WO2021246374A1 - Carte de circuit imprimé en résine isolante - Google Patents

Carte de circuit imprimé en résine isolante Download PDF

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Publication number
WO2021246374A1
WO2021246374A1 PCT/JP2021/020707 JP2021020707W WO2021246374A1 WO 2021246374 A1 WO2021246374 A1 WO 2021246374A1 JP 2021020707 W JP2021020707 W JP 2021020707W WO 2021246374 A1 WO2021246374 A1 WO 2021246374A1
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WO
WIPO (PCT)
Prior art keywords
insulating resin
layer
circuit
metal
circuit board
Prior art date
Application number
PCT/JP2021/020707
Other languages
English (en)
Japanese (ja)
Inventor
慶昭 坂庭
東洋 大橋
Original Assignee
三菱マテリアル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱マテリアル株式会社 filed Critical 三菱マテリアル株式会社
Priority to KR1020227036444A priority Critical patent/KR20230017764A/ko
Priority to CN202180036773.3A priority patent/CN115669235A/zh
Priority to US17/928,356 priority patent/US20230319975A1/en
Priority to EP21817413.4A priority patent/EP4161219A1/fr
Publication of WO2021246374A1 publication Critical patent/WO2021246374A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips

Definitions

  • the present invention relates to an insulating resin circuit board comprising an insulating resin layer and a circuit layer composed of a plurality of metal pieces arranged apart from each other in a circuit pattern on one surface of the insulating resin layer.
  • the power module, LED module, and thermoelectric module have a structure in which a power semiconductor element, an LED element, and a thermoelectric element are bonded to an insulating circuit board having a circuit layer made of a conductive material formed on one surface of the insulating layer. ..
  • an insulating circuit board having a circuit layer made of a conductive material formed on one surface of the insulating layer. ..
  • the metal-based circuit board described in Patent Document 1 has been proposed.
  • an insulating resin layer is formed on the metal substrate, and a circuit layer having a circuit pattern is formed on the insulating resin layer.
  • the insulating resin layer is made of an epoxy resin which is a thermosetting resin
  • the circuit layer is made of a copper foil.
  • a semiconductor element is bonded on the circuit layer, and a heat sink is arranged on the surface of the metal substrate opposite to the insulating resin layer, and heat generated by the semiconductor element is transferred to the heat sink side. It has a structure that dissipates heat. Then, in the metal-based circuit board described in Patent Document 1, a circuit pattern is formed by etching a copper foil arranged on an insulating resin layer.
  • the present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide an insulating resin circuit board which has excellent insulation between circuit patterns and can be used stably.
  • the insulating resin circuit board of the present invention is a circuit composed of an insulating resin layer and a plurality of metal pieces arranged apart from each other in a circuit pattern on one surface of the insulating resin layer.
  • An insulating resin circuit board comprising a layer, wherein the area ratio of the metal element constituting the metal piece is 2.5 when the surface of the insulating resin layer between the metal pieces is analyzed by SEM-EDX. It is characterized by being less than%.
  • the metal constituting the metal pieces when the surface of the insulating resin layer between the metal pieces constituting the circuit layer (between circuit patterns) is analyzed by SEM-EDX. Since the area ratio of the element is less than 2.5%, it is possible to suppress the occurrence of insulation defects between circuit patterns, and stable use is possible.
  • a heat radiating layer is formed on the surface of the insulating resin layer opposite to the circuit layer, and among the heat radiating layers, the metal pieces of the circuit layer are used with each other.
  • the bonding ratio between the insulating resin layer and the heat radiating layer in the region located on the back surface between the two is 70% or more, and the heat radiating layer is made of a material having a higher thermal conductivity than the insulating resin layer. Is preferable.
  • the heat radiating layer causes the circuit layer side.
  • the bonding ratio between the insulating resin layer and the heat radiating layer in the region of the heat radiating layer located on the back surface between the metal pieces of the circuit layer is 70% or more, the insulating resin.
  • the layer and the heat radiating layer are surely joined, and the heat from the insulating resin layer side can be radiated more efficiently by the heat radiating layer.
  • the thickness t of the metal piece is 0.5 mm or more.
  • the thickness t of the metal piece constituting the circuit layer is 0.5 mm or more, conductivity is ensured, and heat can be spread in the circuit layer in the plane direction, resulting in heat dissipation characteristics. are better.
  • the ratio L / t of the thickness t of the metal pieces arranged in a circuit pattern and the closest contact distance L between the metal pieces is 2.0 or less. It is preferable that it is. In this case, since the ratio L / t of the thickness t of the metal pieces and the closest contact distance L between the metal pieces is 2.0 or less, miniaturization of parts using this insulating resin circuit board and miniaturization of parts can be performed. It is possible to reduce the weight. Further, since the area ratio of the metal element on the surface of the insulating resin layer between the metal pieces (between the circuit patterns) is less than 2.5%, the circuit pattern even when the closest contact distance L is small. Insulation between can be ensured.
  • FIG. 1 shows an insulating resin circuit board 10 according to an embodiment of the present invention, and a power module 1 using the insulating resin circuit board 10.
  • the power module 1 includes an insulating resin circuit board 10, a semiconductor element 3 bonded to one side (upper side in FIG. 1) of the insulating resin circuit board 10 via a solder layer 2, and the other of the insulating resin circuit board 10.
  • a heat sink 31 joined via a solder layer 32 is provided on the side (lower side in FIG. 1).
  • the solder layers 2 and 32 are, for example, Sn—Ag-based, Sn—Cu-based, Sn—In-based, or Sn—Ag—Cu-based solder materials (so-called lead-free solder materials).
  • the semiconductor element 3 is an electronic component provided with a semiconductor, and various semiconductor elements are selected according to a required function.
  • the insulating resin circuit board 10 is formed on one surface of the insulating resin layer 11 and the insulating resin layer 11 (upper surface in FIGS. 1 and 2A). It includes a circuit layer 12 and a heat dissipation layer 13 formed on the other surface (upper surface in FIGS. 1 and 2A) of the insulating resin layer 11.
  • the insulating resin layer 11 prevents electrical connection between the circuit layer 12 and the heat radiating layer 13, and is made of a thermosetting resin having an insulating property.
  • a thermosetting resin containing a filler can also be used in order to secure the strength of the insulating resin layer 11.
  • the filler for example, alumina, boron nitride, aluminum nitride or the like can be used.
  • the thermosetting resin an epoxy resin, a polyimide, or the like can be used.
  • the insulating resin layer 11 is made of polyimide. The thickness of the insulating resin layer 11 is within the range of 20 ⁇ m or more and 250 ⁇ m or less.
  • the circuit layer 12 is made of a metal having excellent conductivity on one surface (upper surface in FIGS. 4A to 4D) of the insulating resin layer 11. It is formed by joining metal pieces 22 together.
  • a metal piece formed by punching a metal plate can be used.
  • a rolled plate of oxygen-free copper (OFC) is punched and processed.
  • the metal piece 22 it is also possible to use copper such as tough pitch copper or one obtained by punching out a copper alloy.
  • a circuit pattern is formed by arranging the above-mentioned metal pieces 22 in a circuit pattern, and one surface (upper surface in FIG. 1) of the metal pieces 22 is mounted on which the semiconductor element 3 is mounted. It is said to be a face.
  • the thickness t of the circuit layer 12 (metal piece 22) is set to 0.5 mm or more.
  • the thickness t of the circuit layer 12 (metal piece 22) is preferably 1.0 mm or more, and more preferably 1.5 mm or more.
  • the upper limit of the thickness t of the circuit layer 12 (metal piece 22) is not particularly limited, but is practically 4.0 mm or less.
  • the closest distance L between the metal pieces 22 arranged in the circuit pattern as shown in FIG. 2A is a ratio L / t to the thickness t of the metal pieces 22 arranged in the circuit pattern. Is preferably set to 2.0 or less.
  • the L / t is more preferably 1.0 or less, and more preferably 0.5 or less.
  • the lower limit of L / t is not particularly limited, but is practically 0.2.
  • the closest contact distance L between the metal pieces 22 arranged in the circuit pattern is set within the range of 0.5 mm or more and 2.0 mm or less.
  • the heat radiating layer 13 has an effect of improving the heat radiating characteristics by spreading the heat generated in the semiconductor element 3 mounted on the insulating resin circuit board 10 in the plane direction. Therefore, the heat radiating layer 13 is made of a metal having excellent thermal conductivity, for example, copper or a copper alloy, aluminum or an aluminum alloy. These metals tend to have higher thermal conductivity than the thermosetting resin and filler used for the insulating resin layer 11. In this embodiment, it is composed of a rolled plate of oxygen-free copper. The thickness of the heat radiating layer 13 is set within the range of 0.05 mm or more and 3 mm or less.
  • the surface of the insulating resin layer 11 located between the metal pieces 22 constituting the circuit layer 12 (between the circuit patterns) is analyzed by SEM-EDX.
  • the area ratio of the metal element constituting the metal piece 22 is less than 2.5%.
  • the area ratio of the metal element is more preferably 1.0% or less.
  • the lower limit of the area ratio of the metal element on the surface of the insulating resin layer 11 located between the metal pieces 22 (between the circuit patterns) is 0%.
  • the metal pieces 22 are formed by punching out a rolled plate of oxygen-free copper as described above, the insulating resin layer 11 located between the metal pieces 22 (between the circuit patterns)
  • the area ratio of Cu element on the surface of is less than 2.5%.
  • the bonding ratio with 13 is 70% or more.
  • the bonding ratio is more preferably 90% or more, and the upper limit of the bonding ratio is preferably 100%.
  • the bonding ratio was evaluated using an ultrasonic flaw detector and calculated from the following formula.
  • the heat sink 31 is for dissipating heat on the insulating resin circuit board 10 side.
  • the heat sink 31 is made of copper or a copper alloy, aluminum, an aluminum alloy, or the like having good thermal conductivity. In the present embodiment, it is a heat dissipation plate made of oxygen-free copper.
  • the thickness of the heat sink 31 is set within the range of 3 mm or more and 10 mm or less.
  • the heat dissipation layer 13 of the insulating resin circuit board 10 and the heat sink 31 are joined via the solder layer 32.
  • Metal piece forming step S01 First, the metal piece 22 to be the circuit layer 12 is formed. A metal plate (rolled plate of oxygen-free copper in this embodiment) is punched to form a metal piece 22.
  • the resin composition 21 to be the insulating resin layer 11 is disposed on one surface (upper surface in FIG. 4A) of the metal plate 23 to be the heat dissipation layer 13. ..
  • a resin sheet material made of a polyimide resin is used as the resin composition 21.
  • Metal piece placement step S03 Next, a plurality of metal pieces 22 are arranged in a circuit pattern on one surface (upper surface in FIG. 4B) of the resin composition 21.
  • the metal plate 23 and the insulating resin layer are formed by pressurizing and heating the metal plate 23, which is the heat dissipation layer 13, the resin composition 21, and the metal piece 22 in the stacking direction. 11.
  • the insulating resin layer 11 and the metal piece 22 are joined to form the heat dissipation layer 13 and the circuit layer 12.
  • the rubber-like elastic body 45 is arranged on the metal piece 22 side, and the metal piece 22 is pressed against the resin composition 21 side. ..
  • the rubber-like elastic body 45 is made of, for example, silicone rubber or the like.
  • the heating temperature is within the range of 120 ° C. or higher and 350 ° C. or lower, and the holding time at the heating temperature is within the range of 10 minutes or longer and 180 minutes or lower. Further, the pressurized load in the stacking direction is within the range of 1 MPa or more and 30 MPa or less.
  • the lower limit of the heating temperature is preferably 150 ° C. or higher, and more preferably 170 ° C. or higher.
  • the upper limit of the heating temperature is preferably 250 ° C. or lower, and more preferably 200 ° C. or lower.
  • the lower limit of the holding time at the heating temperature is preferably 30 minutes or more, and more preferably 60 minutes or more.
  • the upper limit of the holding time at the heating temperature is preferably 120 minutes or less, and more preferably 90 minutes or less.
  • the lower limit of the pressurized load in the stacking direction is preferably 5 MPa or more, and more preferably 8 MPa or more.
  • the upper limit of the pressurizing load in the stacking direction is preferably 15 MPa or less, and more preferably 10 MPa or less.
  • the insulating resin circuit board 10 according to the present embodiment is manufactured by each of the above-mentioned steps.
  • Heat sink joining process S05 Next, the heat sink 31 is joined to the other surface of the heat dissipation layer 13 of the insulating resin circuit board 10.
  • the heat radiating layer 13 and the heat sink 31 are joined via a solder material.
  • semiconductor element joining step S06 the semiconductor element 3 is bonded to the circuit layer 12 of the insulating resin circuit board 10.
  • the circuit layer 12 and the semiconductor element 3 are joined via a solder material.
  • the surface of the insulating resin layer 11 between the metal pieces 22 and 22 constituting the circuit layer 12 (between the circuit patterns) is SEM.
  • the area ratio of the metal element (Cu element in this embodiment) constituting the metal piece 22 when analyzed by EDX is less than 2.5%, it is necessary to suppress the occurrence of insulation defects between circuit patterns. Can be done.
  • the heat radiating layer 13 since the heat radiating layer 13 is formed on the surface of the insulating resin layer 11 opposite to the circuit layer 12, the heat radiating layer 13 can efficiently dissipate the heat on the circuit layer 12 side. It will be possible.
  • the bonding ratio between the insulating resin layer 11 and the heat radiating layer 13 in the region of the heat radiating layer 13 located on the back surface between the metal pieces 22 and 22 of the circuit layer 12 is 70% or more.
  • the insulating resin layer 11 and the heat radiating layer 13 are securely bonded to each other, and the heat from the insulating resin layer 11 side can be radiated more efficiently by the heat radiating layer 13.
  • the rubber-like elastic body 45 is arranged to press the metal piece 22 toward the resin composition 21, so that the metal piece 22 is arranged. It is possible to sufficiently pressurize the resin composition 21 and the metal plate 23 in the stacking direction even in the region where the resin composition 21 is not provided, and the insulating resin layer in the region located on the back surface between the metal pieces 22 and 22 of the circuit layer 12. It is possible to set the bonding ratio between 11 and the heat dissipation layer 13 to 95% or more.
  • the conductivity and heat dissipation characteristics are excellent, and a large current and high voltage are applied. It can be applied well to applications. In addition, heat can be spread in the plane direction in the circuit layer 12, and the heat dissipation characteristics are excellent.
  • the ratio L / t of the thickness t of the metal pieces 22 arranged in a circuit pattern and the closest contact distance L between the metal pieces 22 and 22 is 2.0 or less. In this case, it is possible to reduce the size and weight of the parts using the insulating resin circuit board 10. Further, as described above, the metal element constituting the metal piece 22 when the surface of the insulating resin layer 11 between the metal pieces 22 and 22 (between the circuit patterns) is analyzed by SEM-EDX (Cu in the present embodiment). Since the area ratio of the element) is less than 2.5%, even if the ratio L / t of the metal pieces 22 and 22 to the closest distance L is 2.0 or less, the circuit patterns are interspersed. It is possible to suppress the occurrence of insulation defects.
  • the power semiconductor element is mounted on the circuit layer of the insulating resin circuit board to form a power module, but the present invention is not limited to this.
  • an LED element may be mounted on an insulating resin circuit board to form an LED module
  • a thermoelectric element may be mounted on a circuit layer of an insulating resin circuit board to form a thermoelectric module.
  • the description is made assuming that the insulating resin circuit board and the heat sink are joined via a solder layer, but the present invention is not limited to this, and the insulating resin circuit board (metal substrate), the heat sink, and the grease are used. It may be laminated through. Further, the material and structure of the heat sink are not limited to this embodiment, and the design may be appropriately changed. Further, in the present embodiment, the insulating resin layer has been described as being made of polyimide, but the present invention is not limited to this, and the insulating resin layer may be made of epoxy resin or the like. Further, in the present embodiment, the metal piece has been described as being composed of oxygen-free copper, but the present invention is not limited to this, and is composed of other copper or copper alloys, aluminum, silver, and other other metal materials. It may be a copper one.
  • the pressurization is performed by using the rubber-like elastic body in the pressurizing and heating steps, but the present invention is not limited to this, and the rubber-like elastic body may not be used.
  • the metal piece forming step S01 for forming the metal piece 22 by punching out the metal plate is provided, but the present invention is not limited to this, and the metal piece 22 is formed by other means. A piece of metal may be used.
  • An oxygen-free copper rolled plate (60 mm ⁇ 40 mm ⁇ thickness 1.0 mm) was prepared as a metal plate to be a heat dissipation layer, and a sheet material of the resin composition shown in Table 1 was arranged on one surface of the metal plate. ..
  • the metal pieces (20 mm ⁇ 20 mm) shown in Table 1 were arranged in a pattern on one surface of the resin composition. At this time, the metal pieces were arranged so that the closest distance between the metal pieces was the value shown in Table 1.
  • the metal plate (60 mm ⁇ 40 mm) shown in Table 1 was arranged on one surface of the resin composition.
  • the metal plate, the resin composition, and the metal piece are pressurized and heated in the laminating direction to cure the resin composition to form an insulating resin layer, and the metal plate and the insulating resin layer are formed. And a metal piece (metal plate) were joined.
  • the conditions for the pressurization and heating steps were a pressurization load of 3 MPa, a heating temperature of 300 ° C., and a holding time at the heating temperature of 1 hour.
  • a rubber-like elastic body (thickness 4.0 mm) made of silicone rubber was arranged on one side of the metal and pressed in the stacking direction.
  • Example 2 of the present invention pressure was applied without using a rubber-like elastic body. Further, in the comparative example, after joining the metal plate and the insulating resin layer in the same manner as in Example 1 of the present invention, the metal plate to be the circuit layer is etched, and the closest contact distance becomes the value shown in Table 1.
  • the circuit pattern was formed as follows.
  • the area ratio of the metal element on the surface of the insulating resin layer between the metal pieces is measured, and the position is located on the back surface between the metal pieces of the circuit layer in the heat dissipation layer.
  • the bonding ratio and withstand voltage resistance in the region to be treated were evaluated as follows.
  • FIGS. 5A and 5B show the analysis results of Example 1 and Comparative Example of the present invention. As shown in FIG. 5A, in Example 1 of the present invention, almost the entire surface of the Cu element map was at the background level, and Cu was not detected. As shown in FIG. 5B, Cu was detected in the comparative example.
  • the insulating resin circuit board was placed in a constant humidity and constant temperature bath (temperature 85 ° C., humidity 85%), and a voltage of 1000 V DC was applied to the insulating resin circuit board. After 2000 hours, the insulation resistance between the metal pieces is measured, and if the value is larger than 1.0 ⁇ 10 6 ⁇ , it is “A (possible)”, and if it is 1.0 ⁇ 10 6 ⁇ or less, it is “B (". Impossible) ”. The evaluation results are shown in Table 1.
  • Example 1 and 2 of the present invention in which the circuit layer is formed by arranging and joining the metal pieces in a circuit pattern, as shown in FIG. 5A, the insulating resin layer between the metal pieces is formed. No Cu element was confirmed on the surface, and the area ratio of the metal element on the surface of the insulating resin layer between the metal pieces was 0%. Therefore, the withstand voltage resistance became "A". Further, in Example 1 of the present invention using a rubber-like elastic body in the pressurizing and heating steps, the bonding ratio in the region of the heat dissipation layer located on the back surface between the metal pieces of the circuit layer was 100%. ..

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Cette carte de circuit imprimé en résine isolante comprend une couche de résine isolante, et une couche de circuit formée à partir d'une pluralité de pièces métalliques agencées de façon à être séparées dans un motif de circuit sur une surface de la couche de résine isolante, le rapport de surface d'éléments métalliques constituant les pièces métalliques étant inférieur à 2,5 % lorsque la surface de la couche de résine isolante entre les pièces métalliques est analysée par SEM-EDX.
PCT/JP2021/020707 2020-06-01 2021-05-31 Carte de circuit imprimé en résine isolante WO2021246374A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020227036444A KR20230017764A (ko) 2020-06-01 2021-05-31 절연 수지 회로 기판
CN202180036773.3A CN115669235A (zh) 2020-06-01 2021-05-31 绝缘树脂电路基板
US17/928,356 US20230319975A1 (en) 2020-06-01 2021-05-31 Insulating resin circuit substrate
EP21817413.4A EP4161219A1 (fr) 2020-06-01 2021-05-31 Carte de circuit imprimé en résine isolante

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020095304A JP2021190586A (ja) 2020-06-01 2020-06-01 絶縁樹脂回路基板
JP2020-095304 2020-06-01

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JP2015207666A (ja) 2014-04-21 2015-11-19 住友ベークライト株式会社 金属ベース基板、金属ベース基板の製造方法、金属ベース回路基板および電子装置
JP2018147934A (ja) * 2017-03-01 2018-09-20 三菱マテリアル株式会社 絶縁回路基板の製造方法
JP2020095304A (ja) 2018-12-10 2020-06-18 キヤノンマーケティングジャパン株式会社 情報処理装置、情報処理システム、その制御方法、及びプログラム

Patent Citations (3)

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JP2015207666A (ja) 2014-04-21 2015-11-19 住友ベークライト株式会社 金属ベース基板、金属ベース基板の製造方法、金属ベース回路基板および電子装置
JP2018147934A (ja) * 2017-03-01 2018-09-20 三菱マテリアル株式会社 絶縁回路基板の製造方法
JP2020095304A (ja) 2018-12-10 2020-06-18 キヤノンマーケティングジャパン株式会社 情報処理装置、情報処理システム、その制御方法、及びプログラム

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