WO2021244215A1

WO2021244215A1 - Tec high-low temperature impact testing machine

Info

Publication number: WO2021244215A1
Application number: PCT/CN2021/092133
Authority: WO
Inventors: 刘冬喜
Original assignee: 海拓仪器(江苏)有限公司
Priority date: 2020-06-03
Filing date: 2021-05-07
Publication date: 2021-12-09
Also published as: CN111487156A

Abstract

A TEC high-low temperature impact testing machine, comprising a cooling heat-dissipating mechanism, a semiconductor refrigeration plate (6), and a controller (8). The cooling heat-dissipating mechanism comprises a variable speed compressor (1), a condenser (2), and an evaporator (5). A hot surface of the semiconductor refrigeration plate (6) is in contact connection with the evaporator (5), and a cold surface of the semiconductor refrigeration plate (6) is in contact connection with a heat conducting member (7). The controller (8) is electrically connected to the semiconductor refrigeration plate (6) and the variable speed compressor (1) to control, by means of a received system parameter, positive and negative electrodes and the magnitude of voltage of the semiconductor refrigeration plate (6) and the refrigeration capacity of the variable speed compressor (1). The testing machine has a low refrigeration temperature, can reach a temperature ranging from -70°C to 150°C, and thus features a high refrigeration speed and large refrigeration capacity, simple operations, a small volume, and low consumption and is energy-saving and environmentally friendly. During a test, temperature adjustment can be performed for an individual element without affecting a test circuit, thus greatly prolonging the service life of a test circuit; in addition, during a test process, pressure and temperature are both effectively controlled.

Description

A TEC high and low temperature impact testing machine

Technical field

The invention relates to a TEC high and low temperature impact tester, which belongs to the technical field of semiconductor refrigeration.

Background technique

The impact testing machine is a necessary three-temperature (ie, low temperature, normal temperature, high temperature) performance testing equipment for the electronics, semiconductor, IC, communications and other material industries. It is used to test the temperature tolerance of material structures, composite materials or electronic components. , That is, the degree of endurance in a continuous environment of extremely high temperature and extremely low temperature in an instant, so that the chemical change or physical damage caused by the thermal expansion and contraction of the sample can be detected in the shortest time.

The existing high and low temperature impact testing machine has the following shortcomings: 1. The cooling speed is slow and the cooling capacity is insufficient. It cannot effectively and quickly cool the object under test during the test; 2. It cannot test for a single component (such as a chip); 3. During the test, the object under test and the test circuit need to be placed in a high and low temperature environment, which will damage the test circuit over time and affect the service life of the test circuit; 4. Compressed air is required to achieve sufficient low temperature and cooling capacity.

Summary of the invention

In order to solve the above technical problems, the purpose of the present invention is to provide a TEC high and low temperature impact tester with low power consumption, small size, high controllability, and capable of specifically raising and lowering the temperature of the tested object without affecting the test circuit.

In order to achieve the above objectives, the technical solution adopted by the present invention is: a TEC high and low temperature impact tester, which includes a cooling and heat dissipation mechanism, a semiconductor refrigeration fin, and a controller. The cooling and heat dissipation mechanism is used to dissipate heat from the hot surface of the semiconductor refrigeration fin. The cooling and heat dissipation mechanism includes a frequency conversion compressor, a condenser and an evaporator. The hot surface of the semiconductor refrigeration fin is in contact with the evaporator, and the cold surface of the semiconductor refrigeration fin is useful for contact and connection. It is the thermal conductive element that contacts the object under test. The invention adopts two-stage temperature reduction, namely, a frequency conversion compressor (first stage) and a semiconductor refrigeration sheet (second stage), which has a fast cooling speed, a large load and a large refrigeration capacity, and can realize rapid temperature control of the measured object. The semiconductor refrigeration sheet directly controls the temperature of the object under test through the heat-conducting part, and does not affect the test circuit. The controller is electrically connected to the semiconductor refrigeration film and the inverter compressor. The controller controls the positive and negative poles and voltage of the semiconductor refrigeration film and the cooling capacity of the inverter compressor through the received system parameters. The system parameters here include heat transfer components. The controller performs real-time control and adjustment according to the temperature of the heat-conducting part to ensure that the temperature of the object under test meets the test requirements.

Further, the testing machine further includes a pressure actuator, which has a telescopically movable output end, which is connected to the evaporator and drives the evaporator, the semiconductor refrigeration fin and the heat conducting member to move together. Through this structure setting, during the test, under the action of the pressure actuator, on the one hand, the heat-conducting element can be brought into close contact with the object under test, ensuring effective and rapid heat conduction, realizing rapid temperature control of the object under test and ensuring uniform temperature of the object under test On the other hand, in order to ensure the rapid progress of the detection process, the object to be tested and the circuit board of the test circuit are connected by contact, so that the object to be tested can be quickly placed and removed during detection, and the pressure actuator can be set Make close contact between the tested object and the circuit board of the test circuit to ensure the accuracy of the test result.

Furthermore, the evaporator, the semiconductor refrigeration fin and the heat conduction member are fixed to each other to form an integrated structure, which not only facilitates the assembly operation when assembling the test machine, but also facilitates effective heat conduction between the evaporator, the semiconductor refrigeration fin and the heat conduction member.

Furthermore, the testing machine also includes a host housing and a test head housing, the above-mentioned variable frequency compressor, condenser, and controller are all arranged in the host housing, and the above-mentioned pressure actuator, evaporator, semiconductor refrigeration chip and The heat-conducting parts are all arranged in the test head shell. This structural design makes the overall structure of the testing machine more beautiful and easy to operate during testing. The main body shell and the test head shell are connected by an integrated hose, and the integrated hose is provided with a refrigerant input pipe, a refrigerant output pipe and an electric wire.

Furthermore, the pressure actuator includes a power output mechanism and a pressure transmitter. The output end of the power output mechanism is the telescopic and movable output end of the pressure actuator. The pressure transmitter is respectively connected to the controller and the power output mechanism. After the pressure transmitter receives the pressure value control signal from the controller, it controls the power output mechanism to perform actions, and feeds back the pressure value after the execution to the controller, and the controller further controls the expansion and contraction of the output end of the power output mechanism according to the feedback data In order to achieve precise control of the execution of the power output mechanism, avoid excessive output pressure to damage the tested object or test circuit, and low output pressure caused by low heat conduction efficiency or poor contact resulting in inaccurate test results. Preferably, the power output mechanism is a cylinder, and the piston rod of the cylinder is the output end of the power output mechanism.

Furthermore, the front end of the test head housing is provided with a docking portion, which can be connected to a fixture for installing the object under test, and through the connection between the docking portion and the fixture, the thermal conductive member corresponds to the position of the object under test. Therefore, the action of the pressure actuator can accurately press the heat-conducting member on the object to be measured.

Further, a temperature sensor is provided on the heat-conducting part, and the output end of the temperature sensor is connected with the controller. The temperature sensor detects the temperature of the heat-conducting part in real time, and feeds the data back to the controller, so that the controller can perform real-time compression of the frequency conversion The corresponding parameters of the machine and the semiconductor refrigeration chip are adjusted. Specifically, the heat-conducting element is provided with a mounting hole, and the temperature sensor is installed in the mounting hole, so that the temperature sensor can detect the temperature of the heat-conducting element more accurately.

Further, the pipe between the condenser and the evaporator is provided with a filter drier and a throttling device, and the condenser is provided with a fan to help the coolant dissipate heat.

By adopting the above technical solutions, the present invention has the following beneficial effects compared with the prior art: the temperature of the TEC high and low temperature impact tester can reach -70～150℃, the refrigeration temperature is low, the refrigeration speed is fast, the refrigeration capacity is large, and the operation is simple, Small size, low power consumption, energy saving and environmental protection; during testing, the temperature of a single component can be adjusted without affecting the test circuit, which greatly extends the service life of the test circuit, and during the test, the pressure and temperature can be adjusted Get effective control.

The additional aspects and advantages of the present invention will be partially given in the following description, and some will become obvious from the following description, or be understood through the practice of the present invention.

Description of the drawings

Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary but not restrictive manner with reference to the accompanying drawings. The same reference numerals in the drawings indicate the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the attached picture:

Figure 1 is a schematic diagram of the structure of the present invention;

Figure 2 is a schematic diagram of the overall structure of the present invention;

Figure 3 is a schematic diagram of the internal structure of the host of the present invention;

Figure 4 is a perspective view of the structure of the test head of the present invention;

Fig. 5 is a schematic diagram of the structure of the test head (except the test head housing) of the present invention.

The marks in the picture are: 1- variable frequency compressor, 2- condenser, 3- filter drier, 4- throttling device, 5- evaporator, 6-semiconductor refrigeration fin, 7-heat conduction element, 8-controller, 9 -Temperature sensor, 10-host housing, 11-test head housing, 12-first power supply, 13-second power supply, 14-cylinder, 15-butting part, 16-block, A-host, B-test Head, C-integrated hose.

detailed description

The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

Referring to FIG. 1 to FIG. 5, this embodiment provides a TEC high and low temperature impact tester.

Referring to the structural principle diagram of FIG. 1, the TEC high and low temperature impact tester in this embodiment includes a cooling and heat dissipation mechanism, a semiconductor refrigeration fin 6 and a controller 8. The cooling and heat dissipation mechanism is used to dissipate heat on the hot surface of the semiconductor refrigeration fin 6, specifically, as shown in FIG. It is in contact with the evaporator 5 to form a two-stage cooling, that is, the inverter compressor 1 (first stage) and the semiconductor refrigeration fin 6 (second stage). The cooling speed is fast, the load is large, and the cooling capacity is large. Quick temperature control. The cold surface of the semiconductor refrigeration sheet 6 is connected with a heat conducting element 7 which is used for contacting the object to be measured. The semiconductor refrigeration sheet 6 directly controls the temperature of the object under test through the heat-conducting member 7, without affecting the test circuit. In this embodiment, the pipe between the condenser 2 and the evaporator 5 is provided with a filter drier 3 and a throttling device 4, and the condenser 2 is provided with a fan for dissipating the coolant.

The controller 8 is electrically connected to the semiconductor refrigeration fin 6 and the inverter compressor 1, and the controller 8 controls the positive and negative poles and voltage levels of the semiconductor refrigeration fin 6 and the cooling capacity of the inverter compressor 1 through the received system parameters. The system parameters here include the temperature of the heat-conducting element 7, and the controller 8 performs real-time control and adjustment according to the temperature of the heat-conducting element 7 to ensure that the temperature of the measured object meets the test requirements. Specifically, a temperature sensor 9 is provided on the heat-conducting element 7, and the output end of the temperature sensor 9 is connected to the controller 8. The temperature sensor 9 detects the temperature of the heat-conducting element 7 in real time, and feeds the data back to the controller 8, and the controller 8 8 can adjust the corresponding parameters of the inverter compressor 1 and the semiconductor refrigeration fin 6 in real time. The connection structure of the temperature sensor 9 in this embodiment is shown in Fig. 4: a mounting hole is provided on the heat conducting member 7, and the temperature sensor 9 is installed in the mounting hole, so that the temperature sensor 9 can more accurately sense the temperature of the heat conducting member 7 .

The testing machine also includes a pressure actuator. The pressure actuator has a telescopically movable output end. The output end is connected to the evaporator 5 and drives the evaporator 5, the semiconductor refrigeration fin 6 and the heat conducting member 7 to move together. During the test, under the action of the pressure actuator, on the one hand, the heat conducting element 7 can be brought into close contact with the object under test, ensuring effective and rapid heat conduction, realizing rapid temperature control of the object under test and ensuring uniform temperature of the object under test, on the other hand In order to ensure the rapid progress of the detection process, the object to be tested and the circuit board of the test circuit are connected by contact, so that the object to be tested can be quickly placed and removed during detection, and the setting of the pressure actuator can make the object under test It is in close contact with the circuit board of the test circuit to ensure the accuracy of the test result. In this embodiment, the evaporator 5, the semiconductor refrigeration fin 6 and the heat conduction member 7 are fixed to each other to form an integrated structure, which not only facilitates the assembly operation when assembling the test machine, but also facilitates the connection between the evaporator, the semiconductor refrigeration fin and the heat conduction member. Effective heat conduction.

In a more preferred embodiment, the pressure actuator includes a power output mechanism and a pressure transmitter. The output end of the power output mechanism is the telescopically movable output end of the pressure actuator. The power output mechanism in this embodiment uses a cylinder 14, as shown in FIG. 4 and FIG. 5. The pressure transmitter is connected to the controller 8 and the cylinder 14 respectively. The pressure transmitter controls the cylinder 14 to perform actions after receiving the pressure value control signal from the controller 8, and feeds back the pressure value after the action to the controller 8. The controller 8 further controls the expansion and contraction of the output end of the cylinder 14 according to the feedback data, so as to realize the precise control of the execution of the power output mechanism, avoiding the output pressure from damaging the object under test or the test circuit, and the heat transfer efficiency caused by the output pressure being too small Low or poor contact leads to inaccurate test results.

As shown in Figures 2 to 5, in terms of appearance and structure, the TEC high and low temperature impact test machine in this embodiment includes a host A and a test head B, and the host A and the test head B are connected through an integrated hose C. The host A includes a host housing 10. The inverter compressor 1, condenser 2, and controller 8 described above are all arranged in the host housing 10. In addition, as shown in FIG. 3, the host housing 10 is also provided with The first power supply 12 supplies power to the inverter compressor 1 and the second power supply 13 supplies heat to the semiconductor refrigeration fins 13. The test head B includes a test head housing 11, and the above-mentioned pressure actuator, evaporator 5, semiconductor refrigeration fin 6 and heat conducting member 7 are all arranged in the test head housing 11. The integrated hose C is provided with a refrigerant input pipe, a refrigerant output pipe and an electric wire which are respectively connected to the corresponding components in the host housing 10 and the test head housing 11. Regarding the specific structure of the integrated hose C and how the various pipelines and lines in the integrated hose C are connected to the components in the host A and the test head B, it is not the invention of the present application, and those skilled in the art will use their knowledge according to their own knowledge. The domain technical knowledge can be understood and realized, so it will not be described in detail here.

In a more preferred embodiment, referring to Figures 1 to 5, the front end of the test head housing 11 is provided with a docking portion 15, which can be connected to a fixture for installing the object under test, and further Ground, the docking portion 15 has a clamping block 16 for clamping with the clamp. Through the connection between the docking portion 15 and the fixture, the heat-conducting element 7 corresponds to the position of the object to be measured on the fixture, so that the action of the pressure actuator can accurately press the heat-conducting element 7 on the object to be measured.

The working principle of the TEC high and low temperature impact testing machine in this embodiment: first install the object to be tested in the fixture, and then connect the docking part at the front end of the test head housing 11 to the fixture, so that the position of the heat conducting element 7 and the object to be tested Correspondingly, the controller 8 controls the inverter compressor 1 and the semiconductor refrigeration fin 6, so that the temperature of the heat-conducting member 7 reaches the set temperature, and the controller 8 controls the action of the pressure actuator to make the heat-conducting member 7 contact and compress the object under test. During the test, the temperature sensor 9 feeds back the temperature of the heat-conducting element 7 to the controller 8 in real time, and the controller 8 further controls the inverter compressor 1 and the semiconductor refrigeration fin 7 according to the feedback temperature data to ensure that the output temperature of the testing machine conforms to the test Require.

The temperature of the TEC high and low temperature impact tester of the above embodiment can reach -70～150℃, the cooling temperature is low, the cooling speed is fast, the cooling capacity is large, and the operation is simple, the volume is small, the power consumption is low, and it is energy-saving and environmentally friendly; , Can adjust the temperature of a single component without affecting the test circuit, greatly extending the service life of the test circuit, and in the test process, the pressure and temperature can be effectively controlled.

The above-mentioned embodiments are only to illustrate the technical concept and features of the present invention, and their purpose is to enable those familiar with the technology to understand the content of the present invention and implement them accordingly, and cannot limit the scope of protection of the present invention. The equivalent changes or modifications made by the spirit essence should all be covered within the protection scope of the present invention.

Claims

A TEC high and low temperature impact tester, which is characterized by comprising a cooling and heat dissipation mechanism, a semiconductor refrigeration fin, and a controller. The cooling and heat dissipation mechanism is used to dissipate heat on the hot surface of the semiconductor refrigeration fin. The hot surface of the semiconductor refrigeration fin is in contact with the evaporator, and the cold surface of the semiconductor refrigeration fin is in contact and connected with a heat conduction element for contacting the object to be measured. The controller is connected with the semiconductor refrigeration fin and the inverter The compressors are all electrically connected, and the controller controls the positive and negative poles and voltage of the semiconductor refrigeration chip and the refrigeration capacity of the inverter compressor through the received system parameters.
The TEC high and low temperature impact testing machine according to claim 1, characterized in that the testing machine further comprises a pressure actuator, the pressure actuator has a telescopically movable output end, and the output end is connected to the evaporator, And it drives the evaporator, the semiconductor refrigeration fin and the heat conducting element to move together.
The TEC high and low temperature impact tester according to claim 1 or 2, wherein the evaporator, the semiconductor refrigeration fin and the heat conducting member are fixed to each other to form an integrated structure.
The TEC high and low temperature impact testing machine according to claim 2, characterized in that, the testing machine further comprises a host shell and a test head shell, and the inverter compressor, condenser, and controller are all arranged on the host In the shell, the pressure actuator, the evaporator, the semiconductor refrigeration sheet and the heat conducting element are all arranged in the test head shell.
The TEC high and low temperature impact testing machine according to claim 4, characterized in that, the main body shell and the test head shell are connected by an integrated hose, and the integrated hose is provided with a refrigerant input pipe and a refrigerant Output tube and wires.
The TEC high and low temperature impact testing machine according to claim 2, wherein the pressure actuator includes a power output mechanism and a pressure transmitter, and the output end of the power output mechanism is the retractable of the pressure actuator The mobile output terminal, the pressure transmitter is respectively connected with the controller and the power output mechanism, the pressure transmitter receives the pressure value control signal from the controller and then controls the power output mechanism to perform actions, and will execute the pressure value after the action The size is fed back to the controller.
The TEC high and low temperature impact tester according to claim 4, characterized in that the front end of the test head housing is provided with a butting portion, which is connected to a fixture for mounting the object to be tested so that the heat conducting member Correspond to the position of the measured object.
The TEC high and low temperature impact testing machine according to claim 1, wherein a temperature sensor is provided on the heat-conducting part, the output end of the temperature sensor is connected with the controller, and the heat-conducting part is provided with a temperature sensor. Install the mounting hole for the temperature sensor.
The TEC high and low temperature impact tester according to claim 1, wherein the pipe between the condenser and the evaporator is provided with a drying filter and a throttling device, and the condenser is provided with a cooling agent Cooling fan.