CN212340902U

CN212340902U - TEC high-low temperature impact testing machine

Info

Publication number: CN212340902U
Application number: CN202020991695.5U
Authority: CN
Inventors: 刘冬喜
Original assignee: Haituo Instruments Jiangsu Co ltd
Current assignee: Haituo Instruments Jiangsu Co ltd
Priority date: 2020-06-03
Filing date: 2020-06-03
Publication date: 2021-01-12
Anticipated expiration: 2030-06-03

Abstract

The utility model discloses a TEC high low temperature impact tester, including cooling heat dissipation mechanism, semiconductor refrigeration piece and controller, cooling heat dissipation mechanism is used for dispelling the heat to the hot face of semiconductor refrigeration piece, and it includes frequency conversion compressor, condenser and evaporimeter, the hot face and the evaporimeter contact of semiconductor refrigeration piece are connected, and the cold face and the heat-conducting plate contact of semiconductor refrigeration piece are connected, controller and semiconductor refrigeration piece and frequency conversion compressor electric connection, its refrigeration volume through the positive negative pole and the voltage size of receiving to the semiconductor refrigeration piece and frequency conversion compressor is controlled to the system parameter. The utility model is simple in operation, small, low power dissipation can realize testing the chip performance to in the testing process, pressure and temperature all can obtain effectual control.

Description

TEC high-low temperature impact testing machine

Technical Field

The utility model relates to a TEC high low temperature impact tester belongs to semiconductor refrigeration technology field.

Background

The most used of traditional mechanical refrigeration equipment is freon refrigeration, but freon refrigerated mode has the pollution, and mechanical refrigeration exists bulky moreover, and system parts is many, and the consumption is big, need add refrigerant (refrigerant), defect such as refrigeration limit temperature is limited, so in some high-end manufacturing fields, mechanical refrigeration has can't satisfy the requirement in the industry.

At present, with the development of semiconductor refrigeration technology, the semiconductor refrigeration chip is gradually widely used for refrigeration, and the semiconductor refrigeration chip realizes the purposes of refrigeration and heating by respectively absorbing heat and releasing heat at two ends of a galvanic couple by means of direct current, thereby meeting the requirement of environmental protection. During the operation of the semiconductor refrigeration chip, the cold quantity is released to a refrigeration chamber of the refrigeration equipment through a cold-end radiator at the cold end, and the heat quantity is required to be radiated to the outside through a hot-end radiator at the hot end. But the heat dissipation capacity of the heat end radiator directly influences the cold production capacity and the refrigeration efficiency of the semiconductor in the actual use process. Therefore, the current semiconductor refrigeration equipment has the problems of poor heat dissipation performance, low refrigeration stability and efficiency, low controllability, incapability of being directly applied in specific fields such as the field of chip performance test and the like.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a TEC high and low temperature impact tester that the consumption is little, and is small, and energy-conserving and controllability is high.

In order to realize the purpose, the utility model discloses the technical scheme who takes is: the utility model provides a TEC high low temperature impact tester, includes cooling heat dissipation mechanism, semiconductor refrigeration piece and controller, cooling heat dissipation mechanism is used for dispelling the heat to the hot face of semiconductor refrigeration piece, and it includes frequency conversion compressor, condenser and evaporimeter, the hot face and the evaporimeter contact of semiconductor refrigeration piece are connected, and the cold face and the heat-conducting plate contact of semiconductor refrigeration piece are connected, controller and semiconductor refrigeration piece and frequency conversion compressor electric connection, its positive negative pole and the voltage size of semiconductor refrigeration piece and the refrigerating output of frequency conversion compressor are controlled through the system parameter who receives.

Furthermore, the refrigerating device also comprises a pressure executing mechanism, wherein the telescopic end of the pressure executing mechanism is connected with the evaporator and drives the semiconductor refrigerating sheet and the heat conducting plate to do telescopic motion together by driving the evaporator to move.

Furthermore, the evaporator, the semiconductor refrigeration sheet and the heat conduction plate are connected with each other to form a modular combined structure.

Furthermore, the refrigerating device comprises a host and a refrigerating output end, wherein the host mainly comprises a variable frequency compressor, a condenser, a controller, a PLC (programmable logic controller) board and a power supply, and the refrigerating output end mainly comprises a pressure executing mechanism, an evaporator, a semiconductor refrigerating sheet and a heat conducting plate.

Furthermore, the main machine and the refrigeration output end are connected through an integrated hose, and a refrigerant input pipe, a refrigerant output pipe and an electric wire are arranged in the integrated hose.

Furthermore, the pressure executing mechanism comprises an air cylinder and a pressure transmitter, the pressure transmitter is connected with the controller, the pressure transmitter receives a pressure value control signal of the controller and then controls the air cylinder to execute actions, and the size of the pressure value after the actions are executed is fed back to the controller.

Furthermore, the front end of the pressure actuating mechanism is provided with a butt joint, and the butt joint is clamped and fixed with a clamp for mounting an object to be tested.

Furthermore, the heat conducting plate is provided with a temperature sensor, and the heat conducting plate is provided with a mounting hole for mounting the temperature sensor.

Furthermore, the variable frequency compressor is provided with a motor, the motor is connected with a frequency converter, the frequency converter is connected with a controller, and the controller controls the rotating speed of the motor through the frequency converter.

Furthermore, a drying filter and a throttling device are arranged on a pipeline between the condenser and the evaporator, and a fan for assisting the heat dissipation of the coolant is arranged on the condenser.

The utility model has the advantages that: the TEC high-low temperature impact testing machine is simple to operate, small in size, low in power consumption, energy-saving and environment-friendly; the device can test the performance of the chip, and in the test process, the pressure and the temperature can be effectively controlled.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic view of the overall structure of the present invention.

Fig. 3 is a schematic diagram of the internal structure of the host of the present invention.

Fig. 4 is a schematic diagram of the structure of the external refrigeration output end of the present invention.

Labeled as: the system comprises a variable frequency compressor, a condenser, a drying filter, a throttling device evaporator, a 5-evaporator, a semiconductor refrigerating sheet, a heat conducting plate, a controller, a frequency converter, a relay, a PLC (programmable logic controller), a 12-air pressure proportional valve, a 13-5V power supply, a 14-24V power supply, a 15-12V power supply, a 16-air cylinder, a 17-temperature sensor, an A-host and a B-refrigerating output end, wherein the 1-variable frequency compressor, the 2-condenser, the 3-drying filter, the 4-throttling device evaporator, the 5-evaporator, the 6-semiconductor refrigerating sheet, the 7.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1 to 4, the TEC high and low temperature impact tester includes a cooling and heat dissipation mechanism, a pressure actuator, a semiconductor cooling plate 6 and a controller 8. The cooling and heat dissipation mechanism is used for dissipating heat of the hot surface of the semiconductor refrigeration sheet 6, adopts a common mechanical refrigeration device and mainly comprises a variable frequency compressor 1, a condenser 2, an evaporator 5, a drying filter 3 and a throttling device 4; the hot side of semiconductor refrigeration piece 6 is connected with evaporimeter 5 contact, and the cold side of semiconductor refrigeration piece 6 is connected with heat-conducting plate 7 contact, and pressure actuating mechanism's flexible end is connected evaporimeter 5 to through driving evaporimeter 5 motion and then drive semiconductor refrigeration piece 6 and heat-conducting plate 7 and make concertina movement together. Wherein, frequency conversion compressor 1, condenser 2, controller 8, PLC board 11, atmospheric pressure proportional valve 12, power, display screen etc. parts have constituted host computer A of this device, and pressure actuating mechanism, evaporimeter 5, semiconductor refrigeration piece 6 and heat-conducting plate 7 have constituted the refrigeration output B who locates outside the host computer A, connect through an integrated hose between host computer A and the refrigeration output B, are equipped with refrigerant input tube, refrigerant output tube and electric wire in this integrated hose. The controller 8 is electrically connected with the semiconductor refrigerating sheet 6 and the variable frequency compressor 1, and the controller 8 controls the size of the anode and the cathode of the semiconductor refrigerating sheet 6 and the voltage and the refrigerating capacity of the variable frequency compressor 1 through received system parameters.

In this embodiment, the evaporator 5, the semiconductor refrigeration sheet 6 and the heat conduction plate 7 are connected to form a modular combination structure.

In this embodiment, the pressure actuator includes cylinder 16 and pressure transmitter, pressure transmitter is connected with controller 8, and pressure transmitter receives the pressure value control signal of controller 8 and then controls cylinder 16 to execute the action to the pressure value size feedback after executing the action to controller 8. And the front end of the pressure actuating mechanism is provided with a butt joint which is clamped and fixed with a clamp for installing an object to be tested.

In this embodiment, the heat conducting plate 7 is provided with a temperature sensor 17, and the heat conducting plate 7 is provided with a mounting hole for mounting the temperature sensor 17.

In this embodiment, the inverter compressor 1 is provided with a motor, the motor is connected to the inverter 9, the inverter 9 is connected to the controller 8, and the controller 8 controls the rotation speed of the motor through the inverter 9. The condenser 2 is provided with a fan for assisting the heat dissipation of the coolant.

The utility model discloses a theory of operation: firstly, an object to be tested is installed in a specific clamp, then a butt joint at the front end of a pressure execution mechanism is clamped and fixed with the clamp, and then the anode and the cathode of a semiconductor refrigeration sheet 6, the voltage, the refrigeration temperature and the pressure executed by the pressure execution mechanism are set. The controller 8 controls and controls which side of the semiconductor refrigerating sheet 6 heats and which side refrigerates by controlling the positive and negative poles of the semiconductor refrigerating sheet 6, and controls the stability of the refrigerating temperature of the semiconductor refrigerating sheet 6 by controlling the value of the voltage, after the refrigerating sheet is electrified, one side heats and the other side refrigerates, and the lower the cooling temperature of the hot side is, the lower the temperature made by the cold side is. In addition, the controller 8 controls the expansion amount of the air cylinder 16 through the pressure transmitter, so as to adjust the pressure value between the heat conduction mechanism and the object to be measured, such as the surface of a chip; and the controller 8 also controls the rotational speed of the compressor motor via the frequency converter 9.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It should be understood by those skilled in the art that the above embodiments do not limit the scope of the present invention in any way, and all technical solutions obtained by using equivalent substitution modes and the like fall within the scope of the present invention.

The utility model discloses the part that does not relate to all is the same with prior art or can adopt prior art to realize.

Claims

1. The utility model provides a TEC high low temperature impact tester, its characterized in that, includes cooling heat dissipation mechanism, semiconductor refrigeration piece and controller, cooling heat dissipation mechanism is used for dispelling the heat to the hot face of semiconductor refrigeration piece, and it includes frequency conversion compressor, condenser and evaporimeter, the hot face and the evaporimeter contact of semiconductor refrigeration piece are connected, and the cold face and the heat-conducting plate contact of semiconductor refrigeration piece are connected, controller and semiconductor refrigeration piece and frequency conversion compressor electric connection, its refrigeration volume through the positive negative pole and the voltage size of receiving to the semiconductor refrigeration piece and frequency conversion compressor is controlled.

2. The TEC high and low temperature impact tester according to claim 1, further comprising a pressure actuator, wherein the expansion end of the pressure actuator is connected to the evaporator and drives the semiconductor refrigeration plate and the heat conduction plate to move together through driving the evaporator.

3. The TEC high and low temperature impact tester according to claim 1 or 2, wherein the evaporator, the semiconductor cooling plate and the heat conducting plate are connected to each other to form a modular combined structure.

4. The TEC high and low temperature impact tester according to claim 2, wherein the tester mainly comprises two major components, namely a main machine and a refrigeration output end, wherein the main machine mainly comprises a variable frequency compressor, a condenser, a controller, a PLC board and a power supply, and the refrigeration output end mainly comprises a pressure actuator, an evaporator, a semiconductor refrigeration piece and a heat conducting plate.

5. The TEC high and low temperature impact tester according to claim 4, wherein the host machine and the refrigeration output end are connected through an integrated hose, and a refrigerant input pipe, a refrigerant output pipe and an electric wire are arranged in the integrated hose.

6. The TEC high and low temperature impact tester according to claim 2, wherein the pressure actuator comprises a cylinder and a pressure transmitter, the pressure transmitter is connected to the controller, the pressure transmitter receives a pressure value control signal from the controller and controls the cylinder to perform an action, and feeds back the magnitude of the pressure value after performing the action to the controller.

7. The TEC high and low temperature impact tester according to claim 2, wherein the front end of the pressure actuator is provided with a butt joint which is clamped and fixed with a clamp for mounting the object to be tested.

8. The TEC high and low temperature impact tester according to claim 1, wherein the heat conducting plate is provided with a temperature sensor and a mounting hole for mounting the temperature sensor is opened on the heat conducting plate.

9. The TEC high and low temperature impact tester according to claim 1, wherein the inverter compressor is provided with a motor, the motor is connected with an inverter, the inverter is connected with a controller, and the controller controls the rotation speed of the motor through the inverter.

10. The TEC high and low temperature impact tester according to claim 1, wherein a dry filter and a throttling device are provided on the pipe between the condenser and the evaporator, and a fan for helping the coolant to dissipate heat is provided on the condenser.