WO2021238849A1 - 拍摄装置、电子设备及拍摄装置的控制方法 - Google Patents

拍摄装置、电子设备及拍摄装置的控制方法 Download PDF

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Publication number
WO2021238849A1
WO2021238849A1 PCT/CN2021/095476 CN2021095476W WO2021238849A1 WO 2021238849 A1 WO2021238849 A1 WO 2021238849A1 CN 2021095476 W CN2021095476 W CN 2021095476W WO 2021238849 A1 WO2021238849 A1 WO 2021238849A1
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WO
WIPO (PCT)
Prior art keywords
module
photosensitive chip
acting
photographing device
chip module
Prior art date
Application number
PCT/CN2021/095476
Other languages
English (en)
French (fr)
Inventor
许能华
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to JP2022572793A priority Critical patent/JP7516564B2/ja
Priority to EP21814431.9A priority patent/EP4175276A4/en
Priority to KR1020227045538A priority patent/KR20230016053A/ko
Publication of WO2021238849A1 publication Critical patent/WO2021238849A1/zh
Priority to US17/993,513 priority patent/US20230092048A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/56—Accessories
    • G03B17/561—Support related camera accessories
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation

Definitions

  • This application belongs to the field of anti-shake technology, and specifically relates to a photographing device and a control method of the photographing device.
  • the present application provides a photographing device and a control method of the photographing device, which can solve the problem of complex structure and low thrust of the anti-shake device in the prior art.
  • an embodiment of the present application provides a photographing device, including:
  • a lens module the lens module is installed on the base, the lens module is fixedly arranged with respect to the base, and the lens module includes a lens body;
  • the photosensitive chip module is mounted on the lens module, the photosensitive chip module is located on the side of the lens body close to the base, and the photosensitive chip module is in a first plane Movable, the first plane is parallel to the lens body;
  • the drive module drives the photosensitive chip module to move in the first plane to realize anti-shake.
  • an embodiment of the present application provides an electronic device, including the photographing device as described in the first aspect.
  • an embodiment of the present application provides a method for controlling a photographing device, which is applied to the photographing device according to the first aspect, and the method includes:
  • the driving module drives the photosensitive chip module to move in the first plane to achieve anti-shake.
  • an embodiment of the present application provides a photographing device, including: a receiving module for receiving input from a user; a driving module for driving the photosensitive chip module in response to the input Move in the first plane to achieve anti-shake.
  • an embodiment of the present application provides an electronic device that includes a processor, a memory, and a program or instruction that is stored on the memory and can run on the processor.
  • the program or instruction is When the processor executes, the steps of the control method of the photographing device as described in the third aspect are realized.
  • an embodiment of the present application provides a readable storage medium that stores a program or instruction on the readable storage medium, and when the program or instruction is executed by a processor, the imaging device described in the third aspect is implemented Steps of the control method.
  • an embodiment of the present application provides a chip, the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is used to run a program or an instruction to implement the third aspect The control method of the photographing device.
  • the embodiments of the present application provide a computer software product, the computer software product is stored in a nonvolatile storage medium, and the software product is configured to be executed by at least one processor to implement the third The steps of the control method of the photographing device described in the aspect.
  • an embodiment of the present application provides a photographing device configured to execute the control method according to the third aspect.
  • the photosensitive chip module is driven by the electromagnetic drive module to move in a plane parallel to the lens body, thereby achieving anti-shake.
  • the structure is simple and compact, and can produce more Big thrust.
  • Fig. 1 is an exploded view of a photographing device provided by an embodiment of the present application
  • FIGS. 2 to 13 are schematic diagrams of partial structures of a photographing device provided by an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a photographing device provided by an embodiment of the present application.
  • 15-16 are schematic cross-sectional views of a photographing device provided by an embodiment of the present application.
  • 17-18 are schematic diagrams of a driving module of a photographing device provided by an embodiment of the present application.
  • FIG. 19 is a schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present application.
  • first and second in the specification and claims of this application are used to distinguish similar objects, but not to describe a specific sequence or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the "first", “second”, etc. are distinguished
  • the objects are usually of one type, and the number of objects is not limited.
  • the first object may be one or multiple.
  • “and/or” in the description and claims means at least one of the connected objects, and the character “/” generally means that the associated objects before and after are in an "or” relationship.
  • an embodiment of the present application provides a photographing device, including: a base 10, a lens module, a photosensitive chip module, and a driving module;
  • the lens module is mounted on the base 10, the lens module is fixedly arranged relative to the base 10, the lens module includes a lens body 1, and the lens body 1 is made of one or more pieces
  • An optical component composed of curved (usually spherical) optical glass or plastic parts, used for transmitting light, capable of receiving light signals and converging the light signals on the photosensitive chip module;
  • the photosensitive chip module is mounted on the lens module, the photosensitive chip module is located on a side of the lens body 1 close to the base 10, and the photosensitive chip module is movable in a first plane, The first plane is parallel to the lens body 1, and the photosensitive chip module has the photosensitive chip 6.
  • the photosensitive chip 6 can receive light, convert the light signal into an electrical signal, and cooperate with other image processing devices to image the subject , Realize shooting.
  • the photosensitive chip module is installed on the lens module, including a physical connection relationship and an electrical connection relationship
  • the photosensitive chip module is installed on the lens module for soft mounting, that is, the photosensitive chip module It has a connection relationship with the lens module, but the relative position relationship can be changed.
  • the first plane is parallel to the lens body 1, that is, is arranged perpendicular to the main optical axis of the lens body 1, so that the photosensitive chip module can move in the first plane, that is, in the vertical direction. It is movable in the plane of the main optical axis of the lens body 1, so as to realize anti-shake;
  • the drive module is respectively connected to the base 10 and the photosensitive chip module, the drive module is an electromagnetic drive module, the drive module is electrically connected to the photosensitive chip module, and the drive module
  • the group drives the photosensitive chip module to move in the first plane to achieve anti-shake.
  • the photosensitive chip module can be moved in a plane perpendicular to the main optical axis of the lens body 1. In this way, the distance between the photosensitive chip module and the lens body 1 in the horizontal direction is changed to realize anti-shake, wherein the horizontal direction refers to the direction perpendicular to the main optical axis of the lens body 1.
  • the photosensitive chip module is driven by an electromagnetic drive module to move in a plane perpendicular to the main optical axis of the lens body 1, thereby achieving anti-shake.
  • the structure is simple Compact, can produce greater thrust.
  • the photosensitive chip module is mounted on the lens module through a suspension module, wherein the suspension module includes: a plurality of suspension members 4 and a conductive connection member, a plurality of the suspension modules
  • the components 4 are respectively connected with the lens module and the photosensitive chip module, and each of the suspension members 4 can be deformed; the conductive connecting members are respectively electrically connected with the lens module and the photosensitive chip module.
  • “multiple” means “two or more”, that is, the “multiple” suspension members 4 refer to “at least three” suspension members 4. Exemplarily, as shown in FIG. 9, the number of the suspension members 4 is four, so that the photosensitive chip module maintains a certain degree of stability and only produces displacement in the first plane.
  • the number of the suspension members 4 can also be three, five, seven, etc., which are specifically set according to actual needs, which is not limited here.
  • the photosensitive chip module and the lens module can be connected through the suspension 4, and the suspension 4 can be deformed, so that the photosensitive chip module can move in the first plane; the photosensitive chip module and the lens module can be realized through the conductive connection Electrical connection between lens modules.
  • a plurality of the suspension members 4 are arranged at intervals along the circumferential direction of the lens module.
  • a plurality of suspension members 4 may be arranged at equal intervals.
  • the lower surface of the lens module is square, and the four suspension members 4 are respectively located at the four corners of the lower surface. s position.
  • the multiple suspension members 4 may not be arranged at equal intervals, which are specifically arranged according to actual needs, which is not limited here.
  • the photosensitive chip module can be moved in the first plane, and at the same time, the photosensitive chip module can maintain a certain degree of stability. Displacement occurs only in the first plane, and no displacement occurs in the second plane.
  • the second plane refers to a plane other than the first plane, so as to improve the stability and clarity of shooting.
  • the suspension member 4 is configured as the conductive connecting member, and each suspension member 4 is a conductive elastic member.
  • the suspension member 4 and the conductive connection member are arranged as one body, and the physical connection and electrical connection between the lens module and the photosensitive chip module are realized through the suspension member 4, so as to achieve the effects of reducing cost, reducing weight and saving space.
  • the lens module includes a frame 3, the frame 3 is provided with a plurality of conductive grooves, and one ends of the plurality of suspension members 4 are respectively installed in the corresponding conductive grooves , And each of the suspension members 4 is electrically connected to the conductive groove; the other ends of the plurality of suspension members 4 are respectively electrically connected to the photosensitive chip module.
  • the electrical connection between the frame 3, the suspension member 4 and the photosensitive chip module can be realized, the structure is simple and compact, and the assembly is convenient.
  • the suspension member 4 suspends the photosensitive chip module to facilitate the movement of the photosensitive chip module, thereby achieving the purpose of anti-shake; at the same time, the two ends of the suspension member 4 are connected to the frame 3 and the photosensitive chip respectively.
  • the module is electrically connected to realize the function of being connected to the outside world.
  • the frame 3 includes the metal part 3A and the plastic part 3B embedded in it, and insert molding (insert molding) technology
  • the two are injection molded together; the metal surface 3A1, the metal surface 3A2, the metal surface 3A3, and the metal surface 3A4 are respectively connected to the plastic part groove 3B1, the plastic part groove 3B2, and the plastic part
  • the plastic part 3B8 is combined, wherein the metal surface 3A5 and the plastic part groove 3B5 are combined to form the metal supporting surface 371, and the metal surface 3A6 and the plastic part groove 3B6 are combined to form the The metal supporting surface 372, wherein the metal surface 3A7 and the plastic part groove 3B7 are combined to form the metal supporting surface 373, and the metal surface 3A8 and the plastic part groove 3B8 are combined to form the metal supporting surface 374 .
  • the photosensitive chip module includes: a printed circuit board (PCB) 7 and a photosensitive chip 6.
  • the photosensitive chip 6 is mounted on the circuit board 7, and the photosensitive chip 6 It is electrically connected to the circuit board 7, and the photosensitive chip 6 faces the lens body 1,
  • the circuit board 7 is provided with a plurality of conductive mounting holes, and the other ends of the plurality of suspension members 4 are respectively mounted on the corresponding Inside the conductive mounting hole, and each of the suspension members 4 is electrically connected to the conductive mounting hole.
  • the photosensitive chip 6 can receive light, convert the light signal into an electric signal, and transmit the electric signal to the circuit board 7, and cooperate with other image processing devices to image the object to be photographed.
  • the circuit board 7 may be a flexible circuit board connected to the outside.
  • the circuit board 7 includes a circuit board 73, and four corners of the circuit board 73 are respectively provided with conductive mounting holes, which are respectively The conductive mounting hole 741, the conductive mounting hole 742, the conductive mounting hole 743, the conductive mounting hole 744, the conductive mounting hole 741 and one end of the suspension 41 are fixed by welding, the conductive mounting The hole 742 is fixed to one end of the suspension member 42 by welding, the conductive mounting hole 743 is fixed to one end of the suspension member 43 by welding, and the conductive mounting hole 744 is fixed to one end of the suspension member 44 by welding; The other end of the suspension member 41 is fixed in the conductive groove 321 of the frame 3 by welding, and the other end of the suspension member 42 is fixed in the conductive groove 322 of the frame 3 by welding.
  • the other end of the suspension member 43 is fixed in the conductive groove 323 of the frame 3 by welding, and the other end of the suspension member 44 is fixed in the conductive groove 324 of the frame 3 by welding;
  • the PCB 7 is fixed to the frame 3 through the suspension member 41, the suspension member 42, the suspension member 43, and the suspension member 44.
  • the circuit board carrying the photosensitive chip is suspended and fixed by the suspension member, and the electromagnetic force generated by the driving module drives the circuit board carrying the photosensitive chip to move, thereby realizing the image anti-shake function.
  • the PCB 7 includes a 3-layer S-shaped soft board 75, and the layer of the soft board 75 is parallel to the period of the layer. There are the strip holes 721 and the strip holes 722 in the middle of the soft board 75. The strip holes 721 and the strip holes 722 can reduce the obstruction of the soft board 75 during the movement.
  • the number of strip holes is not limited to two, and can be adjusted according to actual conditions; one end of the soft board 75 is connected to the connector 71, and the connector 71 is connected to an external line to supply power to the entire device; The other end of the flexible board 75 is connected to the circuit board 73, and the chip 6 is fixed on the upper surface 76 of the circuit board 73 by Surface Mounting Technology (SMT) technology, thereby realizing the chip 6 Connect to the outside world.
  • SMT Surface Mounting Technology
  • the suspension member 4 suspends and fixes the PCB 7 to facilitate displacement and movement of the PCB 7 and the photosensitive chip 6 fixed on the upper surface of the PCB 7 through SMT, thereby achieving the purpose of anti-shake.
  • the fixing surface 78 of the soft board 75 is fixed to the side surface 35 of the frame 3 by means of glue or the like, so as to prevent the connector 71 from being outside.
  • the PCB7 is affected to produce variation, causing adverse effects.
  • the photographing device further includes: a filter 5, as shown in Figs. 5, 6, and 14, the filter 5 is fixed to the bottom of the frame 3 by means of glue or the like On the surface of the groove 33, the optical signal received by the lens body 1 is filtered by the filter 5.
  • the drive module includes: a first drive assembly, the first drive assembly includes a first action part and a second action part, wherein the first action part is connected to the base 10, and the first action part is connected to the base 10; Two acting members are connected to the photosensitive chip module, and the first acting member and the second acting member magnetically act on each other in a first direction to drive the photosensitive chip module to move in the first direction .
  • the photosensitive chip module is driven to move in the first direction, and the photosensitive chip module and the lens module are changed in the first direction. In order to compensate for the shaking of the camera in the first direction and realize the anti-shake.
  • the drive module further includes: a second drive assembly, the second drive assembly includes a third acting part and a fourth acting part, wherein the third acting part is connected to the base 10, the The fourth acting member is connected to the photosensitive chip module, and the third acting member and the fourth acting member magnetically act on each other in the second direction to drive the photosensitive chip module in the second direction Moving, the second direction and the first direction are in the same plane, and the second direction intersects the first direction.
  • the photosensitive chip module is driven to move in the first direction, and the photosensitive chip module and the lens module are changed in the first direction.
  • the distance between the camera and the camera in the first direction is compensated for; the third acting member and the fourth acting member act magnetically in the second direction to drive the photosensitive chip module to move in the second direction , Changing the distance between the photosensitive chip module and the lens module in the second direction, so as to compensate for the jitter produced by the camera in the second direction; and because the second direction and the first direction are in the same plane, and the The second direction intersects the first direction.
  • the photosensitive chip module can be moved in all directions in the first plane, so that the photosensitive chip module can be changed.
  • the distance between the lens module and the lens module in each direction in the first plane so as to compensate for the shake generated by the camera in each direction in the first plane.
  • the photosensitive chip module includes: a circuit board 7 and a photosensitive chip 6 mounted on the circuit board 7, the first acting member is a magnetic member, and the second acting member is A coil, the second acting member is electrically connected to the circuit board 7, and when the second acting member is energized, the second acting member and the first acting member mutually magnetically act to drive the circuit board 7 moves in the first direction; the third acting member is a magnetic member, the fourth acting member is a coil, the fourth acting member is electrically connected to the circuit board 7, and the fourth acting member is When the element is energized, the fourth acting member and the third acting member mutually magnetically act to drive the circuit board 7 to move in the second direction. Through the mutual magnetoelectric effect between the coil and the magnetic part, the PCB 7 and the photosensitive chip 6 are driven to move, thereby realizing anti-shake.
  • the second acting member and the first acting member mutually magnetically act to drive the circuit board 7 to move in the first direction;
  • the fourth acting member is energized
  • the fourth acting member and the third acting member mutually magnetically drive the circuit board 7 to move in the second direction;
  • the second acting member and the fourth acting member are both energized
  • the second acting member and the first acting member mutually magnetically drive the circuit board 7 to move in the first direction, and the fourth acting member and the third acting member are mutually magnetically driven
  • the circuit board 7 moves in the second direction; so as to realize that the photosensitive chip module can be moved in all directions in the first plane, so that the first plane between the photosensitive chip module and the lens module can be changed.
  • the distance in each direction in the first plane thereby compensating for the shake generated by the camera in each direction in the first plane.
  • the first acting member and the third acting member are fixedly installed on the base 10.
  • the first driving assembly includes a plurality of sets of first acting members and second acting members arranged at intervals; the second driving assembly includes a plurality of sets of third acting members and fourth acting members arranged at intervals Pieces.
  • the multiple groups may be two groups, three groups, or other situations, which are specifically set according to actual needs and are not limited here.
  • the first driving assembly includes two sets of first acting members and second acting members arranged at intervals; the second driving assembly includes two sets of third acting members and fourth acting members arranged at intervals.
  • the second action part 81, the second action part 83, the fourth action part 82, and the fourth action part 84 wherein the second action part
  • the member 81, the second acting member 83, the fourth acting member 82 and the fourth acting member 84 are denoted as the assembly 8.
  • the four acting members (may be coils) are symmetrically distributed on the lower surface 77 of the circuit board 73.
  • the second acting member 81, the fourth acting member 82, the second acting member 83, the fourth acting member 84 and the circuit board 73 are connected and conducting together; the first acting member 91, the third acting member Piece 92, first action piece 93, third action piece 94, among them, first action piece 91, third action piece 92, first action piece 93, third action piece 94 are denoted as assembly 9, four action pieces ( It may be a magnetic part, such as a magnet, which is symmetrically fixed on the surface A3 of the base 10 by glue or the like; the second action part 81 corresponds to the upper and lower centers of the first action part 91, and the fourth action The member 82 corresponds to the upper and lower centers of the third acting member 92, the second acting member 83 corresponds to the upper and lower centers of the first acting member 93, and the fourth acting member 84 corresponds to the upper and lower centers of the third acting member 94.
  • the PCB 7 and the photosensitive chip 6 are driven to move in the device, thereby realizing the anti-shake effect.
  • the second acting member 81 and the fourth The acting member 82, the second acting member 83, the fourth acting member 84, and the first acting member 91, the third acting member 92, the first acting member 93, and the third acting The pieces 94 together constitute the drive module of the entire device.
  • the base 10 includes a side boss A21, a side boss A22, a side boss A23, and a side boss A24.
  • the side boss A25 collides with the side 791, side 792, side 793, and side 794 of the PCB 7 to prevent other parts of the PCB from being hit.
  • the side boss A21, the side boss A25 and the The side surface 791 corresponds to the side surface 791
  • the side surface boss A22 corresponds to the side surface 792
  • the side surface boss A23 corresponds to the side surface 793
  • the side surface boss A24 corresponds to the side surface 794
  • the base A includes the recess A1, and the purpose is to leave space for the PCB 7 to prevent the soft board 75 from colliding with the base A during the anti-shake movement.
  • X represents the first direction
  • Y represents the second direction
  • N represents the N pole of the magnet
  • S represents the S pole of the magnet
  • I represents the direction of current
  • F represents the direction of the Lorentz force received by the coil.
  • the lens module includes a frame 3, the photosensitive chip module includes a circuit board 7 and a photosensitive chip 6 mounted on the circuit board 7, and the base 10 includes a bottom plate and a surrounding area.
  • the side panel of the bottom panel, the side panel is connected to the edge of the bottom panel, the frame 3 is installed on the side panel, and the frame 3, the side panel and the bottom panel are formed between In the mounting cavity, the driving module and the photosensitive chip 6 are located in the mounting cavity, and a part of the circuit board 7 extends out of the mounting cavity.
  • the upper surface A4 of the base 10 and the lower surface 34 of the frame 3 are fixed together by glue or the like, so as to connect the photosensitive chip 6, part of the PCB 7, and the suspension
  • the part 4, the filter sheet 5, and the drive module are surrounded to prevent external forces.
  • the lens module further includes a motor 2, and the motor 2 is used to drive the lens body 1 to make a displacement movement, so as to realize the automatic focusing of the camera module.
  • the lens body 1 is used as the Auto-Focusing (AF) driving part of the entire device through a fixing method such as glue;
  • the motor 2 described in this solution uses a closed-loop motor as an example to illustrate, but it is not limited to closed-loop driving Motors also include open loop motors and mid-mounted motors.
  • the entire AF driving part after the lens body 1 and the motor 2 are fixed by glue is fixed to the concave part of the frame 3 by glue. Groove 31, so that the AF driving part and the anti-shake part are fixed together; the connection pin 21 of the motor 2, the connection pin 22 of the motor 2, the connection pin 23 of the motor 2, The connection pin 24 of the motor 2 is respectively conductively connected to the metal welding pad 361, the metal welding pad 362, the metal welding pad 363, and the metal welding pad 364 by welding, thereby connecting to the metal welding pad 361, the metal welding pad 362, the metal welding pad 364, and The suspension 4 and the PCB 7 are conductively connected to the outside, so that the AF driving part is connected to the outside.
  • the circuit board carrying the photosensitive chip is suspended and fixed by the suspension, and the electromagnetic force generated by the charged coil in the magnetic field drives the circuit board carrying the photosensitive chip to move, so as to realize the image anti-shake function, and the sensor ( Chip) anti-shake, simple and compact structure; relatively large space reserved for the drive module, so that a large magnet or multi-coil design can be used to generate greater thrust.
  • an embodiment of the present application further provides an electronic device, and the provided electronic device includes the photographing device described in any of the above embodiments.
  • the embodiment of the present application also provides a method for controlling the photographing device.
  • the method includes: receiving input from a user; in response to the input, the driving module drives the photosensitive chip The module moves in the first plane to achieve anti-shake.
  • the photosensitive chip module by receiving user input; in response to the input, the photosensitive chip module is driven by an electromagnetic drive module to move in a plane parallel to the lens body 1, thereby achieving anti-shake, compared to Traditional lens anti-shake can produce greater thrust.
  • the execution subject may be the camera, or a control module in the camera for executing the method of controlling the camera.
  • the method for controlling the shooting device executed by the shooting device is taken as an example to describe the shooting device provided in the embodiment of the present application.
  • An embodiment of the present application provides a photographing device, including: a receiving module for receiving user input; a driving module for responding to the input, the driving module driving the photosensitive chip module in the first Move in the plane to achieve anti-shake.
  • the photosensitive chip module by receiving user input; in response to the input, the photosensitive chip module is driven by an electromagnetic drive module to move in a plane parallel to the lens body 1, thereby achieving anti-shake, compared to Traditional lens anti-shake can produce greater thrust.
  • the photographing device in the embodiment of the present application may be a device, a component, an integrated circuit, or a chip in a terminal.
  • the device can be a mobile electronic device or a non-mobile electronic device.
  • the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (personal digital assistant). assistant, PDA), etc.
  • Non-mobile electronic devices can be servers, network attached storage (NAS), personal computers (PC), televisions (television, TV), teller machines or self-service machines, etc., this application The embodiments are not specifically limited.
  • the photographing device in the embodiment of the present application may be a device with an operating system.
  • the operating system may be an Android operating system, an ios operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.
  • the photographing device provided in the embodiment of the present application can implement the various processes implemented in the foregoing method embodiment, and in order to avoid repetition, details are not described herein again.
  • an embodiment of the present application further provides an electronic device, including a processor, a memory, and a program or instruction that is stored in the memory and can run on the processor.
  • an electronic device including a processor, a memory, and a program or instruction that is stored in the memory and can run on the processor.
  • the electronic devices in the embodiments of the present application include the above-mentioned mobile electronic devices and non-mobile electronic devices.
  • FIG. 19 is a schematic diagram of the hardware structure of an electronic device that implements an embodiment of the present application.
  • the electronic device 1000 includes, but is not limited to: a radio frequency unit 1001, a network module 1002, an audio output unit 1003, an input unit 1004, a sensor 1005, a display unit 1006, a user input unit 1007, an interface unit 1008, a memory 1009, a processor 1010, etc. part.
  • the electronic device 1000 may also include a power source (such as a battery) for supplying power to various components.
  • the power source may be logically connected to the processor 1010 through a power management system, so that the power management system can manage charging, discharging, and power management. Consumption management and other functions.
  • the structure of the electronic device shown in FIG. 19 does not constitute a limitation on the electronic device.
  • the electronic device may include more or fewer components than those shown in the figure, or some components may be combined, or different component arrangements, which will not be repeated here. .
  • the user input unit 1007 is configured to receive user input; the processor 1010 is configured to respond to the input, and the drive module drives the photosensitive chip module to move in the first plane to achieve prevention shake.
  • the photosensitive chip module by receiving user input; in response to the input, the photosensitive chip module is driven by an electromagnetic drive module to move in a plane parallel to the lens body 1, thereby achieving anti-shake, compared to Traditional lens anti-shake can produce greater thrust.
  • the input unit 1004 may include a graphics processing unit (GPU) 10041 and a microphone 10042.
  • the graphics processor 10041 is paired by the image capture device ( For example, the image data of the still picture or video obtained by the camera) is processed.
  • the display unit 1006 may include a display panel 10061, and the display panel 10061 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like.
  • the user input unit 1007 includes a touch panel 10071 and other input devices 10072.
  • the touch panel 10071 is also called a touch screen.
  • the touch panel 10071 may include two parts, a touch detection device and a touch controller.
  • Other input devices 10072 may include, but are not limited to, a physical keyboard, function keys (such as volume control buttons, switch buttons, etc.), trackball, mouse, and joystick, which will not be repeated here.
  • the memory 1009 may be used to store software programs and various data, including but not limited to application programs and operating systems.
  • the processor 1010 may integrate an application processor and a modem processor.
  • the application processor mainly processes an operating system, a user interface, and an application program
  • the modem processor mainly processes wireless communication. It can be understood that the foregoing modem processor may not be integrated into the processor 1010.
  • the embodiment of the present application also provides a readable storage medium, and the readable storage medium stores a program or instruction.
  • the program or instruction is executed by a processor, each process of the control method embodiment of the above-mentioned photographing device is realized, and can be To achieve the same technical effect, in order to avoid repetition, I will not repeat them here.
  • the processor is the processor in the electronic device described in the foregoing embodiment.
  • the readable storage medium includes a computer readable storage medium, such as computer read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disks, or optical disks.
  • the embodiment of the present application further provides a chip, the chip includes a processor and a communication interface, the communication interface is coupled with the processor, and the processor is used to run a program or an instruction to implement the control method of the aforementioned camera
  • the chip includes a processor and a communication interface
  • the communication interface is coupled with the processor
  • the processor is used to run a program or an instruction to implement the control method of the aforementioned camera
  • chips mentioned in the embodiments of the present application may also be referred to as system-level chips, system-on-chips, system-on-chips, or system-on-chips.
  • the method of the above embodiments can be implemented by means of software plus the necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases the former is better. ⁇
  • the technical solution of this application essentially or the part that contributes to the existing technology can be embodied in the form of a software product, and the computer software product is stored in a storage medium (such as ROM/RAM, magnetic disk, The optical disc) includes several instructions to make a terminal (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) execute the methods described in the various embodiments of the present application.

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Abstract

本申请公开了一种拍摄装置、电子设备及拍摄装置的控制方法。该拍摄装置包括：底座、透镜模组、感光芯片模组和驱动模组，透镜模组安装于底座，透镜模组相对于底座固定设置，透镜模组包括透镜本体；感光芯片模组安装于透镜模组，感光芯片模组位于透镜本体的靠近底座的一侧，感光芯片模组在第一平面内可移动，第一平面与透镜本体平行；驱动模组分别与底座和感光芯片模组相连，驱动模组为电磁驱动模组，驱动模组与感光芯片模组电连接，驱动模组驱动感光芯片模组在第一平面内移动，以实现防抖。

Description

拍摄装置、电子设备及拍摄装置的控制方法
相关申请的交叉引用
本申请主张在2020年5月27日在中国提交的中国专利申请号No.202010460991.7的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于防抖技术领域，具体涉及一种拍摄装置及拍摄装置的控制方法。
背景技术
手持电子设备拍照时，手的抖动会造成电子设备的轻微倾斜(一般在+/-0.5度以内)，该倾斜引起了镜头观察角度的变化，造成图像始终随着手的抖动而处于不稳定状态。目前的防抖方案绝大部分采用Lens(镜头)防抖，结构复杂，且推力较小。
发明内容
本申请提供一种拍摄装置及拍摄装置的控制方法，能够解决现有技术中存在的防抖装置结构复杂，且推力较小的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种拍摄装置，包括：
底座；
透镜模组，所述透镜模组安装于所述底座，所述透镜模组相对于所述底座固定设置，所述透镜模组包括透镜本体；
感光芯片模组，所述感光芯片模组安装于所述透镜模组，所述感光芯片模组位于所述透镜本体的靠近所述底座的一侧，所述感光芯片模组在第一平面内可移动，所述第一平面与所述透镜本体平行；
驱动模组，所述驱动模组分别与所述底座和所述感光芯片模组相连，所述驱动模组为电磁驱动模组，所述驱动模组与所述感光芯片模组电连接，所 述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。
第二方面，本申请实施例提供了一种电子设备，包括如第一方面所述的拍摄装置。
第三方面，本申请实施例提供了一种拍摄装置的控制方法，应用于如第一方面所述的拍摄装置，所述方法包括：
接收用户的输入；
响应于所述输入，所述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。
第四方面，本申请实施例提供了一种拍摄装置，包括：接收模块，用于接收用户的输入；驱动模块，用于响应于所述输入，所述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。
第五方面，本申请实施例提供了一种电子设备，该电子设备包括处理器、存储器及存储在所述存储器上并可在所述处理器上运行的程序或指令，所述程序或指令被所述处理器执行时实现如第三方面所述的拍摄装置的控制方法的步骤。
第六方面，本申请实施例提供了一种可读存储介质，所述可读存储介质上存储程序或指令，所述程序或指令被处理器执行时实现如第三方面所述的拍摄装置的控制方法的步骤。
第七方面，本申请实施例提供了一种芯片，所述芯片包括处理器和通信接口，所述通信接口和所述处理器耦合，所述处理器用于运行程序或指令，实现如第三方面所述的拍摄装置的控制方法。
第八方面，本申请实施例提供了一种计算机软件产品，所述计算机软件产品被存储在非易失的存储介质中，所述软件产品被配置成被至少一个处理器执行以实现如第三方面所述的拍摄装置的控制方法的步骤。
第九方面，本申请实施例提供了一种拍摄装置，所述拍摄装置被配置成用于执行如第三方面所述的控制方法。
在本申请实施例中，通过电磁驱动模组驱动感光芯片模组在平行于所述透镜本体的平面内移动，从而实现防抖，相较于传统的镜头防抖，结构简单紧凑，可以产生更大的推力。
附图说明
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1是本申请实施例提供的一种拍摄装置的爆炸图；
图2-图13是本申请实施例提供的一种拍摄装置的部分结构示意图；
图14是本申请实施例提供的一种拍摄装置的结构示意图；
图15-图16是本申请实施例提供的一种拍摄装置的剖面示意图；
图17-图18是本申请实施例提供的一种拍摄装置的驱动模组的示意图；
图19是本申请实施例提供的一种电子设备的硬件结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的拍摄装置进行详细地说明。
如图1～图18所示，本申请实施例提供一种拍摄装置，包括：底座10、透镜模组、感光芯片模组和驱动模组；
所述透镜模组安装于所述底座10，所述透镜模组相对于所述底座10固 定设置，所述透镜模组包括透镜本体1，所述透镜本体1是一种是由一片或多片弧面(通常为球面)光学玻璃或者塑料件组成的光学部件，用于透射光线，能够接收光信号并汇聚光信号于感光芯片模组；
所述感光芯片模组安装于所述透镜模组，所述感光芯片模组位于所述透镜本体1的靠近所述底座10的一侧，所述感光芯片模组在第一平面内可移动，所述第一平面与所述透镜本体1平行，感光芯片模组具有所述感光芯片6，感光芯片6可以接收光线，将光信号转换为电信号，配合其他图像处理器件，使被拍摄物成像，实现拍摄。其中，所述感光芯片模组安装于所述透镜模组，包括物理连接关系和电连接关系，且所述感光芯片模组安装于所述透镜模组为软安装，即所述感光芯片模组与所述透镜模组具有连接关系，但是相对位置关系可发生变化。
可以理解的是，所述第一平面与所述透镜本体1平行，即垂直于所述透镜本体1的主光轴设置，这样所述感光芯片模组在第一平面内可移动，即在垂直于所述透镜本体1的主光轴的平面内可移动，从而实现防抖；
所述驱动模组分别与所述底座10和所述感光芯片模组相连，所述驱动模组为电磁驱动模组，所述驱动模组与所述感光芯片模组电连接，所述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。由此，通过驱动模组的电磁力驱动所述感光芯片模组在所述第一平面内移动，即可使得感光芯片模组在垂直于所述透镜本体1的主光轴的平面内移动，从而改变感光芯片模组和透镜本体1之间在水平方向上的距离，实现防抖，其中水平方向是指与所述透镜本体1的主光轴垂直的方向。
在本申请实施例中，通过电磁驱动模组驱动感光芯片模组在垂直于所述透镜本体1的主光轴的平面内移动，从而实现防抖，相较于传统的镜头防抖，结构简单紧凑，可以产生更大的推力。
根据本申请的一些实施例，所述感光芯片模组通过悬挂模组安装于所述透镜模组，其中，所述悬挂模组包括：多个悬挂件4以及导电连接件，多个所述悬挂件4分别与所述透镜模组和所述感光芯片模组连接，每个所述悬挂件4可形变；所述导电连接件分别与所述透镜模组和所述感光芯片模组电连接。需要说明的是，“多个”含义为“两个以上”，即所述“多个”悬挂件4 指“至少三个”悬挂件4。示例性地，如图9所示，所述悬挂件4为四个，以使感光芯片模组保持一定的稳定性，只在第一平面内产生位移。当然，所述悬挂件4的个数还可以是三个、五个、七个等，具体根据实际需要设置，在此不做限定。这样，便可通过悬挂件4连接感光芯片模组和透镜模组，且所述悬挂件4可形变，使得感光芯片模组在第一平面内可以移动；通过导电连接件实现感光芯片模组和透镜模组之间的电连接。
根据本申请的一些实施例，多个所述悬挂件4沿所述透镜模组的周向间隔设置。在一种可选地实施方式中，多个悬挂件4可以等间距设置，如图6所示，透镜模组的下表面为方形，4个悬挂件4分别位于所述下表面的四个拐角的位置。当然，多个悬挂件4也可以不是等间距设置，具体根据实际需要设置，在此不做限定。这样，便可以使得感光芯片模组在第一平面内可以移动，同时使得感光芯片模组保持一定的稳定性，只在第一平面内产生位移，不会在第二平面内发生位移，这里第二平面指除第一平面之外的平面，从而提高拍摄的稳定性和清晰度。
根据本申请的一些实施例，所述悬挂件4构造为所述导电连接件，每个所述悬挂件4为导电弹性件。将悬挂件4和导电连接件设置为一体，通过悬挂件4实现透镜模组和感光芯片模组之间的物理连接和电连接，实现减低成本、减轻重量以及节省空间的效果。
根据本申请的一些实施例，所述透镜模组包括框架3，所述框架3上设有多个导电凹槽，多个所述悬挂件4的一端分别安装在对应的所述导电凹槽内，且每个所述悬挂件4与所述导电凹槽电连接；多个所述悬挂件4的另一端分别与所述感光芯片模组电连接。这样，便可实现框架3、悬挂件4和感光芯片模组之间的电连接，结构简单紧凑，装配方便。
所述悬挂件4将所述感光芯片模组悬空设置，便于使得所感光芯片模组可以移动，从而达到防抖目的；同时所述悬挂件4两端分别与所述框架3以及所述感光芯片模组电连接，实现通过与外界导通的作用。
在本申请的一个具体示例中，如图2、图3、图4所示，所述框架3包含内嵌所述金属件3A以及所述塑料件3B，通过insert molding(嵌件注塑)技术将两者注塑一起；所述金属面3A1、所述金属面3A2、所述金属面3A3、 所述金属面3A4分别与所述塑料件凹槽3B1、所述塑料件凹槽3B2、所述塑料件凹槽3B3、所述塑料件3B4组合，其中所述金属面3A1与所述塑料件凹槽3B1组合为所述金属焊接pad 361，其中所述金属面3A2与所述塑料件凹槽3B2组合为所述金属焊接pad 362，其中所述金属面3A3与所述塑料件凹槽3B3组合为所述金属焊接pad 363，其中所述金属面3A4与所述塑料件凹槽3B4组合为所述金属焊接pad 364；所述金属面3A5、所述金属面3A6、所述金属面3A7、所述金属面3A8分别与所述塑料件凹槽3B5、所述塑料件凹槽3B6、所述塑料件凹槽3B7、所述塑料件3B8组合，其中所述金属面3A5与所述塑料件凹槽3B5组合为所述金属支撑面371，其中所述金属面3A6与所述塑料件凹槽3B6组合为所述金属支撑面372，其中所述金属面3A7与所述塑料件凹槽3B7组合为所述金属支撑面373，其中所述金属面3A8与所述塑料件凹槽3B8组合为所述金属支撑面374。
根据本申请的一些实施例，所述感光芯片模组包括：电路板(Printed Circuit Board，PCB)7和感光芯片6，所述感光芯片6安装在所述电路板7上，所述感光芯片6与所述电路板7电连接，且所述感光芯片6朝向所述透镜本体1，所述电路板7上设有多个导电安装孔，多个所述悬挂件4的另一端分别安装在对应的所述导电安装孔内，且每个所述悬挂件4与所述导电安装孔电连接。其中，感光芯片6可以接收光线，将光信号转换为电信号，并将电信号传输至电路板7，配合其他图像处理器件，使被拍摄物成像，实现拍摄。由此，在电路板7和感光芯片6之间、电路板7和悬挂件4之间实现了电连接，又因为框架3和悬挂件4之间具有电连接关系，因此在框架3、悬挂件4、电路板7之间形成了电连接关系。
所述电路板7可以是与外界导通的柔性线路板。
在本申请的一些实施例中，如图4、图6、图7、图9所示，所述电路板7包括线路板73，所述线路板73的四角落分别有导电安装孔，分别为所述导电安装孔741、所述导电安装孔742、所述导电安装孔743、所述导电安装孔744，所述导电安装孔741与所述悬挂件41的一端通过焊接固定，所述导电安装孔742与所述悬挂件42的一端通过焊接固定，所述导电安装孔743与所述悬挂件43的一端通过焊接固定，所述导电安装孔744与所述悬挂件44的 一端通过焊接固定；所述悬挂件41另一端通过焊接固定在所述框架3的所述导电凹槽321内，所述悬挂件42另一端通过焊接固定在所述框架3的所述导电凹槽322内，所述悬挂件43另一端通过焊接固定在所述框架3的所述导电凹槽323内，所述悬挂件44另一端通过焊接固定在所述框架3的所述导电凹槽324内；从而达到将所述PCB 7通过所述悬挂件41、所述悬挂件42、所述悬挂件43、所述悬挂件44与所述框架3固定。
在本申请实施例中，通过悬挂件将承载感光芯片的线路板悬空固定，由驱动模组产生电磁力带动承载感光芯片的线路板发生移动，从而实现图片防抖的功能。
在本申请的一些实施例中，如图7、图8、图9所示，所述PCB 7包含有一条3层S型的软板75，所述软板75的层与层之期间平行，所述软板75中间有所述条形孔721和所述条形孔722，所述条形孔721和所述条形孔722可以减少所述软板75在运动过程中的产生阻碍运动的扭力，所述条形孔的数量不仅限于2个，可以根据实际情况调整；所述软板75的一端连接所述连接器71，通过所述连接器71与外界线路连接，给整个装置供电；所述软板75的另一端连接所述线路板73，所述芯片6通过表面贴装技术(Surface Mounting Technology，SMT)技术固定在所述线路板73的上表面76，从而实现所述芯片6与外界通电。这样，所述悬挂件4将所述PCB 7悬空固定，便于将所述PCB 7以及通过SMT固定在所述PCB 7上表面的所述感光芯片6做位移移动，从而达到防抖目的。
在本申请的一些实施例中，如图9、图12，所述软板75的所述固定面78通过胶水等方式固定在所述框架3的侧面35，从而避免所述连接器71在外面扣接时候影响所述PCB7产生变异，造成不良影响。
在本申请的一些实施例中，所述拍摄装置还包括：滤波片5，如图5、图6、图14所示，所述滤波片5通过胶水等方式固定在所述框架3底部的所述凹槽33表面，通过所述滤波片5过滤所述透镜本体1接收的光信号。
根据本申请的一些实施例，所述驱动模组包括：第一驱动组件，所述第一驱动组件包括第一作用件和第二作用件，其中第一作用件与底座10相连，所述第二作用件与所述感光芯片模组相连，所述第一作用件与所述第二作用 件在第一方向上相互磁力作用，以驱动所述感光芯片模组在所述第一方向上移动。由此，通过第一作用件与第二作用件在第一方向上相互磁力作用，驱动感光芯片模组在所述第一方向上移动，改变感光芯片模组和透镜模组在第一方向上的距离，从而对拍摄装置在第一方向上产生的抖动进行补偿，实现防抖。
根据本申请的一些实施例，所述驱动模组还包括：第二驱动组件，所述第二驱动组件包括第三作用件和第四作用件，其中第三作用件与底座10相连，所述第四作用件与所述感光芯片模组相连，所述第三作用件与所述第四作用件在第二方向上相互磁力作用，以驱动所述感光芯片模组在所述第二方向上移动，所述第二方向和所述第一方向位于同一平面内，且所述第二方向与所述第一方向相交。
由此，通过第一作用件与第二作用件在第一方向上相互磁力作用，驱动感光芯片模组在所述第一方向上移动，改变感光芯片模组和透镜模组在第一方向上的距离，从而对拍摄装置在第一方向上产生的抖动进行补偿；通过第三作用件与第四作用件在第二方向上相互磁力作用，驱动感光芯片模组在所述第二方向上移动，改变感光芯片模组和透镜模组在第二方向上的距离，从而对拍摄装置在第二方向上产生的抖动进行补偿；又因为第二方向和第一方向位于同一平面内，且所述第二方向与所述第一方向相交，通过第一驱动组件和第二驱动组件的共同作用，可以实现感光芯片模组在第一平面内的各个方向上均可以移动，从而可以改变感光芯片模组和透镜模组之间在第一平面内的各个方向上的距离，从而对拍摄装置在第一平面内的各个方向上产生的抖动进行补偿。
根据本申请的一些实施例，所述感光芯片模组包括：电路板7和安装在所述电路板7上的感光芯片6，所述第一作用件为磁性件，所述第二作用件为线圈，所述第二作用件与所述电路板7电连接，在所述第二作用件通电的情况下，所述第二作用件与所述第一作用件相互磁力作用驱动所述电路板7在所述第一方向上移动；所述第三作用件为磁性件，所述第四作用件为线圈，所述第四作用件与所述电路板7电连接，在所述第四作用件通电的情况下，所述第四作用件与所述第三作用件相互磁力作用驱动所述电路板7在所述第 二方向上移动。通过线圈与磁性件产生相互的磁电作用，带动所述PCB 7以及所述感光芯片6做位移移动，从而实现防抖。
由此，在第二作用件通电的情况下，所述第二作用件与所述第一作用件相互磁力作用驱动所述电路板7在所述第一方向上移动；在第四作用件通电的情况下，所述第四作用件与所述第三作用件相互磁力作用驱动所述电路板7在所述第二方向上移动；在第二作用件与第四作用件均通电的情况下，所述第二作用件与所述第一作用件相互磁力作用驱动所述电路板7在所述第一方向上移动，且所述第四作用件与所述第三作用件相互磁力作用驱动所述电路板7在所述第二方向上移动；从而实现感光芯片模组在第一平面内的各个方向上均可以移动，从而可以改变感光芯片模组和透镜模组之间在第一平面内的各个方向上的距离，从而对拍摄装置在第一平面内的各个方向上产生的抖动进行补偿。
根据本申请的一些实施例，所述第一作用件和所述第三作用件固定安装于所述底座10。
根据本申请的一些实施例，所述第一驱动组件包括间隔设置的多组第一作用件和第二作用件；所述第二驱动组件包括间隔设置的多组第三作用件和第四作用件。其中，所述多组可以是两组，也可以是三组，还可以是其他情况，具体根据实际需要设置，在此不做限定。所述第一驱动组件包括间隔设置的两组第一作用件和第二作用件；所述第二驱动组件包括间隔设置的两组第三作用件和第四作用件。
在本申请的一些实施例中，如图8、图10、图11所示，第二作用件81、第二作用件83、第四作用件82、第四作用件84，其中，第二作用件81、第二作用件83、第四作用件82和第四作用件84记为组件8，四个作用件(可以为线圈)相对称分布在所述线路板73的下表面77，所述第二作用件81、所述第四作用件82、所述第二作用件83、所述第四作用件84与所述线路板73连接导通在一起；第一作用件91、第三作用件92、第一作用件93、第三作用件94，其中，第一作用件91、第三作用件92、第一作用件93、第三作用件94记为组件9，四个作用件(可以为磁性件，比如磁石)通过胶水等相对称固定在所述底座10的所述表面A3上；所述第二作用件81与所述第一 作用件91上下中心对应，所述第四作用件82与所述第三作用件92上下中心对应，所述第二作用件83与所述第一作用件93上下中心对应，所述第四作用件84与所述第三作用件94上下中心对应，通过带电线圈在磁场中受到力的原理，实现带动所述PCB7以及所述感光芯片6在装置内做位移移动，从而实现防抖的功效，所述第二作用件81、所述第四作用件82、所述第二作用件83、所述第四作用件84、与所述第一作用件91、所述第三作用件92、所述第一作用件93、所述第三作用件94共同组成整个装置的驱动模组。
在本申请的一些实施例中，如图7、图10、图11、图13所示，所述底座10，包含有侧面凸台A21、侧面凸台A22、侧面凸台A23、侧面凸台A24、侧面凸台A25，与所述PCB7的侧面791、侧面792、侧面793、侧面794撞击，防止所述PCB 7其他部位被撞击，其中所述侧面凸台A21、所述侧面凸台A25与所述侧面791相对应，所述侧面凸台A22与所述侧面792相对应，所述侧面凸台A23与所述侧面793相对应，所述侧面凸台A24与所述侧面794相对应；所述底座A包含有所述凹台A1，目的是留有空间给所述PCB7，防止所述软板75在防抖运动过程中与所述底座A产生撞击。
在本申请的一些实施例中，如图17、图18所示，X代表第一方向，Y代表第二方向，N代表磁石的N极，S代表磁石的S极，I代表电流的方向，F代表线圈所受的洛伦兹力的方向。
根据本申请的一些实施例，所述透镜模组包括框架3，所述感光芯片模组包括电路板7和安装在所述电路板7上的感光芯片6，所述底座10包括底板和围绕所述底板的侧围板，所述侧围板连接于所述底板的边沿，所述框架3安装在所述侧围板上，所述框架3、所述侧围板和所述底板之间形成安装腔，所述驱动模组和所述感光芯片6位于所述安装腔内，所述电路板7的一部分伸出所述安装腔之外。
在本申请的一些实施例中，所述底座10的上表面A4与所述框架3的下表面34通过胶水等方式固定在一起，从而将所述感光芯片6、部分所述PCB7、所述悬挂件4、所述过滤片5、所述驱动模组包围，防止外界的受力。
在本申请的一些实施例中，所述透镜模组还包括：马达2，所述马达2用于带动所述透镜本体1做位移运动，从而实现摄像头模组自动对焦，所述 马达2与所述透镜本体1通过胶水等固定方式一起作为整个装置的自动对焦(Auto-Focusing，AF)驱动部分；本方案所述马达2，以一颗闭环的马达作为案例来陈述，但不仅限于闭环的驱动马达，也包括开环马达和中置马达。
在本申请的一些实施例中，如图4、图14所示，所述透镜本体1与所述马达2通过胶水固定后的整个AF驱动部分，通过胶水固定在所述框架3的所述凹槽31上，从而实现AF驱动部分与防抖部分固定在一起；所述马达2的所述连接pin 21、所述马达2的所述连接pin 22、所述马达2的所述连接pin 23、所述马达2的所述连接pin 24分别与所述金属焊接pad 361、所述金属焊接pad 362、所述金属焊接pad 363、所述金属焊接pad 364通过焊接方式导通连接，从而与所述悬挂件4、所述PCB7与外界导通连接，实现AF驱动部分与外界导通。
在本申请实施例中，通过悬挂件将承载感光芯片的线路板悬空固定，由带电线圈在磁场中产生电磁力带动承载感光芯片的线路板发生移动，从而实现图片防抖的功能，采用sensor(芯片)防抖，结构简单紧凑，；预留给驱动模组的空间相对大，从而可以采用大磁石或者多线圈的设计，产生更大的推力。
基于本申请实施例提供的拍摄装置，本申请实施例还提供一种电子设备，所提供的电子设备包括上文任一实施例所述的拍摄装置。
基于本申请实施例提供的拍摄装置，本申请实施例还提供一种拍摄装置的控制方法，所述方法包括：接收用户的输入；响应于所述输入，所述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。
在本申请实施例中，通过接收用户的输入；响应于所述输入，通过电磁驱动模组驱动感光芯片模组在平行于所述透镜本体1的平面内移动，从而实现防抖，相较于传统的镜头防抖，可以产生更大的推力。
需要说明的是，本申请实施例提供的拍摄装置的控制方法，执行主体可以为拍摄装置，或者该拍摄装置中的用于执行拍摄装置的控制方法的控制模块。本申请实施例中以拍摄装置执行拍摄装置的控制方法为例，说明本申请实施例提供的拍摄装置。
本申请实施例提供一种拍摄装置，包括：接收模块，用于接收用户的输 入；驱动模块，用于响应于所述输入，所述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。
在本申请实施例中，通过接收用户的输入；响应于所述输入，通过电磁驱动模组驱动感光芯片模组在平行于所述透镜本体1的平面内移动，从而实现防抖，相较于传统的镜头防抖，可以产生更大的推力。
本申请实施例中的拍摄装置可以是装置，也可以是终端中的部件、集成电路、或芯片。该装置可以是移动电子设备，也可以为非移动电子设备。示例性的，移动电子设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等，非移动电子设备可以为服务器、网络附属存储器(Network Attached Storage，NAS)、个人计算机(personal computer，PC)、电视机(television，TV)、柜员机或者自助机等，本申请实施例不作具体限定。
本申请实施例中的拍摄装置可以为具有操作系统的装置。该操作系统可以为安卓(Android)操作系统，可以为ios操作系统，还可以为其他可能的操作系统，本申请实施例不作具体限定。
本申请实施例提供的拍摄装置能够实现上述方法实施例实现的各个过程，为避免重复，这里不再赘述。
可选地，本申请实施例还提供一种电子设备，包括处理器，存储器，存储在存储器上并可在所述处理器上运行的程序或指令，该程序或指令被处理器执行时实现上述摄拍摄装置的控制方法实施例的各个过程，且能达到相同的技术效果，为避免重复，这里不再赘述。
需要注意的是，本申请实施例中的电子设备包括上述所述的移动电子设备和非移动电子设备。
图19为实现本申请实施例的一种电子设备的硬件结构示意图。
该电子设备1000包括但不限于：射频单元1001、网络模块1002、音频输出单元1003、输入单元1004、传感器1005、显示单元1006、用户输入单元1007、接口单元1008、存储器1009、以及处理器1010等部件。
本领域技术人员可以理解，电子设备1000还可以包括给各个部件供电的 电源(比如电池)，电源可以通过电源管理系统与处理器1010逻辑相连，从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。图19中示出的电子设备结构并不构成对电子设备的限定，电子设备可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置，在此不再赘述。
其中，用户输入单元1007，用于接收用户的输入；处理器1010，用于响应于所述输入，所述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。
在本申请实施例中，通过接收用户的输入；响应于所述输入，通过电磁驱动模组驱动感光芯片模组在平行于所述透镜本体1的平面内移动，从而实现防抖，相较于传统的镜头防抖，可以产生更大的推力。
应理解的是，本申请实施例中，输入单元1004可以包括图形处理器(Graphics Processing Unit，GPU)10041和麦克风10042，图形处理器10041对在视频捕获模式或图像捕获模式中由图像捕获装置(如摄像头)获得的静态图片或视频的图像数据进行处理。显示单元1006可包括显示面板10061，可以采用液晶显示器、有机发光二极管等形式来配置显示面板10061。用户输入单元1007包括触控面板10071以及其他输入设备10072。触控面板10071，也称为触摸屏。触控面板10071可包括触摸检测装置和触摸控制器两个部分。其他输入设备10072可以包括但不限于物理键盘、功能键(比如音量控制按键、开关按键等)、轨迹球、鼠标、操作杆，在此不再赘述。存储器1009可用于存储软件程序以及各种数据，包括但不限于应用程序和操作系统。处理器1010可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作系统、用户界面和应用程序等，调制解调处理器主要处理无线通信。可以理解的是，上述调制解调处理器也可以不集成到处理器1010中。
本申请实施例还提供一种可读存储介质，所述可读存储介质上存储有程序或指令，该程序或指令被处理器执行时实现上述拍摄装置的控制方法实施例的各个过程，且能达到相同的技术效果，为避免重复，这里不再赘述。
其中，所述处理器为上述实施例中所述的电子设备中的处理器。所述可读存储介质，包括计算机可读存储介质，如计算机只读存储器(Read-Only Memory，ROM)、随机存取存储器(Random Access Memory，RAM)、磁 碟或者光盘等。
本申请实施例另提供了一种芯片，所述芯片包括处理器和通信接口，所述通信接口和所述处理器耦合，所述处理器用于运行程序或指令，实现上述拍摄装置的控制方法实施例的各个过程，且能达到相同的技术效果，为避免重复，这里不再赘述。
应理解，本申请实施例提到的芯片还可以称为系统级芯片、系统芯片、芯片系统或片上系统芯片等。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端(可以是手机，计算机，服务器，空调器，或者网络设备等)执行本申请各个实施例所述的方法。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (20)

  1. 一种拍摄装置，包括：
    底座；
    透镜模组，所述透镜模组安装于所述底座，所述透镜模组相对于所述底座固定设置，所述透镜模组包括透镜本体；
    感光芯片模组，所述感光芯片模组安装于所述透镜模组，所述感光芯片模组位于所述透镜本体的靠近所述底座的一侧，所述感光芯片模组在第一平面内可移动，所述第一平面与所述透镜本体平行；
    驱动模组，所述驱动模组分别与所述底座和所述感光芯片模组相连，所述驱动模组为电磁驱动模组，所述驱动模组与所述感光芯片模组电连接，所述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。
  2. 根据权利要求1所述的拍摄装置，其中，所述感光芯片模组通过悬挂模组安装于所述透镜模组，其中，所述悬挂模组包括：
    多个悬挂件，多个所述悬挂件分别与所述透镜模组和所述感光芯片模组连接，每个所述悬挂件可形变；
    导电连接件，所述导电连接件分别与所述透镜模组和所述感光芯片模组电连接。
  3. 根据权利要求2所述的拍摄装置，其中，多个所述悬挂件沿所述透镜模组的周向间隔设置。
  4. 根据权利要求2所述的拍摄装置，其中，所述悬挂件构造为所述导电连接件，每个所述悬挂件为导电弹性件。
  5. 根据权利要求4所述的拍摄装置，其中，所述透镜模组包括框架，所述框架上设有多个导电凹槽，多个所述悬挂件的一端分别安装在对应的所述导电凹槽内，且每个所述悬挂件与所述导电凹槽电连接；多个所述悬挂件的另一端分别与所述感光芯片模组电连接。
  6. 根据权利要求5所述的拍摄装置，其中，所述感光芯片模组包括：电路板和感光芯片，所述感光芯片安装在所述电路板上，所述感光芯片与所述电路板电连接，且所述感光芯片朝向所述透镜本体，所述电路板上设有多个 导电安装孔，多个所述悬挂件的另一端分别安装在对应的所述导电安装孔内，且每个所述悬挂件与所述导电安装孔电连接。
  7. 根据权利要求1所述的拍摄装置，其中，所述驱动模组包括：
    第一驱动组件，所述第一驱动组件包括第一作用件和第二作用件，其中第一作用件与底座相连，所述第二作用件与所述感光芯片模组相连，所述第一作用件与所述第二作用件在第一方向上相互磁力作用，以驱动所述感光芯片模组在所述第一方向上移动。
  8. 根据权利要求7所述的拍摄装置，其中，所述驱动模组还包括：
    第二驱动组件，所述第二驱动组件包括第三作用件和第四作用件，其中第三作用件与底座相连，所述第四作用件与所述感光芯片模组相连，所述第三作用件与所述第四作用件在第二方向上相互磁力作用，以驱动所述感光芯片模组在所述第二方向上移动，所述第二方向和所述第一方向位于同一平面内，且所述第二方向与所述第一方向相交。
  9. 根据权利要求8所述的拍摄装置，其中，所述感光芯片模组包括：电路板和安装在所述电路板上的感光芯片，所述第一作用件为磁性件，所述第二作用件为线圈，所述第二作用件与所述电路板电连接，在所述第二作用件通电的情况下，所述第二作用件与所述第一作用件相互磁力作用驱动所述电路板在所述第一方向上移动；所述第三作用件为磁性件，所述第四作用件为线圈，所述第四作用件与所述电路板电连接，在所述第四作用件通电的情况下，所述第四作用件与所述第三作用件相互磁力作用驱动所述电路板在所述第二方向上移动。
  10. 根据权利要求9所述的拍摄装置，其中，所述第一作用件和所述第三作用件固定安装于所述底座。
  11. 根据权利要求8所述的拍摄装置，其中，所述第一驱动组件包括间隔设置的多组第一作用件和第二作用件；所述第二驱动组件包括间隔设置的多组第三作用件和第四作用件。
  12. 根据权利要求1所述的拍摄装置，其中，所述透镜模组包括框架，所述感光芯片模组包括电路板和安装在所述电路板上的感光芯片，所述底座包括底板和围绕所述底板的侧围板，所述侧围板连接于所述底板的边沿，所述 框架安装在所述侧围板上，所述框架、所述侧围板和所述底板之间形成安装腔，所述驱动模组和所述感光芯片位于所述安装腔内，所述电路板的一部分伸出所述安装腔之外。
  13. 一种电子设备，包括根据权利要求1-12中任一项所述的拍摄装置。
  14. 一种拍摄装置的控制方法，应用于如权利要求1-12中任一项所述的拍摄装置，所述方法包括：
    接收用户的输入；
    响应于所述输入，所述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。
  15. 一种拍摄装置，包括：接收模块，用于接收用户的输入；驱动模块，用于响应于所述输入，所述驱动模组驱动所述感光芯片模组在所述第一平面内移动，以实现防抖。
  16. 一种电子设备，该电子设备包括处理器、存储器及存储在所述存储器上并可在所述处理器上运行的程序或指令，所述程序或指令被所述处理器执行时实现如权利要求14所述的拍摄装置的控制方法的步骤。
  17. 一种可读存储介质，所述可读存储介质上存储程序或指令，所述程序或指令被处理器执行时实现如权利要求14所述的拍摄装置的控制方法的步骤。
  18. 一种芯片，所述芯片包括处理器和通信接口，所述通信接口和所述处理器耦合，所述处理器用于运行程序或指令，实现如权利要求14所述的拍摄装置的控制方法。
  19. 一种计算机软件产品，所述计算机软件产品被存储在非易失的存储介质中，所述软件产品被配置成被至少一个处理器执行以实现如权利要求14所述的拍摄装置的控制方法的步骤。
  20. 一种拍摄装置，所述拍摄装置被配置成用于执行如权利要求14所述的拍摄装置的控制方法。
PCT/CN2021/095476 2020-05-27 2021-05-24 拍摄装置、电子设备及拍摄装置的控制方法 WO2021238849A1 (zh)

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KR20230016053A (ko) 2023-01-31
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CN111654603A (zh) 2020-09-11
EP4175276A4 (en) 2023-09-20
JP2023527838A (ja) 2023-06-30
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