WO2021238468A1 - 基板及其切割方法、电子器件及电子设备 - Google Patents

基板及其切割方法、电子器件及电子设备 Download PDF

Info

Publication number
WO2021238468A1
WO2021238468A1 PCT/CN2021/086832 CN2021086832W WO2021238468A1 WO 2021238468 A1 WO2021238468 A1 WO 2021238468A1 CN 2021086832 W CN2021086832 W CN 2021086832W WO 2021238468 A1 WO2021238468 A1 WO 2021238468A1
Authority
WO
WIPO (PCT)
Prior art keywords
arc
substrate
straight line
cutting
line segment
Prior art date
Application number
PCT/CN2021/086832
Other languages
English (en)
French (fr)
Inventor
宋春雷
曾磊
王文亮
郑亮亮
Original Assignee
京东方科技集团股份有限公司
京东方（河北）移动显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 京东方（河北）移动显示技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/780,053 priority Critical patent/US20220413325A1/en
Priority to EP21813346.0A priority patent/EP4160303A4/en
Publication of WO2021238468A1 publication Critical patent/WO2021238468A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/56—Substrates having a particular shape, e.g. non-rectangular
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Definitions

  • the embodiments of the present disclosure relate to a substrate and a cutting method thereof, an electronic device, and an electronic device.
  • the related art When preparing the substrate, the related art first uses a cutter wheel to cut the substrate mother board into a plurality of individual substrates; and then uses a laser to cut the corners of the substrate through an external cutting process.
  • the external cutting process refers to the laser cutting directly from one edge of the substrate to the other edge of the substrate, so as to cut off the corners of the substrate.
  • the substrate carries electronic components.
  • the laser is cut to the edge of the substrate, the edge of the substrate will refract the laser into the substrate, making the laser reflect back and forth inside the substrate. At this time, the laser is easily reflected to the substrate. On the electronic components, it is easy to burn the electronic components and cause the product to be defective.
  • a substrate in one aspect, includes: at least two side portions; and, at least one end portion, each end portion connecting two adjacent side portions.
  • each end includes a cutting section and two breaking sections, one end of the cutting section is connected to one of the two adjacent sides through a breaking section, and the other end of the cutting section passes through the other
  • the fracture section connects the other edge of the two adjacent edges.
  • the cutting section is configured to be formed by cutting with a tool, and the fracture section is configured to be formed under the action of physical force.
  • the orthographic projection of the cutting segment on the plane where the substrate is located includes: a first arc, and the arc center of the first arc is located inside the substrate.
  • the orthographic projection of the cutting segment on the plane where the substrate is located further includes: a second arc, the first end of the second arc and one of the fractured segments on the plane where the substrate is located Orthographic projection connection, the second end of the second arc is directly or indirectly connected to the first end of the first arc; the arc center of the second arc is located outside the substrate; and/or, A third circular arc, the first end of the third circular arc is connected with the orthographic projection of the other fractured segment on the plane where the substrate is located, and the second end of the third circular arc is connected to the first circular arc The second ends of are directly or indirectly connected; the arc center of the third arc is located outside the substrate.
  • the second circular arc when the second circular arc is directly connected to the first circular arc, and/or, the third circular arc is directly connected to the first circular arc; the second circular arc is directly connected to the first circular arc;
  • the radius of the arc and/or the radius of the third arc is r 21 , and r 21 satisfies the following formula:
  • the cutting segment The orthographic projection on the plane where the substrate is located further includes: a first straight line segment, the first end of the first straight line segment is connected to the second end of the second arc, and the second end of the first straight line segment is connected to The first end of the first arc; and/or, the second straight line segment, the first end of the second straight line segment is connected to the second end of the third arc, and the second straight line segment has the first end The two ends are connected to the second end of the first arc.
  • the first straight line segment is tangent to the second arc and the first arc at the same time, and/or the second straight line segment is tangent to the third arc and the first arc at the same time.
  • the first arc is tangent.
  • the radius of the second arc and/or the radius of the third arc is r 22 , and r 22 satisfies the following formula:
  • the third limit value is approximately equal to 0.05 mm.
  • the cutting segment The orthographic projection on the plane where the substrate is located further includes: a fourth arc, the first end of the fourth arc is connected to the second end of the second arc, and the second end of the fourth arc is connected to The first end of the first arc; and/or, the fifth arc, the first end of the fifth arc is connected to the second end of the third arc, the first end of the fifth arc The two ends are connected to the second end of the first arc.
  • the fourth circular arc is inscribed with the first circular arc, and the fourth circular arc is circumscribed with the second circular arc; and/or, the fifth circular arc is inscribed with The first circular arc cuts inwardly, and the fifth circular arc cuts out of the three circular arcs.
  • the cutting segment The orthographic projection on the plane where the substrate is located further includes: a first straight line segment and a fourth circular arc, the first end of the first straight line segment is connected to the second end of the second circular arc, and the first straight line segment The second end of the fourth arc is connected to the first end of the fourth arc, and the second end of the fourth arc is connected to the first end of the first arc; and/or, the second straight line segment and the fifth circle Arc, the first end of the second straight line segment is connected to the second end of the third arc, the second end of the second straight line segment is connected to the first end of the fifth arc, the fifth The second end of the arc is connected to the second end of the first arc.
  • the first straight line segment is tangent to the second arc and the fourth arc at the same time, and the fourth arc is inwardly tangent to the first arc; and/or, The second straight line segment is simultaneously tangent to the third circular arc and the fifth circular arc, and the fifth circular arc is inwardly tangent to the first circular arc.
  • the radius of the second arc and/or the radius of the third arc is r 23 , and r 23 satisfies the following formula:
  • the value of k 1 ranges from 1 to 2; n is the formula The minimum value of L in the middle, ⁇ is the central angle corresponding to the auxiliary arc, the auxiliary arc is obtained by extending the first arc, and the opposite ends of the auxiliary arc are to the two adjacent sides The distance of is equal to the second limit value, r 1 is the radius of the first arc, and s is the first limit value.
  • the range of the radius of the first arc is 7.01 mm to 8.74 mm; the range of the radius of the second arc and/or the radius of the third arc is 0.15 mm ⁇ 0.3mm; the range of the radius of the fourth arc and/or the radius of the fifth arc is 5mm ⁇ 6mm; the length of the first straight line segment and/or the second straight line segment The range of the length of is 0.3mm ⁇ 0.52mm.
  • the shortest distance from each point of the cutting segment in the orthographic projection of the plane where the substrate is located to the circle where the first arc is located is less than or equal to a first limit value.
  • the first limit value is approximately equal to 0.04 mm.
  • the size of each of the fractured segments along the first direction is a second limited value; the first direction is parallel to the plane where the substrate is located and perpendicular to the edge connected to the fractured segment .
  • the second limit value ranges from 0.06 mm to 0.1 mm.
  • the second limit value ranges from 0.1 mm to 0.3 mm.
  • the electronic device includes: at least one substrate as described in any one of the foregoing embodiments.
  • the electronic device is any one of a display panel, a touch panel, a microfluidic chip, or an electronic chip.
  • the electronic device is a display panel; the display panel further includes: at least one metal wire disposed in the display panel and located at the periphery of the display panel.
  • the orthographic projection of the cutting section of the substrate on the plane where the substrate is located includes a first arc and a second arc
  • the shortest distance between the first arc and the metal wire is greater than the The shortest distance between the second arc and the metal wire
  • the orthographic projection of the cutting section of the substrate on the plane where the substrate is located includes the first arc and the third arc
  • the shortest distance between the first arc and the metal wire is greater than the shortest distance between the third arc and the metal wire
  • the cutting section of the substrate is located at the substrate
  • the orthographic projection of the plane includes a first arc and a first straight line segment
  • the shortest distance between the first arc and the metal wire is greater than the shortest distance between the first straight line segment and the metal wire
  • the orthographic projection of the plane includes a first arc and a first straight line
  • an electronic device in another aspect, includes: the electronic device described in any one of the foregoing embodiments.
  • a method for cutting a substrate which includes: cutting a substrate mother board into a plurality of substrates whose corners are to be removed along a first cutting path; determining a second cutting path on the substrate whose corners are to be removed; The second cutting path corresponds to the cutting section of the substrate as described in any of the above embodiments; the substrate whose corners are to be removed is cut along the second cutting path, and then the corners are removed by physical force to The substrate as described in any of the above embodiments is formed.
  • Fig. 1 is a structural diagram of a substrate according to some embodiments.
  • Figure 2 is a structural diagram of another substrate according to some embodiments.
  • 3A and 3B are structural diagrams of still another substrate according to some embodiments.
  • FIGS. 4A and 4B are structural diagrams of yet another substrate according to some embodiments.
  • FIG. 5 is a structural diagram of yet another substrate according to some embodiments.
  • Fig. 6 is a structural diagram of yet another substrate according to some embodiments.
  • FIG. 7 is a structural diagram of yet another substrate according to some embodiments.
  • Fig. 8 is a flowchart of a method for cutting a substrate according to some embodiments.
  • FIG. 9 is a structural diagram of a substrate mother board according to some embodiments.
  • FIG. 10 is a structural diagram of a substrate with corners to be removed according to some embodiments.
  • FIG. 11 is a structural diagram of an electronic device according to some embodiments.
  • Figure 12 is a structural diagram of an electronic device according to some embodiments.
  • FIG. 13 is a structural diagram of another electronic device according to some embodiments.
  • FIG. 14 is a structural diagram of a display panel according to some embodiments.
  • FIG. 15 is a structural diagram of another display panel according to some embodiments.
  • the substrate 1 includes at least two side portions 11 and at least one end portion 12, and each end portion 12 connects two adjacent side portions 11.
  • FIG. 1 only schematically shows one end 12 of the substrate 1 and does not limit the number of the upper ends 12 of the substrate 1. That is, in practical applications, only one end 12 may be provided on the substrate 1.
  • the part 12 can also be provided with two or more end parts 12.
  • each end portion 12 is connected to two adjacent side portions 11 thereof. For example, in the case where the substrate 1 includes four sides, if any two adjacent sides are provided with ends, the number of ends included in the substrate should be four.
  • each end 12 includes a cutting section 121 and two breaking sections 122.
  • One end of the cutting section 121 is connected to one of the two adjacent sides 11 through a breaking section 122.
  • the other end of the cutting section 121 is connected to the other side 11 of the two adjacent sides 11 through another breaking section 122.
  • the cutting section 121 is configured to be formed by cutting with a tool.
  • the tool may be a tool with a cutting function such as a laser cutting machine.
  • the laser cutting machine may use a laser to cut the cutting section 121 of the substrate 1.
  • the fracture section 122 is configured to be formed under the action of physical force, for example, the physical force may be gravity, pressure exerted by an external object, or the like.
  • the corner of the substrate to be removed will naturally fracture under the action of gravity, thereby forming the substrate 1; when the physical force is applied to an external object
  • the corner of the substrate to be removed will naturally fracture under the pressure of the external object (such as a human hand or mechanical equipment, etc.), thereby The substrate 1 is formed.
  • the laser will not remove the corners of the substrate from which the corners are to be removed. It is directed to the side 11 of the substrate 1, so the laser will not be refracted into the substrate 1 through the side 11 of the substrate 1, and the laser will not be reflected back and forth inside the substrate 1, which can prevent the laser from being reflected to the substrate. 1 on the electronic components, thereby helping to prevent burns to electronic components and reduce product defects.
  • the orthographic projection of the cutting section 121 on the plane where the substrate 1 is located includes a first arc R1, and the arc center O 1 of the first arc R1 is located inside the substrate 1, such that As a result, the corners of the substrate to be removed can form relatively regular rounded corners after cutting and breaking the corners, which improves the versatility of the substrate 1.
  • the orthographic projection of the cutting section 121 on the plane where the substrate 1 is located may only include the first arc R1; it may also include other parts in addition to the first arc R1 (for example, FIGS. 3A and 3B).
  • Figures 4A, 4B, and Figures 5-7 show the second arc R2, the third arc R3, the fourth arc R4, the fifth arc R5, the first straight line segment L1 and the second straight line segment At least one of L2).
  • the shortest distance from each point of the cutting section 121 in the orthographic projection of the plane where the substrate 1 is to the circle where the first arc R1 is located is less than Or equal to the first limit value.
  • the first limit value may be related to the cutting accuracy of the substrate required by the product. For example, when the cutting accuracy required by the product does not exceed h (that is, the cutting offset of the cutting section 121 does not exceed h), the first limit value may be set to be less than or equal to h.
  • the size of each fracture section 122 along the first direction is the second limit value d; the first direction is parallel to the plane where the substrate 1 is located and perpendicular to the fracture section.
  • the direction E of the edge 11 connected with 122, or the first direction is parallel to the plane where the substrate 1 is located and perpendicular to the direction F of the edge 13 connected with the fracture section 122.
  • the size of the second limit value d it can only satisfy that after the cutting section 121 is formed by cutting, the fracture section 122 can be formed under the action of physical force.
  • the value range of the second limit value d is 0.06 mm to 0.1 mm.
  • the value range of the second limit value d may be 0.06 mm to 0.08 mm.
  • the width of each fractured section 122 along the first direction E can be 0.06mm, 0.07mm, or 0.1mm, etc., so that after the cutting section 121 is formed on the substrate from which the corner is to be removed, the corner to be removed.
  • the corners of the substrate of the lower part are relatively easy to break, and undesirable residues are unlikely to appear on the substrate 1 after the corners are broken.
  • some embodiments of the present disclosure further improve the substrate 1
  • the cutting section 121 has been improved.
  • it includes but is not limited to the cutting section 121 described in the following embodiments.
  • the orthographic projection of the cutting section 121 on the plane where the substrate 1 is located includes not only the first arc R1, but also a second arc R2. And/or the third arc R3.
  • the first end of the second circular arc R2 and a fractured section 122 are on the plane of the substrate 1 Projection connection, the second end of the second arc R2 is directly or indirectly connected to the first end of the first arc R1 (for example, FIG. 3A shows that the second end of the second arc R2 is connected to the first arc The first end of R1 is directly connected.
  • Figures 4A, 5 and 6 show that the second end of the second arc R2 is indirectly connected to the first end of the first arc R1);
  • the arc center is located on the outside of the base plate.
  • the corner can be better broken along the predetermined track, so that the fracture section 122 of the substrate 1 is not prone to appear relatively high. There are many residues, and the fracture section 122 is not prone to burrs.
  • the first end of the third arc R3 and the other fracture section 122 are on the plane of the substrate 1 Projection connection, the second end of the third arc R3 is directly or indirectly connected to the second end of the first arc R1 (for example, FIG. 3A shows that the second end of the third arc R3 is connected to the first arc The first end of R1 is directly connected.
  • Figures 4A, 5 and 6 show that the second end of the third arc R3 is indirectly connected to the first end of the first arc R1);
  • the arc center is located on the outside of the base plate.
  • the stress distribution of the corner of the substrate to be removed is more uniform when it is fractured, and stress concentration is less likely to occur. Therefore, the corner can better fracture along the predetermined track, making the substrate 1 less likely to have more fractured sections. Residues, and the fractured section is not prone to burrs.
  • the second end of the second arc R2 is directly connected to the first end of the first arc R1, and/or the second end of the third arc R3 is directly connected to the second end of the first arc R1 Situation:
  • a first auxiliary line m1 and a second auxiliary line m2 are formed on the side of any one side 11 close to the first arc R1.
  • the first auxiliary line m1 is parallel to the orthographic projection of the side 11 on the plane of the substrate 1, and the distance from the first auxiliary line m1 to the orthographic projection of the side 11 on the plane of the substrate 1 is the second as described above Limit value (for example, the value range of the second limit value can be 0.06mm ⁇ 0.1mm); the second auxiliary line m2 is parallel to the orthographic projection of the side 11 on the plane where the substrate 1 is located, and the second auxiliary line m2
  • the distance to the orthographic projection of the side portion 11 on the plane where the substrate 1 is located is the sum of the second limit value and the above-mentioned first limit value (for example, the value range of the first limit value may be 0.036 mm to 0.044 mm).
  • the intersection point closest to the first arc R1 is the first position point T 1 ; and determine where the first arc R1 is Among the intersection points of the circle and the first auxiliary line m1, the intersection point closest to the first arc R1 is the second position point T 2 .
  • the preset angle ⁇ may be 30°-60°.
  • the radius of the second arc and/or the radius of the third arc is r 21 , and r 21 satisfies the following formula:
  • the first limit value and the second limit value have been described above, and will not be repeated here.
  • the radius r 21 of the second arc R2 or the third arc R3 is equal to the length of the line segment T 1 T 3 multiplied by tan ⁇ 1 .
  • the length of the line segment T 1 T 3 is equal to s is the above-mentioned first limit value.
  • the length of the line segment O 1 N is r 1 ⁇ cos(45°- ⁇ /2)-s;
  • ⁇ 1 may further calculate the second arc second arc central angle of R2 or R3, i.e., R2 of the second arc and second arc R3 central angle is equal to 2 ⁇ (90°- ⁇ 1 ).
  • the central angle of the second arc R2 may be 25°-40°; the central angle of the third arc R3 may also be 25°-40°.
  • the second end of the second arc R2 is indirectly connected to the first end of the first arc R1, and/or the second end of the third arc R3 is indirectly connected to the second end of the first arc R1 Situation:
  • the orthographic projection of the cutting section 121 on the plane where the substrate is located further includes a first straight line section L1 and/or a second straight line section L2.
  • the first end of the first straight line segment L1 is connected to the second end of the second arc R2, and the second end of the first straight line segment L1 is connected to the first end of the first arc R1.
  • a smooth transition between the first arc R1 and the second arc R2 can be achieved through the first straight section L1, so that the cutting section 121 is not prone to sharp corners, which can better meet the use requirements of the substrate.
  • the second end of the second straight line segment L2 is connected to the second end of the third arc R3, and the second segment of the second straight line segment L2 is connected to the second end of the first arc R1.
  • a smooth transition between the first arc R1 and the third arc R3 can be achieved through the second straight section L2, so that the cutting section 121 is not prone to sharp corners, which can better meet the use requirements of the substrate.
  • the first straight line segment L1 is tangent to the second circular arc R2 and the first circular arc R1 at the same time, and/or, the second straight line segment L2 is simultaneously tangent to the first circular arc R1.
  • the three arcs R3 are tangent to the first arc R1. In this way, a smoother transition effect can be achieved between the first circular arc R1 and the second circular arc R2, and/or between the first circular arc R1 and the third circular arc R3.
  • a fourth auxiliary line m4 a fifth auxiliary line m5, and a sixth auxiliary line m6 are made on the side of any one side 11 close to the cutting section 121.
  • the fourth auxiliary line m4 is parallel to the orthographic projection of the side 11 on the plane of the substrate 1, and the distance from the fourth auxiliary line m4 to the orthographic projection of the side 11 on the plane of the substrate 1 is the second as described above Limit value (for example, the value range of the second limit value can be 0.06mm ⁇ 0.1mm); the fifth auxiliary line m5 is parallel to the orthographic projection of the side 11 on the plane of the substrate 1, and the fifth auxiliary line m5
  • the distance to the orthographic projection of the side portion 11 on the plane of the substrate 1 is the sum of the second limit value and the first limit value (for example, the value range of the first limit value may be 0.036 mm to 0.044 mm).
  • the sixth auxiliary line m6 is parallel to the orthographic projection of the side 11 on the plane of the substrate 1, and the distance from the sixth auxiliary line m6 to the orthographic projection of the side 11 on the plane of the substrate 1 is the second limit value, the first The sum of the first limit value and the third limit value.
  • the third limit value is approximately equal to 0.05 mm, and here roughly means that the third limit value can fluctuate by ten percent on the basis of 0.05 mm. Setting the third limit value in this way is beneficial to realize a smooth transition between the first straight line segment L1 (or the second straight line segment L1) formed subsequently and the arc adjacent thereto.
  • auxiliary line m4 form a preset angle ⁇ m7 seventh auxiliary line, a seventh auxiliary line m4 m7 and a fourth auxiliary line intersect at the seventh position of the point T 7.
  • This embodiment does not limit the value of the preset angle ⁇ , as long as it is ensured that the seventh position point T 7 is located between the fourth position point T 4 and the fifth position point T 5 in a direction parallel to the fourth auxiliary line m4 That's it.
  • the preset angle ⁇ may be 30°-60°.
  • the radius of the second arc R2 and/or the radius of the third arc R3 is r 22
  • r 22 satisfies the following formula:
  • the value of k 1 ranges from 1 to 2; ⁇ is the central angle corresponding to the auxiliary arc, which is obtained by extending the first arc, r1 is the radius of the first arc; s is the first arc A limit value; ⁇ is the central angle corresponding to the auxiliary circular arc, the auxiliary circular arc is obtained by extending the first circular arc, and the opposite ends of the auxiliary circular arc to the two adjacent sides
  • the distance is equal to the second limit value;
  • u is the third limit value.
  • the first limit value, the second limit value, and the third limit value have been described above, and will not be repeated here.
  • the radius r 22 of the second arc and/or the third arc is equal to the length of the line segment T 5 T 7 multiplied by tan ⁇ 2 .
  • the length of the line segment T 5 T 7 is equal to s is the first limit value as described above.
  • the length of the line segment O 1 B 1 is r 1 ⁇ cos(45°- ⁇ /2)-s
  • the length of the line segment O 1 B 2 is r 1 ⁇ cos(45°- ⁇ /2) -su.
  • the length of the line segment T 5 B 1 is The length of the line segment T 6 B 2 is Furthermore, it can be seen that:
  • the central angle of the second arc R2 may be 30°-40°; the central angle of the third arc R3 may also be 30°-40°.
  • the second end of the second arc R2 is indirectly connected to the first end of the first arc R1, and/or the second end of the third arc R3 is indirectly connected to the second end of the first arc R1 Situation:
  • the orthographic projection of the cutting section 121 on the plane where the substrate is located further includes a fourth arc R4 and/or a fifth arc R5.
  • the first end of the fourth arc R4 is connected to the second end of the second arc R2, and the second end of the fourth arc R4 is connected to the first end of the first arc.
  • a smooth transition between the first arc R1 and the second arc R2 can be achieved through the fourth arc R4, so that the cutting section 121 is not prone to sharp corners, which can better meet the use requirements of the substrate.
  • the second end of the fifth arc R5 is connected to the second end of the third arc R3, and the second section of the fifth arc R5 is connected to the second end of the first arc.
  • the orthographic projection of the cutting segment 121 on the plane where the substrate is located further includes a first straight line segment L1 and a fourth arc R4; and/or, it also includes a second straight line segment L2 and a fourth arc R4.
  • the first end of the first straight line segment L1 is connected to the second end of the second arc R2, the second end of the first straight line segment L1 is connected to the first end of the fourth arc R4, the The second end of the fourth arc R4 is connected to the first end of the first arc.
  • This design makes it possible to achieve a smooth transition between the first arc R1 and the second arc R2 through the first straight line segment L1 and the fourth arc R4, so that the cutting section 121 is less prone to sharp corners and can better Meet the needs of the use of substrates.
  • the first end of the second straight line segment L2 is connected to the second end of the third arc R3, the second end of the second straight line segment L2 is connected to the first end of the fifth arc, and the first end of the fifth arc is connected.
  • the second end of the five arc R5 is connected to the second end of the first arc.
  • the first straight line segment L1 is simultaneously tangent to the second circular arc R2 and the fourth circular arc R4, and/or, the second straight line segment L2 is simultaneously It is tangent to the third arc R3 and the fifth arc R5.
  • a smoother transition effect can be achieved between the second arc R2 and the fourth arc R4, and/or the third arc R3 and the fifth arc R5, thereby further enhancing the first arc R1
  • the transition effect between the second arc R2 and/or the first arc R1 and the third arc R3 greatly reduces the probability of sharp corners of the cutting section 121.
  • the position of the offset arc can be determined. That is, the offset arc defines the allowable cutting offset of the product, and the actual cutting position should not exceed the offset arc.
  • a ninth auxiliary line m9 that is at a preset angle ⁇ with the eighth auxiliary line m8 is formed through the eighth position point T 8 , and the ninth auxiliary line m9 intersects the offset arc at the ninth position point T 9 .
  • This embodiment does not limit the value of the preset angle ⁇ , as long as it is ensured that the ninth position point T 9 is closer to the first arc R1 relative to the eighth position point T 8.
  • the preset angle ⁇ may be 30°-60°.
  • the tangent line T 9 T 10 of the offset arc R0 is made through the ninth position point T 9 , and the tangent line T 9 T 10 intersects the circle where the first arc R1 is located at the tenth position point T 10 .
  • the radius of the second arc R2 and/or the radius of the third arc R3 is r 23
  • r 23 satisfies the following formula:
  • the value of k 1 ranges from 1 to 2; n is the formula The minimum value of L in the middle, ⁇ is the central angle corresponding to the auxiliary arc (the auxiliary arc R01 as shown in Figure 7).
  • the auxiliary arc is obtained by extending the first arc R1.
  • the distance from the opposite ends to the two adjacent sides is equal to the second limit value (the vertical distance from one end T 8 of the auxiliary arc R01 to the side 11 in Fig. 7 is equal to the second limit value), r 1 is the radius of the first arc R1, and s is the first limit value; wherein, the first limit value and the second limit value have been described above, and will not be repeated here.
  • the radius of the second arc R2 and/or the radius of the third arc R3 is r 23 , taking the preset angle ⁇ equal to 45° as an example.
  • r 23 is equal to the length of the line segment T 8 T 9 multiplied by tan ⁇ T 8 T 9 O 2 .
  • ⁇ 180°- ⁇ -(45°+ ⁇ /2).
  • the central angle of the second arc R2 or the second arc R3 can also be calculated according to the obtained ⁇ T 8 T 9 O 2, that is, the second arc R2 or the second arc R3
  • the central angle of is equal to 2 ⁇ (90°- ⁇ T 8 T 9 O 2 ).
  • the central angle of the second arc R2 may be 30°-40°; the central angle of the third arc R3 may also be 30°-40°.
  • the central angle of the fourth circular arc R4 may be 8°-12°; the central angle of the fifth circular arc R5 may also be 8°-12°.
  • the radius of the first arc R1 ranges from 7.01 mm to 8.74 mm; the radius of the second arc R2 and/or the radius of the third arc R3 ranges from 0.15 mm ⁇ 0.3mm; the radius of the fourth arc R4 and/or the radius of the fifth arc R5 ranges from 5mm to 6mm; the length of the first straight line segment L1 and/or the second straight line segment L2 The range of the length of is 0.3mm ⁇ 0.52mm.
  • first circular arc R1, the second circular arc R2, the third circular arc R3, the fourth circular arc R4, the fifth circular arc R5, the first straight line segment L1 and the second straight line segment L1 can be in accordance with any one of the following Way to set.
  • the radius of the first arc R1 is about 7.78mm; the radius of the second arc R2 and/or the radius of the third arc R3 is about 0.3mm; the radius of the fourth arc R4 and/ Or the radius of the fifth arc R5 is about 5 mm; the length of the first straight line segment L1 and/or the length of the second straight line segment L2 is about 0.3 mm.
  • “about” means that in actual applications, each size can fluctuate up and down by 10%.
  • the radius of the first arc R1 is approximately 7.93 mm; the radius of the second arc R2 and/or the radius of the third arc R3 is approximately 0.18 mm; the radius of the fourth arc R4 and/ Or the radius of the fifth arc R5 is about 6 mm; the length of the first straight line segment L1 and/or the length of the second straight line segment L2 is about 0.36 mm.
  • “about” means that in actual applications, the corresponding size values can fluctuate by 10%.
  • the radius of the first arc R1 is approximately 8.74 mm; the radius of the second arc R2 and/or the radius of the third arc R3 is approximately 0.24 mm; the radius of the fourth arc R4 and/ Or the radius of the fifth arc R5 is about 6 mm; the length of the first straight line segment L1 and/or the length of the second straight line segment L2 is about 0.44 mm.
  • “about” means that in actual applications, the corresponding dimensions can fluctuate by 10%.
  • the radius of the first arc R1 is approximately 7.41 mm; the radius of the second arc R2 and/or the radius of the third arc R3 is approximately 0.19 mm; the radius of the fourth arc R4 and/ Or the radius of the fifth arc R5 is about 5.5 mm; the length of the first straight line segment L1 and/or the length of the second straight line segment L2 is about 0.52 mm.
  • “about” means that in actual applications, the corresponding dimensions can fluctuate by 10%.
  • the radius of the first arc R1 is about 7.01mm; the radius of the second arc R2 and/or the radius of the third arc R3 is about 0.15mm; the radius of the fourth arc R4 and/ Or the radius of the fifth arc R5 is about 5 mm; the length of the first straight line segment L1 and/or the length of the second straight line segment L2 is about 0.48 mm.
  • “about” means that in actual applications, the corresponding dimensions can fluctuate by 10%.
  • the width of the two ends of the corner of the substrate to be removed (that is, the width of the portion of the corner corresponding to the second arc R2 and the third arc R3) is larger, thereby making the corner
  • the stress distribution of the part is relatively uniform when it is broken, and stress concentration is not easy to appear. Therefore, the corner part can be better broken along the predetermined track, so that the fractured section of the substrate 1 is not prone to more residues, and the fractured section is not prone to burrs.
  • the electronic device 100 includes at least one substrate 1 as described in any of the above-mentioned embodiments.
  • electronic components 201 are provided on the substrate 1.
  • the electronic component 201 can be, for example, a thin film transistor, a capacitor, or other components, or a structure such as an electrode, an electronic circuit, or the like; or the electronic component 201 can be a combination of two or more of various electronic components or structures.
  • the electronic device 200 can be any one of a display panel, a touch panel, a microfluidic chip, or an electronic chip.
  • the embodiments of the present disclosure do not limit this.
  • the display panel may be a liquid crystal display panel, an electroluminescence display panel, or a photoluminescence display panel.
  • FIG. 9 exemplarily shows a case where the display panel is a liquid crystal display panel 01
  • FIG. 10 exemplarily shows a case where the display panel is an electroluminescence display panel 03 or a photoluminescence display panel 03.
  • the main structure of the liquid crystal display panel 01 includes an array substrate 011, an alignment substrate 012, and a liquid crystal disposed between the array substrate 011 and the alignment substrate 012.
  • Layer 013 The array substrate 011 and the counter substrate 012 are joined together by the frame sealant, so that the liquid crystal layer 013 is confined in the area enclosed by the frame sealant.
  • the main structure of the electroluminescence display panel 03 or the photoluminescence display panel 03 includes a display substrate 031 and The encapsulation layer 032 for encapsulating the substrate 031 for display.
  • the packaging layer 032 may be a packaging film or a packaging substrate.
  • some embodiments of the present disclosure provide an electronic device 300.
  • the electronic device 300 includes the electronic device 200 described in any of the foregoing embodiments.
  • the electronic device 300 may be a display device, and the display device may be any product or component with a display function, such as an AR helmet, AR glasses, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc.
  • a display function such as an AR helmet, AR glasses, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc.
  • the display device may be a liquid crystal display device 301 (Liquid Crystal Display, LCD for short); as shown in FIG. 10, the display device may also be an electroluminescence display device 302 or a photoluminescence display device 302.
  • the electroluminescent display device may be an organic light-emitting diode (Organic Light-Emitting Diode, OLED for short) or a quantum dot electroluminescent display device (Quantum Dot Light).
  • OLED Organic Light-Emitting Diode
  • QLED Quantum Dot Light
  • micro LED such as Mini-LED or Micro-LED
  • the photoluminescence display device may be a quantum dot photoluminescence display device.
  • the display device is a liquid crystal display device 301.
  • the display device includes a liquid crystal display panel 01 and a backlight assembly 02.
  • the backlight assembly 02 is used to provide a light source for the liquid crystal display panel 01 so that the liquid crystal display panel 01 can display images normally.
  • the display device is an electroluminescence display device 302 or a photoluminescence display device 302.
  • the display device includes an electroluminescent display panel 03 or a photoluminescent display panel 03, a polarizer 04, a first optical adhesive (Optically Clear Adhesive, OCA) 05 and Cover glass 02.
  • OCA Optically Clear Adhesive
  • the electronic device and electronic device provided by the embodiments of the present disclosure include the substrate 1 in any of the above embodiments. Therefore, the electronic device and electronic device have all the beneficial effects of the above substrate 1 and will not be repeated here.
  • the thickness of the substrate 1 is relatively large due to the structural strength requirements of the device. If laser cutting is used in this case, the laser energy required for cutting is higher and the spot is larger. Therefore, a larger second limit value d needs to be set to prevent the laser from cutting to the edge of the substrate.
  • the edge of the substrate refracts the laser light into the substrate, causing the laser to be reflected back and forth inside the substrate, causing product defects.
  • the value range of the second limit value may be 0.1 mm to 0.3 mm.
  • the size of the second limit value may be set to increase with the area of the display area of the display device.
  • some embodiments of the present disclosure provide a method for cutting a substrate.
  • the cutting method includes steps 101 to 103.
  • Step 101 Cut the substrate mother board 100 along the diameter of the first cutting path S1 into a plurality of substrates 10 whose corners are to be removed.
  • the substrate mother board 100 can be an array substrate mother board and a counter substrate mother board that have been aligned (for example, the liquid crystal display panel 01 shown in FIG. 9); it can also be a separate array substrate mother board or a counter substrate. Of course, it can also be a self-luminous display substrate mother board, or other substrate mother boards provided with electronic components, which is not limited in the present disclosure.
  • a cutter wheel is used to cut the display mother board 100 along the first cutting path S1 to obtain a plurality of substrates 10 whose corners are to be removed.
  • the substrate 10 with a corner to be removed has at least one corner Q on it.
  • the substrate 10 whose corners are to be removed by cutting is rectangular, the substrate 10 whose corners are to be removed may have four corners Q.
  • Step 102 As shown in FIG. 13, a second cutting path S2 is determined on the substrate 10 whose corners are to be removed.
  • the second cutting path S2 corresponds to the cutting section of the substrate 1 described in any of the above embodiments (as shown in Figure 1, Figure 2, Figure 3A, Figure 3B, Figure 4A, Figure 4B, Figure 5, Figure 6 or Figure 7) Out of the cutting section 121).
  • “corresponding” means that the orthographic projection of the first cutting path S2 on the plane of the substrate 1 overlaps with the orthographic projection of the cutting section 121 on the plane of the substrate 1.
  • gaps d are respectively left between the two end points of the second cutting path S2 and the two first edges of the corner Q.
  • Step 103 Cut the substrate 10 with the corner to be removed along the second cutting path S2, and then use physical force to remove the corner Q of the substrate 10 with the corner to be removed to obtain the substrate according to any of the above embodiments 1.
  • a laser can be used to cut the substrate 10 whose corners are to be removed along the second cutting path S2; the physical force can be gravity, or an external object (such as a human hand or a mechanical device). Etc.) The applied force.
  • This design is such that when a laser is used to cut the corner Q of the substrate 10 from which the corner is to be removed along the second cutting path S2, since the two end points of the second cutting path S2 to the two edges of the corner Q There is a gap d between them, and the laser will not hit the edge of the substrate 1, so the laser will not be refracted into the substrate 1 through the edge of the substrate 1, and there will be no laser reflection inside the substrate 1. It can prevent the laser from being reflected to the circuit in the peripheral area of the substrate, thereby helping to prevent the circuit from being burned and reducing the display defects of the product.
  • the cutting section corresponding to the second cutting path S2 is the cutting section shown in FIG. 3A, FIG. 3B, FIG. 4A, FIG. 4B, FIG. 5, FIG. 6 or FIG. 7, the substrate formed by the cutting method In 1, the fracture trajectory of the two fractured sections is closer to the predetermined trajectory, that is, the corners that should be broken are not easily left on the fractured section, and the surface of the fractured section is not prone to burrs, thereby improving the cutting of the substrate Yield.
  • FIG. 14 shows a display panel, and the cutting method of the substrate can be directly applied to the display panel.
  • the display panel is divided into a display area A and a peripheral area S, and FIG. 14 takes the peripheral area S surrounding the display area A as an example for illustration.
  • the display area A is provided with a plurality of sub-pixels P.
  • the peripheral area S is used for wiring, and the gate driving circuit can also be provided in the peripheral area S.
  • the above-mentioned display area A includes a plurality of sub-pixels P.
  • the multiple sub-pixels P are arranged in a matrix as an example.
  • the sub-pixels P arranged in a row along the horizontal direction X are called sub-pixels in the same row
  • the sub-pixels P arranged in a row along the vertical direction Y are called sub-pixels in the same column.
  • the sub-pixels in the same row can be connected to one gate line
  • the sub-pixels in the same column can be connected to one data line.
  • the substrate cutting method described in any of the above embodiments may be used to cut along the second cutting path S2 to remove the corner Q.
  • the laser will not be reflected back and forth inside the display panel, and the laser can be prevented from being reflected to the circuit in the peripheral area of the display panel, which is beneficial to prevent the circuit from being burned and reduce the display defects of the product.
  • the corner Q can be better broken along the predetermined trajectory, that is, the part that should be removed is not easy to remain on the surface formed after the corner Q is removed, and burrs are not prone to appear on the surface, which can further improve The cutting yield of the display panel.
  • the cut display panel further includes at least one metal wire K located in the display panel but at the periphery of the display panel.
  • the metal wire K may be, for example, a ground wire, an electromagnetic shielding wire, a gate wire, and a data wire.
  • the metal wire K is arranged close to the cutting section, and there is no other wire between the metal wire K and the cutting section.
  • the cutting section includes the second arc R2. Any point on the second arc R2 has the shortest distance to the metal wire K. Comparing the shortest distances from each point on the second arc R2 to the metal wire K, you can get the shortest distance D2 between the second arc R2 and the metal wire K. ;
  • the positional relationship between the metal wire and the cutting section is: D1>D2.
  • the cut display panel can obtain a relatively large "safe distance of electronic components" in the area near the center of the end. . That is, in the area close to the center of the end, the distance between the cutting section and the electronic components of the display panel is relatively far, so the impact of the end break or crack on the display function and life of the display panel can be reduced, and the display breadth can be improved. Reliability.
  • the cutting section also includes the first straight section L1
  • the shortest distance between the first straight section L1 and the metal wire K is D3
  • the metal wire K The positional relationship with the cutting section is: D1>D3
  • the cutting segment further includes a fourth arc R4, similar to the definition of the shortest distance between the first arc R1 and the metal wire K, the shortest distance between the fourth arc R4 and the metal wire K is D4, and the metal wire K
  • the cutting segment includes the second arc R2, the first straight line segment L1, and the fourth arc R4, similar to the definition of the shortest distance between the first arc R1 and the metal wire K
  • the first The shortest distances between the second arc R2, the first straight line segment L1, and the fourth arc R4 to the metal wire K are D2, D3, D4, respectively.
  • the positional relationship between the metal wire K and the cutting section is: D1>max(D2,D3, D4), where max(D2, D3, D4) represents the maximum value of D2, D3, and D4.
  • the cutting segment includes a third arc R3, which is similar to the definition of the shortest distance between the first arc R1 and the metal wire K.
  • the shortest distance between the third arc R3 and the metal wire K is D2', and the metal wire K and the cutting
  • the positional relationship of the segments is: D1>D2';
  • the cutting segment further includes the second straight line segment L2, similar to the definition of the shortest distance between the first arc R1 and the metal wire K, the shortest distance from the second straight line segment L2 to the metal wire K is D3', and the metal wire
  • the cutting segment further includes a fifth arc R5, similar to the definition of the shortest distance between the first arc R1 and the metal wire K, the shortest distance from the fifth arc R5 to the metal wire K is D4', and the metal wire
  • the cutting segment includes the third arc R3, the second straight line segment L2, and the fifth arc R5, similar to the definition of the shortest distance between the first arc R1 and the metal wire K
  • the third arc R3, the The shortest distances from the second straight line segment L2 and the fifth arc R5 to the metal wire K are D2', D3', D4' respectively.
  • the positional relationship between the metal wire K and the cutting segment is: D1>max(D2',D3',D4 '), where max(D2', D3', D4') represents the maximum value among D2', D3', and D4'.
  • the panel structure given in the above example enables the cut display panel to obtain a relatively large "electronic component safety distance" in the area close to the center of the end. That is, in the area close to the center of the end, the distance between the cutting section and the electronic components of the display panel is relatively far, so the impact of the end break or crack on the display function and life of the display panel can be reduced, and the display breadth can be improved. Reliability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种基板(1)，包括：至少两个边部(11、13)；和至少一个端部(12)，各端部连接相邻的两个边部。其中，各端部包括切割段(121)和两个断裂段(122)，切割段的一端通过一个断裂段连接相邻的两个边部中的一个边部，切割段的另一端通过另一个断裂段连接相邻的两个边部中的另一个边部。切割段配置为由工具切割形成，断裂段配置为在物理力的作用下形成。该基板有利于防止烧伤元件，减少产品不良现象，提高产品的通用性。还涉及一种电子器件、一种电子设备及一种基板的切割方法。

Description

基板及其切割方法、电子器件及电子设备
本申请要求于2020年05月29日提交的、申请号为202010480020.9的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开实施例涉及一种基板及其切割方法、电子器件及电子设备。
背景技术
在制备基板时，相关技术中先采用刀轮将基板母板切割成多个单独的基板；然后再采用激光通过外切工艺对基板的角部进行切割。其中，外切工艺是指激光直接由基板的一个边部切割至该基板的另一个边部，从而实现将基板的角部切割掉。然而，基板上承载有电子元件，激光切割到该基板的边部时，该基板的边部会将激光折射至基板内部，使得激光在基板的内部来回反射，这时，激光容易被反射至基板的电子元件上，从而容易烧伤电子元件，造成产品不良。
发明内容
一方面，提供一种基板。所述基板包括：至少两个边部；和，至少一个端部，各端部连接相邻的两个边部。其中，各端部包括切割段和两个断裂段，所述切割段的一端通过一个断裂段连接所述相邻的两个边部中的一个边部，所述切割段的另一端通过另一个断裂段连接所述相邻的两个边部中的另一个边部。所述切割段配置为由工具切割形成，所述断裂段配置为在物理力的作用下形成。
在一些实施例中，所述切割段在所述基板所在平面的正投影包括：第一圆弧，所述第一圆弧的弧心位于所述基板的内侧。
在一些实施例中，所述切割段在所述基板所在平面的正投影还包括：第二圆弧，所述第二圆弧的第一端与一个所述断裂段在所述基板所在平面的正投影相连，所述第二圆弧的第二端与所述第一圆弧的第一端直接或间接相连；所述第二圆弧的弧心位于所述基板的外侧；和/或，第三圆弧，所述第三圆弧的第一端与另一个所述断裂段在所述基板所在平面的正投影相连，所述第三圆弧的第二端与所述第一圆弧的第二端直接或间接相连；所述第三圆弧的弧心位于所述基板的外侧。
在一些实施例中，在所述第二圆弧与所述第一圆弧直接相连，和/或，所述第三圆弧与所述第一圆弧直接相连的情况下；所述第二圆弧的半径和/或所述第三圆弧的半径为r 21，r 21满足以下公式：
Figure PCTCN2021086832-appb-000001
其中，k1的取值范围为1～2；r1为第一圆弧的半径；s为第一限定值；α为辅助圆弧对应的圆心角，所述辅助圆弧通过延长所述第一圆弧得到，且所述辅助圆弧的相对两端到相邻的两个所述边部的距离等于第二限定值。
在一些实施例中，在所述第二圆弧与所述第一圆弧间接相连，和/或，所述第三圆弧与所述第一圆弧间接相连的情况下；所述切割段在所述基板所在平面的正投影还包括：第一直线段，所述第一直线段的第一端连接所述第二圆弧的第二端，所述第一直线段的第二端连接所述第一圆弧的第一端；和/或，第二直线段，所述第二直线段的第一端连接所述第三圆弧的第二端，所述第二直线段的第二端连接所述第一圆弧的第二端。
在一些实施例中，所述第一直线段同时与所述第二圆弧和所述第一圆弧相切，和/或，所述第二直线段同时与所述第三圆弧和所述第一圆弧相切。
在一些实施例中，所述第二圆弧的半径和/或所述第三圆弧的半径为r 22，r 22满足以下公式：
Figure PCTCN2021086832-appb-000002
其中，k1的取值范围为1～2；r1为第一圆弧的半径；s为第一限定值；α为辅助圆弧对应的圆心角，所述辅助圆弧通过延长所述第一圆弧得到，且所述辅助圆弧的相对两端到相邻的两个所述边部的距离等于第二限定值；u为第三限定值。
在一些实施例中，所述第三限定值大致等于0.05mm。
在一些实施例中，在所述第二圆弧与所述第一圆弧间接相连，和/或，所述第三圆弧与所述第一圆弧间接相连的情况下；所述切割段在所述基板所在平面的正投影还包括：第四圆弧，所述第四圆弧的第一端连接所述第二圆弧的第二端，所述第四圆弧的第二端连接所述第一圆弧的第一端；和/或，第五圆弧，所述第五圆弧的第一端连接所述第三圆弧的第二端，所述第五圆弧的第二端连接所述第一圆弧的第二端。
在一些实施例中，所述第四圆弧与所述第一圆弧内切，且所述第四圆弧与所述第二圆弧外切；和/或，所述第五圆弧与所述第一圆弧内切，且所述第五圆弧与所述三圆弧外切。
在一些实施例中，在所述第二圆弧与所述第一圆弧间接相连，和/或，所述第三圆弧与所述第一圆弧间接相连的情况下；所述切割段在所述基板所在平面的正投影还包括：第一直线段和第四圆弧，所述第一直线段的第一端连接所述第二圆弧的第二端，所述第一直线段的第二端连接所述第四圆弧的第一端，所述第四圆弧的第二端连接所述第一圆弧的第一端；和/或，第二直线段和第五圆弧，所述第二直线段的第一端连接所述第三圆弧的第二端，所述第二直线段的第二端连接所述第五圆弧的第一端，所述第五圆弧的第二端连接所述第一圆弧的第二端。
在一些实施例中，所述第一直线段同时与所述第二圆弧和所述第四圆弧相切，所述第四圆弧与所述第一圆弧内切；和/或，所述第二直线段同时与所述第三圆弧和所述第五圆弧相切，所述第五圆弧与所述第一圆弧内切。
在一些实施例中，所述第二圆弧的半径和/或所述第三圆弧的半径为r 23，r 23满足以下公式：
Figure PCTCN2021086832-appb-000003
其中，k 1的取值范围为1～2；n为公式
Figure PCTCN2021086832-appb-000004
中L的最小值，α为辅助圆弧对应的圆心角，所述辅助圆弧通过延长所述第一圆弧得到，所述辅助圆弧的相对两端到相邻的两个所述边部的距离等于第二限定值，r 1为第一圆弧的半径，s为第一限定值。
在一些实施例中，所述第四圆弧和/或所述第五圆弧的半径为r 4，r 4＝k 2·r 1；其中，k 2的取值范围为0.5～0.8，r 1为第一圆弧的半径。
在一些实施例中，所述第一圆弧的半径的取值范围为7.01mm～8.74mm；所述第二圆弧的半径和/或所述第三圆弧的半径的取值范围为0.15mm～0.3mm；所述第四圆弧的半径和/或所述第五圆弧的半径的取值范围为5mm～6mm；所述第一直线段的长度和/或所述第二直线段的长度的取值范围为0.3mm～0.52mm。
在一些实施例中，所述切割段在所述基板所在平面的正投影中各个点到所述第一圆弧所在圆的最短距离小于或等于第一限定值。
在一些实施例中，所述第一限定值大致等于0.04mm。
在一些实施例中，各所述断裂段沿第一方向的尺寸为第二限定值；所述 第一方向平行于所述基板所在的平面、且垂直于与该断裂段相连的所述边部。
在一些实施例中，所述第二限定值的取值范围为0.06mm～0.1mm。
在一些实施例中，所述第二限定值的取值范围为0.1mm～0.3mm。
另一方面，提供一种电子器件。所述电子器件包括：至少一个如上述任一项实施例所述的基板。
在一些实施例中，所述电子器件为显示面板、触控面板、微流控芯片或电子芯片中的任一者。
在一些实施例中，所述电子器件为显示面板；所述显示面板还包括：至少一条金属导线，设置于所述显示面板中且位于所述显示面板外围。其中，在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第二圆弧的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第二圆弧与所述金属导线之间的最短距离；和/或，在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第三圆弧的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第三圆弧与所述金属导线之间的最短距离；和/或，在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第一直线段的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第一直线段与所述金属导线之间的最短距离；和/或，在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第二直线段的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第二直线段与所述金属导线之间的最短距离；和/或，在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第四圆弧的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第四圆弧与所述金属导线之间的最短距离；和/或，在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第五圆弧的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第五圆弧与所述金属导线之间的最短距离。
再一方面，提供一种电子设备。所述电子设备包括：如上述任一项实施例所述的电子器件。
又一方面，提供一种基板的切割方法，包括：沿第一切割路径将基板母板切割成多个待去除角部的基板；在待去除角部的基板上确定第二切割路径；所述第二切割路径对应于如上述任一项实施例所述的基板的切割段；沿所述第二切割路径切割所述待去除角部的基板，之后，利用物理力去除所述角部，以形成如上述任一项实施例所述的基板。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据一些实施例的一种基板的结构图；
图2为根据一些实施例的另一种基板的结构图；
图3A和图3B为根据一些实施例的再一种基板的结构图；
图4A和图4B为根据一些实施例的又一种基板的结构图；
图5为根据一些实施例的又一种基板的结构图；
图6为根据一些实施例的又一种基板的结构图；
图7为根据一些实施例的又一种基板的结构图；
图8为根据一些实施例的一种基板的切割方法的流程图；
图9为根据一些实施例的一种基板母板的结构图；
图10为根据一些实施例的一种待去除角部的基板的结构图；
图11为根据一些实施例的一种电子器件的结构图；
图12为根据一些实施例的一种电子设备的结构图；
图13为根据一些实施例的另一种电子设备的结构图；
图14为根据一些实施例的一种显示面板的结构图；
图15为根据一些实施例的另一种显示面板的结构图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)” 或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
本公开一些实施例提供了一种基板1。如图1所示，该基板1包括至少两个边部11和至少一个端部12，各端部12连接相邻的两个边部11。需要说明的是，图1仅示意性的示出了基板1的一个端部12，并未对基板1上端部12的数量进行限定，即，在实际应用中，基板1上可以仅设置一个端部12，也可以设置两个或两个以上的端部12。而且在基板1上设置有两个或两个以上的端部12的情况下，各端部12连接与其相邻的两个边部11。例如在基板1包括四个边部的情况下，若任意两个相邻的边部之间都设置有端部，则该基板所包括的端部的数量应该是四个。
如图1所示，各端部12包括切割段121和两个断裂段122，该切割段121的一端通过一个断裂段122连接该相邻的两个边部11中的一个边部11，该切割段121的另一端通过另一个断裂段122连接该相邻的两个边部11中的另一个边部11。
该切割段121配置为由工具切割形成，例如，该工具可以为激光切割机等具有切割功能的工具，该激光切割机可以利用激光切割出该基板1的切割段121。该断裂段122配置为在物理力的作用下形成，例如，物理力可以为重力、外部物体施加的压力等。在物理力为重力的情况下，利用工具切割形成切割段121后，待去除角部的基板的角部将会在重力的作用下自然断裂，从而形成该基板1；在物理力为外部物体施加的压力的情况下，利用工具切割形成切割段121后，待去除角部的基板的角部将会在该外部物体(例如人的手或机械设备等)施加的压力的作用下自然断裂，从而形成该基板1。
本实施例中，由于基板1的端部12既包括切割段121，又包括位于该切割段121两端的两个断裂段122，使得在去除待去除角部的基板的角部时，激光不会射向该基板1的边部11，因此激光不会经该基板1的边部11折射至基板1内部，进而不会出现激光在基板1的内部来回反射的情况，可以避免激光被反射至基板1上的电子元件，从而有利于防止烧伤电子元件，减少产品不良现象。
在一些实施例中，如图2所示，该切割段121在基板1所在平面的正投影包括第一圆弧R1，该第一圆弧R1的弧心O 1位于该基板1的内侧，这样 使得待去除角部的基板在切割、断裂角部后可以形成比较规整的圆角，提高了该基板1的通用性。
需要说明的是，该切割段121在基板1所在平面的正投影可以仅包括第一圆弧R1；也可以在除包括该第一圆弧R1以外，还包括其它部分(例如图3A、图3B、图4A、图4B、以及图5～图7示出的第二圆弧R2、第三圆弧R3、第四圆弧R4、第五圆弧R5、第一直线段L1和第二直线段L2中的至少一者)。
在该切割段121在基板1所在平面的正投影还包括其它部分的情况下，该切割段121在该基板1所在平面的正投影中各个点到该第一圆弧R1所在圆的最短距离小于或等于第一限定值。该第一限定值可以与产品要求达到的基板的切割精度相关。例如，当产品要求达到的切割精度不超过h(也即切割段121的切割偏移量不超过h)时，该第一限定值可以设置为小于或等于h。同时，考虑切割工具的定位误差，该第一限定值可以设置为大致等于0.8h，例如，在h＝0.05mm时，该第一限定值大致等于0.04mm。此处，“大致等于”是指可以上下浮动百分之十，也即，在h＝0.05mm时，该第一限定值的取值范围可以在0.036mm～0.044mm之间。此时，更容易获得满足切割精度的切割段121，有利于改善切割段121过切或少切的问题。
在一些实施例中，如图1所示，各断裂段122沿第一方向的尺寸为第二限定值d；该第一方向为平行于该基板1所在的平面、且垂直于与该断裂段122相连的边部11的方向E，或者，该第一方向为平行于该基板1所在的平面、且垂直于与该断裂段122相连的边部13的方向F。其中，关于该第二限定值d的大小，只能能够满足在切割形成切割段121之后，可以在物理力的作用下形成断裂段122即可。
示例性的，该第二限定值d的取值范围为0.06mm～0.1mm。例如，该第二限定值d的取值范围可以为0.06mm～0.08mm。换句话说，各断裂段122沿第一方向E的宽度可以为0.06mm、0.07mm或0.1mm等，这样设计，使得在待去除角部的基板上切割形成切割段121后，该待去除角部的基板的角部比较容易断裂，且角部断裂后的基板1上不易出现不希望残留的物质。
在此基础上，为了使断裂段122沿预定轨迹断裂，减少断裂段122上产生的不希望残留的物质，以及减少断裂段122的表面上出现的毛刺，本公开的一些实施例还对基板1的切割段121做了改进。例如包括但不限于以下一些实施例所描述的切割段121。
在一些实施例中，如图3A、图4A、图5和图6所示，该切割段121在 基板1所在平面的正投影除包括该第一圆弧R1以外，还包括第二圆弧R2和/或第三圆弧R3。
其中，该第二圆弧R2的第一端与一个断裂段122(即该第二圆弧R2对应的端部12所包括的两个断裂段122中的一者)在基板1所在平面的正投影相连，该第二圆弧R2的第二端与第一圆弧R1的第一端直接或间接相连(例如图3A中示出了该第二圆弧R2的第二端与第一圆弧R1的第一端直接相连，图4A、图5和图6示出了该第二圆弧R2的第二端与第一圆弧R1的第一端间接相连)；该第二圆弧R2的弧心位于基板的外侧。这样设计，使得待去除角部的基板的角部在断裂时应力分布比较均匀，不易出现应力集中现象，因此该角部能够更好沿预定轨迹断裂，使得该基板1的断裂段122不易出现较多的残留，而且该断裂段122不容易出现毛刺。
该第三圆弧R3的第一端与另一个断裂段122(即该第三圆弧R3对应的端部12所包括的两个断裂段122中的另一者)在基板1所在平面的正投影相连，该第三圆弧R3的第二端与第一圆弧R1的第二端直接或间接相连(例如图3A中示出了该第三圆弧R3的第二端与第一圆弧R1的第一端直接相连，图4A、图5和图6示出了该第三圆弧R3的第二端与第一圆弧R1的第一端间接相连)；该第三圆弧R3的弧心位于基板的外侧。这样设计，使得待去除角部的基板的角部在断裂时应力分布比较均匀，不易出现应力集中现象，因此该角部能够更好沿预定轨迹断裂，使得该基板1的断裂段不易出现较多的残留，而且该断裂段不容易出现毛刺。
在该第二圆弧R2的第二端与第一圆弧R1的第一端直接相连，和/或该第三圆弧R3的第二端与第一圆弧R1的第二端直接相连的情况下：
对于第二圆弧R2和第三圆弧R3中的任一者，在设计时，已知第一圆弧R1的弧心O 1的位置以及该第一圆弧R1的半径r 1。参见图3B，首先在任意一个边部11的靠近第一圆弧R1一侧做第一辅助线m1和第二辅助线m2。该第一辅助线m1平行于该边部11在基板1所在平面的正投影，且该第一辅助线m1到该边部11在基板1所在平面的正投影的距离为如上所述的第二限定值(例如该第二限定值的取值范围可以为0.06mm～0.1mm)；该第二辅助线m2平行于该边部11在基板1所在平面的正投影，且该第二辅助线m2到该边部11在基板1所在平面的正投影的距离为第二限定值与上述第一限定值(例如该第一限定值的取值范围可以为0.036mm～0.044mm)之和。
然后，确定第一圆弧R1所在的圆与该第二辅助线m2相交的交点中，距 离该第一圆弧R1最近的交点为第一位置点T 1；并确定第一圆弧R1所在的圆与该第一辅助线m1相交的交点中，距离该第一圆弧R1最近的交点为第二位置点T 2。
接着，过该第一位置点T 1做与第一辅助线m1呈预设角度λ的第三辅助线m3，第三辅助线m3与第一辅助线m1相交于第三位置点T 3。本实施例对预设角度λ的值不做限定，只要保证第三位置点T 3在沿平行于第一辅助线m1的方向上位于第一位置点T 1和第二位置点T 2之间即可。例如该预设角度λ可以为30°～60°。
最后，过第三位置点T 3做同时与第三辅助线m3和第一圆弧R1相切的圆弧，该圆弧即为第二圆弧R2或者第三圆弧R3。
在此基础上，示例性的，所述第二圆弧的半径和/或所述第三圆弧的半径为r 21，r 21满足以下公式：
Figure PCTCN2021086832-appb-000005
其中，k 1的取值范围为1～2；r 1为第一圆弧的半径；s为第一限定值；α为辅助圆弧对应的圆心角，所述辅助圆弧通过延长所述第一圆弧得到，且所述辅助圆弧的相对两端到相邻的两个所述边部的距离分别等于第二限定值。其中，第一限定值和第二限定值已在前面说明，此处不再赘述。
参见图3B，以预设角度λ等于45°为例。根据几何关系可知，第二圆弧R2或者第三圆弧R3的半径r 21等于线段T 1T 3的长度乘以tanε 1。其中，线段T 1T 3的长度等于
Figure PCTCN2021086832-appb-000006
s为上述第一限定值。
同时，根据几何关系可知：线段O 1N的长度为r 1·cos(45°-α/2)-s；
Figure PCTCN2021086832-appb-000007
此外，基于图3B可知，过第一位置点T 1且与所求的圆弧(即第二圆弧R2或第三圆弧R3)相切的切线，与过第一位置点T 1且与第一圆弧R1相切的切线几乎重合，因此
Figure PCTCN2021086832-appb-000008
由此可得：
Figure PCTCN2021086832-appb-000009
需要说明的是，上述推导过程是以预设角度λ等于45°为例进行说明的，而本实施例中，设计
Figure PCTCN2021086832-appb-000010
并设计k 1的取值范围为1～2，这样，可以得到多种满足要求的第二圆弧R2或第三圆弧R3。
在此基础上，根据所求出的ε 1还可以计算出该第二圆弧R2或第二圆弧R3的圆心角，即该第二圆弧R2或第二圆弧R3的圆心角等于2×(90°-ε 1)。
本实施例中，该第二圆弧R2的圆心角可以为25°～40°；该第三圆弧R3的圆心角也可以为25°～40°。
在该第二圆弧R2的第二端与第一圆弧R1的第一端间接相连，和/或该第三圆弧R3的第二端与第一圆弧R1的第二端间接相连的情况下：
示例性的，如图4B所示，该切割段121在基板所在平面的正投影还包括第一直线段L1和/或第二直线段L2。
该第一直线段L1的第一端连接第二圆弧R2的第二端，该第一直线段L1的第二端连接第一圆弧R1的第一端。这样设计，使得第一圆弧R1与第二圆弧R2之间可以通过第一直线段L1实现平滑过渡，从而使得切割段121不易出现尖角，能够更好的满足基板的使用需求。
该第二直线段L2的第二端连接第三圆弧R3的第二端，该第二直线段L2的第二段连接第一圆弧R1的第二端。这样设计，使得第一圆弧R1与第三圆弧R3之间可以通过第二直线段L2实现平滑过渡，从而使得切割段121不易出现尖角，能够更好的满足基板的使用需求。
在此基础上，如图4B所示，一些示例中，该第一直线段L1同时与第二圆弧R2和第一圆弧R1相切，和/或，该第二直线段L2同时与第三圆弧R3和第一圆弧R1相切。这样能够使第一圆弧R1与第二圆弧R2之间，和/或使第一圆弧R1与第三圆弧R3之间达到更平滑的过渡效果。
在设计时，参见图4B，已知第一圆弧R1的弧心O 1的位置以及该第一圆弧R1的半径r 1。参见图4B，首先在任意一个边部11的靠近切割段121一侧做第四辅助线m4、第五辅助线m5和第六辅助线m6。该第四辅助线m4平行于该边部11在基板1所在平面的正投影，且该第四辅助线m4到该边部11在 基板1所在平面的正投影的距离为如上所述的第二限定值(例如该第二限定值的取值范围可以为0.06mm～0.1mm)；该第五辅助线m5平行于该边部11在基板1所在平面的正投影，且该第五辅助线m5到该边部11在基板1所在平面的正投影的距离为第二限定值和第一限定值(例如该第一限定值的取值范围可以为0.036mm～0.044mm)的和值。该第六辅助线m6平行于该边部11在基板1所在平面的正投影，且该第六辅助线m6到该边部11在基板1所在平面的正投影的距离为第二限定值、第一限定值及第三限定值三者之和。示例性的，该第三限定值大致等于0.05mm，此处大致是指第三限定值可以在0.05mm的基础上上下浮动百分之十。这样设置第三限定值有利于使后续形成的第一直线段L1(或第二直线段L1)和与其相邻的圆弧之间实现平滑过渡。
然后，确定第一圆弧R1所在的圆与该第四辅助线m4相交的交点中，距离该第一圆弧R1最近的交点为第四位置点T 4；确定第一圆弧R1所在的圆与该第五辅助线m5相交的交点中，距离该第一圆弧R1最近的交点为第五位置点T 5；并确定第一圆弧R1所在的圆与该第六辅助线m6相交的交点中，距离该第一圆弧R1最近的交点为第六位置点T 6。
接着，过该第五位置点T 5做与第四辅助线m4呈预设角度λ的第七辅助线m7，第七辅助线m7与第四辅助线m4相交于第七位置点T 7。本实施例对预设角度λ的值不做限定，只要保证第七位置点T 7在沿平行于第四辅助线m4的方向上位于第四位置点T 4和第五位置点T 5之间即可。例如该预设角度λ可以为30°～60°。
最后，过第七位置点T 7做同时与第七辅助线m7和线段T 5T 6相切的圆弧(即第二圆弧R2或第三圆弧R3)。同时，线段T 5T 6位于所做的圆弧(即第二圆弧R2或第三圆弧R3)与第一圆弧R1之间的部分即为第一直线段L1或第二直线段L2。
在此基础上，示例性的，所述第二圆弧R2的半径和/或所述第三圆弧R3的半径为r 22，r 22满足以下公式：
Figure PCTCN2021086832-appb-000011
其中，k 1的取值范围为1～2；α为辅助圆弧对应的圆心角，所述辅助圆弧通过延长所述第一圆弧得到，r1为第一圆弧的半径；s为第一限定值；α为辅助圆弧对应的圆心角，所述辅助圆弧通过延长所述第一圆弧得到，且所述辅助圆弧的相对两端到相邻的两个所述边部的距离等于第二限定值；u为第三限 定值。其中，第一限定值、第二限定值和第三限定值已在前面说明，此处不再赘述。
参见图4B，以预设角度λ等于45°为例。根据几何关系可知，第二圆弧和/或第三圆弧的半径r 22等于线段T 5T 7的长度乘以tanε 2。其中，线段T 5T 7的长度等于
Figure PCTCN2021086832-appb-000012
s为如上所述的第一限定值。
同时，根据几何关系可知：线段O 1B 1的长度为r 1·cos(45°-α/2)-s，线段O 1B 2的长度为r 1·cos(45°-α/2)-s-u。
在此基础上，根据勾股定理可知：
线段T 5B 1的长度为
Figure PCTCN2021086832-appb-000013
线段T 6B 2的长度为
Figure PCTCN2021086832-appb-000014
进一步地，可知：
Figure PCTCN2021086832-appb-000015
而
Figure PCTCN2021086832-appb-000016
由此可得：
Figure PCTCN2021086832-appb-000017
需要说明的是，上述推导过程是以预设角度λ等于45°为例进行说明的，而本实施例中设计为：
Figure PCTCN2021086832-appb-000018
并设计k 1的取值范围为1～2，这样，可以得到多种满足要求的第二圆弧R2或第三圆弧R3。
在此基础上，根据所求出的ε 2还可以计算出该第二圆弧R2或第二圆弧R3的圆心角，即该第二圆弧R2或第二圆弧R3的圆心角等于2×(90°-ε 2)。
本实施例中，该第二圆弧R2的圆心角可以为30°～40°；该第三圆弧R3的圆心角也可以为30°～40°。
在该第二圆弧R2的第二端与第一圆弧R1的第一端间接相连，和/或该第三圆弧R3的第二端与第一圆弧R1的第二端间接相连的情况下：
又示例性的，如图5所示，该切割段121在基板所在平面的正投影还包 括第四圆弧R4和/或第五圆弧R5。
该第四圆弧R4的第一端连接第二圆弧R2的第二端，该第四圆弧R4的第二端连接第一圆弧的第一端。这样设计，使得第一圆弧R1与第二圆弧R2之间可以通过第四圆弧R4实现平滑过渡，从而使得切割段121不易出现尖角，能够更好的满足基板的使用需求。
该第五圆弧R5的第二端连接第三圆弧R3的第二端，该第五圆弧R5的第二段连接第一圆弧的第二端。这样设计，使得第一圆弧R1与第二圆弧R2之间可以通过第五圆弧R5实现平滑过渡，从而使得切割段121不易出现尖角，能够更好的满足基板的使用需求。
又示例性的，如图6所示，该切割段121在基板所在平面的正投影，还包括第一直线段L1和第四圆弧R4；和/或，还包括第二直线段L2和第五圆弧R5。
如图6所示，该第一直线段L1的第一端连接第二圆弧R2的第二端，该第一直线段L1的第二端连接该第四圆弧R4的第一端，该第四圆弧R4的第二端连接第一圆弧的第一端。这样设计，使得第一圆弧R1与第二圆弧R2之间可以通过第一直线段L1和第四圆弧R4实现平滑过渡，从而使得切割段121更加不容易出现尖角，能够更好的满足基板的使用需求。
如图6所示，该第二直线段L2的第一端连接第三圆弧R3的第二端，该第二直线段L2的第二端连接该第五圆弧的第一端，该第五圆弧R5的第二端连接所述第一圆弧的第二端。这样设计，使得第一圆弧R1与第二圆弧R2之间可以通过第二直线段L2和第五圆弧R5实现平滑过渡，从而使得切割段121更加不容易出现尖角，能够更好的满足基板的使用需求。
在此基础上，一些示例中，如图6所示，该第一直线段L1同时与该第二圆弧R2和该第四圆弧R4相切，和/或，该第二直线段L2同时与该第三圆弧R3和该第五圆弧R5相切。这样能够使第二圆弧R2和该第四圆弧R4之间，和/或，第三圆弧R3和该第五圆弧R5达到更平滑的过渡效果，进而可以进一步增强第一圆弧R1与第二圆弧R2之间，和/或，第一圆弧R1与第三圆弧R3之间的过渡效果，大幅降低该切割段121出现尖角的机率。
对于图5和图6示出的方案，在设计时，参见图7，首先在任意一个边部11的靠近切割段121一侧做第八辅助线m8，该第八辅助线m8平行于该边部11在基板1所在平面的正投影，且该第八辅助线m8到该边部11在基板1所在平面的正投影的距离为如上所述的第二限定值(例如该第二限定值的取值范围可以为0.06mm～0.1mm)。
然后，确定第一圆弧R1所在的圆与该第八辅助线m8相交的交点中，距离该第一圆弧R1最近的交点为第八位置点T 8；
接着，根据第一圆弧R1的半径r 1和第一限定值s，确定偏移圆弧的半径r 2，即r 2＝r 1-s。从而可以确定偏移圆弧的位置。也即，该偏移圆弧限定了产品所允许的切割偏移量，实际切割时的切割位置不应当超出该偏移圆弧。
过该第八位置点T 8做与第八辅助线m8呈预设角度λ的第九辅助线m9，第九辅助线m9与偏移圆弧相交于第九位置点T 9。本实施例对预设角度λ的值不做限定，只要保证第九位置点T 9相对于第八位置点T 8更靠近第一圆弧R1即可。例如该预设角度λ可以为30°～60°。
过第九位置点T 9做偏移圆弧R0的切线T 9T 10，该切线T 9T 10与第一圆弧R1所在的圆相交于第十位置点T 10。
最后，过第八位置点T 8做同时与第九辅助线m9和线段T 9T 10相切的圆弧(即第二圆弧R2或第三圆弧R3)，该圆弧的与第八位置点T 8相对的一端位于线段T 9T 10上。
在此基础上，对于图5示出的方案，在第二圆弧R2与第一圆弧R1之间做与第一圆弧R1内切、且与第二圆弧R2外切的圆弧(即为图5示例中的第四圆弧R4)；在第三圆弧R3与第一圆弧R1之间做与第一圆弧R1内切、且与第三圆弧R3外切的圆弧(即为图5示例中的第五圆弧R5)。
而对于图6示出的方案，如图7所示，在第十位置点T 10处做倒圆，可得到与线段T 9T 10相切，且与第一圆弧R1内切的圆弧(即第四圆弧R4或者第五圆弧R5)。此时，线段T 9T 10位于第二圆弧R2和第四圆弧R4之间的部分为第一直线段L1，线段T 9T 10位于第三圆弧R3和第五圆弧R5之间的部分为第二直线段L2。
对于图5和图6示出的方案，示例性的，该第二圆弧R2的半径和/或该第三圆弧R3的半径为r 23，r 23满足以下公式：
Figure PCTCN2021086832-appb-000019
其中，k 1的取值范围为1～2；n为公式
Figure PCTCN2021086832-appb-000020
中L的最小值，α为辅助圆弧(如图7示出的辅助圆弧R01)对应的圆心角，所述辅助圆 弧通过延长所述第一圆弧R1得到，所述辅助圆弧的相对两端到相邻的两个所述边部的距离等于第二限定值(如图7中辅助圆弧R01的一个端点T 8到边部11的垂直距离等于该第二限定值)，r 1为第一圆弧R1的半径，s为第一限定值；其中，第一限定值和第二限定值已在前面说明，此处不再赘述。
在设计时，参见图7，该第二圆弧R2的半径和/或该第三圆弧R3的半径为r 23，以预设角度λ等于45°为例。根据几何关系可知，r 23等于线段T 8T 9的长度乘以tan∠T 8T 9O 2。
如图7所示，β＝180°-λ-(45°+α/2)。其中，α和λ为已知量。因此，β＝90°-α/2，也即β也为已知量。
设定线段T 8T 9的长度为L，根据余弦定理可知，
Figure PCTCN2021086832-appb-000021
也即
Figure PCTCN2021086832-appb-000022
此处，参见图7，需要说明的是，过第九辅助线m9与偏移圆弧所在的圆存在两个交点，因此根据上述公式可以计算出两个L值，而线段T 8T 9的长度为两个L值中的最小值n。
在此基础上，参见图7，根据余弦定理可知，
Figure PCTCN2021086832-appb-000023
而线段T 9T 10为偏移圆弧的切线，因此线段T 9T 10与线段T 9O 1(即偏移圆弧的半径)互相垂直。因此，∠T 8T 9T 10＝360°-90°-ε。进而得到∠T 8T 9T 10的值为
Figure PCTCN2021086832-appb-000024
然后根据三角函数可得
Figure PCTCN2021086832-appb-000025
同时，由于偏移圆弧的半径r 3＝r 1-s，所以
Figure PCTCN2021086832-appb-000026
需要说明的是，上述推导过程是以预设角度λ等于45°为例进行说明的， 而本实施例中，设计
Figure PCTCN2021086832-appb-000027
且k 1的取值范围为1～2，这样，可以对应多种满足要求的第二圆弧R2或第三圆弧R3。
在此基础上，根据所求出的∠T 8T 9O 2还可以计算出该第二圆弧R2或第二圆弧R3的圆心角，即该第二圆弧R2或第二圆弧R3的圆心角等于2×(90°－∠T 8T 9O 2)。
本实施例中，该第二圆弧R2的圆心角可以为30°～40°；该第三圆弧R3的圆心角也可以为30°～40°。
在图5和图6示出的方案的基础上，示例性的，参见图7，该第四圆弧R4和/或该第五圆弧R5的半径为r 4，r 4＝k 2·r 1；其中，k 2的取值范围为0.5～0.8，r 1为第一圆弧R1的半径。这样设计，使得第一直线段L1与第一圆弧R1之间，和/或，第二直线段L2与第一圆弧R1之间可以实现平滑过渡，进而使得切割段121上不易尖角。
其中，该第四圆弧R4的圆心角可以为8°～12°；该第五圆弧R5的圆心角也可以为8°～12°。
在一些实施例中，该第一圆弧R1的半径的取值范围为7.01mm～8.74mm；该第二圆弧R2的半径和/或该第三圆弧R3的半径的取值范围为0.15mm～0.3mm；该第四圆弧R4的半径和/或该第五圆弧R5的半径的取值范围为5mm～6mm；该第一直线段L1的长度和/或该第二直线段L2的长度的取值范围为0.3mm～0.52mm。这样设计，使得切割形成的基板的切割段不易出现尖角，提高了基板的切割段的平滑度。
其中，该第一圆弧R1、第二圆弧R2、第三圆弧R3、第四圆弧R4、第五圆弧R5、第一直线段L1和第二直线段L1可以按照以下任意一种方式进行设置。
方式一：该第一圆弧R1的半径约为7.78mm；该第二圆弧R2的半径和/或该第三圆弧R3的半径约为0.3mm；该第四圆弧R4的半径和/或该第五圆弧R5的半径约为5mm；该第一直线段L1的长度和/或该第二直线段L2的长度约为0.3mm。此处，“约”是指实际应用中，各尺寸可以上下浮动百分之十。
方式二：该第一圆弧R1的半径约为7.93mm；该第二圆弧R2的半径和/ 或该第三圆弧R3的半径约为0.18mm；该第四圆弧R4的半径和/或该第五圆弧R5的半径约为6mm；该第一直线段L1的长度和/或该第二直线段L2的长度约为0.36mm。此处，“约”是指实际应用中，对应的各尺寸值可以上下浮动百分之十。
方式三：该第一圆弧R1的半径约为8.74mm；该第二圆弧R2的半径和/或该第三圆弧R3的半径约为0.24mm；该第四圆弧R4的半径和/或该第五圆弧R5的半径约为6mm；该第一直线段L1的长度和/或该第二直线段L2的长度约为0.44mm。此处，“约”是指实际应用中，对应的各尺寸可以上下浮动百分之十。
方式四：该第一圆弧R1的半径约为7.41mm；该第二圆弧R2的半径和/或该第三圆弧R3的半径约为0.19mm；该第四圆弧R4的半径和/或该第五圆弧R5的半径约为5.5mm；该第一直线段L1的长度和/或该第二直线段L2的长度约为0.52mm。此处，“约”是指实际应用中，对应的各尺寸可以上下浮动百分之十。
方式五：该第一圆弧R1的半径约为7.01mm；该第二圆弧R2的半径和/或该第三圆弧R3的半径约为0.15mm；该第四圆弧R4的半径和/或该第五圆弧R5的半径约为5mm；该第一直线段L1的长度和/或该第二直线段L2的长度约为0.48mm。此处，“约”是指实际应用中，对应的各尺寸可以上下浮动百分之十。
通过以上方式一～方式五，使得待去除角部的基板的角部两端的宽度(即该角部对应第二圆弧R2和第三圆弧R3的部分的宽度)较大，进而使得该角部在断裂时应力分布比较均匀，不易出现应力集中现象，因此该角部能够更好沿预定轨迹断裂，使得该基板1的断裂段不易出现较多的残留，而且该断裂段不容易出现毛刺。
另一方面，本公开一些实施例提供一种电子器件200，如图8所示，该电子器件100包括至少一个如上述任一实施例所述的基板1。其中，该基板1上设置有电子元件201。该电子元件201例如可以为薄膜晶体管、电容等元件，或者电极、电子线路等结构；或者该电子元件201可以为各种电子元件或结构中两种或多种的组合。
其中，该电子器件200可以为显示面板、触控面板、微流控芯片或电子芯片中的任一者。本公开实施例对此不做限制。
在该电子器件200为显示面板的情况下，该显示面板可以为液晶显示面 板、电致发光显示面板或光致发光显示面板。例如，图9示例性的示出了显示面板为液晶显示面板01的情况；图10示例性的示出了显示面板为电致发光显示面板03或光致发光显示面板03的情况。
如图9所示，在显示面板为液晶显示面板01的情况下，该液晶显示面板01的主要结构包括阵列基板011、对盒基板012以及设置在阵列基板011和对盒基板012之间的液晶层013。阵列基板011和对置基板012通过封框胶对合在一起，从而将液晶层013限定在封框胶围成的区域内。
如图10所示，在显示面板为电致发光显示面板02或光致发光显示面板02的情况下，该电致发光显示面板03或光致发光显示面板03的主要结构包括显示用基板031和用于封装显示用基板031的封装层032。此处，封装层032可以为封装薄膜，也可以为封装基板。
再一方面，本公开一些实施例提供一种电子设备300，参见图9和图10，该电子设备300包括上述任一实施例所述的电子器件200。
该电子设备300可以为显示装置，该显示装置可以为AR头盔、AR眼镜、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
如图9所示，该显示装置可以为液晶显示装置301(Liquid Crystal Display，简称LCD)；如图10所示，该显示装置也可以为电致发光显示装置302或光致发光显示装置302。而且在该显示装置为电致发光显示装置的情况下，电致发光显示装置可以为有机电致发光显示装置(Organic Light-Emitting Diode，简称OLED)或量子点电致发光显示装置(Quantum Dot Light Emitting Diodes，简称QLED)或微LED(如Mini-LED或Micro-LED)显示装置。在该显示装置为光致发光显示装置的情况下，光致发光显示装置可以为量子点光致发光显示装置。
在显示装置为液晶显示装置301的情况下。在一些示例中，如图9所示，该显示装置包括液晶显示面板01以及背光组件02。背光组件02用于为液晶显示面板01提供光源，以使液晶显示面板01可以正常显示图像。
在显示装置为电致发光显示装置302或光致发光显示装置302的情况下。在一些示例中，如图10所示，该显示装置包括依次设置的电致发光显示面板03或光致发光显示面板03、偏光片04、第一光学胶(Optically Clear Adhesive，简称OCA)05和盖板玻璃02。
本公开实施例提供的电子器件及电子设备包括上述任一实施例中的基板 1，因此，该电子器件及电子设备具有以上基板1的全部有益效果，在此不再赘述。
特别的，当显示装置为电视机或其他显示区域较大(如大于等于10寸)的显示装置时，由于装置的结构强度需求，基板1的厚度较大。如果在在这种情况下使用激光切割，切割所需的激光能量较高，光斑较大，因此需要设定较大的第二限定值d，以防止激光切割到该基板的边部时，该基板的边部会将激光折射至基板内部，使得激光在基板的内部来回反射，造成产品不良。示例性的，当显示装置为电视机或其他显示区域较大(如大于等于10寸)的显示装置时，所述第二限定值的取值范围可以为0.1mm～0.3mm。示例性的，可以设定所述第二限定值的大小随着显示装置显示区域的面积而增大。
另一方面，本公开一些实施例提供了一种基板的切割方法。
参加图11，该切割方法包括步骤101～步骤103。
步骤101、沿第一切割路S1径将基板母板100切割成多个待去除角部的基板10。
需要说明的是，该基板母板100可以是已对合的阵列基板母板和对置基板母板(例如图9示出的液晶显示面板01)；也可以是单独的阵列基板母板或者对置基板母板；当然还可以是自发光的显示基板母板，或者其它具有设置有电子元件的基板母板，本公开对此不做限制。在一些示例中，参见图12，采用刀轮沿第一切割路径S1对显示母板100进行切割以得到多个待去除角部的基板10。
参见图13，对于每个待去除角部的基板10，该待去除角部的基板10上具有至少一个角部Q。例如，如图13所示，在切割而成的待去除角部的基板10呈矩形的情况下，该待去除角部的基板10可以具有四个角部Q。
步骤102、如图13所示，在该待去除角部的基板10上确定第二切割路径S2。该第二切割路径S2对应于上述任一实施例所述的基板1的切割段(如图1、图2、图3A、图3B、图4A、图4B、图5、图6或图7示出的切割段121)。此处，“对应”是指，该第一切割路径S2在基板1所在平面的正投影与上述切割段121在基板1所在平面的正投影重叠。
其中，如图13所示，该第二切割路径S2的两个端点到该角部Q的两个第一边缘之间分别留有间隙d。
步骤103、沿第二切割路径S2切割该待去除角部的基板10，之后，利用物理力，去除该待去除角部的基板10的角部Q，以得到上述任一实施例所述 的基板1。其中，需要说明的是，在一些示例中，可以采用激光沿该第二切割路径S2切割该待去除角部的基板10；该物理力可以是重力、或者外部物体(例如人的手或机械设备等)所施加的作用力。
这样设计，使得在采用激光沿第二切割路径S2对该待去除角部的基板10的角部Q进行切割时，由于该第二切割路径S2的两个端点到该角部Q的两个边缘之间分别留有间隙d，激光不会射向基板1的边部，因此激光不会经该基板1的边缘折射至基板1内部，进而不会出现激光在基板1的内部来回反射的情况，可以避免激光被反射至基板周边区的电路上，从而有利于防止烧伤电路，减少产品显示不良现象。
而且，在第二切割路径S2对应的切割段为上述图3A、图3B、图4A、图4B、图5、图6或图7示出的切割段的情况下，由该切割方法形成的基板1中，两个断裂段的断裂轨迹更接近预定轨迹，也即，该断裂段上不易残留原本应该断裂掉的角部部分，且该断裂段的表面不容易出现毛刺，进而提高了基板的切割良率。
图14示出了一种显示面板，该基板的切割方法可以直接应用于该显示面板。如图14所示，该显示面板上划分出显示区A和周边区S，图14以周边区S环绕显示区A为例进行示意。显示区A设置有多个亚像素P。周边区S用于布线，也可将栅极驱动电路设置于周边区S。
上述显示区A中包括多个亚像素P。为了方便说明，本实施例中上述多个亚像素P是以矩阵形式排列为例进行的说明。在此情况下，沿水平方向X排列成一排的亚像素P称为同一行亚像素，沿竖直方向Y排列成一排的亚像素P称为同一列亚像素。同一行亚像素可以与一根栅线连接，同一列亚像素可以与一根数据线连接。
在对该显示面板进行切割时，可以按照以上任一实施例所述的基板的切割方法，沿第二切割路径S2进行切割以去除角部Q。这样不会出现激光在显示面板的内部来回反射的情况，可以避免激光被反射至显示面板周边区的电路上，从而有利于防止烧伤电路，减少产品显示不良现象。同时，使得角部Q可以更好的沿预定轨迹断裂，也即，去除该角部Q后所形成的表面上不易残留原本应该去除的部分，且该表面上不容易出现毛刺，进而还可以提高显示面板的切割良率。
如图15所示，切割后的显示面板还包括至少一条位于显示面板中但位于显示面板外围的金属导线K，所述金属导线K例如可以是接地线， 电磁屏蔽线，栅线、数据线。所述金属导线K靠近所述切割段设置，且与切割段之间不存在其他导线。
第一圆弧R1上任意一点都存在其到金属导线K的最短距离，比较R1上各点到金属导线K的最短距离，可以得到第一圆弧R1与金属导线K的最短距离D1；当切割后的显示面板具有如图3A所示结构时，切割段包括第二圆弧R2。第二圆弧R2上任意一点都有到金属导线K的最短距离，比较第二圆弧R2上各点到金属导线K的最短距离，可以得到第二圆弧R2与金属导线K的最短距离D2；金属导线与切割段的位置关系有：D1>D2。由于靠近端部中心的位置相对于其他位置较为脆弱，容易断裂或出现裂纹，利用这样的结构设计，切割后的显示面板可以在靠近端部中心的区域获得相对较大的“电子元件安全距离”。即在靠近端部中心的区域，切割段距离显示面板的各电子元件的距离相对较远，因此可以较少因为端部断裂或出现裂纹对显示面板的显示功能和寿命的影响，提高显示面包的信赖性。
示例性的，当切割段还包括第一直线段L1时，类似第一圆弧R1与金属导线K的最短距离的定义，第一直线段L1到金属导线K的最短距离为D3，金属导线K与切割段的位置关系有：D1>D3
示例性的，当切割段还包括第四圆弧R4时，类似第一圆弧R1与金属导线K的最短距离的定义，第四圆弧R4到金属导线K的最短距离为D4，金属导线K与切割段的位置关系有：D1>D4
示例性的，如图15所示，当切割段包括第二圆弧R2、第一直线段L1、第四圆弧R4时，类似第一圆弧R1与金属导线K的最短距离的定义，第二圆弧R2、第一直线段L1、第四圆弧R4到金属导线K的最短距离分别为D2、D3、D4，金属导线K与切割段的位置关系有：D1>max(D2,D3,D4)，其中，max(D2,D3,D4)代表D2、D3、D4中的最大值。
示例性的，切割段包括第三圆弧R3，类似第一圆弧R1与金属导线K的最短距离的定义，第三圆弧R3到金属导线K的最短距离为D2’，金属导线K与切割段的位置关系有：D1>D2’；
示例性的，当切割段还包括第二直线段L2时，类似第一圆弧R1与金属导线K的最短距离的定义，第二直线段L2到金属导线K的最短距离为D3’，金属导线K与切割段的位置关系有：D1>D3’
示例性的，当切割段还包括第五圆弧R5时，类似第一圆弧R1与金 属导线K的最短距离的定义，第五圆弧R5到金属导线K的最短距离为D4’，金属导线K与切割段的位置关系有：D1>D4’
示例性的，当切割段包括第三圆弧R3、第二直线段L2、第五圆弧R5时，类似第一圆弧R1与金属导线K的最短距离的定义，第三圆弧R3、第二直线段L2、第五圆弧R5到金属导线K的最短距离分别为D2’、D3’、D4’，金属导线K与切割段的位置关系有：D1>max(D2’,D3’,D4’)，其中，max(D2’,D3’,D4’)表示D2’、D3’、D4’中的最大值。
利用这样的结构设计，基于同样的原理，上述示例给出的面板结构，使切割后的显示面板可以在靠近端部中心的区域获得相对较大的“电子元件安全距离”。即在靠近端部中心的区域，切割段距离显示面板的各电子元件的距离相对较远，因此可以较少因为端部断裂或出现裂纹对显示面板的显示功能和寿命的影响，提高显示面包的信赖性。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (25)

  1. 一种基板，包括：
    至少两个边部；和，
    至少一个端部，各端部连接相邻的两个边部；
    其中，各端部包括切割段和两个断裂段，所述切割段的一端通过一个断裂段连接所述相邻的两个边部中的一个边部，所述切割段的另一端通过另一个断裂段连接所述相邻的两个边部中的另一个边部；
    所述切割段配置为由工具切割形成，所述断裂段配置为在物理力的作用下形成。
  2. 根据权利要求1所述的基板，其中，所述切割段在所述基板所在平面的正投影包括：
    第一圆弧，所述第一圆弧的弧心位于所述基板的内侧。
  3. 根据权利要求2所述的基板，其中，所述切割段在所述基板所在平面的正投影还包括：
    第二圆弧，所述第二圆弧的第一端与一个所述断裂段在所述基板所在平面的正投影相连，所述第二圆弧的第二端与所述第一圆弧的第一端直接或间接相连；所述第二圆弧的弧心位于所述基板的外侧；和/或，
    第三圆弧，所述第三圆弧的第一端与另一个所述断裂段在所述基板所在平面的正投影相连，所述第三圆弧的第二端与所述第一圆弧的第二端直接或间接相连；所述第三圆弧的弧心位于所述基板的外侧。
  4. 根据权利要求3所述的基板，其中，在所述第二圆弧与所述第一圆弧直接相连，和/或，所述第三圆弧与所述第一圆弧直接相连的情况下；所述第二圆弧的半径和/或所述第三圆弧的半径为r 21，r 21满足以下公式：
    Figure PCTCN2021086832-appb-100001
    其中，k1的取值范围为1～2；r1为第一圆弧的半径；s为第一限定值；α为辅助圆弧对应的圆心角，所述辅助圆弧通过延长所述第一圆弧得到，且所述辅助圆弧的相对两端到相邻的两个所述边部的距离等于第二限定值。
  5. 根据权利要求3所述的基板，其中，在所述第二圆弧与所述第一圆弧间接相连，和/或，所述第三圆弧与所述第一圆弧间接相连的情况下；
    所述切割段在所述基板所在平面的正投影还包括：
    第一直线段，所述第一直线段的第一端连接所述第二圆弧的第二端，所述第一直线段的第二端连接所述第一圆弧的第一端；和/或，
    第二直线段，所述第二直线段的第一端连接所述第三圆弧的第二端，所述第二直线段的第二端连接所述第一圆弧的第二端。
  6. 根据权利要求5所述的基板，其中，所述第一直线段同时与所述第二圆弧和所述第一圆弧相切，和/或，所述第二直线段同时与所述第三圆弧和所述第一圆弧相切。
  7. 根据权利要求5或6所述的基板，其中，所述第二圆弧的半径和/或所述第三圆弧的半径为r 22，r 22满足以下公式：
    Figure PCTCN2021086832-appb-100002
    其中，k1的取值范围为1～2；r1为第一圆弧的半径；s为第一限定值；α为辅助圆弧对应的圆心角，所述辅助圆弧通过延长所述第一圆弧得到，且所述辅助圆弧的相对两端到相邻的两个所述边部的距离等于第二限定值；u为第三限定值。
  8. 根据权利要求7所述的基板，其中，
    所述第三限定值大致等于0.05mm。
  9. 根据权利要求3所述的基板，其中，在所述第二圆弧与所述第一圆弧间接相连，和/或，所述第三圆弧与所述第一圆弧间接相连的情况下；
    所述切割段在所述基板所在平面的正投影还包括：
    第四圆弧，所述第四圆弧的第一端连接所述第二圆弧的第二端，所述第四圆弧的第二端连接所述第一圆弧的第一端；和/或，
    第五圆弧，所述第五圆弧的第一端连接所述第三圆弧的第二端，所述第五圆弧的第二端连接所述第一圆弧的第二端。
  10. 根据权利要求9所述的基板，其中，所述第四圆弧与所述第一圆弧内切，且所述第四圆弧与所述第二圆弧外切；和/或，
    所述第五圆弧与所述第一圆弧内切，且所述第五圆弧与所述三圆弧外切。
  11. 根据权利要求3所述的基板，其中，在所述第二圆弧与所述第一圆弧间接相连，和/或，所述第三圆弧与所述第一圆弧间接相连的情况下；
    所述切割段在所述基板所在平面的正投影还包括：
    第一直线段和第四圆弧，所述第一直线段的第一端连接所述第二圆弧的第二端，所述第一直线段的第二端连接所述第四圆弧的第一端，所述第四圆 弧的第二端连接所述第一圆弧的第一端；和/或，
    第二直线段和第五圆弧，所述第二直线段的第一端连接所述第三圆弧的第二端，所述第二直线段的第二端连接所述第五圆弧的第一端，所述第五圆弧的第二端连接所述第一圆弧的第二端。
  12. 根据权利要求11所述的基板，其中，所述第一直线段同时与所述第二圆弧和所述第四圆弧相切，所述第四圆弧与所述第一圆弧内切；和/或，所述第二直线段同时与所述第三圆弧和所述第五圆弧相切，所述第五圆弧与所述第一圆弧内切。
  13. 根据权利要求9～12中任一项所述的基板，其中，所述第二圆弧的半径和/或所述第三圆弧的半径为r 23，r 23满足以下公式：
    Figure PCTCN2021086832-appb-100003
    其中，k 1的取值范围为1～2；n为公式
    Figure PCTCN2021086832-appb-100004
    中L的最小值，α为辅助圆弧对应的圆心角，所述辅助圆弧通过延长所述第一圆弧得到，所述辅助圆弧的相对两端到相邻的两个所述边部的距离等于第二限定值，r 1为第一圆弧的半径，s为第一限定值。
  14. 根据权利要求9～13中任一项所述的基板，其中，所述第四圆弧和/或所述第五圆弧的半径为r 4，r 4＝k 2·r 1；其中，k 2的取值范围为0.5～0.8，r 1为第一圆弧的半径。
  15. 根据权利要求11或12，其中，所述第一圆弧的半径的取值范围为7.01mm～8.74mm；所述第二圆弧的半径和/或所述第三圆弧的半径的取值范围为0.15mm～0.3mm；所述第四圆弧的半径和/或所述第五圆弧的半径的取值范围为5mm～6mm；所述第一直线段的长度和/或所述第二直线段的长度的取值范围为0.3mm～0.52mm。
  16. 根据权利要求2～15中任一项所述的基板，其中，所述切割段在所述基板所在平面的正投影中各个点到所述第一圆弧所在圆的最短距离小于或等于第一限定值。
  17. 根据权利要求4、7、13或16中任一项所述的基板，其中，所述第一限定值大致等于0.04mm。
  18. 根据权利要求1～17中任一项所述的基板，其中，各所述断裂段沿第 一方向的尺寸为第二限定值；
    所述第一方向平行于所述基板所在的平面、且垂直于与该断裂段相连的所述边部。
  19. 根据权利要求4、7、13或18中任一项所述的基板，其中，所述第二限定值的取值范围为0.06mm～0.1mm。
  20. 根据权利要求4、7、13或18中任一项所述的基板，其中，所述第二限定值的取值范围为0.1mm～0.3mm。
  21. 一种电子器件，包括：
    至少一个如权利要求1～20中任一项所述的基板。
  22. 根据权利要求21所述的电子器件，其中，所述电子器件为显示面板、触控面板、微流控芯片或电子芯片中的任一者。
  23. 根据权利要求21所述的电子器件，其中，所述电子器件为显示面板；所述显示面板还包括：
    至少一条金属导线，设置于所述显示面板中且位于所述显示面板外围；
    其中，在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第二圆弧的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第二圆弧与所述金属导线之间的最短距离；和/或，
    在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第三圆弧的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第三圆弧与所述金属导线之间的最短距离；和/或，
    在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第一直线段的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第一直线段与所述金属导线之间的最短距离；和/或，
    在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第二直线段的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第二直线段与所述金属导线之间的最短距离；和/或，
    在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第四圆弧的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第四圆弧与所述金属导线之间的最短距离；和/或，
    在所述基板的切割段在所述基板所在平面的正投影包括第一圆弧和第五圆弧的情况下，所述第一圆弧与所述金属导线之间的最短距离大于所述第五圆弧与所述金属导线之间的最短距离。
  24. 一种电子设备，包括：
    如权利要求21～23中任一项所述的电子器件。
  25. 一种基板的切割方法，包括：
    沿第一切割路径将基板母板切割成多个待去除角部的基板；
    在待去除角部的基板上确定第二切割路径；所述第二切割路径对应于如权利要求1～20中任一项所述的基板的切割段；
    沿所述第二切割路径切割所述待去除角部的基板，之后，利用物理力去除所述角部，以形成如权利要求1～20中任一项所述的基板。
PCT/CN2021/086832 2020-05-29 2021-04-13 基板及其切割方法、电子器件及电子设备 WO2021238468A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/780,053 US20220413325A1 (en) 2020-05-29 2021-04-13 Substrate and method for cutting the same, and electronic device and electronic apparatus
EP21813346.0A EP4160303A4 (en) 2020-05-29 2021-04-13 SUBSTRATE, METHOD FOR CUTTING THE SAME, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010480020.9 2020-05-29
CN202010480020.9A CN113751889A (zh) 2020-05-29 2020-05-29 基板及其切割方法、电子器件及电子设备

Publications (1)

Publication Number Publication Date
WO2021238468A1 true WO2021238468A1 (zh) 2021-12-02

Family

ID=78745525

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/086832 WO2021238468A1 (zh) 2020-05-29 2021-04-13 基板及其切割方法、电子器件及电子设备

Country Status (4)

Country Link
US (1) US20220413325A1 (zh)
EP (1) EP4160303A4 (zh)
CN (1) CN113751889A (zh)
WO (1) WO2021238468A1 (zh)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102574232A (zh) * 2009-09-29 2012-07-11 皮可钻机公司 切割基板的方法和用于切割的设备
KR20120119082A (ko) * 2011-04-20 2012-10-30 엘지디스플레이 주식회사 액정표시장치용 기판 절단 방법
JP2013082589A (ja) * 2011-10-11 2013-05-09 V Technology Co Ltd ガラス基板のレーザ加工装置
KR20140122312A (ko) * 2013-04-09 2014-10-20 엘지디스플레이 주식회사 액정표시장치 및 그 제조 방법
CN104310779A (zh) * 2014-09-29 2015-01-28 合肥鑫晟光电科技有限公司 一种激光切割基板的方法及激光切割设备
CN109031743A (zh) * 2018-08-29 2018-12-18 厦门天马微电子有限公司 异形显示面板及其切割方法
CN110211973A (zh) * 2019-06-12 2019-09-06 京东方科技集团股份有限公司 一种显示面板及制作方法
CN212577823U (zh) * 2020-05-29 2021-02-23 京东方科技集团股份有限公司 基板、电子器件及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5054496B2 (ja) * 2007-11-30 2012-10-24 浜松ホトニクス株式会社 加工対象物切断方法
US9260337B2 (en) * 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
JP6817822B2 (ja) * 2017-01-18 2021-01-20 株式会社ディスコ 加工方法
KR102607770B1 (ko) * 2017-12-08 2023-12-01 삼성디스플레이 주식회사 표시패널 및 그 제조방법
KR102580292B1 (ko) * 2018-05-29 2023-09-19 삼성디스플레이 주식회사 표시 장치, 그 제조 방법 및 표시 장치 제조를 위한 레이저 가공 장치
CN111151894A (zh) * 2020-01-03 2020-05-15 深圳市华星光电半导体显示技术有限公司 异形显示面板及其切割方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102574232A (zh) * 2009-09-29 2012-07-11 皮可钻机公司 切割基板的方法和用于切割的设备
KR20120119082A (ko) * 2011-04-20 2012-10-30 엘지디스플레이 주식회사 액정표시장치용 기판 절단 방법
JP2013082589A (ja) * 2011-10-11 2013-05-09 V Technology Co Ltd ガラス基板のレーザ加工装置
KR20140122312A (ko) * 2013-04-09 2014-10-20 엘지디스플레이 주식회사 액정표시장치 및 그 제조 방법
CN104310779A (zh) * 2014-09-29 2015-01-28 合肥鑫晟光电科技有限公司 一种激光切割基板的方法及激光切割设备
CN109031743A (zh) * 2018-08-29 2018-12-18 厦门天马微电子有限公司 异形显示面板及其切割方法
CN110211973A (zh) * 2019-06-12 2019-09-06 京东方科技集团股份有限公司 一种显示面板及制作方法
CN212577823U (zh) * 2020-05-29 2021-02-23 京东方科技集团股份有限公司 基板、电子器件及电子设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4160303A4

Also Published As

Publication number Publication date
EP4160303A1 (en) 2023-04-05
CN113751889A (zh) 2021-12-07
US20220413325A1 (en) 2022-12-29
EP4160303A4 (en) 2023-12-20

Similar Documents

Publication Publication Date Title
JP4731594B2 (ja) 表示パネル
TWI518650B (zh) 顯示裝置
TWI534674B (zh) 觸控面板及其製造方法
US11665953B2 (en) Display panel and method of fabricating the same
TWI576736B (zh) 觸控裝置
KR101109106B1 (ko) 표시패널 및 그 제조방법
US20090316090A1 (en) Display device
US11960168B2 (en) Electronic device
US10770688B2 (en) Display device
US10661465B2 (en) Display panel
KR20110005499A (ko) 유기전계 발광 표시장치 및 그 제조방법
WO2021238468A1 (zh) 基板及其切割方法、电子器件及电子设备
CN212577823U (zh) 基板、电子器件及电子设备
US10451901B2 (en) Display device on a substrate connected to another substrate with contact pads, vias, and conductive traces
KR20110102251A (ko) 표시패널
US20240099108A1 (en) Display device and method for fabrication thereof
JP5403651B2 (ja) 表示装置およびその製造方法
JP4731576B2 (ja) 表示パネル
TWI383222B (zh) 背光模組及其導光板
TW201502895A (zh) 觸控面板、觸控顯示面板及製作觸控面板之方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21813346

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2021813346

Country of ref document: EP

Effective date: 20221228