WO2021230089A1 - Circuit électrique pour alimentation électrique de circuit intégré, condensateur et circuit électrique ayant un circuit intégré - Google Patents

Circuit électrique pour alimentation électrique de circuit intégré, condensateur et circuit électrique ayant un circuit intégré Download PDF

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Publication number
WO2021230089A1
WO2021230089A1 PCT/JP2021/017083 JP2021017083W WO2021230089A1 WO 2021230089 A1 WO2021230089 A1 WO 2021230089A1 JP 2021017083 W JP2021017083 W JP 2021017083W WO 2021230089 A1 WO2021230089 A1 WO 2021230089A1
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Prior art keywords
capacitor
integrated circuit
electric circuit
external electrode
anode
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PCT/JP2021/017083
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English (en)
Japanese (ja)
Inventor
一明 青山
昭二 吉田
健司 倉貫
慎也 鈴木
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パナソニックＩｐマネジメント株式会社
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Publication of WO2021230089A1 publication Critical patent/WO2021230089A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks

Definitions

  • the present disclosure generally relates to an electric circuit for power supply of an integrated circuit, a capacitor and an electric circuit with an integrated circuit, and more particularly, an electric circuit for power supply of an integrated circuit including a capacitor, a capacitor used in this electric circuit, and ,
  • the present invention relates to an electric circuit with an integrated circuit including this electric circuit.
  • the digital signal processing board described in Patent Document 1 includes an LSI to which an element for clock operation is connected, a power input line for supplying power to the LSI, and a decoupling capacitor connected between the power input line and ground. And have.
  • the decoupling capacitor a surface-mounted solid electrolytic capacitor having an ESR of 25 m ⁇ (100 kHz) or less and an ESL of 800 pH (500 MHz) or less is used.
  • the electric circuit for power supply of the integrated circuit includes an electric circuit and at least one predetermined capacitor.
  • the electric circuit supplies DC power from a power source to the integrated circuit.
  • the predetermined capacitor has predetermined characteristics.
  • the predetermined capacitor is electrically connected to the electric circuit and the ground.
  • the predetermined characteristic is a characteristic that the impedance is 10 [m ⁇ ] or less at least when the frequency is 5 [MHz] or more and 10 [MHz] or less.
  • the capacitor according to one aspect of the present disclosure is used as the predetermined capacitor in the electric circuit for supplying power to the integrated circuit.
  • the electric circuit with an integrated circuit includes an electric circuit for supplying power to the integrated circuit and the integrated circuit.
  • This disclosure has the advantage that the number of capacitors can be reduced.
  • FIG. 1 is a circuit diagram of an electric circuit with an integrated circuit according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic diagram of a main part of the electric circuit with an integrated circuit of FIG.
  • FIG. 3 is a schematic diagram of a main part of an electric circuit with an integrated circuit according to a comparative example.
  • FIG. 4 is a characteristic diagram of a capacitor according to an embodiment of the present disclosure.
  • FIG. 5 is a characteristic diagram of a capacitor according to a comparative example.
  • FIG. 6 is a characteristic diagram of a parallel circuit of a plurality of capacitors according to a comparative example.
  • FIG. 7 is a schematic cross-sectional view of the capacitor according to the embodiment of the present disclosure.
  • FIG. 8 is a schematic cross-sectional view of the capacitor element of the capacitor of FIG.
  • FIG. 9 is a schematic diagram of a main part of an electric circuit with an integrated circuit according to an embodiment (modification example 1) of the present disclosure.
  • the electric circuit 101 for power supply of the integrated circuit 41 of the present embodiment includes an electric circuit 30 and at least one predetermined capacitor 11.
  • the electric circuit 30 supplies DC power from the power supply PS1 to the integrated circuit 41.
  • the predetermined capacitor 11 has a predetermined characteristic.
  • the predetermined capacitor 11 is electrically connected to the electric circuit 30 and the ground.
  • the predetermined characteristic is that the impedance is 10 [m ⁇ ] or less at least when the frequency is 5 [MHz] or more and 10 [MHz] or less.
  • the number of capacitors used in the electric circuit 101 can be reduced. That is, the number of capacitors required to suppress the voltage fluctuation of the electric circuit 30 which is the power supply line to the integrated circuit 41 can be reduced.
  • the predetermined characteristic of the predetermined capacitor 11 is more preferably the characteristic that the impedance is 10 [m ⁇ ] or less when the frequency is 100 [kHz] or more and 10 [MHz] or less.
  • the self-resonant frequency of the predetermined capacitor 11 is preferably 300 [kHz] or more and 1 [GHz] or less. Further, the drive voltage of the predetermined capacitor 11 is preferably 3.3 [V] or less.
  • the capacitor 11 is used as the predetermined capacitor 11 in the electric circuit 101 for supplying power to the integrated circuit 41.
  • the capacitor 11 may be provided independently of the configuration of the electric circuit 101 other than the capacitor 11.
  • the electric circuit 100 with an integrated circuit includes an electric circuit 101 for supplying power to the integrated circuit 41 and an integrated circuit 41.
  • the integrated circuit 41 is, for example, a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI).
  • the integrated circuit 41 is provided in, for example, a personal computer, a server computer, or a microcontroller.
  • the electric circuit 101 is, for example, a circuit of a printed wiring board.
  • the electric circuit 101 for power supply of the integrated circuit 41 (hereinafter, simply referred to as “electric circuit 101”) includes a first electric circuit 31 and a second electric circuit 32 as the electric circuit 30. Further, the electric circuit 101 includes capacitors 42 and 45 in addition to the capacitor 11. Each of the capacitors 11, 42 and 45 is an electrolytic capacitor. Further, the electric circuit 101 includes a DC / DC converter 43 and an inductor 44.
  • the electric circuit 101 is electrically connected to the power supply PS1.
  • the first end of the first electric line 31 is electrically connected to the power supply PS1.
  • the second end of the first electric circuit 31 is electrically connected to the DC / DC converter 43.
  • the power supply PS1 is a DC power supply.
  • the power source PS1 is, for example, a battery.
  • the power supply PS1 supplies DC power to the DC / DC converter 43.
  • the electric circuit 101 is electrically connected to the integrated circuit 41.
  • the first end of the second electric circuit 32 is electrically connected to the DC / DC converter 43.
  • the second end of the second electric circuit 32 is electrically connected to the integrated circuit 41.
  • the capacitor 11 is electrically connected between the second electric circuit 32 and the ground. More specifically, the first end of the capacitor 11 is electrically connected to the second electric circuit 32, and the second end is electrically connected to the ground.
  • the DC / DC converter 43 is electrically connected between the power supply PS1 and the capacitor 11 (predetermined capacitor).
  • the DC / DC converter 43 converts the DC power input from the power supply PS1 into DC power having a predetermined voltage and outputs the DC power to the second electric circuit 32.
  • the DC power output from the DC / DC converter 43 is input to the integrated circuit 41 (power supply pin) via the second electric path 32.
  • the switching frequency of the DC / DC converter 43 is 200 [kHz] or more and 10 [MHz] or less.
  • a capacitor 42 is electrically connected between the first electric circuit 31 and the ground.
  • a capacitor 45 is electrically connected between the second electric circuit 32 and the ground. That is, a capacitor 42 is provided in the input stage of the DC / DC converter 43, and a capacitor 45 is provided in the output stage.
  • the capacitor 42 smoothes the input voltage of the DC / DC converter 43.
  • the capacitor 45 smoothes the output voltage of the DC / DC converter 43.
  • the inductor 44 is electrically connected to the second electric circuit 32. More specifically, the inductor 44 is electrically connected between the DC / DC converter 43 and the capacitor 45. The inductor 44 constitutes a low-pass filter together with the capacitor 45.
  • a capacitor 11 is electrically connected between the second electric circuit 32 and the ground.
  • the connection point between the capacitor 11 and the second electric circuit 32 is located between the capacitor 45 and the integrated circuit 41.
  • FIG. 1 illustrates the parasitic resistance 46 and the parasitic inductance 47 of the second electric circuit 32.
  • the wiring impedance of the second electric circuit 32 is determined by the parasitic resistance 46 and the parasitic inductance 47.
  • the electric circuit length between the capacitor 11 and the integrated circuit 41 is shorter than the electric circuit length between the DC / DC converter 43 and the integrated circuit 41.
  • the wiring impedance between the capacitor 11 (predetermined capacitor) and the integrated circuit 41 is smaller than the wiring impedance between the DC / DC converter 43 and the integrated circuit 41.
  • FIG. 2 is a schematic diagram showing an example of the spatial arrangement of a part of the configuration of the electric circuit 100 with an integrated circuit.
  • conductor patterns 321 and 322 are provided as a part of the second electric circuit 32.
  • the conductor pattern 321 is electrically connected to the first end of the DC / DC converter 43 (see FIG. 1) and the inductor 44.
  • the conductor pattern 322 is electrically connected to the second end of the inductor 44 and the integrated circuit 41.
  • the conductor pattern 322 has a first pattern N1, a second pattern N2, and a third pattern P1.
  • the potentials of the first pattern N1 and the second pattern N2 are ground potentials.
  • the potential of the third pattern P1 is different from the ground potential.
  • the second end of the inductor 44 is electrically connected to the third pattern P1.
  • the capacitor 11 is provided with four external electrodes. More specifically, the capacitor 11 includes a first external electrode 21, a second external electrode 22, and two third external electrodes 23.
  • the first external electrode 21 and the second external electrode 22 are anode terminals.
  • the first external electrode 21 and the second external electrode 22 are electrically connected to the third pattern P1.
  • the two third external electrodes 23 are cathode terminals.
  • One of the two third external electrodes 23 is electrically connected to the first pattern N1 and the other is electrically connected to the second pattern N2.
  • the integrated circuit 41 is electrically connected to the third pattern P1. Further, the integrated circuit 41 is electrically connected to the ground pattern (first pattern N1 or second pattern N2).
  • the number of capacitors 11 is one. As described above, the number of capacitors 11 (predetermined capacitors) electrically connected to the electric circuit 30 may be one. Alternatively, the number of capacitors 11 (predetermined capacitors) electrically connected to the electric circuit 30 may be a plurality. It is preferable to reduce the cost, mounting area, etc. by reducing the number of capacitors 11 as much as possible within the range where the load line impedance of the integrated circuit 41 is equal to or less than the desired value required for the integrated circuit 41.
  • the load line impedance of the integrated circuit 41 is the total impedance of the entire power supply line as seen from the integrated circuit 41. That is, the load line impedance of the integrated circuit 41 is calculated from the impedance of the DC / DC converter 43, the wiring impedance of the electric circuit 30, and the impedance of each element such as the capacitor 11 electrically connected to the electric circuit 30.
  • the load line impedance of the integrated circuit 41 is, for example, 10 [m ⁇ ] or less at a frequency of 10 [MHz] or less.
  • the load line impedance when the current consumption of the integrated circuit 41 is 200 [A] is 1.0 [m ⁇ ] or less.
  • the load line impedance when the current consumption of the integrated circuit 41 is 226 [A] is 0.9 [m ⁇ ] or less.
  • the load line impedance when the current consumption of the integrated circuit 41 is 117 [A] is 0.85 [m ⁇ ] or less.
  • the load line impedance when the current consumption of the integrated circuit 41 is 392 [A] is 0.6 [m ⁇ ] or less.
  • the load line impedance when the current consumption of the integrated circuit 41 is 490 [A] or more and 520 [A] or less is 0.5 [m ⁇ ] or less. ..
  • the capacitor 11 has an alternating laminated structure in which a first capacitor element 10a (see FIG. 7) facing in one direction and a second capacitor element 10b (see FIG. 7) facing in the opposite direction are alternately laminated. have.
  • the capacitor 11 has the above-mentioned predetermined characteristics.
  • Such a capacitor is referred to as an alternating laminated capacitor.
  • the predetermined characteristic is that the impedance is 10 [m ⁇ ] or less at least when the frequency is 5 [MHz] or more and 10 [MHz] or less.
  • the ESR (equivalent series resistance) of the capacitor 11 at the self-resonant frequency of the capacitor 11 is 2 [m ⁇ ] or less.
  • the ESL (equivalent series inductance) of the capacitor 11 at 500 [MHz] is 100 [pH] or less.
  • the voltage of the electric circuit 30 fluctuates due to the switching operation of the DC / DC converter 43, the fluctuation of the load current in the integrated circuit 41, and the like.
  • the capacitor 11 has the above-mentioned predetermined characteristics, the number of required capacitors can be reduced. That is, since the capacitor 11 has a low impedance in a relatively wide frequency band, the number of members of the capacitor 11 can be reduced.
  • a second capacitor having no predetermined characteristic may be electrically connected to the electric circuit 30, but also in this case, the number of capacitors 11 and the second capacitor 11 are used. The number of capacitors can be reduced.
  • the mounting area of the capacitor 11 and the second capacitor may be reduced.
  • FIG. 3 is a schematic diagram showing an example of the spatial arrangement of a part of the configuration of the electric circuit 100P with an integrated circuit according to the comparative example.
  • a capacitor 11P having a larger impedance than the capacitor 11 is used instead of the capacitor 11, a parallel circuit in which a plurality of such capacitors 11P (six in FIG. 3P) are connected in parallel. Therefore, the characteristics corresponding to a single capacitor 11 can be obtained, but a larger number of capacitors 11P are required.
  • the capacitor 11P is a ceramic capacitor.
  • FIG. 4 shows the characteristics of the capacitor 11 (alternate laminated capacitor) of the present embodiment.
  • FIG. 5 shows the characteristics of the capacitor 11P of the comparative example.
  • the capacitance of the capacitor 11P is 100 [ ⁇ F].
  • FIG. 6 shows the characteristics of a parallel circuit in which six capacitors 11P of the comparative example are connected in parallel.
  • the horizontal axis of FIGS. 4 to 6 represents frequency (unit: [MHz]), and the vertical axis represents impedance (unit: [ ⁇ ]). Impedance of the capacitor 11,11P, since the lower frequency band than the self-resonant frequency f 0 is a capacitance component is dominant, the impedance is smaller the larger the frequency.
  • the capacitor 11 has the above-mentioned predetermined characteristics.
  • the predetermined characteristic is that the impedance is 10 [m ⁇ ] or less at least when the frequency is 5 [MHz] or more and 10 [MHz] or less.
  • the predetermined characteristic is that the impedance is 10 [m ⁇ ] or less when the frequency is 100 [kHz] or more and 10 [MHz] or less. From FIG. 5, the capacitor 11P does not have a predetermined characteristic, and from FIG. 6, the parallel circuit of the six capacitors 11P has a predetermined characteristic.
  • the parallel circuit of the six capacitors 11P of the comparative example can be replaced with one capacitor 11, so that the number of capacitors can be reduced.
  • the capacitor 11 the load line impedance of the integrated circuit 41 can be reduced while reducing the number of members.
  • the self-resonant frequency f 0 of the capacitor 11 is 300 [kHz] or more and 1 [GHz] or less.
  • the capacitor 11 By adopting an alternating laminated capacitor as the capacitor 11, it is possible to reduce the characteristic change due to temperature, applied voltage, etc., as compared with the case of adopting a ceramic capacitor. Further, as compared with the case where a ceramic capacitor is adopted as the capacitor 11, the change in the capacitance of the capacitor 11 (AC bias characteristic) due to the AC component superimposed on the direct current supplied to the capacitor 11 is very small.
  • the electrolytic capacitor 11 includes an element laminate in which a plurality of capacitor elements 10 are laminated, an exterior body 14 for sealing the element laminate, a first external electrode 21, and a second. An external electrode 22 and a third external electrode 23 are provided.
  • the plurality of capacitor elements 10 each cover an anode 3 having a porous portion 5 on its surface, a dielectric layer formed on the surface of at least a part of the porous portion 5, and at least a part of the dielectric layer. It has a cathode portion 6.
  • the plurality of capacitor elements 10 have a first end portion 1a on which the anode body 3 is exposed and a second end portion 2a in which the anode body 3 is covered with the cathode portion 6, and at least the end surface of the first end portion 1a is an exterior. It is exposed from the body 14.
  • the plurality of capacitor elements 10 have a first end portion 1a facing the first surface 14a of the exterior body 14, and a second end portion 1a having a second surface 14b different from the first surface 14a of the exterior body 14. There is something that suits you. Of these, the one in which the first end portion 1a faces the first surface 14a of the exterior body 14 is different from the first capacitor element 10a, and the first end portion 1a is different from the first surface 14a of the exterior body 14. Those facing the surface 14b are referred to as a second capacitor element 10b.
  • the first end portion 1a of the first capacitor element 10a is electrically connected to the first external electrode 21.
  • the first end portion 1a of the second capacitor element 10b is electrically connected to the second external electrode 22.
  • the direction in which the current flows in the first capacitor element 10a and the second capacitor element 10b are different. Therefore, since the direction of the magnetic field generated by the current is different, the magnetic flux generated in the element stack is reduced. Therefore, ESL is reduced.
  • the first surface 14a and the second surface 14b may be surfaces of the exterior body 14 facing each other. Further, when the first capacitor element 10a and the second capacitor element 10b are alternately laminated, the magnetic flux generated in the element stacking body can be effectively reduced. Therefore, ESL can be effectively reduced.
  • the number of the first capacitor elements 10a and the number of the second capacitor elements 10b may be the same.
  • the magnetic field generated by the current flowing in the first capacitor element 10a and the magnetic field generated by the current flowing in the second capacitor element 10b are canceled out without excess or deficiency, and the magnetic flux generated in the element laminated body is reduced. Therefore, it is easy to reduce ESL.
  • the end surface of the first end portion 1a exposed from the exterior body 14 of each capacitor element 10 is connected to the external electrode (first external electrode 21 or the second external electrode 21). This can be done by electrically connecting to the electrode 22).
  • the electrical connection between the end face of the first end 1a and the external electrode is, for example, using an external electrode formed along the first surface 14a or the second surface 14b, or the first surface 14a or This can be done by electrically connecting an intermediate electrode (corresponding to the anode electrode layer 16 described later) formed along the second surface 14b to an external electrode.
  • the third external electrode 23 is electrically connected to the cathode portion 6 of the capacitor element 10.
  • the third external electrode 23 is electrically connected to the cathode portion 6 in, for example, the outermost layer (that is, the lowest layer or the uppermost layer) of the element laminate.
  • the cathode terminal can be provided on the bottom surface of the electrolytic capacitor 11.
  • the anode terminal can be provided on the bottom surface of the electrolytic capacitor 11. In this case, the current flowing through the extending portion of the first external electrode 21 or the second external electrode 22 flows in the direction opposite to the current flowing through the anode extraction portion.
  • the magnetic field generated by the current flowing in the anode extraction portion is canceled by the magnetic field generated by the current flowing in the extending portion of the first external electrode 21 or the second external electrode 22, and the ESL of the electrolytic capacitor 11 is further reduced. ..
  • the extending portion can reduce the distance between the cathode terminal and the first and / or second external electrode, thus improving ESL. Due to these synergistic effects, ESL is significantly reduced.
  • the first end portion 1a may be electrically connected to the first external electrode 21 or the second external electrode 22 via the contact layer 15.
  • the contact layer 15 may be selectively formed on, for example, the end face of the first end portion 1a of the plurality of capacitor elements 10.
  • the contact layer 15 includes an intermediate electrode (anode electrode layer 16) or an external electrode formed so as to cover each of the first end portions 1a of the plurality of capacitor elements 10 and the first surface 14a or the second surface 14b. Can be connected between. Through the contact layer 15, the electrical connection between the first end portion 1a and the external electrode can be ensured. Therefore, the reliability of the electrolytic capacitor 11 can be improved.
  • the first external electrode 21 and the second external electrode 22 may face each other in the longitudinal direction of the anode body 3 or may face each other in the lateral direction.
  • the first external electrode 21 and the second external electrode 22 may be arranged at the ends of one surface (for example, the bottom surface) of the exterior body 14 along the lateral direction, respectively, and may be arranged along the longitudinal direction. It may be arranged at the end.
  • the first external electrode 21 and the second external electrode 22 may face each other in the lateral direction of the anode body 3.
  • the bottom surface of the electrolytic capacitor 11 of the first external electrode 21 or the second external electrode 22 It is easy to lengthen the extension distance, it is easy to control the separation distance between the cathode terminal and the anode terminal, and it is easy to control the ESL to a desired value.
  • FIG. 7 is a cross-sectional view schematically showing the structure of the electrolytic capacitor 11 according to the embodiment of the present disclosure.
  • FIG. 8 is a cross-sectional view showing the structure of the capacitor element 10 constituting the electrolytic capacitor 11 of FIG. 7.
  • the electrolytic capacitor 11 according to the present disclosure is not limited to these.
  • the electrolytic capacitor 11 includes a plurality of capacitor elements 10 (10a, 10b).
  • the capacitor element 10 includes an anode body 3 and a cathode portion 6.
  • the anode body 3 is, for example, a foil (anode foil).
  • the anode body 3 has a porous portion 5 on the surface thereof, and a dielectric layer (not shown) is formed on the surface of at least a part of the porous portion 5.
  • the cathode portion 6 covers at least a part of the dielectric layer.
  • the anode body 3 is exposed at one end (first end) 1a without being covered by the cathode portion 6, while the anode of the other end (second end) 2a.
  • the body 3 is covered with the cathode portion 6.
  • the portion of the anode 3 not covered by the cathode portion 6 will be referred to as the first portion 1
  • the portion of the anode 3 covered with the cathode portion 6 will be referred to as the second portion 2.
  • the end of the first portion 1 is the first end 1a
  • the end of the second portion 2 is the second end 2a.
  • the dielectric layer is formed on the surface of the porous portion 5 formed at least in the second portion 2.
  • the first portion 1 of the anode body 3 is also referred to as an anode extraction portion.
  • the second portion 2 of the anode body 3 is also referred to as a cathode forming portion.
  • the second portion 2 has a core portion 4 and a porous portion (porous body) 5 formed on the surface of the core portion 4 by roughening (etching or the like) or the like.
  • the first portion 1 may or may not have the porous portion 5 on the surface.
  • the dielectric layer is formed along the surface of the porous portion 5. At least a part of the dielectric layer covers the inner wall surface of the hole of the porous portion 5 and is formed along the inner wall surface thereof.
  • the cathode portion 6 includes a solid electrolyte layer 7 that covers at least a part of the dielectric layer, and a cathode extraction layer that covers at least a part of the solid electrolyte layer 7.
  • the surface of the dielectric layer is formed with an uneven shape corresponding to the shape of the surface of the anode body 3.
  • the solid electrolyte layer 7 may be formed so as to fill the unevenness of such a dielectric layer.
  • the cathode extraction layer includes, for example, a carbon layer 8 that covers at least a part of the solid electrolyte layer 7, and a silver paste layer 9 that covers the carbon layer 8.
  • the portion of the anode 3 in which the solid electrolyte layer 7 is formed on the anode 3 via the dielectric layer (porous portion 5) is the second portion 2, and the dielectric layer (peripheral portion 5) is placed on the anode 3.
  • the portion of the anode 3 in which the solid electrolyte layer 7 is not formed via the porous portion 5) is the first portion 1.
  • An insulating separation layer (or insulating member) 12 may be formed so as to cover the surface of the anode body 3 in at least a portion adjacent to the cathode portion 6 in the region of the anode body 3 that does not face the cathode portion 6. As a result, the contact between the cathode portion 6 and the exposed portion (first portion 1) of the anode body 3 is restricted.
  • the separation layer 12 is, for example, an insulating resin layer.
  • capacitor elements 10 10a, 10b
  • the cathode portions 6 second portion 2
  • the first capacitor element 10a the first portion 1 of the anode body 3 faces in one direction (to the right in the figure) with respect to the second portion 2.
  • the second capacitor element 10b the first portion 1 of the anode body 3 faces the second portion 2 in the direction opposite to the direction in which the first portion 1 of the first capacitor element 10a faces (in the figure). (To the left).
  • the first capacitor element 10a and the second capacitor element 10b are alternately laminated to form an element laminate.
  • the cathode portions 6 adjacent to each other in the stacking direction are electrically connected via the adhesive layer 13 having conductivity.
  • a conductive adhesive is used to form the adhesive layer 13.
  • the adhesive layer 13 contains, for example, silver.
  • the electrolytic capacitor 11 includes the above-mentioned element laminate in which a plurality of capacitor elements 10 (10a, 10b) are laminated, an exterior body 14 that seals the element laminate, a first external electrode 21, and a second outside. An electrode 22 and a third external electrode 23 are provided. In the element laminated body, the end surface of the first end portion 1a is exposed from the exterior body 14.
  • the exterior body 14 has a substantially rectangular parallelepiped outer shape, and the electrolytic capacitor 11 also has a substantially rectangular parallelepiped outer shape.
  • the exterior body 14 has a first surface 14a and a second surface 14b opposite to the first surface 14a.
  • the first end portion 1a of the first capacitor element 10a faces the first surface 14a (that is, the first end portion 1a is closer to the first surface 14a than the second end portion 2a).
  • the first end 1a of the second capacitor element 10b faces the second surface 14b (that is, the first end 1a is closer to the second surface 14b than the second end 2a). ..
  • each of the plurality of first end portions 1a (first portion 1) exposed from the exterior body 14 is a first external electrode 21 or a second surface extending along the first surface 14a. It is electrically connected to a second external electrode 22 extending along 14b.
  • first external electrode 21 or a second surface extending along the first surface 14a. It is electrically connected to a second external electrode 22 extending along 14b.
  • the ratio of the first portion 1 to the anode body 3 can be reduced to increase the capacity.
  • the contribution of ESL by the first portion 1 is reduced.
  • the separation distance between the third external electrode 23 and the first external electrode 21 and / or the second external electrode 22 can be shortened, the ESL is improved.
  • each of the end faces of the plurality of first end portions 1a exposed from the exterior body 14 is covered with the contact layer 15.
  • the anode electrode layer 16 covers the first surface 14a and the second surface 14b of the contact layer 15 and the exterior body 14.
  • the first external electrode 21 and the second external electrode 22 cover the anode electrode layer 16, whereby the plurality of first end portions 1a (first portion 1) are the first external electrode 21 or the second external electrode 21. It is electrically connected to the external electrode 22.
  • the anode electrode layer 16 covering the first surface 14a of the exterior body 14 is interposed between the contact layer 15 and the first external electrode 21, and the contact layer 15 and the second external electrode 22 are interposed.
  • An anode electrode layer 16 covering the second surface 14b of the exterior body 14 is interposed between the two.
  • the element laminate is supported by the substrate 17.
  • the substrate 17 is, for example, a laminated substrate in which conductive wiring patterns are formed on the front surface and the back surface thereof, and the wiring pattern on the front surface and the wiring pattern on the back surface are electrically connected by through holes.
  • the wiring pattern on the front surface is electrically connected to the cathode portion 6 of the capacitor element 10 laminated on the lowermost layer, and the wiring pattern on the back surface is electrically connected to the third external electrode 23. Therefore, the third external electrode 23 and the cathode portion 6 of each capacitor element 10 of the element laminate are electrically connected via the substrate 17.
  • the number, shape, and arrangement of the third external electrodes 23 can be arbitrarily set depending on the wiring pattern on the back surface.
  • the third external electrode 23 is formed on the substrate 17 by, for example, a plating process, and the substrate 17 on which the third external electrode 23 is formed can be treated as one member.
  • the third external electrode 23 is exposed on the bottom surface of the electrolytic capacitor 11.
  • the exposed portion on the bottom surface of the third external electrode 23 constitutes the cathode terminal of the electrolytic capacitor 11.
  • two third external electrodes 23 are provided apart from each other, and the third external electrode 23 is exposed in a plurality of regions.
  • a part of the first external electrode 21 is bent along the bottom surface of the exterior body 14 and is exposed on the bottom surface of the electrolytic capacitor 11.
  • a part of the second external electrode 22 is bent along the bottom surface of the exterior body 14 so as to face the bent portion of the first external electrode 21, and is exposed on the bottom surface of the electrolytic capacitor 11.
  • the exposed portion on the bottom surface of the first external electrode 21 and the second external electrode 22 constitutes the anode terminal of the electrolytic capacitor 11. That is, in the present embodiment, the electrolytic capacitor 11 has two anode terminals separated from each other. A cathode terminal may be present so as to be sandwiched between two separated anode terminals.
  • ESL of the electrolytic capacitor 11 the distance between the first distance L 1 of the outer electrode 21 and the third external electrodes 23, and, a second external electrode 22 in the bottom third of the external electrode 23 on the bottom surface It depends on L 2.
  • the shorter the separation distances L 1 and L 2 the smaller the ESL tends to be.
  • a plurality of third external electrodes 23 may be arranged on the bottom surface. In this case, one of the plurality of third external electrodes 23 is arranged close to the first external electrode 21, and the other one of the plurality of third external electrodes 23 is close to the second external electrode 22. Can be placed. This can effectively reduce ESL.
  • the separation distances L 1 and L 2 may be, for example, 0.4 mm to 1.1 mm.
  • “having a plurality of third external electrodes 23” means that the third external electrode 23 is exposed in a plurality of separated regions, and the plurality of third external electrodes 23 are separated from each other. Not limited to the case. Two or more of the plurality of third external electrodes 23 may be continuously formed in the exterior body 14 and electrically connected to each other. The plurality of third external electrodes 23 may be provided on different surfaces of the exterior body 14, such as one provided on the upper surface and the other provided on the bottom surface.
  • the direction of the current flowing through the first capacitor element 10a is opposite to the direction of the current flowing through the second capacitor element 10b. Therefore, the magnetic field generated by the current flowing in the first capacitor element 10a and the magnetic field generated by the current flowing in the second capacitor element 10b cancel each other out, and the magnetic flux generated in the electrolytic capacitor 11 is reduced. As a result, ESL is reduced.
  • the effect of canceling the magnetic field does not occur.
  • the electrolytic capacitor 11 of the present embodiment it is easy to shorten the length of the first portion 1. Therefore, the contribution of ESL caused by this portion is reduced. Further, since the first external electrode 21 and the second external electrode 22 extend along the bottom surface of the exterior body 14, the contribution of ESL caused by this portion can be further reduced. Due to these effects, the ESL of the electrolytic capacitor 11 can be significantly improved.
  • the anode body 3 can include a valve acting metal, an alloy containing a valve acting metal, a compound containing a valve acting metal (intermetallic compound, etc.) and the like. These materials can be used alone or in combination of two or more.
  • As the valve acting metal aluminum, tantalum, niobium, titanium and the like can be used.
  • the anode 3 may be a valve-acting metal, an alloy containing a valve-acting metal, or a foil of a compound containing a valve-acting metal, and is a valve-acting metal, an alloy containing a valve-acting metal, or a compound containing a valve-acting metal. It may be a porous sintered body.
  • a porous portion 5 is usually formed on the surface of at least the second portion 2 of the anode foil in order to increase the surface area.
  • the second portion 2 has a core portion 4 and a porous portion 5 formed on the surface of the core portion 4.
  • the porous portion 5 may be formed by roughening the surface of at least the second portion 2 of the anode foil by etching or the like. After arranging a predetermined masking member on the surface of the first portion 1, it is also possible to perform a roughening treatment such as an etching treatment. On the other hand, it is also possible to roughen the entire surface of the surface of the anode foil by etching or the like.
  • an anode foil having no porous portion 5 on the surface of the first portion 1 and having the porous portion 5 on the surface of the second portion 2 can be obtained.
  • the porous portion 5 is formed on the surface of the first portion 1 in addition to the surface of the second portion 2.
  • a known method may be used, and examples thereof include electrolytic etching.
  • the masking member is not particularly limited, but an insulator such as a resin is preferable. The masking member is removed before the formation of the solid electrolyte layer 7, but may be a conductor containing a conductive material.
  • the surface of the first portion 1 has a porous portion 5. Therefore, the adhesion between the porous portion 5 and the exterior body 14 is not sufficient, and air (specifically, oxygen and moisture) invades the inside of the electrolytic capacitor 11 through the contact portion between the porous portion 5 and the exterior body 14. May be done.
  • the first portion 1 formed in the porous portion may be compressed in advance to close the pores of the porous portion 5. As a result, it is possible to suppress the intrusion of air from the first end portion 1a exposed from the exterior body 14 into the inside of the electrolytic capacitor 11 through the porous portion 5 and the deterioration of the reliability of the electrolytic capacitor 11 due to the intrusion of the air.
  • the dielectric layer is formed, for example, by anodizing the valve acting metal on the surface of at least the second portion 2 of the anode body 3 by chemical conversion treatment or the like.
  • the dielectric layer contains an oxide of the valve acting metal.
  • the dielectric layer contains aluminum oxide.
  • the dielectric layer is formed along at least the surface of the second portion 2 (including the inner wall surface of the hole of the porous portion 5) in which the porous portion 5 is formed.
  • the method for forming the dielectric layer is not limited to this, and it is sufficient that an insulating layer that functions as a dielectric can be formed on the surface of the second portion 2.
  • the dielectric layer may also be formed on the surface of the first portion 1 (for example, on the porous portion 5 on the surface of the first portion 1).
  • the cathode portion 6 includes a solid electrolyte layer 7 that covers at least a part of the dielectric layer, and a cathode extraction layer that covers at least a part of the solid electrolyte layer 7.
  • the solid electrolyte layer 7 contains, for example, a conductive polymer.
  • a conductive polymer for example, polypyrrole, polythiophene, polyaniline and derivatives thereof can be used.
  • the solid electrolyte layer 7 can be formed, for example, by chemically polymerizing and / or electrolytically polymerizing the raw material monomer on the dielectric layer. Alternatively, it can be formed by applying a solution in which the conductive polymer is dissolved or a dispersion in which the conductive polymer is dispersed to the dielectric layer.
  • the solid electrolyte layer 7 may contain a manganese compound.
  • the cathode extraction layer includes, for example, a carbon layer 8 and a silver paste layer 9.
  • the carbon layer 8 may be conductive as long as it has conductivity, and can be formed by using a conductive carbon material such as graphite.
  • the carbon layer 8 is formed by applying, for example, carbon paste to at least a part of the surface of the solid electrolyte layer 7.
  • a composition containing silver powder and a binder resin epoxy resin or the like
  • the silver paste layer 9 is formed by, for example, applying a silver paste to the surface of the carbon layer 8.
  • the configuration of the cathode extraction layer is not limited to this, and may be any configuration having a current collecting function.
  • an insulating separation layer 12 may be provided in order to electrically separate the first portion 1 and the cathode portion 6, an insulating separation layer 12 may be provided.
  • the separation layer 12 may be provided in close proximity to the cathode portion 6 so as to cover at least a part of the surface of the first portion 1.
  • the separation layer 12 is preferably in close contact with the first portion 1 and the exterior body 14. As a result, it is possible to suppress the intrusion of air into the electrolytic capacitor 11 described above.
  • the separation layer 12 may be arranged on the first portion 1 via a dielectric layer.
  • the separation layer 12 contains, for example, a resin, and an example of the exterior body 14 described later can be used. Insulation may be imparted by compressing and densifying the dielectric layer formed in the porous portion 5 of the first portion 1.
  • the separation layer 12 that is in close contact with the first portion 1 can be obtained, for example, by attaching a sheet-shaped insulating member (resin tape or the like) to the first portion 1.
  • a sheet-shaped insulating member resin tape or the like
  • the porous portion 5 of the first portion 1 may be compressed and flattened, and then the insulating member may be brought into close contact with the first portion 1.
  • the sheet-shaped insulating member preferably has an adhesive layer on the surface on the side to be attached to the first portion 1.
  • the liquid resin may be applied or impregnated into the first portion 1 to form an insulating member in close contact with the first portion 1.
  • the insulating member is formed so as to fill the unevenness of the surface of the porous portion 5 of the first portion 1.
  • the liquid resin easily enters the recesses on the surface of the porous portion 5, and the insulating member can be easily formed in the recesses as well.
  • the curable resin composition exemplified in the fourth step described later can be used as the liquid resin.
  • the exterior body 14 preferably contains, for example, a cured product of a curable resin composition, and may contain a thermoplastic resin or a composition containing the same.
  • the exterior body 14 can be formed by using a molding technique such as injection molding, for example.
  • the exterior body 14 can be formed by filling a predetermined portion with a curable resin composition or a thermoplastic resin (composition) so as to cover the capacitor element 10, for example, using a predetermined mold.
  • the curable resin composition may contain a filler, a curing agent, a polymerization initiator, and / or a catalyst in addition to the curable resin.
  • the curable resin include thermosetting resins.
  • the curing agent, polymerization initiator, catalyst and the like are appropriately selected depending on the type of the curable resin.
  • curable resin composition and the thermoplastic resin (composition) those exemplified in the third step described later can be used.
  • the insulating member and the exterior body 14 each contain a resin.
  • the exterior body 14 is more likely to adhere to the insulating member containing the resin than the first portion 1 containing the valve acting metal or the dielectric layer containing the oxide of the valve acting metal.
  • the separation layer 12 and the exterior body 14 contain the same resin as each other. In this case, the adhesion between the separation layer 12 and the exterior body 14 is further improved, whereby the intrusion of air into the electrolytic capacitor 11 is further suppressed.
  • the same resin contained in the separation layer 12 and the exterior body 14 include an epoxy resin.
  • the exterior body 14 contains a filler.
  • the separation layer 12 preferably contains a filler having a smaller particle size than the exterior body 14, and more preferably does not contain the filler.
  • the liquid resin preferably contains a filler having a smaller particle size than the exterior body 14, and more preferably does not contain the filler. In this case, it is easy to impregnate the liquid resin deep into the recesses on the surface of the porous portion 5 of the first portion 1, and it is easy to form the separation layer 12. Further, it is easy to form a separation layer 12 having a small thickness so that a plurality of capacitor elements 10 can be laminated.
  • the contact layer 15 may be formed so as to cover the end surface of the first end portion 1a of the anode body 3.
  • the contact layer 15 can be formed so as not to cover the surface of the exterior body 14 (and the separation layer 12) which is a resin material as much as possible, but to cover only the surface of the first end portion 1a exposed from the exterior body 14. ..
  • the contact layer 15 may contain a metal having a lower ionization tendency than the metal constituting the anode 3.
  • a metal having a lower ionization tendency than the metal constituting the anode 3.
  • the anode 3 is an aluminum (Al) foil
  • a material containing, for example, Zn, Ni, Sn, Cu, and Ag can be used as the contact layer 15.
  • the electrical connection is improved as compared with the case where the exposed portion of the anode 3 at the first end portion 1a is directly connected to the external electrode. You can be sure.
  • An alloy layer may be formed at the interface between the contact layer 15 and the anode body 3.
  • the anode 3 is an aluminum (Al) foil, Cu, Zn, or Ag has an interatomic distance close to that of Al, so that an alloy layer due to an intermetal bond with Al can be formed at the interface. Thereby, the bonding strength with the anode body 3 can be further strengthened.
  • the contact layer 15 may be made of a single element metal of the above element, may be made of an alloy such as bronze or brass, or may be a laminated metal layer of a plurality of different single elements (for example,). It may be a laminated structure of a Cu layer and an Ag layer).
  • the exterior body 14 does not contain a filler, or when the exterior body 14 contains a filler, the Young's modulus of the filler is smaller than the Young's modulus of the contact layer 15. As a result, the formation of the contact layer 15 on the surface of the exterior body 14 is suppressed, and the contact layer 15 can be selectively formed on the end surface of the first end portion 1a.
  • the contact layer 15 can be formed by, for example, a cold spray method, thermal spraying, plating, vapor deposition, or the like.
  • the cold spray method for example, solid metal particles are made to collide with the surface (first surface 14a and / or second surface 14b) of the exterior body 14 including the exposed surface of the first end portion 1a.
  • the metal particles are fixed to the surface by plastic deformation to form a contact layer 15 containing a metal constituting the metal particles on the end face of the first end portion 1a.
  • the Young's modulus of the metal particles is larger than the Young's modulus of the constituent member (for example, filler) of the exterior body 14, the metal particles colliding with the surface of the exterior body 14 are plastically deformed on the surface of the exterior body 14.
  • the contact layer 15 is selectively formed on the end surface of the first end portion 1a of the anode body 3, and the surface (first surface 14a and / or the second surface 14b) of the exterior body 14 is roughened. Can be done.
  • the anode electrode layer 16 may be interposed between the contact layer 15 and the external electrode (first external electrode 21 or second external electrode 22).
  • the anode electrode layer 16 covers the first surface 14a or the second surface 14b of the exterior body 14 and, if necessary, via the contact layer 15 with the first end portion 1a of the (plural) capacitor elements 10. Can be electrically connected.
  • the anode electrode layer 16 may include a conductive resin layer mixed with conductive particles.
  • the conductive resin layer can be formed by applying and drying a conductive paste containing conductive particles and a resin material on the first surface 14a or the second surface 14b of the exterior body 14.
  • the resin material is suitable for adhesion to the material constituting the exterior body 14 and the anode body 3 (contact layer 15), and the bonding strength can be increased by a chemical bond (for example, a hydrogen bond).
  • the conductive particles for example, metal particles such as silver and copper, and particles of a conductive inorganic material such as carbon can be used.
  • the anode electrode layer 16 may be a metal layer.
  • the anode electrode layer 16 may be formed by using an electrolytic plating method, a non-electrolytic plating method, a sputtering method, a vacuum vapor deposition method, a chemical vapor deposition (CVD) method, a cold spray method, or a thermal spraying method.
  • the anode electrode layer 16 may cover a part of a surface (for example, an upper surface or a bottom surface) orthogonal to the first surface 14a and the second surface 14b of the exterior body 14.
  • the roughness Ra of the surface of the exterior body 14 covered with the anode electrode layer 16 may be 5 micrometers or more. In this case, the contact area between the anode electrode layer 16 and the exterior body 14 is increased, and the adhesion between the anode electrode layer 16 and the exterior body 14 is improved by the anchor effect, and the reliability can be further improved.
  • the first to third external electrodes 21 to 23 are preferably a metal layer.
  • the metal layer is, for example, a plating layer.
  • the metal layer contains, for example, at least one selected from the group consisting of nickel (Ni), copper (Cu), zinc (Zn), tin (Sn), silver (Ag), and gold (Au).
  • film forming techniques such as electrolytic plating method, electroless plating method, sputtering method, vacuum vapor deposition method, chemical vapor deposition (CVD) method, cold spray method, and thermal spraying method are used. You may.
  • the first to third external electrodes 21 to 23 may have, for example, a laminated structure of a Ni layer and a tin layer.
  • the first to third external electrodes 21 to 23 may be made of a metal having at least an outer surface thereof having excellent wettability with solder. Examples of such a metal include Sn, Au, Ag, Pd and the like.
  • the external electrode may be formed by adhering a Cu cap having a Sn coating formed in advance to the anode electrode layer 16.
  • the first external electrode 21 and the second external electrode 22 both form an anode terminal of the electrolytic capacitor 11.
  • both the first external electrode 21 and the second external electrode 22 need to be connected to the electrodes on the substrate 17.
  • the first external electrode 21 and the second external electrode 22 may be electrically connected via the surface of the exterior body 14 other than the first surface 14a and the second surface 14b. .. In this case, when mounting the electrolytic capacitor 11 on the substrate 17, either the first external electrode 21 or the second external electrode 22 may be connected to the electrode on the substrate.
  • the electrolytic capacitor 11 includes, for example, a first step of preparing an anode 3, a second step of obtaining a plurality of capacitor elements 10, and an element laminate in which a plurality of capacitor elements 10 are laminated.
  • It can be manufactured by a manufacturing method including a sixth step of electrically connecting with and.
  • the manufacturing method may further include a step of arranging the separation layer 12 (insulating member) in a part of the anode body 3 (separation layer arrangement step).
  • the anode body 3 having the dielectric layer formed on the surface is prepared. More specifically, it comprises a first portion 1 including one end and a second portion 2 including the other end opposite to one end, and a dielectric on the surface of at least the second portion 2.
  • the layered anode 3 is prepared.
  • the first step includes, for example, a step of forming the porous portion 5 on the surface of the anode body 3 and a step of forming a dielectric layer on the surface of the porous portion 5. More specifically, the anode 3 used in the first step includes a first portion 1 including an end to be removed (one end thereof) and a second end 2a (the other end). It has a second portion 2. It is preferable to form the porous portion 5 on the surface of at least the second portion 2.
  • the porous portion 5 on the surface of the anode body 3 it suffices to form irregularities on the surface of the anode body 3, and for example, the surface of the anode foil is roughened by etching (for example, electrolytic etching). May be done by.
  • etching for example, electrolytic etching
  • the dielectric layer may be formed by chemical conversion treatment of the anode body 3.
  • the chemical conversion treatment for example, by immersing the anode body 3 in the chemical conversion liquid, the surface of the anode body 3 is impregnated with the chemical conversion liquid, and the anode body 3 is used as an anode and a voltage is applied between the anode body 3 and the cathode immersed in the chemical conversion liquid. Can be done by applying.
  • the porous portion 5 is provided on the surface of the anode body 3, the dielectric layer is formed along the uneven shape of the surface of the porous portion 5.
  • the step of arranging the separation layer 12 (insulating member) may be performed after the first step and before the second step.
  • an insulating member is arranged on a part of the anode body 3. More specifically, in this step, the insulating member is arranged on the first portion 1 of the anode body 3 via the dielectric layer. The insulating member is arranged so that the insulating member separates the first portion 1 from the cathode portion 6 formed in a subsequent step.
  • a sheet-shaped insulating member (resin tape or the like) may be attached to a part of the anode body 3 (for example, the first part 1). Even when the anode body 3 having the porous portion 5 formed on the surface is used, the insulating member can be firmly adhered to the first portion 1 by compressing and flattening the unevenness of the surface of the first portion 1. ..
  • the sheet-shaped insulating member preferably has an adhesive layer on the surface on the side to be attached to the first portion 1.
  • a liquid resin may be applied or impregnated into a part of the anode body 3 (for example, the first part 1) to form an insulating member.
  • the liquid resin may be applied or impregnated and then cured.
  • an insulating member that is in close contact with the first portion 1 can be easily formed.
  • the curable resin composition exemplified in the fourth step formation of the exterior body 14
  • a resin solution in which the resin is dissolved in a solvent, and the like can be used.
  • a liquid resin may be applied or impregnated on a part of the surface of the porous portion 5 of the anode body 3 (for example, the surface of the first portion 1). preferable.
  • the insulating member can be easily formed so as to fill the unevenness of the surface of the porous portion 5 of the first portion 1.
  • the liquid resin easily enters the recesses on the surface of the porous portion 5, and the insulating member can be easily formed in the recesses as well. As a result, the porous portion 5 on the surface of the anode body 3 is protected by the insulating member.
  • the porous portion 5 of the anode body 3 is protected. Collapse is suppressed. Since the surface of the porous portion 5 of the anode body 3 and the insulating member are firmly adhered to each other, when the anode body 3 is partially removed together with the exterior body 14 in the fourth step, the insulating member is the anode body 3. Peeling from the surface of the porous portion 5 is suppressed.
  • the cathode portion 6 is formed on the anode body 3 to obtain the capacitor element 10.
  • the insulating member is provided in the sixth step, the cathode portion 6 is formed in the portion of the anode body 3 where the insulating member is not arranged, and the capacitor element 10 is obtained. More specifically, in the second step, at least a part of the dielectric layer formed on the surface of the second portion 2 of the anode body 3 is covered with the cathode portion 6.
  • the step of forming the cathode portion 6 includes, for example, a step of forming a solid electrolyte covering at least a part of the dielectric and a step of forming a cathode drawer layer covering at least a part of the solid electrolyte layer 7.
  • the solid electrolyte layer 7 can be formed, for example, by chemically polymerizing and / or electrolytically polymerizing the raw material monomer on the dielectric layer. Further, the solid electrolyte layer 7 may be formed by attaching a treatment liquid containing a conductive polymer and then drying it.
  • the treatment liquid may further contain other components such as dopants.
  • the conductive polymer for example, poly (3,4-ethylenedioxythiophene) (PEDOT) is used.
  • the dopant for example, polystyrene sulfonic acid (PSS) is used.
  • the treatment liquid is a dispersion liquid or a solution of a conductive polymer. Examples of the dispersion medium (solvent) include water, an organic solvent, or a mixture thereof.
  • the cathode extraction layer can be formed, for example, by sequentially laminating the carbon layer 8 and the silver paste layer 9 on the solid electrolyte layer.
  • a plurality of capacitor elements 10 are laminated to obtain an element laminate.
  • the cathode portions 6 of the plurality of capacitor elements 10 are alternately provided with a conductive adhesive so that the first portion 1 faces the opposite side between the plurality of capacitor elements 10 and the adjacent capacitor elements 10.
  • the element laminate is obtained by superimposing the elements.
  • the element laminate is placed on a laminated substrate (board 17) having wiring patterns formed on the front surface and the back surface via a conductive adhesive.
  • a third external electrode 23 is preliminarily formed on the side opposite to the side on which the element laminate of the laminated substrate is placed. By mounting, the third external electrode 23 is a capacitor element constituting the element laminate via a wiring pattern formed on the laminated substrate and a through hole connecting the wiring pattern on the front surface and the wiring pattern on the back surface. It is electrically connected to the cathode portion 6 of 10.
  • a plate-shaped third external electrode 23 processed into a predetermined shape is attached to the surface of the cathode portion 6 exposed in the lowermost layer or the uppermost layer of the element laminate via a conductive paste or the like. Thereby, the element laminate and the third external electrode 23 may be electrically connected.
  • the third external electrode 23 may be formed by using an electrolytic plating method, a electroless plating method, a physical vapor deposition method, a chemical vapor deposition method, a cold spray method, and / or a thermal spraying method.
  • the element laminate is covered with the exterior body 14.
  • the entire third external electrode 23 is not covered with the exterior body 14, and at least a part of the third external electrode 23 is exposed.
  • the exterior body 14 can be formed by injection molding or the like.
  • the exterior body 14 can be formed by filling a predetermined portion with a curable resin composition or a thermoplastic resin (composition) so as to cover the element laminated body, for example, using a predetermined mold.
  • the curable resin composition may contain a filler, a curing agent, a polymerization initiator, and / or a catalyst in addition to the curable resin.
  • the curable resin include epoxy resin, phenol resin, urea resin, polyimide, polyamideimide, polyurethane, diallyl phthalate, and unsaturated polyester.
  • the thermoplastic resin include polyphenylene sulfide (PPS) and polybutylene terephthalate (PBT).
  • a thermoplastic resin composition containing a thermoplastic resin and a filler may be used.
  • the filler for example, insulating particles and / or fibers are preferable.
  • the insulating material constituting the filler include insulating compounds (oxide and the like) such as silica and alumina, glass, and mineral materials (talc, mica, clay and the like).
  • the exterior body 14 may contain one kind of these fillers, or may contain two or more kinds of these fillers in combination.
  • the end face of the first portion 1 is formed and exposed from the exterior body 14. More specifically, at least the anode body 3 is partially removed together with the exterior body 14 on both ends of the element laminate, and at least the first end portion 1a of the anode body 3 (specifically, the first end). The end face of the portion 1a) is exposed from the exterior body 14 on both sides of the first surface 14a and the second surface 14b.
  • exposing the first end portion 1a from the exterior body 14 for example, after covering the capacitor element 10 with the exterior body 14, the surface of the exterior body 14 is exposed so that the first end portion 1a is exposed from the exterior body 14.
  • a method of polishing or cutting off a part of the exterior body 14 can be mentioned. Further, a part of the first portion 1 may be separated together with a part of the exterior body 14. In this case, the first end portion 1a, which does not include the porous portion 5 and has a surface on which a natural oxide film is not formed, can be easily exposed from the exterior body 14, and the first portion 1 and the external electrode can be easily exposed. A highly reliable connection state with low resistance can be obtained. Dicing is preferable as a method for cutting the exterior body 14. As a result, the exposed end surface of the first end portion 1a of the first portion 1 appears on the cut surface.
  • the element laminate has two types of capacitor elements 10 in which the orientation of the first portion 1 is different, when a part of the first portion 1 is separated together with a part of the exterior body 14, it is necessary to cut at two places. be.
  • One of the two cut surfaces is the first surface 14a and the other is the second surface 14b.
  • the anode body 3 and the insulating member are partially removed together with the exterior body 14 on both ends of the element laminate, and the end face of the first end portion 1a and the end face of the insulating member are exposed from the exterior body 14. You may let me. In this case, flush end faces exposed from the exterior body 14 are formed on the anode body 3 and the insulating member, respectively. Thereby, the end surface of the anode body 3 flush with the surface of the exterior body 14 and the end surface of the insulating member can be easily exposed from the exterior body 14, respectively.
  • the end face of the anode body 3 (first end portion 1a) on which the natural oxide film is not formed can be easily exposed from the exterior body 14, and the anode body 3 (more specifically, the first end portion 1a) can be easily exposed.
  • a highly reliable connection state with low resistance can be obtained between 1 part 1) and the external electrode.
  • the end surface of the anode body 3 (first end portion 1a) exposed from the exterior body 14 is electrically connected to the external electrode.
  • the first external electrode 21 is formed so as to cover the first surface 14a of the exterior body 14
  • the second external electrode 22 is formed so as to cover the second surface 14b.
  • Each external electrode is electrically connected to the end face of the first end portion 1a.
  • the end face of the first end portion 1a may be electrically connected to the external electrode by bonding or the like, or an electrolytic plating method, a non-electrolytic plating method, a physical vapor deposition method, a chemical vapor deposition method, a cold spray method, and / or A thermal spraying method may be used.
  • the step of forming the anode electrode layer 16 covering the surface 14a or the second surface 14b may be performed.
  • the first external electrode 21 and the second external electrode 22 are formed so as to cover the anode electrode layer 16.
  • the contact layer 15 can be formed by, for example, a cold spray method, thermal spraying, plating, vapor deposition, or the like.
  • the contact layer 15 may be formed so as not to cover the first surface 14a and the second surface 14b of the exterior body 14 as much as possible, but to selectively cover the end surface of the first end portion 1a.
  • the contact layer 15 is formed by colliding metal particles with the end face of the first end portion 1a at high speed.
  • the metal particles may be metal particles having a lower ionization tendency than the metal constituting the anode 3.
  • the anode 3 is an Al foil
  • Cu particles can be mentioned as such metal particles.
  • the Cu particles that collide with the end face of the first end portion 1a at high speed can break through the natural oxide film (Al oxide film) formed on the end face and form a metal bond between Al and Cu.
  • Al oxide film natural oxide film
  • the surface of the contact layer 15 is covered with a Cu layer which is a non-valve acting metal. Since Cu has a lower ionization tendency than Al, the surface of the contact layer 15 is less likely to be oxidized, and electrical connection with an external electrode (or an anode electrode layer 16) can be reliably performed.
  • metal particles with a size of several ⁇ m to several tens of ⁇ m are accelerated from subsonic to supersonic by using compressed gas such as air, nitrogen, and helium, and used as a substrate in a solid state. It is a technique to form a metal film by colliding with each other.
  • the mechanism of adhesion of metal particles in the cold spray method has not been elucidated in some parts, but in general, the collision energy of metal particles causes plastic deformation of the metal particles or metal substrate, exposing a new surface on the metal surface. It is thought that it is activated by doing so.
  • the metal particles can also collide with the first surface 14a and the second surface 14b of the exterior body 14 made of a non-metal material, and the end surface of the separation layer 12 (insulating member).
  • the base material with which the metal particles collide is a resin base material
  • the bond between the metal particles and the resin base material is mainly due to the plastically deformed metal particles being fitted into the irregularities on the surface of the resin base material. It is considered to be a good joint. Therefore, in order to form a metal on the surface of the resin base material, (ia) the resin base material should have sufficient hardness and the collision energy should be efficiently used for the plastic deformation of the metal particles, and (iia) the metal particles.
  • the conditions are to select a metal material and processing conditions that are prone to plastic deformation, and (iiia) that the resin base material is not easily destroyed by the energy of collision.
  • the resin base material should be made elastic so that the collision energy is not converted into the energy of plastic deformation, and (iib) the end face of the first end portion 1a.
  • the young ratio of the metal particles is smaller than the young ratio of the member (for example, filler) constituting the resin base material, plastic deformation at the time of collision of the metal particles tends to be promoted, and when it is large, the metal particles of the metal particles tend to be deformed. Plastic deformation at the time of collision tends to be suppressed. In the latter case, the collision energy of the metal particles causes brittle fracture of the resin base material, and the surface of the resin base material is scraped off.
  • the member for example, filler
  • the Young's modulus of the metal particles (which may be rephrased as the contact layer 15) larger than the Young's modulus of the filler contained in the resin base material, it is possible to make the metal particles difficult to adhere to the resin base material. can.
  • the formation of the contact layer 15 on the first surface 14a and the second surface 14b of the exterior body 14 and the end faces of the separation layer 12 (insulating member) is suppressed, and the contact layer 15 is formed at the first end. It can be selectively formed on the end face of the portion 1a. Further, by colliding the metal particles with the first surface 14a and the second surface 14b of the exterior body 14, it is possible to obtain the effect of roughening the first surface 14a and the second surface 14b.
  • the fixing state changes depending on the shape, size, temperature of the metal particles, the size of the silica to be filled in the resin material, the filling rate, and the like, and is not limited to this.
  • the anode electrode layer 16 covers the end surface or the contact layer 15 of the first end portion 1a, and when the first surface 14a and the second surface 14b of the exterior body 14 and the separation layer 12 are provided, the separation layer 12 (insulation). It can be formed to cover the end face of the member).
  • the anode electrode layer 16 may be formed by applying a conductive paste containing conductive particles and a resin material. Specifically, a conductive paste (for example, silver paste) is applied to each end face by a dip method, a transfer method, a printing method, a dispense method, or the like, and then cured at a high temperature to form an anode electrode layer 16. do.
  • a conductive paste for example, silver paste
  • the anode electrode layer 16 which is a metal layer may be formed by an electrolytic plating method, a non-electrolytic plating method, a sputtering method, a vacuum vapor deposition method, a chemical vapor deposition (CVD) method, a cold spray method, or a thermal spraying method.
  • the capacitor 11A (predetermined capacitor) of the present modification 1 is a through capacitor.
  • the capacitor 11A includes a housing 24, two anode terminals 25 and 26, a penetrating portion 27, and at least one (four in FIG. 9) cathode terminals 28.
  • the two anode terminals 25 and 26 are exposed to the outside of the housing 24.
  • the two anode terminals 25 and 26 are electrically connected to the electric circuit 30.
  • the penetrating portion 27 is arranged inside the housing 24.
  • the penetration portion 27 electrically connects the two anode terminals 25 and 26.
  • the cathode terminal 28 is exposed to the outside of the housing 24.
  • the cathode terminal 28 is electrically connected to the ground (that is, the conductor pattern N3 of the ground potential).
  • the shape of the housing 24 is a rectangular parallelepiped.
  • the two anode terminals 25 and 26 are provided on two surfaces of the housing 24 facing each other.
  • Each of the plurality of cathode terminals 28 is provided on a surface (a surface facing the conductor pattern N3) different from the above two surfaces of the housing 24.
  • the shape of the penetrating portion 27 is, for example, a sheet shape or a wire shape.
  • the first end of the penetrating portion 27 is electrically connected to the anode terminal 25.
  • the second end of the penetrating portion 27 is electrically connected to the anode terminal 26.
  • the capacitor 11A further includes at least one internal ground electrode.
  • the internal ground electrode is arranged inside the housing 24.
  • the internal ground electrode is electrically connected to at least one cathode terminal 28.
  • the internal ground electrode faces the penetrating portion 27 at a distance from the penetrating portion 27.
  • a conductor pattern 321 and conductor patterns P2 and P3 are provided as a part of the second electric circuit 32.
  • the conductor pattern 321 is electrically connected to the first end of the DC / DC converter 43 (see FIG. 1) and the inductor 44.
  • the conductor pattern P2 is electrically connected to the second end of the inductor 44 and the anode terminal 25.
  • the conductor pattern P3 is electrically connected to the anode terminal 26 and the integrated circuit 41. Further, the integrated circuit 41 is electrically connected to the ground pattern (conductor pattern N3).
  • the penetrating portion 27 electrically connects the conductor patterns P2 and P3. That is, the penetrating portion 27 also serves as a part of the electric path 30 (second electric path 32).
  • the electric circuit 100A with an integrated circuit has such a configuration, but the equivalent circuit of the electric circuit 100A with an integrated circuit is the same as the electric circuit 100 with an integrated circuit (see FIG. 1) of the embodiment.
  • the capacitor 11 may have at least one of the configurations listed below.
  • the capacitor 11 may have an LW inversion type structure.
  • the LW inversion type capacitor has a rectangular shape when viewed from the direction facing the mounting surface, and external electrodes (first external electrode 21 and second external electrode 22) are provided on two sides along the longitudinal direction. Has a structure.
  • the capacitor 11 may have an LW inversion type structure and may be an alternating laminated capacitor as in the embodiment.
  • the capacitor 11 may be a multi-terminal capacitor having three or more external electrodes. Further, when connecting a plurality of multi-terminal capacitors in parallel, the multi-terminal capacitors adjacent to each other may be connected so that their polarities are opposite to each other. In other words, even if the multi-terminal capacitor facing in the positive direction and the multi-terminal capacitor facing in the opposite direction to the positive direction are arranged alternately with the direction of the multi-terminal capacitor in the direction of polarity as the positive direction. good. As a result, the magnetic flux generated by the multi-terminal capacitor can be effectively reduced, and the ESL can be effectively reduced.
  • the number of pairs of the first capacitor element 10a and the second capacitor element 10b is not limited to two, and may be one or three or more. Further, the first capacitor element 10a and the second capacitor element 10b are not limited to being alternately laminated, and a first laminated structure composed of a plurality of first capacitor elements 10a and a plurality of second capacitors are used. The second laminated structure composed of the capacitor element 10b may be alternately laminated.
  • the capacitor 11 may be electrically connected to the first electric circuit 31 and the ground. Further, a parallel circuit of a plurality of capacitors 11 may be electrically connected between the first electric path 31 and the ground. A parallel circuit of a plurality of capacitors 11 may be electrically connected between the second electric circuit 32 and the ground.
  • the capacitor 11 is arranged outside the package accommodating the integrated circuit 41, but it may be built in the package.
  • the integrated circuit 41 may be used in a quantum computer.
  • an AC power supply and an AC / DC converter that converts AC power input from the AC power supply into DC power and outputs it may be used.
  • the electric circuit (101, 101A) for power supply of the integrated circuit (41) includes an electric circuit (30) and at least one predetermined capacitor (11, 11A).
  • the electric circuit (30) supplies DC power from the power source (PS1) to the integrated circuit (41).
  • the predetermined capacitors (11, 11A) have predetermined characteristics.
  • the predetermined capacitors (11, 11A) are electrically connected to the electric circuit (30) and the ground.
  • the predetermined characteristic is that the impedance is 10 [m ⁇ ] or less at least when the frequency is 5 [MHz] or more and 10 [MHz] or less.
  • the number of capacitors used in the electric circuit (101, 101A) can be reduced.
  • the predetermined characteristic is that the frequency is 100 [kHz] or more and 10 [MHz] or less.
  • the impedance is 10 [m ⁇ ] or less.
  • the number of capacitors used in the electric circuit (101, 101A) can be reduced.
  • the electric circuit (101, 101A) for power supply of the integrated circuit (41) further includes a DC / DC converter (43) in the first or second aspect.
  • the DC / DC converter (43) is electrically connected between the power supply (PS1) and a predetermined capacitor (11, 11A).
  • a desired voltage can be supplied to the integrated circuit (41).
  • the switching frequency of the DC / DC converter (43) is 200 [kHz] or more. It is 10 [MHz] or less.
  • the AC component of the input voltage of the integrated circuit (41) can be limited.
  • the predetermined capacitor (11, 11A) and the integrated circuit (41) are used.
  • the wiring impedance between is smaller than the wiring impedance between the DC / DC converter (43) and the integrated circuit (41).
  • the harmonic component of the output voltage of the DC / DC converter (43) can be reduced by a predetermined capacitor (11, 11A).
  • the self of the predetermined capacitor (11, 11A) in any one of the first to fifth aspects, the self of the predetermined capacitor (11, 11A).
  • the resonance frequency (f0) is 300 [kHz] or more and 10 [GHz] or less.
  • the impedance of the predetermined capacitor (11, 11A) can be suppressed in the frequency band before and after the self-resonant frequency (f0).
  • a predetermined capacitor (11, 11A) is driven.
  • the voltage is 3.3 [V] or less.
  • the predetermined capacitors (11, 11A) are suitable for use in the electric circuit (30) electrically connected to the integrated circuit (41).
  • the predetermined capacitor (11) is an electrolytic capacitor. ..
  • the predetermined capacitor (11) includes an element laminate in which a plurality of capacitor elements (10) are laminated, an exterior body (14) that seals the element laminate, a first external electrode (21), and a second.
  • the external electrode (22) and the third external electrode (23) are provided.
  • Each of the plurality of capacitor elements (10) has an anode body (3), a dielectric layer, a cathode portion (6), a first end portion (1a), and a second end portion (2a). ..
  • the anode body (3) has a porous portion (5) on the surface.
  • the dielectric layer is formed on the surface of at least a part of the porous portion (5).
  • the cathode portion (6) covers at least a part of the dielectric layer.
  • the anode body (3) is exposed.
  • the anode (3) is covered with the cathode (6).
  • At least the end face of the first end portion (1a) is exposed from the exterior body (14).
  • the plurality of capacitor elements (10) include a first capacitor element (10a) and a second capacitor element (10b). In the first capacitor element (10a), the first end portion (1a) faces the first surface (14a) of the exterior body (14).
  • the first end portion (1a) faces the second surface (14b) different from the first surface (14a) of the exterior body (14).
  • the first capacitor element (10a) and the second capacitor element (10b) are alternately laminated.
  • the first end portion (1a) of the first capacitor element (10a) is electrically connected to the first external electrode (21).
  • the first end portion (1a) of the second capacitor element (10b) is electrically connected to the second external electrode (22).
  • the third external electrode (23) is electrically connected to the cathode portion (6) of the capacitor element (10).
  • the predetermined capacitor (11A) is a through capacitor. ..
  • the predetermined capacitor (11A) includes a housing (24), two anode terminals (25, 26), a penetration portion (27), and a cathode terminal (28).
  • the two anode terminals (25, 26) are exposed to the outside of the housing (24).
  • the two anode terminals (25, 26) are electrically connected to the electric circuit (30).
  • the penetration portion (27) is arranged inside the housing (24).
  • the penetration portion (27) electrically connects the two anode terminals (25, 26).
  • the cathode terminal (28) is exposed to the outside of the housing (24).
  • the cathode terminal (28) is electrically connected to the ground.
  • the electric circuit (30) is electrically connected to the electric circuit (30).
  • the number of predetermined capacitors (11, 11A) is one.
  • the number of predetermined capacitors (11, 11A) can be reduced.
  • the configuration other than the first aspect is not an essential configuration for the electric circuit (101, 101A) for power supply of the integrated circuit (41), and can be omitted as appropriate.
  • the capacitor (11, 11A) according to the eleventh aspect is a predetermined electric circuit (101, 101A) for power supply of the integrated circuit (41) according to any one of the first to ten aspects. It is used as a capacitor (11, 11A).
  • the number of capacitors used in the electric circuit (101, 101A) can be reduced.
  • the electric circuit with an integrated circuit (100, 100A) according to the twelfth aspect is an electric circuit (101, 101A) for supplying power to the integrated circuit (41) according to any one of the first to tenth aspects. And an integrated circuit (41).
  • the number of capacitors used in the electric circuit (101, 101A) can be reduced.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Filters And Equalizers (AREA)

Abstract

La présente invention concerne un circuit électrique (101) pour l'alimentation électrique d'un circuit intégré (41) qui comprend un trajet électrique (30) et au moins un condensateur prescrit (11). Le trajet électrique (30) fournit de l'énergie en courant continu au circuit intégré (41) à partir d'une alimentation électrique (PS1). Le condensateur prescrit (11) a des caractéristiques prescrites. Le condensateur prescrit (11) est électriquement connecté au trajet électrique (30) et au nuage. Le nombre de condensateurs peut être réduit par des caractéristiques prescrites comprenant au moins une caractéristique selon laquelle l'impédance à 5-10 MHz n'est pas supérieure à 10 mΩ.
PCT/JP2021/017083 2020-05-12 2021-04-28 Circuit électrique pour alimentation électrique de circuit intégré, condensateur et circuit électrique ayant un circuit intégré WO2021230089A1 (fr)

Applications Claiming Priority (2)

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JP2020084089A JP2023085583A (ja) 2020-05-12 2020-05-12 集積回路の電源供給用の電気回路、コンデンサ及び集積回路付電気回路
JP2020-084089 2020-05-12

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WO2021230089A1 true WO2021230089A1 (fr) 2021-11-18

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220406526A1 (en) * 2020-09-21 2022-12-22 Tdk Electronics Ag Capacitor
US11996239B2 (en) * 2020-09-21 2024-05-28 Tdk Electronics Ag Capacitor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352059A (ja) * 2005-05-18 2006-12-28 Matsushita Electric Ind Co Ltd デジタル信号処理基板
JP2007258478A (ja) * 2006-03-23 2007-10-04 Rohm Co Ltd 複合回路部品およびこれを備える半導体装置
JP2008022017A (ja) * 2003-05-06 2008-01-31 Marvell World Trade Ltd 超低インダクタンス多層セラミックコンデンサ
JP2008098462A (ja) * 2006-10-13 2008-04-24 Fujitsu Media Device Kk 固体電解コンデンサ
WO2009028183A1 (fr) * 2007-08-29 2009-03-05 Panasonic Corporation Condensateur électrolytique solide
JP3185175U (ja) * 2013-05-24 2013-08-01 アルプス電気株式会社 電源供給回路

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008022017A (ja) * 2003-05-06 2008-01-31 Marvell World Trade Ltd 超低インダクタンス多層セラミックコンデンサ
JP2006352059A (ja) * 2005-05-18 2006-12-28 Matsushita Electric Ind Co Ltd デジタル信号処理基板
JP2007258478A (ja) * 2006-03-23 2007-10-04 Rohm Co Ltd 複合回路部品およびこれを備える半導体装置
JP2008098462A (ja) * 2006-10-13 2008-04-24 Fujitsu Media Device Kk 固体電解コンデンサ
WO2009028183A1 (fr) * 2007-08-29 2009-03-05 Panasonic Corporation Condensateur électrolytique solide
JP3185175U (ja) * 2013-05-24 2013-08-01 アルプス電気株式会社 電源供給回路

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220406526A1 (en) * 2020-09-21 2022-12-22 Tdk Electronics Ag Capacitor
US11996239B2 (en) * 2020-09-21 2024-05-28 Tdk Electronics Ag Capacitor

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