WO2021221036A1 - 組成物の供給方法、組成物及びドライエッチング方法 - Google Patents
組成物の供給方法、組成物及びドライエッチング方法 Download PDFInfo
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- WO2021221036A1 WO2021221036A1 PCT/JP2021/016722 JP2021016722W WO2021221036A1 WO 2021221036 A1 WO2021221036 A1 WO 2021221036A1 JP 2021016722 W JP2021016722 W JP 2021016722W WO 2021221036 A1 WO2021221036 A1 WO 2021221036A1
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- Prior art keywords
- composition
- supplying
- trimethylamine
- volume
- gas
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 120
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000001312 dry etching Methods 0.000 title claims description 9
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims abstract description 148
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims abstract description 78
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims abstract description 71
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000007789 gas Substances 0.000 claims description 79
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 15
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 12
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 abstract description 9
- 239000012071 phase Substances 0.000 description 30
- 238000010926 purge Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 230000003247 decreasing effect Effects 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000617 Mangalloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- SPEUIVXLLWOEMJ-UHFFFAOYSA-N acetaldehyde dimethyl acetal Natural products COC(C)OC SPEUIVXLLWOEMJ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- -1 hexafluorosilicic acid Chemical compound 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 150000003956 methylamines Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/01—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms
- C07C211/02—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
- C07C211/03—Monoamines
- C07C211/04—Mono-, di- or tri-methylamine
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/01—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms
- C07C211/02—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
- C07C211/03—Monoamines
- C07C211/08—Monoamines containing alkyl groups having a different number of carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
Definitions
- the present disclosure relates to a method for supplying a composition containing trimethylamine and dimethylethylamine, a composition containing trimethylamine and dimethylethylamine, and a dry etching method.
- a raw material gas for semiconductor applications is required to be an ultra-high purity product in which impurity components are eliminated as much as possible.
- Amines such as trimethylamine are being studied as gases for high-speed and high-selective etching of silicon oxide films, but large-scale equipment is required and enormous time is required to purify amines to ultra-high purity. Often does not meet the cost benefits.
- trimethylamine forms a complicated azeotropic composition with dimethylamine and monomethylamine and is difficult to separate, and it is difficult to obtain only trimethylamine as a pure product (for example, Patent Document 1).
- composition azeotrope As a supply method using composition azeotrope, a method of supplying a mixture of hydrogen fluoride and ethanol has been reported (for example, Patent Document 2). However, as a supply method for amines, a method using composition azeotrope has not been known so far.
- the present inventors have formed a stable co-boiling composition with other methylamines such as monomethylamine and dimethylamine contained in a trace amount in trimethylamine by adding a small amount of dimethylethylamine to trimethylamine, and used it.
- a stable gas composition can be supplied regardless of the amount, and have completed the present invention.
- the method for supplying the composition of the present disclosure is a storage container in which a composition containing trimethylamine, dimethylethylamine, and at least one of dimethylamine and monomethylamine is sealed in a gas phase at 10 ° C. or higher. It is characterized in that the gas of the above composition is supplied to a predetermined device while being kept at a constant temperature.
- a composition containing trimethylamine, dimethylethylamine, and at least one of dimethylamine and monomethylamine can be supplied in a stable gas composition regardless of the amount used. ..
- the composition of the present disclosure is for use in the method for supplying the above-mentioned composition, and is characterized by containing trimethylamine, dimethylethylamine, and at least one of dimethylamine and monomethylamine in the gas phase. And. Since the composition of the present disclosure contains dimethylethylamine, trimethylamine can be supplied with a stable gas composition even when trimethylamine contains dimethylamine and / or monomethylamine as impurities. Further, since dimethylethylamine has a structure similar to that of trimethylamine, there is an advantage that when it is used as an etching gas, the influence of containing dimethylethylamine is small.
- the dry etching method of the present disclosure is characterized in that a gaseous composition and a gaseous hydrogen fluoride supplied by using the above-mentioned composition supply method are reacted with a silicon oxide without a plasma state. ..
- the gas of the composition having a stable composition containing trimethylamine is reacted with the silicon oxide by using the above-mentioned method of supplying the composition, so that the etching process can be stably performed.
- the method for supplying the composition of the present disclosure by adding a small amount of dimethylethylamine to trimethylamine, when trimethylamine is supplied at a temperature under a certain condition, the content of dimethylamine or monomethylamine contained as impurities is that of trimethylamine. Since it hardly fluctuates regardless of the amount used, trimethylamine can be supplied with a stable gas composition.
- a storage container containing a composition containing trimethylamine, dimethylethylamine, and at least one of dimethylamine and monomethylamine in the gas phase is kept warm at a constant temperature of 10 ° C. or higher.
- the gas of the above composition is supplied to a predetermined device.
- most of the weight of the composition containing trimethylamine or the like is in the liquid phase, and part of the composition is in the gas phase.
- the gas phase in the storage container that is, the gas of the composition is supplied to a predetermined device.
- the method for making this composition is particularly limited as long as the composition to be sealed in the storage container is a composition containing trimethylamine, dimethylethylamine, and at least one of dimethylamine and monomethylamine in the gas phase.
- the composition to be sealed in the storage container is a composition containing trimethylamine, dimethylethylamine, and at least one of dimethylamine and monomethylamine in the gas phase.
- dimethylethylamine it is preferable to add dimethylethylamine to trimethylamine.
- Trimethylamine and dimethylethylamine may be obtained by synthesis or purchased, and the method of obtaining them is not particularly limited.
- the trimethylamine used in the present disclosure those containing at least one of dimethylamine and monomethylamine as impurities can be used.
- the amount of dimethylethylamine to be added is preferably 1 to 500 ppm by weight, with the total amount of the composition being 100% by weight. More preferably, it is 1 to 100 ppm by weight.
- a method for adding dimethylethylamine to trimethylamine for example, a method known to those skilled in the art such as a pressure ratio mixing method, a gravimetric method, a half gravimetric method, and a flow-type mixing method is used. After adding trimethylamine and dimethylethylamine into the storage container, it is preferable to further mix them.
- the above mixing can be performed by, for example, shaking mixing, overturning mixing, or the like.
- the gas phase of the composition contains trimethylamine and dimethylethylamine, and further contains at least one of dimethylamine and monomethylamine. That is, the gas phase of the composition contains trimethylamine, dimethylethylamine and dimethylamine, contains trimethylamine, dimethylethylamine and monomethylamine, or contains trimethylamine, dimethylethylamine, dimethylamine and monomethylamine.
- trimethylamine is preferably contained in an amount of 95% by volume or more, more preferably 98% by volume or more, and further preferably 99% by volume or more.
- Dimethylethylamine is preferably contained in the gas phase of the above composition in an amount of 1 to 100% by volume, more preferably 1 to 50% by volume.
- Dimethylamine is preferably contained in the gas phase of the above composition in an amount of 0 to 1000% by volume, more preferably 0 to 400% by volume.
- the monomethylamine is preferably contained in the gas phase of the above composition in an amount of 0 to 100% by volume, more preferably 0 to 50% by volume.
- the gas phase of the composition contains 95% by volume or more of trimethylamine, 1 to 100% by volume of dimethylethylamine, 0 to 1000% by volume of dimethylamine, and 0 to 100% by volume of monomethylamine.
- the gas phase of the composition contains 95% by volume or more of trimethylamine, 1 to 50% by volume of dimethylethylamine, 0 to 400% by volume of dimethylamine, and 0 to 50% by volume of monomethylamine. ..
- the gas phase of the above composition may contain impurities other than monomethylamine and dimethylamine, and other impurities include water, an inert gas, ammonia, carbon monoxide, carbon dioxide, and methane. , Methanol.
- Moisture may be contained in the gas phase of the above composition in an amount of 1 to 1000 parts by volume ppm.
- the content of the inert gas is preferably 5% by volume or less in the gas phase of the above composition. More preferably, it is 1% by volume or less.
- the storage container in which the composition is sealed is kept at a constant temperature of 10 ° C. or higher. If the temperature is lower than 10 ° C., the gas composition in the gas phase in the storage container is not stable, and monomethylamine, dimethylamine, and dimethylethylamine before supplying the gas of the composition and after supplying a certain amount of gas. Concentration fluctuates greatly.
- the temperature at which the storage container is stored is preferably 10 to 50 ° C, more preferably 15 to 40 ° C.
- the storage container in which the above composition is sealed is not particularly limited, and any container may be used as long as it can store liquid trimethylamine or the like.
- a storage container for example, a container made of stainless steel (SUS), manganese steel, nickel steel, chrome molybdenum steel or the like is used.
- the method for keeping the storage container warm is not particularly limited, and a method known to those skilled in the art can be used.
- the storage container containing the above composition is kept warm at a constant temperature of 10 ° C. or higher, and then the gas of the composition is supplied to a predetermined device.
- the rate at which the gas of the composition is supplied is not particularly limited, and is preferably 1 to 5000 ml / min, more preferably 5 to 1000 ml / min.
- a supply unit for connecting the storage container containing the composition and the predetermined device is provided, and the gas of the composition is supplied from the storage container to the predetermined device. Is used directly.
- the predetermined device is not particularly limited, and examples thereof include an etching device for etching a silicon oxide film.
- the increase or decrease in the contents of trimethylamine, dimethylethylamine, dimethylamine and monomethylamine in the gas phase is before the start of supply. It is preferably within 10% as compared with. That is, using the method for supplying the composition of the present disclosure, 90% by weight was supplied based on the respective contents of trimethylamine, dimethylethylamine, dimethylamine and monomethylamine in the gas phase before the start of supply and the total amount of the composition. The difference from the respective contents of trimethylamine, dimethylethylamine, dimethylamine and monomethylamine in the subsequent gas phase can be within 10%.
- the present disclosure also relates to compositions containing trimethylamine, dimethylethylamine, and at least one of dimethylamine and monomethylamine in the gas phase for use in the methods of supplying the compositions described above.
- the present disclosure also comprises a dry etching method in which a gaseous composition and gaseous hydrogen fluoride supplied using the method for supplying the composition described above are reacted with a silicon oxide without a plasma state.
- the gas composition supplied by using the method for supplying the above-mentioned composition is the gas of the above-mentioned composition, which mainly contains trimethylamine, and further contains dimethylethylamine and at least one of dimethylamine and monomethylamine. include.
- gaseous trimethylamine and gaseous hydrogen fluoride are reacted with silicon oxide without causing a plasma state, dry etching of silicon oxide is performed without generating gas plasma.
- the dry etching method of the present disclosure is the first embodiment in which a gas of a composition containing gaseous hydrogen fluoride and trimethylamine is supplied to an etching apparatus and brought into contact with the silicon oxide to dry-etch the silicon oxide.
- the gas of the composition containing trimethylamine and the gaseous hydrogen fluoride can be separately supplied to the etching apparatus to be divided into a second embodiment in which the silicon oxide is dry-etched.
- the reaction compound finally produced is a trimethylamine salt of hexafluorosilicic acid, and the compound is sublimated into a gas at the same time as it is produced, or is thermally decomposed into a gas.
- the gas of the composition containing gaseous hydrogen fluoride and trimethylamine may be a hydrogen fluoride salt of the composition containing trimethylamine in part or in whole.
- the temperature at which the gas of the composition containing gaseous hydrogen fluoride and trimethylamine is brought into contact with the silicon oxide is preferably 200 ° C. or lower, more preferably 150 ° C. or lower, and 120 ° C. or lower. Is particularly preferable.
- the contact temperature is preferably 20 ° C. or higher, more preferably 50 ° C. or higher, and particularly preferably 80 ° C. or higher.
- the mixing ratio of the gas of the composition containing hydrogen fluoride and trimethylamine is a value obtained by dividing the total number of moles of the composition containing trimethylamine by the number of moles of hydrogen fluoride, and is preferably 0.001 or more and 100 or less, preferably 0.01. More than 10 or less is more preferable, and 0.1 or more and 5 or less is particularly preferable.
- the dry etching method of the present disclosure can be applied to etching a semiconductor substrate having a silicon oxide film.
- a silicon oxide is applied to a substrate to be processed in which both a silicon oxide film and a silicon nitride film are exposed. Only the film can be selectively etched.
- Example 1 A SUS container was filled with 1 kg of trimethylamine (TMA) having a purity of 99.9% by volume or more, and 15 mg of dimethylethylamine (DMEA) was added. While the container was kept at room temperature, the gas was discharged from the container after sufficient mixing, and the composition of the gas phase was analyzed. It contained a volume of ppm. The monomethylamine (MMA) concentration was less than 1 volume ppm. The composition analysis of the gas phase was performed by a gas chromatograph analyzer (GC-2014, manufactured by Shimadzu Corporation, detector: FID). The container was cooled to 15 ° C. and purged at a flow rate of 1000 ml / min.
- TMA trimethylamine
- DMEA dimethylethylamine
- TMA concentration was 99.9% by volume or more
- DMA concentration was 380% by volume ppm
- MMA concentration was less than 1 volume ppm
- DMEA concentration was 13% by volume ppm.
- Example 2 A SUS container was filled with 1 kg of trimethylamine (TMA) having a purity of 99.9% by volume or more, which was different from that of Example 1, 15 mg of dimethylethylamine (DMEA) was added, and after sufficient mixing, gas was discharged from the container and the gas was discharged.
- TMA trimethylamine
- DMEA dimethylethylamine
- the composition of the phase was analyzed. As a result, the composition was such that the DMA concentration of the gas phase was 12 volume ppm, the MMA concentration was less than 1 volume ppm, the DMEA concentration was 11 volume ppm, and the water concentration was 10 volume ppm. After that, purging was performed under the same conditions as in Example 1, and then composition analysis was performed. The results are shown in Table 1.
- Example 3 1 kg of trimethylamine (TMA) having a purity of 99.9% by volume or more different from that of Examples 1 and 2 was filled in a SUS container, 15 mg of dimethylethylamine (DMEA) was added, and the gas was discharged from the container after sufficient mixing.
- the composition of the gas phase was analyzed. As a result, the composition was such that the DMA concentration of the gas phase was 13 volume ppm, the MMA concentration was 45 volume ppm, the DMEA concentration was 5 volume ppm, and the water concentration was 1 volume ppm. Then, purging was performed under the same conditions as in Example 1 except that the container temperature was set to 40 ° C., and then composition analysis was performed. The results are shown in Table 1.
- Example 1 In Examples 1 and 2 in which DMEA was added to set the purge temperature to 15 ° C. and Example 3 in which the purge temperature was set to 40 ° C., the gas composition was compared with the gas composition before purging even after purging 90% by weight.
- the relative change amount ⁇ [(90% by weight post-use gas composition-pre-use gas composition) / pre-use gas composition] was increased or decreased by 0 to several%.
- Comparative Example 1 the concentration of DMA decreased by about 75% as the relative change amount ⁇ , and in Comparative Example 2, DMA decreased by about 82% as the relative change amount ⁇ .
- MMA decreased by about 79% as a relative change amount ⁇ . Further, in Comparative Example 3 in which DMEA was added but the purge temperature was 5 ° C., the concentration of DMA decreased by about 65% as the relative change amount ⁇ , and the concentration of DMEA increased by about 113% as the relative change amount ⁇ .
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Abstract
Description
本開示の組成物の供給方法によれば、トリメチルアミンと、ジメチルエチルアミンと、ジメチルアミン及びモノメチルアミンの少なくとも1種とを含む組成物を、使用量によらず安定したガス組成で供給することができる。
本開示の組成物は、ジメチルエチルアミンを含むので、トリメチルアミンが不純物としてジメチルアミン及び/又はモノメチルアミンを含む場合であっても、安定したガス組成でトリメチルアミンを供給することができる。また、ジメチルエチルアミンはトリメチルアミンと類似した構造であるため、エッチング用ガスとして用いた場合に、ジメチルエチルアミンを含有することによる影響が小さいという利点がある。
本開示のドライエッチング方法は、上述の組成物の供給方法を用いてトリメチルアミンを含む安定した組成からなる組成物のガスをシリコン酸化物に反応させるので、エッチング処理を安定して行うことができる。
トリメチルアミン等を含む組成物は、保存容器内ではその重量のうちほとんどが液相であり、一部が気相となっている。本開示の組成物の供給方法では、保存容器内の気相、すなわち組成物のガスを所定の装置に供給する。
トリメチルアミン及びジメチルエチルアミンを保存容器内に添加した後は、更に混合することが好ましい。上記混合は、例えば、振とう混和、転倒混和等で行うことができる。
ジメチルエチルアミンは、上記組成物の気相中に1~100体積ppm含まれることが好ましく、1~50体積ppm含まれることがより好ましい。
ジメチルアミンは、上記組成物の気相中に0~1000体積ppm含まれることが好ましく、0~400体積ppm含まれることがより好ましい。
モノメチルアミンは、上記組成物の気相中に0~100体積ppm含まれることが好ましく、0~50体積ppm含まれることがより好ましい。
本開示のより好ましい態様として、上記組成物の気相中にトリメチルアミンを95体積%以上、ジメチルエチルアミンを1~50体積ppm、ジメチルアミンを0~400体積ppm及びモノメチルアミンを0~50体積ppm含む。
保存容器を保温する方法としては特に限定されず、当業者に公知の方法等を用い得る。
組成物のガスを供給する速度は特に限定されず、1~5000ml/minが好ましく、5~1000ml/minがより好ましい。
組成物のガスを所定の装置に供給する方法としては、例えば、上記組成物を封入した保存容器と所定の装置とを連結する供給部を設けて、保存容器から所定の装置に組成物のガスを直接導入する方法が用いられる。
上記所定の装置としては特に限定されず、例えばシリコン酸化膜をエッチングするエッチング装置等が挙げられる。
本開示のエッチング方法では、気体のトリメチルアミンと気体のフッ化水素とを、プラズマ状態を伴わずにシリコン酸化物に反応させるので、ガスプラズマを発生させることなく、シリコン酸化物のドライエッチングを行う。
気体のフッ化水素及びトリメチルアミンを含む組成物のガスをシリコン酸化物に接触させる際の温度は、200℃以下であることが好ましく、150℃以下であることがより好ましく、120℃以下であることが特に好ましい。また、接触温度は20℃以上であることが好ましく、50℃以上であることがより好ましく、80℃以上であることが特に好ましい。
純度99.9体積%以上のトリメチルアミン(TMA)をSUS製容器に1kg充填し、15mgのジメチルエチルアミン(DMEA)を添加した。容器を室温に保った状態で、十分に混合した後に容器からガスを排出して気相の組成分析を行ったところ、DMEA濃度12体積ppm、ジメチルアミン(DMA)濃度387体積ppm、水分濃度410体積ppmを含んでいた。モノメチルアミン(MMA)濃度は1体積ppm未満であった。気相の組成分析は、ガスクロマトグラフ分析装置(GC-2014、株式会社島津製作所製、検出器:FID)で行った。容器を15℃まで冷却し、流量1000ml/minでパージを行った。容器中のTMAの残量が0.1kgとなったことを確認し(TMAを90重量%使用)、改めて気相の組成分析を行った。このときの気相の組成分析は、15℃に冷却した容器からパージしたガスについて、室温で行った。その結果、TMA濃度は99.9体積%以上、DMA濃度は380体積ppm、MMA濃度は1体積ppm未満、DMEA濃度は13体積ppmであった。結果を表1に示す。
実施例1と異なる純度99.9体積%以上のトリメチルアミン(TMA)をSUS製容器に1kg充填し、15mgのジメチルエチルアミン(DMEA)を添加し、十分に混合した後に容器からガスを排出して気相の組成分析を行った。その結果、気相のDMA濃度が12体積ppm、MMA濃度が1体積ppm未満、DMEA濃度が11体積ppm、水分濃度が10体積ppmの組成となっていた。この後、実施例1と同様の条件でパージを行い、その後組成分析を行った。結果を表1に示す。
実施例1及び2と異なる純度99.9体積%以上のトリメチルアミン(TMA)をSUS製容器に1kg充填し、15mgのジメチルエチルアミン(DMEA)を添加し、十分に混合した後に容器からガスを排出して気相の組成分析を行った。その結果、気相のDMA濃度が13体積ppm、MMA濃度が45体積ppm、DMEA濃度が5体積ppm、水分濃度が1体積ppmの組成となっていた。その後、容器温度を40℃とした以外は実施例1と同様の条件でパージを行い、その後組成分析を行った。結果を表1に示す。
DMEAを添加しなかった以外は、実施例1と同じトリメチルアミン(TMA)を用い、実施例1と同様の条件でパージを行い、その後組成分析を行った。結果を表1に示す。
DMEAを添加しなかった以外は、実施例3と同じトリメチルアミン(TMA)を用い、実施例1と同様の条件でパージを行い、その後組成分析を行った。結果を表1に示す。
実施例1と同じトリメチルアミン(TMA)を用い、実施例1と同様にジメチルエチルアミン(DMEA)15mgを添加し、その組成を分析したところ、表1に示す値となった。この後、容器温度を5℃に冷却し、実施例1と同様の条件でパージを行い、その後組成分析を行った。結果を表1に示す。
Claims (10)
- 気相中にトリメチルアミンと、ジメチルエチルアミンと、ジメチルアミン及びモノメチルアミンの少なくとも1種とを含む組成物を封入した保存容器を10℃以上の一定温度に保温して、前記組成物のガスを所定の装置に供給することを特徴とする組成物の供給方法。
- 前記気相中にトリメチルアミンを95体積%以上、ジメチルエチルアミンを1~100体積ppm、ジメチルアミンを0~1000体積ppm及びモノメチルアミンを0~100体積ppm含むことを特徴とする請求項1に記載の組成物の供給方法。
- 前記気相中にトリメチルアミンを95体積%以上、ジメチルエチルアミンを1~50体積ppm、ジメチルアミンを0~400体積ppm及びモノメチルアミンを0~50体積ppm含むことを特徴とする請求項1又は2に記載の組成物の供給方法。
- 前記保存容器を10~50℃の一定温度に保温する請求項1~3のいずれか1項に記載の組成物の供給方法。
- 前記保存容器を15~40℃の一定温度に保温する請求項1~4のいずれか1項に記載の組成物の供給方法。
- 前記組成物のガスを組成物の全量を基準として90重量%供給した後の、気相中のトリメチルアミン、ジメチルエチルアミン、ジメチルアミン及びモノメチルアミンの各含有量の増減が、供給開始前と比較して10%以内である請求項1~5のいずれか1項に記載の組成物の供給方法。
- 前記気相中にさらに水分を1~1000体積ppm含むことを特徴とする請求項1~6のいずれか1項に記載の組成物の供給方法。
- 前記気相中にさらに不活性ガスを含むことを特徴とする請求項1~7のいずれか1項に記載の組成物の供給方法。
- 請求項1~8のいずれか1項に記載の組成物の供給方法に使用するための、気相中にトリメチルアミンと、ジメチルエチルアミンと、ジメチルアミン及びモノメチルアミンの少なくとも1種とを含む組成物。
- 請求項1~8のいずれか1項に記載の組成物の供給方法を用いて供給された気体の組成物及び気体のフッ化水素を、プラズマ状態を伴わずにシリコン酸化物に反応させることを特徴とするドライエッチング方法。
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