WO2021217710A1 - 导电组件及显示装置 - Google Patents
导电组件及显示装置 Download PDFInfo
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- WO2021217710A1 WO2021217710A1 PCT/CN2020/089542 CN2020089542W WO2021217710A1 WO 2021217710 A1 WO2021217710 A1 WO 2021217710A1 CN 2020089542 W CN2020089542 W CN 2020089542W WO 2021217710 A1 WO2021217710 A1 WO 2021217710A1
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- WIPO (PCT)
- Prior art keywords
- wire
- narrowed portion
- insulating layer
- via hole
- conductive
- Prior art date
Links
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 86
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 230000006378 damage Effects 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 208000027418 Wounds and injury Diseases 0.000 description 4
- 208000014674 injury Diseases 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 208000013883 Blast injury Diseases 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
Definitions
- a first via hole 1 is provided corresponding to the end of the first metal wire M1 facing the second metal wire M2, and a second via hole 2 is provided corresponding to the end of the second metal wire M2 facing the first metal wire M1.
- the indium tin layer 3 is formed in the first via hole 1 and the second via hole 2 to electrically connect the first metal wire M1 and the second metal wire M2. Since the area of the indium tin oxide layer in the first via hole 1 and the second via hole 2 is small, the current flowing through the indium tin oxide layer in the first via hole 1 and the second via hole 2 will cause the indium tin oxide Layer 3 has a risk of injury.
- the purpose of the present application is to provide a conductive component and a display device to avoid explosion damage to the conductive blocks that are partially located in the first via hole and the second via hole and electrically connected to the first wire and the second wire.
- the present application provides a conductive component, the conductive component includes:
- a second wire at least one end of the second wire has a second narrowed portion, and an end of the second wire having the second narrowed portion faces an end of the first wire that has the first narrowed portion Extending, the first narrowed portion and the second narrowed portion are mutually engaged;
- a first insulating layer where the first insulating layer is located between the first wire and the second wire;
- a second insulating layer where the second insulating layer is located on a side of the second wire away from the first insulating layer
- a first via hole, the first via hole is provided corresponding to the first narrowed portion of the first wire and penetrates the first insulating layer and the second insulating layer, so that the first narrowed portion Reveal
- a second via hole, the second via hole is provided corresponding to the second narrowed portion of the second wire and penetrates the second insulating layer, so that the second narrowed portion is exposed;
- the conductive block is located on the side of the second insulating layer away from the second wire, and the conductive block is formed in the first via hole, the second via hole and the second On the insulating layer, electrically connecting the first wire and the second wire;
- the conductive block is made of indium tin oxide or indium tin oxide.
- the length of the first narrowed portion is equal to the length of the second narrowed portion
- the width of the first narrowed portion is equal to the width of the second narrowed portion
- the first via hole is arranged corresponding to the middle position of the length of the first narrowed portion
- the second via hole is arranged corresponding to the middle position of the length of the second narrowed portion.
- the first wire has a first notch at one end of the first narrowed portion, the first notch is located on one side of the first narrowed portion, and the second wire has One end of the second narrowed portion has a second notch, the second notch is located on one side of the second narrowed portion, the second narrowed portion is located in the first notch, and the first narrowed portion The narrow part is located in the second gap.
- opposite ends of the second wire have the second narrowed portion, and the second narrowed portion at one end of the second wire is connected to the first wire of the first wire.
- One narrowed portion is electrically connected by one of the conductive blocks, and the second narrowed portion at the other end of the second wire and the first narrowed portion of the other first wire pass through the other one.
- the conductive block is electrically connected.
- a conductive component comprising:
- a first wire, one end of the first wire has a first narrowed portion
- a second wire at least one end of the second wire has a second narrowed portion, and an end of the second wire having the second narrowed portion faces an end of the first wire that has the first narrowed portion Extending, the first narrowed portion and the second narrowed portion are mutually engaged;
- a first insulating layer where the first insulating layer is located between the first wire and the second wire;
- a second insulating layer where the second insulating layer is located on a side of the second wire away from the first insulating layer
- a second via hole, the second via hole is provided corresponding to the second narrowed portion of the second wire and penetrates the second insulating layer, so that the second narrowed portion is exposed;
- the conductive block is located on the side of the second insulating layer away from the second wire, and the conductive block is formed in the first via hole, the second via hole and the second On the insulating layer, the first wire and the second wire are electrically connected.
- the length of the first narrowed portion is equal to the length of the second narrowed portion
- the width of the first narrowed portion is equal to the width of the second narrowed portion
- opposite ends of the second wire have the second narrowed portion, and the second narrowed portion at one end of the second wire is connected to the first wire of the first wire.
- One narrowed portion is electrically connected by one of the conductive blocks, and the second narrowed portion at the other end of the second wire and the first narrowed portion of the other first wire pass through the other one.
- the conductive block is electrically connected.
- the conductive component is a conductive pad.
- the first wire and the second wire are located on the same straight line.
- a display device the display device includes a conductive component, and the conductive component includes:
- a first insulating layer where the first insulating layer is located between the first wire and the second wire;
- a first via hole, the first via hole is provided corresponding to the first narrowed portion of the first wire and penetrates the first insulating layer and the second insulating layer, so that the first narrowed portion Reveal
- a second via hole, the second via hole is provided corresponding to the second narrowed portion of the second wire and penetrates the second insulating layer, so that the second narrowed portion is exposed;
- the conductive block is located on the side of the second insulating layer away from the second wire, and the conductive block is formed in the first via hole, the second via hole and the second On the insulating layer, the first wire and the second wire are electrically connected.
- the length of the first narrowed portion is equal to the length of the second narrowed portion
- the width of the first narrowed portion is equal to the width of the second narrowed portion
- the first via hole is arranged corresponding to the middle position of the length of the first narrowed portion
- the second via hole is arranged corresponding to the middle position of the length of the second narrowed portion.
- one end of the first wire having the first narrowed portion has a first notch, the first notch is located on one side of the first narrowed portion, and the second wire has One end of the second narrowed portion has a second notch, the second notch is located on one side of the second narrowed portion, the second narrowed portion is located in the first notch, and the first narrowed portion The narrow part is located in the second gap.
- opposite ends of the second wire have the second narrowed portion, and the second narrowed portion at one end of the second wire is connected to the first wire of the first wire.
- One narrowed portion is electrically connected by one of the conductive blocks, and the second narrowed portion at the other end of the second wire and the first narrowed portion of the other first wire pass through the other one.
- the conductive block is electrically connected.
- the conductive element is arranged in a non-display area of the display device.
- the conductive component is a conductive pad.
- the first wire and the second wire are located on the same straight line.
- one end of the first wire and one end of the second wire are interlocked with each other to increase the layout space of the first via hole and the second via hole, thereby increasing the conductive blocks in the first via hole and the second via hole.
- the area is large to avoid the problem of explosion damage to the conductive block.
- FIG. 1 is a schematic plan view of a first metal wire and a second metal wire of a conventional display panel connected through an indium tin oxide layer;
- Figure 4 is a schematic cross-sectional view taken along the B-B tangent line in Figure 3;
- FIG. 5 is a schematic plan view of a conductive component according to a second embodiment of the application.
- FIG. 6 is a schematic plan view of a conductive component according to a third embodiment of the application.
- FIG. 3 is a schematic plan view of the conductive component according to the first embodiment of the application
- FIG. 4 is a schematic cross-sectional view taken along the line B-B in FIG. 3.
- the conductive component 100 includes a first wire 11, a second wire 12, a first insulating layer 13, a second insulating layer 14, a first via 16 a, a second via 16 b, and a conductive block 15.
- the first notch 11a cooperates with the second narrowed portion 121, the size of the first notch 11a is the same as the size of the second narrowed portion 121, the first notch 11a and the second narrowed portion 121 are both rectangular, that is, the first notch
- the length of 11 a is the same as the length of the second narrowed portion 121, and the width of the first notch 11 a is the same as the width of the second narrowed portion 121.
- the preparation material of the first wire 11 is selected from at least one of molybdenum, aluminum, titanium, copper, and silver.
- At least one end of the second wire 12 has a second narrowed portion 121.
- the end of the second wire 12 having the second narrowed portion 121 extends to the end of the first wire 11 having the first narrowed portion 111, and the first narrowed portion 111 and the second narrowed portion 121 are engaged with each other.
- one end of the second wire 12 with the second narrowed portion 121 has a second notch 12a, the second notch 12a is located on one side of the second narrowed portion 121, and the second narrowed portion 121 is located in the first notch 11a .
- the second notch 12a is matched with the first narrowed part 111, the second notch 12a and the first narrowed part 111 are both rectangular, the length of the second notch 12a is equal to the length of the first narrowed part 111, and the length of the second notch 12a is equal to the length of the first narrowed part 111.
- the width is equal to the width of the first narrowed portion 111.
- the preparation material of the second wire 12 is selected from at least one of molybdenum, aluminum, titanium, copper, and silver.
- the first insulating layer 13 is located between the first wire 11 and the second wire 12 to insulate the first wire 11 and the second wire 12.
- the thickness of the first insulating layer 13 is 800 angstroms to 2000 angstroms, for example, 1500 angstroms, and the material of the first insulating layer is silicon nitride or silicon oxide.
- the second insulating layer 14 is located on the side of the second wire 12 away from the first insulating layer 13.
- the second insulating layer 14 insulates the second wire 12 and the conductive block 15.
- the thickness of the second insulating layer 14 is 3000 angstroms to 6000 angstroms.
- the preparation material of the second insulating layer 14 is silicon nitride or silicon oxide.
- the first via 16a is provided corresponding to the first narrowed portion 111 of the first wire 11 and penetrates the first insulating layer 13 and the second insulating layer 14 so that the first narrowed portion 1111 is exposed.
- the second via hole 16 b is provided corresponding to the second narrowed portion 121 of the second wire 12 and penetrates the second insulating layer 14 to expose the second narrowed portion 121.
- the conductive block 15 is located on the side of the second insulating layer 14 away from the second wire 12, and the conductive block 15 is formed in the first via 16a, the second via 16b, and on the second insulating layer 14 to electrically connect the first wire 11 and second wire 12.
- the conductive block 15 is a monolithic conductive layer, and the material of the conductive block 15 is indium tin oxide or indium tin oxide.
- the first wire 11 and the second wire 12 are located on the same straight line.
- the length of the first narrowed portion 111 is equal to the length of the second narrowed portion 121, and the width of the first narrowed portion 111 is equal to the width of the second narrowed portion 121.
- the length of the first narrowed portion 111 is greater than the width of the first narrowed portion 111, so that the number of the first vias 16a subsequently provided corresponding to the first narrowed portion 111 increases, and the length of the second narrowed portion 121 is greater than that of the second narrowed portion.
- the width of the narrowed portion 121 is increased to increase the number of second vias 16b that are subsequently provided corresponding to the second narrowed portion 121, and the area of the conductive block 15 in the first via 16a and the second via 16b is increased to avoid conduction. Block 15 appears to be wounded.
- the first via hole 16a is set corresponding to the middle position of the length of the first narrowed portion 111
- the second via hole 16b is set corresponding to the middle position of the length of the second narrowed portion 121, so that the first via 16a and the second via 16b have an appropriate number, and are respectively provided at both ends of the length of the first narrowed portion 111 and the length of the second narrowed portion 121 with respect to the first via 16a and the second via 16b. Both ends can reduce the probability of the conductive block 15 being injured.
- FIG. 5 is a schematic plan view of a conductive component according to a second embodiment of the application.
- the conductive component shown in FIG. 5 is basically similar to the conductive component shown in FIG. 3, except that the first via 16a corresponds to the length of the entire first narrowed portion 111, and the second via 16b corresponds to the entire second narrowed portion.
- the length of 121 is set to maximize the number of the first via 16a and the second via 16b, so as to maximize the area of the conductive block 15 in the first via 16a and the second via 16b.
- the increase in the number of the first via 16a and the second via 16b also increases the number of the conductive block 15 Probability of injury.
- FIG. 6 is a schematic plan view of a conductive component according to a third embodiment of the application.
- the conductive component shown in FIG. 6 is basically similar to the conductive component shown in FIG. 3, except that the opposite ends of the second wire 12 have a second narrowed portion 121, and the second narrowed portion 121 at one end of the second wire 12 It is electrically connected to the first narrowed portion 111 of a first wire 11 through a conductive block 15, and the second narrowed portion 121 at the other end of the second wire 12 passes through the first narrowed portion 111 of the other first wire 11
- the other conductive block 15 is electrically connected.
- the two first wires 11 located on the same layer are electrically bridged by a second wire 12 to avoid a short circuit between the first wire 11 and the conductive device that needs to be avoided.
- the application also provides a display device.
- the display device may be a liquid crystal display device.
- the display device includes a conductive component, and the conductive component can be arranged in a non-display area of the display device.
- the conductive component may constitute a conductive pad of the display device, and the conductive pad is used to input data signals or scan control signals.
- Conductive components can also constitute wires for transmitting data signals.
- Conductive components include:
- the second wire at least one end of the second wire has a second narrowed portion, the end of the second wire with the second narrowed portion extends to the end of the first wire with the first narrowed portion, the first narrowed portion and the second narrowed portion
- the narrowed parts bite into each other;
- a second insulating layer, the second insulating layer is located on the side of the second wire away from the first insulating layer;
- a second via hole, the second via hole is provided corresponding to the second narrowed portion of the second wire and penetrates the second insulating layer, so that the second narrowed portion is exposed;
- the conductive block is located on the side of the second insulating layer away from the second wire.
- the conductive block is formed in the first via hole, in the second via hole and on the second insulating layer to electrically connect the first wire and the second wire. wire.
- the display area of the display device is provided with multiple scan lines and multiple data lines.
- the first conductive line and the plurality of scan lines are located on the same metal layer, and the second conductive line and the multiple data lines are located on the same metal layer.
- the first insulating layer is a gate insulating layer, the thickness of the gate insulating layer is 800 angstroms to 2000 angstroms, and the preparation material of the gate insulating layer is silicon nitride or silicon oxide.
- the second insulating layer is an interlayer insulating layer, and the thickness of the interlayer insulating layer is 3000 angstroms to 6000 angstroms.
- the preparation material of the interlayer insulating layer is silicon nitride or silicon oxide.
- the length of the first narrowed portion is equal to the length of the second narrowed portion
- the width of the first narrowed portion is equal to the width of the second narrowed portion, so that the first narrowed portion and the second narrowed portion
- the portions are arranged symmetrically, and it is advantageous for the first narrowed portion and the second narrowed portion to be electrically connected through the conductive blocks in the first via hole and the second via hole.
- the end of the first wire with the first narrowed portion has a first notch
- the first notch is located on one side of the first narrowed portion
- the end of the second wire with the second narrowed portion has a first notch.
- the edge of the second narrowed part away from the first narrowed part is flush with the edge of the first narrowed part away from the first narrowed part, the edge of the first narrowed part away from the second narrowed part and the second notch away from the first narrowed edge
- the edges of the part are flush, that is, the first narrowed part is matched with the second notch, and the second narrowed part is matched with the first notch.
- the shape and size of the first via hole and the second via hole are the same.
- the shape of the first via hole may be a square with a size of 12 ⁇ m ⁇ 12 ⁇ m.
- the shape of the first via hole may also be circular.
- the first via hole is set at an intermediate position corresponding to the length of the first narrowed portion
- the second via hole is set at an intermediate position corresponding to the length of the second narrowed portion.
- the first via hole corresponding to the entire first narrowed portion, and the second via hole corresponding to the entire second narrowed portion it is possible to prevent the conductive block from exploding due to the excessive number of first vias and second vias. Riskier issues. Relative to the two ends corresponding to the first narrowing portion, the first via hole is provided, and the second via hole is provided corresponding to the two ends of the second narrowing portion. It is beneficial to reduce the risk of injury from the conductive block.
- the opposite ends of the second wire have second narrowed portions, and the second narrowed portion at one end of the second wire is electrically connected to the first narrowed portion of a first wire through a conductive block.
- the second narrowed portion at the other end of the second wire is electrically connected to the first narrowed portion of the other first wire through another conductive block.
- the two first wires are bridged by a second wire to avoid short circuits between the first wires and the devices that need to be avoided between the two first wires.
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
一种导电组件(100)及显示装置，导电组件(100)包括：第一导线(11)，第一导线(11)的一端具有第一收窄部(111)；第二导线(12)，第二导线(12)的至少一端具有第二收窄部(121)，第二导线(12)具有第二收窄部(121)的一端向第一导线(11)具有第一收窄部(111)的一端延伸，第一收窄部(111)和第二收窄部(121)相互咬合；第一收窄部(111)和第二收窄部(121)通过导电块(15)桥接。
Description
本申请涉及显示技术领域，尤其涉及一种导电组件及显示装置。
如图1所示，其为传统显示面板的第一金属线和第二金属线通过氧化铟锡层连接的平面示意图。如图2所示，其为沿图1中A-A切线的截面示意图。第一金属线M1和第二金属线M2位于同一条直线上，第一金属线M1和第二金属线M2位于不同层，第一金属线M1与第二金属线M2正对的一端的宽度等于第二金属线M2与第一金属线M1正对的一端的宽度。对应第一金属线M1正对第二金属线M2的一端设置有第一过孔1，对应第二金属线M2正对第一金属线M1的一端设置有第二过孔2，整块的氧化铟锡层3形成于第一过孔1和第二过孔2中以电性连接第一金属线M1和第二金属线M2。由于第一过孔1和第二过孔2中的氧化铟锡层的面积较小，流过第一过孔1和第二过孔2中的氧化铟锡层的电流较大会导致氧化铟锡层3有炸伤的风险。
因此，有必要提出一种技术方案以解决氧化铟锡层炸伤的问题。
本申请的目的在于提供一种导电组件及显示装置，以避免部分位于第一过孔和第二过孔中且电性连接第一导线和第二导线的导电块出现炸伤。
为实现上述目的，本申请提供一种导电组件，所述导电组件包括：
第一导线，所述第一导线的一端具有第一收窄部；
第二导线，所述第二导线的至少一端具有第二收窄部，所述第二导线具有所述第二收窄部的一端向所述第一导线具有所述第一收窄部的一端延伸，所述第一收窄部和所述第二收窄部相互咬合；
第一绝缘层，所述第一绝缘层位于所述第一导线和所述第二导线之间；
第二绝缘层，所述第二绝缘层位于所述第二导线远离所述第一绝缘层的一侧；
第一过孔，所述第一过孔对应所述第一导线的所述第一收窄部设置且贯穿所述第一绝缘层和所述第二绝缘层，使所述第一收窄部显露；
第二过孔，所述第二过孔对应所述第二导线的所述第二收窄部设置且贯穿所述第二绝缘层，使所述第二收窄部显露；
导电块，所述导电块位于所述第二绝缘层远离所述第二导线的一侧，所述导电块形成于所述第一过孔中、所述第二过孔中以及所述第二绝缘层上，以电性连接所述第一导线和所述第二导线；
所述第一导线的制备材料选自钼、铝、钛、铜以及银中的至少一种，所述第二导线的制备材料选自钼、铝、钛、铜以及银中的至少一种，
所述导电块的制备材料为氧化铟锡或氧化铟锡。
在上述导电组件中，所述第一收窄部的长度等于所述第二收窄部的长度，所述第一收窄部的宽度等于所述第二收窄部的宽度。
在上述导电组件中，所述第一过孔对应所述第一收窄部的长度上的中间位置设置，所述第二过孔对应所述第二收窄部长度上的中间位置设置。
在上述导电组件中，所述第一导线具有所述第一收窄部的一端具有一个第一缺口，所述第一缺口位于所述第一收窄部的一侧，所述第二导线具有所述第二收窄部的一端具有一个第二缺口，所述第二缺口位于所述第二收窄部的一侧，所述第二收窄部位于第一缺口中，所述第一收窄部位于所述第二缺口中。
在上述导电组件中，所述第二导线的相对两端均具有所述第二收窄部，所述第二导线一端的所述第二收窄部与一个所述第一导线的所述第一收窄部通过一个所述导电块电性连接，所述第二导线另一端的所述第二收窄部与另一个所述第一导线的所述第一收窄部通过另一个所述导电块电性连接。
一种导电组件，所述导电组件包括：
第一导线，所述第一导线的一端具有第一收窄部；
第二导线，所述第二导线的至少一端具有第二收窄部，所述第二导线具有所述第二收窄部的一端向所述第一导线具有所述第一收窄部的一端延伸，所述第一收窄部和所述第二收窄部相互咬合；
第一绝缘层，所述第一绝缘层位于所述第一导线和所述第二导线之间；
第二绝缘层，所述第二绝缘层位于所述第二导线远离所述第一绝缘层的一侧；
第一过孔，所述第一过孔对应所述第一导线的所述第一收窄部设置且贯穿所述第一绝缘层和所述第二绝缘层，使所述第一收窄部显露；
第二过孔，所述第二过孔对应所述第二导线的所述第二收窄部设置且贯穿所述第二绝缘层，使所述第二收窄部显露；
导电块，所述导电块位于所述第二绝缘层远离所述第二导线的一侧，所述导电块形成于所述第一过孔中、所述第二过孔中以及所述第二绝缘层上，以电性连接所述第一导线和所述第二导线。
在上述导电组件中，所述第一收窄部的长度等于所述第二收窄部的长度，所述第一收窄部的宽度等于所述第二收窄部的宽度。
在上述导电组件中，所述第一过孔对应所述第一收窄部的长度上的中间位置设置，所述第二过孔对应所述第二收窄部长度上的中间位置设置。
在上述导电组件中，所述第一导线具有所述第一收窄部的一端具有一个第一缺口，所述第一缺口位于所述第一收窄部的一侧，所述第二导线具有所述第二收窄部的一端具有一个第二缺口，所述第二缺口位于所述第二收窄部的一侧，所述第二收窄部位于第一缺口中，所述第一收窄部位于所述第二缺口中。
在上述导电组件中，所述第二导线的相对两端均具有所述第二收窄部，所述第二导线一端的所述第二收窄部与一个所述第一导线的所述第一收窄部通过一个所述导电块电性连接，所述第二导线另一端的所述第二收窄部与另一个所述第一导线的所述第一收窄部通过另一个所述导电块电性连接。
在上述导电组件中，所述导电组件为导电焊盘。
在上述导电组件中，所述第一导线和所述第二导线位于同一条直线上。
一种显示装置，所述显示装置包括导电组件，所述导电组件包括：
第一导线，所述第一导线的一端具有第一收窄部；
第二导线，所述第二导线的至少一端具有第二收窄部，所述第二导线具有所述第二收窄部的一端向所述第一导线具有所述第一收窄部的一端延伸，所述第一收窄部和所述第二收窄部相互咬合；
第一绝缘层，所述第一绝缘层位于所述第一导线和所述第二导线之间；
第二绝缘层，所述第二绝缘层位于所述第二导线远离所述第一绝缘层的一侧；
第一过孔，所述第一过孔对应所述第一导线的所述第一收窄部设置且贯穿所述第一绝缘层和所述第二绝缘层，使所述第一收窄部显露；
第二过孔，所述第二过孔对应所述第二导线的所述第二收窄部设置且贯穿所述第二绝缘层，使所述第二收窄部显露；
导电块，所述导电块位于所述第二绝缘层远离所述第二导线的一侧，所述导电块形成于所述第一过孔中、所述第二过孔中以及所述第二绝缘层上，以电性连接所述第一导线和所述第二导线。
在上述显示装置中，所述第一收窄部的长度等于所述第二收窄部的长度，所述第一收窄部的宽度等于所述第二收窄部的宽度。
在上述显示装置中，所述第一过孔对应所述第一收窄部的长度上的中间位置设置，所述第二过孔对应所述第二收窄部长度上的中间位置设置。
在上述显示装置中，所述第一导线具有所述第一收窄部的一端具有一个第一缺口，所述第一缺口位于所述第一收窄部的一侧，所述第二导线具有所述第二收窄部的一端具有一个第二缺口，所述第二缺口位于所述第二收窄部的一侧，所述第二收窄部位于第一缺口中，所述第一收窄部位于所述第二缺口中。
在上述显示装置中，所述第二导线的相对两端均具有所述第二收窄部，所述第二导线一端的所述第二收窄部与一个所述第一导线的所述第一收窄部通过一个所述导电块电性连接，所述第二导线另一端的所述第二收窄部与另一个所述第一导线的所述第一收窄部通过另一个所述导电块电性连接。
在上述显示装置中，所述导电组件设置于所述显示装置的非显示区。
在上述显示装置中，所述导电组件为导电焊盘。
在上述显示装置中，所述第一导线和所述第二导线位于同一条直线上。
本申请提供一种导电组件及显示装置，导电组件包括：第一导线，第一导线的一端具有第一收窄部；第二导线，第二导线的至少一端具有第二收窄部，第二导线具有第二收窄部的一端向第一导线具有第一收窄部的一端延伸，第一收窄部和第二收窄部相互咬合；第一绝缘层，第一绝缘层位于第一导线和第二导线之间；第二绝缘层，第二绝缘层位于第二导线远离第一绝缘层的一侧；第一过孔，第一过孔对应第一导线的第一收窄部设置且贯穿第一绝缘层和第二绝缘层，使第一收窄部显露；第二过孔，第二过孔对应第二导线的第二收窄部设置且贯穿第二绝缘层，使第二收窄部显露；导电块，导电块位于第二绝缘层远离第二导线的一侧，导电块形成于第一过孔中、第二过孔中以及第二绝缘层上，以电性连接第一导线和第二导线。相对于传统技术，通过第一导线的一端和第二导线的一端相互咬合，以增加第一过孔和第二过孔的布设空间，从而增加第一过孔和第二过孔中的导电块的面积，避免导电块出现炸伤的问题。
图1为传统显示面板的第一金属线和第二金属线通过氧化铟锡层连接的平面示意图；
图2为沿图1中A-A切线的截面示意图；
图3为本申请第一实施例导电组件的平面示意图；
图4为沿图3中B-B切线的截面示意图；
图5为本申请第二实施例导电组件的平面示意图；
图6为本申请第三实施例导电组件的平面示意图。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图3以及图4，图3为本申请第一实施例导电组件的平面示意图，图4为沿图3中B-B切线的截面示意图。导电组件100包括第一导线11、第二导线12、第一绝缘层13、第二绝缘层14、第一过孔16a、第二过孔16b以及导电块15。
第一导线11的一端具有第一收窄部111。第一导线11的另一端的宽度大于第一收窄部111的宽度。具体地，第一导线11具有第一收窄部111的一端具有一个第一缺口11a，第一缺口11a位于第一收窄部111的一侧。第一缺口11a与第二收窄部121相配合，第一缺口11a的尺寸与第二收窄部121的尺寸相同，第一缺口11a与第二收窄部121均为矩形，即第一缺口11a的长度与第二收窄部121的长度相同，第一缺口11a的宽度与第二收窄部121的宽度相同。第一导线11的制备材料选自钼、铝、钛、铜以及银中的至少一种。
第二导线12的至少一端具有第二收窄部121。第二导线12具有第二收窄部121的一端向第一导线11具有第一收窄部111的一端延伸，第一收窄部111和第二收窄部121相互咬合。具体地，第二导线12具有第二收窄部121的一端具有一个第二缺口12a，第二缺口12a位于第二收窄部121的一侧，第二收窄部121位于第一缺口11a中。第二缺口12a与第一收窄部111相配合，第二缺口12a与第一收窄部111均为矩形，第二缺口12a的长度等于第一收窄部111的长度，第二缺口12a的宽度等于第一收窄部111的宽度。第二导线12的制备材料选自钼、铝、钛、铜以及银中的至少一种。
第一绝缘层13位于第一导线11和第二导线12之间，以使第一导线11和第二导线12之间绝缘。第一绝缘层13的厚度为800埃-2000埃，例如为1500埃，第一绝缘层的制备材料为氮化硅或氧化硅。
第二绝缘层14位于第二导线12远离第一绝缘层13的一侧。第二绝缘层14使第二导线12和导电块15之间绝缘。第二绝缘层14的厚度为3000埃-6000埃。第二绝缘层14的制备材料为氮化硅或氧化硅。
第一过孔16a对应第一导线11的第一收窄部111设置且贯穿第一绝缘层13和第二绝缘层14，使第一收窄部1111显露。
第二过孔16b对应第二导线12的第二收窄部121设置且贯穿第二绝缘层14，使第二收窄部121显露。
导电块15位于第二绝缘层14远离第二导线12的一侧，导电块15形成第一过孔16a中、第二过孔16b中以及第二绝缘层14上，以电性连接第一导线11和第二导线12。导电块15为一整块的导电层，导电块15的制备材料为氧化铟锡或氧化铟锡。
在本实施例中，第一导线11和第二导线12位于同一条直线上。第一收窄部111的长度等于第二收窄部121的长度，第一收窄部111的宽度等于第二收窄部121的宽度。第一收窄部111的长度大于第一收窄部111的宽度，以使得后续对应第一收窄部111设置的第一过孔16a的数目增多，第二收窄部121的长度大于第二收窄部121的宽度，以使得后续对应第二收窄部121设置的第二过孔16b的数目增多，增加第一过孔16a和第二过孔16b中的导电块15的面积，避免导电块15出现炸伤。
在本实施例中，第一过孔16a对应第一收窄部111长度上的中间位置设置，第二过孔16b对应第二收窄部121长度上的中间位置设置，以使得第一过孔16a和第二过孔16b具有合适的数目，且相对于第一过孔16a和第二过孔16b分别设置于第一收窄部111长度上的两端以及第二收窄部121长度上的两端，可以减少导电块15炸伤的概率。
具体地，第一过孔16a沿着第一收窄部111长度呈一排设置，第二过孔16b沿着第二收窄部121的长度呈一排设置，第一过孔16a和第二过孔16b的尺寸以及大小相同，一个第一过孔16a对应一个第二过孔16b设置。
请参阅图5，其为本申请第二实施例导电组件的平面示意图。图5所示导电组件与图3所示导电组件基本相似，不同之处在于，第一过孔16a对应整个第一收窄部111的长度设置，第二过孔16b对应整个第二收窄部121的长度设置，以使得第一过孔16a和第二过孔16b的数目最大化，以使得第一过孔16a和第二过孔16b中的导电块15的面积最大化。
相对于第一实施例的导电组件，本实施例尽管增加第一过孔16a和第二过孔16b的数目，但第一过孔16a和第二过孔16b的数目增加也增加导电块15炸伤的概率。
请参阅图6，其为本申请第三实施例导电组件的平面示意图。图6所示导电组件和图3所示导电组件基本相似，不同之处在于，第二导线12的相对两端均具有第二收窄部121，第二导线12一端的第二收窄部121与一个第一导线11的第一收窄部111通过一个导电块15电性连接，第二导线12另一端的第二收窄部121与另一个第一导线11的第一收窄部111通过另一个导电块15电性连接。
位于同一层的两个第一导线11通过一个第二导线12电性桥接，避免第一导线11与需要避让的导电器件之间发生短路。
本申请还提供一种显示装置。显示装置可以为液晶显示装置。显示装置包括导电组件，导电组件可以设置于显示装置的非显示区。导电组件可以构成显示装置的导电焊盘，导电焊盘用于输入数据信号或者扫描控制信号等。导电组件也可以构成传输数据信号的导线。导电组件包括：
第一导线，第一导线的一端具有第一收窄部；
第二导线，第二导线的至少一端具有第二收窄部，第二导线具有第二收窄部的一端向第一导线具有第一收窄部的一端延伸，第一收窄部和第二收窄部相互咬合；
第一绝缘层，第一绝缘层位于第一导线和第二导线之间；
第二绝缘层，第二绝缘层位于第二导线远离第一绝缘层的一侧；
第一过孔，第一过孔对应第一导线的第一收窄部设置且贯穿第一绝缘层和第二绝缘层，使第一收窄部显露；
第二过孔，第二过孔对应第二导线的第二收窄部设置且贯穿第二绝缘层，使第二收窄部显露；
导电块，导电块位于第二绝缘层远离第二导线的一侧，导电块形成于第一过孔中、第二过孔中以及第二绝缘层上，以电性连接第一导线和第二导线。
在本实施例中，显示装置的显示区设置有多条扫描线以及多条数据线。第一导线与多条扫描线位于同一金属层，第二导线与多条数据线位于同一金属层。第一绝缘层为栅极绝缘层，栅极绝缘层的厚度为800埃-2000埃，栅极绝缘层的制备材料为氮化硅或氧化硅。第二绝缘层为层间绝缘层，层间绝缘层的厚度为3000埃-6000埃。层间绝缘层的制备材料为氮化硅或氧化硅。显示装置为液晶显示装置时，导电块可以与像素电极同层且绝缘设置。
在本实施例中，第一收窄部的长度等于第二收窄部的长度，第一收窄部的宽度等于第二收窄部的宽度，以使第一收窄部和第二收窄部对称设置，且有利于第一收窄部和第二收窄部之间通过第一过孔和第二过孔中的导电块电性连接。
在本实施例中，第一导线具有第一收窄部的一端具有一个第一缺口，第一缺口位于第一收窄部的一侧，第二导线具有第二收窄部的一端具有一个第二缺口，第二缺口位于第二收窄部的一侧，第二收窄部位于第一缺口中，第一收窄部位于第二缺口中。第二收窄部远离第一收窄部的边缘与第一缺口远离第一收窄部的边缘平齐，第一收窄部远离第二收窄部的边缘与第二缺口远离第一收窄部的边缘平齐，即第一收窄部与第二缺口相配合，第二收窄部与第一缺口相配合。
在本实施例中，第一过孔和第二过孔的形状和尺寸相同。第一过孔的形状可以为正方形，尺寸为12微米×12微米。第一过孔的形状也可以为圆形。
在本实施例中，第一过孔对应第一收窄部的长度上的中间位置设置，第二过孔对应第二收窄部长度上的中间位置设置，以使得相对于传统技术，在第一过孔和第二过孔的面积不变的情况下，适当地增加第一过孔和第二过孔的数目，以适当增加导电块在第一过孔和第二过孔中的总截面积，例如图1所示中第一过孔1的数目为16个，而在本申请中第一过孔的数目为44个，显著地增加了第一过孔中导电块的面积，避免导电块由于流经过孔中导电块的面积较小导致电流较大导致出现过孔炸伤。相对于对应整个第一收窄部设置第一过孔，且对应整个第二收窄部设置第二过孔，可以避免第一过孔和第二过孔的数目过多导致导电块炸伤的风险更大的问题。相对于对应第一收窄部的两端设置第一过孔，对应第二收窄部的两端设置第二过孔，对应第一收窄部和第二收窄部的中间位置设置更有利于降低导电块炸伤的风险。
在本实施例中，第二导线的相对两端均具有第二收窄部，第二导线一端的第二收窄部与一个第一导线的第一收窄部通过一个导电块电性连接，第二导线另一端的第二收窄部与另一个第一导线的第一收窄部通过另一个导电块电性连接。通过一个第二导线桥接两个第一导线，以避免第一导线与两个第一导线之间需要避让的器件之间短路。
以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。
Claims (20)
- 一种导电组件，其中，所述导电组件包括：第一导线，所述第一导线的一端具有第一收窄部；第二导线，所述第二导线的至少一端具有第二收窄部，所述第二导线具有所述第二收窄部的一端向所述第一导线具有所述第一收窄部的一端延伸，所述第一收窄部和所述第二收窄部相互咬合；第一绝缘层，所述第一绝缘层位于所述第一导线和所述第二导线之间；第二绝缘层，所述第二绝缘层位于所述第二导线远离所述第一绝缘层的一侧；第一过孔，所述第一过孔对应所述第一导线的所述第一收窄部设置且贯穿所述第一绝缘层和所述第二绝缘层，使所述第一收窄部显露；第二过孔，所述第二过孔对应所述第二导线的所述第二收窄部设置且贯穿所述第二绝缘层，使所述第二收窄部显露；导电块，所述导电块位于所述第二绝缘层远离所述第二导线的一侧，所述导电块形成于所述第一过孔中、所述第二过孔中以及所述第二绝缘层上，以电性连接所述第一导线和所述第二导线；所述第一导线的制备材料选自钼、铝、钛、铜以及银中的至少一种，所述第二导线的制备材料选自钼、铝、钛、铜以及银中的至少一种，所述导电块的制备材料为氧化铟锡或氧化铟锡。
- 根据权利要求1所述的导电组件，其中，所述第一收窄部的长度等于所述第二收窄部的长度，所述第一收窄部的宽度等于所述第二收窄部的宽度。
- 根据权利要求1所述的导电组件，其中，所述第一过孔对应所述第一收窄部的长度上的中间位置设置，所述第二过孔对应所述第二收窄部长度上的中间位置设置。
- 根据权利要求1所述的导电组件，其中，所述第一导线具有所述第一收窄部的一端具有一个第一缺口，所述第一缺口位于所述第一收窄部的一侧，所述第二导线具有所述第二收窄部的一端具有一个第二缺口，所述第二缺口位于所述第二收窄部的一侧，所述第二收窄部位于第一缺口中，所述第一收窄部位于所述第二缺口中。
- 根据权利要求1所述的导电组件，其中，所述第二导线的相对两端均具有所述第二收窄部，所述第二导线一端的所述第二收窄部与一个所述第一导线的所述第一收窄部通过一个所述导电块电性连接，所述第二导线另一端的所述第二收窄部与另一个所述第一导线的所述第一收窄部通过另一个所述导电块电性连接。
- 一种导电组件，其中，所述导电组件包括：第一导线，所述第一导线的一端具有第一收窄部；第二导线，所述第二导线的至少一端具有第二收窄部，所述第二导线具有所述第二收窄部的一端向所述第一导线具有所述第一收窄部的一端延伸，所述第一收窄部和所述第二收窄部相互咬合；第一绝缘层，所述第一绝缘层位于所述第一导线和所述第二导线之间；第二绝缘层，所述第二绝缘层位于所述第二导线远离所述第一绝缘层的一侧；第一过孔，所述第一过孔对应所述第一导线的所述第一收窄部设置且贯穿所述第一绝缘层和所述第二绝缘层，使所述第一收窄部显露；第二过孔，所述第二过孔对应所述第二导线的所述第二收窄部设置且贯穿所述第二绝缘层，使所述第二收窄部显露；导电块，所述导电块位于所述第二绝缘层远离所述第二导线的一侧，所述导电块形成于所述第一过孔中、所述第二过孔中以及所述第二绝缘层上，以电性连接所述第一导线和所述第二导线。
- 根据权利要求6所述的导电组件，其中，所述第一收窄部的长度等于所述第二收窄部的长度，所述第一收窄部的宽度等于所述第二收窄部的宽度。
- 根据权利要求6所述的导电组件，其中，所述第一过孔对应所述第一收窄部的长度上的中间位置设置，所述第二过孔对应所述第二收窄部长度上的中间位置设置。
- 根据权利要求6所述的导电组件，其中，所述第一导线具有所述第一收窄部的一端具有一个第一缺口，所述第一缺口位于所述第一收窄部的一侧，所述第二导线具有所述第二收窄部的一端具有一个第二缺口，所述第二缺口位于所述第二收窄部的一侧，所述第二收窄部位于第一缺口中，所述第一收窄部位于所述第二缺口中。
- 根据权利要求6所述的导电组件，其中，所述第二导线的相对两端均具有所述第二收窄部，所述第二导线一端的所述第二收窄部与一个所述第一导线的所述第一收窄部通过一个所述导电块电性连接，所述第二导线另一端的所述第二收窄部与另一个所述第一导线的所述第一收窄部通过另一个所述导电块电性连接。
- 根据权利要求6所述的导电组件，其中，所述导电组件为导电焊盘。
- 根据权利要求6所述的导电组件，其中，所述第一导线和所述第二导线位于同一条直线上。
- 一种显示装置，其中，所述显示装置包括导电组件，所述导电组件包括：第一导线，所述第一导线的一端具有第一收窄部；第二导线，所述第二导线的至少一端具有第二收窄部，所述第二导线具有所述第二收窄部的一端向所述第一导线具有所述第一收窄部的一端延伸，所述第一收窄部和所述第二收窄部相互咬合；第一绝缘层，所述第一绝缘层位于所述第一导线和所述第二导线之间；第二绝缘层，所述第二绝缘层位于所述第二导线远离所述第一绝缘层的一侧；第一过孔，所述第一过孔对应所述第一导线的所述第一收窄部设置且贯穿所述第一绝缘层和所述第二绝缘层，使所述第一收窄部显露；第二过孔，所述第二过孔对应所述第二导线的所述第二收窄部设置且贯穿所述第二绝缘层，使所述第二收窄部显露；导电块，所述导电块位于所述第二绝缘层远离所述第二导线的一侧，所述导电块形成于所述第一过孔中、所述第二过孔中以及所述第二绝缘层上，以电性连接所述第一导线和所述第二导线。
- 根据权利要求13所述的显示装置，其中，所述第一收窄部的长度等于所述第二收窄部的长度，所述第一收窄部的宽度等于所述第二收窄部的宽度。
- 根据权利要求13所述的显示装置，其中，所述第一过孔对应所述第一收窄部的长度上的中间位置设置，所述第二过孔对应所述第二收窄部长度上的中间位置设置。
- 根据权利要求13所述的显示装置，其中，所述第一导线具有所述第一收窄部的一端具有一个第一缺口，所述第一缺口位于所述第一收窄部的一侧，所述第二导线具有所述第二收窄部的一端具有一个第二缺口，所述第二缺口位于所述第二收窄部的一侧，所述第二收窄部位于第一缺口中，所述第一收窄部位于所述第二缺口中。
- 根据权利要求13所述的显示装置，其中，所述第二导线的相对两端均具有所述第二收窄部，所述第二导线一端的所述第二收窄部与一个所述第一导线的所述第一收窄部通过一个所述导电块电性连接，所述第二导线另一端的所述第二收窄部与另一个所述第一导线的所述第一收窄部通过另一个所述导电块电性连接。
- 根据权利要求13所述的显示装置，其中，所述导电组件设置于所述显示装置的非显示区。
- 根据权利要求13所述的显示装置，其中，所述导电组件为导电焊盘。
- 根据权利要求13所述的显示装置，其中，所述第一导线和所述第二导线位于同一条直线上。
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