WO2021214898A1 - Presse à imprimer et système d'impression - Google Patents

Presse à imprimer et système d'impression Download PDF

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Publication number
WO2021214898A1
WO2021214898A1 PCT/JP2020/017290 JP2020017290W WO2021214898A1 WO 2021214898 A1 WO2021214898 A1 WO 2021214898A1 JP 2020017290 W JP2020017290 W JP 2020017290W WO 2021214898 A1 WO2021214898 A1 WO 2021214898A1
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WO
WIPO (PCT)
Prior art keywords
substrate
printing
height
mask
clamp
Prior art date
Application number
PCT/JP2020/017290
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English (en)
Japanese (ja)
Inventor
良宗 横井
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2022516539A priority Critical patent/JP7389894B2/ja
Priority to PCT/JP2020/017290 priority patent/WO2021214898A1/fr
Publication of WO2021214898A1 publication Critical patent/WO2021214898A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces

Definitions

  • This specification discloses technologies related to printing machines and printing systems.
  • the transport device described in Patent Document 1 includes a conveyor device, a clamp device, and a support member, and a substrate transported to a predetermined position by the conveyor device is lifted from the conveyor device by the support member and lifted. Is clamped by a clamping device. Further, the transport device includes a pressing member and a control device having a first clamp portion. The pressing member is provided above the conveyor device and presses the substrate from above. The first clamp portion controls the operation of the transport device in order to clamp the substrate in the upward warped state in which the central portion of the substrate protrudes from the edge portion.
  • the first clamp portion deforms the substrate into a downward warp state by pressing the central portion of the substrate lifted by the support member downward by the pressing member.
  • the transport device described in Patent Document 1 can also flatten and clamp a substrate in a downward warp state in which the edge portion of the substrate protrudes from the central portion.
  • Patent Document 1 does not describe the step difference between the height of the contact surface of the clamp device capable of contacting the mask and the height of the printed surface of the substrate capable of contacting the mask. If a step occurs in the holding state of the substrate, the degree of adhesion between the mask and the substrate may decrease, and the print quality may deteriorate. Therefore, there is a request to know the above-mentioned step. Further, Patent Document 1 does not describe the relationship between the height of the printed surface of the substrate and the printed result of the substrate. Therefore, it is difficult to know the relationship between the height of the printed surface of the substrate and the printed result of the substrate.
  • the present specification describes the measurement result of the step, which is the difference between the height of the contact surface of the clamp device capable of contacting the mask and the height of the printed surface of the substrate capable of contacting the mask. Disclose at least the printing presses that can be obtained. Further, the present specification discloses a printing system in which the relationship between the measurement result of the height of the printed surface of the substrate and the printed result of the substrate can be at least known.
  • the present specification is a printing machine in which a squeegee slides a mask to print solder on a substrate through an opening of the mask, and includes a clamping device, a support device, and an acquisition device.
  • the clamping device clamps the edge of the substrate using a pair of clamping members.
  • the support device is provided between the pair of clamp members and supports the substrate from below.
  • the acquisition device has the height of the contact surface of the clamp device capable of contacting the mask in the holding state of the substrate in which the substrate is clamped by the clamp device and the substrate is supported by the support device.
  • the step difference from the height of the printed surface of the substrate that can come into contact with the mask is measured, and the substrate holding information including the measurement result of the step is acquired.
  • the present specification is a printing system including a printing machine in which a squeegee slides a mask to print solder on a substrate through an opening of the mask, and the printing machine includes a clamping device and a supporting device. And an acquisition device.
  • the clamping device clamps the edge of the substrate using a pair of clamping members.
  • the support device is provided between the pair of clamp members and supports the substrate from below.
  • the acquisition device measures the height of the printed surface of the substrate that can come into contact with the mask in the holding state of the substrate in which the substrate is clamped by the clamping device and the substrate is supported by the support device. Then, the substrate holding information including the measurement result of the height of the printed surface of the substrate is acquired.
  • the printing system stores the substrate holding information acquired by the acquisition device and the printing result information including the printing result of the substrate on which the solder is printed in the holding state of the substrate in association with each other. Be prepared.
  • the printing machine can at least obtain the measurement result of the step, which is the difference between the height of the contact surface of the clamp device capable of contacting the mask and the height of the printed surface of the substrate capable of contacting the mask. ..
  • the above-mentioned printing system includes a storage device that stores the substrate holding information including the measurement result of the height of the printing surface of the substrate acquired by the acquisition device and the printing result information including the printing result of the substrate in association with each other. ing. Therefore, the user of the printing system can at least know the relationship between the measurement result of the height of the printed surface of the substrate and the printing result of the substrate from the storage device.
  • Embodiment 1-1 Configuration example of the substrate work line WL0
  • the board-to-board work line WL0 of the present embodiment may be provided with the printing machine WM1, and the type and number of the board-to-board work machines WM0 constituting the board-to-board work line WL0 are not limited.
  • the board-to-board work line WL0 of the present embodiment is a plurality (five) board-to-board work of the printing machine WM1, the printing inspection machine WM2, the component mounting machine WM3, the reflow furnace WM4, and the appearance inspection machine WM5.
  • the machine WM0 is provided, and the substrate 90 is conveyed in this order by the substrate conveying device.
  • the printing machine WM1 prints the solder 80 at the mounting positions of a plurality of parts on the substrate 90.
  • the printing inspection machine WM2 inspects the printing state of the solder 80 printed by the printing machine WM1.
  • the component mounting machine WM3 mounts a plurality of components on the substrate 90 on which the solder 80 is printed by the printing machine WM1.
  • the component mounting machine WM3 may be one or a plurality. When a plurality of component mounting machines WM3 are provided, the plurality of component mounting machines WM3 can share and mount a plurality of parts.
  • the reflow furnace WM4 heats the substrate 90 on which a plurality of parts are mounted by the component mounting machine WM3, melts the solder 80, and performs soldering.
  • the visual inspection machine WM5 inspects the mounting state of a plurality of parts mounted by the component mounting machine WM3.
  • the board-to-board work line WL0 uses a plurality of (five) board-to-board work machines WM0 to sequentially convey the boards 90 and execute a production process including an inspection process to produce the board product 900. Can be done.
  • the substrate work line WL0 includes, for example, a functional inspection machine, a buffer device, a substrate supply device, a substrate reversing device, a shield mounting device, an adhesive coating device, an ultraviolet irradiation device, and other anti-board work machines WM0 as needed. You can also prepare.
  • a plurality of (five) anti-board work machines WM0 and a management device HC0 constituting the anti-board work line WL0 are electrically connected by a communication unit.
  • the communication unit connects them in a communicable manner by wire or wirelessly.
  • various communication methods can be adopted.
  • a premises information communication network LAN: Local Area Network
  • LAN Local Area Network
  • the plurality of (five) anti-board working machines WM0 can communicate with each other via the communication unit.
  • a plurality of (five) anti-board working machines WM0 can communicate with the management device HC0 via the communication unit.
  • the management device HC0 controls a plurality of (five) anti-board work machines WM0 constituting the anti-board work line WL0, and monitors the operating status of the anti-board work line WL0.
  • the management device HC0 stores various control data for controlling a plurality of (five) anti-board working machines WM0.
  • the management device HC0 transmits control data to each of a plurality of (five) anti-board working machines WM0. Further, each of the plurality (five) anti-board working machines WM0 transmits the operating status and the production status to the management device HC0.
  • the management device HC0 is provided with a storage device DS0.
  • the storage device DS0 can store various acquired data acquired by the board working machine WM0. For example, various image data captured by the anti-board working machine WM0 are included in the acquired data.
  • the record (log data) of the operating status acquired by the board working machine WM0 is included in the acquired data.
  • the storage device DS0 can store various production information regarding the production of the substrate product 900. For example, shape-related information such as information on the shape of a part, information on image processing of image data obtained by imaging a part, information on handling of a part, information on imaging conditions when imaging a part, and information on electrical characteristics of a part can be obtained. , Included in production information.
  • package information which is information on how to supply parts
  • package information which is information on how to supply parts
  • the inspection standard information used when the inspection machine such as the printing inspection machine WM2 and the appearance inspection machine WM5 inspects the inspection target is included in the production information.
  • the inspection result by the inspection machine is included in the production information.
  • the quality information (traceability information) of the substrate product 900 is included in the production information.
  • the printing machine WM1 of the present embodiment executes a printing process in which the squeegee 34 slides the mask 70 to print the solder 80 on the substrate 90 through the opening 71 of the mask 70.
  • the printing machine WM1 includes a substrate transfer device 10, a mask support device 20, a squeegee moving device 30, a display device 40, and a control device 50.
  • the transport direction of the substrate 90 (the direction perpendicular to the paper surface of FIG. 2) is the X direction
  • the printing direction is the front-rear direction (horizontal direction on the paper surface of FIG. 2) of the printing machine WM1 orthogonal to the X direction.
  • the Y direction is defined, and the vertical direction (vertical direction on the paper surface of FIG. 2) orthogonal to the X direction and the Y direction is defined as the Z direction.
  • the substrate transfer device 10 conveys the substrate 90 to be printed.
  • the substrate 90 is a circuit board on which an electronic circuit, an electric circuit, a magnetic circuit, and the like are formed.
  • the substrate transfer device 10 is provided on the base BS0 of the printing machine WM1.
  • the substrate transfer device 10 conveys the substrate 90 by, for example, a belt conveyor extending in the transfer direction (X direction) of the substrate 90.
  • the substrate transfer device 10 holds the substrate 90 carried into the printing machine WM1 as described later.
  • the mask support device 20 is provided above the substrate transfer device 10.
  • the mask support device 20 supports the mask 70 by a pair of support bases.
  • the pair of supports are on the left side (the back side of the paper in FIG. 2 and shown) and the right side (the front side of the paper in FIG. 2) of the front-view printing press WM1 and are not shown in the figure. ), And is formed so as to extend along the printing direction (Y direction).
  • FIG. 2 is a partial cross-sectional view of the printing press WM1 cut along the printing direction (Y direction), such as the inside of the printing press WM1 in the side view, the mask 70, the substrate 90, and the substrate conveying device 10.
  • the cross section is schematically shown.
  • the mask 70 is formed with an opening 71 that penetrates at a predetermined position on the wiring pattern of the substrate 90.
  • the mask 70 is supported by the mask support device 20 via, for example, a frame member provided on the outer peripheral edge.
  • the squeegee moving device 30 raises and lowers the squeegee 34 in the vertical direction (Z direction) perpendicular to the mask 70, and moves the squeegee 34 in the printing direction (Y direction) on the upper surface of the mask 70.
  • the squeegee moving device 30 includes a head driving device 31, a squeegee head 32, a pair of elevating devices 33, 33, and a pair of squeegees 34, 34.
  • the head driving device 31 is arranged on the upper side of the printing machine WM1.
  • the head drive device 31 can move the squeegee head 32 in the printing direction (Y direction) by, for example, a linear motion mechanism such as a feed screw mechanism.
  • the squeegee head 32 is clamped and fixed to a moving body constituting the linear motion mechanism of the head drive device 31.
  • the squeegee head 32 holds a pair of elevating devices 33, 33.
  • Each of the pair of elevating devices 33, 33 holds the squeegee 34 and can be driven independently of each other.
  • Each of the pair of elevating devices 33, 33 drives an actuator such as an air cylinder to elevate and elevate the squeegee 34 to be held.
  • each of the pair of squeegees 34, 34 is a plate-shaped member formed so as to extend along the transport direction (X direction) of the substrate 90 orthogonal to the printing direction (Y direction).
  • the squeegee 34 on the front side (left side of the paper in FIG. 2) is used for the printing process of moving the solder 80 from the front side to the rear side, and goes from the front side to the rear side of the printing machine WM1.
  • the direction is the direction of travel.
  • the squeegee 34 on the rear side (on the right side of the paper in FIG. 2) is used for the printing process of moving the solder 80 from the rear side to the front side, and is used from the rear side to the front side of the printing machine WM1.
  • the direction of travel is the direction of travel.
  • the direction opposite to the traveling direction is set as the retreating direction.
  • Each of the pair of squeegees 34, 34 is held by the elevating device 33 at an angle so that the front portion located on the traveling side faces downward. In other words, each of the pair of squeegees 34, 34 is held by the elevating device 33 at an angle so that the back surface portion located on the retracting side faces upward.
  • the inclination angle of each of the pair of squeegees 34, 34 is adjusted by an adjusting mechanism provided in the lower part of the elevating device 33.
  • the display device 40 can display the work status of the printing machine WM1. Further, the display device 40 of the present embodiment is configured by a touch panel, and also functions as an input device that accepts various operations by an operator.
  • the control device 50 includes a known arithmetic unit and a storage device, and constitutes a control circuit.
  • the control device 50 is communicably connected to the management device HC0 shown in FIG. 1 via a communication unit, and can transmit and receive various data.
  • the control device 50 can drive and control the substrate transfer device 10, the mask support device 20, the squeegee movement device 30, and the display device 40 based on the production program, the detection results of various sensors, and the like.
  • the control device 50 acquires various information stored in the storage device and detection results of various sensors provided in the printing machine WM1.
  • the storage device stores a production program for driving the printing machine WM1 and the like.
  • the control device 50 drives and controls, for example, the squeegee moving device 30.
  • the control device 50 sends a control signal to the squeegee moving device 30 based on the above-mentioned various information and detection results.
  • the positions (height) of the pair of squeegees 34, 34 held in the squeegee head 32 in the printing direction (Y direction) and the vertical direction (Z direction), as well as the moving speed and the tilt angle are controlled.
  • the pair of squeegees 34, 34 are driven and controlled, and the solder 80 is printed on the substrate 90 arranged on the lower surface side of the mask 70.
  • the board transfer device 10 includes a pedestal portion 11, an elevating portion 12, a clamp device 13, and a support device 14.
  • the pedestal portion 11 is provided on the base BS0 and includes an elevating mechanism 11a.
  • the elevating mechanism 11a is lowered when the substrate 90 is conveyed, and when the substrate 90 is conveyed to a predetermined position, the elevating mechanism 11a raises the substrate 90 together with the elevating portion 12, the clamp device 13, and the support device 14.
  • a known linear motion mechanism such as a feed screw mechanism can be used as the elevating mechanism.
  • the elevating part 12 is provided with a clamp device 13 and a support device 14.
  • the clamping device 13 clamps the edge portion of the substrate 90 by using a pair of clamping members 13e and 13e.
  • the clamp device 13 includes a support base 13a, a fixed guide rail 13b, a movable guide rail 13c, a pair of conveyor belts 13d and 13d, a pair of clamp members 13e and 13e, and a clamp motor 13f.
  • the support base 13a is a rectangular plate-shaped member that extends along the transport direction (X direction) of the substrate 90, and is fixed to the elevating portion 12.
  • the fixed guide rail 13b is provided at one end of the support base 13a on the one end side in the printing direction (Y direction).
  • the fixed guide rail 13b is a rectangular plate-shaped member that extends along the transport direction (X direction) of the substrate 90 and extends upward from the end portion in the vertical direction (Z direction).
  • the movable guide rail 13c is provided at the other end of the support base 13a on the other end side in the printing direction (Y direction).
  • the movable guide rail 13c is a rectangular plate-shaped member that extends along the transport direction (X direction) of the substrate 90 and extends upward from the end portion in the vertical direction (Z direction).
  • the sizes of the fixed guide rail 13b and the movable guide rail 13c are formed to be substantially the same.
  • One of the pair of conveyor belts 13d and 13d is provided on the upper end side of the inner wall surface of the fixed guide rail 13b.
  • the other of the pair of conveyor belts 13d and 13d is provided on the upper end side of the inner wall surface of the movable guide rail 13c. Therefore, as shown in FIG. 2, the pair of conveyor belts 13d and 13d face each other.
  • the pair of conveyor belts 13d and 13d rotate around with the substrate 90 mounted on them to convey the substrate 90.
  • the clamp device 13 includes a belt drive unit.
  • the belt drive unit drives a pair of conveyor belts 13d and 13d.
  • a known drive device such as a stepping motor or a servo motor can be used.
  • the belt drive unit is driven and controlled by the control device 50, and the pair of conveyor belts 13d and 13d can convey the substrate 90, adjust the stop position of the substrate 90, and the like.
  • Each of the pair of clamp members 13e and 13e is a rectangular plate-shaped member extending along the transport direction (X direction) of the substrate 90.
  • One of the pair of clamp members 13e and 13e is provided so as to project outward from the top of the fixed guide rail 13b.
  • the contact surface of the clamp member 13e that comes into contact with the edge of the board 90 is aligned with the inner wall surface of the fixed guide rail 13b.
  • the other of the pair of clamp members 13e and 13e is provided so as to project outward from the top of the movable guide rail 13c.
  • the contact surface of the clamp member 13e that comes into contact with the edge of the board 90 (the side surface of the board 90 that extends along the transport direction (X direction) of the board 90) is aligned with the inner wall surface of the movable guide rail 13c.
  • the pair of clamp members 13e and 13e of the present embodiment come into contact with the edge portion of the substrate 90 (the side surface of the substrate 90 extending along the transport direction (X direction) of the substrate 90) to clamp the substrate 90. be able to.
  • the pair of clamp members 13e and 13e can support the lower surface of the mask 70.
  • the clamp motor 13f is provided on the support base 13a.
  • the clamp motor 13f can move the movable guide rail 13c in the printing direction (Y direction) via a linear motion mechanism 13f1 such as a feed mechanism.
  • a linear motion mechanism 13f1 such as a feed mechanism.
  • the movable guide rail 13c can move on the upper surface of the support base 13a while maintaining a state parallel to the fixed guide rail 13b, and the separation distance between the fixed guide rail 13b and the movable guide rail 13c can be increased. It can be changed.
  • the support device 14 is provided between the pair of clamp members 13e and 13e, and supports the substrate 90 from below.
  • the support device 14 includes a backup table 14a, a plurality of backup pins 14b, and an elevating motor 14c.
  • the backup table 14a is a rectangular plate-shaped member substantially the same size as the substrate 90.
  • the backup table 14a is provided so as to be able to move up and down between the fixed guide rail 13b and the movable guide rail 13c.
  • the plurality of backup pins 14b are rod-shaped members that push up the substrate 90 from the lower surface side of the substrate 90.
  • the plurality of backup pins 14b are provided so as to project upward in the vertical direction (Z direction) from the backup table 14a.
  • the positions and numbers of the plurality of backup pins 14b on the backup table 14a can be changed in order to avoid lands (electrodes) formed on the back surface of the substrate 90, parts mounted on the back surface of the substrate 90, and the like. ing.
  • the elevating motor 14c is provided in the elevating portion 12 below the support base 13a.
  • the elevating motor 14c can elevate the backup table 14a in the vertical direction (Z direction) via a known linear motion mechanism 14c1 such as a feed mechanism.
  • a known linear motion mechanism 14c1 such as a feed mechanism.
  • the plurality of backup pins 14b can push up the substrate 90 from the lower surface side of the substrate 90.
  • the linear motion mechanism 14c1 penetrates the support base 13a in the vertical direction (Z direction).
  • the control device 50 drives and controls the elevating mechanism 11a, the clamp motor 13f, and the elevating motor 14c. Specifically, when the substrate 90 is conveyed to a predetermined position, the control device 50 drives and controls the elevating mechanism 11a to raise the elevating portion 12, the clamp device 13, and the support device 14 to a predetermined height. Then, the control device 50 drives and controls the elevating motor 14c to bring the plurality of backup pins 14b into contact with the lower surface of the substrate 90, and the plurality of backup pins 14b push up the substrate 90 from the lower surface side of the substrate 90. .. As a result, the substrate 90 rises together with the backup table 14a and the plurality of backup pins 14b.
  • the control device 50 drives and controls the clamp motor 13f to move the movable guide rail 13c toward the fixed guide rail 13b.
  • the separation distance between the pair of clamp members 13e and 13e is reduced as compared with that before the movement, and the pair of clamp members 13e and 13e are moved in the edge portion of the substrate 90 (in the transport direction (X direction) of the substrate 90).
  • the substrate 90 is clamped in contact with the side surface of the substrate 90 extending along it.
  • the state in which the substrate 90 is clamped by the clamp device 13 and the substrate 90 is supported by the support device 14 is referred to as a holding state of the substrate 90.
  • the height AH0 of the contact surface AS0 of the clamp device 13 in this embodiment, the pair of clamp members 13e, 13e
  • a step DL0 which is a difference from the height PH0 of the printed surface PS0 of the substrate 90 that can come into contact with the 70, may occur.
  • a step DL0 occurs in the holding state of the substrate 90, it becomes difficult to bring the mask 70 and the substrate 90 into close contact with each other as shown by the broken line in FIG. As a result, the degree of adhesion between the mask 70 and the substrate 90 may decrease, and the print quality may decrease.
  • the printing machine WM1 of the present embodiment is provided with the acquisition device SS0.
  • the acquisition device SS0 measures the step DL0 in the holding state of the substrate 90 and acquires the board holding information including the measurement result of the step DL0.
  • the acquisition device SS0 may take various forms as long as it can measure the holding state of the substrate 90 including at least the step DL0.
  • a known displacement sensor such as a laser sensor can be used as the acquisition device SS0.
  • the acquisition device SS0 of the present embodiment is provided on a moving body including the camera unit FC0.
  • the printing machine WM1 includes a mobile body driving device.
  • the moving body driving device can move the moving body in a horizontal plane formed by the transport direction (X direction) and the printing direction (Y direction) of the substrate by, for example, a biaxial linear motion mechanism.
  • the camera unit FC0 acquires image data by imaging the upper surface of the substrate 90.
  • the control device 50 performs image processing on the image data acquired by the camera unit FC0 to recognize the position marks FM1 and FM2 provided on the substrate 90 shown in FIG. As a result, the control device 50 can know the position of the substrate 90 in the printing press WM1.
  • the camera unit FC0 acquires image data by imaging the lower surface of the mask 70.
  • the control device 50 performs image processing on the image data acquired by the camera unit FC0 and recognizes the position marks FM1 and FM2 provided on the mask 70 shown in FIG. Thereby, the control device 50 can know the position of the mask 70 in the printing machine WM1.
  • the position mark FM1 provided on the substrate 90 and the position mark FM1 provided on the mask 70 match, and the position mark FM2 provided on the substrate 90 and the position mark FM2 provided on the mask 70 match.
  • the printing machine WM1 can align the substrate 90 and the mask 70 (plate alignment).
  • the acquisition device SS0 holds the contact surface AS0 of the pair of clamp members 13e and 13e and the printed surface PS0 of the substrate 90. You can move. Specifically, the acquisition device SS0 prints the substrate 90 from the contact surface AS0 of one of the pair of clamp members 13e and 13e on the one end side in the transport direction (X direction) of the substrate 90. It moves along the printing direction (Y direction) to the contact surface AS0 of the other clamp member 13e via the surface PS0.
  • the acquisition device SS0 measures the height AH0 of the contact surface AS0 at the position P11 of the contact surface AS0 of one of the clamp members 13e. Further, the acquisition device SS0 measures the height PH0 of the printed surface PS0 at a plurality of positions (for example, position P12, position P13, position P14) of the printed surface PS0 of the substrate 90. Further, the acquisition device SS0 measures the height AH0 of the contact surface AS0 at the position P15 of the contact surface AS0 of the other clamp member 13e.
  • the acquisition device SS0 moves by a predetermined distance along the transport direction (X direction) of the substrate 90, and from the contact surface AS0 of the other clamp member 13e of the pair of clamp members 13e, 13e, the substrate 90 It moves along the printing direction (Y direction) to the contact surface AS0 of one of the clamp members 13e via the printing surface PS0 of.
  • the acquisition device SS0 measures the height AH0 of the contact surface AS0 of the pair of clamp members 13e and 13e and the height PH0 of the printed surface PS0 of the substrate 90 in the same manner as in the above case.
  • the acquisition device SS0 moves by a predetermined distance along the transport direction (X direction) of the substrate 90, and from the contact surface AS0 of one of the pair of clamp members 13e and 13e, the substrate 90. It moves along the printing direction (Y direction) to the contact surface AS0 of the other clamp member 13e via the printing surface PS0 of.
  • the acquisition device SS0 measures the height AH0 of the contact surface AS0 of the pair of clamp members 13e and 13e and the height PH0 of the printed surface PS0 of the substrate 90 in the same manner as in the above case.
  • the acquisition device SS0 can measure the step DL0 for the entire substrate 90 by repeating the above movement and measurement to the other end side of the substrate 90 in the transport direction (X direction).
  • the measurement results of the height PH0 of the printed surface PS0 of the substrate 90 are uniform, and these measurement results are paired.
  • the step DL0 is generated.
  • the measurement results of the height PH0 of the printed surface PS0 of the substrate 90 are uniform, and these measurement results are a pair.
  • the step DL0 does not occur.
  • the acquisition device SS0 can also measure the height PH0 of the printed surface PS0 of the substrate 90 in the holding state of the substrate 90 and acquire the measurement result of the height PH0 of the printed surface PS0 of the substrate 90.
  • the measurement result of the height PH0 of the printed surface PS0 of the substrate 90 is included in the substrate holding information.
  • the acquisition device SS0 can measure the height PH0 of the printed surface PS0 of the substrate 90.
  • FIG. 5 the positions corresponding to the positions P11 to P15 shown in FIG. 4 are indicated by the positions P21 to P25.
  • the measurement result of the height PH0 of the printing surface PS0 of the substrate 90 at the position P23 at the center of the printing direction (Y direction) of the substrate 90 is near both ends of the printing direction (Y direction) of the substrate 90. It is higher than the measurement results at the positions P22 and P24.
  • the height PH0 of the printing surface PS0 of the substrate 90 gradually increases from one end side to the center portion in the printing direction (Y direction), and gradually decreases from the center portion to the other end side. ing.
  • the measurement result of the height PH0 of the printing surface PS0 of the substrate 90 at the positions P22 and the position P24 near both ends in the printing direction (Y direction) of the substrate 90 is the central portion of the substrate 90 in the printing direction (Y direction). It is assumed that the measurement result is higher than the measurement result at the position P23. In this case, the height PH0 of the printing surface PS0 of the substrate 90 gradually decreases from one end side to the center portion in the printing direction (Y direction), and the warp of the concave substrate 90 gradually increases from the center portion to the other end side. there is a possibility. However, in this embodiment, the substrate 90 is supported from below by the support device 14. Therefore, there is little possibility that the concave substrate 90 will warp.
  • a plurality of measurement results of the height PH0 of the printed surface PS0 of the substrate 90 in the printing direction (Y direction) are equal, and these measurement results are a pair of clamp members 13e, 13e.
  • a state different from the measurement result of the height AH0 of the contact surface AS0 of the above is included.
  • a plurality of measurement results of the height PH0 of the printed surface PS0 of the substrate 90 in the printing direction (Y direction) are uneven, and at least one of these measurement results is a pair of clamps.
  • a state different from the measurement result of the height AH0 of the contact surface AS0 of the members 13e and 13e is included.
  • the height AH0 of the contact surfaces AS0 of the pair of clamp members 13e and 13e can be substantially positioned at a target height by the substrate transfer device 10. Therefore, the acquisition device SS0 can omit the measurement of the height AH0 of the contact surface AS0 of at least one of the pair of clamp members 13e and 13e.
  • the height PH0 of the printed surface PS0 of the substrate 90 is easily affected by the holding state of the substrate 90.
  • the height PH0 of the printed surface PS0 of the substrate 90 is more likely to be affected by the holding state of the substrate 90.
  • the lower the rigidity of the substrate 90 the more easily the height PH0 of the printed surface PS0 of the substrate 90 is affected by the holding state of the substrate 90. Therefore, as the size of the substrate 90 increases, the number of measurements in the printing direction (Y direction) can be increased. Further, as the rigidity of the substrate 90 decreases, the number of measurements in the printing direction (Y direction) can be increased.
  • the pair of clamp members 13e and 13e facing each other in the printing direction (Y direction) come into contact with the edge portion of the substrate 90 (the side surface of the substrate 90 extending along the transport direction (X direction) of the substrate 90).
  • the substrate 90 is clamped. Therefore, the substrate 90 is more easily deformed in the printing direction (Y direction) than in the transport direction (X direction). Therefore, the number of measurements of the substrate 90 in the transport direction (X direction) can be reduced as compared with the printing direction (Y direction).
  • the height reference of the height AH0 of the contact surface AS0 of the pair of clamp members 13e and 13e and the height reference of the height PH0 of the printed surface PS0 of the substrate 90 can be arbitrarily set. As shown in FIGS. 4 and 5, for example, these height references can be set on the installation surface of the pedestal portion 11 (the upper surface of the base BS0).
  • the target device control unit 51 determines whether the holding state of the substrate 90 is good or bad based on the substrate holding information acquired by the acquisition device SS0, and determines that the holding state of the substrate 90 is defective.
  • the target device TG0 which is at least one of the clamp device 13 and the support device 14, is driven and controlled to change the holding state of the substrate 90.
  • the target device control unit 51 can be provided in various control devices, management devices, and the like. As shown in FIG. 6, the target device control unit 51 can be provided, for example, in the control device 50 of the printing machine WM1. Further, the target device control unit 51 can include at least one of a support device control unit 52, a clamp device control unit 53, and an auxiliary member control unit 54. The target device control unit 51 of the present embodiment includes a support device control unit 52, a clamp device control unit 53, and an auxiliary member control unit 54.
  • the support device control unit 52 determines whether or not the step DL0 is included in the predetermined allowable range based on the measurement result of the step DL0 acquired by the acquisition device SS0. Then, when the support device control unit 52 determines that the step DL0 is not included in the predetermined allowable range, the support device control unit 52 moves the support device 14 in the direction of reducing the step DL0.
  • the substrate holding information includes the measurement result of the step DL0. Further, the quality of the holding state of the substrate 90 is determined by whether or not the step DL0 is included in a predetermined allowable range.
  • the target device TG0 is a support device 14.
  • the support device control unit 52 executes control according to the flowchart shown in FIG. Specifically, the acquisition device SS0 measures the step DL0 (step S11). Then, the support device control unit 52 determines whether or not the step DL0 is included in the predetermined allowable range based on the measurement result of the step DL0 acquired by the acquisition device SS0 (step S12).
  • the permissible range can be set in advance in consideration of the permissible degree of adhesion between the mask 70 and the substrate 90. The narrower the permissible range, the easier it is for the support device control unit 52 to execute control, and the degree of adhesion between the mask 70 and the substrate 90 increases. However, as the permissible range is narrowed, the support device control unit 52 requires a high degree of control, which may complicate the control.
  • the support device control unit 52 moves the support device 14 in the direction of reducing the step DL0 (step S13).
  • the height PH0 of the printed surface PS0 of the substrate 90 is lower than the height AH0 of the contact surface AS0 of the pair of clamp members 13e and 13e. In this case, the support device control unit 52 moves the support device 14 upward in the vertical direction (Z direction).
  • the support device control unit 52 drives and controls the elevating motor 14c shown in FIG. 2 to raise the backup table 14a and the plurality of backup pins 14b according to the step DL0.
  • the substrate 90 rises together with the backup table 14a and the plurality of backup pins 14b, and as shown in FIG. 8, the step DL0 is eliminated.
  • the support device control unit 52 moves the support device 14 downward in the vertical direction (Z direction). Specifically, the support device control unit 52 drives and controls the elevating motor 14c shown in FIG. 2 to lower the backup table 14a and the plurality of backup pins 14b according to the step DL0. As a result, the substrate 90 descends together with the backup table 14a and the plurality of backup pins 14b, and the step DL0 is eliminated.
  • the support device 14 is vertically arranged so that the height PH0 of the printed surface PS0 of the substrate 90 is slightly higher than the height AH0 of the contact surface AS0 of the pair of clamp members 13e and 13e. It can also be moved in the direction (Z direction). In this case, the degree of adhesion between the mask 70 and the substrate 90 is further increased as compared with the case where the height AH0 of the contact surface AS0 of the pair of clamp members 13e and 13e and the height PH0 of the printed surface PS0 of the substrate 90 are matched. , At least one of the mask 70 and the substrate 90 can be easily absorbed.
  • step S13 the control by the support device control unit 52 is once ended. Further, when the step DL0 is included in the predetermined allowable range (Yes in step S12), the support device control unit 52 does not need to control the step DL0. Therefore, the support device control unit 52 executes the process shown in step S13. Do not stop the control once.
  • the clamp device control unit 53 determines whether or not the warp amount WA0 of the substrate 90 is included in a predetermined allowable range based on the measurement result of the height PH0 of the printed surface PS0 of the substrate 90 acquired by the acquisition device SS0. .. Then, when the clamp device control unit 53 determines that the warp amount WA0 of the substrate 90 is not included in the predetermined allowable range, the clamp device control unit 53 has among the pair of clamp members 13e and 13e in the direction of reducing the warp amount WA0 of the board 90. Move at least one of them. In this case, the substrate holding information includes the measurement result of the height PH0 of the printed surface PS0 of the substrate 90.
  • the quality of the holding state of the substrate 90 is determined by whether or not the warp amount WA0 of the substrate 90 is included in a predetermined allowable range.
  • the target device TG0 is a clamp device 13 (at least one of a pair of clamp members 13e and 13e).
  • the clamp device control unit 53 executes control according to the flowchart shown in FIG. Specifically, the acquisition device SS0 measures the height PH0 of the printed surface PS0 of the substrate 90 in the holding state of the substrate 90 (step S21). Further, the clamp device control unit 53 acquires the warp amount WA0 of the substrate 90 based on the measurement result of the height PH0 of the printed surface PS0 of the substrate 90 acquired by the acquisition device SS0. For example, the warp amount WA0 of the substrate 90 can be obtained by subtracting the minimum value of the measurement result from the maximum value of the measurement result of the height PH0 of the printed surface PS0 of the substrate 90.
  • the clamp device control unit 53 determines whether or not the warp amount WA0 of the substrate 90 is included in the predetermined allowable range (step S22).
  • the permissible range can be set in advance as in the case of the step DL0.
  • the clamp device control unit 53 sets the pair of clamp members 13e, 13e in the direction of reducing the warp amount WA0 of the board 90. At least one of them is moved (step S23).
  • the height PH0 of the printing surface PS0 of the substrate 90 gradually increases from one end side to the center portion in the printing direction (Y direction), and gradually decreases from the center portion to the other end side. Warp is occurring.
  • the clamp device control unit 53 increases the separation distance between the pair of clamp members 13e and 13e. Specifically, the clamp device control unit 53 drives and controls the clamp motor 13f shown in FIG. 2 to move the movable guide rail 13c in a direction away from the fixed guide rail 13b. As a result, the separation distance between the pair of clamp members 13e and 13e is increased as compared with that before the movement, and the warp of the convex substrate 90 is reduced.
  • the clamp device control unit 53 reduces the warp amount WA0 of the board 90 when it is determined that the warp amount WA0 of the board 90 is not included in the predetermined allowable range. It is also possible to move the pair of clamp members 13e and 13e in the direction of movement. Further, as described above, the height PH0 of the printing surface PS0 of the substrate 90 gradually decreases from one end side to the center portion in the printing direction (Y direction), and gradually increases from the center portion to the other end side. The warp of 90 is unlikely to occur. If the concave substrate 90 is warped, the support device control unit 52 can move the support device 14 in a direction that reduces the warp amount WA0 of the substrate 90. Specifically, the support device control unit 52 drives and controls the elevating motor 14c shown in FIG. 2 to raise the backup table 14a and the plurality of backup pins 14b according to the warp amount WA0 of the substrate 90.
  • step S23 When the process shown in step S23 is completed, the control by the clamp device control unit 53 is once ended. Further, when the warp amount WA0 of the substrate 90 is included in the predetermined allowable range (Yes in step S22), the control by the clamp device control unit 53 is unnecessary, so that the clamp device control unit 53 moves to step S23. The control is temporarily terminated without executing the indicated process.
  • the support device 14 is an auxiliary member which is at least one of a suction member VC0 that sucks the substrate 90 and a pressing member PU0 that presses the substrate 90 from the side of the printed surface PS0 of the substrate 90. It can be equipped with AM0.
  • the suction member VC0 can be provided on at least one of the plurality of backup pins 14b.
  • the position and number of the pressing member PU0 on the substrate 90 can be changed in order to avoid lands (electrodes) formed on the printed surface PS0 of the substrate 90, parts mounted on the printed surface PS0 of the substrate 90, and the like. It has become.
  • the auxiliary member control unit 54 determines whether or not the warp amount WA0 of the substrate 90 is included in a predetermined allowable range based on the measurement result of the height PH0 of the printed surface PS0 of the substrate 90 acquired by the acquisition device SS0.
  • the auxiliary member AM0 is used to reduce the warp amount WA0 of the substrate 90.
  • the substrate holding information includes the measurement result of the height PH0 of the printed surface PS0 of the substrate 90.
  • the quality of the holding state of the substrate 90 is determined by whether or not the warp amount WA0 of the substrate 90 is included in a predetermined allowable range.
  • the target device TG0 is a support device 14 (auxiliary member AM0).
  • the auxiliary member control unit 54 executes control according to the flowchart shown in FIG.
  • the process shown in step S21 and the determination shown in step S22 are the same as in the case of control by the clamp device control unit 53.
  • the auxiliary member control unit 54 reduces the warp amount WA0 of the board 90 by using the auxiliary member AM0 (step S23).
  • the height PH0 of the printing surface PS0 of the substrate 90 gradually increases from one end side to the center portion in the printing direction (Y direction), and gradually decreases from the center portion to the other end side. Warp is occurring.
  • the auxiliary member control unit 54 presses the substrate 90 from the side of the printed surface PS0 of the substrate 90 by using the pressing member PU0 at the central portion of the substrate 90 in the printing direction (Y direction). Further, the auxiliary member control unit 54 can also use the suction member VC0 to suck the central portion of the substrate 90 in the printing direction (Y direction). As a result, the warp of the convex substrate 90 is reduced.
  • the auxiliary member control unit 54 can reduce the amount of warpage WA0 of the substrate 90 by using the auxiliary member AM0 in at least a part of the substrate 90.
  • step S23 the control by the auxiliary member control unit 54 is once ended. Further, when the warp amount WA0 of the substrate 90 is included in the predetermined allowable range (Yes in step S22), the control by the auxiliary member control unit 54 is unnecessary, so that the auxiliary member control unit 54 moves to step S23. The control is temporarily terminated without executing the indicated process. Further, when the warp amount WA0 of the substrate 90 is not included in the predetermined allowable range, the clamp device control unit 53 uses at least one of the pair of clamp members 13e and 13e in the direction of reducing the warp amount WA0 of the board 90. The auxiliary member control unit 54 may use the auxiliary member AM0 to reduce the warp amount WA0 of the substrate 90 while moving the substrate 90.
  • the moving body including the camera unit FC0 and the acquisition device SS0 retracts to a predetermined position shown in FIG.
  • the elevating mechanism 11a of the substrate transport device 10 further elevates the substrate 90 together with the elevating portion 12, the clamp device 13, and the support device 14.
  • the substrate 90 is held in a state where the printed surface PS0 of the substrate 90 is in close contact with the lower surface of the mask 70. Then, the printing process by the printing machine WM1 is executed.
  • the printing system WS0 includes a printing machine WM1.
  • the printing machine WM1 includes a clamp device 13, a support device 14, and an acquisition device SS0.
  • the clamping device 13 clamps the edge portion of the substrate 90 by using a pair of clamping members 13e and 13e.
  • the support device 14 is provided between the pair of clamp members 13e and 13e and supports the substrate 90 from below.
  • the acquisition device SS0 In the acquisition device SS0, the height PH0 of the printed surface PS0 of the substrate 90 that can come into contact with the mask 70 in the holding state of the substrate 90 in which the substrate 90 is clamped by the clamping device 13 and the substrate 90 is supported by the support device 14. Is measured to acquire the substrate holding information including the measurement result of the height PH0 of the printed surface PS0 of the substrate 90.
  • the acquisition device SS0 obtains a step DL0 which is the difference between the height AH0 of the contact surface AS0 of the clamp device 13 capable of contacting the mask 70 and the height PH0 of the printed surface PS0 of the substrate 90 in the holding state of the substrate 90. It is also possible to measure and obtain the measurement result of the step DL0.
  • the measurement result of the step DL0 is included in the substrate holding information.
  • the printing system WS0 stores the substrate holding information acquired by the acquisition device SS0 and the printing result information including the printing result of the substrate 90 on which the solder 80 is printed in the holding state of the substrate 90 in association with each other.
  • the storage device DS0 is not limited as long as it can store the substrate holding information and the print result information in association with each other.
  • the storage device DS0 can be provided in a printing machine WM1, a management device HC0, a management device that manages a plurality of board-to-board work lines WL0, and the like.
  • the storage device DS0 can also be formed on the cloud. As shown in FIG. 1, the storage device DS0 of the present embodiment is provided in the management device HC0.
  • the printing result of the substrate 90 can include the inspection result by the printing inspection machine WM2 for inspecting the printing state of the solder 80 printed by the printing machine WM1.
  • the printing inspection machine WM2 sets a reference range for determining each of the volume, area, and height of the solder 80 printed on the substrate 90 as a non-defective product. Then, the printing inspection machine WM2 determines that the substrate 90 is a non-defective product when all of the volume, area, and height of the solder 80 fall within the reference range in all of the plurality of printing areas of the substrate 90.
  • the printing inspection machine WM2 determines the substrate 90 as a defective product when at least one of the volume, area and height of the solder 80 is out of the reference range in at least one printing area of the substrate 90. ..
  • the print result of the substrate 90 can also be obtained by visual inspection, measurement, or the like by an operator.
  • the user of the printing system WS0 can at least know the relationship between the measurement result of the height PH0 of the printed surface PS0 of the substrate 90 and the printing result of the substrate 90 from the storage device DS0. Therefore, the user of the printing system WS0 can also analyze the causal relationship between the measurement result of the height PH0 of the printed surface PS0 of the substrate 90 and the printing result of the substrate 90.
  • the print quality tends to deteriorate as the variation in the plurality of print areas of the substrate 90 increases.
  • the smaller the area of the printed solder 80 with respect to the target value the more likely it is that the solder 80 will be chipped.
  • the larger the area of the printed solder 80 with respect to the target value the more easily the solder 80 bleeds.
  • the lower the height of the printed solder 80 with respect to the target value the more easily the solder 80 is blurred.
  • the higher the height of the printed solder 80 with respect to the target value the more easily the solder 80 becomes angular. The same can be said for the case where the variation becomes large in the printing process of the plurality of substrates 90.
  • the height PH0 of the printed surface PS0 of the substrate 90 is related to the degree of adhesion between the mask 70 and the substrate 90, and tends to affect the print quality. Therefore, for example, the user of the printing system WS0 measures the variation in the volume, area, and height of the solder 80 and the height PH0 of the printed surface PS0 of the substrate 90 based on the above relationship acquired from the storage device DS0. The relationship with can be analyzed. For example, the user of the printing system WS0 can measure the height PH0 of the printed surface PS0 of the substrate 90, which is stored in association with the printing result of the substrate 90, which minimizes the variation in the volume, area, and height of the solder 80. Can be known. In this case, by setting the height PH0 of the printed surface PS0 of the substrate 90 to be the same as the measurement result, it is possible to suppress variations in the volume, area and height of the solder 80, and improve the print quality. can.
  • the printing system WS0 may also include a target device control unit 51.
  • the target device control unit 51 determines whether the holding state of the substrate 90 is good or bad based on the substrate holding information acquired by the acquisition device SS0, and when it is determined that the holding state of the substrate 90 is defective, the clamp device 13 and the support device
  • the target device TG0 which is at least one of 14, is driven and controlled to change the holding state of the substrate 90.
  • the target device control unit 51 can include at least one of the support device control unit 52, the clamp device control unit 53, and the auxiliary member control unit 54.
  • the acquisition device SS0 can also acquire the board holding information for the board 90 whose holding state has been changed by the target device control unit 51. Further, the storage device DS0 can also store the board holding information and the print result information of the board 90 whose holding state has been changed by the target device control unit 51 in association with each other. As a result, for example, the user of the printing system WS0 can easily confirm the effect of changing the holding state of the substrate 90.
  • the printing system WS0 can include an exchange device 60 for exchanging the exchange member CE0 detachably provided on the printing machine WM1 with the printing machine WM1.
  • the replacement member CE0 is not limited as long as it is detachably provided on the printing machine WM1.
  • the mask 70, the backup table 14a of the support device 14, and the plurality of backup pins 14b are included in the replacement member CE0.
  • the exchange device 60 includes a housing unit 61 and a movable device 62, and can move in the production equipment including the board work line WL0.
  • the accommodating unit 61 can accommodate the replacement member CE0 supplied to the printing press WM1.
  • the accommodating unit 61 can also accommodate the replacement member CE0 collected from the printing machine WM1.
  • the movable device 62 is provided so as to be able to advance and retreat from the switching device 60 into the printing machine WM1.
  • the movable device 62 includes a holding member for holding the replacement member CE0, and the replacement member CE0 is held by the holding member of the movable device 62 and carried into the printing machine WM1 from the accommodating unit 61.
  • the replacement member CE0 is held by the holding member of the movable device 62 and is carried out from the inside of the printing machine WM1 to the accommodating portion 61.
  • the acquisition device SS0 can acquire the substrate holding information. Further, when the target device control unit 51 determines that the holding state of the board 90 is defective, the target device control unit 51 can drive and control the target device TG0 to change the holding state of the board 90. Further, the printing result includes an inspection result by the printing inspection machine WM2 for inspecting the printing state of the solder 80 printed by the printing machine WM1. Further, the exchange device 60 can exchange the exchange member CE0 with the printing machine WM1. As described above, the printing system WS0 of the present embodiment can automate the work related to the printing machine WM1 and save labor.
  • the acquisition device SS0 is provided. Therefore, the printing machine WM1 is the difference between the height AH0 of the contact surface AS0 of the clamp device 13 capable of contacting the mask 70 and the height PH0 of the printing surface PS0 of the substrate 90 capable of contacting the mask 70. At least the measurement result of the step DL0 can be obtained. Further, the printing system WS0 stores the substrate holding information including the measurement result of the height PH0 of the print surface PS0 of the substrate 90 acquired by the acquisition device SS0 and the print result information including the print result of the substrate 90 in association with each other. It is equipped with a storage device DS0. Therefore, the user of the printing system WS0 can at least know the relationship between the measurement result of the height PH0 of the printed surface PS0 of the substrate 90 and the printing result of the substrate 90 from the storage device DS0.
  • 13 Clamp device, 13e, 13e: Pair of clamp members
  • 14 Support device
  • 34 Squeegee
  • 51 Target device control unit
  • 52 Support device control unit
  • 53 Clamp device control unit
  • 54 Auxiliary member control unit
  • 60 Exchange device
  • 70 Mask
  • 71 Opening
  • 90 Substrate
  • AS0 Contact surface
  • AH0 Height
  • PS0 Printed surface
  • PH0 Height
  • DL0 Step
  • WA0 Warp amount
  • AM0 Auxiliary member
  • VC0 Suction member
  • PU0 Pressing member
  • CE0 Replacement member
  • SS0 Acquisition device
  • DS0 Storage device
  • TG0 Target device
  • WM1 Printing machine
  • WM2 Printing inspection machine
  • WS0 Printing system.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)

Abstract

La présente invention porte sur une presse à imprimer permettant de faire glisser une raclette sur un masque pour imprimer une soudure sur un substrat à travers des ouvertures dans le masque, ladite presse à imprimer comprenant un dispositif de serrage, un dispositif de support et un dispositif d'acquisition. Le dispositif de serrage serre les bords du substrat avec une paire d'éléments de serrage. Le dispositif de support est disposé entre la paire d'éléments de serrage pour supporter le substrat par le dessous. Le dispositif d'acquisition mesure un pas représenté par une différence entre la hauteur d'une surface de butée du dispositif de serrage, avec laquelle celui-ci peut venir en butée contre le masque, et la hauteur d'une surface d'impression du substrat, avec laquelle celui-ci peut venir en butée contre le masque, le substrat étant dans un état retenu dans lequel celui-ci est serré par le dispositif de serrage et supporté par le dispositif de support, et acquiert des informations de retenue de substrat concernant le résultat de mesure du pas.
PCT/JP2020/017290 2020-04-22 2020-04-22 Presse à imprimer et système d'impression WO2021214898A1 (fr)

Priority Applications (2)

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JP2022516539A JP7389894B2 (ja) 2020-04-22 2020-04-22 印刷機および印刷システム
PCT/JP2020/017290 WO2021214898A1 (fr) 2020-04-22 2020-04-22 Presse à imprimer et système d'impression

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005156283A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Ind Co Ltd 半田検査装置および半田検査方法
JP2007160692A (ja) * 2005-12-13 2007-06-28 Yamaha Motor Co Ltd スクリーン印刷装置
JP2012158129A (ja) * 2011-02-02 2012-08-23 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
WO2016199207A1 (fr) * 2015-06-08 2016-12-15 富士機械製造株式会社 Dispositif d'impression et dispositif de travail de substrat
JP2017220633A (ja) * 2016-06-10 2017-12-14 ヤマハ発動機株式会社 基板クランプ装置及び基板処理装置
US20180139875A1 (en) * 2016-11-14 2018-05-17 Wongeun Yoo Screen printer improved in solder separation and method of controlling the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005156283A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Ind Co Ltd 半田検査装置および半田検査方法
JP2007160692A (ja) * 2005-12-13 2007-06-28 Yamaha Motor Co Ltd スクリーン印刷装置
JP2012158129A (ja) * 2011-02-02 2012-08-23 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
WO2016199207A1 (fr) * 2015-06-08 2016-12-15 富士機械製造株式会社 Dispositif d'impression et dispositif de travail de substrat
JP2017220633A (ja) * 2016-06-10 2017-12-14 ヤマハ発動機株式会社 基板クランプ装置及び基板処理装置
US20180139875A1 (en) * 2016-11-14 2018-05-17 Wongeun Yoo Screen printer improved in solder separation and method of controlling the same

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