WO2021201197A1 - 膜形成用組成物 - Google Patents

膜形成用組成物 Download PDF

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Publication number
WO2021201197A1
WO2021201197A1 PCT/JP2021/014092 JP2021014092W WO2021201197A1 WO 2021201197 A1 WO2021201197 A1 WO 2021201197A1 JP 2021014092 W JP2021014092 W JP 2021014092W WO 2021201197 A1 WO2021201197 A1 WO 2021201197A1
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WIPO (PCT)
Prior art keywords
group
film
forming composition
methyl
formula
Prior art date
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Ceased
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PCT/JP2021/014092
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English (en)
French (fr)
Japanese (ja)
Inventor
亘 柴山
諭 武田
修平 志垣
謙 石橋
宏大 加藤
中島　誠
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Nissan Chemical Corp
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Nissan Chemical Corp
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Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to JP2022512681A priority Critical patent/JP7853648B2/ja
Priority to US17/916,512 priority patent/US20230152700A1/en
Priority to KR1020227036757A priority patent/KR102924234B1/ko
Priority to CN202180026667.7A priority patent/CN115362413A/zh
Publication of WO2021201197A1 publication Critical patent/WO2021201197A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5445—Silicon-containing compounds containing nitrogen containing at least one Si-N bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/692—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their composition, e.g. multilayer masks or materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/693—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane
    • H10P50/695—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H10P76/2042—Photolithographic processes using lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H10P76/2043—Photolithographic processes using an anti-reflective coating

Definitions

  • a thin film of a photoresist material is formed on a semiconductor substrate such as a silicon wafer, and an active ray such as ultraviolet rays is irradiated through a mask pattern on which a pattern of a semiconductor device is drawn to develop and obtain the result.
  • an active ray such as ultraviolet rays
  • the resist underlayer film Si-HM (Silicon hard mask) is required to have not only good lithography characteristics but also a good etching rate in wet etching, and therefore good solubility in a chemical solution (HF or the like) for wet etching is required.
  • EUV Extreme Ultraviolet
  • a large amount of functional groups having high adhesion to the resist can be introduced into the polymer, and a composition of a photoacid generator can be used.
  • Materials that have been added in large quantities to the inside are being developed, but in such materials, the decrease in the solubility of wet etching in chemicals (HF, etc.) due to the increase in organic components has become a major problem. There is.
  • Patent Documents 1 and 2 a composition for forming a resist underlayer film containing a silane compound having an onium group and a resist underlayer film containing a silane compound having an anion group have been reported.
  • the present invention has been made in view of the above circumstances, and is a resist lower layer having resistance to a solvent, good etching characteristics to a fluorine-based gas, and further good lithography characteristics of the composition for a resist film formed as an upper layer.
  • An object of the present invention is to provide a composition that provides a film that can function well as a film.
  • the present inventors hydrolyze and hydrolyze a hydrolyzable silane compound containing a predetermined hydrolyzable silane using an acidic compound containing two or more acidic groups.
  • the composition containing the hydrolyzed condensate obtained by condensation and the solvent has the resistance to the solvent of the composition for the resist film formed as the upper layer, the good etching property to the fluorine-based gas, and the better lithography property.
  • the present invention has been completed by finding that it provides a film that can function well as a resist underlayer film.
  • composition for The present invention relates to a film-forming composition, wherein the hydrolyzable silane compound contains an amino group-containing silane represented by the following formula (1).
  • R 1 is a group bonded to a silicon atom and represents an organic group containing an amino group independently of each other.
  • R 2 is a group bonded to a silicon atom, which may be an substituent or an alkyl group, an aryl group which may be substituted, an aralkyl group which may be substituted, or an alkyl halide group which may be substituted.
  • R 3 is a group or atom bonded to a silicon atom and independently represents an alkoxy group, an aralkyloxy group, an acyloxy group or a halogen atom.
  • a is an integer of 1 to 2
  • b is an integer of 0 to 1, and satisfies a + b ⁇ 2.
  • the first viewpoint includes two or more kinds of acidic groups selected so as to be different from each other from the group consisting of a sulfonic acid group, a phosphoric acid group, a carboxy group and a phenolic hydroxy group.
  • the above two or more acidic groups consist of at least one selected from the group consisting of a sulfonic acid group, a phosphoric acid group, a carboxy group and a phenolic hydroxy group, and a carboxy group and a phenolic hydroxy group.
  • the film-forming composition according to a second aspect which comprises at least one selected from the group.
  • the film-forming composition according to any one of the first to third aspects wherein the acidic compound contains an aromatic ring.
  • the film-forming composition according to the fourth aspect wherein at least one of the two or more acidic groups is directly bonded to the aromatic ring.
  • the film-forming composition according to the fifth aspect wherein all of the two or more acidic groups are directly bonded to the aromatic ring.
  • the film-forming composition according to any one of the first to sixth aspects wherein the acidic compound contains an acidic compound containing two or three acidic groups.
  • the above two or more acidic groups are a sulfonic acid group and a phenolic hydroxy group, a sulfonic acid group and a carboxy group, a sulfonic acid group and a carboxy group and a phenolic hydroxy group, and a phosphoric acid group and a phenolic hydroxy group.
  • the composition for forming a film according to the first aspect which is a phosphate group and a carboxy group, a phosphoric acid group and a carboxy group and a phenolic hydroxy group, or a carboxy group and a phenolic hydroxy group.
  • the film-forming composition according to the first aspect wherein the acidic compound contains an acidic compound represented by the following formula (S).
  • Ar represents an aromatic ring having 6 to 20 carbon atoms
  • RA represents an acidic group
  • RS represents a substituent
  • q is an acidic group bonded to the aromatic ring.
  • the film-forming composition according to any one of the first to ninth aspects, wherein the organic group containing an amino group is a group represented by the following formula (A1).
  • R 101 and R 102 represent a hydrogen atom or a hydrocarbon group independently of each other, and L represents an optionally substituted alkylene group.
  • the film-forming composition according to the tenth aspect wherein the alkylene group is a linear or branched alkylene group having 1 to 10 carbon atoms.
  • the film-forming composition according to any one of the first aspect to the eleventh aspect which is for forming a resist underlayer film used in a lithography process.
  • the present invention relates to a resist underlayer film obtained from the film-forming composition according to any one of the first to twelfth viewpoints.
  • a step of forming an organic underlayer film on a substrate and a process of forming an organic underlayer film A step of forming a resist underlayer film on the organic underlayer film using the film-forming composition according to any one of the first to twelfth viewpoints.
  • the present invention relates to a method for manufacturing a semiconductor device, which includes a step of forming a resist film on the resist underlayer film.
  • the film-forming composition of the present invention not only can the film be easily formed by a wet process such as a spin coating method, but also good lithography when used together with a resist film and an organic underlayer film in a three-layer process. It is possible to obtain a film suitable as a resist underlayer film, which can realize the characteristics and further exhibits resistance to a solvent and good etching characteristics to a fluorine-based gas of the composition for a resist film formed as an upper layer. By using such a film-forming composition, it can be expected that a more reliable semiconductor device will be manufactured.
  • the film-forming composition of the present invention contains a hydrolyzed condensate of a hydrolyzable silane compound, and the hydrolyzed condensate includes not only a siloxane polymer which is a completely condensed condensate, but also a siloxane polymer. Also included are siloxane polymers, which are partially hydrolyzed condensates for which condensation is not completely completed. Such a partially hydrolyzed condensate is also a polymer obtained by hydrolysis and condensation of a silane compound, like the condensate in which condensation is completely completed, but it partially stops at hydrolysis and is not condensed. Therefore, the Si—OH group remains. Further, in the present invention, the solid content means a component other than the solvent in the composition.
  • the film-forming composition of the present invention contains a hydrolyzable condensate obtained by hydrolyzing and condensing a hydrolyzable silane compound using an acidic compound containing two or more kinds of acidic groups, and the above-mentioned hydrolyzable silane compound.
  • a hydrolyzable condensate obtained by hydrolyzing and condensing a hydrolyzable silane compound using an acidic compound containing two or more kinds of acidic groups, and the above-mentioned hydrolyzable silane compound.
  • it contains an amino group-containing silane represented by the following formula (1).
  • R 1 is a group bonded to a silicon atom and represents an organic group containing an amino group
  • R 2 is a group bonded to a silicon atom and may be substituted alkyl group.
  • R 3 is a group or atom bonded to the silicon atoms, independently of one another, alkoxy groups, aralkyloxy group, an acyloxy group or a halogen atom
  • A is an integer of 1 to 2
  • b is an integer of 0 to 1, and satisfies a + b ⁇ 2.
  • the alkyl group in the formula (1) is a monovalent group derived by removing one hydrogen atom from an alkane, and may be linear, branched or cyclic, and the number of carbon atoms of the alkyl group is Although not particularly limited, it is preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, still more preferably 10 or less.
  • linear or branched alkyl group examples include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, s-butyl group, t-butyl group and n-pentyl.
  • cyclic alkyl group examples include cyclopropyl group, cyclobutyl group, 1-methyl-cyclopropyl group, 2-methyl-cyclopropyl group, cyclopentyl group, 1-methyl-cyclobutyl group, 2-methyl-cyclobutyl group, 3 -Methyl-cyclobutyl group, 1,2-dimethyl-cyclopropyl group, 2,3-dimethyl-cyclopropyl group, 1-ethyl-cyclopropyl group, 2-ethyl-cyclopropyl group, cyclohexyl group, 1-methyl-cyclopentyl Group, 2-methyl-cyclopentyl group, 3-methyl-cyclopentyl group, 1-ethyl-cyclobutyl group, 2-ethyl-cyclobutyl group, 3-ethyl-cyclobutyl group, 1,2-dimethyl-cyclobutyl group, 1,3- Dimethyl-cyclobutyl group, 2,2-dimethyl-cyclobut
  • the aryl group in the formula (1) is a monovalent group derived by removing one hydrogen atom of a phenyl group and a fused ring aromatic hydrocarbon compound, and one hydrogen atom of a ring-linked aromatic hydrocarbon compound is removed.
  • Any of the derived monovalent groups may be used, and the number of carbon atoms thereof is not particularly limited, but is preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less.
  • a phenyl group a 1-naphthyl group, a 2-naphthyl group, a 1-anthryl group, a 2-anthryl group, a 9-anthryl group, a 1-phenanthryl group, a 2-phenanthryl group, a 3-phenanthryl group, and 4 -Phenyltril group, 9-phenanthryl group, 1-naphthacenyl group, 2-naphthacenyl group, 5-naphthacenyl group, 2-crisenyl group, 1-pyrenyl group, 2-pyrenyl group, pentasenyl group, benzopyrenyl group, triphenylenyl group; biphenyl- 2-Il group, biphenyl-3-yl group, biphenyl-4-yl group, paraterphenyl-4-yl group, metaterphenyl-4-yl group, orthoterphenyl-4-yl group, 1,
  • the aralkyl group in the formula (1) is an alkyl group substituted with an aryl group, and specific examples of such an aryl group and an alkyl group include the same as those described above.
  • the number of carbon atoms of the aralkyl group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less.
  • aralkyl group examples include a phenylmethyl group (benzyl group), a 2-phenylethylene group, a 3-phenyl-n-propyl group, a 4-phenyl-n-butyl group, a 5-phenyl-n-pentyl group, and 6 -Phenyl-n-hexyl group, 7-phenyl-n-heptyl group, 8-phenyl-n-octyl group, 9-phenyl-n-nonyl group, 10-phenyl-n-decyl group and the like can be mentioned. Not limited to.
  • the alkyl halide group in the formula (1) is an alkyl group substituted with a halogen atom, and specific examples of such an alkyl group include the same as those described above.
  • the number of carbon atoms of the alkyl halide group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, still more preferably 10 or less.
  • Examples of the halogen atom and the halogen atom in the formula (1) include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
  • alkyl halide group examples include a monofluoromethyl group, a difluoromethyl group, a trifluoromethyl group, a bromodifluoromethyl group, a 2-chloroethyl group, a 2-bromoethyl group, a 1,1-difluoroethyl group, and 2,2.
  • 2-Trifluoroethyl group 1,1,2,2-tetrafluoroethyl group, 2-chloro-1,1,2-trifluoroethyl group, pentafluoroethyl group, 3-bromopropyl group, 2,2 , 3,3-Tetrafluoropropyl group, 1,1,2,3,3,3-hexafluoropropyl group, 1,1,1,3,3,3-hexafluoropropane-2-yl group, 3- Examples thereof include, but are not limited to, a bromo-2-methylpropyl group, a 4-bromobutyl group, and a perfluoropentyl group.
  • the aryl halide group in the formula (1) is an aryl group substituted with a halogen atom, and specific examples of such an aryl group and a halogen atom include the same as those described above.
  • the number of carbon atoms of the aryl halide group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less.
  • Specific examples of the aryl halide group include 2-fluorophenyl group, 3-fluorophenyl group, 4-fluorophenyl group, 2,3-difluorophenyl group, 2,4-difluorophenyl group, and 2,5-difluorophenyl.
  • the halogenated aralkyl group in the formula (1) is an aralkyl group substituted with a halogen atom, and specific examples of such an aralkyl group and the halogen atom include the same as those described above.
  • the number of carbon atoms of the halogenated aralkyl group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less.
  • Specific examples of the halogenated aralkyl group include 2-fluorobenzyl group, 3-fluorobenzyl group, 4-fluorobenzyl group, 2,3-difluorobenzyl group, 2,4-difluorobenzyl group, and 2,5-difluorobenzyl group.
  • the alkoxyalkyl group in the formula (1) is an alkyl group substituted with an alkoxy group, and the alkyl group substituted by the alkoxy group in the alkoxyalkyl group may be linear, branched or cyclic, and such. Specific examples of the alkyl group include the same as those described above.
  • the number of carbon atoms of the alkoxyalkyl group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, still more preferably 10 or less.
  • alkoxy group substituted with the alkyl group in the alkoxyalkyl group and the alkoxy group in the formula (1) include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, and s-.
  • alkoxyalkyl group examples include, but are not limited to, lower alkyloxy lower alkyl groups such as methoxymethyl group, ethoxymethyl group, 1-ethoxyethyl group and 2-ethoxyethyl group.
  • the alkoxyaryl group in the formula (1) is an aryl group substituted with an alkoxy group, and specific examples of such an alkoxy group and the aryl group include the same as those described above.
  • the number of carbon atoms of the alkoxyaryl group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less.
  • alkoxyaryl group examples include 2-methoxyphenyl group, 3-methoxyphenyl group, 4-methoxyphenyl group, 2- (1-ethoxy) phenyl group, 3- (1-ethoxy) phenyl group, and 4- ( 1-ethoxy) phenyl group, 2- (2-ethoxy) phenyl group, 3- (2-ethoxy) phenyl group, 4- (2-ethoxy) phenyl group, 2-methoxynaphthalen-1-yl group, 3-methoxy Examples thereof include naphthalene-1-yl group, 4-methoxynaphthalen-1-yl group, 5-methoxynaphthalen-1-yl group, 6-methoxynaphthalen-1-yl group, 7-methoxynaphthalen-1-yl group and the like. However, it is not limited to these.
  • the alkoxyaralkyl group in the formula (1) is an alkoxylyl group substituted with an alkoxy group, and specific examples of such an alkoxy group and an aralkyl group include the same as those described above.
  • the number of carbon atoms of the alkoxyaralkyl group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less.
  • Specific examples of the alkoxyaralkyl group include, but are not limited to, a 3- (methoxyphenyl) benzyl group, a 4- (methoxyphenyl) benzyl group and the like.
  • the alkenyl group in the formula (1) may be linear or branched, and the number of carbon atoms thereof is not particularly limited, but is preferably 40 or less, more preferably 30 or less, and even more preferably. Is 20 or less, more preferably 10 or less.
  • Specific examples of the alkenyl group include ethenyl group, 1-propenyl group, 2-propenyl group, 1-methyl-1-ethenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group and 2-methyl-1.
  • -Propenyl group 2-methyl-2-propenyl group, 1-ethylethenyl group, 1-methyl-1-propenyl group, 1-methyl-2-propenyl group, 1-pentenyl group, 2-pentenyl group, 3-pentenyl group , 4-Pentenyl group, 1-n-propylethenyl group, 1-methyl-1-butenyl group, 1-methyl-2-butenyl group, 1-methyl-3-butenyl group, 2-ethyl-2-propenyl group , 2-Methyl-1-butenyl group, 2-methyl-2-butenyl group, 2-methyl-3-butenyl group, 3-methyl-1-butenyl group, 3-methyl-2-butenyl group, 3-methyl-2-butenyl group, 3-methyl- 3-butenyl group, 1,1-dimethyl-2-propenyl group, 1-isopropylethenyl group, 1,2-dimethyl-1-propenyl group, 1,2-dimethyl-2-propenyl
  • Examples of the organic group containing an epoxy group in the formula (1) include, but are limited to, a glycidoxymethyl group, a glycidoxyethyl group, a glycidoxypropyl group, a glycidoxybutyl group, an epoxycyclohexyl group and the like. Not done.
  • Examples of the organic group containing an acryloyl group in the formula (1) include, but are not limited to, an acryloyl methyl group, an acryloyl ethyl group, and an acryloyl propyl group.
  • Examples of the organic group containing a methacryloyl group in the formula (1) include, but are not limited to, a methacryloylmethyl group, a methacryloylethyl group, a methacryloylpropyl group, and the like.
  • Examples of the organic group containing a mercapto group in the formula (1) include, but are not limited to, an ethyl mercapto group, a butyl mercapto group, a hexyl mercapto group, and an octyl mercapto group.
  • Examples of the organic group containing a cyano group in the formula (1) include, but are not limited to, a cyanoethyl group and a cyanopropyl group.
  • the aralkyloxy group in the formula (1) is a group derived by removing a hydrogen atom from the hydroxy group of the aralkyl alcohol, and specific examples of such an aralkyl group include the same as those described above.
  • the number of carbon atoms of the aralkyloxy group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less.
  • Specific examples of the aralkyloxy group include a phenylmethyloxy group (benzyloxy group), a 2-phenylethyleneoxy group, a 3-phenyl-n-propyloxy group, a 4-phenyl-n-butyloxy group, and a 5-phenyl-n.
  • the acyloxy group in the formula (1) is a group derived by removing a hydrogen atom from the carboxy group of the carboxylic acid compound, and is typically a hydrogen atom from the carboxy group of an alkylcarboxylic acid, an arylcarboxylic acid or an aralkylcarboxylic acid.
  • Examples thereof include, but are not limited to, an alkylcarbonyloxy group, an arylcarbonyloxy group or an aralkylcarbonyloxy group derived by removing the above.
  • Specific examples of the alkyl group, aryl group and aralkyl group in such alkylcarboxylic acid, arylcarboxylic acid and aralkylcarboxylic acid include the same as those described above.
  • acyloxy group examples include methylcarbonyloxy group, ethylcarbonyloxy group, n-propylcarbonyloxy group, isopropylcarbonyloxy group, n-butylcarbonyloxy group, isobutylcarbonyloxy group, s-butylcarbonyloxy group, t.
  • the organic group containing an amino group in the formula (1) is not particularly limited as long as it is an organic group containing an amino group, but a preferable example is a group represented by the following formula (A1).
  • R 101 and R 102 represent a hydrogen atom or a hydrocarbon group independently of each other, and L represents an alkylene group which may be substituted independently of each other.
  • hydrocarbon group in the formula (A1) examples include, but are not limited to, an alkyl group, an alkenyl group, an aryl group and the like. Specific examples of such an alkyl group, an alkenyl group and an aryl group include the same as those described above.
  • R 101 and R 102 are preferably a hydrogen atom, an alkyl group, or an aryl group, and more preferably a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.
  • R 101 and R 102 are both an alkyl group having 1 to 5 carbon atoms or an aryl group having 6 to 10 carbon atoms, and more preferably , both R 101 and R 102 are both. It is a hydrogen atom.
  • examples of the alkylene group in the formula (A1) include the same as those described above, which may be linear or branched, and the number of carbon atoms thereof is usually 1 to 10, preferably 1 to 1. It is 5.
  • linear alkylene groups such as methylene group, ethylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, heptamethylene group, octamethylene group, nonamethylene group and decamethylene group are preferable.
  • a is an integer of 1 to 2 and b is an integer of 0 to 1 and satisfies a + b ⁇ 2, but has excellent lithography characteristics, resistance of the resist film composition to solvent, and a suitable etching rate balance. From the viewpoint of the above, preferably b is 0, more preferably a is 1, and b is 0.
  • the content of the amino group-containing silane represented by the formula (1) in the hydrolyzable silane compound is arbitrary, but is preferably 0.01 mol% from the viewpoint of achieving excellent lithography characteristics with good reproducibility. To 20 mol%, more preferably 0.1 mol% to 5 mol%, and other hydrolyzable silane is used as a remainder.
  • the film-forming composition of the present invention contains the amino group-containing silane represented by the formula (1) as the above-mentioned hydrolyzable silane compound for the purpose of adjusting the film physical properties such as the film density, and other hydrolyzable silanes.
  • silane for example, at least one selected from the hydrolyzable silane represented by the following formula (2) and the hydrolyzable silane represented by the following formula (3) may be contained.
  • R 4 is a group bonded to the silicon atom by Si-C bond, independently of one another, an optionally substituted alkyl group, an aryl group which may be substituted, it is substituted Aralkyl groups which may be substituted, alkyl halide groups which may be substituted, aryl halide groups which may be substituted, aralkyl groups which may be substituted, alkoxyalkyl groups which may be substituted, Represents an optionally substituted alkoxyaryl group, an optionally substituted alkoxyaralkyl group, or an optionally substituted alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amide group, an alkoxy.
  • R 5 represents a group, an organic group containing a sulfonyl group, or a combination thereof.
  • the R 5 is a group or atom attached to silicon atoms, each independently represent an alkoxy group, an aralkyloxy group, an acyloxy group, or a halogen atom.
  • d represents an integer of 0 to 3.
  • R 6 is a group bonded to a silicon atom by a Si—C bond, which is an alkyl group which may be substituted independently of each other, an aryl group which may be substituted, and a substituent.
  • R 7 is a group or atom bonded to a silicon atom, and independently represents an alkoxy group, an aralkyloxy group, an acyloxy group, or a halogen atom.
  • Y is a group bonded to a silicon atom by a Si—C bond and represents an alkylene group or an arylene group independently of each other.
  • e represents an integer of 0 or 1
  • f represents an integer of 0 or 1.
  • each group and atom in R 6 and R 7 and a suitable number of carbon atoms thereof include the above-mentioned groups and atoms and the number of carbon atoms.
  • Specific examples of the alkylene group in Y include linear chains such as methylene group, ethylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, heptamethylene group, octamethylene group, nonamethylene group and decamethylene group.
  • Alkane group 1-methyltrimethylene group, 2-methyltrimethylene group, 1,1-dimethylethylene group, 1-methyltetramethylene group, 2-methyltetramethylene group, 1,1-dimethyltrimethylene group, 1 , 2-dimethyltrimethylene group, 2,2-dimethyltrimethylene group, 1-ethyltrimethylene group and other branched chain alkylene groups and other alkylene groups, methanetriyl groups, ethane-1,1,2-triyl groups, ethane -1,2,2-triyl group, ethane-2,2,2-triyl group, propane-1,1,1-triyl group, propane-1,1,2-triyl group, propane-1,2,3 -Triyl group, propane-1,2,2-triyl group, propane-1,1,3-triyl group, butane-1,1,1-triyl group, butane-1,1,2-triyl group, butane- 1,1,3-triyl group, butane-1,2,3-triy
  • allylene group in Y include 1,2-phenylene group, 1,3-phenylene group, 1,4-phenylene group; 1,5-naphthalenedyl group, 1,8-naphthalenedyl group, 2, 6-naphthalenedyl group, 2,7-naphthalenedyl group, 1,2-anthracendiyl group, 1,3-anthracendiyl group, 1,4-anthracendiyl group, 1,5-anthracendiyl group, 1,6- Anthracendyl Group, 1,7-Anthracendyl Group, 1,8-Anthracendyl Group, 2,3-Anthracendiyl Group, 2,6-Anthracendyl Group, 2,7-Anthracendyl Group, 2,9-Anthracendil A group derived by removing two hydrogen atoms on the aromatic ring of a fused ring aromatic hydrocarbon compound such as a group, a 2,10-anthrac
  • Groups include, but are not limited to, groups derived by removing two hydrogen atoms on the aromatic ring of the ring-linked aromatic hydrocarbon compound of the 4,4 "-paraterphenyldiyl group.
  • e is preferably 0 or 1, and more preferably 0.
  • f is preferably 1.
  • hydrolyzable silane represented by the formula (2) examples include tetramethoxysilane, tetrachlorosilane, tetraacetoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetra-i-propoxysilane, and tetra-n.
  • hydrolyzable silane represented by the formula (3) examples include methylenebistrimethoxysilane, methylenebistrichlorosilane, methylenebistriacetoxysilane, ethylenebistriethoxysilane, ethylenebistrichlorosilane, ethylenebistriacetoxysilane, and propylenebistriethoxysilane.
  • the hydrolyzable silane compound that gives a hydrolyzable condensate contains other hydrolyzable silanes other than the amino group-containing silane represented by the formula (1)
  • the hydrolyzable silane compound is contained.
  • the content of other hydrolyzable silanes is usually 80 mol% to 99.99 mol%, preferably 95 mol% to 99.9 mol%.
  • the hydrolyzable silane compound preferably contains a hydrolyzable silane represented by the formula (2), and more preferably a trifunctional hydrolyzable silane represented by the formula (2) and a tetrafunctional. It contains a hydrolyzable silane represented by the property formula (2), more preferably contains at least one selected from alkyltrialkoxysilanes and aryltrialkoxysilanes, and tetraalkoxysilanes, and more preferably methyl.
  • the ratio of the hydrolyzable silane represented by the trifunctional formula (2) to the hydrolyzable silane represented by the tetrafunctional formula (2) is a molar ratio, usually 10:90. It is from 90:10, preferably 70:30 to 20:80.
  • An acidic compound containing two or more kinds of acidic groups is used for the hydrolysis and condensation of the hydrolyzable silane compound for obtaining the hydrolyzed condensate contained in the film-forming composition of the present invention.
  • the acidic compound containing two or more kinds of acidic groups is not particularly limited as long as it contains two or more acidic groups structurally different from each other, and may be either an inorganic acid or an organic acid.
  • the acidic compound containing two or more kinds of acidic groups is not limited to this, but typically contains an aromatic ring such as a benzene ring and two or more kinds of acidic groups, and is preferable.
  • At least one of two or more acidic groups is directly bonded to an aromatic ring such as a benzene ring, and more preferably, all two or more acidic groups are directly bonded to an aromatic ring such as a benzene ring. It has a structure that is similar to that of benzene.
  • the two or more acidic groups include two or more selected from the group consisting of a sulfonic acid group, a phosphoric acid group, a carboxy group and a phenolic hydroxy group, and in a more preferable embodiment, It contains at least one selected from the group consisting of a sulfonic acid group, a phosphoric acid group, a carboxy group and a phenolic hydroxy group, and at least one selected from the group consisting of a carboxy group and a phenolic hydroxy group.
  • Preferred combinations of two or more acidic groups are a sulfonic acid group and a phenolic hydroxy group, a sulfonic acid group and a carboxy group, a sulfonic acid group and a carboxy group and a phenolic hydroxy group, a phosphoric acid group and a phenolic hydroxy group, and phosphorus.
  • Examples thereof include, but are not limited to, an acid group and a carboxy group, a phosphoric acid group and a carboxy group and a phenolic hydroxy group, and a carboxy group and a phenolic hydroxy group.
  • the number of types of two or more acidic groups is two or more, but is usually 2 to 5, preferably 2 from the viewpoint of achieving good lithography characteristics with good reproducibility and the availability of compounds, respectively. It is, more preferably 2 or 3.
  • the number of two or more acidic groups is two or more, but is usually 2 to 5, preferably 2 to 4, respectively, from the viewpoint of achieving good lithography characteristics with good reproducibility and the availability of compounds, respectively. , More preferably 2 or 3.
  • a preferable example of the acidic compound is, but is not limited to, an acidic compound represented by the following formula (S).
  • S an acidic compound represented by the following formula (S).
  • Ar represents an aromatic ring having 6 to 20 carbon atoms such as a benzene ring and a naphthalene ring
  • RA represents an acidic group
  • RS represents a halogen atom, a nitro group, etc. independently of each other.
  • It represents a cyano group or a substituent such as an alkyl group having 1 to 10 carbon atoms such as a methyl group and an ethyl group
  • q represents the number of acidic groups bonded to the aromatic ring, and is an integer of 2 to 5.
  • r represents the number of substituents attached to the aromatic ring, is an integer of 0 to 3, the number q of R a represents a different group, the r pieces of R s, being the same or different May be.
  • acidic compounds containing two or more acidic groups include o-phenol sulfonic acid, m-phenol sulfonic acid, p-phenol sulfonic acid, 3-sulfosalicylic acid, 4-sulfosalicylic acid, 5-sulfosalicylic acid, 6 -Sulfosalicylic acid, o-phosphonobenzoic acid, m-phosphonobenzoic acid, p-phosphonobenzoic acid, 2-hydroxybenzoic acid, 3-hydroxybenzoic acid, 4-hydroxybenzoic acid, etc., o-hydroxyphenylphosphonic acid, m- Examples thereof include, but are not limited to, hydroxyphenylphosphonic acid and p-hydroxyphenylphosphonic acid.
  • the hydrolyzed condensate contained in the film-forming composition of the present invention uses the acidic compound described above to hydrolyze a hydrolyzable silane compound containing an amino group-containing silane represented by the above-described formula (1). It is obtained by condensation, but by using the amino group-containing silane and an acidic compound containing two or more acidic groups, as a monomer unit derived from the amino group-containing silane in the hydrolyzed condensate. A unit containing two or more kinds of amine salt structures can be realized, and as a result, the resistance of the composition for the resist film formed as the upper layer to the solvent, the good etching property to the fluorine-based gas, and the good lithography property can be realized. ..
  • the carboxy group and the phenolic hydroxy group can particularly contribute to the improvement of the lithography characteristics
  • the sulfonic acid group and the phosphoric acid group can particularly contribute to the improvement of the etching characteristics for the fluorine-based gas and the wet etching characteristics. Can be done.
  • the film-forming composition of the present invention contains a solvent.
  • a solvent is not limited as long as it dissolves the above-mentioned and the following hydrolyzable silanes, hydrolyzable condensates thereof and other components.
  • methyl cellosolve acetate ethyl cellosolve acetate
  • propylene glycol propylene glycol monomethyl ether
  • propylene glycol monoethyl ether methyl isobutyl carbinol
  • propylene glycol monobutyl ether propylene glycol monomethyl ether acetate
  • propylene glycol monoethyl ether acetate propylene glycol monoethyl ether acetate
  • the film-forming composition of the present invention may contain water as a solvent, and the content thereof is preferably 30% by mass or less, more preferably 20% by mass or less, based on the solvent contained in the composition. More preferably, it is 15% by mass or less.
  • the hydrolyzable silane may contain a hydrolyzable organosilane having an onium group in the molecule.
  • a hydrolyzable organosilane having an onium group in the molecule By using a hydrolyzable organosilane having an onium group in the molecule, the cross-linking reaction of the hydrolyzable silane can be effectively and efficiently promoted.
  • a suitable example of a hydrolyzable organosilane having such an onium group in the molecule is represented by the following formula (4).
  • R 31 is a group bonded to a silicon atom and is an onium group or an organic group containing the onium group independently of each other, and R 32 is a group bonded to a silicon atom and may be substituted alkyl group.
  • An organic group containing a group, a methacryloyl group, a mercapto group, an amino group or a cyano group, and R 33 is a group or atom that independently bonds to a silicon atom, and is an alkoxy group, an aralkyloxy group, an acyloxy group, Alternatively, it is a halogen atom, j represents 1 or 2, k represents 0 or 1, and 1 ⁇ j + k ⁇ 2 is satisfied.
  • substituents of the group, alkoxyaralkyl group and alkenyl group and the suitable number of carbon atoms thereof include the same as those described above.
  • the onium group examples include a cyclic ammonium group or a chain ammonium group, and a tertiary ammonium group or a quaternary ammonium group is preferable. That is, suitable specific examples of the onium group or the organic group containing the same include a cyclic ammonium group, a chain ammonium group, or an organic group containing at least one of these, and a tertiary ammonium group or a quaternary ammonium group. Alternatively, an organic group containing at least one of these is preferable.
  • the onium group is a cyclic ammonium group
  • the nitrogen atom constituting the ammonium group also serves as an atom constituting the ring.
  • R 31 is a heteroaromatic cyclic ammonium group represented by the following formula (S1).
  • a 1 , A 2 , A 3 and A 4 independently represent a group represented by any of the following formulas (J1) to (J3), but at least one of A 1 to A 4 is , a group represented by the following formula (J2), silicon atom in the formula (4), depending on whether combined with any of a 1 ⁇ a 4, and a 1 ⁇ a 4 respectively, adjacent to their respective Whether the bond between the atoms forming the ring together is a single bond or a double bond is determined so that the formed ring exhibits aromaticity.
  • R 30 independently represents a single bond, a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, an alkyl halide group, an aryl halide group, an aralkyl halide group or an alkenyl group, and an alkyl group, an aryl group, Specific examples of the aralkyl group, the alkyl halide group, the aryl halide group, the halogenated aralkyl group and the alkenyl group and the suitable number of carbon atoms thereof include the same as those described above.
  • R 34 independently represents an alkyl group, an aryl group, an aralkyl group, an alkyl halide group, an aryl halide group, an aralkyl halide group, an alkenyl group or a hydroxy group, and when two or more R 34s are present.
  • the two R 34s may be bonded to each other to form a ring, or the ring formed by the two R 34s may have a crosslinked ring structure.
  • the cyclic ammonium group may be a cyclic ammonium group. It will have an Adamantin ring, a Norbornen ring, a Spiro ring, and the like.
  • alkyl group an aryl group, an aralkyl group, an alkyl halide group, an aryl halide group, a halogenated aralkyl group and an alkenyl group, and suitable carbon atoms thereof are the same as those described above. Can be mentioned.
  • n 1 is an integer from 1 to 8
  • m 1 is 0 or 1
  • m 2 is a positive integer from 0 or 1 to the maximum number that can be replaced with a monocyclic or polycyclic ring.
  • a (4 + n 1 ) member ring including A 1 to A 4 is formed. That is, a 5-membered ring when n 1 is 1, a 6-membered ring when n 1 is 2, a 7-membered ring when n 1 is 3, and an 8-membered ring when n 1 is 4.
  • m 1 1, a condensed ring is formed in which a (4 + n 1 ) member ring containing A 1 to A 3 and a 6-member ring containing A 4 are condensed.
  • a 1 to A 4 may have a hydrogen atom on the atom constituting the ring or may not have a hydrogen atom depending on which of the formulas (J1) to (J3), but A 1 to A 1
  • the hydrogen atom may be replaced with R 34.
  • R 34 may be substituted with a ring-constituting atom other than the ring-constituting atom in A 1 to A 4.
  • m 2 is selected from 0 or 1 to the maximum number that can be replaced with a monocyclic or polycyclic integer.
  • the bond of the heteroaromatic cyclic ammonium group represented by the formula (S1) is present at any carbon atom or nitrogen atom present in such a monocyclic or fused ring, and is directly bonded to a silicon atom or bonded to a silicon atom.
  • the linking groups combine to form an organic group containing cyclic ammonium, which bonds to the silicon atom. Examples of such a linking group include, but are not limited to, an alkylene group, an arylene group, an alkaneylene group and the like. Specific examples of the alkylene group and the arylene group and the suitable number of carbon atoms thereof include the same as those described above.
  • the alkenylene group is a divalent group derived by further removing one hydrogen atom of the alkenyl group, and specific examples of such an alkenyl group include the same as those described above.
  • the number of carbon atoms of the alkenylene group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less. Specific examples thereof include, but are not limited to, vinylene, 1-methylvinylene, propenylene, 1-butenylene, 2-butenylene, 1-pentenylene, 2-pentenylene group and the like.
  • hydrolyzable organosilane represented by the formula (4) having a heteroaromatic cyclic ammonium group represented by the formula (S1) are given, but are not limited thereto.
  • R 31 is a heteroaliphatic cyclic ammonium group represented by the following formula (S2).
  • a 5 , A 6 , A 7 and A 8 independently represent a group represented by any of the following formulas (J4) to (J6), but at least one of A 5 to A 8 is , a group represented by the following formula (J5), silicon atom in the formula (4), depending on whether combined with any of a 5 ⁇ a 8, respectively a 5 ⁇ a 8, adjacent to their respective Whether the bond with the atom that constitutes the ring is a single bond or a double bond is determined so that the constituent ring exhibits non-aromaticity.
  • R 30 independently represents a single bond, a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, an alkyl halide group, an aryl halide group, an aralkyl halide group or an alkenyl group, and an alkyl group, an aryl group, Specific examples of the aralkyl group, the alkyl halide group, the aryl halide group, the halogenated aralkyl group and the alkenyl group and the suitable number of carbon atoms thereof include the same as those described above.
  • R 35 represents an alkyl group, an aryl group, an aralkyl group, an alkylyl halide group, an aryl halide group, an aralkyl halide group, an alkenyl group or a hydroxy group independently of each other, and when two or more R 35s are present.
  • the two R 35s may be bonded to each other to form a ring, or the ring formed by the two R 35s may have a crosslinked ring structure.
  • the cyclic ammonium group may be a cyclic ammonium group. It will have an Adamantin ring, a Norbornen ring, a Spiro ring, and the like.
  • alkyl group an aryl group, an aralkyl group, an alkyl halide group, an aryl halide group, a halogenated aralkyl group and an alkenyl group, and suitable carbon atoms thereof are the same as those described above. Can be mentioned.
  • n 2 is an integer from 1 to 8
  • m 3 is 0 or 1
  • m 4 is a positive integer from 0 or 1 to the maximum number that can be replaced with a monocyclic or polycyclic ring.
  • m 3 is 0, a (4 + n 2 ) member ring including A 5 to A 8 is formed. That is, a 5-membered ring when n 2 is 1, a 6-membered ring when n 2 is 2, a 7-membered ring when n 2 is 3, and an 8-membered ring when n 2 is 4.
  • a condensed ring is formed by condensing a (4 + n 2 ) member ring containing A 5 to A 7 and a 6-member ring containing A 8.
  • a 5 to A 8 may have a hydrogen atom on the atom constituting the ring or may not have a hydrogen atom, depending on which of the formulas (J4) to (J6), but A 5 When ⁇ A 8 has a hydrogen atom on the atom constituting the ring, the hydrogen atom may be replaced with R 35.
  • ring-constituting atom other than the ring member atoms in the A 5 ⁇ A 8, R 35 may be substituted.
  • m 4 is selected from 0 or 1 to the maximum number that can be replaced with a monocyclic or polycyclic integer.
  • the bond of the heteroaliphatic cyclic ammonium group represented by the formula (S2) is present at any carbon atom or nitrogen atom present in such a monocyclic or fused ring, and is directly bonded to a silicon atom or bonded to a silicon atom.
  • the linking groups combine to form an organic group containing cyclic ammonium, which bonds to the silicon atom. Examples of such a linking group include an alkylene group, an arylene group or an alkaneylene group, and specific examples of the alkylene group, the arylene group and the alkaneylene group and their suitable carbon atoms are the same as those described above. Be done.
  • hydrolyzable organosilane represented by the formula (4) having a heteroaliphatic cyclic ammonium group represented by the formula (S2) are given, but are not limited thereto.
  • R 31 is a chain ammonium group represented by the following formula (S3).
  • R 30 independently represents a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, an alkyl halide group, an aryl halide group, an aralkyl halide group or an alkenyl group, and an alkyl group, an aryl group, an aralkyl group, Specific examples of the alkyl halide group, the aryl halide group, the halogenated aralkyl group and the alkenyl group and the suitable number of carbon atoms thereof include the same as those described above.
  • the chain ammonium group represented by the formula (S3) is directly bonded to the silicon atom, or the linking group is bonded to form an organic group containing the chain ammonium group, which is bonded to the silicon atom.
  • Examples of such a linking group include an alkylene group, an arylene group or an alkaneylene group, and specific examples of the alkylene group, the arylene group and the alkaneylene group include the same as those described above.
  • hydrolyzable organosilane represented by the formula (4) having a chain ammonium group represented by the formula (S3) are given, but are not limited thereto.
  • the film-forming composition of the present invention may further contain a silane having a sulfone group and a silane having a sulfonamide group as the hydrolyzable silane. Specific examples thereof will be given below, but the present invention is not limited thereto.
  • the hydrolyzable silane compound may contain a hydrolyzable organosilane having a cyclic urea skeleton in the molecule, and specific examples thereof are not limited to this, but the following formula Examples thereof include hydrolyzable organosilanes represented by (5-1).
  • R 501 is a group bonded to a silicon atom, and independently of each other, represents a group represented by formula (5-2), and R 502 is a group bonded to a silicon atom.
  • R 503 is a group or atom bonded to a silicon atom and is an alkoxy group independently of each other.
  • alkyloxy, acyloxy group or halogen atom x is 1 or 2, y is 0 or 1, satisfies x + y ⁇ 2, alkyl group, aryl group, aralkyl group, halogenated R 502.
  • alkoxy group, aralkyloxy, acyloxy group and halogen atom and specific examples and preferred number of such carbon atoms of the substituents include the same as those described above for R 2 and R 3.
  • R 504 independently represents a hydrogen atom, an optionally substituted alkyl group, an optionally substituted alkenyl group, or an organic group containing an epoxy or sulfonyl group.
  • R 505 independently represent an alkylene group, a hydroxyalkylene group, a sulfide bond (-S-), an ether bond (-O-) or an ester bond (-CO-O- or -O-CO-). .
  • Specific examples of the optionally substituted alkyl group of R 504 , the optionally substituted alkenyl group and the organic group containing the epoxy group, the suitable number of carbon atoms and the like are the same as those described above for R 2.
  • an alkyl group in which the terminal hydrogen atom is substituted with a vinyl group is preferable, and specific examples thereof include an allyl group and 2-. Examples thereof include a vinylethyl group, a 3-vinylpropyl group and a 4-vinylbutyl group.
  • the organic group containing a sulfonyl group is not particularly limited as long as it contains a sulfonyl group, and is an alkylsulfonyl group which may be substituted, an arylsulfonyl group which may be substituted, and an aralkylsulfonyl group which may be substituted.
  • Examples thereof include an alkoxyarylsulfonyl group which may be present, an alkoxyaralkylsulfonyl group which may be substituted, an alkenylsulfonyl group which may be substituted, and the alkyl group, the aryl group, the aralkyl group, and the alkyl halide in these groups.
  • the alkylene group is a divalent group derived by further removing one hydrogen atom of the alkyl group, and may be linear, branched or cyclic, and specific examples of such an alkylene group include , The same as those mentioned above can be mentioned.
  • the number of carbon atoms of the alkylene group is not particularly limited, but is preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, still more preferably 10 or less.
  • the alkylene group of R 505 may have one or more selected from a sulfide bond, an ether bond and an ester bond at the end or in the middle, preferably in the middle.
  • Specific examples of the alkylene group include linear chains such as methylene group, ethylene group, trimethylene group, methylethylene group, tetramethylene group, pentamethylene group, hexamethylene group, heptamethylene group, octamethylene group, nonamethylene group and decamethylene group.
  • Alkylene group 1-methyltrimethylene group, 2-methyltrimethylene group, 1,1-dimethylethylene group, 1-methyltetramethylene group, 2-methyltetramethylene group, 1,1-dimethyltrimethylene group, 1 , 2-Dimethyltrimethylene group, 2,2-dimethyltrimethylene group, 1-ethyltrimethylene group and other branched chain alkylene groups, 1,2-cyclopropipandyl group, 1,2-cyclobutandyl, 1, Cyclic alkylene such as 3-cyclobutytandiyl group, 1,2-cyclohexanediyl, 1,3-cyclohexanediyl, etc., -CH 2 OCH 2- , -CH 2 CH 2 OCH 2- , -CH 2 CH 2 OCH 2 CH 2- , -CH 2 CH 2 OCH 2 CH 2 CH 2- , -CH 2 CH 2 CH 2 OCH 2 CH 2 CH 2- , -CH 2 CH 2 CH 2 OCH 2 CH 2 CH 2- , -
  • the hydroxyalkylene group has at least one hydrogen atom of the alkylene group replaced with a hydroxy group, and specific examples thereof include a hydroxymethylene group, a 1-hydroxyethylene group, a 2-hydroxyethylene group, and 1,2. -Dihydroxyethylene group, 1-hydroxytrimethylene group, 2-hydroxytrimethylene group, 3-hydroxytrimethylene group, 1-hydroxytetramethylene group, 2-hydroxytetramethylene group, 3-hydroxytetramethylene group, 4-hydroxy Tetramethylene group, 1,2-dihydroxytetramethylene group, 1,3-dihydroxytetramethylene group, 1,4-dihydroxytetramethylene group, 2,3-dihydroxytetramethylene group, 2,4-dihydroxytetramethylene group, 4 , 4-Dihydroxytetramethylene group and the like, but are not limited thereto.
  • X 501 represents a group represented by the following formulas (5-3) to (5-5) independently of each other, and also represents the following formulas (5-4) and (5-5).
  • the carbon atom of the ketone group in 5) is bonded to the nitrogen atom to which R505 is bonded in the formula (5-2).
  • R 506 to R 510 are independent of each other, a hydrogen atom or an optionally substituted alkyl group, an optionally substituted alkenyl group, or an epoxy group. Alternatively, it represents an organic group containing a sulfonyl group, and specific examples of an alkyl group which may be substituted, an alkenyl group which may be substituted and an organic group containing an epoxy group or a sulfonyl group, a suitable number of carbon atoms and the like are R. The same as those described above for 504 can be mentioned. Above all, the group represented by the formula (5-5) is preferable from the viewpoint of realizing excellent lithography characteristics with good reproducibility.
  • At least one of R 504 and R 506 to R 510 is an alkyl group in which a hydrogen atom at the terminal is substituted with a vinyl group.
  • the hydrolyzable organosilane represented by the above formula (5-1) may be a commercially available product, or may be synthesized by a known method described in International Publication No. 2011/102470 or the like.
  • the hydrolyzed condensate contained in the film-forming composition of the present invention includes an amino group-containing silane represented by the formula (1) and other silanes represented by the formula (2).
  • the hydrolyzed condensate contained in the film-forming composition of the present invention comprises an amino group represented by the formula (1).
  • the contained silane it contains other silanes represented by the formula (2), hydrolyzable organosilanes represented by the formula (5-1), and a hydrolyzed condensate obtained by using at least.
  • the weight average molecular weight of the hydrolyzed condensate in the present invention is usually 500 to 1,000,000, but is preferably 500,000 or less from the viewpoint of suppressing precipitation of the hydrolyzed condensate in the composition. , More preferably 250,000 or less, even more preferably 100,000 or less, and preferably 700 or more, more preferably 1,000 or more, from the viewpoint of achieving both storage stability and coatability.
  • the weight average molecular weight is a molecular weight obtained in terms of polystyrene by GPC analysis.
  • a GPC apparatus (trade name: HLC-8220GPC, manufactured by Toso Co., Ltd.) and a GPC column (trade names: Shodex KF803L, KF802, KF801, manufactured by Showa Denko KK) are used, the column temperature is set to 40 ° C., and elution is performed. This can be performed by using tetrahydrofuran as the liquid (eluting solvent), setting the flow rate (flow velocity) to 1.0 mL / min, and using polystyrene (manufactured by Showa Denko KK) as the standard sample.
  • the film-forming composition of the present invention may contain an organic acid, water, alcohol, etc. for the purpose of stabilizing the hydrolyzed condensate.
  • the film-forming composition of the present invention contains an organic acid, the content thereof is 0.1% by mass to 5.% by mass with respect to the total mass of the hydrolyzable silane, its hydrolyzate and its hydrolyzed condensate. It is 0% by mass.
  • the alcohol that can be contained in the film-forming composition of the present invention for the above purpose is preferably one that easily evaporates by heating after coating.
  • Specific examples thereof include lower aliphatic alcohols such as methanol, ethanol, propanol, isopropanol and butanol.
  • the film-forming composition of the present invention contains alcohol, the content thereof is 1 part by mass to 20 parts by mass with respect to 100 parts by mass of the composition.
  • the film-forming composition of the present invention may further contain an organic polymer compound, an acid generator, a surfactant and the like, if necessary.
  • the organic polymer compound that can be contained in the film-forming composition of the present invention is appropriately selected from various organic polymers (condensation polymer and addition polymer) according to the purpose of addition thereof.
  • organic polymers condensation polymer and addition polymer
  • Specific examples thereof include addition-polymerized polymers such as polyester, polystyrene, polyimide, acrylic polymer, methacrylic polymer, polyvinyl ether, phenol novolac, naphthol novolac, polyether, polyamide and polycarbonate, and depolymerized polymers.
  • an organic polymer containing an aromatic ring such as a benzene ring, a naphthalene ring, an anthracene ring, a triazine ring, a quinoline ring, a quinoxaline ring, or a heteroaromatic ring that functions as an absorption site also needs such a function.
  • an aromatic ring such as a benzene ring, a naphthalene ring, an anthracene ring, a triazine ring, a quinoline ring, a quinoxaline ring, or a heteroaromatic ring that functions as an absorption site also needs such a function.
  • organic polymer compounds include addition polymerizable properties such as benzyl acrylate, benzyl methacrylate, phenyl acrylate, naphthyl acrylate, anthryl methacrylate, anthryl methyl methacrylate, styrene, hydroxystyrene, benzyl vinyl ether and N-phenylmaleimide.
  • addition-polymerized polymers containing a monomer as a structural unit thereof and depolymerized polymers such as phenol novolac and naphthol novolac.
  • the polymer compound may be either a homopolymer or a copolymer.
  • Additive-polymerizable monomers are used in the production of add-polymerized polymers, and specific examples of such add-polymerizable monomers include acrylic acid, methacrylic acid, acrylic acid ester compounds, methacrylic acid ester compounds, acrylamide compounds, and methacrylic acids. Examples thereof include, but are not limited to, amide compounds, vinyl compounds, styrene compounds, maleimide compounds, maleic anhydride, acrylonitrile, and the like.
  • acrylic acid ester compound examples include methyl acrylate, ethyl acrylate, normal hexyl acrylate, isopropyl acrylate, cyclohexyl acrylate, benzyl acrylate, phenyl acrylate, anthryl methyl acrylate, 2-hydroxyethyl acrylate, and 3-chloro-2-hydroxy.
  • methacrylic acid ester compound examples include methyl methacrylate, ethyl methacrylate, normal hexyl methacrylate, isopropyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, phenyl methacrylate, anthrylmethyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, and 2 , 2,2-Trifluoroethyl methacrylate, 2,2,2-trichloroethyl methacrylate, 2-bromoethyl methacrylate, 4-hydroxybutyl methacrylate, 2-methoxyethyl methacrylate, tetrahydrofurfuryl methacrylate, 2-methyl-2-adamantyl Examples thereof include methacrylate, 5-methacryloyloxy-6-hydroxynorbornene-2-carboxylic-6-lactone, 3-methacryloxypropyltriethoxysi
  • acrylamide compound examples include acrylamide, N-methylacrylamide, N-ethylacrylamide, N-benzylacrylamide, N-phenylacrylamide, N, N-dimethylacrylamide, N-anthrylacrylamide and the like. Not limited.
  • methacrylamide compounds include methacrylamide, N-methylmethacrylamide, N-ethylmethacrylamide, N-benzylmethacrylamide, N-phenylmethacrylamide, N, N-dimethylmethacrylamide, and N-anthrylmethacrylamide. Etc., but are not limited to these.
  • vinyl compounds include vinyl alcohol, 2-hydroxyethyl vinyl ether, methyl vinyl ether, ethyl vinyl ether, benzyl vinyl ether, vinyl acetate, vinyl trimethoxysilane, 2-chloroethyl vinyl ether, 2-methoxyethyl vinyl ether, vinyl naphthalene and vinyl. Anthracene and the like can be mentioned, but the present invention is not limited to these.
  • styrene compound examples include, but are not limited to, styrene, hydroxystyrene, chlorostyrene, bromostyrene, methoxystyrene, cyanostyrene, acetylstyrene and the like.
  • maleimide compound examples include, but are not limited to, maleimide, N-methylmaleimide, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-hydroxyethylmaleimide and the like.
  • such a polymer includes, for example, a polycondensation polymer of a glycol compound and a dicarboxylic acid compound.
  • the glycol compound include diethylene glycol, hexamethylene glycol, butylene glycol and the like.
  • the dicarboxylic acid compound include succinic acid, adipic acid, terephthalic acid, maleic anhydride and the like.
  • polyesters such as polypyrromeritimide, poly (p-phenylene terephthalamide), polybutylene terephthalate, and polyethylene terephthalate, polyamides, and polyimides can be mentioned, but are not limited thereto.
  • the organic polymer compound contains a hydroxy group, the hydroxy group can undergo a cross-linking reaction with a hydrolyzed condensate or the like.
  • the weight average molecular weight of the organic polymer compound that can be contained in the film-forming composition of the present invention is usually 1,000 to 1,000,000, but is preferably 300 from the viewpoint of suppressing precipitation in the composition. It is 3,000 or less, more preferably 200,000 or less, even more preferably 100,000, and is preferably 3,000 or more, more preferably 5,000 or more, from the viewpoint of sufficiently obtaining the effect of the function as a polymer. , Even more preferably 10,000 or more.
  • Such organic polymer compounds can be used alone or in combination of two or more.
  • the film-forming composition of the present invention contains an organic polymer compound
  • its content cannot be unconditionally determined because it is appropriately determined in consideration of the function of the organic polymer compound and the like, but it is usually hydrolyzed of hydrolyzable silane.
  • It is in the range of 1% by mass to 200% by mass with respect to the mass of the condensate, and is preferably 100% by mass or less, more preferably 50% by mass or less, further from the viewpoint of suppressing precipitation in the composition. It is preferably 30% by mass or less, preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 30% by mass or more from the viewpoint of sufficiently obtaining the effect.
  • the film-forming composition of the present invention contains an acid generator
  • the acid generator include a thermal acid generator and a photoacid generator.
  • the photoacid generator include, but are not limited to, onium salt compounds, sulfonimide compounds, disulfonyldiazomethane compounds and the like.
  • the onium salt compound examples include diphenyliodonium hexafluorosulfonate, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium nonafluoronormal butane sulfonate, diphenyliodonium perfluoronormal octane sulfonate, diphenyliodonium camphor sulfonate, and bis (4-t-butyl).
  • Iodonium salt compounds such as phenyl) iodonium camphor sulfonate, bis (4-t-butylphenyl) iodonium trifluoromethane sulfonate, triphenyl sulfonium hexafluoroantimonate, triphenyl sulfonium nonafluoronormal butane sulfonate, triphenyl sulfonium camphor sulfonate, triphenyl Examples thereof include, but are not limited to, sulfonium salt compounds such as sulfonium trifluoromethane sulfonate.
  • sulfoneimide compound examples include N- (trifluoromethanesulfonyloxy) succinimide, N- (nonafluoronormal butanesulfonyloxy) succinimide, N- (kanfersulfonyloxy) succinimide, and N- (trifluoromethanesulfonyloxy) naphthalimide. Etc., but are not limited to these.
  • disulfonyldiazomethane compound examples include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, and bis (2,4-dimethylbenzene).
  • Sulfonyl) Diazomethane, methylsulfonyl-p-toluenesulfonyldiazomethane and the like can be mentioned, but are not limited thereto.
  • the acid generator can be used alone or in combination of two or more.
  • the film-forming composition of the present invention contains an acid generator
  • its content cannot be unconditionally defined because it is appropriately determined in consideration of the type of the acid generator and the like, but it is usually hydrolyzed and condensed with hydrolyzable silane. It is in the range of 0.01% by mass to 5% by mass with respect to the mass of the substance, and is preferably 3% by mass or less, more preferably 1% by mass, from the viewpoint of suppressing the precipitation of the acid generator in the composition. % Or less, preferably 0.1% by mass or more, and more preferably 0.5% by mass or more from the viewpoint of sufficiently obtaining the effect.
  • the surfactant is particularly effective in suppressing the occurrence of pinholes, stings, etc. when the film-forming composition of the present invention is applied to a substrate as a composition for forming a resist underlayer film for lithography.
  • Specific examples of such surfactants include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether, and polyoxyethylene octylphenyl ether.
  • Polyoxyethylene alkylallyl ethers such as polyoxyethylene nonylphenyl ether, polyoxyethylene / polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan triole Solbitan fatty acid esters such as ate and sorbitan tristearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristea.
  • Nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters such as rates, trade names Ftop EF301, EF303, EF352 (manufactured by Tochem Products Co., Ltd.), trade names Megafuck F171, F173, R-08, R -30, R-30N, R-40LM (manufactured by DIC Co., Ltd.), Florard FC430, FC431 (manufactured by Sumitomo 3M Co., Ltd.), trade name Asahi Guard AG710, Surfron S-382, SC101, SC102, SC103, SC104, Fluorosurfactants such as SC105 and SC106 (manufactured by AGC Co., Ltd.), organosiloxane polymer-KP341 (manufactured by Shin-Etsu Chemical Industry Co., Ltd.) and the like can be mentioned, but are not limited thereto.
  • the surfactant may be used alone or in combination of two or more.
  • the content thereof is usually in the range of 0.0001 parts by mass to 5 parts by mass with respect to 100 parts by mass of the hydrolyzed condensate (polyorganosiloxane). However, it is preferably 1 part by mass or less from the viewpoint of suppressing precipitation in the composition, and preferably 0.001 part by mass or more, more preferably 0.01 from the viewpoint of sufficiently obtaining the effect. It is more than a mass part.
  • the film-forming composition of the present invention preferably does not contain a curing catalyst as an additive.
  • a part of the additive may move into the resist film during the formation of the resist film or subsequent heating, which may cause deterioration of the characteristics, and this is to avoid this.
  • the film-forming composition of the present invention may contain a rheology adjuster, an adhesion aid, a pH adjuster and the like.
  • Rheology modifiers are effective in improving the fluidity of film-forming compositions.
  • the adhesion aid is effective in improving the adhesion between the resist underlayer film obtained from the film-forming composition of the present invention and the semiconductor substrate, the organic underlayer film or the resist film.
  • Bisphenol S or bisphenol S derivative can be added as a pH adjuster.
  • the content of bisphenol S or bisphenol S derivative is 0.01 part by mass to 20 part by mass, or 0.01 part to 10 part by mass, or 100 parts by mass with respect to 100 parts by mass of the hydrolyzed condensate (polyorganosiloxane). It is 0.01 parts by mass to 5 parts by mass.
  • the hydrolyzable condensate used in the present invention can be obtained by hydrolyzing and condensing the above-mentioned hydrolyzable silane compound.
  • the hydrolysis may be a complete hydrolysis or a partial hydrolysis, as described above.
  • the hydrolyzed condensate contained in the film-forming composition of the present invention may contain a partially hydrolyzed product as well as a completely hydrolyzed product.
  • hydrolyzable silane which is a monomer, may remain in the composition.
  • an acidic compound containing two or more kinds of acidic groups is used for hydrolysis and condensation of the hydrolyzable silane compound, and water is added from the viewpoint of obtaining the effect of the present invention with better reproducibility.
  • the acidic group of the acidic compound containing two or more kinds of acidic groups is usually 0.001 mol to 10 mol, preferably 0.002 mol to 5 mol, more preferably 0.002 mol to 5 mol, per 1 mol of the hydrolyzable group of the degradable silane compound.
  • the amount of the acidic compound containing two or more acidic groups is determined so as to be 0.003 mol to 3 mol, more preferably 0.005 mol to 2 mol, still more preferably 0.007 mol to 1 mol. do.
  • the hydrolyzable silane compound used in the present invention has an alkoxy group, an aralkyloxy group, an acyloxy group or a halogen atom that is directly bonded to a silicon atom, and has an alkoxysilyl group, an aralkyloxysilyl group, an acyloxysilyl group or a halogenated silyl.
  • a hydrolyzable group as a group, 0.5 mol to 100 mol, preferably 1 mol to 10 mol, of water is usually used per 1 mol of the hydrolyzable group.
  • a hydrolysis catalyst may be used for the purpose of promoting hydrolysis and condensation.
  • Specific examples thereof include, but are not limited to, metal chelate compounds, organic bases, and inorganic bases.
  • the hydrolyzing catalyst can be used alone or in combination of two or more, and the amount used is usually 0.001 to 10 mol, preferably 0.001 mol, per mol of the hydrolyzable group. ⁇ 1 mol.
  • metal chelate compound examples include triethoxy mono (acetylacetonet) titanium, tri-n-propoxymono (acetylacetoneate) titanium, tri-isopropoxymono (acetylacetonate) titanium, and tri-n-.
  • organic bases include pyridine, pyrrol, piperazin, pyrrolidine, piperidine, picolin, trimethylamine, triethylamine, monoethanolamine, diethanolamine, dimethylmonoethanolamine, monomethyldiethanolamine, triethanolamine, diazabicyclooctane, and diazabicyclo.
  • the inorganic base include, but are not limited to, ammonia, sodium hydroxide, potassium hydroxide, barium hydroxide, calcium hydroxide and the like.
  • a metal chelate compound is preferable as the hydrolysis catalyst.
  • an organic solvent When hydrolyzing and condensing, an organic solvent may be used as a solvent, and specific examples thereof include n-pentane, isopentane, n-hexane, isohexane, n-heptane, isoheptane, and 2,2,4-trimethylpentane.
  • N-octane isooctane, cyclohexane, methylcyclohexane and other aliphatic hydrocarbon solvents
  • benzene toluene, xylene, ethylbenzene, trimethylbenzene, methylethylbenzene, n-propylbenzene, isopropylbenzene, diethylbenzene, isobutylbenzene, triethylbenzene
  • Aromatic hydrocarbon solvents such as di-isopropylbenzene, n-amylnaphthalene; methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, s-butanol, t-butanol, n-pentanol, isopen Tanol, 2-methylbutanol, s-pentanol, t-pentanol,
  • Sulfur-containing solvents and the like can be mentioned, but the present invention is not limited thereto. These solvents can be used alone or in combination of two or more. Among these, acetone, methyl ethyl ketone, methyl-n-propyl ketone, methyl-n-butyl ketone, diethyl ketone, methyl-isobutyl ketone, methyl-n-pentyl ketone, ethyl-n-butyl ketone, methyl-n-hexyl ketone, di -Ketone-based solvents such as isobutyl ketone, trimethylnonanone, cyclohexanone, methylcyclohexanone, 2,4-pentandione, acetonylacetone, diacetone alcohol, acetophenone, and fenchon are preferable in terms of storage stability of the solution.
  • the reaction temperature for hydrolysis and condensation is usually 20 ° C to 80 ° C.
  • the amount of the amino group-containing silane represented by the formula (1) is the amount of the hydrolyzable silane among all the hydrolyzable silanes. It is usually 0.1 mol% or more, but from the viewpoint of obtaining the above-mentioned effect of the present invention with good reproducibility, it is preferably 0.5 mol% or more, more preferably 1 mol% or more, still more preferably 5 mol% or more. be.
  • the amount of these other silanes charged is in all the hydrolyzable silanes.
  • the amount of the organosilane charged is usually 0.01 mol% or more, preferably 0, among all the hydrolyzable silanes. .1 mol% or more, usually 30 mol% or less, preferably 10 mol% or less.
  • the amount of the organosilane charged is usually 0.1 mol% or more, preferably 0.1 mol% or more, among all the hydrolyzable silanes. Is 0.3 mol% or more, usually 50 mol% or less, preferably 30 mol% or less.
  • a hydrolyzable condensate can be produced by hydrolyzing and condensing the hydrolyzable silane compound under the conditions described above.
  • the acid catalyst used for hydrolysis can be removed by directly or diluting or concentrating the reaction solution, neutralizing it, or treating it with an ion exchange resin.
  • alcohol, water, catalyst and the like as by-products can be removed from the reaction solution by vacuum distillation or the like. If necessary, after such purification, the solvent is distilled off in whole or in part from the solution containing the hydrolyzed condensate to make the hydrolyzed condensate a solid or a solution containing the hydrolyzed condensate. Can be obtained as.
  • the film-forming composition of the present invention can be produced by mixing a hydrolyzed condensate of the above-mentioned hydrolyzable silane compound with a solvent and, if other components are contained, the other components.
  • a solution containing a hydrolyzed condensate or the like may be prepared in advance, and this solution may be mixed with a solvent or other components.
  • the mixing order is not particularly limited.
  • a solvent may be added to a solution containing a hydrolyzed condensate or the like and mixed, and other components may be added to the mixture.
  • the solution containing the hydrolyzed condensate or the like, the solvent and other components may be mixed at the same time. You may.
  • an additional solvent may be added at the end, or some components that are relatively soluble in the solvent may be added at the end without being included in the mixture, but the constituents may be aggregated or separated. From the viewpoint of preparing a composition having excellent uniformity with good reproducibility, it is preferable to prepare a solution in which a hydrolyzed condensate or the like is well dissolved and prepare the composition using the solution. It should be noted that the hydrolyzed condensate and the like may aggregate or precipitate when they are mixed, depending on the type and amount of the solvent to be mixed together, the amount and properties of other components, and the like.
  • the hydrolyzed condensate or the like is prepared so that the amount of the hydrolyzed condensate or the like in the finally obtained composition is a desired amount. Also keep in mind that it is necessary to determine the concentration of the solution and the amount used. In the preparation of the composition, heating may be appropriately performed as long as the components are not decomposed or deteriorated.
  • the film-forming composition may be filtered using a submicrometer-order filter or the like in the middle of manufacturing the composition or after mixing all the components.
  • the concentration of the solid content in the film-forming composition of the present invention is usually 0.1% by mass to 50% by mass with respect to the mass of the composition, but is preferable from the viewpoint of suppressing the precipitation of the solid content. It is 30% by mass or less, more preferably 25% by mass or less.
  • the proportion of the hydrolyzed condensate of the hydrolyzable silane compound in the solid content is usually 50% by mass or more, preferably 60% by mass or more, and more preferably 70% by mass from the viewpoint of obtaining the above-mentioned effects of the present invention with good reproducibility. % Or more, more preferably 80% by mass or more, still more preferably 90% by mass or more.
  • the film-forming composition of the present invention can be suitably used as a composition for forming a resist underlayer film used in a lithography process.
  • substrates used in the manufacture of semiconductor devices eg, silicon wafer substrates, silicon / silicon dioxide coated substrates, silicon nitride substrates, glass substrates, ITO substrates, polyimide substrates, and low dielectric constant materials.
  • a resist underlayer film-forming composition composed of the film-forming composition of the present invention is coated on a (low-k material) coated substrate, etc.) by an appropriate coating method such as a spinner or a coater, and then fired.
  • the resist underlayer film of the present invention is formed.
  • the firing conditions are usually appropriately selected from a firing temperature of 80 ° C. to 250 ° C. and a firing time of 0.3 minutes to 60 minutes, but preferably a firing temperature of 150 ° C. to 250 ° C. and a firing time of 0.5 minutes to 2 minutes.
  • the resist underlayer film of the present invention may further contain a metal oxide.
  • metal oxides include tin (Sn), titanium (Ti), aluminum (Al), zirconium (Zr), zinc (Zn), niobium (Nb), tantalum (Ta) and W (tungsten).
  • Metals such as boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), and metalloids such as tellurium (Te). Things can be mentioned, but not limited to these.
  • the film thickness of the resist underlayer film of the present invention is, for example, 10 nm to 1,000 nm, 20 nm to 500 nm, 50 nm to 300 nm, or 100 nm to 200 nm.
  • a photoresist film is formed on the resist underlayer film of the present invention.
  • the photoresist film can be formed by a well-known method, that is, by applying the composition for forming a photoresist film on the resist underlayer film of the present invention and firing it.
  • the film thickness of the photoresist film is, for example, 50 nm to 10,000 nm, 100 nm to 2,000 nm, or 200 nm to 1,000 nm.
  • a resist underlayer film of the present invention can be formed on the substrate, and a photoresist film can be further formed on the resist underlayer film of the present invention.
  • the pattern width of the photoresist film is narrowed, and even when the photoresist film is thinly coated in order to prevent the pattern from collapsing, the substrate can be processed by selecting an appropriate etching gas.
  • An oxygen-based gas capable of achieving an etching rate can be used as an etching gas to process an organic underlayer film, and a fluorine-based gas capable of achieving a sufficiently fast etching rate for an organic underlayer film can be used as an etching gas for a substrate. Processing can be performed.
  • the substrate and coating method that can be used at this time include the same as those described above.
  • the material of the photoresist film formed on the resist underlayer film of the present invention is not particularly limited as long as it is sensitive to light used for exposure. Both negative photoresist and positive photoresist materials can be used. Specific examples thereof include a positive photoresist material composed of novolak resin and 1,2-naphthoquinonediazide sulfonic acid ester, which is decomposed by an acid and dissolved in alkali.
  • a chemically amplified photoresist material consisting of a binder having a group that increases the rate and a photoacid generator, a low molecular weight compound that decomposes with an acid to increase the alkali dissolution rate of the photoresist, an alkali-soluble binder, and a photoacid generator.
  • Amplified photoresist materials and the like can be mentioned, but are not limited thereto.
  • Specific examples available as products include, but are not limited to, the product name APEX-E manufactured by Shipley, the product name PAR710 manufactured by Sumitomo Chemical Co., Ltd., and the product name SEPR430 manufactured by Shin-Etsu Chemical Co., Ltd.
  • Proc. SPIE, Vol. 3999, 330-334 (2000), Proc. SPIE, Vol. 3999,357-364 (2000), and Proc. SPIE, Vol. Fluorine-containing atomic polymer-based photoresist materials as described in 3999,365-374 (2000) can also be preferably used.
  • post-exposure heating is performed if necessary. Post-exposure heating is performed under appropriately selected conditions from a heating temperature of 70 ° C. to 150 ° C. and a heating time of 0.3 minutes to 10 minutes.
  • a resist material for electron beam lithography or a resist material for EUV lithography can be used as the resist material instead of the photoresist material.
  • the resist material for electron beam lithography both negative type and positive type can be used, and specific examples thereof are chemically amplified resists composed of an acid generator and a binder having a group that decomposes with an acid to change the alkali dissolution rate.
  • a chemically amplified resist material consisting of a material, an alkali-soluble binder, an acid generator, and a low-molecular-weight compound that decomposes with an acid to change the alkali dissolution rate of the resist, and a group that decomposes with an acid generator and an acid to change the alkali dissolution rate.
  • a chemically amplified resist material consisting of a low-molecular-weight compound that decomposes with an acid to change the alkali dissolution rate of the resist, and a non-chemically amplified resist material consisting of a binder that decomposes with an electron beam and changes the alkali dissolution rate.
  • Examples thereof include, but are not limited to, a resist material and a non-chemically amplified resist material composed of a binder having a site that is cut by an electron beam to change the alkali dissolution rate. Even when these resist materials for electron beam lithography are used, a resist pattern can be formed in the same manner as when a photoresist material is used with the irradiation source as an electron beam.
  • a resist material for EUV lithography a methacrylate resin-based resist material can be used as the resist material for EUV lithography.
  • the developing solution include an aqueous solution of an alkali metal hydroxide such as potassium hydroxide and sodium hydroxide, an aqueous solution of quaternary ammonium hydroxide such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline, and ethanolamine.
  • Alkaline aqueous solutions such as amine aqueous solutions such as propylamine and ethylenediamine can be mentioned, but the present invention is not limited thereto.
  • an organic solvent can be used as the developing solution. That is, after exposure, development is performed with a developing solution (organic solvent). As a result, for example, when a negative photoresist material is used, the photoresist film in the unexposed portion is removed, and a pattern of the photoresist film is formed.
  • a developing solution organic solvent
  • Specific examples of the organic solvent that can be used as such a developing solution include methyl acetate, butyl acetate, ethyl acetate, isopropyl acetate, amyl acetate, isoamyl acetate, ethyl methoxyacetate, ethyl ethoxyacetate, propylene glycol monomethyl ether acetate, and ethylene glycol.
  • the developer may contain a surfactant or the like.
  • Development is carried out under appropriately selected conditions from a temperature of 5 ° C. to 50 ° C. and a time of 10 seconds to 600 seconds.
  • the resist lower layer film (intermediate layer) of the present invention is removed using the pattern of the resist film (upper layer) thus formed as a protective film, and then the patterned resist film and the resist of the present invention are removed.
  • the organic lower layer film (lower layer) is removed by using the film composed of the lower layer film (intermediate layer) as a protective film.
  • the semiconductor substrate is processed using the patterned resist underlayer film (intermediate layer) and organic underlayer film (lower layer) of the present invention as protective films.
  • the resist underlayer film (intermediate layer) of the present invention in the portion from which the photoresist film has been removed is removed by dry etching to expose the semiconductor substrate.
  • dry etching of the resist underlayer film of the present invention tetrafluoromethane (CF 4 ), perfluorocyclobutane (C 4 F 8 ), perfluoropropane (C 3 F 8 ), trifluoromethane, carbon monoxide, argon, oxygen, Gases such as nitrogen, sulfur hexafluoride, difluoromethane, nitrogen trifluoride, chlorine trifluoride, chlorine, trichloroborane, and dichloroborane can be used.
  • a halogen-based gas for dry etching of the resist underlayer film. Dry etching with a halogen-based gas basically makes it difficult to remove the photoresist film made of an organic substance.
  • the resist underlayer film of the present invention containing a large amount of silicon atoms is rapidly removed by the halogen-based gas. Therefore, it is possible to suppress a decrease in the film thickness of the photoresist film due to dry etching of the resist underlayer film. As a result, the photoresist film can be used as a thin film.
  • the dry etching of the resist underlayer film is preferably performed by a fluorine-based gas
  • fluorine-based gas examples include tetrafluoromethane (CF 4 ), perfluorocyclobutane (C 4 F 8 ), and perfluoro propane (C 3 F 8 ).
  • CF 4 tetrafluoromethane
  • C 4 F 8 perfluorocyclobutane
  • C 3 F 8 perfluoro propane
  • Trifluoromethane, difluoromethane (CH 2 F 2 ) and the like but are not limited thereto.
  • the organic underlayer film is removed using the patterned photoresist film and the film composed of the resist underlayer film of the present invention as a protective film.
  • the organic lower layer film (lower layer) is preferably performed by dry etching with an oxygen-based gas. This is because the resist underlayer film of the present invention containing a large amount of silicon atoms is difficult to be removed by dry etching with an oxygen-based gas.
  • the processing of the semiconductor substrate is preferably performed by dry etching with a fluorine-based gas.
  • a fluorine-based gas examples include tetrafluoromethane (CF 4 ), perfluorocyclobutane (C 4 F 8 ), perfluoropropane (C 3 F 8 ), trifluoromethane, difluoromethane (CH 2 F 2 ) and the like.
  • CF 4 tetrafluoromethane
  • C 4 F 8 perfluorocyclobutane
  • C 3 F 8 perfluoropropane
  • trifluoromethane difluoromethane
  • CH 2 F 2 difluoromethane
  • An organic antireflection film can be formed on the upper layer of the resist underlayer film of the present invention before the photoresist film is formed.
  • the antireflection film composition used therefor is not particularly limited, and for example, it can be arbitrarily selected and used from those conventionally used in the lithography process, and a commonly used method, for example, is used.
  • the antireflection film can be formed by coating and firing with a spinner or coater.
  • the substrate on which the resist underlayer film forming composition composed of the film forming composition of the present invention is applied has an organic or inorganic antireflection film formed by a CVD method or the like on its surface.
  • the resist underlayer film of the present invention can be formed on the resist underlayer film of the present invention.
  • the substrate to be used is an organic or inorganic antireflection film formed on the surface thereof by a CVD method or the like. It may have.
  • the resist underlayer film formed from the resist underlayer film forming composition of the present invention may also have absorption for the light depending on the wavelength of the light used in the lithography process. Then, in such a case, it can function as an antireflection film having an effect of preventing the reflected light from the substrate. Further, the resist underlayer film of the present invention has an adverse effect on the substrate, such as a layer for preventing interaction between the substrate and the photoresist film, a material used for the photoresist film, or a substance generated during exposure to the photoresist film.
  • a layer having a function of preventing As a layer having a function of preventing, a layer having a function of preventing the diffusion of substances generated from the substrate during heating and firing into the photoresist film, and a barrier layer for reducing the poisoning effect of the photoresist film by the dielectric layer of the semiconductor substrate, etc. It is also possible to use it.
  • the resist underlayer film formed from the resist underlayer film forming composition of the present invention is applied to a substrate on which via holes are formed, which is used in the dual damascene process, and is a hole filling material (embedding material) capable of filling holes without gaps. Can be used as. It can also be used as a flattening material for flattening the surface of a semiconductor substrate having irregularities.
  • the underlayer film of EUV resist it can be used for the following purposes in addition to the function as a hard mask.
  • an underlayer antireflection film of an EUV resist that can prevent reflection of unfavorable exposure light, such as the deep ultraviolet (DUV) light described above, from the substrate or interface without intermixing with the EUV resist film.
  • DUV deep ultraviolet
  • the composition for forming a resist underlayer film of the present invention can be used. Reflection can be efficiently prevented as an underlayer film of the EUV resist film.
  • the process can be carried out in the same manner as a photoresist underlayer.
  • the film-forming composition of the present invention described above can be suitably used for manufacturing a semiconductor element, and the method for manufacturing a semiconductor element of the present invention, for example, a step of forming an organic underlayer film on a substrate, and the above.
  • the method for manufacturing a semiconductor element including the step of performing, good production of a highly reliable semiconductor element can be expected.
  • the weight average molecular weight is a molecular weight obtained in terms of polystyrene by GPC analysis.
  • GPC analysis a GPC apparatus (trade name: HLC-8220GPC, manufactured by Toso Co., Ltd.) and a GPC column (trade names: Shodex KF803L, KF802, KF801, manufactured by Showa Denko KK) were used, the column temperature was set to 40 ° C., and the eluent was used.
  • the solid content concentration of the obtained concentrated liquid exceeded 20% by mass in terms of solid residue when heated at 140 ° C.
  • propylene glycol monoethyl ether is added to the obtained concentrated solution, the concentration is adjusted so as to be 20% by mass in terms of solid residue when heated at 140 ° C., and propylene glycol monoethyl ether is used as a solvent.
  • a solution of the hydrolyzed condensate (polymer) solid content concentration 20% by mass
  • the obtained polymer contained a structure represented by the formula (E1), and its weight average molecular weight (Mw) was 2,000 in terms of polystyrene by GPC.
  • Synthesis Example 2 The same method as in Synthesis Example 1 was used except that 20.4 g of a 5-sulfosalicylic acid aqueous solution (concentration 0.2 mol / L) was used instead of 20.4 g of the p-phenol sulfonic acid aqueous solution (concentration 0.2 mol / L). , A solution of a hydrolyzed condensate (polymer) (solid content concentration 20% by mass) was obtained. The obtained polymer contained a structure represented by the formula (E2), and its weight average molecular weight (Mw) was 2,100 in terms of polystyrene by weight average molecular weight by GPC.
  • E2 weight average molecular weight
  • Synthesis Example 5 The same method as in Synthesis Example 1 except that 20.4 g of a p-phosphonobenzoic acid aqueous solution (concentration 0.2 mol / L) was used instead of 20.4 g of the p-phenol sulfonic acid aqueous solution (concentration 0.2 mol / L). A solution of the hydrolyzed condensate (polymer) (solid content concentration 20% by mass) was obtained. The obtained polymer contained a structure represented by the formula (E5), and its weight average molecular weight (Mw) was 2,400 in terms of polystyrene by weight average molecular weight by GPC.
  • Synthesis Example 6 The same method as in Synthesis Example 1 except that 20.4 g of a 4-hydroxybenzoic acid aqueous solution (concentration 0.2 mol / L) was used instead of 20.4 g of the p-phenol sulfonic acid aqueous solution (concentration 0.2 mol / L). A solution (solid content concentration: 20% by mass) of a hydrolyzed aqueous solution (polymer) was obtained.
  • the obtained polymer contained a structure represented by the formula (E6), and its weight average molecular weight (Mw) was 2,200 in terms of polystyrene by weight average molecular weight by GPC.
  • the solid content concentration of the obtained concentrated liquid exceeded 20% by mass in terms of solid residue when heated at 140 ° C.
  • propylene glycol monoethyl ether is added to the obtained concentrated solution, the concentration is adjusted so as to be 20% by mass in terms of solid residue when heated at 140 ° C., and propylene glycol monoethyl ether is used as a solvent.
  • a solution of the hydrolyzed condensate (polymer) solid content concentration 20% by mass
  • the obtained polymer contained a structure represented by the formula (E7), and its weight average molecular weight (Mw) was 2,200 in terms of polystyrene by weight average molecular weight by GPC.
  • propylene glycol monoethyl ether is added to the obtained concentrated solution, the concentration is adjusted so as to be 20% by mass in terms of solid residue when heated at 140 ° C., and propylene glycol monoethyl ether is used as a solvent.
  • a solution of the hydrolyzed condensate (polymer) (solid content concentration 20% by mass) was obtained.
  • the obtained polymer contained a structure represented by the formula (E8), and its weight average molecular weight (Mw) was 2,000 in terms of polystyrene by GPC.
  • a mixed solution of 0 g and 0.36 g of dimethylaminopropyltrimethoxysilane [manufactured by Tokyo Chemical Industry Co., Ltd.] was added dropwise. After the dropping, the flask was transferred to an oil bath adjusted to 60 ° C. and refluxed for 240 minutes. Then, ethanol, methanol and water were distilled off under reduced pressure to obtain a concentrated solution of a hydrolyzed condensate (polymer) using propylene glycol monoethyl ether as a solvent. The solid content concentration of the obtained concentrated liquid exceeded 20% by mass in terms of solid residue when heated at 140 ° C.
  • propylene glycol monoethyl ether is added to the obtained concentrated solution, the concentration is adjusted so as to be 20% by mass in terms of solid residue when heated at 140 ° C., and propylene glycol monoethyl ether is used as a solvent.
  • a solution of the hydrolyzed condensate (polymer) (solid content concentration 20% by mass) was obtained.
  • the obtained polymer contained a structure represented by the formula (E9), and its weight average molecular weight (Mw) was 1,900 in terms of polystyrene by GPC.
  • the solid content concentration of the obtained concentrated liquid exceeded 20% by mass in terms of solid residue when heated at 140 ° C.
  • propylene glycol monoethyl ether is added to the obtained concentrated solution, the concentration is adjusted so as to be 20% by mass in terms of solid residue when heated at 140 ° C., and propylene glycol monoethyl ether is used as a solvent.
  • a solution of the hydrolyzed condensate (polymer) solid content concentration 20% by mass
  • the obtained polymer contained a structure represented by the formula (E10), and its weight average molecular weight (Mw) was 2,700 in terms of polystyrene by GPC.
  • the flask was transferred to an oil bath adjusted to 60 ° C. and refluxed for 240 minutes. Then, ethanol, methanol and water were distilled off under reduced pressure to obtain a concentrated solution of a hydrolyzed condensate (polymer) using propylene glycol monoethyl ether as a solvent.
  • the solid content concentration of the obtained concentrated liquid exceeded 20% by mass in terms of solid residue when heated at 140 ° C.
  • 0.36 g of N, N-dimethyl-3- (trimethoxysilyl) propan-1-amine and 0.27 g of p-phenolsulfonic acid were dissolved in propylene glycol monoethyl ether to obtain the obtained solution.
  • the concentration is adjusted so that it becomes 20% by mass in terms of solid residue when heated at 140 ° C., and a solution (solid content) of a hydrolyzed condensate (polymer) using propylene glycol monoethyl ether as a solvent. A concentration of 20% by mass) was obtained.
  • the obtained polymer contained a structure represented by the formula (E11), and its weight average molecular weight (Mw) was 2,500 in terms of polystyrene by GPC.
  • the flask was transferred to an oil bath adjusted to 60 ° C. and refluxed for 240 minutes. Then, ethanol, methanol and water were distilled off under reduced pressure to obtain a concentrated solution of a hydrolyzed condensate (polymer) using propylene glycol monoethyl ether as a solvent.
  • the solid content concentration of the obtained concentrated liquid exceeded 20% by mass in terms of solid residue when heated at 140 ° C.
  • 0.47 g of 1- (3- (triethoxysilyl) propyl) -4,5-dihydro-1H-imidazole and 0.34 g of 5-sulfosalicylic acid were dissolved in propylene glycol monoethyl ether.
  • a solution of a hydrolyzed condensate (polymer) using propylene glycol monoethyl ether as a solvent, with the concentration adjusted to 20% by mass in terms of solid residue when heated at 140 ° C. (Solid content concentration 20% by mass) was obtained.
  • the obtained polymer contained a structure represented by the formula (E12), and its weight average molecular weight (Mw) was 2,500 in terms of polystyrene by GPC.
  • composition for forming an organic underlayer film Carbazole (6.69 g, 0.040 mol, manufactured by Tokyo Chemical Industry Co., Ltd.), 9-fluorenone (7.28 g, 0. 040 mol, manufactured by Tokyo Chemical Industry Co., Ltd., paratoluenesulfonic acid monohydrate (0.76 g, 0.0040 mol, manufactured by Tokyo Chemical Industry Co., Ltd.) is added, and 1,4-dioxane (6.69 g, Kanto) is added. Chemical Co., Ltd. was charged, stirred, heated to 100 ° C., dissolved, and polymerization was started. After 24 hours, it was allowed to cool to 60 ° C.
  • the film obtained from the film-forming composition of the present invention showed good resistance to solvents and developers.
  • the composition for forming an organic underlayer film was similarly applied onto a silicon wafer using a spinner and heated on a hot plate at 215 ° C. for 1 minute to form an organic underlayer film (film thickness 0.20 ⁇ m). ).
  • O an etching gas
  • the dry etching rate was measured using 2 gases. The results obtained are shown in Table 3. The dry etching rate using the O 2 gas was expressed as a ratio (resistance) to the dry etching rate of the organic underlayer film.
  • the film obtained from the film-forming composition of the present invention exhibits a high etching rate for fluorine-based gas and has better resistance to oxygen-based gas as compared with the organic underlayer film. Indicated.
  • the film obtained from the film-forming composition of the present invention showed a good wet etch rate with respect to the wet etching chemical solution.
  • the film obtained from the film-forming composition of the present invention functioned well as a resist underlayer film, and excellent lithography characteristics could be realized.
  • the film obtained from the film-forming composition of the present invention functioned well as a resist underlayer film, and excellent lithography characteristics could be realized.

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JP2017020000A (ja) * 2015-06-15 2017-01-26 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 湿式剥離性シリコン含有反射防止剤

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