WO2021201144A1 - 表示装置および電子機器 - Google Patents

表示装置および電子機器 Download PDF

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Publication number
WO2021201144A1
WO2021201144A1 PCT/JP2021/013957 JP2021013957W WO2021201144A1 WO 2021201144 A1 WO2021201144 A1 WO 2021201144A1 JP 2021013957 W JP2021013957 W JP 2021013957W WO 2021201144 A1 WO2021201144 A1 WO 2021201144A1
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WIPO (PCT)
Prior art keywords
cathode electrode
display device
light emitting
sub
protective layer
Prior art date
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Ceased
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PCT/JP2021/013957
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English (en)
French (fr)
Japanese (ja)
Inventor
昌志 内田
加藤　裕
直也 笠原
崇 山崎
朋和 大地
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Sony Semiconductor Solutions Corp
Sony Group Corp
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Sony Semiconductor Solutions Corp
Sony Group Corp
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Application filed by Sony Semiconductor Solutions Corp, Sony Group Corp filed Critical Sony Semiconductor Solutions Corp
Priority to EP21781407.8A priority Critical patent/EP4131221A4/en
Priority to US17/910,221 priority patent/US20230109576A1/en
Priority to JP2022512647A priority patent/JPWO2021201144A1/ja
Priority to KR1020227030643A priority patent/KR20220160556A/ko
Priority to CN202180024234.8A priority patent/CN115336390A/zh
Priority to KR1020257025227A priority patent/KR20250121451A/ko
Publication of WO2021201144A1 publication Critical patent/WO2021201144A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/876—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/17—Carrier injection layers
    • H10K50/171—Electron injection layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
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    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H—ELECTRICITY
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/10—Transparent electrodes, e.g. using graphene
    • H10K2102/101—Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
    • H—ELECTRICITY
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80522—Cathodes combined with auxiliary electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • This disclosure relates to a display device and an electronic device including the display device.
  • a display device using an organic EL element has a structure in which an organic layer including at least an organic light emitting layer and a second electrode are laminated on a first electrode formed so as to be separated from each other for each pixel.
  • One pixel is composed of a plurality of sub-pixels such as RGB.
  • Patent Document 1 proposes an organic light emitting device in which an upper electrode is composed of a first upper electrode and a second upper electrode provided directly on the first upper electrode.
  • the organic light emitting layer in the patterning step of the first upper electrode and the second upper electrode, the organic light emitting layer is exposed to a process gas, a chemical solution, or the like and is damaged. to degrade. Therefore, the organic light emitting device described in Patent Document 1 has a problem that the reliability is lowered.
  • An object of the present disclosure is to provide a display device capable of suppressing a decrease in reliability and an electronic device provided with the display device.
  • the first disclosure includes an anode electrode, an organic light emitting layer, and a first cathode electrode, and the anode electrode, the organic light emitting layer, and the first cathode are separated for each subpixel.
  • a plurality of light emitting elements, a protective layer covering the plurality of light emitting elements, and a second cathode electrode provided on the protective layer are provided, and the second cathode electrode is a separated first cathode. It is a display device connected to an electrode.
  • the second disclosure includes a first electrode, an organic light emitting layer, and a second electrode, and the second electrode, the organic light emitting layer, and the second electrode are separated for each subpixel.
  • a display device including an element, a protective layer covering a plurality of light emitting elements, and a third electrode provided on the protective layer, and the third electrode is connected to each separated second electrode.
  • the third disclosure is an electronic device including the display device of the first disclosure or the second disclosure.
  • the protective layer has a contact hole, and the second cathode electrode may be connected to each separated first cathode electrode via the contact hole.
  • the shape of the sub-pixel may be substantially elliptical, approximately hexagonal, approximately square or approximately rectangular.
  • the plurality of light emitting elements are configured to be capable of emitting blue light, a plurality of first light emitting elements configured to be able to emit red light, a plurality of second light emitting elements configured to be able to emit green light, and a plurality of second light emitting elements configured to be able to emit green light. It may also include a plurality of third light emitting elements. The plurality of light emitting elements may be configured to be capable of emitting white light.
  • the first cathode electrode and the second cathode electrode may independently contain a transparent metal oxide, metal or alloy.
  • Metal oxides include indium-zinc oxide (IZO), indium-tin oxide (ITO), zinc oxide (ZnO), tin oxide (SnO), aluminum-zinc oxide (AZO) and gallium-zinc oxide (ZO). It may contain at least one selected from the group consisting of GZO).
  • the metal may contain at least one selected from the group consisting of aluminum (Al), silver (Ag), magnesium (Mg), calcium (Ca), sodium (Na) and strontium (Sr).
  • the alloys are alkali metal or alkaline earth metal and Ag alloy, magnesium (Mg) and silver (Ag) alloy, magnesium (Mg) and calcium (Ca) alloy, and aluminum (Al) and lithium (Li). ) May contain at least one selected from the group consisting of alloys with.
  • the first cathode electrode may contain a transparent metal oxide
  • the second cathode electrode may contain a metal or alloy.
  • the resonator structure may be configured for each sub-pixel by the anode electrode and the second cathode electrode.
  • the first cathode electrode may contain a metal or alloy
  • the second cathode electrode may contain a transparent metal oxide.
  • the resonator structure may be configured for each sub-pixel by the anode electrode and the first cathode electrode.
  • the protective layer may contain at least one of an inorganic oxide and an organic insulating material.
  • the inorganic oxide contains, for example, at least one selected from the group consisting of silicon nitride (SiN), silicon oxide (SiO), silicon oxynitride (SiON), aluminum oxide (AlO) and titanium oxide (TIO). May be good.
  • the protective layer may be a single-layer film or a multilayer film.
  • the multilayer film comprises first to nth layers, and these first to nth layers may contain different materials, for example, different inorganic oxides or organic insulating materials.
  • the plurality of sub-pixels includes a plurality of red sub-pixels, a plurality of green sub-pixels, and a plurality of blue sub-pixels, and the thickness of the protective layer on the separated first cathode electrode is a red sub-pixel.
  • the green sub-pixel and the blue sub-pixel may be substantially the same.
  • the sub-pixels are provided with a resonator structure that resonates the light generated in the organic light emitting layer, and the plurality of sub-pixels include a plurality of red sub-pixels, a plurality of green sub-pixels, and a plurality of blue sub-pixels.
  • the thickness of the protective layer on the separated first cathode electrode may be different for each of the red sub-pixel, the green sub-pixel, and the blue sub-pixel.
  • the resonator structure may be composed of an anode electrode and a second cathode electrode.
  • the first cathode electrode and the second cathode electrode may be connected outside the light emitting region of the sub-pixel.
  • the number of connecting portions between the first cathode electrode and the second cathode electrode may be one or two or more for one sub-pixel. From the viewpoint of improving the conductivity between the first cathode electrode and the second cathode electrode, the number of connecting portions between the first cathode electrode and the second cathode electrode is 2 for one sub-pixel. It is preferably more than one.
  • the second cathode electrode has a plurality of contact portions, and one contact portion may be connected to two or more sub-pixels.
  • connection portion between the first cathode electrode and the second cathode electrode may have a point shape or a linear shape.
  • the point shape or the linear shape is a shape when the connection portion is viewed in a plan view from a direction perpendicular to the display surface of the display device.
  • the point connection may be substantially triangular, approximately quadrangular, approximately circular, approximately hexagonal, approximately octagonal or linear.
  • the first cathode electrode has a facing surface facing the second anode electrode, and the linear connecting portion may be provided along the peripheral edge of the facing surface.
  • the second cathode electrode may be connected to the end of the first cathode electrode.
  • the first cathode electrode may have a protruding portion protruding from the peripheral edge of the light emitting region of the light emitting element, and the second cathode electrode may be connected to the first cathode electrode at the protruding portion.
  • the light emitting element may have a notch on the periphery of the light emitting region of the light emitting element, and the second cathode electrode may be connected to the first cathode electrode at the notch.
  • the protective layer has a plurality of air gaps, and each of the plurality of air gaps may be provided between adjacent sub-pixels.
  • the display device may further include a protective layer covering the second cathode electrode.
  • the display device may further include a color filter provided so as to face the plurality of light emitting elements, or may further include an on-chip color filter provided on the plurality of light emitting elements.
  • the first electrode may be the anode electrode
  • the second electrode and the third electrode may be the first cathode electrode and the second cathode electrode, respectively, and the first electrode is the cathode electrode and the first electrode.
  • the second electrode and the third electrode may be the first electrode and the second electrode, respectively.
  • FIG. 3A is a cross-sectional view taken along the line IV-line IV of FIG. 3A.
  • FIG. 5 is an enlarged cross-sectional view showing the organic layer shown in FIG.
  • FIG. 1 is a plan view showing an example of the overall configuration of the organic EL display device 10 (hereinafter, simply referred to as “display device 10”) according to the first embodiment of the present disclosure.
  • the display device 10 is suitable for use in various electronic devices, and a display area 110A and a peripheral area 110B are provided on the periphery of the display area 110A on the substrate 11.
  • a plurality of sub-pixels (sub-pixels) 100R, 100G, and 100B are arranged in a matrix in the display area 110A.
  • the sub-pixel 100R displays red
  • the sub-pixel 100G displays green
  • the sub-pixel 100B displays blue.
  • the red, green, and blue sub-pixels 100R, 100G, and 100B are not particularly distinguished, they are referred to as sub-pixels 100.
  • the peripheral area 110B is provided with a signal line drive circuit 111 and a scanning line drive circuit 112, which are drivers for displaying images.
  • the signal line drive circuit 111 supplies the signal voltage of the video signal corresponding to the luminance information supplied from the signal supply source (not shown) to the sub-pixel 100 selected via the signal line 111A.
  • the scanning line drive circuit 112 is composed of a shift register or the like that sequentially shifts (transfers) the start pulse in synchronization with the input clock pulse.
  • the scanning line drive circuit 112 scans the video signals in line units when writing the video signals to the sub-pixels 100, and sequentially supplies the scanning signals to the scanning lines 112A.
  • the display device 10 is, for example, a microdisplay in which self-luminous elements such as OLED, Micro-OLED, and Micro-LED are formed in an array.
  • the display device 10 is suitable for use in a display device for VR (Virtual Reality), MR (Mixed Reality) or AR (Augmented Reality), an electronic viewfinder (EVF), a small projector, or the like. be.
  • FIG. 2 is a cross-sectional view showing an example of the configuration of the display device 10 according to the first embodiment of the present disclosure.
  • the display device 10 is a top emission type display device, and is a substrate 11 having one main surface, a plurality of light emitting elements (first light emitting elements) 12R provided on one main surface of the substrate 11, and a plurality of light emitting elements.
  • a protective layer 14 that covers an element (second light emitting element) 12G, a plurality of light emitting elements (third light emitting element) 12B and an insulating layer 13, a plurality of light emitting elements 12R, a plurality of light emitting elements 12G and a plurality of light emitting elements 12B.
  • a second cathode electrode 124 provided on the protective layer 14 and a protective layer 15 covering the second cathode electrode 124 are provided. Even if the display device 10 further includes a filled resin layer (not shown) provided on the protective layer 15 and an opposing substrate (not shown) provided on the filled resin layer, if necessary. good.
  • the protective layer 15 side is the top side, and the substrate 11 side is the bottom side. In the following description, when the light emitting elements 12R, 12G, and 12B are not particularly distinguished, they are referred to as a light emitting element 12.
  • 3A, 3B, 3C, and 3D are plan views showing shape examples of the sub-pixel 100, respectively.
  • the sub-pixels 100R, 100G, and 100B are composed of a light emitting element 12R, a light emitting element 12G, and a light emitting element 12B, respectively.
  • the shape of the sub-pixel 100 is, for example, a substantially elliptical shape (see FIG. 3A), a substantially hexagon (see FIG. 3B), a substantially square (see FIG. 3C), a substantially rectangular shape (see FIG. 3D), or the like. Two or more shapes may be used in combination.
  • the term "rectangle" means a quadrangle having two long sides and two short sides and having four internal angles at right angles.
  • the shapes such as substantially elliptical shape, substantially hexagonal shape, substantially square shape, and substantially rectangular shape include shapes such as elliptical shape, hexagonal shape, square shape, and rectangular shape in which a part of the peripheral edge protrudes (FIGS. 3A and 3B, FIG. (See FIGS. 3C, 3D, etc.) and shapes such as ellipses, hexagons, squares, rectangles, etc. in which a part of the peripheral edge is cut out (see FIGS. 11A, 11B, 11C, etc.) are also included.
  • FIG. 1 shows an example in which the sub-pixel 100 is substantially square.
  • the sub-pixels 100 are two-dimensionally arranged in a predetermined pattern.
  • the plurality of sub-pixels 100 having a substantially elliptical shape may be arranged in a staggered pattern so that the major axis directions of the sub-pixels 100 are aligned (see FIG. 3A).
  • the plurality of sub-pixels 100 having a substantially hexagonal shape may be arranged in a honeycomb shape (see FIG. 3B).
  • the plurality of sub-pixels 100 having a substantially square shape may be arranged in a matrix (see FIG. 3C).
  • a plurality of sub-pixels 100 having a substantially rectangular shape may be arranged in a stripe shape (see FIG. 3D).
  • Sub-pixels 100R, 100G, and 100B may be arranged in the repeating row direction.
  • One pixel is formed by the combination of three adjacent sub-pixels 100R, 100G, and 100B.
  • the sub-pixel 100 that is, the light emitting element 12, has a light emitting region 101.
  • the light emitting region 101 may have the same shape as the sub-pixel 100. That is, the sub-pixel 100 having a substantially elliptical shape, a substantially hexagonal shape, a substantially square shape, and a substantially rectangular shape may have a light emitting region 101 having a substantially elliptical shape, a substantially hexagonal shape, a substantially square shape, and a substantially rectangular shape, respectively.
  • the plurality of light emitting elements 12 are two-dimensionally arranged on one main surface of the substrate 11 in a predetermined pattern.
  • the plurality of light emitting elements 12 include a plurality of light emitting elements 12R, a plurality of light emitting elements 12G, and a plurality of light emitting elements 12B.
  • the light emitting element 12R is a red OLED configured to be able to emit red light.
  • the light emitting element 12G is a green OLED configured to be able to emit green light.
  • the light emitting element 12B is a blue OLED configured to be able to emit blue light.
  • the light emitting element 12 may be a Micro-OLED (MOLED) or a Micro-LED.
  • the light emitting element 12R includes an anode electrode 121 provided on the substrate 11, an organic layer 122R provided on the anode electrode 121, and a first cathode electrode 123 provided on the organic layer 122R.
  • the light emitting element 12G includes an anode electrode 121 provided on the substrate 11, an organic layer 122G provided on the anode electrode 121, and a first cathode electrode 123 provided on the organic layer 122G.
  • the light emitting element 12B includes an anode electrode 121 provided on the substrate 11, an organic layer 122B provided on the anode electrode 121, and a first cathode electrode 123 provided on the organic layer 122B.
  • the organic layers 122R, 122G, and 122B are not particularly distinguished, they are referred to as the organic layer 122.
  • the substrate 11 is a support that supports a plurality of light emitting elements 12 arranged on one main surface. Further, although not shown, the substrate 11 is provided with a drive circuit including a sampling transistor for controlling the drive of the plurality of light emitting elements 12 and a drive transistor, a power supply circuit for supplying electric power to the plurality of light emitting elements 12, and the like. You may be.
  • the substrate 11 may be made of, for example, glass or resin having low water and oxygen permeability, or may be made of a semiconductor such as a transistor which can be easily formed.
  • the substrate 11 is a glass substrate such as high-strain point glass, soda glass, borosilicate glass, forsterite, lead glass, or quartz glass, a semiconductor substrate such as amorphous silicon or polycrystalline silicon, or polymethyl.
  • It may be a resin substrate such as methacrylate, polyvinyl alcohol, polyvinylphenol, polyether sulfone, polyimide, polycarbonate, polyethylene terephthalate, or polyethylene naphthalate.
  • the anode electrode 121 is electrically separated for each of the sub-pixels 100R, 100G, and 100B.
  • the anode electrode 121 also functions as a reflective layer, and it is preferable that the anode electrode 121 is composed of a metal layer having a high reflectance and a large work function as much as possible in order to increase the luminous efficiency.
  • the metal layer is, for example, chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al). , Magnesium (Mg), Iron (Fe), Tungsten (W), Silver (Ag) and other metal elements alone and alloys. Specific examples of the alloy include AlNi alloy and AlCu alloy.
  • the anode electrode 121 may be composed of a laminated film of a metal layer.
  • the first cathode electrode 123 is electrically separated for each of the sub-pixels 100R, 100G, and 100B.
  • the first cathode electrode 123 has a facing surface 123S facing the second cathode electrode 124.
  • the first cathode electrode 123 is a transparent electrode having transparency to the light generated in the organic layer 122.
  • the transparent electrode also includes a semitransparent reflective film.
  • the second cathode electrode 124 is provided as an electrode common to all the sub-pixels 100R, 100G, and 100B in the display area 110A.
  • the second cathode electrode 124 is connected to the first cathode electrode 123 separated for each sub-pixel 100.
  • the second cathode electrode 124 has a plurality of contact portions 124A, and each of the plurality of contact portions 124A is connected to the first cathode electrode 123 separated for each sub-pixel 100.
  • the contact portion 124A has a connecting portion 124B connected to the first cathode electrode 123 at its tip.
  • the number of connection portions 124B is, for example, one for each sub-pixel 100.
  • One contact portion 124A is connected to, for example, one sub-pixel 100.
  • the connecting portion 124B is connected to a part of the facing surface 123S of the first cathode electrode 123.
  • the connection portion 124B is preferably provided outside the light emitting region 101 of the sub-pixel 110.
  • FIG. 4 is a cross-sectional view taken along the line IV-line IV of FIG. 3A. However, in FIG. 3A, the illustration of some of the constituent members (protective layer 14, protective layer 15, etc.) shown in FIG. 4 is omitted.
  • the sub-pixel 100 has a protruding portion 102 that protrudes with respect to a part of the peripheral edge of the light emitting region 101.
  • the direction of protrusion of the protrusion 102 is the in-plane direction of the display device 10.
  • the protruding portion 102 is configured by projecting the second cathode electrode 124 with respect to the peripheral edge of the light emitting region 101.
  • the organic layer 122 may project together with the second cathode electrode 124 with respect to the peripheral edge of the light emitting region 101.
  • the contact portion 124A of the second cathode electrode 124 is connected to the first cathode electrode 123 at the protruding portion 102.
  • the protrusions 102 may be arranged in a staggered pattern in the row direction (see FIGS. 3A and 3B), or may be arranged on a straight line extending in the row direction (see FIGS. 3C and 3D). ..
  • the protruding portion 102 when the protruding portion 102 has a substantially elliptical shape, the protruding portion 102 may be provided at one end of the minor axis of the substantially elliptical sub-pixel 100. As shown in FIG. 3B, when the protruding portion 102 has a substantially hexagonal shape, the protruding portion 102 may be provided at one corner of the subpixel 100 having a substantially hexagonal shape. As shown in FIG. 3C, when the projecting portion 102 has a substantially square shape, the projecting portion 102 may be provided in the vicinity of one corner portion of the subpixel 100 having a substantially square shape. As shown in FIG.
  • the protruding portion 102 when the protruding portion 102 has a substantially rectangular shape, the protruding portion 102 may be provided on one short side of the subpixel 100 having a substantially rectangular shape.
  • FIG. 3D shows an example in which the entire short side protrudes, a part of the short side may protrude.
  • connection portion 124B included in the contact portion 124A may have a dot shape.
  • the connecting portion 124B When the connecting portion 124B is viewed in a plan view from the direction perpendicular to the display surface of the display device 10, the point-shaped connecting portion 124B may have a substantially quadrangle such as a substantially square or a substantially rectangle.
  • the number of connecting portions 124B is preferably one for each sub-pixel 100. In this case, by providing the connecting portion 124B, it is possible to prevent the area of the light emitting region 101 from being reduced. Therefore, it is possible to suppress a decrease in the brightness of the display device 10.
  • the first cathode electrode 123 and the second cathode electrode 124 each independently contain, for example, a transparent metal oxide, metal or alloy.
  • Transparent metal oxides include, for example, indium-zinc oxide (IZO), indium-tin oxide (ITO), zinc oxide (ZnO), tin oxide (SnO), aluminum-zinc oxide (AZO) and gallium-. It contains at least one selected from the group consisting of zinc oxide (GZO).
  • the metal contains, for example, at least one selected from the group consisting of aluminum (Al), silver (Ag), magnesium (Mg), calcium (Ca), sodium (Na) and strontium (Sr).
  • Alloys include, for example, alkali metal or alkaline earth metal and silver (Ag) alloys, magnesium (Mg) and silver (Ag) alloys, magnesium (Mg) and calcium (Ca) alloys, and aluminum (Al). ) And lithium (Li), including at least one selected from the group consisting of alloys.
  • the first cathode electrode 123 contains a transparent metal oxide (eg, a transparent conductive material such as IZO), and the second cathode electrode 124 contains a metal or alloy (eg, a highly reflective material such as MgAg). You may.
  • the anode electrode 121 and the second cathode electrode 124 form a resonator structure in the sub-pixels 100R, 100G, and 100B, respectively. May be.
  • the first cathode electrode 123 contains a metal or alloy (eg, a highly reflective material such as MgAg) and the second cathode electrode 124 contains a transparent metal oxide (eg, a transparent conductive material such as IZO). You may.
  • the anode electrodes 121 and the first cathode electrode 123 form a resonator structure in the sub-pixels 100R, 100G, and 100B, respectively. May be. The details of the resonator structure will be described in Modification 2 described later.
  • the insulating layer 13 is for electrically separating the anode electrode 121 for each of the sub-pixels 100R, 100G, and 100B.
  • the insulating layer 13 is provided between the anode electrodes 121 and covers the peripheral edge of the anode electrode 121. More specifically, the insulating layer 13 has an opening in a portion corresponding to each anode electrode 121, and the anode electrode is formed from the peripheral portion of the upper surface of the anode electrode 121 (the surface facing the first cathode electrode 123). It covers the side surface (end face) of 121.
  • the insulating layer 13 contains, for example, an organic material or an inorganic material.
  • the organic material includes, for example, at least one of a polyimide resin and an acrylic resin.
  • the inorganic material includes, for example, at least one selected from the group consisting of silicon oxide, silicon nitride, silicon nitridant and aluminum oxide.
  • the organic layers 122R, 122G, and 122B are electrically separated from each other for each of the sub-pixels 100R, 100G, and 100B, respectively.
  • the organic layers 122R, 122G, and 122B generate red light, green light, and blue light, respectively. Since the organic layers 122R, 122G, and 122B have the same layer structure, the layer structure of the organic layer 122R will be described below.
  • FIG. 5 is an enlarged cross-sectional view of the organic layer 122R shown in FIG.
  • the organic layer 122 has a structure in which the hole injection layer 122K, the hole transport layer 122L, the organic light emitting layer 122M, and the electron transport layer 122N are laminated in this order from the side of the anode electrode 121.
  • the configuration of the organic layer 122 is not limited to this, and layers other than the organic light emitting layer 122M are provided as needed.
  • the hole injection layer 122K is a buffer layer for increasing the hole injection efficiency into the organic light emitting layer 122M and suppressing leakage.
  • the hole transport layer 122L is for increasing the hole transport efficiency to the organic light emitting layer 122M.
  • the organic light emitting layer 122M generates light by recombination of electrons and holes by applying an electric field.
  • the electron transport layer 122N is for increasing the electron transport efficiency to the organic light emitting layer 122M.
  • An electron injection layer (not shown) may be provided between the electron transport layer 122N and the first cathode electrode 123. This electron injection layer is for increasing the electron injection efficiency.
  • the protective layer 14 is for covering and protecting the plurality of light emitting elements 12. Specifically, the protective layer 14 prevents the organic layer 122 from being damaged by being exposed to a process gas, a chemical solution, or the like in the manufacturing process. Further, the protective layer 14 suppresses the infiltration of water from the external environment into the light emitting element 12.
  • the protective layer 14 may have a function of suppressing oxidation of the metal layer.
  • the protective layer 15 is for covering and protecting the second cathode electrode 124. Specifically, the protective layer 15 suppresses the arrival of water from the external environment to the second cathode electrode 124 and the infiltration of water from the external environment into the light emitting element 12.
  • the protective layer 15 may have a function of suppressing oxidation of the metal layer.
  • the protective layer 14 is provided between the first cathode electrode 123 and the second cathode electrode 124, and between the adjacent sub-pixels 100.
  • the protective layer 14 has a plurality of contact holes 14H penetrating in the thickness direction of the protective layer 14.
  • the contact hole 14H is for connecting the first cathode electrode 123 and the second cathode electrode 124, and the contact portion 124A of the second cathode electrode 124 is arranged in the contact hole 14H. ..
  • the contact hole 14H is preferably provided outside the light emitting region 101. By providing the contact hole 14H at such a position, it is possible to suppress a decrease in the area of the light emitting region 101. Therefore, it is possible to suppress a decrease in the brightness of the display device 10. In addition, damage to the organic layer 122 at the time of forming the contact hole 14H can be suppressed.
  • the thickness of the protective layer 14 on the separated first cathode electrode 123 is almost the same for the red, green, and blue sub-pixels 100R, 100G, and 100B.
  • the protective layer 14 contains, for example, at least one of an inorganic oxide and an organic insulating material.
  • the inorganic oxide contains, for example, at least one selected from the group consisting of silicon nitride (SiN), silicon oxide (SiO), silicon oxynitride (SiON), aluminum oxide (AlO) and titanium oxide (TIO).
  • the organic insulating material includes, for example, at least one of a thermosetting resin and an ultraviolet curable resin.
  • FIG. 2 shows an example in which the protective layers 14 and 15 are monolayer films, but as shown in FIG. 6, the protective layer 14 may be a multilayer film or a multilayer film. May be good. It is preferable that each layer constituting the multilayer film contains materials different from each other. This is because it is possible to prevent pinholes from being connected and formed between the layers.
  • the protective layer 14 as a multilayer film includes, for example, a first protective layer 14A and a second protective layer 14B.
  • the first protective layer 14A and the second protective layer 14B preferably contain different materials. This is because it is possible to prevent the pinholes generated in the first protective layer 14A from being connected to and formed in the second protective layer 14B.
  • the multi-layered protective layer 15 includes, for example, a first protective layer 15A and a second protective layer 15B.
  • the first protective layer 15A and the second protective layer 15B preferably contain different materials. This is because it is possible to prevent the pinholes generated in the first protective layer 15A from being connected to and formed in the second protective layer 15B.
  • the first protective layer 14A and the first protective layer 15A contain, for example, silicon nitride (SiN).
  • the second protective layer 14B and the second protective layer 15B contain, for example, aluminum oxide (AlO).
  • the second protective layer 14B and the second protective layer 15B are preferably formed by atomic layer deposition (ALD).
  • the protective layer 14 and the protective layer 15 having a multilayer structure include two protective layers has been described, but two or more protective layers may be provided.
  • a drive circuit or the like is formed on one main surface of the substrate 11 by using, for example, a thin film forming technique, a photolithography technique, and an etching technique.
  • a metal layer is formed on a drive circuit or the like by a sputtering method, and then the metal layer is patterned by using, for example, a photolithography technique and an etching technique, so that each light emitting element 12 (that is, every subpixel 100).
  • the anode electrode 121 separated into the above is formed.
  • the insulating layer 13 is formed by, for example, the CVD method.
  • the insulating layer 13 is patterned using a photolithography technique and an etching technique.
  • the hole injection layer 122K, the hole transport layer 122L, the organic light emitting layer 122M, and the electron transport layer 122N are sequentially laminated on the anode electrode 121 to form the organic layer 122R.
  • the first cathode electrode 123 is formed on the organic layer 122R by, for example, a sputtering method.
  • a first protective layer 14A as a hard mask is formed on the first cathode electrode 123.
  • a resist is applied onto the first protective layer 14A to form a resist layer.
  • the resist layer is processed by photolithography to form a resist pattern, and then the first protective layer 14A as a hard mask is etched through the resist pattern. After that, the resist pattern is removed.
  • the organic layer 122R and the first cathode electrode 123 are etched using the first protective layer 14A as a hard mask. As a result, as shown in FIG. 7A, the organic layer 122R and the first cathode electrode 123 separated for each sub-pixel 100 are formed on the anode electrode 121, and a plurality of light emitting elements 12R are obtained.
  • a plurality of light emitting elements 12G and a plurality of light emitting elements 12B are formed on one main surface of the substrate 11 by the same procedure as the above-described light emitting element 12R forming step.
  • the second protective layer 14B is formed so as to cover the plurality of light emitting elements 12.
  • the protective layer 14 which is a laminated film of the first protective layer 14A and the second protective layer 14B is formed.
  • a resist is applied onto the second protective layer 14B to form a resist layer.
  • the resist layer is processed by photolithography to form a resist pattern, and then the protective layer 14 is etched through the resist pattern.
  • a contact hole 14H for connecting the first cathode electrode 123 and the second cathode electrode 124 is formed in the protective layer 14.
  • the resist pattern is removed.
  • a second cathode electrode 124 is formed on the protective layer 14 so as to imitate the contact hole 14H as shown in FIG. 7D.
  • the protective layer 15 is formed on the second cathode electrode 124 so as to fill the contact hole 14H.
  • the display device 10 shown in FIG. 2 is obtained.
  • the protective layer 14 is provided between the first cathode electrode 123 and the second cathode electrode 124.
  • the protective layer 14 can prevent the organic layer 122 from being exposed to the process gas, the chemical solution, or the like in the etching step of the organic layer 122 and the first cathode electrode 123. That is, it is possible to prevent the organic layer 122 from being damaged. Therefore, it is possible to suppress a decrease in the reliability of the display device 10.
  • the anode electrode 121, the organic light emitting layer 122M, and the first cathode electrode 123 are separated for each sub-pixel 100, and an insulating protective layer 14 is provided between each sub-pixel 100.
  • the leakage current between the adjacent sub-pixels 100 can be suppressed. Therefore, color mixing can be suppressed and color reproducibility can be improved.
  • the luminous efficiency can be improved. Therefore, the characteristics of the display device 10 can be improved.
  • the second cathode electrode 124 is connected to the protruding portion 102 of the first cathode electrode 123 via the contact portion 124A, the contact resistance between the first cathode electrode 123 and the second cathode electrode 124 is reduced. can do.
  • Modification example 1 (Modification example 1)
  • the display device 10 includes a plurality of light emitting elements 12R, 12G, and 12B configured to be capable of emitting red light, green light, and blue light, respectively.
  • the method is not limited to this.
  • the display device 10 is provided with a plurality of light emitting elements 12W and a color filter 16 configured to be able to emit white light instead of the plurality of light emitting elements 12R, 12G, and 12B. May be good.
  • the light emitting element 12W is, for example, a white OLED, a Micro-white OLED (MOLED), or a Micro-white LED.
  • the color filter 16 is, for example, an on-chip color filter (OCCF), and is provided on the protective layer 15.
  • the color filter 16 includes, for example, a red filter 16R, a green filter 16G, and a blue filter 16B.
  • the red filter 16R, the green filter 16G, and the blue filter 16B are provided so as to face the light emitting element 12W of the sub pixel 100R, the light emitting element 12W of the sub pixel 100G, and the light emitting element 12W of the sub pixel 100B, respectively.
  • the white light emitted from each light emitting element 12W in the sub-pixel 100R, the sub-pixel 100G, and the sub-pixel 100B passes through the above-mentioned red filter 16R, green filter 16G, and blue filter 16B, respectively, thereby causing red light.
  • Green light and blue light are emitted from the display surface, respectively.
  • a light-shielding layer (not shown) may be provided in the area between the color filters 16R, 16G, 16B of each color, that is, between the sub-pixels 100R, 100G, 100B of each color.
  • the protective layer 14 may have a multi-layer structure, or the protective layer 15 may have a multi-layer structure. It may have a multi-layer structure.
  • the color filter 16 is an on-chip color filter
  • it may be an opposed color filter provided on one main surface of the opposed substrate.
  • the resonator structures 17R, 17R, and 17B may be provided in the sub-pixels 100R, 100G, and 100B, respectively.
  • the resonator structures 17R, 17R, and 17B resonate, emphasize, and emit light having a specified wavelength.
  • the resonator structures 17R, 17R, and 17B generate red light LR, green light LG, and blue light LB generated by the light emitting elements 12R, 12G, and 12B, specifically, the organic layers 122R, 122G, and 122B, respectively. It resonates and emphasizes and emits red light LR, green light LG, and blue light LB.
  • the sub-pixels 100R, 100G, and 100B are further provided with the resonator structures 17R, 17R, and 17B, respectively, so that the color purity can be improved and high brightness can be realized.
  • the resonator structures 17R, 17R, and 17B are composed of an anode electrode 121 and a second cathode electrode 124.
  • the thickness of the protective layer 14 on the separated first cathode electrode 123 is different for each of the red, green, and blue sub-pixels 100R, 100G, and 100B.
  • the thickness of the protective layer 14 of each of the sub-pixels 100R, 100G, and 100B differs depending on the color to be displayed by the sub-pixels 100R, 100G, and 100B, respectively.
  • the second cathode electrode 124 preferably functions as a semi-transmissive reflective film.
  • the second cathode electrode 124 preferably contains magnesium (Mg), silver (Ag), a magnesium-silver alloy containing these as a main component (MgAg), an alloy containing an alkali metal or an alkaline earth metal, or the like. ..
  • the first cathode electrode 123 preferably contains a transparent metal oxide.
  • the display device 10 includes the resonator structures 17R, 17G, and 17B for each of the sub-pixels 100R, 100G, and 100B, and further includes the color filter 16 described in the first modification. good. In this case, the color reproducibility can be further improved.
  • the resonator structures 17R, 17R and 17B have the anodes. It may be composed of an electrode 121 and a first cathode electrode 123.
  • the thicknesses of the organic layers 122R, 122G, and 122B of the sub-pixels 100R, 100G, and 100B are different depending on the color to be displayed by the sub-pixels 100R, 100G, and 100B, respectively.
  • Optically between the anode electrode 121 and the first cathode electrode 123 such that the protective layer 14 has such a different thickness causes optimum resonance at the wavelength of light according to the color to be displayed. The distance can be set.
  • the first cathode electrode 123 preferably functions as a transflective reflective film.
  • the second cathode electrode 124 preferably contains magnesium (Mg), silver (Ag), a magnesium-silver alloy containing these as a main component (MgAg), an alloy containing an alkali metal or an alkaline earth metal, or the like. ..
  • the second cathode electrode 124 preferably contains a transparent metal oxide.
  • the display device 10 resonates the red, green, and blue light emitting elements 12R, 12G, and 12B with the light of the specified wavelength generated by these light emitting elements 12R, 12G, and 12B.
  • a light emitting element 12W may be provided instead of the light emitting elements 12R, 12G, and 12B.
  • the resonator structures 17R, 17R, and 17B resonate the red light LR, the green light LG, and the blue light LB contained in the white light generated by the light emitting element 12W, specifically, the organic layer 122W, respectively, to the outside. discharge.
  • full-color display or the like can be performed even if the display device 10 does not include the red, green, and blue light emitting elements 12R, 12G, 12B, or the color filter 16. ..
  • the display device 10 includes the resonator structures 17R, 17G, and 17B for each of the sub-pixels 100R, 100G, and 100B, and further includes the color filter 16 described in the first modification. good. In this case, the color reproducibility can be further improved.
  • FIG. 11A is a plan view showing an example of a substantially elliptical sub-pixel 100 having a notch portion 103.
  • the cutout portion 103 is provided at one end of a substantially elliptical minor axis, for example.
  • FIG. 11B is a plan view showing an example of a substantially hexagonal sub-pixel 100 having a notch 103.
  • the notch 103 is provided at, for example, one corner of a substantially hexagon.
  • FIG. 11C is a plan view showing an example of a substantially square sub-pixel 100 having a notch 103.
  • the cutout portion 103 is provided, for example, in the vicinity of one corner portion of a substantially square shape.
  • each sub-pixel 100 may be arranged in a staggered pattern in the row direction (see FIGS. 11A and 11B), or may be arranged on a straight line extending in the row direction (FIG. 11A and 11B). See 11C).
  • FIG. 12 is a cross-sectional view taken along the line XII-line XII of FIG. 11A.
  • the cutout portion 103 is formed by denting a part of the peripheral edge of the anode electrode 121 inside the peripheral edge of the first cathode electrode 123.
  • the organic layer 122 may or may not be provided below the first cathode electrode 123 of the notch 103.
  • FIG. 12 shows an example of the former.
  • the contact portion 124A of the second cathode electrode 124 is connected to the first cathode electrode 123 at the notch 103.
  • connection portion 124B may have a substantially polygonal shape such as a substantially triangular shape (see FIG. 13A), a substantially hexagonal shape (see FIG. 13B), or a substantially octagonal shape (see FIG. 13C), or a substantially circular shape (see FIG. 13C). 13D) may have.
  • the connecting portion 124B of the second cathode electrode 124 has a dot shape, but as shown in FIG. 14, the connecting portion 124B may have a linear shape. ..
  • the linear connecting portion 124B may be provided on the diagonal line of the substantially quadrangular sub-pixel 100.
  • two or more connections are made to one protrusion 102 of a substantially elliptical, substantially hexagonal, substantially square, or substantially rectangular sub-pixel 100.
  • the unit 124B may be connected.
  • two or more connecting portions 124B are connected to one notched portion 103 included in the subpixel 100 having a substantially elliptical shape, a substantially hexagonal shape, or a substantially square shape. You may be.
  • the sub-pixel 100 has one protruding portion 102 and two or more connecting portions 124B are connected to one protruding portion 102 has been described, but the sub-pixel 100 has two. It may have more than one protrusion 102, and one or more connecting portions 124B may be connected to each protrusion 102.
  • the contact unit 124A has one shared connection unit 124C connected to and shared by two or more adjacent sub-pixels 100.
  • the protective layer 14 may be provided with one contact hole 14H for two or more sub-pixels 100.
  • FIG. 18A shows an example in which the shared connection portion 124C of one contact portion 124A is connected to four adjacent sub-pixels 100 and shared by the four sub-pixels 100.
  • FIG. 18A shows an example in which the notch portion 103 is substantially triangular, as shown in FIG. 18B, the notch portion 103 may be substantially quadrangular.
  • FIGS. 18A and 18B show an example in which the shared connection portion 124C is connected to the notch 103, the shared connection portion 124C may be connected to the protrusion 102.
  • 18A and 18B show an example in which the connecting portion 124B is a substantially square shape, but it may be a substantially polygonal shape, a substantially circular shape, a linear shape, or the like other than the substantially square shape.
  • connection portion 124B has a point-shaped connecting portion 124B and the point-shaped connecting portion 124B is connected to the protruding portion 102 of the sub-pixel 100 has been described.
  • the shape and connection form of the connection portion 124B are not limited to this.
  • FIG. 19 is a cross-sectional view showing a modified example of the shape and connection form of the connection portion 124B.
  • FIG. 20A is a plan view showing a modified example of the shape and connection form of the connection portion 124B.
  • the contact portion 124A may have a linear connecting portion 124B.
  • the linear connecting portion 124B may be provided along the peripheral edge of the facing surface 123S of the first cathode electrode 123.
  • FIG. 20A shows an example in which the substantially elliptical sub-pixel 100 is provided with the substantially elliptical connecting portion 124B.
  • a substantially hexagonal shape and a substantially square shape are shown.
  • the sub-pixel 100 having a substantially polygonal shape such as a substantially rectangular shape may be provided with a connection portion 124B having a substantially polygonal shape such as a substantially hexagonal shape, a substantially square shape, or a substantially rectangular shape.
  • 20A, 20B, 20C, and 20D show an example in which the linear connecting portion 124B is continuously provided along the peripheral edge of the facing surface 123S of the first cathode electrode 123, but it is not possible. It may be provided continuously.
  • the tip of the contact portion 124A may be arranged between adjacent sub-pixels 100.
  • the connecting portion for connecting the second cathode electrode 124 to the first cathode electrode 123 (for example, the protruding portion 102 (FIGS. 3A, 3B, 3B, 3B). (See FIGS. 3C and 3D), and a notch 103 (see FIGS. 11A, 11B and 11C)) do not need to be separately provided for each sub-pixel 100. Therefore, in the display device 10 having the configuration of the modification 10, the sub-pixel 100 can be miniaturized as compared with the display device 10 in which the connection portion is separately provided for each sub-pixel 100.
  • the first cathode electrode 123 may have a protruding portion 123A that intersects the contact portion 124A.
  • the protruding portion 123A may have a structure that protrudes with respect to the peripheral edge of the organic layer 122. Since the first cathode electrode 123 has the protruding portion 123A, the contact portion 124A can be easily connected to the first cathode electrode 123 at the end portion (side surface) of the sub-pixel 100. Therefore, it is possible to suppress a poor connection between the contact portion 124A and the first cathode electrode 123.
  • the protective layer 15 may have a plurality of air gaps 15C.
  • the air gap 15C is provided between the adjacent sub-pixels 100.
  • the air gap 15C is preferably provided so as to surround the light emitting element 12.
  • the air gap 15C may have a wall shape.
  • FIG. 29E is a cross-sectional view showing an example of the configuration of the display device 410 according to the second embodiment of the present disclosure.
  • the display device 410 includes a sidewall 411, a protective layer 412, and a second cathode electrode 413.
  • the same reference numerals are given to the same parts as those in the first embodiment, and the description thereof will be omitted.
  • the sidewall 411 covers the side surface of the anode electrode 121 and the side surface of the organic layer 122.
  • the sidewall 411 is made of an insulating material.
  • the insulating material the same material as the insulating layer 13 in the first embodiment can be exemplified.
  • the protective layer 412 is for protecting the light emitting element 12.
  • the protective layer 412 is provided on the light emitting element 12.
  • the protective layer 412 is separated for each light emitting element 12.
  • the same material as the protective layer 14 in the first embodiment can be exemplified.
  • the second cathode electrode 413 covers the light emitting element 12 provided with the protective layer 412 and the sidewall 411.
  • the second cathode electrode 413 covers the side surface of the protective layer 412 and the side surface of 123 of the first cathode.
  • the second cathode electrode 413 is connected to the side surface or the peripheral portion of the first cathode electrode 123.
  • an anode electrode 121 separated for each light emitting element 12 is formed on one main surface of the substrate 11.
  • the organic layer 122, the first cathode electrode 123, and the protective layer 412 are sequentially laminated on one main surface of the substrate 11.
  • the organic layer 122, the first cathode electrode 123, and the protective layer 412 are processed using, for example, photolithography technology and etching technology, and separated into each light emitting element 12. As a result, a plurality of laminates composed of the light emitting element 12 and the protective layer 412 are formed on one main surface of the substrate 11.
  • an insulating layer 411A is formed on one main surface of the substrate 11, and a plurality of laminated bodies are covered with the insulating layer 411A.
  • the insulating layer 411A is processed by, for example, anisotropic etching to form the sidewall 411.
  • a second cathode electrode 413 is formed on one main surface of the substrate 11 to cover the light emitting element 12 provided with the protective layer 412 and the sidewall 411. As a result, the second cathode electrode 413 is connected to the side surface or the peripheral edge of the first cathode electrode 123.
  • the display device 420 may include a side wall portion 421 that covers the side surface of the protective layer 412.
  • the side wall portion 421 is an auxiliary electrode and has conductivity.
  • the side wall portion 421 is provided on the peripheral edge portion of the upper main surface of the first cathode electrode 123.
  • the second cathode electrode 413 covers the side wall portion 421 and is electrically connected to the first cathode electrode 123 via the side wall portion 421.
  • FIG. 30F shows an example in which the second cathode electrode 413 is not in contact with the side surface of the first cathode electrode 123, but the second cathode electrode 413 is the side surface of the first cathode electrode 123. May be in contact with.
  • the side wall portion 421 may be made of the same material as the first cathode electrode 123 (for example, a metal oxide such as IZO).
  • an anode electrode 121 separated for each light emitting element 12 is formed on one main surface of the substrate 11.
  • the organic layer 122, the first cathode electrode 123, and the protective layer 412 are sequentially laminated on one main surface of the substrate 11.
  • the protective layer 412 is patterned and separated into each light emitting element 12 by using, for example, a photolithography technique and an etching technique.
  • a conductive layer 421A (for example, a metal oxide layer such as an IZO layer) is formed on the first cathode electrode 123 to cover the separated protective layer 412.
  • the conductive layer 421A is processed so that the conductive layer 421A remains only on the side wall of the protective layer 412 by, for example, anisotropic etching.
  • the organic layer 122 and the first cathode electrode 123 are separated for each light emitting element 12.
  • a sidewall 411 covering the side surface of the light emitting element 12 is formed on one main surface of the substrate 11, and then a second wall 411 is formed on one main surface of the substrate 11 as shown in FIG. 30F.
  • the cathode electrode 413 is formed, and covers the light emitting element 12 provided with the protective layer 412, the side wall portion 421, and the sidewall 411. As a result, the second cathode electrode 413 and the side wall portion 421 are connected.
  • the second cathode electrode 413 may be connected to either the end portion of the first cathode electrode 123 or the side wall portion 421 connected to the first cathode electrode 123. That is, the effective connection area between the first cathode electrode 123 and the second cathode electrode 413 can be increased. Therefore, even if the height of the sidewall 411, the thickness of the first cathode electrode 123, and the like vary in manufacturing, the first cathode electrode 123 and the second cathode electrode 413 can be stably connected. This can improve yield and reliability.
  • the protective layer 431 having a two-layer structure includes a first protective layer 431A and a second protective layer 431B sequentially on the light emitting element 12.
  • the first protective layer 431A is the same as the protective layer 412 in the second embodiment.
  • the second protective layer 431B is a layer having less etching resistance than the first protective layer 431A.
  • a metal oxide such as aluminum oxide can be used as the material of the second protective layer 431B.
  • the protective layer 412 may have a laminated structure of two or more layers.
  • the layer laminated on top is a layer having less etching resistance than the other layers.
  • an anode electrode 121 separated for each light emitting element 12 is formed on one main surface of the substrate 11.
  • the organic layer 122, the first cathode electrode 123, the first protective layer 431A, and the second protective layer 431B are sequentially laminated on one main surface of the substrate 11.
  • the first protective layer 431A and the second protective layer 431B are patterned and separated for each light emitting element 12 by using, for example, a photolithography technique and an etching technique.
  • a protective layer 431 having a two-layer structure separated for each light emitting element 12 is formed on the first cathode electrode 123.
  • a conductive layer 421A (for example, a metal oxide layer such as an IZO layer) is formed on the first cathode electrode 123 to cover the separated protective layer 431.
  • the conductive layer 421A is processed so that the conductive layer 421A remains on the side wall of the protective layer 431 by, for example, anisotropic etching. At this time, the conductive layer 421A may be processed so that the conductive layer 421A remains on the side wall of the protective layer 431.
  • the organic layer 122 and the first cathode electrode 123 are separated for each light emitting element 12.
  • a sidewall 411 covering the side surface of the light emitting element 12 is formed on one main surface of the substrate 11, and then a second wall 411 is formed on one main surface of the substrate 11 as shown in FIG. 31G.
  • the cathode electrode 413 of the above is formed, and covers the light emitting element 12 provided with the protective layer 431, the side wall portion 421, and the sidewall 411. As a result, the second cathode electrode 413 and the side wall portion 421 are connected.
  • the protective layer 431 has a two-layer structure including the first protective layer 431A and the second protective layer 431B in that order, and the constituent material of the second protective layer 431B is the first protective layer 431A. It has less etching resistance than the constituent materials of. As a result, it is possible to prevent the protective layer 431 from being thinned or deformed due to being exposed to etching during processing of the first cathode electrode 123 or overetching when forming the sidewall 411.
  • the display device 420 may include a side wall portion 441 that covers the side surface of the protective layer 412.
  • the side wall portion 441 contains the same type of material as the first cathode electrode 123.
  • the composition ratio of the constituent materials of the side wall portion 441 and the first cathode electrode 123 may be the same or different.
  • the side wall portion 441 may be composed of a depot film.
  • the depot film is a film formed by deposits of reaction products on the side surface of the protective layer 412 during dry etching (for example, anisotropic etching).
  • an anode electrode 121 separated for each light emitting element 12 is formed on one main surface of the substrate 11.
  • the organic layer 122, the first cathode electrode 123, and the protective layer 412 are sequentially laminated on one main surface of the substrate 11.
  • the organic layer 122, the first cathode electrode 123, and the protective layer 412 are processed by, for example, anisotropic etching, and separated into each light emitting element 12.
  • a conductive depot containing the constituent elements of the first cathode electrode 123 adheres to the side surface of the protective layer 412, and the side wall portion 441 is formed.
  • a plurality of laminated bodies including the side wall portion 441, the protective layer 412, and the light emitting element 12 are formed on one main surface of the substrate 11.
  • an insulating layer 411A is formed on one main surface of the substrate 11, and a plurality of laminated bodies are covered with the insulating layer 411A.
  • the insulating layer 411A is processed by, for example, anisotropic etching to form the sidewall 411.
  • a second cathode electrode 413 is formed on one main surface of the substrate 11 to cover the light emitting element 12 provided with the side wall portion 441, the protective layer 412, and the sidewall 411. As a result, the second cathode electrode 413 and the side wall portion 441 are connected.
  • the second cathode electrode 413 since the second cathode electrode 413 is connected to the side wall portion 441 formed of the depot film, the same effect as that of the modified example 2 can be obtained.
  • the second cathode electrode 413 may be in contact with the peripheral edge of the first cathode electrode 123.
  • the side surface of the protective layer 412 may be located inside the peripheral edge of the upper surface of the first cathode electrode 123.
  • the second cathode electrode 413 is in contact with the peripheral edge of the upper surface of the first cathode electrode 123 and the side surface of the first cathode electrode 123.
  • FIGS. 29A to 29C, 33A, and 33B an example of a manufacturing method of the display device 410 having the above configuration will be described with reference to FIGS. 29A to 29C, 33A, and 33B.
  • the steps from the formation of the anode electrode 121 to the formation of the insulating layer 411A are carried out in the same manner as the manufacturing method of the display device 410 according to the second embodiment (see FIGS. 29A to 29C).
  • the insulating layer 411A is processed by, for example, anisotropic etching to form the sidewall 411, and the side surface of the protective layer 412 is formed from the peripheral edge of the upper surface of the first cathode electrode 123.
  • the sidewall 411 and the protective layer 412 are made of the same material (for example, SiN), and further, by selecting dry etching conditions in which the first cathode electrode 123 (for example, the IZO layer) is difficult to process, the first cathode is formed.
  • the side surface of the protective layer 412 can be retracted from the peripheral edge of one main surface of the electrode 123.
  • a second cathode electrode 413 is formed on one main surface of the substrate 11 to cover the light emitting element 12 provided with the protective layer 412 and the sidewall 411. As a result, the second cathode electrode 413 is brought into contact with the peripheral edge of the upper surface of the first cathode electrode 123 and the side surface of the first cathode electrode 123.
  • the effective connection area between the first cathode electrode 123 and the second cathode electrode 413 can be increased. Therefore, even if the height of the sidewall 411, the film thickness of the first cathode electrode 123, and the like vary in manufacturing, the first cathode electrode 123 and the second cathode electrode 413 can be stably connected. Can be done. Therefore, the yield and reliability can be improved.
  • the display device 410 may further include a contact portion 451 as shown in FIG. 34A.
  • the contact portion 451 is an auxiliary electrode that connects the second cathode electrode 413 and the base wiring (not shown).
  • the upper surface of the contact portion 451 is connected to the peripheral edge portion of the second cathode electrode 413.
  • the lower surface of the contact portion 451 is connected to the base wiring via a contact plug (not shown).
  • the peripheral edge portion of the second cathode electrode 413 means a region having a predetermined width from the peripheral edge of the second cathode electrode 413 toward the inside.
  • the contact portion 451 is provided in a peripheral region on one main surface of the substrate 11.
  • the contact portion 451 has a rectangular closed loop shape surrounding the display area.
  • the contact portion 451 may be formed of the same layer as the anode electrode 121.
  • the contact portion 451 may be provided at the same height as the anode electrode 121.
  • the end of the sidewall 411 may rest on the contact portion 451.
  • the second cathode electrode 413 since it is possible to prevent the second cathode electrode 413 from being cut by the step of the contact portion 451, the second cathode electrode in the vicinity of the connection portion between the second cathode electrode 413 and the contact portion 451 can be suppressed.
  • the increase in resistance of 413 can be suppressed.
  • the sidewall 411 By controlling the film thickness of the insulating layer 411A for forming the sidewall 411 and the dry etching conditions such as gas and pressure when forming the insulating layer 411A, as described above, the sidewall 411 The end of the can be placed on the contact portion 451.
  • Modification 6 In the modified example 5, the example in which the end portion of the sidewall 411 is placed on the contact portion 451 has been described, but the end portion of the sidewall 411 contacts the end portion of the sidewall 411 as shown in FIG. 34B. It may be separated from the portion 451 so that the end portion of the sidewall 411 does not rest on the contact portion 451. In this case, it is possible to prevent the light emitted from the organic layer 122 from propagating inside the sidewall 411 and being reflected by the contact portion 451. Therefore, deterioration of display quality can be suppressed.
  • the contact portion 451 may be provided in the display area as shown in FIG. 35A.
  • the contact portion 451 may be provided between the adjacent light emitting elements 12.
  • the contact portion 451 is connected to a drive circuit or the like via, for example, a contact plug (not shown).
  • the contact portion 451 may be provided outside the display area. By providing the contact portion 451 outside the display region in this way, the size of the light emitting element 12 can be increased.
  • the space between the separated light emitting elements 12 may be filled with a sidewall 411 as an insulating layer.
  • the net distance from each light emitting element 12 to the contact portion 451 may increase in the recess between the adjacent light emitting elements 12.
  • the recesses between the adjacent light emitting elements 12 can be reduced, an increase in the net distance from each light emitting element 12 to the contact portion 451 can be suppressed. Therefore, in the case of the above configuration shown in FIG. 35C, an increase in the resistance of the second cathode electrode 413 can be suppressed.
  • the display device 410 having the above connection configuration can be manufactured, for example, as follows. First, as shown in FIG. 36A, the protective layer 412 separated for each light emitting element 12 is covered with the insulating layer 411A, and then, as shown in FIG. 36B, anisotropic etching for forming the sidewall 411 is performed on the substrate. This is performed until the wiring layer 461 in 11 is reached. Next, the second cathode electrode 413 is formed on the substrate 11. As a result, the second cathode electrode 413 is connected to the wiring layer 461.
  • the space between the side surface and the upper surface of the protective layer 412 may be rounded. Also in this case, in this case, the second cathode electrode 413 that covers the side surface of the protective layer 412 can be formed thickly.
  • the refractive index of the sidewall 411 may be lower than that of the organic layer 122. Since the light emitted by the organic layer 122 can be totally reflected at the interface between the organic layer 122 and the sidewall 411, the light emitted by the organic layer 122 is suppressed from propagating in the lateral direction, and the front side. Brightness can be increased efficiently.
  • FIG. 39 is a cross-sectional view showing an example of the configuration of the display device 510 according to the third embodiment of the present disclosure.
  • the display device 510 includes a substrate 11 having one main surface, a plurality of light emitting elements 12 and contact portions 511 provided on one main surface of the substrate 11, a protective layer 14 covering the plurality of light emitting elements 12, and a protective layer.
  • a second cathode electrode 512 that covers the 14 and the contact portion 511 and the like, a protective layer 15 that covers the second cathode electrode 512, and a resin layer 513 that covers the protective layer 15 are provided.
  • the insulating layer 13 has an opening 13A in a portion corresponding to each anode electrode 121, and covers from the peripheral edge of the upper surface of the anode electrode 121 to the side surface (end surface) of the anode electrode 121.
  • the peripheral edge portion of the upper surface of the anode electrode 121 refers to a region having a predetermined width from the peripheral edge of the upper surface of the anode electrode 121 toward the inside.
  • the light emitting element 12 is separated from the element outside the opening 13A of the insulating layer 13.
  • the insulating layer 13 also has an opening 13B in a portion corresponding to the contact portion 511, and covers from the peripheral edge portion of the upper surface of the contact portion 511 to the side surface (end surface) of the contact portion 511.
  • the peripheral edge portion of the upper surface of the contact portion 511 means a region having a predetermined width from the peripheral edge of the upper surface of the contact portion 511 toward the inside.
  • the contact portion 511 is provided between the adjacent light emitting elements 12.
  • the contact portion 511 may be formed of the same layer as the anode electrode 121.
  • the contact portion 511 is connected to the base wiring (not shown) via a contact plug (not shown).
  • the second cathode electrode 512 is provided as an electrode common to all light emitting elements 12 in the display region.
  • the second cathode electrode 512 covers the upper surface and the side surface of the protective layer 14 separated for each light emitting element 12, and also covers the peripheral edge portion (hereinafter referred to as “terrace portion”) of the upper surface of the light emitting element 12 and the side surface of the light emitting element 12. Covering.
  • the second cathode electrode 124 is connected to the peripheral edge of the upper surface of the first cathode electrode 123 at the peripheral edge of the upper surface of the light emitting element 12. Further, the second cathode electrode 124 covers a portion between the adjacent light emitting elements 12, and is connected to the contact portion 511 at this portion.
  • the peripheral edge portion of the upper surface of the light emitting element 12 means a region having a predetermined width from the peripheral edge of the upper surface of the light emitting element 12 toward the inside.
  • the peripheral edge portion of the upper surface of the first cathode electrode 123 means a region having a predetermined width from the peripheral edge of the upper surface of the first cathode electrode 123 toward the inside.
  • the resin layer 513 covers the protective layer 15.
  • the resin layer 513 fills the recesses between the light emitting elements 12.
  • the resin layer 513 is preferably a low-refractive resin having a lower refractive index than the protective layer 15.
  • the display device 510 can be provided with a waveguide structure, so that the light extraction efficiency of the front surface can be improved.
  • the protective layer 15 is preferably made of a material such as silicon nitride (SiN) having a high refractive index.
  • the sequences of the plurality of images 100R, 100G, 100B are, for example, a stripe sequence (see FIG. 40A), a delta sequence (see FIG. 40B), or a square sequence (see FIG. 40C).
  • a cathode contact region 511A is provided between the pixels 100 and the pixels 100.
  • the cathode contact region 511A is a region including a terrace portion of adjacent light emitting elements 12 and a portion located between the terrace portions.
  • the cathode contact region 511A may be continuously provided between the pixels 100 and the pixels 100 as shown in FIGS. 40A, 40B, and 40C, or may be provided continuously as shown in FIGS. 41A, 41B, and 41C. , It may be provided in a scattered manner between the pixels 100 and the pixels 100.
  • the anode electrode 121 is formed by, for example, a sputtering method, and then the anode electrode 121 is processed by, for example, photolithography and dry etching.
  • the material of the anode electrode 121 an AL alloy, an Ag alloy, or the like may be used.
  • a material having a high work function such as ITO and IGZO and a high transmittance may be used.
  • the insulating layer 13 is formed on one main surface of the substrate 11 by the CVD method. Then, as shown in FIG. 42A, the openings 13A and 13B are formed by using, for example, a resist mask and dry etching.
  • the organic layer 122 is formed on the anode electrode 121 by, for example, a thin-film deposition method.
  • a layer having high hole transportability such as HIL (Hole Injection Layer) or HTL (Hole Transfer Layer) may be used.
  • the first cathode electrode 121 and the first protective layer 14A are sequentially laminated on the organic layer 122.
  • a material having a high work function such as IZO or ITO and having a high transmittance may be used, or an MgAg alloy or the like may be used from the viewpoint of device characteristics.
  • the first protective layer 14A is preferably a layer that can form a film at a low temperature of 100 ° C. or lower and has a high sealing property against moisture and oxygen.
  • the organic layer 122, the first cathode electrode 123, and the first protective layer 14A are processed by, for example, photolithography and dry etching to separate the pixels 100.
  • a second protective layer 14B is formed on the first protective layer 14A.
  • the film forming conditions of the second protective layer 14B may be the same as the film forming conditions of the first protective layer 14A.
  • the second protective layer 14B is processed by, for example, dry etching, and the pixels 100 are separated.
  • the contact portion 511 is exposed. Since the protective layer 14 is provided on the light emitting region, plasma damage to the light emitting region can be suppressed.
  • the resist layer 514 is removed by low temperature ashing at 100 ° C. or lower. When wet etching is used, there is a concern that the organic layer 122 may peel off, so it is preferable to use dry etching.
  • a second cathode electrode 512 is formed as a common cathode in the entire display region by, for example, a sputtering method.
  • the material of the second cathode electrode 512 the same material as that of the first cathode electrode 123 may be used.
  • the second cathode electrode 512 is covered with the protective layer 15, and then the resin layer 513 is formed on the protective layer 15. At this time, the recesses between the pixels 100 are filled with the resin layer 513.
  • the display device 510 since the light emitting element 12 is separated from the outside of the opening 13A of the insulating layer 13, it is possible to suppress the plasma damage caused by dry etching in the light emitting region. Can be done. Further, when the cathode contact region 511A is formed, it is possible to suppress the plasma damage caused by dry etching in the light emitting region. Since the entire light emitting region is covered with the protective layer 14 and the protective layer 15, the formation of leak paths such as moisture can be suppressed. Since the backing wiring is provided via the contact portion 511, the influence of the cathode resistance can be reduced.
  • the cathode resistance can be reduced. Since the contact portion 511 is arranged in the display area, it is not necessary to arrange the cathode contact outside the display area. Further, since the distance from the contact portion 511 to the light emitting element 12 (pixel 100) becomes short, the occurrence of IR drop can be suppressed. In the future, it is expected that the organic EL coating structure will become widespread from the viewpoint of brightness and luminous efficiency. In the conventional structure, the deterioration of device characteristics due to processing damage becomes remarkable, but by using this technology, it is possible to provide a device that meets the needs such as shading and panel miniaturization as well as preventing the deterioration of device characteristics.
  • the protective layer 521 may be further provided on the protective layer 15.
  • the protective layer 521 is an ALD layer made of alumina (aluminum oxide) or the like.
  • the display device 10 according to any one of the above-described first to third embodiments and modifications thereof is incorporated into various electronic devices as, for example, a module as shown in FIG. 25.
  • a module as shown in FIG. 25.
  • This module has an exposed region 210 on one short side of the substrate 11 that is not covered by an opposing substrate or the like, and the wiring of the signal line drive circuit 111 and the scanning line drive circuit 112 is extended to this region 210.
  • An external connection terminal (not shown) is formed.
  • a flexible printed circuit board (FPC) 220 for signal input / output may be connected to the external connection terminal.
  • FPC flexible printed circuit board
  • 26A and 26B show an example of the appearance of the digital still camera 310.
  • This digital still camera 310 is a single-lens reflex type with interchangeable lenses, and has an interchangeable shooting lens unit (interchangeable lens) 312 in the center of the front of the camera body (camera body) 311 and on the left side of the front. It has a grip portion 313 for the photographer to grip.
  • interchangeable shooting lens unit interchangeable lens
  • a monitor 314 is provided at a position shifted to the left from the center of the back of the camera body 311.
  • An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking into the electronic viewfinder 315, the photographer can visually recognize the light image of the subject guided by the photographing lens unit 312 and determine the composition.
  • the display device 10 according to any one of the first to third embodiments described above or a modification thereof can be used.
  • FIG. 27 shows an example of the appearance of the head-mounted display 320.
  • the head-mounted display 320 has, for example, ear hooks 322 for being worn on the user's head on both sides of the eyeglass-shaped display unit 321.
  • the display unit 321 the display device 10 according to any one of the above-mentioned first to third embodiments or a modification thereof can be used.
  • FIG. 28 shows an example of the appearance of the television device 330.
  • the television device 330 has, for example, an image display screen unit 331 including a front panel 332 and a filter glass 333, and the image display screen unit 331 is the first to third embodiments described above or a modification thereof. It is composed of a display device 10 according to any of the examples.
  • the configurations, methods, processes, shapes, materials, numerical values, etc. given in the first to third embodiments and modifications described above are merely examples, and if necessary, different configurations, methods, processes, etc. Shapes, materials, numerical values, etc. may be used.
  • the present disclosure may also adopt the following configuration.
  • a plurality of light emitting elements including an anode electrode, an organic light emitting layer, and a first cathode electrode, wherein the anode electrode, the organic light emitting layer, and the first cathode electrode are separated for each sub-pixel.
  • a protective layer that covers the plurality of light emitting elements, A second cathode electrode provided on the protective layer is provided.
  • the second cathode electrode is a display device connected to each of the separated first cathode electrodes.
  • the protective layer has a plurality of contact holes and has a plurality of contact holes. The display device according to (1), wherein the second cathode electrode is connected to each of the separated first cathode electrodes via the contact hole.
  • the first cathode electrode contains a transparent metal oxide and contains.
  • the protective layer contains at least one of an inorganic oxide and an organic insulating material.
  • the plurality of sub-pixels include a plurality of red sub-pixels, a plurality of green sub-pixels, and a plurality of blue sub-pixels.
  • the thickness of the protective layer on the separated first cathode electrode is substantially the same for the red sub-pixel, the green sub-pixel, and the blue sub-pixel, whichever is (1) to (6). Display device described in Crab.
  • the sub-pixel is provided with a resonator structure that resonates the light generated in the organic light emitting layer.
  • the plurality of sub-pixels include a plurality of red sub-pixels, a plurality of green sub-pixels, and a plurality of blue sub-pixels.
  • the thickness of the protective layer on the separated first cathode electrode is one of (1) to (6) different for each of the red sub-pixel, the green sub-pixel, and the blue sub-pixel.
  • the display device described. (9) The display device according to any one of (1) to (8), wherein the first cathode electrode and the second cathode electrode are connected outside the light emitting region of the sub-pixel. (10) The number of connecting portions between the first cathode electrode and the second cathode electrode is one or two or more with respect to one sub-pixel according to any one of (1) to (9). Display device. (11)
  • the second cathode electrode has a plurality of contact portions and has a plurality of contact portions.
  • the display device according to any one of (1) to (9), wherein one contact portion is connected to two or more of the sub-pixels.
  • the first cathode electrode has a facing surface facing the second cathode electrode.
  • the display device according to any one of (1) to (12), wherein the connecting portion between the first cathode electrode and the second cathode electrode is provided along the peripheral edge of the facing surface.
  • (14) The display device according to any one of (1) to (11), wherein the second cathode electrode is connected to an end portion of the first cathode electrode.
  • the first cathode electrode has a protruding portion protruding from the peripheral edge of the light emitting region of the light emitting element.
  • the display device according to any one of (1) to (12), wherein the second cathode electrode is connected to the first cathode electrode at the protruding portion.
  • the light emitting element has a notch on the peripheral edge of the light emitting region of the light emitting element.
  • the display device according to any one of (1) to (12), wherein the second cathode electrode is connected to the first cathode electrode at the notch.
  • the protective layer has a plurality of air gaps and has a plurality of air gaps.
  • the display device according to any one of (1) to (16), wherein each of the plurality of air gaps is provided between adjacent sub-pixels.
  • the display device according to claim 1, further comprising a protective layer covering the second cathode electrode.
  • a plurality of light emitting elements including a first electrode, an organic light emitting layer, and a second electrode, and the second electrode, the organic light emitting layer, and the second electrode are separated for each sub-pixel.
  • a third electrode provided on the protective layer is provided.
  • the third electrode is a display device connected to each of the separated second electrodes.
  • An electronic device including the display device according to any one of (1) to (19).
  • Display device 11 Substrate 12R, 12B, 12G, 12W Light emitting element 13 Insulation layer 14, 15 Protective layer 14A, 15A First protective layer 14B, 15B Second protective layer 14C Air gap 14H Contact hole 16 Color filter 16R Red filter 16G Green filter 16B Blue filter 17R, 17G, 17B Resonator structure 100R, 100G, 100B Sub-pixel 101 Light emitting area 102 Protruding part 103 Notch part 110A Display area 110B Peripheral area 111 Signal line drive circuit 111A Signal line 112 Scan line drive circuit 112A Scanning line 121 Anode electrode 122 Organic layer 122K Hole injection layer 122L Hole transport layer 122M Organic light emitting layer 122N Electron transport layer 123 First cathode electrode 123A Protruding part 124 Second cathode electrode 124A Contact part 124B Connection part 124C Shared Connection part 310 Digital still camera (electronic device) 320 Head-mounted display (electronic device) 330 Television

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