WO2021200729A1 - サーマルヘッドおよびサーマルプリンタ - Google Patents

サーマルヘッドおよびサーマルプリンタ Download PDF

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Publication number
WO2021200729A1
WO2021200729A1 PCT/JP2021/013060 JP2021013060W WO2021200729A1 WO 2021200729 A1 WO2021200729 A1 WO 2021200729A1 JP 2021013060 W JP2021013060 W JP 2021013060W WO 2021200729 A1 WO2021200729 A1 WO 2021200729A1
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WO
WIPO (PCT)
Prior art keywords
substrate
thermal head
region
electrode
head according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/013060
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English (en)
French (fr)
Japanese (ja)
Inventor
加藤　謙一
宮本　誠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2022512153A priority Critical patent/JP7336588B2/ja
Priority to US17/907,673 priority patent/US12097715B2/en
Priority to CN202180023554.1A priority patent/CN115315356B/zh
Priority to EP21781399.7A priority patent/EP4129700B1/en
Publication of WO2021200729A1 publication Critical patent/WO2021200729A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3351—Electrode layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33515—Heater layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3352—Integrated circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33525—Passivation layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3353—Protective layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33535—Substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3354—Structure of thermal heads characterised by geometry
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Definitions

  • the disclosed embodiment relates to a thermal head and a thermal printer.
  • connection structure of electronic components joined by sandwiching an AuSn alloy layer between Au bumps located on the wiring side and the electronic component side located on the substrate has been proposed.
  • the thermal head includes a substrate, a bonding material, a conductive member, and a gold electrode.
  • the bonding material is located on the substrate and contains gold and tin.
  • the conductive member is located above the bonding material.
  • the gold electrode is located on the substrate and is electrically connected to the conductive member via the bonding material.
  • the thermal printer includes the thermal head described above, a transport mechanism, and a platen roller.
  • the transport mechanism transports the recording medium onto a heat generating portion located on the substrate.
  • the platen roller presses the recording medium.
  • FIG. 1 is a perspective view showing an outline of a thermal head according to an embodiment.
  • FIG. 2 is a cross-sectional view showing an outline of the thermal head shown in FIG.
  • FIG. 3 is a plan view showing an outline of the head substrate shown in FIG.
  • FIG. 4 is an enlarged cross-sectional view of the region A shown in FIG.
  • FIG. 5 is an enlarged cross-sectional view of the region B shown in FIG.
  • FIG. 6 is a schematic view of the thermal printer according to the embodiment.
  • FIG. 7 is a cross-sectional view showing a main part of the thermal head according to the modified example of the embodiment.
  • FIG. 1 is a perspective view showing an outline of a thermal head according to an embodiment.
  • the thermal head X1 according to the embodiment includes a heat radiating body 1, a head substrate 3, and an FPC (flexible printed wiring board) 5.
  • the head substrate 3 is located on the radiator body 1.
  • the FPC 5 is electrically connected to the head substrate 3.
  • the head substrate 3 includes a substrate 7, a heat generating portion 9, a drive IC 11, and a covering member 29.
  • the heat radiating body 1 has a plate shape and a rectangular shape in a plan view.
  • the heat radiating body 1 has a function of radiating heat that does not contribute to printing among the heat generated in the heat generating portion 9 of the head substrate 3.
  • the head substrate 3 is adhered to the upper surface of the heat radiating body 1 with double-sided tape, an adhesive or the like (not shown).
  • the radiator 1 is made of, for example, a metal material such as copper, iron or aluminum.
  • the head substrate 3 has a plate shape and a rectangular shape in a plan view.
  • each member constituting the thermal head X1 is located on the substrate 7.
  • the head substrate 3 prints on the recording medium P (see FIG. 6) according to an electric signal supplied from the outside.
  • a plurality of drive ICs 11 are located on the substrate 7 and are arranged in the main scanning direction.
  • the drive IC 11 is an electronic component having a function of controlling the energized state of each heat generating portion 9.
  • a switching member having a plurality of switching elements inside may be used as the drive IC 11, for example, a switching member having a plurality of switching elements inside may be used.
  • the drive IC 11 is covered with a coating member 29 made of a resin such as an epoxy resin or a silicone resin.
  • the covering member 29 is located across the plurality of drive ICs 11.
  • One end of the FPC 5 is electrically connected to the head substrate 3, and the other end is electrically connected to the connector 31.
  • the FPC 5 is electrically connected to the head substrate 3 by the conductive bonding material 23 (see FIG. 2).
  • the conductive bonding material 23 an anisotropic conductive film (ACF) in which conductive particles are mixed in a solder material or an electrically insulating resin can be exemplified.
  • FIG. 2 is a cross-sectional view showing an outline of the thermal head shown in FIG.
  • FIG. 3 is a plan view showing an outline of the head substrate shown in FIG.
  • the head substrate 3 includes a substrate 7, a common electrode 17, an individual electrode 19, a first electrode 12, a second electrode 14, a terminal 2, a heat generating resistor 15, a protective layer 25, and a coating layer 27. , A bonding material 24 and an underfill material 28 are further provided.
  • the protective layer 25 and the covering layer 27 are omitted.
  • FIG. 3 shows the wiring of the head substrate 3 in a simplified manner, and omits the protective layer 25, the coating layer 27, and the underfill material 28.
  • the configuration of the second electrode 14 is shown in a simplified manner, and the drive IC 11 shows the approximate shape in a plan view by a two-dot chain line.
  • the substrate 7 has a rectangular shape in a plan view, and has one long side, the first long side 7a, the other long side, the second long side 7b, the first short side 7c, and the second short side. It has a side 7d.
  • the substrate 7 is made of an electrically insulating material such as alumina ceramics, a semiconductor material such as single crystal silicon, or the like.
  • the common electrode 17 is located on the upper surface of the substrate 7.
  • the common electrode 17 is made of a conductive material, and examples thereof include a metal of any one of aluminum, gold, silver and copper, or an alloy thereof.
  • the common electrode 17 has a first common electrode 17a, a second common electrode 17b, a third common electrode 17c, and a terminal 2.
  • the common electrode 17 is electrically connected in common to the heat generating portion 9 having a plurality of elements.
  • the first common electrode 17a is located between the first long side 7a of the substrate 7 and the heat generating portion 9, and extends in the main scanning direction.
  • a plurality of the second common electrodes 17b are located along the first short side 7c and the second short side 7d of the substrate 7, respectively.
  • the second common electrode 17b connects the corresponding terminal 2 and the first common electrode 17a, respectively.
  • the third common electrode 17c extends from the first common electrode 17a toward each element of the heat generating portion 9, and a part of the third common electrode 17c is inserted through the opposite side of the heat generating portion 9.
  • the third common electrode 17c is located at intervals from each other in the second direction D2 (main scanning direction).
  • the individual electrode 19 is located on the upper surface of the substrate 7.
  • the individual electrode 19 is a so-called gold electrode.
  • the individual electrode 19 contains, for example, gold or a gold alloy and has conductivity.
  • the individual electrode 19 may contain tin.
  • a plurality of individual electrodes 19 are located in the main scanning direction, and are located between adjacent third common electrodes 17c. Therefore, in the thermal head X1, the third common electrode 17c and the individual electrodes 19 are alternately arranged in the main scanning direction.
  • the electrode pad 10 is connected to the second long side 7b side of the substrate 7.
  • the electrode pad 10 is electrically connected to the drive IC 11 by a bonding material 24 (see FIG. 2).
  • the electrode pad 10 may be made of the same material as the individual electrode 19, for example.
  • the first electrode 12 is connected to the electrode pad 10 and extends in the first direction D1 (secondary scanning direction).
  • the drive IC 11 is mounted on the electrode pad 10 as described above.
  • the electrode pad 10 may be made of the same material as the first electrode 12, for example.
  • the second electrode 14 extends in the main scanning direction and is located over the plurality of first electrodes 12.
  • the second electrode 14 is connected to the outside by the terminal 2.
  • the terminal 2 is located on the second long side 7b side of the substrate 7.
  • the terminal 2 is connected to the FPC 5 by a conductive bonding material 23 (see FIG. 2).
  • the head substrate 3 is electrically connected to the outside.
  • the third common electrode 17c, the individual electrode 19, and the first electrode 12 have their respective material layers formed on the substrate 7 by, for example, a screen printing method, a flexographic printing method, a gravure printing method, a gravure offset printing method, or the like. Can be made. Further, for example, it may be produced by sequentially laminating by a conventionally known thin film forming technique such as a sputtering method, and then processing the laminated body into a predetermined pattern by using a conventionally known photoetching or the like.
  • the thickness of the third common electrode 17c, the individual electrode 19, and the first electrode 12 is, for example, about 0.3 to 10 ⁇ m, and may be, for example, about 0.5 to 5 ⁇ m.
  • the material layers constituting the first common electrode 17a, the second common electrode 17b, the second electrode 14, and the terminal 2 can be formed on the substrate 7 by, for example, a screen printing method.
  • the thickness of the first common electrode 17a, the second common electrode 17b, the second electrode 14, and the terminal 2 is, for example, about 5 to 20 ⁇ m.
  • the heat generation resistor 15 is located straddling the third common electrode 17c and the individual electrode 19 and separated from the first long side 7a of the substrate 7.
  • the portion of the heat generation resistor 15 located between the third common electrode 17c and the individual electrode 19 functions as each element of the heat generation unit 9.
  • each element of the heat generating portion 9 is shown in a simplified manner in FIG. 3, it is located at a density of, for example, 100 dpi to 2400 dpi (dot per inch).
  • the heat generation resistor 15 may, for example, place a material paste containing ruthenium oxide as a conductive component on a substrate 7 in which various electrodes are patterned in a long strip shape long in the main scanning direction by a screen printing method, a dispensing device, or the like. ..
  • the protective layer 25 is located on the heat storage layer 13 formed on the upper surface of the substrate 7 and covers the heat generating portion 9.
  • the protective layer 25 is located along the main scanning direction of the substrate 7 so as to be separated from the electrode pad 10 from the first long side 7a of the substrate 7.
  • the protective layer 25 has an insulating property, and protects the covered area from corrosion due to adhesion of moisture and the like contained in the atmosphere, or wear due to contact with a recording medium to be printed.
  • the protective layer 25 can be made of glass, for example, and can be made by using a thick film forming technique such as printing.
  • the protective layer 25 may be made of SiN, SiO 2 , SiON, SiC, diamond-like carbon or the like.
  • the protective layer 25 may be formed of a single layer, or a plurality of protective layers 25 may be laminated. Such a protective layer 25 can be produced by using a thin film forming technique such as a sputtering method.
  • the coating layer 27 is located on the substrate 7 so as to partially cover the common electrode 17, the individual electrode 19, the first electrode 12, and the second electrode 14.
  • the coating layer 27 protects the coated region from oxidation due to contact with the atmosphere or corrosion due to adhesion of moisture or the like contained in the atmosphere.
  • the coating layer 27 can be made of a resin material such as an epoxy resin, a polyimide resin, or a silicone resin.
  • the bonding material 24 is located on the substrate 7 and electrically connects the drive IC 11 and the individual electrodes 19.
  • the bonding material 24 contains gold (Au) and tin (Sn) and has conductivity. The details of joining the drive IC 11 with the joining material 24 will be described later.
  • the underfill material 28 is located between the substrate 7 and the drive IC 11, and covers a part of the bonding material 24 and the drive IC 11.
  • the underfill material 28 has an insulating property.
  • the underfill material 28 can be made of, for example, a resin such as an epoxy resin.
  • the substrate 7 has been described as a single layer, it may have a laminated structure in which the heat storage layer is located on the upper surface.
  • the heat storage layer can be positioned over the entire area on the upper surface side of the substrate 7.
  • the heat storage layer is made of, for example, glass having low thermal conductivity.
  • the heat storage layer can temporarily store a part of the heat generated in the heat generating unit 9 and shorten the time required to raise the temperature of the heat generating unit 9. As a result, it functions to enhance the thermal response characteristics of the thermal head X1.
  • the heat storage layer is produced, for example, by applying a predetermined glass paste obtained by mixing a glass powder with an appropriate organic solvent onto the upper surface side of the substrate 7 by a conventionally known screen printing or the like and firing the paste.
  • the heat storage layer may have a base portion and a raised portion.
  • the base portion is a portion located over the entire upper surface side of the substrate 7.
  • the raised portion is a portion that protrudes from the base portion in the thickness direction of the substrate 7 and extends in a strip shape along the second direction D2 (main scanning direction). In that case, the raised portion functions so as to satisfactorily press the recording medium for printing against the protective layer 25 formed on the heat generating portion 9.
  • the heat storage layer may have only a raised portion.
  • FIG. 4 is an enlarged cross-sectional view of the region A shown in FIG.
  • the drive IC 11 has an element portion 11a and a terminal portion 11b.
  • the element unit 11a is a main part that realizes the above-mentioned functions of the drive IC 11.
  • the element unit 11a is an example of an electronic component.
  • the terminal portion 11b is electrically connected to the element portion 11a.
  • the terminal portion 11b is electrically connected to the electrode pad 10 located at the end of the individual electrode 19 via the bonding material 24 located on the substrate 7.
  • the terminal portion 11b is, for example, a conductive metal member.
  • the terminal portion 11b contains, for example, copper and nickel.
  • the terminal portion 11b is an example of a conductive member.
  • the terminal portion 11b may have a first layer 111 and a second layer 112.
  • the first layer 111 contains, for example, copper.
  • the first layer 111 has a predetermined dimension and secures a distance d3 between the element portion 11a and the substrate 7.
  • the interval d3 is, for example, 20 ⁇ m or more.
  • the second layer 112 is located closer to the substrate 7 than the first layer 111.
  • the second layer 112 contains, for example, nickel.
  • the second layer 112 functions as a diffusion prevention layer for preventing the diffusion of gold atoms and tin atoms located on the bonding material 24 toward the element portion 11a.
  • the thickness d1 of the terminal portion 11b may be larger than the distance d2 between the substrate 7 and the terminal portion 11b. By making the thickness d1 larger than the interval d2, it becomes easy to secure the above-mentioned interval d3 between the element portion 11a and the substrate 7.
  • the joining material 24 is located between the substrate 7 and the terminal portion 11b of the drive IC 11, and fixes the drive IC 11 on the substrate 7.
  • the bonding material 24 is adjacent to the individual electrode 19 so as to be in contact with the individual electrode 19 and is located on the substrate 7. Therefore, the drive IC 11 and the individual electrodes 19 are electrically connected via the conductive bonding material 24.
  • the bonding material 24 is directly located on the substrate 7 without passing through the individual electrodes 19. By locating the joining material 24 in this way, the durability is increased. This point will be further described with reference to FIGS. 4 and 5.
  • FIG. 5 is an enlarged cross-sectional view of the region B shown in FIG.
  • the substrate 7 has a plurality of convex portions 71 and concave portions 72 facing the individual electrodes 19 and the bonding material 24.
  • the convex portion 71 is a portion that protrudes in the thickness direction of the substrate 7.
  • the concave portion 72 is located between the adjacent convex portions 71, and is a portion that is recessed in the thickness direction of the substrate 7.
  • the average height Zc of the surface of the substrate 7 at a predetermined distance for example, 300 ⁇ m
  • a portion lower than the convex portion 71 and the average height Zc can also be regarded as the concave portion 72.
  • the individual electrode 19 is in contact with the convex portion 71.
  • a gap 20 is located between the recess 72 of the substrate 7 and the individual electrode 19. That is, the individual electrode 19 is fixed to the substrate 7 so as to be supported by the convex portion 71.
  • the joining material 24 has a plurality of concave portions 241 and convex portions 242.
  • the concave portion 241 is located around the convex portion 71 so as to surround the convex portion 71 of the substrate 7 in a plan view.
  • the convex portion 242 is located in the concave portion 72 of the substrate 7. That is, the joining material 24 is positioned so as to follow the surface shape of the substrate 7, and the joining material 24 and the substrate 7 are in close contact with each other.
  • the joining material 24 has the concave portion 241 and the convex portion 242 corresponding to the convex portion 71 and the concave portion 72 of the substrate 7, it is compared with the individual electrode 19 that does not follow the convex portion 71 and the concave portion 72 of the substrate 7. Adhesion to the substrate 7 is improved. Therefore, the joining material 24 for fixing the drive IC 11 is less likely to be peeled off or damaged. Therefore, according to the thermal head X1 according to the embodiment, the durability is improved.
  • the joining material 24 may have a first region 24a and a second region 24b.
  • the first region 24a has a higher tin content than the individual electrode 19.
  • the first region 24a may have, for example, 20% to 40% Sn atoms and 80% to 60% Au atoms in terms of mass ratio.
  • the second region 24b has a higher gold content than the first region 24a.
  • the second region 24b may have, for example, Sn atoms having a mass ratio of less than 20% and Au atoms having a mass ratio of more than 80%.
  • the first region 24a and the second region 24b can be visually discriminated based on a SEM (Scanning Electron Microscope) image obtained by capturing a cross section of the bonding material 24.
  • the second region 24b is located so as to spread in the left-right direction shown in FIG. 4 from below the terminal portion 11b.
  • the second region 24b may be located closer to the substrate 7 than the first region 24a.
  • the first region 24a may be positioned so as to face the terminal portion 11b of the drive IC 11, and the second region 24b may be positioned so as to be adjacent to the individual electrode 19.
  • the bonding material 24 may contain a glass component 26.
  • the glass component 26 is located, for example, inside the second region 24b.
  • the bonding material 24 for fixing the drive IC 11 is less likely to be peeled off or damaged. Therefore, according to the thermal head X1 according to the embodiment, the durability is improved.
  • connection of the drive IC 11 in the electrode pad 10 located at the first electrode 12 is also related to the connection of the drive IC 11 in the electrode pad 10 located at the end of the individual electrode 19 as an example of the gold electrode. It can be similar to a connection.
  • FIG. 6 is a schematic view of the thermal printer according to the embodiment.
  • the thermal printer Z1 includes the above-mentioned thermal head X1, a transport mechanism 40, a platen roller 50, a power supply device 60, and a control device 70.
  • the thermal head X1 is attached to the attachment surface 80a of the attachment member 80 arranged in the housing (not shown) of the thermal printer Z1.
  • the thermal head X1 is attached to the attachment member 80 so as to be along the main scanning direction which is a direction orthogonal to the conveying direction S.
  • the transport mechanism 40 has a drive unit (not shown) and transport rollers 43, 45, 47, 49.
  • the transport mechanism 40 is placed on the protective layer 25 located on the plurality of heat generating portions 9 of the thermal head X1 so that the recording medium P such as the thermal paper and the image receiving paper on which the ink is transferred is along the transport direction S indicated by the arrow.
  • the drive unit has a function of driving the transfer rollers 43, 45, 47, 49, and for example, a motor can be used.
  • the transport rollers 43, 45, 47, 49 are made of, for example, cylindrical shaft bodies 43a, 45a, 47a, 49a made of a metal such as stainless steel, and elastic members 43b, 45b, 47b, made of butadiene rubber or the like.
  • the recording medium P is an image receiving paper or the like on which ink is transferred
  • an ink film (not shown) is conveyed between the recording medium P and the heat generating portion 9 of the thermal head X1 together with the recording medium P.
  • the platen roller 50 has a function of pressing the recording medium P onto the protective layer 25 located on the heat generating portion 9 of the thermal head X1.
  • the platen roller 50 is arranged so as to extend along a direction orthogonal to the transport direction S, and both ends thereof are supported and fixed so as to be rotatable in a state where the recording medium P is pressed onto the heat generating portion 9.
  • the platen roller 50 can be formed by, for example, covering a columnar shaft body 50a made of a metal such as stainless steel with an elastic member 50b made of butadiene rubber or the like.
  • the power supply device 60 has a function of supplying a current for heating the heat generating portion 9 of the thermal head X1 and a current for operating the drive IC 11 as described above.
  • the control device 70 has a function of supplying a control signal for controlling the operation of the drive IC 11 to the drive IC 11 in order to selectively generate heat of the heat generating portion 9 of the thermal head X1 as described above.
  • the thermal printer Z1 presses the recording medium P onto the heat generating portion 9 of the thermal head X1 by the platen roller 50, and conveys the recording medium P onto the heat generating portion 9 by the conveying mechanism 40, while the power supply device 60 and the control device 70.
  • a predetermined printing is performed on the recording medium P by selectively heating the heat generating portion 9 by the above.
  • the recording medium P is an image receiving paper or the like
  • printing is performed on the recording medium P by thermally transferring the ink of the ink film (not shown) conveyed together with the recording medium P to the recording medium P.
  • FIG. 7 is a cross-sectional view showing a main part of the thermal head according to the modified example of the embodiment.
  • the first region 24a and the second region 24b of the joining material 24 are located side by side in a layered manner.
  • the joining material 24 may have one or a plurality of third regions 24c located inside the first region 24a.
  • the third region 24c has a higher gold content than the first region 24a.
  • the joining material 24 may have one or a plurality of fourth regions 24d located inside the second region 24b.
  • the fourth region 24d has a higher tin content than the second region 24b. Since the joining material 24 has the fourth region 24d in this way, the melting point of the joining material 24 is lowered, and the filling property of the recess 72 of the substrate 7 is improved.
  • the glass component 26 is located in the second region 24b.
  • the glass component 26 may be located inside the first region 24a, the third region 24c, and the fourth region 24d.
  • the present disclosure is not limited to the above embodiments, and various changes can be made as long as the purpose is not deviated.
  • the flat head in which the heat generating portion 9 is located on the main surface of the substrate 7 has been described as an example, an end face head in which the heat generating portion 9 is located on the end surface of the substrate 7 may be used.
  • the heat generation resistor 15 may be used for a so-called thin film head formed by sputtering.
  • the material of the underfill material 28 that covers the joining material 24 and the terminal portion 11b may be the same material as the covering member 29 that covers the drive IC 11.
  • the connector 31 may be directly electrically connected to the head substrate 3 without providing the FPC 5.
  • the connector pin (not shown) of the connector 31 and the electrode pad 10 may be electrically connected.
  • the thermal head X1 having the coating layer 27 is illustrated, the coating layer 27 does not necessarily have to be provided. In that case, the protective layer 25 may be positioned up to the region where the covering layer 27 is provided.
  • the bonding material 24 is located between the substrate 7 and the terminal portion 11b, but for example, a part of the bonding material 24 is located between the individual electrode 19 and the element portion 11a. May be good.
  • the concave portion 241 and the convex portion 242 of the joining material 24 and the convex portion 71 and the concave portion 72 of the corresponding substrate 7 are in close contact with each other.
  • such a gap may be smaller than the gap 20 located between the individual electrode 19 and the substrate 7.
  • the electrode pad 10 is described as being composed of the same material as the corresponding individual electrode 19 or the first electrode 12, but the present invention is not limited to this, and for example, the electrode pad 10 is made of the same material as the bonding material 24. May be good. Further, the electrode pad 10 does not have to be positioned at the end of the individual electrode 19 and the first electrode 12.

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  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)
PCT/JP2021/013060 2020-03-31 2021-03-26 サーマルヘッドおよびサーマルプリンタ Ceased WO2021200729A1 (ja)

Priority Applications (4)

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JP2022512153A JP7336588B2 (ja) 2020-03-31 2021-03-26 サーマルヘッドおよびサーマルプリンタ
US17/907,673 US12097715B2 (en) 2020-03-31 2021-03-26 Thermal head and thermal printer
CN202180023554.1A CN115315356B (zh) 2020-03-31 2021-03-26 热敏头以及热敏打印机
EP21781399.7A EP4129700B1 (en) 2020-03-31 2021-03-26 Thermal head and thermal printer

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JP2020065270 2020-03-31
JP2020-065270 2020-03-31

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WO2021200729A1 true WO2021200729A1 (ja) 2021-10-07

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WO (1) WO2021200729A1 (https=)

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WO2024029512A1 (ja) * 2022-08-05 2024-02-08 京セラ株式会社 サーマルヘッドおよびサーマルプリンタ
JPWO2024029512A1 (https=) * 2022-08-05 2024-02-08
EP4549158A4 (en) * 2022-08-05 2025-11-12 Kyocera Corp THERMAL HEAD AND THERMAL PRINTER
JP7811998B2 (ja) 2022-08-05 2026-02-06 京セラ株式会社 サーマルヘッドおよびサーマルプリンタ

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CN115315356B (zh) 2023-11-21
EP4129700A4 (en) 2024-04-03
EP4129700A1 (en) 2023-02-08
US12097715B2 (en) 2024-09-24
US20230130610A1 (en) 2023-04-27
EP4129700B1 (en) 2025-10-29
JPWO2021200729A1 (https=) 2021-10-07
CN115315356A (zh) 2022-11-08

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