JPS55166268A - Manufacture of thermal head - Google Patents
Manufacture of thermal headInfo
- Publication number
- JPS55166268A JPS55166268A JP7339979A JP7339979A JPS55166268A JP S55166268 A JPS55166268 A JP S55166268A JP 7339979 A JP7339979 A JP 7339979A JP 7339979 A JP7339979 A JP 7339979A JP S55166268 A JPS55166268 A JP S55166268A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- electroplated
- common electrode
- electrodes
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electronic Switches (AREA)
Abstract
PURPOSE:To form electrodes which their electric resistance is low and are excellent in bonding properties without etching the electrodes off by a method wherein a common electrode of thermal heads after forming a wear resisting layer is connected to a cathode of an electroplating device through an elastic connector and electroplated. CONSTITUTION:A plating jig 13 is positioned so as to contact with only a common electrode 3 of thermal heads after forming a wear resisting layer 5, and pushed by the force of 1.5kg/cm<2> in the arrow head 14 direction, and the common electrode 3 and a metallic plate 9 of the plating jig 13 are electrically connected by a metallic thin wire 7. The metallic plate 9 is connected to a cathode of an electroplating device under this condition and electroplated in a plating liquid, and plating films are made up to the common electrode 3 and separate electrodes 4 in regions not coated with the silicon rubber 6 of the plating jig 13. Boundaries among portions 31, 41 electroplated and portions 32, 42 not electroplated are shown in sharp contours, and a conductor for plating and the etching-off are not required.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7339979A JPS55166268A (en) | 1979-06-11 | 1979-06-11 | Manufacture of thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7339979A JPS55166268A (en) | 1979-06-11 | 1979-06-11 | Manufacture of thermal head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55166268A true JPS55166268A (en) | 1980-12-25 |
JPS6245829B2 JPS6245829B2 (en) | 1987-09-29 |
Family
ID=13517073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7339979A Granted JPS55166268A (en) | 1979-06-11 | 1979-06-11 | Manufacture of thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55166268A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61112661A (en) * | 1985-11-09 | 1986-05-30 | Ricoh Co Ltd | Conductive path-wired base plate for thermal head and its manufacture |
JPWO2021200729A1 (en) * | 2020-03-31 | 2021-10-07 |
-
1979
- 1979-06-11 JP JP7339979A patent/JPS55166268A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61112661A (en) * | 1985-11-09 | 1986-05-30 | Ricoh Co Ltd | Conductive path-wired base plate for thermal head and its manufacture |
JPWO2021200729A1 (en) * | 2020-03-31 | 2021-10-07 |
Also Published As
Publication number | Publication date |
---|---|
JPS6245829B2 (en) | 1987-09-29 |
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