WO2021192391A1 - Procédé de production d'un corps stratifié optique équipé d'une couche adhésive ayant un trou traversant - Google Patents

Procédé de production d'un corps stratifié optique équipé d'une couche adhésive ayant un trou traversant Download PDF

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Publication number
WO2021192391A1
WO2021192391A1 PCT/JP2020/041297 JP2020041297W WO2021192391A1 WO 2021192391 A1 WO2021192391 A1 WO 2021192391A1 JP 2020041297 W JP2020041297 W JP 2020041297W WO 2021192391 A1 WO2021192391 A1 WO 2021192391A1
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WO
WIPO (PCT)
Prior art keywords
hole
end mill
adhesive layer
cutting
forming
Prior art date
Application number
PCT/JP2020/041297
Other languages
English (en)
Japanese (ja)
Inventor
誠 中市
優樹 山本
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to KR1020227031111A priority Critical patent/KR20220156536A/ko
Priority to CN202080098920.5A priority patent/CN115315332A/zh
Priority to JP2022509239A priority patent/JPWO2021192391A1/ja
Publication of WO2021192391A1 publication Critical patent/WO2021192391A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C3/00—Milling particular work; Special milling operations; Machines therefor
    • B23C3/007—Milling end surfaces of nuts or tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C3/00—Milling particular work; Special milling operations; Machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/02—Milling-cutters characterised by the shape of the cutter
    • B23C5/10—Shank-type cutters, i.e. with an integral shaft
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/02—Milling-cutters characterised by the shape of the cutter
    • B23C5/10—Shank-type cutters, i.e. with an integral shaft
    • B23C5/1009—Ball nose end mills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a non-planar shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements

Definitions

  • the present invention relates to a method for manufacturing an optical laminate with an adhesive layer having through holes.
  • optical laminates for example, polarizing plates
  • image display devices such as mobile phones and notebook personal computers in order to realize image display and / or enhance the performance of the image display.
  • the optical laminate is typically configured as an optical laminate with an adhesive layer provided with an adhesive layer, and can be bonded to an image display cell.
  • image display devices equipped with cameras have come to be widely used.
  • an optical laminate with an adhesive layer having a through hole at a position corresponding to the camera portion has also been widely used.
  • Such through holes can be formed, for example, by drilling with an end mill.
  • the present invention has been made to solve such a problem, and its main purpose is to provide an optical laminate with an adhesive layer having through holes in which glue chipping and floating of a surface protective film and a separator are suppressed. It is an object of the present invention to provide a method which can be manufactured easily and inexpensively.
  • the method for manufacturing an optical laminate with an adhesive layer having through holes is to form a work by stacking a plurality of optical laminates with an adhesive layer and cutting the work using an end mill. Includes forming through holes in place of.
  • the optical laminate with the pressure-sensitive adhesive layer includes an optical film, a pressure-sensitive adhesive layer arranged on one side of the optical film, a separator temporarily attached to the pressure-sensitive adhesive layer so as to be peelable, and the optical film. Includes a surface protective film that is temporarily attached to one side so that it can be peeled off.
  • the formation of the through hole includes cutting by moving the end mill either upward or downward while pressing the end mill against the end face of the hole and cutting.
  • the formation of the through hole is to form a pilot hole; while cutting by pressing the end mill against the end face of the pilot hole, the end mill is placed along the end face of the pilot hole. , The end mill is made to go around while moving from a predetermined position at the start of cutting to either the upper side or the lower side to form the next hole having a diameter larger than the diameter of the prepared hole by a predetermined amount; Returning to a predetermined position, the end mill is pressed against the end face of the next hole to cut, and the end mill is moved along the end face of the next hole and the end mill is moved upward or downward from the predetermined position.
  • the formation of the through hole includes forming the pilot hole with a cantilevered end mill and forming a hole after the next hole with a double-sided end mill.
  • the end mill has a torsion blade, and the vertical movement direction of the end mill in forming the through hole is a cutting chip discharge direction.
  • the end mill forming the prepared hole and the end mill forming the hole after the next hole are the same end mill, and the end mill moves up and down in the formation of the hole after the next hole.
  • the direction is upward.
  • the thickness of the work is 10 mm or more.
  • the optical film comprises a polarizer or a polarizing plate.
  • the end mill in the formation of a through hole in the production of an optical laminate with an adhesive layer having a through hole, is cut while moving either upward or downward to cause glue chipping and It is possible to suppress the floating of the surface protective film and the separator.
  • FIG. 1 It is a schematic diagram explaining the relationship between the typical example of the structure of the end mill having a torsion blade which can be used in the manufacturing method by Embodiment of this invention, and the discharge direction and the rotation direction of cutting waste. It is a schematic plan view explaining the details of the formation of the through hole in the manufacturing method according to the embodiment of this invention.
  • (A) is a schematic cross-sectional view for explaining the formation of a pilot hole in the formation of a through hole
  • (b) is a schematic cross-sectional view for explaining the formation of holes after the next hole.
  • FIG. 1 is a schematic plan view explaining the trajectory in the plane of the end mill in the formation of the through hole;
  • (b) is a schematic view explaining the upward movement accompanying the movement of the end mill in the plane;
  • (C) is a schematic view explaining the downward movement accompanying the movement of the end mill in a plane. It is the schematic explaining the vertical movement with the movement in the plane of the end mill in the comparative example 4.
  • the method for manufacturing an optical laminate with an adhesive layer having through holes is to form a work by stacking a plurality of optical laminates with an adhesive layer and cutting the work by cutting with an end mill. Includes forming through holes in place.
  • the optical laminate with the pressure-sensitive adhesive layer is formed on the optical film, the pressure-sensitive adhesive layer arranged on one side of the optical film, the separator temporarily attached to the pressure-sensitive adhesive layer so as to be peelable, and the other side of the optical film.
  • the formation of through holes involves cutting while moving the end mill either upwards or downwards.
  • FIG. 1 is a schematic cross-sectional view illustrating an example of an optical laminate with an adhesive layer that can be used in the manufacturing method according to the embodiment of the present invention.
  • the optical laminate 100 with an adhesive layer of the illustrated example includes an optical film 10, an adhesive layer 20 arranged on one side of the optical film 10, and a separator 30 temporarily attached to the adhesive layer 20 so as to be peelable.
  • a surface protective film 40 that is temporarily attached to the other side of the optical film 10 so as to be peelable.
  • the separator 30 is typically arranged on the image display cell side.
  • the separator 30 is peeled off and removed, and the pressure-sensitive adhesive layer 20 is used to bond the optical laminate with the pressure-sensitive adhesive layer to an image display device (substantially, an image display cell).
  • the surface protective film 40 typically has a base material 41 and an adhesive layer 42. In order to distinguish it from the pressure-sensitive adhesive layer 20, the pressure-sensitive adhesive layer 42 of the surface protective film may be referred to as a "PF pressure-sensitive adhesive layer".
  • the surface protective film 40 is also peeled off during actual use of the optical laminate with an adhesive layer.
  • the optical laminate with the pressure-sensitive adhesive layer has a through hole 50 at a predetermined position.
  • One through hole 50 may be formed as shown in FIG. 2A, two may be formed as shown in FIG. 2B, or three or more through holes 50 may be formed (not shown).
  • two through holes may be formed side by side in the short side direction, may be formed side by side in the long side direction, or may be formed randomly as shown in FIG. 2B.
  • the formation position of the through hole can be appropriately set according to the purpose.
  • the through hole is typically formed at or near the end of the optical laminate with an adhesive layer, and is preferably formed at a corner as shown in the illustrated example.
  • the through hole may be formed at a position corresponding to the camera portion of the image display device.
  • the plan view shape of the through hole any suitable shape may be adopted depending on the purpose and the desired configuration of the image display device.
  • a typical example is a substantially circular shape as shown in the illustrated example.
  • the size of the through hole (diameter in the illustrated example) is, for example, 5 mm or less, preferably 1 mm to 5 mm, and more preferably 2 mm to 4 mm. The description of the through hole is omitted in FIG.
  • optical film 10 examples include any suitable optical film that can be used in applications that require through holes.
  • the optical film may be a film composed of a single layer or a laminated body.
  • Specific examples of the optical film composed of a single layer include a polarizer and a retardation film.
  • Specific examples of the optical film configured as a laminate include a polarizing plate (typically, a laminate of a polarizing element and a protective film), a conductive film for a touch panel, a surface treatment film, and a single layer thereof.
  • Examples thereof include a laminated body (for example, a circular polarizing plate for antireflection, a polarizing plate with a conductive layer for a touch panel) in which an optical film formed as an optical film and / or an optical film formed as a laminated body is appropriately laminated according to a purpose.
  • a laminated body for example, a circular polarizing plate for antireflection, a polarizing plate with a conductive layer for a touch panel
  • an optical film formed as an optical film and / or an optical film formed as a laminated body is appropriately laminated according to a purpose.
  • any suitable configuration can be adopted as the pressure-sensitive adhesive layer 20.
  • Specific examples of the adhesives constituting the adhesive layer include acrylic adhesives, rubber adhesives, silicone adhesives, polyester adhesives, urethane adhesives, epoxy adhesives, and polyether adhesives. Can be mentioned. By adjusting the type, number, combination and blending ratio of the monomers forming the base resin of the pressure-sensitive adhesive, the blending amount of the cross-linking agent, the reaction temperature, the reaction time, etc., the pressure-sensitive adhesive having desired characteristics according to the purpose. Can be prepared.
  • the base resin of the pressure-sensitive adhesive may be used alone or in combination of two or more.
  • An acrylic adhesive is preferable from the viewpoint of transparency, processability, durability and the like.
  • the thickness of the pressure-sensitive adhesive layer 20 can be, for example, 10 ⁇ m to 100 ⁇ m.
  • the pressure-sensitive adhesive layer 20 has a creep value at 85 ° C. of, for example, 500 ⁇ m or less, preferably 5 ⁇ m to 500 ⁇ m.
  • the creep value is preferably 200 ⁇ m to 450 ⁇ m, more preferably 220 ⁇ m to 420 ⁇ m.
  • the creep value is preferably 5 ⁇ m to 300 ⁇ m, more preferably 5 ⁇ m to 200 ⁇ m, and even more preferably 10 ⁇ m to 100 ⁇ m.
  • the composition of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer for example, the type of base polymer (polarity, Tg, softness), molecular weight), It is presumed that adhesive chipping can be suppressed by controlling the cross-linked structure (for example, the type of the cross-linking agent, the distance between the cross-linking points (molecular weight between the cross-linking points), the cross-linking density, and the uncross-linked component (sol content)).
  • the creep value can be measured, for example, by the following procedure: a test sample cut out from an optical laminate with an adhesive layer is attached to a support plate at a joint surface of 10 mm ⁇ 10 mm.
  • the pressure-sensitive adhesive layer 20 has a storage elastic modulus at 85 ° C. of preferably 1.0 ⁇ 10 4 Pa or more, preferably 2.0 ⁇ 10 4 Pa or more, and more preferably 5.0 ⁇ 10 4 Pa or more. or more, further preferably 1.0 ⁇ 10 5 Pa or more.
  • the storage elastic modulus is in such a range, it becomes easy to realize the desired creep value.
  • the storage modulus is less for example 3.0 ⁇ 10 6 Pa.
  • the storage elastic modulus can be obtained from, for example, dynamic viscoelasticity measurement.
  • any suitable separator can be adopted.
  • Specific examples include plastic films, non-woven fabrics or paper surface-coated with a release agent.
  • Specific examples of the release material include a silicone-based release agent, a fluorine-based release agent, and a long-chain alkyl acrylate-based release agent.
  • Specific examples of the plastic film include polyethylene terephthalate (PET) film, polyethylene film, and polypropylene film.
  • PET polyethylene terephthalate
  • the thickness of the separator can be, for example, 10 ⁇ m to 100 ⁇ m.
  • the surface protective film 40 typically has a base material 41 and an adhesive layer 42.
  • the material for forming the base material 41 include ester resins such as polyethylene terephthalate resins, cycloolefin resins such as norbornene resins, olefin resins such as polypropylene, polyamide resins, polycarbonate resins, and their common weights. Combined resin can be mentioned.
  • An ester resin (particularly, a polyethylene terephthalate resin) is preferable.
  • Such a material has an advantage that the elastic modulus is sufficiently high and deformation is unlikely to occur even if tension is applied during transportation and / or bonding.
  • the elastic modulus of the base material 41 can be, for example, 2.2 kN / mm 2 to 4.8 kN / mm 2 .
  • the elastic modulus is measured according to JIS K 6781.
  • the thickness of the base material 41 can be, for example, 30 ⁇ m to 70 ⁇ m.
  • any suitable configuration can be adopted as the pressure-sensitive adhesive layer (PF pressure-sensitive adhesive layer) 42.
  • Specific examples include acrylic adhesives, rubber adhesives, silicone adhesives, polyester adhesives, urethane adhesives, epoxy adhesives, and polyether adhesives.
  • the base resin of the pressure-sensitive adhesive may be used alone or in combination of two or more.
  • the pressure-sensitive adhesive constituting the PF pressure-sensitive adhesive layer is characterized in that the base resin contains a polymer having an active hydrogen-containing functional group.
  • a PF pressure-sensitive adhesive layer having a desired storage elastic modulus can be obtained. Details of the pressure-sensitive adhesive constituting the PF pressure-sensitive adhesive layer are described in, for example, JP-A-2018-123281, and the description of the publication is incorporated herein by reference.
  • the thickness of the PF pressure-sensitive adhesive layer 42 can be, for example, 10 ⁇ m to 100 ⁇ m.
  • the storage elastic modulus G'of the PF pressure-sensitive adhesive layer 42 at 25 ° C. can be, for example, 0.5 ⁇ 10 6 (Pa) to 3.0 ⁇ 10 6 (Pa). When the storage elastic modulus is in such a range, an adhesive layer (as a result, a surface protective film) having an excellent balance between adhesiveness and peelability can be obtained.
  • the thickness of the surface protective film 40 can be, for example, 40 ⁇ m to 120 ⁇ m.
  • the thickness of the surface protective film means the total thickness of the base material and the PF adhesive layer.
  • FIG. 3 is a schematic perspective view illustrating the outline of formation of a through hole in the manufacturing method according to the embodiment of the present invention, and the work W is shown in this figure.
  • a work W in which a plurality of optical laminates with an adhesive layer are laminated is formed.
  • the optical laminate with the pressure-sensitive adhesive layer is typically cut into an arbitrary suitable shape when the work is formed.
  • the optical laminate with the adhesive layer may be cut into a rectangular shape, may be cut into a shape similar to the rectangular shape, and may be cut into an appropriate shape (for example, a circle) according to the purpose. It may be disconnected.
  • the work W has outer peripheral surfaces (cutting surfaces) 1a and 1b facing each other and outer peripheral surfaces (cutting surfaces) 1c and 1d orthogonal to them.
  • the work W is preferably clamped from above and below by clamping means (not shown).
  • the total thickness of the work is preferably 3 mm or more, more preferably 5 mm to 40 mm, and further preferably 10 mm to 30 mm.
  • the total thickness of the work is preferably 10 mm to 25 mm.
  • the total thickness of the work in forming a through hole, the total thickness of the work can be increased by cutting while moving the end mill either upward or downward.
  • the optical laminate with the pressure-sensitive adhesive layer is laminated so that the workpieces have such a total thickness.
  • the number of optical laminates with an adhesive layer constituting the work can vary depending on the thickness of the optical laminate with an adhesive layer.
  • the number of optical laminates with an adhesive layer is preferably 50 or more, more preferably 50 to 200, and even more preferably 75 to 150.
  • a work can be formed by stacking a significantly larger number of optical laminates with an adhesive layer than usual, and as a result, the optical laminate with an adhesive layer having through holes can be formed. The production efficiency can be remarkably improved.
  • the clamping means (for example, a jig) may be made of a soft material or a hard material. When composed of a soft material, its hardness (JIS A) is preferably 60 ° to 80 °. If the hardness is too high, imprints may remain due to the clamping means. If the hardness is too low, the jig may be deformed and misaligned, resulting in insufficient cutting accuracy.
  • JIS A hardness
  • through holes are formed in the work (substantially, an optical laminate with an adhesive layer).
  • the through hole can be formed by cutting with an end mill as shown in FIG.
  • the pilot hole formed first and the through hole finally formed are schematically shown.
  • the end mill that can be used for forming the through hole will be described first, and then the specific procedure for forming the through hole will be described.
  • the end mill 60 may have a twisted blade (may have a predetermined blade angle) or may have a blade angle of 0 °.
  • the end mill 60 typically has a torsion blade as shown in FIGS. 3 and 4.
  • the effect of cutting while moving the end mill either upward or downward (described later) becomes remarkable. This is because it is easy to match the direction of cutting chips with the direction of movement of the end mill.
  • the end mill 60 having a torsion blade has a rotating shaft 61 extending in the stacking direction (vertical direction) of the work W and a cutting blade configured as the outermost diameter of a main body rotating around the rotating shaft 61. 62 and.
  • the cutting blade 62 is configured as the outermost diameter twisted along the rotating shaft 61, and shows a right-handed right-handed twist.
  • the cutting blade 62 includes a cutting edge 62a, a rake surface 62b, and a relief surface 62c.
  • the number of cutting blades 62 can be appropriately set according to the purpose.
  • the cutting blade in the illustrated example has a configuration of three blades, but the number of blades may be one continuous blade, two blades, four blades, or five or more blades. good.
  • the blade angle of the end mill (the helix angle ⁇ of the cutting blade in the illustrated example) is preferably 10 ° to 40 °, more preferably 20 ° to 30 °.
  • the rake angle is preferably 15 ° to 25 °, and the clearance angle is preferably 25 ° to 35 °.
  • the relief surface of the cutting blade is preferably roughened.
  • any appropriate treatment can be adopted. A typical example is blasting. By applying the roughening treatment to the relief surface, the adhesion of the adhesive to the cutting blade can be suppressed, and as a result, blocking can be suppressed.
  • the outer diameter of the end mill is preferably 0.5 mm to 10 mm, more preferably 0.8 mm to 5 mm, and even more preferably 1 mm to 3 mm.
  • the effective length of the cutting blade of the end mill is preferably 10 mm to 50 mm, more preferably 20 mm to 40 mm.
  • blocking refers to a phenomenon in which optical laminates with an adhesive layer adhere to each other with an adhesive on the end face, and the shavings of the adhesive adhering to the end face are the optical laminate with the adhesive layer. It will contribute to the adhesion between the bodies. Further, the "outer diameter of the end mill” means that the distance from the rotating shaft 61 to the cutting edge 62a is doubled.
  • FIG. 5 is a schematic view illustrating a typical example of the configuration of an end mill having a torsion blade that can be used in the manufacturing method according to the embodiment of the present invention.
  • the configuration of an end mill having a twisted blade is roughly classified into a right-handed right-handed twist, a right-handed left-handed twist, a left-handed right-handed twist, and a left-handed left-handed twist.
  • the right blade means a configuration that can be cut when rotated clockwise when viewed from the upper side (shank side); and the left blade means a counterclockwise direction when viewed from the upper side (shank side).
  • right-handed twist refers to a configuration in which the cutting edge extends diagonally upward to the right when viewed from the side
  • left-handed twist refers to a configuration in which the cutting edge extends diagonally upward to the left when viewed from the side.
  • Right-blade right-handed and left-blade left-handed twists have a cutting chip discharge direction upward
  • right-blade left-handed twist and left-blade right-handed twist have a cutting waste discharge direction downward.
  • a pilot hole 51 is formed.
  • the term "prepared hole” refers to a hole that serves as a clue for forming a through hole at a correct position.
  • the pilot hole 51 can be typically formed by an end mill 60 in a cantilever state (a state in which only one end is held), as shown in FIG. 7A.
  • the end mill 60 holding the upper end is moved from the upper side to the lower side to form the pilot hole 51, but the end mill 60 holding the lower end may be moved from the lower side to the upper side to form the pilot hole 51. ..
  • the diameter of the prepared hole 51 is substantially the same as the outer diameter of the end mill 60.
  • the end mill 60 is pressed against the end face of the prepared hole 51 to cut, and the end mill 60 is made to go around along the end face of the prepared hole 51.
  • the next hole 52 having a diameter P larger than the diameter of the prepared hole 51 by a predetermined amount P is formed.
  • the end mill 60 is moved around the end face of the prepared hole 51 while moving from a predetermined position A at the start of cutting to either the upper side or the lower side to form the next hole 52.
  • FIG. 9 (a) starting from the cutting starting position A S of the prepared hole 51 will be described the case of forming the next hole 52.
  • the end mill 60 is outermost (cutting edge) is while cutting the end surface of the prepared hole 51, moves A S ⁇ A 1 ⁇ A 2 ⁇ A 3 ⁇ A 4 ⁇ A 1 ⁇ A S.
  • a S ⁇ A 1 starts cutting a predetermined pitch and moves along the orbit clockwise when viewed from above end mill, then, the end mill along the end face of the prepared hole 51 A 1 ⁇ A 2 ⁇ A 3 ⁇ A 4 ⁇ A 1 goes around.
  • the end mill returns to As while cutting in a clockwise trajectory when viewed from above.
  • the end mill 60 (e.g., the midpoint M of the cutting edge as a positioning indicator) when is in a predetermined position T in the thickness direction of the work (the vertical direction), end mill A S ⁇ A 1 ⁇ A 2 ⁇ A 3 ⁇ as it moves with a 4 ⁇ a 1 ⁇ a S , the position of the end mill, the figure in the case when moving the end mill upward changes as in FIG. 9 (b), to move the end mill downward It changes as in 9 (c).
  • the predetermined amount P may be referred to as a cutting pitch.
  • the following procedure is similar to the cutting of the pilot hole (formation of the next hole 52), and the end mill 60 is moved to either the upper side or the lower side to make a circuit along the end face of the next hole 52, and then the next hole is formed. Cut the end face of 52.
  • a further next hole 53 having a diameter P larger than the diameter of the next hole 52 by a predetermined amount P is formed. More specifically, as shown in FIG.
  • the amount of movement of the end mill upward or downward in the formation of the through hole is preferably 1 mm to 8 mm, more preferably 2 mm to 7 mm. More preferably, it is 3 mm to 5 mm. If the amount of movement is too small, chipping of glue or floating of the surface protective film or separator may not be sufficiently suppressed.
  • the larger the amount of movement, the more preferable, and the upper limit can be limited by the effective length of the cutting blade of the end mill.
  • the amount of movement can be, for example, 6% to 15% with respect to the effective length of the cutting blade of the end mill.
  • the moving direction of the end mill is preferably the direction of discharging cutting chips. That is, if the end mill is right-blade right-handed or left-blade left-handed, the direction of movement is upward; if the end mill is right-blade left-handed or left-blade right-handed, the direction of movement is downward. With such a configuration, the accumulation of cutting chips on the cutting edge of the rake face is remarkably suppressed, and the cutting chips are discharged extremely well. Alternatively, the pushing into the separator is remarkably suppressed, and as a result, the adhesive chipping and the floating of the surface protective film and the separator can be remarkably suppressed.
  • the blowing pressure is, for example, 0.05Mpa to 1Mpa
  • the wind speed is, for example, 1,500 m / min to 15,000 m / min
  • the air volume is, for example, 5 L / min to 1,000 L / min.
  • the holes after the next hole 52 can be typically formed by an end mill 60 in a double-sided state (a state in which both ends are held), as shown in FIG. 7 (b).
  • the end mill used for forming the next hole 52 and subsequent holes may be the same as or different from the end mill used for forming the prepared hole 51.
  • the vertical movement direction of the end mill in the orbital cutting is preferably upward.
  • the pilot hole can be formed by moving the end mill in the cantilever state (holding the upper end) downward, as described above.
  • the direction of discharging cutting chips is preferably upward from the viewpoint of suppressing adhesive chipping and floating of the surface protective film and the separator. Therefore, it is preferable that the vertical movement direction of the end mill in cutting by orbit is upward, which is the discharge direction of cutting chips.
  • the vertical movement direction of the end mill during orbital cutting is upward corresponding to the end mill configuration (cutting waste discharge direction). It may be lower or lower.
  • the cutting pitch P can change according to the size of the through hole, the outer diameter of the end mill, and the number of turns of the end mill.
  • the number of turns of the end mill can change depending on the size of the through hole, the outer diameter of the end mill, and the cutting pitch P.
  • the cutting pitch is, for example, 5 ⁇ m to 20 ⁇ m, preferably 5 ⁇ m to 10 ⁇ m.
  • the size of the through hole is 3 mm
  • the outer diameter of the end mill is 2 mm
  • the cutting pitch P is 10 ⁇ m
  • the number of laps of the end mill is 50 times.
  • the cutting conditions for forming the through hole can be appropriately set according to the size of the through hole, the outer diameter of the end mill, the number of laps of the end mill, and the like.
  • the rotation speed of the end mill is preferably 1000 rpm to 10000 rpm, and more preferably 1500 rpm to 4000 rpm.
  • the feed rate of the end mill is preferably 50 mm / min to 2000 mm / min, more preferably 70 mm / min to 1000 mm / min, and even more preferably 70 mm / min to 400 mm / min.
  • a through hole 50 having a predetermined diameter is formed. If necessary, the end face of the through hole may be subjected to finish cutting.
  • an optical laminate with an adhesive layer having through holes can be obtained.
  • adhesive chipping and floating of the surface protective film and the separator are suppressed.
  • the ratio (%) of the "no glue chipping" sample out of 10 was used as the evaluation standard.
  • Example 5 and Comparative Example 3 50 sets of workpieces were prepared and a total of 500 samples were evaluated.
  • Floating surface protection film or separator In the same manner as in (1), the floating of the surface protective film or separator in the through hole portion was observed, and if no floating of 50 ⁇ m or more was observed, the optical laminate with the adhesive layer was counted as a “no floating” sample. The ratio (%) of the "no float" sample out of 10 was used as the evaluation standard.
  • Example 5 and Comparative Example 3 50 sets of workpieces were prepared and a total of 500 samples were evaluated.
  • 50 sets of workpieces were prepared and a total of 500 samples were evaluated.
  • HC-TAC protective film is a film in which a hard coat (HC) layer (7 ⁇ m) is formed on a triacetyl cellulose (TAC) film (25 ⁇ m), and the TAC film is laminated so as to be on the polarizer side.
  • a surface protective film having a composition of PET base material (38 ⁇ m) / PF pressure-sensitive adhesive layer (20 ⁇ m) was used as the surface protective film.
  • the creep value of the pressure-sensitive adhesive layer was 73 ⁇ m.
  • the obtained polarizing plate with an adhesive layer was punched to a size of 5.7 inches (length 140 mm and width 65 mm), and 120 punched polarizing plates were stacked to form a work (total thickness about 18 mm). With the obtained work sandwiched between clamps (jigs), a through hole having a diameter of 3 mm was formed at a corner by end milling. More details were as follows.
  • the end mill used to form the through hole has an outer diameter of 2.0 mm, an effective length of the cutting blade of 30 mm, a blade angle of 25 °, a rake angle of 20 °, a clearance angle of 30 °, and a right-handed twist of the cutting blade (cutting waste discharge direction is Above).
  • a pilot hole (diameter 2 ⁇ m) was formed by moving it downward from the surface protective film side (upper side) in a cantilevered state.
  • the end mill was held in a double-sided state, and as shown in FIG. 9A, the end mill was pressed against the end face of the pilot hole to cut the end mill, and the end mill was made to go around along the end face of the pilot hole.
  • the cutting pitch was 10 ⁇ m.
  • the end mill was rotated once and moved upward by 4 mm. After circulation, after returning the end mill A S position, by 4mm moved downward (i.e., by 4mm moved downward in a state that does not cut) was returned to the original position in the vertical direction. Then, the end mill is moved from A S to B S, it was cut by next lap of the end mill. By repeating such cutting by orbiting the end mill, a through hole having a diameter of 3 mm was formed. The horizontal movement speed of the end mill in the orbit was 250 mm / min, and the rotation speed was 2500 rpm.
  • Table 1 The obtained polarizing plates with an adhesive layer having through holes were evaluated in (1) to (3) above. The results are shown in Table 1.
  • Example 2 A polarizing plate with an adhesive layer having a through hole was produced in the same manner as in Example 1 except that the cutting process was performed by orbiting the end mill in a cantilevered state.
  • the obtained polarizing plate with an adhesive layer having through holes was subjected to the same evaluation as in Example 1. The results are shown in Table 1.
  • Both the first retardation layer and the second retardation layer are orientation-solidified layers of liquid crystal compounds, the in-plane retardation of the first retardation layer is 240 nm, and the in-plane retardation of the second retardation layer is in-plane.
  • the phase difference was 120 nm.
  • the angle formed by the slow axis of the first retardation layer and the absorption axis of the polarizer is 15 °, and the angle formed by the slow axis of the second retardation layer and the absorption axis of the polarizer is 75 °. It was °.
  • the creep value of the pressure-sensitive adhesive layer was 73 ⁇ m.
  • the obtained polarizing plate with an adhesive layer was punched to a size of 5.7 inches (length 140 mm and width 65 mm), and 90 punched polarizing plates were stacked to form a work (total thickness about 18 mm).
  • a circularly polarizing plate with an adhesive layer having a through hole was produced in the same manner as in Example 1 except that the moving speed in the horizontal direction in the circumference of the end mill was 70 mm / min.
  • the obtained circularly polarizing plate with an adhesive layer having through holes was subjected to the same evaluation as in Example 1. The results are shown in Table 1.
  • Example 4 A circularly polarizing plate with an adhesive layer having a through hole was produced in the same manner as in Example 3 except that the horizontal moving speed in the circumference of the end mill was 125 mm / min. The obtained circularly polarizing plate with an adhesive layer having through holes was subjected to the same evaluation as in Example 1. The results are shown in Table 1.
  • Example 5 A circularly polarizing plate with an adhesive layer having a through hole was produced in the same manner as in Example 3 except that the horizontal moving speed in the circumference of the end mill was 250 mm / min. The obtained circularly polarizing plate with an adhesive layer having through holes was subjected to the same evaluation as in Example 1. The results are shown in Table 1.
  • the manufacturing method of the present invention can be suitably used for manufacturing an optical laminate with an adhesive layer that requires a through hole.
  • the optical laminate with an adhesive layer obtained by the manufacturing method of the present invention is suitably used for an image display unit having a through hole represented by an automobile instrument panel, a smart watch, and an image display device having a camera unit. obtain.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé avec lequel il est possible de produire de manière simple et peu coûteuse un corps stratifié optique équipé d'une couche adhésive ayant un trou traversant et pour lequel la perte de colle et le soulèvement d'un séparateur et d'un film de protection de surface ont été supprimés. Selon un mode de réalisation de la présente invention, le procédé de production du corps stratifié optique équipé d'une couche adhésive ayant un trou traversant comprend l'empilement d'une pluralité de corps stratifiés optiques équipés d'une couche adhésive pour former une pièce à travailler et la formation du trou traversant à une position prédéfinie sur la pièce à travailler par découpe à l'aide d'un broyeur d'extrémité. Le corps stratifié optique équipé d'une couche adhésive comprend un film optique, une couche adhésive disposée sur un côté du film optique, un séparateur fixé temporairement à la couche adhésive de manière séparable et un film de protection de surface fixé temporairement à l'autre côté du film optique de manière séparable. La formation du trou traversant consiste à presser le broyeur d'extrémité contre une surface d'extrémité du trou et à couper tout en déplaçant le broyeur d'extrémité dans une direction vers le haut ou vers le bas pour effectuer la coupe.
PCT/JP2020/041297 2020-03-25 2020-11-05 Procédé de production d'un corps stratifié optique équipé d'une couche adhésive ayant un trou traversant WO2021192391A1 (fr)

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CN202080098920.5A CN115315332A (zh) 2020-03-25 2020-11-05 具有贯通孔的带有粘合剂层的光学层叠体的制造方法
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JP7220764B1 (ja) 2021-11-02 2023-02-10 住友化学株式会社 貫通孔付きフィルムの製造方法、及び、円偏光板

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JPH11197928A (ja) * 1998-01-05 1999-07-27 Sony Corp 切削方法及び装置
JP2010076069A (ja) * 2008-09-29 2010-04-08 Precision Hasegawa:Kk 切削加工方法およびその装置
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JP2016515716A (ja) * 2013-03-22 2016-05-30 エシロル アンテルナショナル（コンパーニュ ジェネラル ドプテーク） らせん経路で眼鏡レンズを穿孔する方法及び関連する穿孔装置
WO2016203521A1 (fr) * 2015-06-15 2016-12-22 オーエスジー株式会社 Alésoir
WO2018016285A1 (fr) * 2016-07-22 2018-01-25 日東電工株式会社 Procédé de fabrication de plaque de polarisation et dispositif de fabrication associé
JP6622439B1 (ja) * 2019-03-06 2019-12-18 住友化学株式会社 切削加工された積層フィルムの製造方法

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JPS591512U (ja) * 1982-06-28 1984-01-07 日野自動車株式会社 内径加工装置
JPH11197928A (ja) * 1998-01-05 1999-07-27 Sony Corp 切削方法及び装置
JP2010076069A (ja) * 2008-09-29 2010-04-08 Precision Hasegawa:Kk 切削加工方法およびその装置
DE102010029445A1 (de) * 2010-05-28 2011-12-01 Airbus Operations Gmbh Verfahren zum Herstellen einer Anzahl von Bohrungen
JP2012096339A (ja) * 2010-11-05 2012-05-24 Hitachi Via Mechanics Ltd ワークの加工方法、ワークの加工装置、およびプログラム
JP2016515716A (ja) * 2013-03-22 2016-05-30 エシロル アンテルナショナル（コンパーニュ ジェネラル ドプテーク） らせん経路で眼鏡レンズを穿孔する方法及び関連する穿孔装置
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WO2018016285A1 (fr) * 2016-07-22 2018-01-25 日東電工株式会社 Procédé de fabrication de plaque de polarisation et dispositif de fabrication associé
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