WO2021189936A1

WO2021189936A1 - Lamp panel glue coating method for led display screen

Info

Publication number: WO2021189936A1
Application number: PCT/CN2020/133836
Authority: WO
Inventors: 贺金锋; 康鹏飞
Original assignee: 深圳市洲明科技股份有限公司
Priority date: 2020-03-27
Filing date: 2020-12-04
Publication date: 2021-09-30

Abstract

A lamp panel glue coating method for an LED display screen, and an LED module glue coating process. The lamp panel glue coating method comprises: providing an LED lamp panel and a lampshade jig (S110); mounting the lampshade jig on a plurality of LED lamp beads of the LED lamp panel, so that each lamp bead accommodation recess of the lampshade jig covers the lamp bead portion of each LED lamp bead, and the lamp base portion of each LED lamp bead is maintained outside the lamp bead accommodation recess (S120); placing the lampshade jig and the LED lamp panel which are mounted together in an atomization glue environment for a first predetermined time duration, so that a lamp panel body and the lamp base portion of each LED lamp bead are coated with glue layers (S130); taking out the lampshade jig and the LED lamp panel from the atomization glue environment, and then separating the lampshade jig from the LED lamp panel (S140); and curing the glue layers coated on the lamp panel body and the lamp base portion of each LED lamp bead (S150).

Description

Glue coating method for light board of LED display screen

Technical field

This application relates to the technical field of LED display screens, and in particular to a method for coating the lamp panel of the LED display screen.

Background technique

The lamp boards of the existing LED outdoor display screens mostly adopt DIP (dual in-line package) packaging, and the DIP package needs to be filled with glue to protect IC components and lamp pins. Since there are many parts to be protected, and some parts (such as lamp feet) are higher than the lamp board, in order to fully cover and protect the lamp feet, it is necessary to pour glue with a thickness basically equal to the height of the lamp feet from the highest point of the lamp board. This is easy to cause the following problems: (1) The amount of glue is large, and the lamp module is too heavy; (2) The actual utilization rate of the glue material is low and the cost is high; (3) The curing time is long and the production rhythm is slow; (4) IC heat dissipation Relatively difficult, affecting the stability of electronic components.

Summary of the invention

The main purpose of the present application is to provide a method for coating LED display panels with glue, which aims to solve at least one of the above-mentioned technical problems in the existing methods for glue potting treatment on LED panels.

In order to achieve the above objective, in one aspect, the present application provides a method for coating the lamp panel of an LED display screen, which includes:

Provide an LED light board and a lampshade fixture; wherein the LED light board includes a light board main body and a plurality of LED lamp beads arranged on the side surface of the light board main body, each of the LED lamp beads includes a lamp bead part And a lamp foot part, the lamp foot part is located between the lamp bead part and the lamp panel main body; the lampshade fixture includes a plurality of lamp bead receiving grooves;

The lampshade fixture is installed on the plurality of LED lamp beads, so that each lamp bead accommodating groove covers the lamp bead part of each LED lamp bead, and the lamp of each LED lamp bead The feet are kept on the outside of the lamp bead accommodating groove;

Put the lampshade fixture and the LED lamp board installed together in the atomized glue environment for a first predetermined period of time, so that the main body of the lamp board and the lamp feet of each LED lamp bead are covered Glue layer

Take out the lampshade fixture and the LED lamp board from the atomized glue environment, and then separate the lampshade fixture from the LED lamp board; and,

Curing treatment is performed on the main body of the lamp board and the glue layer covering the lamp leg of each of the LED lamp beads.

Further, the curing treatment includes: standing the LED light board for a second predetermined period of time.

Further, every three of the LED lamp beads are combined to form an LED lamp bead group, and two adjacent LED lamp bead groups are separated by a predetermined distance.

Further, the three LED lamp beads of the LED lamp bead group are respectively a red LED lamp bead, a green LED lamp bead, and a blue LED lamp bead.

Further, the three LED lamp beads of the LED lamp bead group are arranged in a triangle or a linear shape.

Further, the lampshade fixture includes a plurality of lampshade bodies, and each of the lampshade bodies includes three lamp bead accommodating grooves corresponding to the three lamp bead parts of a set of the LED lamp bead group.

Further, the lampshade fixture further includes a lampshade back frame, and the plurality of lampshade bodies are respectively fixed on the lampshade back frame.

Further, the lampshade fixture includes a plurality of lampshade bodies, and each of the lampshade bodies includes the lamp bead accommodating groove corresponding to the lamp bead portion of each LED lamp bead.

Further, there is a clearance fit between the lamp bead accommodating groove and the corresponding lamp bead part.

Further, the depth of the lamp bead accommodating groove is smaller than the extension length of the lamp bead portion of the corresponding LED lamp bead.

Further, the difference between the extension length of the lamp bead portion of the LED lamp bead and the groove depth of the corresponding lamp bead accommodating groove is smaller than that of the light-emitting chip in the lamp bead portion of the LED lamp bead to the corresponding LED lamp The distance between the lamp feet of the beads.

Further, the glue in the atomized glue environment is silicone rubber glue.

In the method for coating the lamp panel of the LED display screen provided by the present application, when the lamp panel coating operation is performed, the lamp bead part of each LED lamp bead of the LED lamp panel is first covered by a lampshade jig, and each LED is exposed The lamp foot of the lamp bead. Then, the lampshade fixture and the LED lamp board are placed in an atomized glue environment, so that the main body of the lamp board and the lamp feet of each LED lamp bead are covered with a uniform glue layer. Finally, after the lamp cover fixture detaching operation is performed on the LED lamp panel covered with the glue layer, the LED lamp panel is cured so that the glue layer is completely cured, thereby completing the entire lamp panel gluing operation. In this way, the entire lamp surface can be evenly protected with a small amount of glue, which significantly reduces the weight of the outdoor LED lamp module and greatly reduces the consumption of glue.

In another aspect, the present application provides an LED module coating process, including:

Carry out the first glue coating on part of the area of the lamp pin of the plug-in lamp;

After the first glued glue is cured to form a first glue layer, mount and fix the area of the lamp pin of the plug-in lamp that is not covered by the first glue layer on the surface of the PCB board;

A second glue coating is performed on the surface of the PCB board where the plug-in lamp is installed.

Further, the second glue layer is cured to form a second glue layer, and the second glue layer covers the connection area between the lamp pin and the PCB board.

Further, the plug-in lamp includes a lamp bead and a lamp pin, the lamp pin extends from the lamp bead, and the lamp pin has a catch point spaced apart from the lamp bead; The glue range includes the area of the lamp pin between the lamp bead and the card point.

Further, the coating range of the first coating includes the stuck points.

Further, the first glue coating is completed by a glue dispensing machine or a glue spraying machine.

Further, the second coating is completed by spraying, spraying or pouring.

Further, the viscosity of the glue for the first coating is greater than 2000 cps, and/or the viscosity of the glue for the second coating is greater than 2000 cps.

In another aspect, the present application also provides an LED module, including a plug-in lamp and a PCB board, the plug-in lamp includes a lamp pin, wherein the LED module is coated with the above-mentioned LED module coating process.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.

Fig. 1 is a flow chart of a method for coating a light board of an LED display screen according to an embodiment of the present application.

Fig. 2 is a schematic diagram of the structure of the LED light board in the light board gluing method shown in Fig. 1.

Fig. 3 is a schematic diagram of the structure of the LED light board shown in Fig. 2 after covering the lampshade fixture.

Fig. 4 is a schematic cross-sectional view of the LED light board shown in Fig. 3 along the A-A section line.

FIG. 5 is an enlarged schematic diagram of the partial I of the LED light board shown in FIG. 4.

FIG. 6 is a schematic diagram of the structure of the LED light board shown in FIG. 5 after being coated with glue.

FIG. 7 is a flow chart of an LED module coating process provided according to another embodiment of the present application.

FIG. 8 is an enlarged schematic cross-sectional view of the first glue coating range of the plug-in lamp in the glue coating process of the LED module shown in FIG. 7.

9 is an enlarged schematic cross-sectional view of the second glue coating range of the plug-in lamp in the glue coating process of the LED module shown in FIG. 7.

FIG. 10 is a schematic diagram of the structure of an LED module after being coated according to the LED module coating process shown in FIG. 7.

Fig. 11 is a schematic diagram of the structure cut along E-E in Fig. 10.

Fig. 12 is a partial enlarged view of B in Fig. 11.

Detailed ways

The specific implementation of the present application will be further described below in conjunction with the accompanying drawings. It should be noted here that the description of these implementation manners is used to help understand the application, but does not constitute a limitation to the application. In addition, the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

As shown in FIG. 1, an embodiment of the present application provides a method for coating a lamp panel of an LED display screen. The method for coating a lamp panel specifically includes the following steps:

Step S110: Provide an LED light board and a lamp shade fixture. The LED light board includes a light board main body and a plurality of LED lamp beads arranged on one side surface of the light board main body. Each LED lamp bead includes a lamp bead part and a lamp foot part, the lamp bead part is away from the main body of the lamp board, and the lamp foot part is located between the lamp bead part and the main body of the lamp board. The lampshade jig includes a plurality of lamp bead accommodating grooves.

In some embodiments, as shown in FIG. 2, the LED light board 100 includes a light board main body 110 and a plurality of LED lamp beads 121 laid on one side surface of the light board main body 110, and every three LED lamp beads 121 are combined to form one The LED lamp bead group 120 has a predetermined distance between adjacent LED lamp bead groups 120. The three LED lamp beads 121 of the LED lamp bead group 120 may be red LED lamp beads, green LED lamp beads, and blue LED lamp beads, respectively. In this embodiment, the three LED lamp beads of the LED lamp bead group 120 are arranged in a triangle, for example, so that the three LED lamp beads of the LED lamp bead group 120 are arranged more compactly. It is understandable that the three LED lamp beads of the LED lamp bead group 120 can also be arranged in a straight line.

Step S120: Install the lampshade fixture on the plurality of LED lamp beads, so that each lamp bead receiving groove covers the lamp bead part of each LED lamp bead, and keep the lamp foot part of each LED lamp bead in the lamp bead capacity The outside of the slot.

As shown in FIGS. 3, 4 and 5, in some embodiments, the lampshade fixture 200 includes a plurality of lampshade bodies 210, and each lampshade body 210 corresponds to an LED lamp bead group 120. Each lampshade body 210 is provided with three lamp bead accommodating grooves 211, which are arranged on the lamp bead portions 1211 of the three LED lamp beads 121 of the corresponding LED lamp bead group 120 in a one-to-one correspondence. There is a clearance fit between each lamp bead accommodating groove 211 and the corresponding lamp bead part 1211. In addition, the lampshade fixture 200 also includes a lampshade back frame 220. Several lampshade bodies 210 can be connected with at least one lampshade back frame 220. In this way, several lampshade bodies 210 can be connected into a whole through the lampshade back frame 220 to facilitate the overall picking and placing.

Step S130: Place the installed lampshade fixture and the LED lamp board in an atomized glue environment for a first predetermined period of time, so that the main body of the lamp board and the lamp feet of each LED lamp bead are covered with uniform glue Floor.

In some embodiments, as shown in FIGS. 1 to 6, the entire LED light board 100 covering the lampshade fixture 200 is placed in an atomized glue environment, so that the light board main body 110 and each LED lamp bead The lamp feet 1212 of 121 are covered with a uniform layer of glue 30. The atomized glue environment can be a confined space, and a spray head is set above the sealed space to spray the atomized glue throughout the confined space. The glue is preferably silicone rubber, and its weather resistance or flame retardancy can better meet the protection requirements of the lamp board main body 110 and the lamp foot 1212 of each LED lamp bead 121. Since the lamp bead portion 1211 of each LED lamp bead 121 is covered and shielded by the corresponding lamp bead accommodating groove 211, the entire LED lamp board 100, except for the lamp bead portion 1211 of each LED lamp bead 121, the lamp board The main body 110 and the lamp base 1212 of each LED lamp bead 121 are covered with a uniform layer of glue 30.

Step S140: Take out the lampshade fixture and the LED light board covered with glue from the atomized glue environment, and then remove the lampshade fixture from the lamp bead part.

In some embodiments, as shown in FIGS. 1 to 6, when the LED light board 100 is covered with glue 30 in the atomized glue environment, the LED light board 100 covered with the glue 30 can be removed from the atomization Take it out of the glue environment, and remove the lampshade fixture 200 from the lamp bead part.

Step S150: curing the glue layer covering the main body of the lamp board and the lamp leg of each LED lamp bead.

For example, the LED light board 100 is allowed to stand for a second preset period of time, so that the glue layer 30 is completely cured, and the light board gluing operation of the LED light board 100 can be completed. For example, the LEC lamp panel 100 can be allowed to stand for a period of time at room temperature to realize the curing of the water-added layer 30.

In some embodiments, the depth of the lamp bead accommodating groove 211 is smaller than the extension length of the lamp bead portion 1211 of the corresponding LED lamp bead 121. In this way, when the lamp bead part 1211 of each LED lamp bead 121 is covered by the lampshade jig 120, the lamp foot part 1212 of each LED lamp bead 121 can be ensured to be exposed, and a certain transition area is reserved.

In some embodiments, the difference between the extension length of the lamp bead portion 1211 of the LED lamp bead 121 and the groove depth of the corresponding lamp bead accommodating groove 211 is smaller than that of the light-emitting chip 1213 in the lamp bead portion 1211 of the LED lamp bead 121 to the corresponding The distance of the foot 1212 of the LED lamp bead 121 is to ensure that the reserved transition area is much lower than the light-emitting surface. In this way, the glue can completely cover the upper end of the lamp foot part 1212, and at the same time, it will not affect the light-emitting and display effect of the lamp bead.

In the method for coating the lamp panel of the LED display screen provided by the embodiment of the present application, when the lamp panel coating operation is performed, the lamp bead part of each LED lamp bead of the LED lamp panel is first covered by a lampshade jig, and each LED lamp bead is exposed. The foot of the LED lamp bead. Then, the entire LED lamp board covering the lampshade fixture is placed in an atomized glue environment, so that the main body of the lamp board and the lamp leg of each LED lamp bead are covered with a uniform layer of glue. Then, take out the glue-covered LED light board from the atomized glue environment, then remove the lampshade fixture from the lamp beads, and leave the LED light board for a preset time, so that the glue is completely cured, and finally the entire light board gluing is completed operate. In this way, only a small amount of glue can evenly protect the entire lamp surface, significantly reduce the weight of the outdoor LED lamp module, and also help reduce the consumption of glue.

As shown in FIG. 7, an embodiment of the present application provides an LED module coating process, and the coating process includes the following steps:

In step S210, a first glue coating is performed on a partial area of the lamp pin 12 of the plug-in lamp.

Figure 8 shows the structure of a plug-in lamp. The plug-in lamp includes a lamp bead 11, a lamp pin 12, and a catch point 13. The lamp pin 12 extends outward from the lamp bead 11, and the catch point 13 is on the lamp pin 12 and is connected to the lamp. The beads 12 are spaced apart. The lamp pin 12 of the plug-in lamp can be first coated with existing equipment, such as a glue dispenser or a glue sprayer. The first adhesive layer 14 is covered.

In some embodiments, the viscosity of the glue used for the first gluing of the lamp pin 12 is greater than 2000 cps (Centipoise, a viscosity unit, commonly used for fluid viscosity, and the unit is mPa·sec). Using glue with a higher relative viscosity can better ensure the covering effect and protective effect of the first glue layer 14 at the lamp base 12.

The coating range for the first coating of the lamp pin 12 includes at least the area of the lamp pin 12 between the clamping point 13 and the lamp bead 11. Since the card point 13 itself is very small, in some embodiments, the area of the pin 12 between the card point 13 and the lamp bead 11 is completely covered by the first adhesive layer 14 as the first adhesive coating range A limit case of the pin 12 between the card point 13 and the lamp bead 11 and the card point 13 itself are completely covered by the first adhesive layer 14 as another limit case of the first adhesive coating range. That is, the coating range for the first coating of the lamp pin 12 may include the stuck points 13 of the lamp pin 12, so that sufficient error redundancy is left for this step and the development difficulty of the process is reduced. The two extreme cases of the coating range for the first coating of the lamp pin 12 are shown in FIG. 8 and FIG. 9. It can be understood that the coating range for the first coating of the lamp pin 12 generally does not include the area of the pin 12 that is away from the lamp bead 11 from the card point 13, that is, the first adhesive layer 14 generally does not cover the slave card of the pin 12 Point 13 away from the area of the lamp bead 11.

In step S220, after the first glued glue is cured to form the first glue layer 14, the lamp pins 12 of the plug-in lamp are installed and fixed on the surface of the PCB board 2.

In some embodiments, multiple plug-in lights can be installed on one PCB board 2. When the lamp pins 12 of all the plug-in lights have completed the first gluing and the glue of the first gluing is all fixed, all the plug-in lights can be installed and soldered on the PCB board 2 according to the existing process. At this time, Figure 8 As shown in FIG. 9, the part of the lamp pin 12 above the card point 13 is fully covered by glue, and the part of the lamp pin 12 below the card point 13 is welded to the PCB board 2.

Step S230: Perform a second glue coating on the surface of the PCB board 2 where the plug-in lamp is installed.

In some embodiments, the second glue layer 25 (see FIG. 12) is formed after the glue of the second glue is cured. The second glue layer 25 can completely cover the connection area between the lamp pin 12 and the PCB board 2 (for example, the lamp pin 12). The welding point with the PCB board 2), so that the lamp pin 12 of the plug-in lamp is completely covered by the glue layer.

In some embodiments, after the installation of all the plug-in lights is completed in step S220, at least the surface of the PCB board 2 where the plug-in lights are installed is covered with glue. The covering process includes but is not limited to being completed by spraying, spraying or pouring. . In some embodiments, the viscosity of the glue used to coat the surface of the PCB board 2 is greater than 2000 cps (Centipoise, a viscosity unit, commonly used for fluid viscosity, and the unit is mPa·s). The use of relatively high viscosity glue can better ensure the coating effect and protective effect.

The above-mentioned gluing process, as shown in FIG. 10, FIG. 11, and FIG. 12, has completed the gluing of the lamp pin 12 in step S210, and the area C in FIG. 12 has the effect of gluing in step S210. The effective protection of the lamp pin 12 is realized. Therefore, a thick glue layer is not required when the surface of the PCB board 2 is coated with the second glue in step S230. In the area D in FIG. 12, the glue coating effect is completed in step S230. Therefore, only a much thinner glue layer than the glue layer produced by the existing process is needed to complete the full coverage of the entire PCB board 2 and the lamp feet 12, and realize a small amount of glue to protect the entire surface of the PCB board 2 and the lamp feet of the plug-in lamp. The goal of 12 is to greatly reduce the consumption of glue and significantly reduce the weight of the LED module.

An embodiment of the present application also discloses an LED module. As shown in FIGS. 8-12, the LED module may include a bottom shell 3, a PCB board 2 mounted on the bottom shell 3, and a PCB board 2 mounted and fixed on the PCB board 2. The plug-in lamp includes lamp beads 11, lamp pins 12 and pin points 13, and the LED module adopts the above-mentioned gluing process for gluing.

The embodiments of the present application have been described in detail above with reference to the accompanying drawings, but the present application is not limited to the described embodiments. For those skilled in the art, without departing from the principle and spirit of the present application, various changes, modifications, substitutions and modifications to these implementation manners still fall within the protection scope of the present application.

Claims

A method for gluing the light board of an LED display screen, including:

Provide an LED light board and a lampshade fixture; wherein the LED light board includes a light board main body and a plurality of LED lamp beads arranged on the side surface of the light board main body, each of the LED lamp beads includes a lamp bead part And a lamp foot part, the lamp foot part is located between the lamp bead part and the lamp panel main body; the lampshade fixture includes a plurality of lamp bead receiving grooves;

The lampshade fixture is installed on the plurality of LED lamp beads, so that each lamp bead accommodating groove covers the lamp bead part of each LED lamp bead, and the lamp of each LED lamp bead The feet are kept on the outside of the lamp bead accommodating groove;

Put the lampshade fixture and the LED lamp board installed together in the atomized glue environment for a first predetermined period of time, so that the main body of the lamp board and the lamp feet of each LED lamp bead are covered Glue layer

Take out the lampshade fixture and the LED lamp board from the atomized glue environment, and then separate the lampshade fixture from the LED lamp board; and,

Curing treatment is performed on the main body of the lamp board and the glue layer covering the lamp leg of each of the LED lamp beads.
The method for coating a lamp panel according to claim 1, wherein the curing process comprises: standing the LED lamp panel for a second predetermined period of time.
The method for coating a lamp panel according to claim 1, wherein every three of the LED lamp beads are combined to form an LED lamp bead group, and two adjacent LED lamp bead groups are separated by a predetermined distance.
The method for coating a lamp board according to claim 3, wherein the three LED lamp beads of the LED lamp bead group are respectively a red LED lamp bead, a green LED lamp bead, and a blue LED lamp bead.
The method for coating a lamp panel according to claim 3, wherein the three LED lamp beads of the LED lamp bead group are arranged in a triangle or a linear shape.
The lamp panel gluing method according to claim 3, wherein the lampshade fixture includes a plurality of lampshade bodies, and each of the lampshade bodies includes a set corresponding to the three lamp bead parts of the LED lamp bead group. Three said lamp bead accommodating grooves.
7. The lamp panel gluing method according to claim 6, wherein the lampshade fixture further comprises a lampshade back frame, and the plurality of lampshade bodies are respectively fixed on the lampshade back frame.
The lamp panel gluing method according to claim 1, wherein the lampshade fixture includes a plurality of lampshade bodies, and each of the lampshade bodies includes the lamp corresponding to the lamp bead part of each of the LED lamp beads. Bead containing groove.
8. The lamp panel gluing method according to claim 8, wherein the lampshade fixture further comprises a lampshade back frame, and the plurality of lampshade bodies are respectively fixed on the lampshade back frame.
The method for coating a lamp panel according to claim 1, wherein the lamp bead containing groove and the corresponding lamp bead part are in a clearance fit.
The method for coating a lamp panel according to claim 1, wherein the depth of the lamp bead accommodating groove is smaller than the extension length of the lamp bead portion of the corresponding LED lamp bead.
The lamp board gluing method according to claim 11, wherein the difference between the extension length of the lamp bead portion of the LED lamp bead and the corresponding groove depth of the lamp bead accommodating groove is smaller than that of the lamp of the LED lamp bead The distance from the light-emitting chip in the bead part to the lamp foot part of the corresponding LED lamp bead.
The lamp board glue coating method according to any one of claims 1, wherein the glue in the atomized glue environment is silicone rubber glue.
An LED module coating process, including:

Carry out the first glue coating on a part of the lamp pin of the plug-in lamp;

After the first glued glue is cured to form a first glue layer, the lamp pins of the plug-in lamp are installed and fixed on the surface of the PCB board;

A second glue coating is performed on the surface of the PCB board where the plug-in lamp is installed.
The LED module gluing process according to claim 14, wherein the second glue layer is cured to form a second glue layer, and the second glue layer covers the connection between the lamp pin and the PCB board area.
The LED module coating process according to claim 14, wherein the plug-in lamp comprises a lamp bead and a lamp pin, the lamp pin extends from the lamp bead, and the lamp pin is spaced apart from the lamp bead. The open card point; the coating range of the first coating includes the area of the lamp pin between the lamp bead and the card point.
The LED module coating process according to claim 16, wherein the coating range of the first coating includes the stuck points.
The LED module coating process according to claim 14, wherein the first coating is completed by a glue dispenser or a glue spray machine.
The LED module coating process according to claim 14, wherein the second coating is completed by spraying, spraying or pouring.
The LED module coating process according to claim 14, wherein the viscosity of the glue for the first coating is greater than 2000 cps, and/or the viscosity of the glue for the second coating is greater than 2000 cps.
An LED module includes a plug-in lamp and a PCB board. The plug-in lamp includes lamp pins, wherein the LED module adopts the LED module gluing process of any one of claims 14-20 for gluing.