CN111261062A - LED module glue coating process and LED module - Google Patents
LED module glue coating process and LED module Download PDFInfo
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- CN111261062A CN111261062A CN202010230928.4A CN202010230928A CN111261062A CN 111261062 A CN111261062 A CN 111261062A CN 202010230928 A CN202010230928 A CN 202010230928A CN 111261062 A CN111261062 A CN 111261062A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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Abstract
The invention discloses an LED module and a glue coating process thereof, and belongs to the technical field of LED display screens. The glue coating process comprises the following steps: coating glue on lamp pins of the plug-in lamp; after the glue is solidified, mounting and fixing the plug-in lamp on the PCB; coating glue on the surface of the PCB; the LED module comprises a plug-in lamp and a PCB, wherein the plug-in lamp comprises a lamp pin, and the LED module is coated with glue by adopting the LED module coating process. According to the glue coating process, since the glue coating of the lamp pins is completed firstly, the effective protection of the lamp pins is realized, so that the whole PCB and the lamp pins can be completely covered without a thick glue layer when the surface of the PCB is subsequently coated with glue, only a plurality of thinner glue layers are needed compared with the glue layers generated by the prior art, the aim of protecting the whole lamp surface and the lamp pins of the plug-in lamp by a small amount of glue is realized, the glue consumption is greatly reduced, and the weight of the LED module is remarkably reduced.
Description
Technical Field
The invention relates to the technical field of LED display screens, in particular to an LED module glue coating process and an LED module.
Background
The existing LED display screen is especially used for an outdoor LED display screen, the lamp panel of the LED display screen needs to be subjected to glue filling and sealing treatment so as to protect an IC element and a lamp base, the positions needing to be protected are many, the part of the lamp panel is higher than the lamp base, for fully covering and protecting the lamp base, glue which is equal to the same thickness as the highest position of the lamp panel needs to be filled, the glue filling amount is large, the actual utilization rate of glue filling materials is low, the cost is high, and meanwhile, the LED module is overweight.
Disclosure of Invention
The invention aims to provide an LED module glue coating process and an LED module, and solves the technical problems that the actual utilization rate of glue filling materials is low and the cost is high due to large glue filling amount in the existing glue filling process, and the LED module is overweight.
The technical purpose of the invention is realized by the following technical scheme:
according to one aspect of the invention, the invention provides an LED module glue coating process, which comprises the following steps:
coating glue on lamp pins of the plug-in lamp;
after the glue is solidified, mounting and fixing the plug-in lamp on the PCB;
and coating glue on the surface of the PCB.
As a further optimization, the viscosity of the glue for gluing the lamp pins of the plug-in lamp is more than 2000 cps.
Preferably, the range of the glue coating of the lamp pins of the plug-in lamp is the part of the lamp pins above the clamping point.
As a further optimization, the range for coating the lamp pins of the plug-in lamp comprises a clamping point.
As a further optimization, the gluing of the lamp pins of the plug-in lamp is completed by a glue dispenser or a glue sprayer.
As a further optimization, the coating of the surface of the PCB is performed by spraying, brushing or pouring.
As a further optimization, the viscosity of the glue for coating the surface of the PCB is greater than 2000 cps.
According to another aspect of the invention, an LED module is provided, which includes a plug-in lamp and a PCB board, wherein the plug-in lamp includes a lamp pin, and the LED module is coated with the aforementioned LED module coating process.
In conclusion, the invention has the following beneficial effects: according to the glue coating process, since the glue coating of the lamp pins is completed firstly, the effective protection of the lamp pins is realized, so that the whole PCB and the lamp pins can be completely covered without a thick glue layer when the surface of the PCB is subsequently coated with glue, only a plurality of thinner glue layers are needed compared with the glue layers generated by the prior art, the aim of protecting the whole lamp surface and the lamp pins of the plug-in lamp by a small amount of glue is realized, the glue consumption is greatly reduced, and the weight of the LED module is remarkably reduced.
Drawings
FIG. 1 is a schematic flow chart of an exemplary LED module glue coating process;
FIG. 2 is a schematic sectional view showing an enlarged structure of an insert lamp in a case where the foot coating of the embodiment is applied to one side of the adhesive range;
FIG. 3 is a schematic sectional view showing an enlarged structure of an insert lamp in another case of the foot coating range of the embodiment;
FIG. 4 is a schematic structural diagram of the LED module after the glue coating process is completed in the embodiment;
FIG. 5 is a schematic view of the structure taken along line A-A in FIG. 4;
fig. 6 is a partially enlarged view at B in fig. 5.
In the figure: 11. a lamp bead; 12. a lamp foot; 13. sticking points; 14. a glue layer; 2. a PCB board; 3. a bottom shell.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment discloses an LED module glue coating process, as shown in FIG. 1, the glue coating process comprises the following steps:
step S1, the lamp pins 12 of the plug-in lamp are coated with glue.
Specifically, as shown in fig. 2, the plug-in lamp includes a lamp bead 11, a lamp pin 12 and a clamping point 13, and the lamp pin 12 of the plug-in lamp can be coated with glue by using existing equipment such as a dispenser or a glue sprayer, so that the lamp pin 12 is coated with a glue layer 14. As an optimization, the viscosity of the glue for coating the lamp base 12 is greater than 2000cps (centripoise, a viscosity unit commonly used for fluid viscosity, unit is mpa · s), and the coating effect and the protection effect of the glue layer 14 at the lamp base 12 cannot be better ensured by adopting the glue with higher relative viscosity. The range of the coating of the lamp pins 12 is the portion of the lamp pins 12 above the clip points 13. As an optimization, since the clamp point 13 itself is very small, the clamp point 13 can be completely covered as a limit of a glue coating range below the lamp pin 12, that is, the glue coating range of the lamp pin 12 includes the clamp point 13, sufficient error redundancy is left for this step, the difficulty of process development is reduced, and upper and lower limits below the glue coating range at the lamp pin 12 are shown in fig. 2 and fig. 3.
And step S2, after the glue is cured, installing and fixing the plug-in lamp on the PCB 2.
Specifically, after the lamp pins 12 of all the plug-in lamps are coated with glue and the glue is completely fixed, all the plug-in lamps are installed and welded on the PCB 2 according to the existing flow, and at the moment, the glue full coverage of the lamp pins 12 above the clamping points 13 is realized.
And step S3, coating glue on the surface of the PCB 2.
Specifically, after the mounting of all the package lamps is completed in step S2, the surface of the PCB 2 is coated with glue, and the coating process includes, but is not limited to, spraying, brushing, or pouring. As an optimization, the viscosity of the glue for coating the surface of the PCB 2 is greater than 2000cps (centripoise, a viscosity unit commonly used for fluid viscosity, and a unit is mpa · s), and the coating effect and the protection effect can be better ensured by using the glue with relatively higher viscosity.
In the glue coating process in this embodiment, as shown in fig. 4, 5, and 6, since the glue coating of the lamp pins 12 is completed in step S1, and the region C in fig. 6 completes the glue coating effect in step S1, so as to achieve effective protection of the lamp pins 12, a thick glue layer is not needed when the surface of the PCB 2 is coated in step S3, and the region D in fig. 6 completes the glue coating effect in step S3, only a much thinner glue layer than that generated in the conventional process is needed, so as to complete the full coverage of the entire PCB 2 and the lamp pins 12, thereby achieving the purpose of protecting the entire lamp surface and the lamp pins 12 of the plug-in lamp with a small amount of glue, greatly reducing the glue consumption, and significantly reducing the weight of the LED module.
The embodiment also discloses an LED module, which is shown in fig. 2-6, and comprises a bottom shell 3, a PCB (printed circuit board) 2 installed on the bottom shell 3 and a plurality of plug-in lamps installed and fixed on the PCB 2, wherein the plug-in lamps comprise lamp beads 11, lamp feet 12 and clamping points 13, and the LED module is coated with glue by adopting the glue coating process.
The above specific embodiments are merely illustrative of the present invention, and are not restrictive, and those skilled in the art can modify the above embodiments without inventive contribution as required after reading the present specification, but only protected by the patent laws within the scope of the claims of the present invention.
Claims (8)
1. The LED module glue coating process is characterized in that: the method comprises the following steps:
coating glue on lamp pins of the plug-in lamp;
after the glue is solidified, mounting and fixing the plug-in lamp on the PCB;
and coating glue on the surface of the PCB.
2. The LED module glue coating process according to claim 1, characterized in that: the viscosity of the glue for coating the lamp pins of the plug-in lamp is more than 2000 cps.
3. The LED module glue coating process according to claim 1, characterized in that: the range of coating the lamp pins of the plug-in lamp is the part of the lamp pins above the clamping points.
4. The LED module glue coating process according to claim 3, characterized in that: the range for coating the lamp pins of the plug-in lamp comprises a clamping point.
5. The LED module glue coating process according to claim 1, characterized in that: and the lamp pins of the plug-in lamp are coated with glue by a glue dispenser or a glue sprayer.
6. The LED module glue coating process according to claim 1, characterized in that: and coating the surface of the PCB with glue by spraying, spraying or pouring.
7. The LED module glue coating process according to claim 1, characterized in that: the viscosity of the glue for coating the surface of the PCB is more than 2000 cps.
8. The utility model provides a LED module, includes plug-in components lamp and PCB board, the plug-in components lamp includes the lamp base, its characterized in that: the LED module is coated by the LED module coating process of any one of claims 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010230928.4A CN111261062A (en) | 2020-03-27 | 2020-03-27 | LED module glue coating process and LED module |
| PCT/CN2020/133836 WO2021189936A1 (en) | 2020-03-27 | 2020-12-04 | Lamp panel glue coating method for led display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010230928.4A CN111261062A (en) | 2020-03-27 | 2020-03-27 | LED module glue coating process and LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111261062A true CN111261062A (en) | 2020-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010230928.4A Pending CN111261062A (en) | 2020-03-27 | 2020-03-27 | LED module glue coating process and LED module |
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| Country | Link |
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| CN (1) | CN111261062A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112102736A (en) * | 2020-09-08 | 2020-12-18 | 深圳市洲明科技股份有限公司 | Lamp panel glue coating method of LED display screen |
| CN113393777A (en) * | 2021-05-07 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Display screen module and glue filling process thereof |
| WO2021189936A1 (en) * | 2020-03-27 | 2021-09-30 | 深圳市洲明科技股份有限公司 | Lamp panel glue coating method for led display screen |
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| CN201868044U (en) * | 2010-10-27 | 2011-06-15 | 深圳市洲明科技股份有限公司 | Outdoor LED (Light-Emitting Diode) display module |
| CN202796942U (en) * | 2012-08-17 | 2013-03-13 | 木林森股份有限公司 | Insertion type patch-applicable full-color LED lamp bead |
| CN203963884U (en) * | 2014-07-09 | 2014-11-26 | 徐培鑫 | A kind of LED module with rubber filling type watertight composition |
| CN206225410U (en) * | 2016-12-15 | 2017-06-06 | 东莞市莱曼光电科技有限公司 | High temperature reliability LED high |
| CN209328451U (en) * | 2019-01-31 | 2019-08-30 | 余金才 | A kind of plug-in LED advertising lamp |
-
2020
- 2020-03-27 CN CN202010230928.4A patent/CN111261062A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201868044U (en) * | 2010-10-27 | 2011-06-15 | 深圳市洲明科技股份有限公司 | Outdoor LED (Light-Emitting Diode) display module |
| CN202796942U (en) * | 2012-08-17 | 2013-03-13 | 木林森股份有限公司 | Insertion type patch-applicable full-color LED lamp bead |
| CN203963884U (en) * | 2014-07-09 | 2014-11-26 | 徐培鑫 | A kind of LED module with rubber filling type watertight composition |
| CN206225410U (en) * | 2016-12-15 | 2017-06-06 | 东莞市莱曼光电科技有限公司 | High temperature reliability LED high |
| CN209328451U (en) * | 2019-01-31 | 2019-08-30 | 余金才 | A kind of plug-in LED advertising lamp |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021189936A1 (en) * | 2020-03-27 | 2021-09-30 | 深圳市洲明科技股份有限公司 | Lamp panel glue coating method for led display screen |
| CN112102736A (en) * | 2020-09-08 | 2020-12-18 | 深圳市洲明科技股份有限公司 | Lamp panel glue coating method of LED display screen |
| CN112102736B (en) * | 2020-09-08 | 2022-03-01 | 深圳市洲明科技股份有限公司 | Lamp panel glue coating method of LED display screen |
| CN113393777A (en) * | 2021-05-07 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Display screen module and glue filling process thereof |
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