WO2021187521A1 - Cover tape for packaging electronic component and package - Google Patents

Abstract

Provided is a cover tape for packaging electronic components that has: a base material layer; a heat seal layer disposed on one surface side of the base material layer and being sealed by a carrier tape having a plurality of housing sections that house electronic components; and an antistatic layer disposed on the opposite side of the base material layer to the surface on the heat seal layer side. The cover tape is characterized by: the surface resistance of the surface on the side that the antistatic layer is disposed being no more than 1.0 × 10¹⁰ Ω/□, after a moisture heat load of 100 hours of storage in a humid environment having 95% RH at 40°C; the strength of seal with the carrier tape prior to said moisture heat load being no more than 0.7 N; and the strength of the seal with the carrier tape after said moisture heat load being at least 0.1 N.

Description

Cover tape and packaging for electronic component packaging

This disclosure relates to a cover tape for packaging electronic components and a packaging body using the same.

In recent years, electronic components such as ICs, resistors, transistors, diodes, capacitors, and piezoelectric element registers have been taped and packaged for surface mounting. In taping packaging, after storing electronic parts in a carrier tape having a plurality of storage portions for storing electronic parts, the carrier tape is heat-sealed with a cover tape to obtain a package for storing and transporting the electronic parts. When mounting electronic components, the cover tape is peeled off from the carrier tape, and the electronic components are automatically taken out and surface-mounted on the substrate. The cover tape is also called a top tape.

In taping packaging, static electricity may be generated by peeling the cover tape from the carrier tape during mounting. This phenomenon is called peeling charge, and due to peeling charge, electronic parts may adhere to the cover tape during mounting and the electronic parts may not be taken out normally, or the electronic parts may pop out from the carrier tape storage part. be. This leads to a decrease in mounting efficiency. Furthermore, static electricity may cause deterioration and destruction of electronic components. Therefore, in order to suppress the generation of static electricity, various cover tapes having antistatic properties have been proposed (see, for example, Patent Documents 1 and 2).

Further, Patent Document 3 proposes a cover tape in which the sealing strength when peeling the cover tape from the carrier tape is within a specific range.

WO2016 / 143600 Japanese Unexamined Patent Publication No. 2015-140200 Japanese Unexamined Patent Publication No. 2005-096852

However, the present inventors have maintained good sealing strength (peeling strength) in the taping package obtained by heat-sealing the carrier tape with a conventional cover tape during storage and transportation under a normal environment. Despite this, if the product is stored in a moist heat environment, the seal strength will decrease due to the moist heat load, and the cover tape will be unintentionally peeled off before the cover tape is peeled off by the peeling device when mounting electronic components. It was found that there is a problem that electronic parts, which are objects, fall off. It was also found that the antistatic property deteriorates due to the moist heat load, which causes mounting defects during mounting.

The present disclosure has been made in view of the above problems, and is for packaging electronic components capable of suppressing unintentional peeling of the cover tape and improving mounting efficiency at the time of mounting even when a moist heat load is applied. It is intended to provide a cover tape.

One embodiment of the present disclosure comprises a base material layer, a heat seal layer arranged on one surface side of the base material layer and sealed by a carrier tape having a plurality of storage portions for storing electronic components, and the base. It has an antistatic layer arranged on the surface opposite to the surface of the material layer on the heat seal layer side, and is charged after being stored for 100 hours in a moist heat environment of 40 ° C. and 95% RH. The surface resistivity of the surface on the side where the prevention layer is arranged is 1.0 × 10 ¹⁰ Ω / □ or less, and the seal with the carrier tape having a plurality of storage portions for storing electronic components before the above-mentioned moist heat load. Provided is a cover tape for packaging electronic components, which has a strength of 0.7 N or less and a sealing strength with the carrier tape of 0.1 N or more after the moist heat load.

In one embodiment of the present disclosure, a carrier tape having a plurality of storage portions for storing electronic components, electronic components stored in the storage portions, and the electronic component packaging described above arranged so as to cover the storage portions. Provided is a packaging body comprising a cover tape for use.

The electronic component packaging cover tape of the present disclosure can suppress unintentional peeling of the cover tape even when stored and transported in a moist heat environment, and can improve the mounting efficiency at the time of mounting. It becomes a tape.

It is the schematic cross-sectional view which illustrates the cover tape for electronic component packaging of this disclosure. It is a schematic plan view and a cross-sectional view which exemplify the package body of this disclosure. It is the schematic cross-sectional view which illustrates the cover tape for electronic component packaging of this disclosure.

An embodiment of the present disclosure will be described below with reference to drawings and the like. However, the present disclosure can be implemented in many different embodiments and is not construed as limited to the description of the embodiments illustrated below. Further, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual form, but this is merely an example and the interpretation of the present disclosure is limited. It's not something to do. Further, in the present specification and each figure, the same elements as those described above with respect to the above-mentioned figures may be designated by the same reference numerals, and detailed description thereof may be omitted as appropriate.

In the present specification, when expressing the mode of arranging another member on one member, when it is simply described as "above" or "below", it is in contact with a certain member unless otherwise specified. Including the case where another member is arranged directly above or directly below, and the case where another member is arranged above or below a certain member via another member. Further, in the present specification, when expressing the mode of arranging another member on the surface of a certain member, when simply expressing "on the surface side" or "on the surface", unless otherwise specified, the certain member is used. It includes both the case where another member is arranged directly above or directly below the member so as to be in contact with each other, and the case where another member is arranged above or below one member via another member.

Electronic components are packed as the above-mentioned packaging at the electronic component manufacturing factory. Ideally, the packaging should be stored and transported in a well-controlled room temperature and humidity environment so as not to be in a high humidity environment. However, in reality, it is difficult to adequately control all environments such as warehouses, the inside of transportation facilities and containers, and factories that use electronic components, and it is difficult to store them in relatively hot and humid areas and seasons. When transported, the packaging may be exposed to a relatively high temperature and high humidity environment.

Carrier tapes are roughly classified into plastic carrier tapes made of plastic and paper carrier tapes made of paper. Paper carrier tapes generally absorb moisture more easily than plastic carrier tapes and are affected by a high humidity environment. Cheap. The present inventors have found that the antistatic property is lowered when the cover tape is stored in a moist heat environment.

Conventionally, the size and weight of the main electronic components were large (1 mm or more for surface mounting, 1 cm or more for other connectors, etc.), so adhesion due to static electricity was unlikely to occur. However, as the size of electronic components has become smaller (lighter), the problem of mounting defects due to static electricity has become apparent. For this reason, mounting defects occur due to deterioration of the antistatic performance of the cover tape from the time of shipment from the parts manufacturer to the time of use by the mounting manufacturer due to warehouse storage and transportation in a relatively hot and humid area, which has not been a problem in the past. Problems such as actualization have arisen.

If an excessive amount of antistatic agent is added to the heat seal layer in order to prevent mounting defects due to the deterioration of the antistatic performance, the seal strength is reduced even in the initial stage of manufacturing, and the cover tape is peeled off. Such a problem occurs. In addition, low-molecular-weight antistatic agents tend to bleed out at temperatures higher than room temperature, which reduces the sealing strength of the cover tape.

Therefore, it was considered to strengthen the seal strength in advance in order to maintain the predetermined seal strength even when stored in a moist heat environment. However, when the seal strength is strengthened with the recent miniaturization of electronic components, the carrier tape vibrates when the cover tape before moist heat deterioration is peeled off, the vibration is transmitted to the electronic components, and when the measuring machine adsorbs the electronic components. In addition, the suction position of the electronic component may shift or the electronic component may pop out from the storage portion. Therefore, it was difficult to strengthen the initial seal strength.

Therefore, when the present inventors investigated the cause of the decrease in seal strength after a moist heat load, the antistatic agent contained in the heat seal layer was bleeding due to the moisture absorbed by the carrier tape and the moisture adhering to the surface. It was found that it was out and inhibited the sealing property. Then, it was considered that the decrease in the seal strength after the wet heat load was suppressed by reducing the amount of the antistatic agent contained in the heat seal layer, but at the same time, there was a concern that the antistatic performance of the cover tape was deteriorated.

In particular, low-molecular-weight antistatic agents tend to move to highly polar materials when the environmental temperature rises, so they move from the surface of the heat seal layer to highly polar layers such as paper carrier tape, and are charged. The prevention performance is reduced. Further, when an antistatic agent having high hydrophilicity is used in terms of cost merit and performance, there is a problem that the antistatic agent flows down when moisture or dew condensation occurs in a high humidity environment, and the performance deteriorates.

However, the present inventors suppress peeling charge when peeling the cover tape from the carrier tape if the surface resistivity of the surface of the antistatic layer of the cover tape is equal to or higher than a specific value after a moist heat load. It was found that the cover tape as a whole can exhibit sufficient antistatic properties. Therefore, it has been found that even if the amount of the antistatic agent in the heat seal layer is reduced, the decrease in the seal strength after the wet heat load can be suppressed without lowering the antistatic property of the cover tape as a whole.
Hereinafter, the cover tape for packaging electronic components and the packaging body of the present disclosure will be described in detail.

A. Cover tape for packaging electronic components The cover tape for packaging electronic components of the present disclosure is arranged on one surface side of a base material layer and the base material layer, and seals a carrier tape having a plurality of storage portions for storing electronic parts. 100 The surface resistance of the surface on the side where the antistatic layer is arranged is 1.0 × 10 ¹⁰ Ω / □ or less after the moist heat load stored for a long time, and the sealing strength with the carrier tape before the moist heat load is 0. It is characterized in that it is 7.N or less, and the sealing strength with the carrier tape after the moist heat load is 0.1N or more. In this specification, the "cover tape for packaging electronic components" may be simply referred to as a "cover tape".

Here, "under a moist heat environment of 40 ° C and 95% RH" is set assuming a hot and humid area and the storage environment and transportation environment of that area. In addition, "stored for 100 hours" was set to improve the efficiency of evaluation because a tendency can be seen in the evaluation after storage for 100 hours as an accelerated test. In addition, domestic transportation time and shipping container transshipment time were also taken into consideration when setting.

The cover tape of the present disclosure has a surface resistivity of 1.0 × 10 ¹⁰ Ω / □ or less on the side on which the antistatic layer is arranged after a moist heat load, so that the cover tape as a whole is sufficiently charged. It has a preventive performance and can suppress a decrease in mounting efficiency under a moist heat load. Further, since the seal strength is 0.7 N or less before the moist heat load, it is possible to prevent the electronic components from popping out from the storage pocket when the cover tape is peeled off before the moist heat deterioration occurs.

Further, since the seal strength is 0.1 N or more after the moist heat load, the decrease in the seal strength is suppressed after the moist heat load. Therefore, even when a moist heat load is applied, it is possible to suppress unintentional peeling of the cover tape and improve the mounting efficiency at the time of mounting.

The cover tape of the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of the cover tape of the present disclosure. As shown in FIG. 1, the cover tape 1 of the present disclosure includes a base material layer 2, a heat seal layer 3 arranged on one surface side of the base material layer 2, and a heat seal layer 3 side of the base material layer 2. It has an antistatic layer 4 arranged on the surface side opposite to the surface of the surface.

2 (a) and 2 (b) are schematic plan views and cross-sectional views showing an example of a package using the cover tape for packaging electronic components of the present disclosure, and FIG. 2 (b) is A of FIG. 2 (a). It is a cross-sectional view taken along the line A. As shown in FIGS. 2A and 2B, the package 10 stores the carrier tape 11 having a plurality of storage portions 12 for storing the electronic components 13, the electronic components 13 stored in the storage portions 12, and the electronic components 13. A cover tape 1 arranged so as to cover the portion 12 is provided. The cover tape 1 is heat-sealed on the carrier tape 11, and heat-sealing portions 3h are provided on both ends of the heat-sealing layer 3 of the cover tape 1 in a line shape with a predetermined width. Further, in the package 10, the carrier tape 11 can have a feed hole 14.

In the present disclosure, for example, an antistatic layer having high antistatic performance before moist heat deterioration and less deterioration of antistatic performance after moist heat deterioration (particularly, the first antistatic layer described later) is placed on one surface of the base material. By providing the layer), it is possible to keep the surface resistivity of the surface on the side on which the antistatic layer is arranged after the moist heat load within a predetermined range.

Further, by providing a heat seal layer having a low content of the antistatic agent or not containing the antistatic agent on the side opposite to the antistatic layer side of the base material, the carrier tape can be used after a moist heat load. It is possible to keep the seal strength of the above within a predetermined range. As another method, the ratio of the thermoplastic resin in the heat seal layer is increased in consideration of the balance with other performances so that the seal strength with the carrier tape after the wet heat load is within a predetermined range. Is possible.

Hereinafter, each configuration of the cover tape of the present disclosure will be described.
In the present disclosure, "wet heat load" means that a carrier tape and a cover tape are heat-sealed using a taping machine (NST-35 Nitto Kogyo) under the following conditions, and about 40 m is rolled on a reel with a core diameter of 3 inches. This refers to the load applied when a reel sample wound into a shape is stored in a tilted state in a moist heat environment of 40 ° C. and 95% RH for 100 hours. The surface resistivity and seal strength after a moist heat load, which will be described later, are such that the reel sample is stored for 100 hours in a moist heat environment of 40 ° C. and 95% RH, and then stored for 24 hours or more in a moist heat environment of 25 ° C. and 40% RH. It is a value measured with respect to.

(Taping conditions)
-Paper carrier tape: Hokuetsu Corporation 0.31 mm thick virgin paper 8 mm width-Paper carrier tape Feed hole pitch: 2 mm
・ Taping temperature 180 ℃
・ Taping speed 3500 tact ・ Taping trowel size 0.6mm x 2 wires ・ Taping trowel length (seal length at 1 tact) 8 ± 1mm

I. Antistatic layer The antistatic layer in the present disclosure is a layer arranged on the surface opposite to the surface of the base material layer on the heat seal layer side to prevent the cover tape from being charged. By having the antistatic layer, it is possible to prevent the generation of static electricity due to contact with other surfaces, and to prevent the static electricity from being charged and adhering dust, dust, etc. to the surface of the cover tape.

The surface resistivity of the surface of the cover tape on the side where the antistatic layer is arranged after the wet heat load in the present disclosure is 1.0 × 10 ¹⁰ Ω / □ or less, preferably 1.0 × 10 ⁹ Ω / □ or less. Is.
Therefore, it is possible to suppress an increase in the peeling band voltage after a moist heat load. On the other hand, the lower limit of the surface resistivity of the surface on which the antistatic layer of the cover tape after wet heat load is disposed is not particularly limited, for example, 1.0 × 10 ⁵ Ω / □ or more, preferably 1.0 × 10 ⁷ Ω / □ or more. This is because if the surface resistivity is lowered too much, the cost becomes high.

The surface resistivity of the surface of the cover tape before the moist heat load on which the antistatic layer is arranged is usually 1.0 × 10 ¹⁰ Ω / □ or less, preferably 1.0 × 10 ⁹ Ω. / □ or less. On the other hand, the lower limit of the surface resistivity of the surface on which the antistatic layer of the cover tape prior to wet heat load is disposed is not particularly limited, for example, 1.0 × 10 ⁵ Ω / □ or more, preferably 1.0 × 10 ⁷ Ω / □ or more.

In the present disclosure, the "surface on the side where the antistatic layer of the cover tape is arranged" is not particularly limited, but is usually the surface of the antistatic layer. The surface resistivity is a value obtained under the following test conditions using Mitsubishi Chemical Analytech High Restor UP MCP-HT450.

(Test conditions)
・ Probe: UA probe ・ Applicable voltage: 10 ¹⁰ Ω / less than □ 10 V
10 ¹⁰ to 10 ¹² Ω / □ 500 V
10 ¹³ Ω / □ or more 1000 V
-Sample size: 50 cm x 40 cm
-Measurement point: Central part of sample-Measurement value: Measure 5 points so that the measurement points do not overlap, and adopt the average value-One measurement time: Adopt the display after 10 seconds-Sample storage before measurement: 25 ° C 40 Storage / measurement environment for 24 hours or more in% RH environment: 25 ± 2 ° C, 40 ± 5% RH environment

The antistatic layer in the present disclosure is not particularly limited, and examples thereof include a layer containing a conductive polymer, a layer containing a polymer-type surfactant, and a layer containing a low-molecular-weight surfactant. Of these, the two aspects of the first antistatic layer and the second antistatic layer, which will be described later, are preferable because they can sufficiently suppress an increase in surface resistivity after a moist heat load. In particular, the first antistatic layer, which will be described later, is preferable because the surface resistivity after a moist heat load can be sufficiently lowered.

The thickness of the antistatic layer is a value required for the surface resistivity of the antistatic layer to satisfy the above values, and can be, for example, 0.02 μm or more and 3 μm or less. By forming the antistatic layer having such a thickness, it is possible to impart antistatic properties to the cover tape.

(1) First Antistatic Layer The first antistatic layer in the present disclosure contains a conductive polymer. Since the first antistatic layer has a conductive polymer, the surface resistance of the antistatic layer is reduced. In the second antistatic layer, which will be described later, the quaternary ammonium salt has a strong affinity for moisture in the air, attracts water molecules, and forms a film of moisture on the surface of the antistatic layer to reduce the surface resistance. On the other hand, the conductive polymer in the first antistatic layer is itself conductive. Therefore, it is preferable because the surface resistivity can be sufficiently lowered.

(A) Conductive polymer Examples of the conductive polymer include polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylene vinylene, polyvinylcarbazole and the like.
Among them, polythiophene is preferable as the conductive polymer. As the polythiophene, for example, PEDOT / PSS (poly (3,4-ethylenedioxythiophene / polystyrene sulfonic acid)) is preferably used.

(B) Crosslinked resin The first antistatic layer in the present disclosure has a crosslinked resin containing an acrylic main chain and a crosslinked structure in addition to the above conductive polymer, and the crosslinked structure is −C (= O) OC. _{It is preferable to have 2} H ₄ NH- or -C (OH) CH ₂ OC (= O)-. By containing the crosslinked resin, the above-mentioned conductive polymer can be fixed, the outflow of the conductive polymer under a moist heat load can be prevented, and the surface of the cover tape on the side where the antistatic layer is arranged. It is possible to suppress an increase in the surface resistivity of. As will be described later, such a first antistatic layer is charged with a conductive polymer, a first crosslinkable acrylic polymer having a carboxylate anion group, and a first polyfunctional curing agent. Formed from protective material.

The crosslinked structure in the crosslinked resin contained in the first antistatic layer is composed of a crosslinkable functional group (carboxylate anion (-COO-) and other crosslinkable functional groups) of the first crosslinkable acrylic polymer described later. , A structure in which a first polyfunctional curing agent is bonded, and has -C (= O) OC ₂ H ₄ NH- or -C (OH) CH ₂ OC (= O)-.

(C) First Antistatic Layer Material The first antistatic layer material for forming the first antistatic layer is a first crosslinkable acrylic system containing a conductive polymer and a carboxylate anion. It has a polymer and a first polyfunctional curing agent. Hereinafter, the polyfunctional curing agent contained in the first antistatic layer material is also referred to as a first polyfunctional curing agent.

(C1) Conductive Polymer Examples of the conductive polymer include those similar to those described in "I. Antistatic layer (1) First antistatic layer (a) Conductive polymer" above.

(C2) First Crosslinkable Acrylic Polymer In the first crosslinkable acrylic polymer, a carboxylate anion group (-COO-) and, in some cases, other groups act as a crosslinkable functional group. Furthermore, due to the presence of the carboxylate anion group (-COO-), it also has a function as a binder resin because it has a high affinity with the conductive polymer.

The first crosslinkable acrylic polymer is not particularly limited as long as it is an acrylic resin having a carboxylate anion group (-COO-) in the molecule, and known ones can be used.
For example, a copolymer obtained by reacting a monomer containing an acrylic monomer having a carboxyl group (neutralized salt) can be mentioned. As used herein, the acrylic monomer means a monomer having at least one (meth) acryloyl group in one molecule. Further, the (meth) acryloyl group has a meaning comprehensively referring to an acryloyl group and a methacryloyl group.

The carboxylate anion group is derived from the carboxyl group of the acrylic monomer. As the acrylic monomer having a carboxyl group, acrylic acid and methacrylic acid are preferable.

Examples of the monomer other than the acrylic monomer having a carboxyl group include various known (meth) acrylic acid alkyl esters, (meth) acrylamides, (meth) acrylic acid hydroxyalkyls, and other unsaturated single amounts. You can use the body. As the other unsaturated monomer, a crosslinkable group capable of forming a crosslinked structure with the following polyfunctional curing agent such as a hydroxyl group may be contained.

Examples of the neutralizing agent include ammonia, primary to tertiary amines, alkali metal compounds and alkaline earth metal compounds, and these can be used alone or in combination of two or more. ..

(C3) First Polyfunctional Curing Agent The first polyfunctional curing agent is not particularly limited as long as it has two or more functional groups capable of forming a crosslinked structure with the first crosslinkable acrylic polymer. However, examples thereof include an aziridine-based curing agent and an epoxy-based curing agent.

The blending ratio of the first crosslinkable acrylic polymer and the first polyfunctional curing agent in the first antistatic layer material is not particularly limited, but the mole of the crosslinkable functional group in the crosslinkable acrylic polymer is not particularly limited. When the number (mol) is x and the number of moles (mol) of the functional group of the polyfunctional curing agent is y, x / y is usually about 0.5 to 2.0, preferably 0.75 to 1. It is a range of about .2.

The content ratios of the conductive polymer, the first crosslinkable acrylic polymer, and the first polyfunctional curing agent in the first antistatic layer material are specifically the water resistance and water resistance of the film. From the viewpoint of rubbing property, assuming that the conductive polymer is 100 parts by mass in terms of solid content ratio, the crosslinkable acrylic polymer is 500 to 700 parts by mass, and the polyfunctional curing agent is 50 to 300 parts by mass, preferably 50 parts by mass. It is 150 to 250 parts by weight.

(D) Forming Method As a method for forming the antistatic layer, for example, an antistatic composition in which the conductive polymer, the first crosslinkable acrylic polymer, the first polyfunctional curing agent and the like are dispersed or dissolved in a solvent. Examples thereof include a method of applying the antistatic composition to the other surface side of the base material layer and curing the material. Examples of the application method of the antistatic composition include known application methods such as air doctor, blade coat, knife coat, rod coat, bar coat, direct roll coat, reverse roll coat, gravure coat, and slide coat. ..

(2) Second Antistatic Layer The second antistatic layer has an acrylic main chain, a side chain containing a quaternary ammonium salt, and a crosslinked resin containing a crosslinked structure, and the crosslinked structure is -NHC (= O). ) O-, -NHC (= O)-or-C (= O) OC ₂ H ₄ NH-. As will be described later, the second antistatic layer is charged with a second crosslinkable acrylic polymer containing a crosslinkable functional group and a group having a quaternary ammonium salt, and a second polyfunctional curing agent. Formed from protective material.

(A) Crosslinked resin The second antistatic layer in the present disclosure has a crosslinked resin which is a crosslinked resin, and the crosslinked resin contains an acrylic main chain, a side chain containing a quaternary ammonium salt, and a crosslinked structure.
The quaternary ammonium salt has a function as a hydrophilic part of the surfactant, and the quaternary ammonium salt oriented toward the surface side of the antistatic layer has a strong affinity with water and attracts water molecules to the surface of the antistatic layer. Surface resistance is reduced by forming a film of moisture. Further, since the quaternary ammonium salt is fixed in the crosslinked resin, it is possible to prevent the quaternary ammonium salt from flowing out under a moist heat load, and the side on which the antistatic layer of the cover tape is arranged after the moist heat load is arranged. It is possible to suppress an increase in the surface resistivity of the surface.

Examples of the quaternary ammonium salt in the crosslinked resin include those existing as a group represented by the following formula (1).
-N ⁺ R ₃ (1)
(In the formula, R is an organic group that is the same or different from each other independently.)
R is preferably an alkyl group having 1 to 6 carbon atoms, and more preferably an alkyl group having 1 to 2 carbon atoms from the viewpoint of surface orientation of the quaternary ammonium salt. The quaternary ammonium salt represented by the above formula (1) is bonded to an acrylic chain which is a main chain via a divalent hydrocarbon group which may contain oxygen and nitrogen.

Examples of such a divalent hydrocarbon group include -X (CH ₂ ) _n- (in the formula, n is an integer of 1 to 6 and X is an amide group (-C (= O) NH-) or ester. A group (-C (= O) O-), wherein the carbon atom of the amide group or ester group is bonded to the acrylic chain which is the main chain) is preferable.

The content of the quaternary ammonium salt contained in the antistatic layer is a value required for the surface resistivity of the surface of the cover tape on the side where the antistatic layer is arranged in the present disclosure to fall within the above-mentioned numerical range. can do.

The crosslinked structure is a structure in which the crosslinkable functional group of the second crosslinkable acrylic polymer described later and the second polyfunctional curing agent are bonded, and -NHC (= O) O-, -NHC (=). It has O)-or -C (= O) OC ₂ H ₄ NH-. The second antistatic layer has an acrylic chain as a main chain. As used herein, the term "acrylic chain" means a comprehensive term for an acrylic chain and a methacryl chain.

(B) Second Antistatic Layer Material The second antistatic layer material for forming the second antistatic layer is a second crosslinked product containing a crosslinkable functional group and a group having a quaternary ammonium salt. It has a sex acrylic polymer and a polyfunctional curing agent. The polyfunctional curing agent contained in the second antistatic layer material is referred to as a second polyfunctional curing agent.

(B1) Second Crosslinkable Acrylic Polymer The second crosslinkable acrylic polymer contains a group having a crosslinkable functional group and a quaternary ammonium salt, and reacts with a polyfunctional curing agent to form a crosslinked structure. do. The crosslinkable functional group contained in the second crosslinkable acrylic polymer is not particularly limited as long as it can form a crosslinked structure with the polyfunctional curing agent, and examples thereof include a hydroxyl group and a carboxyl group. .. Examples of the quaternary ammonium salt contained in the second crosslinkable acrylic polymer include those represented by the above formula (1).

In the present disclosure, the second crosslinkable acrylic polymer has a group having a crosslinkable functional group and a quaternary ammonium salt, and 50% by mass or more of the total amount of the monomer components constituting the polymer is an acrylic monomer. Is preferable.

The second crosslinkable acrylic polymer is an acrylic monomer (m1) having a group containing a quaternary ammonium salt (hereinafter referred to as (m1) component), an acrylic polymer having a crosslinkable functional group such as a hydroxyl group and a carboxyl group. A monomer (m2) (hereinafter referred to as (m2) component) and, if necessary, an acrylic monomer or an unsaturated monomer (m3) (hereinafter referred to as (m3) component) other than these are reacted. Polymers can be mentioned.

Examples of the (m1) component include acryloyloxyethyltrimethylammonium chloride, acryloyloxyethyltrimethylammonium bromide, acryloyloxyethylmethylammonium chloride, acryloyloxyethyldiethylmethylammonium chloride, acryloyloxyethyldimethylethylammonium chloride, and the like. These monomers may be used alone or in combination of two or more.

Specific examples of the (meth) acrylic monomer having a carboxyl group of the (m2) component include acrylic acid, methacrylic acid, itaconic acid, maleic acid, and crotonic acid. These monomers may be used alone or in combination of two or more. Specific examples of the (meth) acrylic monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl ( Examples thereof include hydroxyalkyl (meth) acrylates such as meta) acrylates. These monomers may be used alone or in combination of two or more.

Examples of the (m3) component include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, and t. Examples thereof include (meth) acrylic acid esters such as butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, and stearyl (meth) acrylate. These monomers may be used alone or in combination of two or more.

As the second crosslinkable acrylic polymer, a commercially available one can also be used. For example, as an acrylic polymer having a carboxyl group, a quaternary ammonium salt group, and a (meth) acrylic acid ester group, Acryt 1SX-1123 (manufactured by Taisei Fine Chemical Co., Ltd.) can be used.

(B2) Second Polyfunctional Curing Agent The second polyfunctional curing agent has two or more crosslinkable functional groups of the second crosslinkable acrylic polymer and functional groups capable of forming a crosslinked structure. If there is, there is no particular limitation.
Specific examples of such a polyfunctional curing agent include a polyisocyanate curing agent, an aziridine-based curing agent, and a melamine-based curing agent.

The blending ratio of the second crosslinkable acrylic polymer and the second polyfunctional curing agent in the second antistatic layer material is not particularly limited, but the mole of the crosslinkable functional group in the crosslinkable acrylic polymer is not particularly limited. When the number (mol) is x and the number of moles (mol) of the functional group of the polyfunctional curing agent is y, x / y is usually about 0.5 to 2.0, preferably 0.75 to 1. It is a range of about .2.

(C) Forming method As a method for forming the antistatic layer, for example, an antistatic layer material containing the second crosslinkable acrylic polymer, a polyfunctional curing agent, moisture absorbing / releasing fine particles and the like is dispersed or dissolved in a solvent. Examples thereof include a method in which the antistatic layer composition is used and the antistatic layer composition is applied to the other surface side of the base material layer and cured. Examples of the coating method of the antistatic layer composition include known coating methods such as air doctor, blade coating, knife coating, rod coating, bar coating, direct roll coating, reverse roll coating, gravure coating, and slide coating. Be done.

(3) Third Antistatic Layer Examples of the antistatic layer in the present disclosure include a third antistatic layer in addition to the first antistatic layer and the second antistatic layer. The third antistatic layer contains a highly hydrophobic small molecule surfactant and a crosslinked resin. Examples of the low molecular weight surfactant having high hydrophobicity include polyoxyethylene alkylamines such as polyoxyethylene-laurylamine and polyoxyethylene-stearylamine. Examples of the crosslinked resin include those having an acrylic main chain and a crosslinked structure.

The material constituting the third antistatic layer contains a small molecule surfactant, a crosslinkable acrylic polymer, and a polyfunctional curing agent. From the viewpoint of antistatic performance, water resistance and abrasion resistance of the membrane, assuming that the low molecular weight surfactant is 1 part by weight in terms of solid content ratio, for example, the crosslinkable acrylic polymer is 0.3 to 0.7 parts by mass. The polyfunctional curing agent is 0.1 to 0.3 parts by mass. Preferably, the crosslinkable acrylic polymer is 0.4 to 0.6 parts by mass, and the polyfunctional curing agent is 0.15 to 0.2 parts by mass.

II. Base material layer The base material layer in the present disclosure is a layer that supports the above-mentioned antistatic layer and heat seal layer.
As the base material layer, the mechanical strength to withstand the external force of the taping machine during storage and transportation, chip filling, and the mounting machine during chip mounting (force in the longitudinal direction of the reel) and tear strength, and manufacturing and taping. Various materials can be applied as long as they have heat resistance to withstand packaging.

For example, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymers, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymers, and polyamides such as nylon 6, nylon 66 and nylon 610. Examples thereof include polyolefins such as polyethylene, polypropylene, and polymethylpentene. Among them, polyesters such as polyethylene terephthalate and polyethylene naphthalate are preferably used because of their good cost and mechanical strength.

Further, the base material layer may contain additives such as a filler, a plasticizer, a colorant, and an antistatic agent, if necessary. The base material layer may be a single layer, or may be a laminate of a plurality of layers of the same type or different types. Further, the base material layer may be a stretched film or an unstretched film. Above all, the base material layer may be a film stretched in the uniaxial direction or the biaxial direction for the purpose of improving the strength.

The thickness of the base material layer can be, for example, 2.5 μm or more and 300 μm or less, 6 μm or more and 100 μm or less, or 12 μm or more and 50 μm or less. If the thickness of the base material layer is too thick, the rigidity at the time of taping packaging becomes strong, which is disadvantageous in terms of handleability and cost. Further, if the thickness of the base material layer is too thin, the mechanical strength may be insufficient.

The base material layer may be subjected to easy-adhesion treatment such as corona discharge treatment, plasma treatment, ozone treatment, frame treatment, preheat treatment, dust removal treatment, thin film deposition treatment, alkali treatment, and sandblast treatment.

III. Heat-seal layer The heat-seal layer in the present disclosure is a layer arranged on the surface side of the base material layer opposite to the antistatic layer. When the package is manufactured using the cover tape of the present disclosure, the heat seal layer is heat-sealed against the carrier tape, so that the cover tape and the carrier tape are adhered to each other.

(1) Seal strength The cover tape in the present disclosure has a seal strength of 0.7 N or less, preferably 0.5 N or less, before a moist heat load. This is because it is possible to suppress the carrier tape from vibrating when the cover tape is peeled off in use before the deterioration due to moist heat, and there is no risk of the electronic component popping out of the storage pocket. The lower limit of the seal strength before the wet heat load is not particularly limited, and is, for example, 0.1 N or more, preferably 0.15 N or more. It is possible to prevent the cover tape from peeling off from the carrier tape before the moist heat load and the electronic components as the contents from falling off.

The cover tape in the present disclosure has a sealing strength of 0.1 N or more, preferably 0.12 N or more after a moist heat load. According to the present disclosure, the seal strength after a moist heat load can be set to the above value or more. Therefore, even after the deterioration due to moist heat, it is possible to prevent the cover tape from being peeled off from the carrier tape and the electronic components as the contents from falling off before the cover tape is peeled off by the peeling device at the time of mounting the electronic component. ..

The upper limit of the seal strength after a moist heat load is not particularly limited, and is 0.5 N or less, preferably 0.4 N or less. This is because it is possible to suppress the carrier tape from vibrating when the cover tape is peeled off even after a moist heat load, and there is no risk of electronic components popping out of the storage pocket.

In the present disclosure, the sealing strength before moist heat load is about 40 m with a core diameter of 3 inches while heat-sealing the carrier tape and cover tape with a taping machine (NST-35 Nitto Kogyo) under the above (taping conditions). PTS-5000 (stock) has a seal strength when the cover tape is peeled off from the carrier tape after the reel sample wound on the reel of No. It is a value measured under the following measurement conditions using the company EPI).

The sealing strength after moist heat loading is when the cover tape is peeled off from the carrier tape after the reel sample is stored in a 40 ° C. 95% RH environment for 100 hours and then in a 25 ° C. 40% RH environment for 24 hours. Seal strength.

(Seal strength measurement conditions)
・ Cover tape width 5.25 ± 0.2 mm
Measurement length 150 mm
Peeling speed 300 mm / min Peeling angle 165-175 °
Measurement environment 25 ± 3 ° C, 40 ± 10% RH
Measured value 150 mm Average value when measured

(2) Surface resistivity In the present disclosure, the surface resistivity of the surface of the cover tape on the side where the heat seal layer is arranged is, for example, 1 × 10 ⁸ Ω / □ to 1 × 10 ¹⁵ Ω / □. Particularly preferably, it is 1 × 10 ⁸ Ω / □ to 1 × 10 ¹⁴ Ω / □.

Even if the heat seal layer has a relatively high surface resistivity, the cover tape in the present disclosure has excellent antistatic performance of the antistatic layer, so that the antistatic performance of the cover tape as a whole is excellent. Further, when it is at least the above lower limit value, the amount of the antistatic agent added can be reduced, and the decrease in seal strength due to the moist heat load can be suppressed. On the other hand, in order to obtain the required antistatic property of the cover tape as a whole, it is preferably not more than the above upper limit value.
The "face on the side where the heat seal layer of the cover tape is arranged" is usually the surface of the heat seal layer.

(3) Antistatic Agent The heat seal layer in the present disclosure preferably contains an antistatic agent. In addition to arranging the antistatic layer on the surface side of the base material layer opposite to the heat seal layer, by adding an antistatic agent to the heat seal layer, the antistatic property of the cover tape as a whole is further improved. be able to.

Examples of the antistatic agent contained in the heat seal layer include conductive polymers, polymer-type surfactants, low-molecular-weight surfactants, and conductive fine particles, and examples thereof include conductive polymers and polymer-type surfactants. It is preferable because the agent does not easily bleed out after a moist heat load and can suppress a decrease in the seal strength after a moist heat load.

Examples of the conductive polymer include the same ones as the above-mentioned "I. Antistatic layer (1) First antistatic layer (a) Conductive polymer", and in particular, PEDOT / PSS (poly (3). , 4-ethylenedioxythiophene / polystyrene sulfonic acid) is preferably used.

The content of the conductive polymer in the heat seal layer is such that the mixing ratio of the thermoplastic resin composition containing the thermoplastic resin (and the additive if necessary) described later and the conductive polymer is the thermoplastic resin. It is preferably 0.7 parts by mass or less, particularly 0.55 parts by mass or less, based on 100 parts by mass of the composition. This is because by reducing the antistatic material, it is possible to suppress the bleed-out of the antistatic agent contained in the heat seal layer and suppress the decrease in the seal strength after a moist heat load.

Polymer-type surfactants include cationic surfactants such as quaternary ammonium salts, pyridium salts, imidazolium salts, primary to tertiary amine salts, sulfonium salts, and phosphonium salts; sulfonates and sulfates. Anionic surfactants such as ester salts and phosphate ester salts; Amphoteric surfactants such as amino acid-based and amino acid sulfate esters; Surface activity of nonionic surfactants such as aminoalcohol-based, glycerin-based and polyethylene glycol-based Examples thereof include polymer-based surfactants in which the monomer component containing the agent has a high molecular weight.

The content of the polymer-type surfactant in the heat-seal layer is determined by the mixing ratio of the thermoplastic resin composition containing the thermoplastic resin (and, if necessary, an additive) described later and the polymer-type surfactant. The amount is preferably 0.7 parts by mass or less, particularly preferably 0.55 parts by mass or less, based on 100 parts by mass of the thermoplastic resin composition. This is because by reducing the antistatic material, it is possible to suppress a decrease in the sealing strength after a moist heat load.

Further, as the low molecular weight surfactant, a cationic surfactant such as a quaternary ammonium salt, a pyridium salt, an imidazolium salt, a primary to tertiary amine salt, a sulfonium salt, a phosphonium salt; , Anionic surfactants such as sulfate ester salts and phosphate ester salts; Amphoteric surfactants such as amino acid-based and amino acid sulfate ester-based; Nonionic surfactants such as aminoalcohol-based, glycerin-based and polyethylene glycol-based Can be mentioned.

The content of the low molecular weight surfactant in the heat seal layer is determined by the mixing ratio of the low molecular weight surfactant and the thermoplastic resin composition containing the thermoplastic resin (and the additive if necessary) described later. It is preferably 0.7 parts by mass or less, particularly 0.55 parts by mass or less, with respect to 100 parts by mass of the thermoplastic resin composition. This is because by reducing the antistatic material, it is possible to suppress a decrease in the sealing strength after a moist heat load.

The conductive fine particles include metal fine particles such as gold, silver, nickel, aluminum and copper, carbon black fine particles, conductive fine particles obtained by imparting conductivity to metal oxides such as tin oxide, zinc oxide and titanium oxide, and barium sulfate. Examples thereof include conductive fine particles to which conductivity has been imparted, and conductive fine particles to which conductivity has been imparted to sulfides such as zinc sulfide, copper sulfide, cadmium sulfide, nickel sulfide, and palladium sulfide.

(4) Thermoplastic resin The heat seal layer has a thermoplastic resin, and the thermoplastic resin includes an ethylene-vinyl acetate copolymer, an acrylic resin, a polyester resin, a polyurethane resin, and a vinyl chloride-vinyl acetate. Any of the copolymers or a resin containing these as a main component is preferable. Above all, it is preferable to contain an ethylene-vinyl acetate copolymer. When the heat seal layer contains an ethylene-vinyl acetate copolymer, the heat seal property for the carrier tape is improved. Therefore, it is possible to suppress the occurrence of unintended peeling during transportation, storage, and the like.

In the present disclosure, the ethylene-vinyl acetate-based copolymer is a copolymer containing at least an ethylene monomer unit and a vinyl acetate monomer unit. The ethylene monomer unit means a structural unit derived from an ethylene monomer, and the vinyl acetate monomer unit means a structural unit derived from a vinyl acetate monomer.

When the heat-sealed layer in the present disclosure contains an ethylene-vinyl acetate copolymer, it is preferable that the heat-sealed layer further contains a polyethylene resin as the thermoplastic resin. By blending the polyethylene resin, it is possible to reduce the surface tackiness while maintaining good heat sealability and suppress deterioration after being placed in a high humidity and heat environment.

Examples of the polyethylene resin include various types of polyethylene such as low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene. Since they are superior from the viewpoint of dispersibility, low-density polyethylene (LDPE, (Density 0.910 to less than 0.930) and linear low density polyethylene (LLDPE, density 0.910 to 0.925) are preferably used.

Further, in the present disclosure, the classification of various polyethylenes refers to those defined in the former JIS K6748: 1995 and JIS K6890-1: 2000. The content of the polyethylene resin in the heat seal layer is preferably 10% by mass or more and 50% by mass or less, and more preferably 20% by mass or more and 40% by mass or less.

If necessary, the heat seal layer may contain additives such as a tackifier, an anti-blocking agent, a dispersant, a filler, a plasticizer, and a colorant.

The thickness of the heat seal layer can be, for example, 0.5 μm or more and 30 μm or less, preferably 1 μm or more and 20 μm or less. If the thickness of the heat seal layer is too thin, the sealability may be inferior, and a uniform film may not be obtained. If the heat seal layer is too thick, the transparency of the cover tape may decrease.

As a method for forming the heat seal layer, for example, a composition for a heat seal layer in which a thermoplastic resin, an antistatic agent, another additive, or the like is dispersed or dissolved in a solvent is used, and the above is applied to one surface side of the base material layer. Examples thereof include a method of applying the composition for a heat seal layer and drying it. Examples of the method for applying the heat seal layer composition include roll coat, reverse roll coat, gravure coat, gravure reverse coat, comma coat, bar coat, wire bar coat, rod coat, kiss coat, knife coat, die coat, and the like. Known coating methods such as flow coat, dip coat and spray coat can be mentioned.

Also, a film can be used as the heat seal layer. In this case, the method of laminating the base material layer and the heat seal layer is not particularly limited, and a known method can be used. For example, a method of laminating a pre-made film to a base material layer with an adhesive, a method of extruding a raw material of a heat-melted film onto a base material layer with a T-die or the like, and the like to obtain a laminate. As the adhesive in the former method, for example, a polyester-based adhesive, a polyurethane-based adhesive, an acrylic-based adhesive, or the like can be used.

In the present disclosure, the latter method (extrusion laminating method) is preferable. Specifically, in the extrusion laminating method, for example, the value of the melt flow rate measured according to JIS-K-7210 in which a thermoplastic resin, an antistatic agent, other additives and the like are melt-kneaded (hereinafter, "MFR"). (190 ° C., 2.16 kg) is 10 g to 100 g as a raw material for the heat seal layer, and a resin melted from the above raw material is extruded onto one surface side of the base material layer. A method of laminating using a cooling roll can be mentioned.

In the present disclosure, an antistatic coat layer (second antistatic layer) containing an antistatic agent is provided on the surface side of the heat seal layer opposite to the surface on the base material layer side, in addition to the above-mentioned antistatic layer. You may. Examples of the antistatic coat layer include a layer containing an antistatic agent contained in the above-mentioned heat seal layer. In this case, the surface of the coat layer is the surface on the side where the heat seal layer of the cover tape is arranged.

IV. Cover Tape (1) Peeling Band Voltage It is preferable that the peeling band voltage of the cover tape in the present disclosure when peeling from the carrier tape after a moist heat load is 110 V or less, particularly 70 V or less. This is because the mounting success rate of electronic components is good.
The peeling band voltage after the moist heat load is about 40 m with a reel with a core diameter of 3 inches while heat-sealing the carrier tape and cover tape with a taping machine (NST-35 Nitto Kogyo) under the above (taping conditions). The reel sample wound in a roll shape is stored in a tilted state in a 40 ° C. 95% RH environment for 100 hours, and then stored in a 25 ° C. 40% RH environment for 24 hours. Cover tape peeling device: W08f Intelligent feeder ( It is a value measured under the following test conditions using a charge amount measuring device: SK-H050 (manufactured by KEYENCE Co., Ltd.) (manufactured by FUJI Co., Ltd.).

(Test conditions)
-Peeling speed: 100 mm / sec-Measurement conditions: High-precision mode, measurement time 15 seconds-Sample storage before measurement: 24 hours or more under 25 ° C 40% RH-Measurement environment: 25 ± 2 ° C 35 ± 5% RH
-Result calculation method: The value of the peeling charge from 5 seconds to 13 seconds after the start of measurement is measured every 0.0014 seconds, the average value of the absolute values is calculated, and this is used as the peeling band voltage.

V. Other Structure (1) Intermediate Layer In the present disclosure, for example, as shown in FIG. 3, an intermediate layer 5 may be arranged between the base material layer 2 and the heat seal layer 3, if necessary. The intermediate layer can improve the adhesion between the base material layer and the heat seal layer. Further, since the intermediate layer can improve the cushioning property when the cover tape of the present disclosure is heat-sealed to the carrier tape, heat can be applied to the heat-sealing layer more uniformly.

The material of the intermediate layer is appropriately selected depending on the material of the base material layer and the heat seal layer, and examples thereof include polyolefins such as polyethylene and polypropylene, polyurethane, and polyester. The thickness of the intermediate layer can be, for example, 5 μm or more and 50 μm or less.

A film can be used as the intermediate layer. In this case, the method of laminating the base material layer and the intermediate layer is not particularly limited, and a known method can be used. For example, a method of laminating a pre-made film to a base material layer with an adhesive, a method of extruding a raw material of a heat-melted film onto a base material layer with a T-die or the like, and the like to obtain a laminate. The adhesive is the same as that described in the section of the heat seal layer.

(2) Anchor layer Further, an anchor layer may be provided between the base material layer and the intermediate layer, or between the intermediate layer and the heat seal layer. By forming the anchor layer, even when the base material layer, the intermediate layer or the heat seal layer has poor adhesive strength, between the base material layer and the intermediate layer, or between the intermediate layer and the heat seal layer. Adhesion can be improved. The anchor layer may be appropriately selected depending on the material used for the base material layer, the intermediate layer, and the heat seal layer, and is not particularly limited. The anchor layer can be formed of, for example, a resin having good adhesiveness such as an olefin-based, acrylic-based, isocyanate-based, urethane-based, or ester-based adhesive.

B. Packaging Body The packaging body of the present disclosure includes a carrier tape having a plurality of storage portions for storing electronic parts, electronic parts stored in the storage parts, and the above-mentioned cover tape arranged so as to cover the storage parts. And.

The cover tape in the present disclosure has high antistatic properties even when a moist heat load is applied. Therefore, by using the package of the present disclosure, it is possible to suppress an increase in the peeling band voltage due to a moist heat load, and it is possible to improve the mounting efficiency. Further, the cover tape in the present disclosure has good sealing strength with respect to the carrier tape even when a moist heat load is applied. Therefore, even after a moist heat load, the cover tape can be prevented from being peeled off from the carrier tape and the electronic component as a content can be prevented from falling off before the cover tape is peeled off by the peeling device at the time of mounting the electronic component.

2 (a) and 2 (b) are a schematic plan view and a cross-sectional view showing an example of the package of the present disclosure. Note that FIGS. 2 (a) and 2 (b) have been described in the above section "A. Cover tape for packaging electronic components", and thus the description thereof will be omitted here.

Hereinafter, each configuration of the package of the present disclosure will be described.
1. 1. Cover Tape The cover tape in the present disclosure has been described in the above section "A. Cover tape for packaging electronic components", and thus the description thereof will be omitted here.

In the package of the present disclosure, the heat seal layer of the cover tape and the carrier tape are adhered at the heat seal portion. The heat-sealing portion can be arranged, for example, in a part of the portion where the heat-sealing layer of the cover tape comes into contact with the carrier tape. That is, the heat-sealing layer may have a heat-sealing portion and a non-heat-sealing portion. Thereby, the peelability of the cover tape with respect to the carrier tape can be improved.

2. Carrier Tape The carrier tape in the present disclosure is a member having a plurality of storage portions for storing electronic components.

The carrier tape may have a plurality of storage portions, and may be, for example, an embossed carrier tape (also referred to as embossed tape), a punch carrier tape (also referred to as punch tape), or a press carrier tape (press). Any of the tapes) can be used. Above all, the embossed carrier tape is preferably used from the viewpoint of cost, moldability, dimensional accuracy and the like.

Examples of the material of the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, and paper. In the present disclosure, the paper refers to a paper containing cellulose as a main component, and may further contain a resin component. The cover tape that is heat-sealed to the paper carrier tape tends to bleed out the antistatic agent contained in the heat-sealing layer. Therefore, if it is a paper carrier tape, the effect of the cover tape of the present disclosure is more remarkable.

The thickness of the carrier tape is appropriately selected according to the material of the carrier tape, the thickness of the electronic component, and the like. For example, the thickness of the carrier tape can be 150 μm or more and 1500 μm or less. If the thickness of the carrier tape is too thick, the moldability is deteriorated, and if the thickness of the carrier tape is too thin, the strength may be insufficient.

The carrier tape has a plurality of storage parts. The storage portions are usually arranged at predetermined intervals in the longitudinal direction of the carrier tape. The size, depth, pitch, etc. of the storage portion are appropriately adjusted according to the size, thickness, etc. of the electronic component.

As a method for forming a carrier tape having a storage portion, a general method for forming a carrier tape can be applied, and it is appropriately selected according to the type and material of the carrier tape. For example, press molding, vacuum forming, pressure forming, punching, compression and the like can be mentioned.

3. 3. Electronic components The electronic components used in the packaging of the present disclosure are not particularly limited, and include, for example, ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light emitting diodes), liquid crystals, piezoelectric element registers, filters, and crystal oscillators. Examples include children, crystal oscillators, connectors, switches, volumes, relays, and the like. The format of the IC is also not particularly limited.

4. Packaging The packaging of this disclosure is used for the storage and transportation of electronic components. Electronic components are stored and transported in their packaging for mounting. At the time of mounting, the cover tape is peeled off, the electronic components stored in the carrier tape storage portion are taken out, and the electronic components are mounted on a substrate or the like.

Note that the present disclosure is not limited to the above embodiment. The above-described embodiment is an example, and any object having substantially the same structure as the technical idea described in the claims of the present disclosure and exhibiting the same effect and effect is the present invention. Included in the technical scope of the disclosure.

Examples and comparative examples are shown below, and the present disclosure will be described in more detail.
(Example 1)
As a base material layer, a 25 μm-thick biaxially stretched polyethylene terephthalate film (FE2002 manufactured by Futamura Chemical Co., Ltd., hereinafter referred to as PET film) having corona treatment on both sides was prepared. Antistatic coating agent on one side of the PET film (containing PEDOT as a conductive polymer and containing aziridine as a curing agent, Aracoat AS601D / CL910 (mass ratio) = 10/1 Arakawa Chemical Co., Ltd. Concentration 3.0% Water / IPA = 3/7 solution) was applied by a Wet (before drying) weight of 3.3 g / m ^{2 and} dried at 80 ° C. for 1 minute to form an antistatic layer.

Urethane-based anchor coating agent (Takenate A-3075 / Takelac A-3210 (mass ratio) = 3/1 diluted 5% with ethyl acetate) is applied to the surface of the PET film opposite to the surface on which the antistatic layer is formed. Wet (before drying) was applied with a film thickness of 1 μm and dried at 80 ° C. for 1 minute to form an anchor layer. Next, a polyethylene resin (Novatec LC600A, manufactured by Japan Polyethylene Corporation) and an ethylene-vinyl acetate copolymer composition 1 (combined below) were subjected to melt extrusion processing using a cooling roll having a surface roughness Ra of 0.5 μm and Rz of 2.5 μm. They were laminated to a thickness of 15 μm to form an intermediate layer and a heat seal layer, respectively. As a result, a cover tape A1 having an antistatic layer (1 μm or less) / base material layer (25 μm) / anchor layer (1 μm or less) / intermediate layer (15 μm) / heat seal layer (15 μm) was produced.

Ethylene-vinyl acetate copolymer composition 1 contains ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) 70.4% by mass, low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 20. Mass%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 8 mass%, antistatic master batch (Rikemaster ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% antistatic agent)) 1.6 mass %including.

(Example 2)
Covered in the same manner as in Example 1 except that the ethylene-vinyl acetate copolymer composition 2 and a cooling roll having a surface roughness Ra of 0.8 μm Rz 7.5 μm were used instead of the ethylene-vinyl acetate copolymer composition 1. Tape A2 was produced.

The ethylene-vinyl acetate copolymer composition 2 is an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) 69.6% by mass, low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 20. Mass%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 8 mass%, antistatic master batch (Rikemaster ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% antistatic agent)) 2.4 mass %including.

(Example 3)
A cover tape A3 was produced in the same manner as in Example 1 except that the ethylene-vinyl acetate copolymer composition 3 was used instead of the ethylene-vinyl acetate copolymer composition 1.
The ethylene-vinyl acetate copolymer composition 3 contains 68% by mass of an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) and 20% by mass of low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.). , Modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) containing 12% by mass.

(Comparative Example 1)
A cover tape A4 was produced in the same manner as in Example 1 except that the ethylene-vinyl acetate copolymer composition 4 was used instead of the ethylene-vinyl acetate copolymer composition 1.
The ethylene-vinyl acetate copolymer composition 4 is an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) 66.8% by mass, low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 18 Weight%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 12% by mass, antistatic master batch (Rikemaster ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% antistatic agent)) 3.2 mass %including.

(Comparative Example 2)
A cover tape A5 was produced in the same manner as in Example 1 except that the ethylene-vinyl acetate copolymer composition 5 was used instead of the ethylene-vinyl acetate copolymer composition 1.
The ethylene-vinyl acetate copolymer composition 5 contains 66% by mass of an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) and 20% by mass of low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.). , 10% by mass of modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) and 4% by mass of antistatic master batch (Rikemaster ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% of antistatic agent)).

(Comparative Example 3)
As a base material layer, a 25 μm-thick biaxially stretched polyethylene terephthalate film (FE2002 manufactured by Futamura Chemical Co., Ltd., hereinafter referred to as PET film) having corona treatment on both sides was prepared. Antistatic coating agent on one side of the PET film (containing PEDOT as a conductive polymer and containing aziridine as a curing agent, Aracoat AS601D / CL910 (mass ratio) = 10/1 Arakawa Chemical Co., Ltd. Concentration 3.0% Water / IPA = 3/7 solution) was applied by a Wet (before drying) weight of 3.3 g / m ^{2 and} dried at 80 ° C. for 1 minute to form a first antistatic layer.

Urethane-based anchor coating agent (Takenate A-3075 / Takelac A-3210 (mass ratio) = 3/1, 5% with ethyl acetate) on the side of the PET film opposite to the side on which the first antistatic layer was formed. Dilution) was applied to a Wet (before drying) film thickness of 1 μm and dried at 80 ° C. for 1 minute to form an anchor layer. Next, a polyethylene resin (Novatec LC600A, manufactured by Japan Polyethylene Corporation) and an ethylene-vinyl acetate copolymer composition 6 (combined below) were mixed by melt extrusion using a cooling roll having a surface roughness Ra of 0.5 μm and Rz of 2.5 μm. They were laminated to a thickness of 15 μm to form an intermediate layer and a heat seal layer, respectively.

After that, Alacoat AS601D / CL910 (mass ratio) = 10/1 Arakawa Chemical Co., Ltd. concentration 3.0% water / IPA = 3/7 solution) was ^{applied by Wet (before drying) by weight at 3.3 g / m 2} and 80. A second antistatic layer was formed on the heat seal layer by drying at ° C. for 1 minute.

The ethylene-vinyl acetate copolymer composition 6 contains 70% by mass of an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) and 20% by mass of low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.). , Modified agent (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) containing 10% by mass.

(Comparative Example 4)
As a base material layer, a 25 μm-thick biaxially stretched polyethylene terephthalate film (FE2002 manufactured by Futamura Chemical Co., Ltd., hereinafter referred to as PET film) having corona treatment on both sides was prepared. Antistatic coating agent on one side of the PET film (containing PEDOT as a conductive polymer and containing aziridine as a curing agent, Aracoat AS601D / CL910 (mass ratio) = 10/1 Arakawa Chemical Co., Ltd. Concentration 0.9% Water / IPA = 3/7 solution) was applied by a Wet (before drying) weight of 3.3 g / m ^{2 and} dried at 80 ° C. for 1 minute to form an antistatic layer.

Urethane-based anchor coating agent (Takenate A-3075 / Takelac A-3210 (mass ratio) = 3/1 diluted 5% with ethyl acetate) is applied to the surface of the PET film opposite to the surface on which the antistatic layer is formed. It was applied with a Wet film thickness of 1 μm and dried at 80 ° C. for 1 minute to form an anchor layer. Next, a polyethylene resin (Novatec LC600A, manufactured by Japan Polyethylene Corporation) and an ethylene-vinyl acetate copolymer composition 7 (combined below) were subjected to melt extrusion processing using a cooling roll having a surface roughness Ra of 0.5 μm and Rz of 2.5 μm. They were laminated to a thickness of 15 μm to form an intermediate layer and a heat seal layer, respectively.

The ethylene-vinyl acetate copolymer composition 7 contains an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) 69.6% by mass, low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 20. Mass%, modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) 8 mass%, antistatic master batch (Rikemaster ELB-347, manufactured by Riken Vitamin Co., Ltd. (containing 25% antistatic agent)) 2.4 mass %including.

(Comparative Example 5)
As a base material layer, a 25 μm-thick biaxially stretched polyethylene terephthalate film (FE2002 manufactured by Futamura Chemical Co., Ltd., hereinafter referred to as PET film) having corona treatment on both sides was prepared. Apply an antistatic coating agent (Nymine S-202 NOF Corporation 2.0% IPA solution) to one side of the PET film by Wet (before drying) weight of 3.3 g / m ^{2 and} apply at 80 ° C. for 1 minute. By drying, an antistatic layer was formed. A urethane-based anchor coating agent (Takenate A-3075 / Takelac A-3210 (mass ratio) = 3/1 diluted with 5% ethyl acetate) is applied to the surface of the PET film opposite to the surface on which the antistatic layer is formed. It was applied with a Wet film thickness of 1 μm and dried at 80 ° C. for 1 minute to form an anchor layer.

Next, a polyethylene resin (Novatec LC600A, manufactured by Japan Polyethylene Corporation) and an ethylene-vinyl acetate copolymer composition 8 (combined below) were mixed by melt extrusion using a cooling roll having a surface roughness Ra of 0.5 μm and Rz of 2.5 μm. They were laminated to a thickness of 15 μm to form an intermediate layer and a heat seal layer, respectively.

The ethylene-vinyl acetate copolymer composition 8 contains 73% by mass of an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) and low-density polyethylene (Sumicasen L705, manufactured by Sumitomo Chemical Co., Ltd.) 18.2. Contains 8% by mass of a modifier (Arcon P-125, manufactured by Arakawa Chemical Co., Ltd.) and 0.8% by mass of an antioxidant (Perectron PVL).

[Measurement of surface resistivity (before moist heat load)]
The surface resistivity of the surface of the cover tape manufactured above on which the antistatic layer is arranged (surface resistivity of the antistatic layer) and the surface resistivity of the surface on which the heat seal layer is arranged () The surface resistivity of the heat seal layer) was measured by the method described in "A. Cover tape for packaging electronic parts I. Antistatic layer" above. The results are shown in Table 1.

[Packaging]
A package sample was prepared using the above cover tape. While continuously arranging the electronic components in the storage part of the paper carrier tape, the paper carrier tape and the cover tape are sealed using a taping machine (NST-35 Nitto Kogyo) under the following conditions, and the core is about 40 m. A roll-shaped package sample was obtained by winding on a reel having a diameter of 3 inches.

(Taping conditions)
-Paper carrier tape: Hokuetsu Corporation 0.31 mm thick 8 mm width Virgin paper-Paper carrier tape Feed hole pitch: 2 mm
・ Taping temperature 180 ℃
・ Taping speed 3500 tact ・ Seal width 0.6 × 2mm
・ Taping trowel size 0.6mm x 2 wires ・ Taping trowel length (seal length at 1 tact) 8 ± 1mm
・ Electronic components 0402 size capacitors

[Measurement of seal strength (before wet heat load)]
The roll-shaped package sample is left in a state where the reel is tilted in a 25 ° C. and 40% RH environment for 24 hours, the taping package is taken out from the reel, and the sealing strength (before moist heat load) is determined by the above-mentioned "A. Electronics. Cover tape for parts packaging III. Heat seal layer (1) Seal strength ”measured by the method described. The results are shown in Table 1.

[Moist heat load]
The roll-shaped package sample prepared above was stored in a state where the reel was laid down in a 40 ° C. and 95% RH environment for 100 hours. Then, it was left for 24 hours in the environment of 25 ° C. and 40% RH, and various evaluations described later were performed. The results are shown in Table 1.

[Measurement of seal strength (after moist heat load)]
Roll-shaped packaging after moist heat loading Take out the taping packaging from the sample reel and set the sealing strength (after moist heat loading) to the above "A. Cover tape for packaging electronic parts III. Heat seal layer (1) Seal strength". It was measured by the method described. The results are shown in Table 1.

[Measurement of surface resistivity (after moist heat load)]
Take out the taping package from the reel of the roll-shaped package sample after the moist heat load, peel off the cover tape from the carrier tape, and the surface resistivity of the surface of the cover tape on the side where the antistatic layer is arranged (of the antistatic layer). Surface resistivity) and the surface resistivity of the surface on the side where the heat seal layer is arranged (surface resistivity of the heat seal layer) are added to the above "A. Cover tape for packaging electronic parts I. Antistatic layer". It was measured by the method described. The results are shown in Table 1.

[Measurement of peeling band voltage (after moist heat load)]
The peeling band voltage when the taping package is taken out from the reel of the roll-shaped package sample after the moist heat load and the cover tape is peeled from the carrier tape is set to the above-mentioned "A. Cover tape for electronic parts packaging IV. Cover tape (1). ) Measured by the method described in "Peeling band voltage".
The results are shown in Table 1.

[Chip mounting evaluation]
The cover tape is peeled off from the roll-shaped package after the moist heat load using a mounting machine (manufactured by NXT III FUJI, machine speed: standard, peeling method: just before adsorption), and the electronic components stored in the storage section. Was implemented. 2000 chips were evaluated in an environment of 25 ± 3 ° C. and 30 ± 5% Rhes. The results of the implementation success rate are shown in Table 1.

The cover tape of the present disclosure has good sealing strength against the carrier tape and has high antistatic performance even when a moist heat load is applied (Examples 1 to 3). On the other hand, the cover tapes of Comparative Examples 1 to 3 had a high content of the antistatic agent in the heat seal layer or the second antistatic layer, so that the seal strength after the wet heat load was lowered. It was presumed that this is because when a moist heat load is applied, the glue component of the paper carrier tape absorbs moisture, and the antistatic agent contained in the seal layer bleeds out, impairing the sealing property.

Further, the cover tape of Comparative Example 4 has a low content of antistatic agent in the antistatic layer, and the cover tape of Comparative Example 5 does not have sufficient antistatic performance of the antistatic agent contained in the antistatic layer. In each case, the surface resistivity after the moist heat load became high, and the peeling zone voltage became high.

1 ... Cover tape 2 ... Base material layer 3 ... Heat seal layer 4 ... Antistatic layer 5 ... Intermediate layer 10 ... Package 11 ... Carrier tape 12 ... Storage 13 ... Electronic components

Claims (3)

1. Base layer and
   A heat seal layer arranged on one surface side of the base material layer and
   An antistatic layer arranged on a surface side of the base material layer opposite to the surface on the heat seal layer side,
   It is a cover tape for packaging electronic parts with
   The surface resistivity measured from the antistatic layer side of the cover tape after a moist heat load, which is stored for 24 hours in an environment of 60 ° C. and 95% RH in the state of a package using a paper carrier tape, is 1 × 10 ^10. Ω / □ or less,
   The surface tack force measured from the heat seal layer side of the cover tape after a moist heat load, which is stored in a package using a paper carrier tape in an environment of 60 ° C. and 95% RH for 24 hours, is 5 gf or less.
   Cover tape for packaging electronic components.
2. The surface tack force measured from the heat seal layer side of the cover tape after the moist heat load is 80% or less of the surface tack force measured from the heat seal layer side of the cover tape before the moist heat load. , The cover tape for packaging electronic components according to claim 1.
3. A carrier tape with multiple storage units for storing electronic components,
   Electronic components stored in the storage unit and
   The cover tape for packaging electronic components according to claim 1 or 2, which is arranged so as to cover the storage portion.
   A packaging body.

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