JPWO2021187521A1 - - Google Patents

Info

Publication number
JPWO2021187521A1
JPWO2021187521A1 JP2022508407A JP2022508407A JPWO2021187521A1 JP WO2021187521 A1 JPWO2021187521 A1 JP WO2021187521A1 JP 2022508407 A JP2022508407 A JP 2022508407A JP 2022508407 A JP2022508407 A JP 2022508407A JP WO2021187521 A1 JPWO2021187521 A1 JP WO2021187521A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022508407A
Other languages
Japanese (ja)
Other versions
JP7197052B2 (en
JPWO2021187521A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021187521A1 publication Critical patent/JPWO2021187521A1/ja
Publication of JPWO2021187521A5 publication Critical patent/JPWO2021187521A5/ja
Application granted granted Critical
Publication of JP7197052B2 publication Critical patent/JP7197052B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/34—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents and having several recesses to accommodate a series of articles or quantities of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)
JP2022508407A 2020-03-17 2021-03-17 Electronic component packaging cover tape and package Active JP7197052B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020047026 2020-03-17
JP2020047026A JP6950774B1 (en) 2020-03-17 2020-03-17 Cover tape and packaging for electronic component packaging
PCT/JP2021/010792 WO2021187521A1 (en) 2020-03-17 2021-03-17 Cover tape for packaging electronic component and package

Publications (3)

Publication Number Publication Date
JPWO2021187521A1 true JPWO2021187521A1 (en) 2021-09-23
JPWO2021187521A5 JPWO2021187521A5 (en) 2022-04-14
JP7197052B2 JP7197052B2 (en) 2022-12-27

Family

ID=77771603

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020047026A Ceased JP6950774B1 (en) 2020-03-17 2020-03-17 Cover tape and packaging for electronic component packaging
JP2022508407A Active JP7197052B2 (en) 2020-03-17 2021-03-17 Electronic component packaging cover tape and package

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2020047026A Ceased JP6950774B1 (en) 2020-03-17 2020-03-17 Cover tape and packaging for electronic component packaging

Country Status (4)

Country Link
JP (2) JP6950774B1 (en)
CN (1) CN115298110B (en)
TW (1) TW202146305A (en)
WO (1) WO2021187521A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024185677A1 (en) * 2023-03-08 2024-09-12 住友ベークライト株式会社 Cover tape, electronic component packaging body, and method for producing cover tape
JP2024134232A (en) * 2023-03-20 2024-10-03 大日本印刷株式会社 Cover tape for packaging electronic components and packaging body

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010104010A1 (en) * 2009-03-13 2010-09-16 電気化学工業株式会社 Cover film
WO2012173119A1 (en) * 2011-06-14 2012-12-20 電気化学工業株式会社 Cover tape
JP2016182989A (en) * 2015-03-27 2016-10-20 住友ベークライト株式会社 Electronic component packaging cover tape, electronic component packaging material and electronic component packaging body
JP2019043032A (en) * 2017-09-01 2019-03-22 東ソー株式会社 Easily-peelable film

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280411A (en) * 1999-03-31 2000-10-10 Dainippon Printing Co Ltd Laminated plastic film, transparent conductive cover tape and package
JP3766616B2 (en) * 2001-07-30 2006-04-12 三光化学工業株式会社 Resin composition for antistatic coating, method for producing the same, and molded article using the same
JP5419329B2 (en) * 2007-05-08 2014-02-19 日東電工株式会社 Laminated tape for packaging materials
WO2013054867A1 (en) * 2011-10-14 2013-04-18 電気化学工業株式会社 Cover tape
MY181505A (en) * 2013-07-09 2020-12-24 Sumitomo Bakelite Co Cover tape for packaging electronic part
JP6322036B2 (en) * 2014-04-10 2018-05-09 デンカ株式会社 Cover film
KR101756623B1 (en) * 2014-11-12 2017-07-10 스미또모 베이크라이트 가부시키가이샤 Cover tape for electronic part package, packaging material for electronic part package, and electronic part package
JP2018118766A (en) * 2017-01-26 2018-08-02 住友ベークライト株式会社 Cover tape and packaging body for electronic components
JP2018127256A (en) * 2017-02-09 2018-08-16 住友ベークライト株式会社 Cover tape and electronic component packaging body
JP7126841B2 (en) * 2017-09-29 2022-08-29 大日本印刷株式会社 Transparent double-sided conductive cover tape and resin composition for antistatic layer
JP6638751B2 (en) * 2018-03-07 2020-01-29 住友ベークライト株式会社 Cover tape and electronic component package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010104010A1 (en) * 2009-03-13 2010-09-16 電気化学工業株式会社 Cover film
WO2012173119A1 (en) * 2011-06-14 2012-12-20 電気化学工業株式会社 Cover tape
JP2016182989A (en) * 2015-03-27 2016-10-20 住友ベークライト株式会社 Electronic component packaging cover tape, electronic component packaging material and electronic component packaging body
JP2019043032A (en) * 2017-09-01 2019-03-22 東ソー株式会社 Easily-peelable film

Also Published As

Publication number Publication date
TW202146305A (en) 2021-12-16
JP6950774B1 (en) 2021-10-13
JP2021176674A (en) 2021-11-11
CN115298110A (en) 2022-11-04
JP7197052B2 (en) 2022-12-27
WO2021187521A1 (en) 2021-09-23
CN115298110B (en) 2024-02-02

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