WO2021177426A1 - コネクタ装置 - Google Patents

コネクタ装置 Download PDF

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Publication number
WO2021177426A1
WO2021177426A1 PCT/JP2021/008562 JP2021008562W WO2021177426A1 WO 2021177426 A1 WO2021177426 A1 WO 2021177426A1 JP 2021008562 W JP2021008562 W JP 2021008562W WO 2021177426 A1 WO2021177426 A1 WO 2021177426A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
protrusion
mold resin
resin portion
connector device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/008562
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
卓也 山下
平林　辰雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to US17/802,706 priority Critical patent/US12609503B2/en
Priority to CN202180016995.9A priority patent/CN115152098A/zh
Publication of WO2021177426A1 publication Critical patent/WO2021177426A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic welding, or swaged together
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the present disclosure relates to a connector device.
  • This application claims priority based on Japanese Patent Application No. 2020-039412 of the Japanese application dated March 6, 2020, and incorporates all the contents described in the Japanese application.
  • Patent Document 1 discloses an electronic device in which a circuit board and a part of a connector are housed in a housing.
  • the housing is configured by assembling the case and the cover.
  • the sealing material is interposed between the case and the cover, and makes the internal space of the housing a waterproof space.
  • the electronic device will be referred to as a connector device.
  • the connector device includes a circuit board, a connector, and a mold resin portion
  • the circuit board includes a conductor path
  • the connector is a tubular housing made of resin and the housing.
  • a terminal that protrudes outward in the axial direction of the housing from the inside and is connected to the conductor path is provided
  • the mold resin portion includes the circuit board, the terminal located outside the housing, and a part of the housing.
  • the housing is provided with a protrusion provided over the entire circumference so as to be in contact with the mold resin portion, and the protrusion is formed by welding the constituent materials of the housing and the mold resin portion to each other. It is provided with a welded portion.
  • FIG. 1 is a perspective view showing an outline of a connector device according to an embodiment.
  • FIG. 2 is a side view showing an outline of the connector device according to the embodiment.
  • FIG. 3 is a cross-sectional view taken along the line (III)-(III) of FIG.
  • FIG. 4 is a partially enlarged cross-sectional view showing the protrusion and the vicinity of the protrusion shown in FIG. 3 in an enlarged manner.
  • FIG. 5 is a cross-sectional view showing another example of the protrusion provided in the connector device according to the embodiment.
  • FIG. 6 is a cross-sectional view showing still another example of the protrusion provided in the connector device according to the embodiment.
  • FIG. 7 is a perspective view showing a test piece used in a shear tensile test for evaluating adhesive performance.
  • the connector device described in Patent Document 1 is large in size because it includes a housing. Further, the connector device described in Patent Document 1 secures waterproof performance by interposing a sealing material between the case and the cover constituting the housing, and the number of parts is large, which complicates the manufacturing work. easy.
  • One of the purposes of the present disclosure is to provide a connector device that is compact, easy to manufacture, and has excellent waterproof performance.
  • the connector device according to the present disclosure is small in size, easy to manufacture, and has excellent waterproof performance.
  • the connector device includes a circuit board, a connector, and a mold resin portion, the circuit board includes a conductor path, and the connector has a tubular shape made of resin.
  • a housing and terminals projecting from the inside of the housing to the outside in the axial direction of the housing and being connected to the conductor path are provided, and the mold resin portion includes the circuit board and the terminals located outside the housing.
  • a part of the housing is covered together, and the housing is provided with a protrusion provided over the entire circumference so as to come into contact with the mold resin portion, and the protrusion is provided on each other of the housing and the mold resin portion. It is provided with a welded portion formed by welding the constituent materials.
  • the connector device of the present disclosure includes a welded portion on a protrusion provided over the entire circumference of the connector housing. Therefore, the connector device of the present disclosure has excellent adhesion between the housing and the molded resin portion over the entire circumference of the housing. Therefore, the connector device of the present disclosure can prevent liquids such as water from entering through the gap between the housing and the mold resin portion. By suppressing the infiltration of the liquid, it is possible to prevent the liquid from adhering to the conductive member such as the circuit board or the terminal covered with the mold resin portion.
  • the welded part is typically composed of laser welding.
  • laser welding the housing is irradiated with a laser through the mold resin portion, and heat is generated at the interface between the housing and the mold resin portion, and the heat heats the constituent materials of the housing and the mold resin portion.
  • the mold resin portion transmits the laser, and the housing absorbs the laser.
  • the housing that has absorbed the laser generates heat, and the heat generated melts the constituent materials of the housing.
  • the heat of fusion in the housing is transferred to the mold resin portion to generate heat in the mold resin portion, and the heat generated causes the mold resin portion to melt.
  • the welded portion is composed of the constituent material of the molten housing and the constituent material of the mold resin portion.
  • the connector device of the present disclosure includes a welded portion on a protruding portion. That is, in the connector device of the present disclosure, a welded portion is formed by generating heat by a laser at a protruding portion. By generating heat at the protrusions, the heat is likely to be concentrated on the protrusions, and a strong welded portion is likely to be formed. From the above, the connector device of the present disclosure is excellent in waterproof performance.
  • the connector device of the present disclosure In the connector device of the present disclosure, conductive members such as circuit boards and terminals are covered with a molded resin portion. Therefore, the connector device of the present disclosure does not need to separately include a housing for accommodating the conductive member. Further, since the connector device of the present disclosure is excellent in waterproof performance due to the welded portion as described above, it is not necessary to separately provide a sealing material. Therefore, the connector device of the present disclosure has a small number of parts, can omit the work of assembling the housing and the work of arranging the sealing material, and is excellent in manufacturability. From the above, the connector device of the present disclosure is small and easy to manufacture.
  • the housing is provided over the entire circumference so as to be in contact with the mold resin portion, and is provided with a plurality of recesses parallel to each other in the axial direction of the housing. Can be mentioned as a form forming the side wall of the adjacent recess.
  • the recess is filled with a mold resin portion. Therefore, in addition to the mold resin portion filled in the recess serving as an anchor, the contact area between the housing and the mold resin portion can be increased as compared with the case where the protrusion has a uniform height and does not have the recess. Therefore, in the above form, the adhesion between the housing and the mold resin portion can be easily improved.
  • the protrusion is formed by providing the recess, the amount of protrusion of the protrusion protruding from the outer surface of the housing can be reduced as compared with the case where there is no recess. Therefore, in the above embodiment, the thickness of the molded resin portion from the outer surface of the housing can be easily reduced, and the size can be easily reduced.
  • the protrusions are provided over the entire circumference of the housing. That is, the protrusions are provided in an annular shape.
  • the terminal is inserted and arranged on the inner peripheral side of the annular protrusion.
  • the protruding portion of the terminal from the housing is close to the protruding portion.
  • the welded portion is formed by welding the constituent materials of the housing and the mold resin portion to each other by heat.
  • heat can be concentrated on the protrusion by providing the protrusion with a welded portion. Therefore, even when the protruding portion of the terminal from the housing is close to the protruding portion, it is possible to suppress heat transfer to the terminal side.
  • the welded portion when the welded portion is formed, it is possible to prevent the terminal and the circuit board connected to the terminal from being adversely affected. Further, by providing the welded portion on the protrusion, it is easy to secure a certain long distance between the terminal and the welded portion as compared with the case where the protrusion is not provided. When the protrusion is not provided, it is conceivable to increase the thickness of the housing covering the terminal in order to secure a certain long distance between the terminal and the welded portion. However, in this case, the number of components of the housing increases.
  • the welded portion is configured by generating heat from the laser at the protruding portion.
  • the tip surface of the protrusion it is easy to stably secure the surface of the protrusion that receives the laser.
  • the protrusion has the above-mentioned tip surface, it is easy to provide a region where heat is generated on the tip side of the protrusion, and it is easy to suppress heat from being transferred to the base end side of the protrusion.
  • the axial direction of the housing is the longitudinal direction of the terminals located inside the housing.
  • the cross-sectional shape of the protrusion may be a quadrangle.
  • the mold resin part is configured along the outer shape of the housing. However, if the housing has a portion having a complicated shape, a gap may be formed between the molded resin portion and the portion.
  • the shape of the protrusion is simple. Therefore, in the above form, it is easy to improve the adhesion between the protrusion and the mold resin portion. In addition, the above-mentioned form makes it easy to manufacture a protrusion.
  • the welded portion is configured by generating heat from the laser at the protruding portion.
  • the maximum width of the protrusion satisfies the above range, the heat generated by the laser is likely to be concentrated on the protrusion.
  • the welded portion is configured by generating heat from the laser at the protruding portion.
  • the maximum height of the protrusions satisfies the above range, the heat diffusion by the laser tends to be constant, and the melting of the protrusions tends to be constant.
  • the transmittance of the mold resin portion is 40% or more, and the transmittance of the mold resin portion is the ratio of the amount of light a1 to the amount of light b1 (b1 / a1) ⁇ 100.
  • the light amount a1 is the light amount of a laser having a wavelength of 940 nm
  • the light amount b1 is the light amount transmitted by the laser through a test piece having a thickness of 2 mm made of a constituent material of the mold resin portion. Be done.
  • the welded portion is formed by laser welding.
  • the transmittance of the mold resin portion is 40% or more, the laser is less likely to be absorbed by the mold resin portion and easily reaches the surface of the housing. Therefore, in the above-mentioned form, heat by the laser is easily generated at the boundary surface between the housing and the mold resin portion, and the welded portion is easily formed.
  • the transmittance of the housing is 10% or less, and the transmittance of the housing is the ratio of the amount of light a2 to the amount of light b2 (b2 / a2) ⁇ 100.
  • the amount of light a2 is the amount of light of a laser having a wavelength of 940 nm
  • the amount of light b2 is the amount of light transmitted by the laser through a test piece having a thickness of 2 mm made of a constituent material of the housing.
  • the welded portion is formed by laser welding.
  • the transmittance of the housing is 10% or less, the laser is easily absorbed by the housing. Therefore, in the above-mentioned form, heat by the laser is easily generated at the boundary surface between the housing and the mold resin portion, and the welded portion is easily formed.
  • the mold resin portion may include a polyamide resin or polyester.
  • Polyamide resin has excellent mechanical strength and the like. Therefore, the mold resin portion containing the polyamide resin can easily mechanically protect the member covered with the mold resin portion. Polyester is excellent in electrical insulation, water resistance, and the like. Therefore, the mold resin portion containing polyester can easily electrically and chemically protect the member covered with the mold resin portion.
  • the housing includes a form containing polyester.
  • the above form makes it easy to electrically and chemically protect terminals and the like.
  • the mold resin portion and the housing contain the same type of resin, the solubility parameter between the mold resin portion and the housing can be easily brought close to each other. Therefore, in the above form, the mold resin portion and the housing have good compatibility with each other. Therefore, the above form is more excellent in waterproof performance. Further, in the above form, since the welded portion contains the same type of resin, the strength of the welded portion itself tends to increase. Therefore, in the above form, the adhesion between the mold resin portion and the housing is higher.
  • the mold resin portion has a form having a surface in contact with the atmosphere.
  • the surface of the mold resin portion is located on the outermost layer. That is, the above-mentioned form does not include a housing for accommodating a circuit board or the like. Therefore, the above form is easy to miniaturize.
  • the mold resin portion may be in the form of an injection molded body.
  • the injection molded body can be manufactured by injection molding.
  • injection molding the constituent material of the mold resin portion is filled in the molding mold while applying pressure to cover the circuit board, housing, and the like. Therefore, in injection molding, it is easier to fill every corner of the molding die with the constituent material of the mold resin portion as compared with casting molding. Therefore, in the above embodiment, it is difficult for a gap to be formed between the circuit board or housing and the mold resin portion. Since it is difficult to form a gap, it is difficult for water vapor in the gap to condense and generate water droplets. Further, since the above-mentioned form is manufactured by injection molding, the degree of freedom in the shape of the mold resin portion is high.
  • the above form can be used for a long period of time due to the high waterproof performance between the housing and the mold resin part. Therefore, the above form can be suitably used for the control unit. Moreover, since the above-mentioned form is small, it can be suitably used for a control unit.
  • FIG. 3 is a cut surface cut in a plane parallel to the longitudinal direction of the terminal provided in the connector in the connector device of the embodiment.
  • the longitudinal direction of the terminal is mainly the longitudinal direction of the terminal located inside the housing, and is the direction parallel to the axial direction of the tubular housing provided in the connector.
  • the welded portion is shown by cross-hatching.
  • the same reference numerals in the figures indicate the same names.
  • the connector device 1 of the embodiment includes a circuit board 2 and a connector 3 as shown in FIGS. 1 to 3.
  • the circuit board 2 includes a conductor path 20.
  • the connector 3 includes a housing 31 and terminals 32.
  • the housing 31 has a tubular shape made of resin.
  • the terminal 32 projects outward in the axial direction of the housing 31 and is connected to the conductor path 20.
  • One of the features of the connector device 1 of the embodiment is that it includes a circuit board 2, a terminal 32 located outside the housing 31, and a mold resin portion 4 that collectively covers a part of the housing 31.
  • the connector device 1 of the embodiment is characterized in that it includes a protrusion 311 provided over the entire circumference of the housing 31 in contact with the mold resin portion 4, and the protrusion 311 is provided with a welding portion 5.
  • a protrusion 311 provided over the entire circumference of the housing 31 in contact with the mold resin portion 4, and the protrusion 311 is provided with a welding portion 5.
  • the circuit board 2 is a plate-shaped member on which electronic components (not shown) such as a semiconductor relay and a connector 3 and the like are mounted.
  • a printed circuit board can be used as the circuit board 2.
  • the circuit board 2 includes a conductor path 20.
  • the conductor path 20 refers to a portion of the conductive member constituting the electric circuit of the circuit board 2 that is exposed on the surface.
  • the conductor path 20 is, for example, a solder that connects the conductive pattern 21 of the circuit board 2, the terminal of the electronic component mounted on the circuit board 2 (not shown), the terminal of the electronic component, the terminal 32 of the connector 3, and the conductive pattern 21. 22 etc. are included.
  • the circuit board 2 is embedded in the mold resin portion 4 described later.
  • the connector 3 is a connecting member to which a mating connector (not shown) is connected.
  • the mating connector is connected to an in-vehicle electrical component or the like via a wire harness.
  • the connector 3 is mounted on the circuit board 2.
  • the connector 3 includes a housing 31 and terminals 32.
  • the connector 3 further includes a mounting portion 33 and a fixing member 34 (FIG. 2).
  • the connectors 3 are arranged so as to have a distance from the extension surface of the circuit board 2.
  • the connector 3 shown in FIGS. 1 to 3 is arranged above the circuit board 2.
  • the housing 31 is a tubular member into which the mating connector is fitted.
  • the housing 31 has a bottomed tubular shape in which the side on which the mating connector is fitted is open and the side opposite to the open side is closed.
  • a terminal 32 which will be described later, penetrates the closed surface. That is, the terminal 32 is pulled out from the inside to the outside of the housing 31 through the closed surface.
  • this closed surface may be referred to as a closed end surface.
  • the terminal 32 located on the outside of the housing 31 projects from the closed end face.
  • the closed end face and the vicinity of the closed end face in the housing 31 are embedded in the mold resin portion 4 described later over the entire circumference.
  • the housing 31 is provided with a protrusion 311 on the outer periphery near the closed end surface.
  • the protrusion 311 is also embedded in the mold resin portion 4.
  • the protrusion 311 is provided over the entire circumference of the housing 31.
  • the protruding portion 311 includes a welding portion 5 described later.
  • the welded portion 5 is typically formed by laser welding. Although the details will be described later, the welded portion 5 is formed by welding the constituent materials of the housing 31 and the mold resin portion 4 to each other by the heat generated by the laser.
  • the protrusion 311 has a function of intensively absorbing the heat of the laser when forming the welding portion 5. The shape and dimensions of the protrusion 311 do not substantially change before and after laser welding.
  • the housing 31 of this example is provided over the entire circumference and includes a plurality of recesses 312 arranged in parallel in the axial direction of the housing 31.
  • the protrusion 311 is provided so as to form a side wall of adjacent recesses 312. In this example, two recesses 312 are provided.
  • the shape of the protrusion 311 that can intensively absorb the heat of the laser can be appropriately selected.
  • the protrusion 311 preferably includes a tip surface 311s (FIG. 4) parallel to the axial direction of the housing 31.
  • the axial direction of the housing 31 is equal to the longitudinal direction of the terminal 32 (FIG. 3) located inside the housing 31.
  • the protrusion 311 is provided with the tip surface 311s, the region where the heat of the laser is generated can be easily provided on the tip side of the protrusion 311 and the heat can be easily suppressed from being transmitted to the base end side of the protrusion 311.
  • the cross-sectional shape of the protrusion 311 is not particularly limited. As shown in FIG. 4, the cross-sectional shape may be a quadrangle.
  • the cross-sectional shape of the protrusion 311 is a shape on a cut surface cut in a direction orthogonal to the direction in which the protrusion 311 extends.
  • the direction in which the protrusion 311 protrudes is the radial direction of the housing 31.
  • the form in which the protrusion 311 extends in the circumferential direction of the housing 31 may be a configuration provided along the circumferential direction of the housing 31, or a curved configuration such as a corrugated structure deviating from the circumferential direction of the housing 31.
  • the shape of the protrusion 311 is simple, and the adhesion between the protrusion 311 and the mold resin portion 4 can be easily improved. Further, when the cross-sectional shape of the protrusion 311 is quadrangular, it is easy to manufacture the protrusion 311.
  • the maximum width W (FIG. 4) of the protrusion 311 is preferably 1 mm or more and less than 2 mm.
  • the maximum width W of the protrusion 311 is 1 mm or more, it is easy to secure a surface for receiving the laser, and the heat of the laser is easily concentrated on the protrusion 311.
  • the maximum width W of the protrusion 311 is less than 2 mm, the heat of the laser tends to concentrate on the protrusion 311, although it depends on the intensity distribution of the laser.
  • the maximum width W of the protrusion 311 is further 1 mm or more and 1.7 mm or less, particularly 1 mm or more and 1.5 mm or less.
  • the maximum height H (FIG. 4) of the protrusion 311 is preferably 0.2 mm or more and 0.5 mm or less.
  • the maximum height H of the protrusion 311 is preferably 0.2 mm or more and 0.5 mm or less.
  • the maximum height H of the protrusion 311 is 0.2 mm or more, it is easy to provide a region where laser heat is generated on the tip side of the protrusion 311 and suppress heat transfer to the base end side of the protrusion 311. Easy to do.
  • the maximum height H of the protrusion 311 is 0.5 mm or less, the heat diffusion by the laser tends to be constant, and the melting of the constituent material in the protrusion 311 tends to be constant.
  • the maximum height H of the protrusion 311 is further 0.2 mm or more and 0.4 mm or less, particularly 0.2 mm or more and 0.3 mm or less.
  • the cross-sectional shape of the protrusion 311 may be triangular. Further, as shown in FIG. 6, the cross-sectional shape of the protrusion 311 may be a semicircle in which the tip surface 311s is formed of an arc surface. Further, the cross-sectional shape of the protrusion 311 may be trapezoidal (not shown). Further, the cross-sectional shape of the protrusion 311 may be an inverted trapezoid whose width narrows from the tip end side to the base end side (not shown).
  • the protrusion 311 is provided so as to intersect the terminal 32 located inside the housing 31.
  • the protrusion 311 is provided over the entire circumference of the housing 31. That is, the protrusion 311 is provided in an annular shape. Therefore, the terminal 32 located inside the housing 31 is inserted and arranged on the inner peripheral side of the annular protrusion 311.
  • the closed end surface, which is the protruding portion of the terminal 32 from the housing 31 is close to the protruding portion 311. Even in this case, it is possible to prevent the heat of the laser from adversely affecting the terminal 32 and the circuit board 2 connected to the terminal 32 by concentrating the heat on the protrusion 311.
  • the recess 312 located on the closed end face side of the housing 31 is composed of a notch connected to the closed end face.
  • the closed end face side of the housing 31 is the right side of FIG.
  • the recess 312 located on the opening side of the housing 31 is composed of grooves having side walls on both sides.
  • the opening side of the housing 31 is the left side of FIG.
  • the depth of the recess 312 in this example is the same as the maximum height of the protrusion 311.
  • the amount of protrusion of the protrusion 311 protruding from the outer surface of the housing 31 can be reduced as compared with the case where the recess 312 is not provided.
  • the amount of protrusion 311 from the outer surface of the housing 31 is small, the thickness of the mold resin portion 4 from the outer surface of the housing 31 can be easily reduced, and the size can be easily reduced.
  • the recess 312 is filled with the mold resin portion 4. Therefore, in addition to the mold resin portion 4 filled in the concave portion 312 serving as an anchor, the housing 31 and the mold resin portion 4 are provided with each other as compared with the case where the protrusion 311 has a uniform height and does not have the concave portion 312. The contact area can be increased. Therefore, by providing the recess 312, the adhesion between the housing 31 and the mold resin portion 4 is likely to be improved.
  • the number of recesses 312 may be three or more.
  • the two protrusions 311 are provided in parallel in the axial direction of the housing 31.
  • the recess 312 may be one.
  • one of the side walls of the protrusion 311 is formed by the side wall of the recess 312, and the other is formed by the closed end surface of the housing 31.
  • the recess 312 may not be present.
  • the protrusion 311 protrudes from the outer surface of the housing 31.
  • the transmittance of the housing 31 is preferably low.
  • the transmittance of the housing 31 is the ratio (b2 / a2) ⁇ 100 of the amount of light a2 of the laser having a wavelength of 940 nm and the amount of light b2 transmitted by the laser through the test piece having a thickness of 2 mm made of the constituent material of the housing 31. ..
  • the housing 31 having a low transmittance easily absorbs the laser. That is, the housing 31 having a low transmittance is easily melted by the laser. Therefore, the welded portion 5 described later is likely to be formed.
  • the transmittance of the housing 31 is preferably 10% or less, for example.
  • the transmittance of the housing 31 is further preferably 7% or less, particularly preferably 5% or less.
  • the color of the housing 31 is preferably opaque black, gray, or the like. These colors easily absorb the laser.
  • the housing 31 preferably contains, for example, polyester. Polyester is excellent in electrical insulation, water resistance, and the like. Therefore, the housing 31 containing polyester can easily mechanically, electrically, and chemically protect the terminals 32 and the like inside the housing 31. Typical examples of polyester include polybutylene terephthalate (PBT).
  • the housing 31 preferably further contains a colorant. Examples of the colorant include those having a low transmittance of the housing 31. Examples of the colorant include carbon black. By including carbon black, the color of the housing 31 tends to be black.
  • the terminal 32 electrically connects the mating connector and the circuit board 2.
  • the terminal 32 penetrates the closed end surface of the housing 31 and is pulled out from the inside to the outside of the housing 31.
  • the portion of the terminal 32 located inside the housing 31 is provided along the axial direction of the housing 31.
  • One end of the terminal 32 located inside the housing 31 is electrically connected to the mating connector.
  • the portion of the terminal 32 located outside the housing 31 is bent so as to extend toward the circuit board 2.
  • the terminal 32 of this example is composed of a metal wire bent at a substantially right angle.
  • the other end of the terminal 32 located on the outside of the housing 31 is electrically connected to the conductive pattern 21 of the circuit board 2.
  • a solder 22 can be used for electrical connection between the other end of the terminal 32 and the conductive pattern 21.
  • the terminal 32 may be a press-fit terminal.
  • the terminal 32 is electrically connected to the conductive pattern 21 by press fitting. Therefore, when the terminal 32 is a press-fit terminal, the solder 22 can be omitted.
  • the other end of the terminal 32 penetrates the circuit board 2.
  • the terminal 32 located on the outside of the housing 31 is embedded in the mold resin portion 4.
  • the mounting portion 33 is integrally provided with the housing 31.
  • the mounting portion 33 is integrally molded as a part of the housing 31.
  • the mounting portion 33 is bent in an L shape so as to extend from the closed end surface of the housing 31 toward the circuit board 2.
  • the mounting portion 33 of this example is composed of a round bar member that is bent at a substantially right angle.
  • two mounting portions 33 are provided so as to sandwich the terminal 32.
  • a screw hole is provided on the end surface of the mounting portion 33.
  • a fixing member 34 which will be described later, is attached to this screw hole.
  • the circuit board 2 and the housing 31 are fixed by sandwiching the circuit board 2 between the end surface of the mounting portion 33 and the fixing member 34.
  • the mounting portion 33 is embedded in the mold resin portion 4.
  • the fixing member 34 fixes the housing 31 to the circuit board 2.
  • a screw can be used for the fixing member 34.
  • the fixing member 34 of this example is made of a resin screw.
  • each of the two fixing members 34 is penetrated through an insertion hole (not shown) provided in the circuit board 2 and attached to each attachment portion 33.
  • the housing 31 is fixed to the circuit board 2 by mounting the fixing member 34 to the mounting portion 33.
  • a part of the fixing member 34 projects from the surface of the circuit board 2.
  • the fixing member 34 is embedded in the mold resin portion 4.
  • the mold resin portion 4 mechanically, electrically, and chemically protects the conductive members such as the circuit board 2 and the terminals 32 from the external environment.
  • the mold resin portion 4 collectively covers the circuit board 2, the terminal 32 located on the outside of the housing 31, and a part of the housing 31.
  • the mold resin portion 4 covers the circuit board 2 and most of the connector 3 together.
  • the majority of the connector 3 is an area of the housing 31 excluding the end on the opening side into which the mating connector is fitted.
  • the mold resin portion 4 has a surface in contact with the atmosphere. Contact with the atmosphere means that the connector device 1 is not covered with a case or the like and is exposed, and constitutes the outermost surface of the connector device 1. In this example, the surface of the mold resin portion 4 is in contact with the atmosphere over the entire area. That is, the connector device 1 is caseless. Therefore, the connector device 1 is small.
  • the transmittance of the mold resin portion 4 is preferably high.
  • the transmittance of the mold resin portion 4 is the ratio (b1 / a1) of the amount of light a1 of a laser having a wavelength of 940 nm and the amount of light b1 transmitted by the laser through a test piece having a thickness of 2 mm made of a constituent material of the mold resin portion 4. It is ⁇ 100.
  • the molded resin portion 4 having a high transmittance does not easily absorb the laser and easily reaches the housing 31. Therefore, the welded portion 5 described later is likely to be formed.
  • the transmittance of the mold resin portion 4 is preferably 40% or more, for example.
  • the transmittance of the mold resin portion 4 is more preferably 45% or more, and particularly preferably 50% or more.
  • the color of the mold resin portion 4 is preferably colorless and transparent, white and transparent, and opaque white. These colors make it easy for the laser to pass through.
  • the mold resin portion 4 preferably contains, for example, a polyamide resin or polyester.
  • Polyamide resin is excellent in mechanical strength and the like. Therefore, the mold resin portion 4 containing the polyamide resin can easily mechanically protect the member covered by the mold resin portion 4.
  • Polyester is excellent in electrical insulation, water resistance, and the like. Therefore, the mold resin portion 4 containing polyester can easily electrically and chemically protect the member covered with the mold resin portion 4.
  • the housing 31 and the mold resin portion 4 contain the same type of resin.
  • the housing 31 and the mold resin portion 4 are made of exactly the same resin. Since the housing 31 and the mold resin portion 4 contain the same type of resin, the solubility parameters of the housing 31 and the mold resin portion 4 can be easily brought close to each other. Therefore, the housing 31 and the mold resin portion 4 have good compatibility with each other. Moreover, since the welded portion 5 described later contains the same type of resin, the strength of the welded portion 5 itself tends to increase. Therefore, the adhesion between the housing 31 and the mold resin portion 4 is higher. For example, when the housing 31 contains polyester, the mold resin portion 4 preferably contains polyester.
  • the mold resin portion 4 is preferably an injection molded product.
  • the injection molded product can be manufactured by injection molding.
  • injection molding the constituent material of the mold resin portion 4 is filled in the molding die while applying pressure to cover the circuit board 2, the housing 31, and the like. Therefore, in injection molding, it is easier to fill every corner of the molding die with the constituent material of the mold resin portion 4 as compared with casting molding. Therefore, in the injection molded product, a gap is less likely to be formed between the circuit board 2, the housing 31, and the mold resin portion 4 as compared with the cast molded product. Since it is difficult to form a gap, it is difficult for water vapor in the gap to condense and generate water droplets. Further, the injection molded product has a high degree of freedom in the shape of the mold resin portion 4.
  • the constituent material of the mold resin portion 4 preferably has a melting point of 180 ° C. or higher and 200 ° C. or lower.
  • the melting point of the constituent material is 180 ° C. or higher, it is possible to prevent the mold resin portion 4 from melting and deforming when the connector device 1 is used.
  • the melting point of the constituent material is 200 ° C. or lower, the molding temperature at the time of injection molding can be set to 200 ° C. or lower, and the solder 22 or the like can be prevented from melting at the molding temperature.
  • the mold resin portion 4 Since the mold resin portion 4 is an injection molded product, the mold resin portion 4 includes a trace portion 40 of the gate.
  • the trace portion 40 is a portion corresponding to a gate for filling the cavity of the mold with the constituent material of the mold resin portion 4 at the time of molding the mold resin portion 4.
  • the mold resin portion 4 produced by injection molding is formed with an accessory portion having a portion corresponding to the gate. By removing this accessory portion, a trace portion 40 of the gate is formed in the mold resin portion 4.
  • this accessory part may have a part corresponding to the sprue, and may further have a part corresponding to the runner.
  • the attachment can be removed, for example, by breaking off the attachment.
  • terminals 32 and the like are arranged around the housing 31, it is preferable that the gate at the time of injection molding is set at a position away from the housing 31. Therefore, it is preferable that the trace portion 40 is provided on the side of the mold resin portion 4 opposite to the housing 31.
  • the welded portion 5 is formed by welding the constituent materials of the housing 31 and the mold resin portion 4 to each other.
  • Welding means that the constituent materials of each other are mixed, that the constituent materials of each other are compatible with each other, that the shearing force causes material fracture instead of interfacial fracture, and that the surface of the connector 3 becomes rough. It means to satisfy at least one of being.
  • Interfacial fracture means that fracture occurs at the interface between the housing 31 and the mold resin portion 4. Therefore, the housing 31 and the mold resin portion 4 are peeled off along the interface with each other. Therefore, the constituent materials of the other member do not adhere to one member of the housing 31 and the mold resin portion 4.
  • Material destruction means that destruction occurs inside one member of the housing 31 and the mold resin portion 4. Therefore, both members are separated from each other in a state where the constituent material of the one member is attached to the surface of the other member facing the one member.
  • the welded portion 5 can improve the adhesion between the housing 31 and the molded resin portion 4.
  • the welded portion 5 is composed of a protruding portion 311 provided on the housing 31. As described above, the protrusion 311 is provided over the entire circumference of the housing 31. Therefore, the welded portion 5 is also provided over the entire circumference of the housing 31. Therefore, it is possible to prevent liquids such as water from entering between the housing 31 and the mold resin portion 4. Therefore, it is possible to prevent the liquid from adhering to the conductive members such as the circuit board 2 and the terminals 32.
  • the connector device 1 of the embodiment can be suitably used for an engine control unit of an automobile, a module of an electric brake system of an automobile, or the like.
  • the engine control unit include a fuel injection control engine control unit (Fuel Injection Engine Control Unit: FI-ECU).
  • the module of the electric brake system include an electric mechanical brake (EMB) and an electric parking brake (EPB) module.
  • EMB electric mechanical brake
  • EPB electric parking brake
  • the connector device 1 described above includes a step of preparing an assembly including a circuit board 2 and a connector 3, a step of forming an integral body in which a part of the prepared assembly is covered with a mold resin portion 4, and a laser as an integral body. It can be manufactured by the process of irradiating.
  • the assembly in which the circuit board 2 and the connector 3 described above are connected is prepared.
  • the conductive pattern 21 of the circuit board 2 and the terminal 32 of the connector 3 are electrically connected by solder 22.
  • the assembly is configured such that the mounting portion 33 of the connector 3 is fixed to the circuit board 2 by the fixing member 34.
  • the circuit board 2, the terminal 32 located outside the housing 31 in the connector 3, and a part of the housing 31 are collectively covered with the mold resin portion 4. That is, in the step of forming the integral body, most of the assembly except for the opening in which the mating connector of the housing 31 of the connector 3 is fitted is covered with the mold resin portion 4.
  • the mold resin portion 4 covers the protrusion 311 provided on the housing 31 and fills the recess 312.
  • the projection 311 provided on the housing 31 is irradiated with the laser through the mold resin portion 4, and the constituent materials of the housing 31 and the mold resin portion 4 are welded to each other.
  • the laser irradiation may be performed from the outside of the mold resin portion 4 in the normal direction of the outer peripheral surface of the housing 31.
  • the mold resin portion 4 transmits the laser, and the housing 31 absorbs the laser.
  • the housing 31 that has absorbed the laser generates heat, and the heat generated melts the constituent materials of the housing 31.
  • the heat of fusion in the housing 31 is transmitted to the mold resin portion 4, so that the mold resin portion 4 generates heat, and the heat generated causes the mold resin portion 4 to melt.
  • the welded portion 5 is formed by solidifying the melted constituent material of the housing 31 and the constituent material of the mold resin portion 4 in a bonded state.
  • Laser irradiation conditions can be selected as appropriate.
  • the laser source include a solid-state laser, a semiconductor laser, and a fiber laser.
  • the wavelength of the laser is, for example, 800 nm or more and 990 nm or less, further 850 nm or more and 990 nm or less, particularly 930 nm or more and 950 nm or less.
  • the wavelength of the laser is preferably 940 nm.
  • the output of the laser depends on the materials of the housing 31 and the mold resin portion 4, and examples thereof include 10 W or more and 100 W or less, further 20 W or more and 90 W or less, and particularly 30 W or more and 60 W or less.
  • the laser irradiation may be performed while scanning in the circumferential direction of the housing 31.
  • the scanning speed of the laser depends on the material, thickness, and shape of the housing 31 and the mold resin portion 4, but is, for example, 5 mm / min or more and 50 mm / min or less, and further 10 mm / min or more and 40 mm / min or less, particularly 20 mm / min or more. 30 mm / min or less can be mentioned.
  • the laser irradiation is performed collectively on the entire circumference of the housing 31. In this case, a plurality of laser irradiation light sources are arranged side by side in the circumferential direction of the housing 31, and laser irradiation is performed at the same time.
  • the laser irradiation is preferably performed in a state where the mold resin portion 4 is pressed against the housing 31 side. By doing so, the adhesion between the mold resin portion 4 and the housing 31 is likely to be improved.
  • the connector device 1 of the embodiment can exert the following effects.
  • the connector device 1 of the embodiment has excellent waterproof performance due to the welded portion 5, and therefore does not require a housing and a sealing material. Therefore, the number of parts is small, and the work of assembling the housing and the work of arranging the sealing material are performed. This is because it can be omitted.
  • Test example A connector device having a welded portion on a protrusion provided on the housing was manufactured, and the difference in adhesive performance due to the difference in the shape and size of the protrusion was investigated.
  • the evaluation of the adhesive performance was performed using the test piece 100 shown in FIG. 7.
  • the test piece 100 is a member simulating a joint portion between the housing of the connector and the mold resin portion.
  • An absorbent material 110 was prepared that simulated the joint with the molded resin portion of the housing.
  • the absorbent material 110 is made of a PBT resin having a transmittance of 1%.
  • the absorbent material 110 is a plate material having a length of 80 mm, a width of 25 mm, and a thickness of 1 mm.
  • a protrusion 111 and a recess 112 are provided on the surface of the absorbent material 110 near the end. Specifically, as the recess 112, a notch connected to the end face of the absorbent material 110 and a groove portion parallel to the notch are provided along the width direction of the absorbent material 110.
  • the protrusion 111 is provided along the width direction of the absorbent material 110 so as to form each side wall of the notch and the groove.
  • the cross-sectional shape of the protrusion 111 is a quadrangle as shown in FIG.
  • the width W and height H (FIG. 4) of the protrusion 111 are shown in Table 1.
  • the height H of the protrusion 111 was adjusted by adjusting the depth of the recess 112 so that the tip of the protrusion 111 does not protrude from the surface of the absorbent material 110.
  • the transmission material 120 was injection-molded so as to cover the protrusions 111 and the recesses 112 of the prepared absorbent material 110.
  • the transmissive material 120 is made of a thermoplastic polyester resin having a transmittance of 40%.
  • As the thermoplastic polyester resin Toyobo Co., Ltd.'s Viroshot (registered trademark) was used.
  • the transparent material 120 is formed so as to come into contact with the surface side of the absorbent material 110 where the protrusions 111 and the recesses 112 are provided and extend along the longitudinal direction of the absorbent material 110.
  • the transparent material 120 has a length of 80 mm, a width of 25 mm, and a thickness of the absorbent material 110 from the surface of 1 mm. The length of the region where the absorbent material 110 and the transparent material 120 overlap was set to 10 mm.
  • the laser was irradiated to the protrusion 111 provided on the absorbent material 110 through the transparent material 120.
  • the laser irradiation was performed from above the transmitting material 120 in the normal direction of the surface of the absorbing material 110. Further, the laser irradiation was performed collectively over the entire width direction of the protrusion 111 while pressing the transmitting material 120 against the absorbing material 110 side.
  • the pressing pressure was 0.1 MPa.
  • the spot diameter of the laser was 1.5 mm.
  • the wavelength of the laser was 940 nm. As a result, a welded portion 150 was formed at the tip of the protrusion 111.
  • Sample No. 2-1 to 2-3 Sample No. In 2-1 to 2-3, the sample No. The shape and size of the protrusion 111 were changed with respect to 1-1 to 1-5.
  • the cross-sectional shape of the protrusion 111 is a triangle as shown in FIG.
  • the width W and height H (FIG. 5) of the protrusion 111 are shown in Table 1. Conditions other than the shape and size of the protrusion 111 can be found in Sample No. The same applies to 1-1 to 1-5.
  • Sample No. 3-1 to 3-2 Sample No. In 3-1 to 3-2, the sample No. The shape and size of the protrusion 111 were changed with respect to 1-1 to 1-5.
  • the cross-sectional shape of the protrusion 111 is a semicircle as shown in FIG.
  • the width W and height H (FIG. 6) of the protrusion 111 are shown in Table 1. Conditions other than the shape and size of the protrusion 111 can be found in Sample No. The same applies to 1-1 to 1-5.
  • Sample No. 100 Sample No. In 100, the absorbing material 110 was not provided with the protrusion 111. Sample No. In 100, the laser was collectively irradiated over the entire width direction of the absorbent material 110 and the transparent material 120 in an arbitrary region where the absorbent material 110 and the transparent material 120 overlap. The conditions other than the protrusion 111 are the sample No. The same applies to 1-1 to 1-5.
  • the test piece 100 of each of the obtained samples was subjected to a shear tensile test to evaluate the adhesive performance.
  • An Autograph AGS-X series manufactured by Shimadzu Corporation was used as the device for the shear tensile test.
  • the shear tensile test as shown by the white arrows in FIG. 7, when the absorbent material 110 and the transparent material 120 are pulled in a direction away from each other along the length direction, and the absorbent material 110 and the transparent material 120 are separated from each other.
  • the maximum tensile stress of was calculated.
  • the number of measurements for each sample was 5. Table 1 shows the average value of the maximum tensile stress.
  • the adhesive surfaces of the absorbent material 110 and the transparent material 120 were visually observed. As a result, the material was destroyed at the welded portion 150 in all the samples. In the material destruction, the destruction occurred inside one of the absorbent material 110 and the transparent material 120, and one of the constituent materials was attached to the separated surface of the other.
  • the sample No. having protrusions. 1-1 to 1-5, No. Sample Nos. 2-1 to 2-3 and 3-1 to 3-2 have a maximum tensile stress of 2.00 MPa or more and do not have protrusions. It has better adhesive performance than 100.
  • the protrusion it is considered that the heat generated by the laser can be concentrated on the protrusion, and a strong welded portion is formed on the protrusion.
  • sample No. 1-1 and No. 2-1 and No. Comparing with 3-1 the sample No. 1 in which the shape of the protrusion is quadrangular.
  • the sample No. 1 in which the shape of the protrusion is triangular or semi-circular. 2-1 No. It has better adhesive performance than 3-1.
  • sample No. 1-3 and No. 2-2 and No. Comparing with 3-2 the sample No. in which the shape of the protrusion is quadrangular.
  • sample No. 2-1 and No. Comparing with 2-2 the sample No. with a smaller protrusion width. 2-1 is a sample No. with a large protrusion width. It has better adhesive performance than 2-2.
  • sample No. 3-1 and No. Compared with 3-2 the sample No. with a smaller protrusion width. 3-1 is a sample No. with a large protrusion width. It has better adhesive performance than 3-2. It is considered that when the width of the protrusion is small, the surface receiving the laser can be stably secured regardless of the spot diameter of the laser, and the protrusion forms a strong welded portion.
  • the sample No. 1-1 and No. Comparing with 1-2 there is no significant superiority or inferiority in adhesive performance.
  • sample No. 1-3 and No. 1-4 and No. Even when compared with 1-5 no significant superiority or inferiority in adhesive performance can be seen.
  • the sample No. 1-3 and No. 1-4 and No. In 1-5 the variation in maximum tensile stress was examined. The number of measurements of each sample was 5, and the variation in the maximum tensile stress in this number of measurements was determined. As a result, it was found that the higher the height of the protrusion, the smaller the variation.
  • the heat diffusion by the laser tends to be constant, and the melting of the constituent materials in the protrusions becomes constant. It is considered that the heat of the laser is likely to be concentrated on the protrusions when the height of the protrusions is 0.2 mm or more.

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Families Citing this family (2)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0359673U (cg-RX-API-DMAC7.html) * 1989-10-17 1991-06-12
JPH1076528A (ja) * 1996-09-03 1998-03-24 Fujitsu Ten Ltd 金型構造及びコネクタの構造
JP2010040992A (ja) * 2008-08-08 2010-02-18 Hitachi Ltd 電子制御装置の製造方法とそのトランスファーモールド装置および電子制御装置
JP2010098097A (ja) * 2008-10-16 2010-04-30 Denso Corp モールドパッケージの製造方法
JP2014103091A (ja) * 2012-10-24 2014-06-05 Auto Network Gijutsu Kenkyusho:Kk 防水電子回路ユニットの製造方法及び電子回路ユニット
JP2014177051A (ja) * 2013-03-15 2014-09-25 Denso Corp 溶着体のレーザー溶着方法
JP2014194899A (ja) * 2013-03-29 2014-10-09 Yazaki Corp 防水コネクタ
WO2016084537A1 (ja) * 2014-11-25 2016-06-02 日立オートモティブシステムズ株式会社 電子制御装置
WO2019039244A1 (ja) * 2017-08-25 2019-02-28 日立オートモティブシステムズ株式会社 樹脂封止型車載電子制御装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19755497C1 (de) * 1997-12-13 1999-07-08 Hella Kg Hueck & Co Steuergerätegehäuse aus Kunststoff für ein Kraftfahrzeug
JP4281178B2 (ja) * 1999-10-06 2009-06-17 株式会社デンソー 半導体圧力センサ
JP4196546B2 (ja) * 2001-04-23 2008-12-17 株式会社デンソー 空気流量測定装置
CN2585308Y (zh) * 2002-10-25 2003-11-05 互亿科技股份有限公司 兼具防水和导光性能的资讯装置
EP2990769B1 (en) * 2013-04-26 2018-07-25 Hitachi Automotive Systems, Ltd. Flow sensor and method for producing a flow sensor as well as use of a flow sensor
JP6524808B2 (ja) 2015-06-08 2019-06-05 株式会社デンソー 電子装置
JP6798436B2 (ja) * 2017-07-12 2020-12-09 株式会社オートネットワーク技術研究所 回路装置、回路装置の製造方法、およびコネクタ
JP2020202010A (ja) * 2019-06-05 2020-12-17 株式会社オートネットワーク技術研究所 コネクタ装置
JP7319595B2 (ja) * 2020-03-06 2023-08-02 株式会社オートネットワーク技術研究所 コネクタ装置、及びコネクタ装置の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0359673U (cg-RX-API-DMAC7.html) * 1989-10-17 1991-06-12
JPH1076528A (ja) * 1996-09-03 1998-03-24 Fujitsu Ten Ltd 金型構造及びコネクタの構造
JP2010040992A (ja) * 2008-08-08 2010-02-18 Hitachi Ltd 電子制御装置の製造方法とそのトランスファーモールド装置および電子制御装置
JP2010098097A (ja) * 2008-10-16 2010-04-30 Denso Corp モールドパッケージの製造方法
JP2014103091A (ja) * 2012-10-24 2014-06-05 Auto Network Gijutsu Kenkyusho:Kk 防水電子回路ユニットの製造方法及び電子回路ユニット
JP2014177051A (ja) * 2013-03-15 2014-09-25 Denso Corp 溶着体のレーザー溶着方法
JP2014194899A (ja) * 2013-03-29 2014-10-09 Yazaki Corp 防水コネクタ
WO2016084537A1 (ja) * 2014-11-25 2016-06-02 日立オートモティブシステムズ株式会社 電子制御装置
WO2019039244A1 (ja) * 2017-08-25 2019-02-28 日立オートモティブシステムズ株式会社 樹脂封止型車載電子制御装置

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