WO2021177016A1 - Structure de circuit et procédé de fabrication de structure de circuit - Google Patents

Structure de circuit et procédé de fabrication de structure de circuit Download PDF

Info

Publication number
WO2021177016A1
WO2021177016A1 PCT/JP2021/005587 JP2021005587W WO2021177016A1 WO 2021177016 A1 WO2021177016 A1 WO 2021177016A1 JP 2021005587 W JP2021005587 W JP 2021005587W WO 2021177016 A1 WO2021177016 A1 WO 2021177016A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminals
connector
soldered
solder
substrate
Prior art date
Application number
PCT/JP2021/005587
Other languages
English (en)
Japanese (ja)
Inventor
万規夫 西塚
Original Assignee
住友電装株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電装株式会社 filed Critical 住友電装株式会社
Publication of WO2021177016A1 publication Critical patent/WO2021177016A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • This specification discloses a circuit structure and a technique relating to a method for manufacturing the circuit structure.
  • the connector is mounted on the printed circuit board by reflow soldering the terminals of the connector to the land of the wiring pattern on the surface of the insulating member.
  • the plurality of terminals of the connector extend from the housing and are arranged along the longitudinal direction of the housing.
  • the technique described in the present specification has been completed based on the above circumstances, and provides a circuit configuration capable of suppressing soldering defects while increasing the mounting density of electronic components.
  • the purpose is to do.
  • the circuit configuration described in the present specification includes a substrate having a conductive path, a plurality of connector terminals, and a housing for holding the plurality of connector terminals side by side, and the plurality of connector terminals are said to be conductive.
  • a connector to be soldered to the path and a first electronic component having a plurality of terminals soldered to the conductive path are provided, and the conductive path of the substrate is soldered to each terminal of the first electronic component.
  • the plurality of first soldering portions are provided, and the plurality of first soldering portions are arranged side by side along the arrangement direction of the plurality of connector terminals.
  • the method for manufacturing a circuit configuration described in the present specification is a plurality of regions having different thicknesses in a stepped shape on a substrate having a plurality of soldered portions to which a connector terminal and terminals of a plurality of first electronic components are soldered.
  • the removal step of removing the mask superimposed on the substrate from the substrate, and heating the paste-like solder with the connector terminals and the terminals of the first electronic component placed on the plurality of soldering portions.
  • a method of manufacturing a circuit board for mounting the connector terminal and the terminal of the first electronic component wherein each of the terminals of the first electronic component is attached to the plurality of soldered portions. While being soldered, they are arranged side by side along the arrangement direction of the plurality of connector terminals.
  • FIG. 1 is a plan view showing a circuit configuration.
  • FIG. 2 is a plan view showing the substrate.
  • FIG. 3 is a cross-sectional view taken along the line AA of FIG.
  • FIG. 4 is a plan view showing a state in which the mask is superimposed on the substrate.
  • FIG. 5 is a cross-sectional view taken along the line CC of FIG.
  • FIG. 6 is a diagram illustrating a step of painting the paste-like solder arranged on the mask with a squeegee.
  • FIG. 7 is a cross-sectional view showing a state in which the solder through holes of the mask are filled with paste-like solder.
  • FIG. 8 is a cross-sectional view showing a substrate with the mask removed.
  • FIG. 9 is a cross-sectional view showing a state in which paste-like solder is applied onto the pair of first soldered portions at the position BB in FIG.
  • FIG. 10 is a cross-sectional view showing a state in which paste-like solder is applied onto a pair of soldering portions arranged in the front-rear direction as a comparative example with respect to FIG.
  • the circuit configuration of the present disclosure includes a substrate having a conductive path, a plurality of connector terminals, and a housing for holding the plurality of connector terminals side by side, and the plurality of connector terminals are the conductive paths.
  • a connector soldered to the connector and a first electronic component having a plurality of terminals soldered to the conductive path are provided, and the conductive paths of the substrate are arranged along the arrangement direction of the plurality of connector terminals. It is provided with a plurality of first soldering portions that are arranged and to which the terminals of the first electronic component are soldered.
  • a plurality of terminals of the first electronic component can be soldered to a plurality of first soldering portions arranged side by side along the arrangement direction of the plurality of connector terminals, so that a circuit configuration can be obtained. It is possible to increase the mounting density of electronic components on the body. Further, at the time of manufacturing, the paste-like solder used for soldering the connector terminals is laminated on the paste-like solders of the plurality of first soldering portions, and the height of the paste-like solder on the first soldering portions is increased.
  • a plurality of regions having different thicknesses are formed in a stepped manner on a substrate having a plurality of soldered portions to which a connector terminal and terminals of a plurality of first electronic components are soldered.
  • the paste-like solder is heated with the connector terminal and the terminal of the first electronic component placed on the plurality of soldering portions in a removing step of removing the mask superimposed on the substrate from the substrate.
  • a second electronic component having a plurality of terminals soldered to the conductive path and having an occupied area on the substrate larger than that of the first electronic component is provided, and the conductive path of the substrate is the second electronic component.
  • Each of the terminals of the electronic component is provided with a plurality of second soldering portions to which the terminals are soldered, and the plurality of second soldering portions are arranged at positions farther from the connector than the plurality of first soldering portions. ing.
  • a plurality of third soldering portions arranged side by side along the side surface of the housing, and a third electronic component having a plurality of terminals soldered to each of the third soldering portions are provided.
  • the paste-like solder used when soldering the connector terminals is laminated on the paste-like solders of the plurality of third soldering portions, and the height of the paste-like solder on the third soldering portions is increased. Even if it becomes high, the height (amount) of the paste-like solder on the plurality of third soldering portions is obtained by laminating the paste-like solder on each of the plurality of third soldering portions to the same extent. It is possible to suppress the variation of the soldering.
  • the first electronic component includes any one of a resistor, a capacitor and a varistor.
  • the first soldering portion is provided on the plate surface of the substrate.
  • the circuit configuration 10 of the present embodiment can be mounted on a vehicle such as an electric vehicle or a hybrid vehicle, for example.
  • the circuit configuration 10 can be arranged in any direction, but in the following, the X direction of FIG. 1 will be described as the left side, the Y direction as the front side, and the Z direction as the upper side.
  • the circuit configuration 10 includes a substrate 11, a connector 20 surface-mounted on the substrate 11, and first to third electronic components 31 to 33 surface-mounted on the substrate 11.
  • a printed circuit board in which a conductive path 13 made of a copper foil or the like is formed on an insulating plate by a printed wiring technique is used.
  • the board 11 has a connector mounting area 12A arranged on the front end side on which the connector 20 is mounted, a main component mounting area 12B which is separated from the connector mounting area 12A by a predetermined dimension or more, and a connector in the vicinity of the connector 20. It has a sub-component mounting area 12C arranged around the mounting area 12A.
  • the main component mounting area 12B is arranged on the rear side of the board 11, and a large number of second electronic components 32 are mounted.
  • the sub-component mounting area 12C is provided in a region of the board 11 adjacent to the rear side and the side side of the connector mounting area 12A (connector 20), and is provided with a plurality of first electronic components 31 and a plurality of third electrons.
  • the component 33 is mounted.
  • the conductive path 13 is provided on one side or both sides of the substrate 11, and a plurality of soldering portions 14 to 17 as lands (pads) to be soldered are formed.
  • a plurality of soldering portions 14 to 17 are provided on the mounting surfaces of the electronic components 31 to 33 on the substrate 11, and each soldering portion 14 to 17 is formed into, for example, a rectangular region.
  • the plurality of soldering portions 14 to 17 include a plurality of first soldering portions 14 to which the terminals 35 of the first electronic component 31 are soldered, and a plurality of second soldering portions to which the terminals 35 of the second electronic component 32 are soldered. It includes a soldering portion 15, a plurality of third soldering portions 16 to which the terminals 35 of the third electronic component 33 are soldered, and a plurality of fourth soldering portions 17 to which the connector terminals 22 are soldered.
  • a plurality of first soldering portions 14 are provided along the back surface of the connector 20 in the auxiliary component mounting area 12C.
  • a pair of first soldering portions 14 are provided on both the left and right sides of the connector 20. It is provided in.
  • the plurality of second soldering portions 15 are provided in the main component mounting area 12B, which is wider than the sub component mounting area 12C.
  • the plurality of third soldering portions 16 are provided along the side surface of the connector 20 in the sub-component mounting area 12C.
  • the plurality of fourth soldering portions 17 are provided in the connector mounting area 12A, and are provided side by side in the left-right direction according to the position of the connector terminal 22.
  • the connector 20 includes a housing 21 and a plurality of connector terminals 22 fixed to the housing 21, and is fixed to the front end portion of the substrate 11.
  • the housing 21 is made of synthetic resin and has a hood portion that opens like a hood and a back wall portion that closes the hood portion.
  • a plurality of connector terminals 22 are provided in press-fitting holes formed through the back wall portion. It is press-fitted and fixed.
  • the plurality of connector terminals 22 are provided side by side in the left-right direction, and both are bent in a crank shape and extend to the rear of the housing 21.
  • the rear end side of each connector terminal 22 extends rearward along the upper surface 11A (plate surface) of the substrate 11.
  • each connector terminal 22 is electrically connected to the conductive path 13 of the substrate 11.
  • the connector terminal 22 is thinner and longer than the terminals 35 of the electronic components 31 to 33, the terminal 35 is likely to float when soldered. Therefore, with respect to the fourth soldering portion 17, the thickness dimension of the solder S to be overlapped on the fourth soldering portion 17 (thickness of the paste-like solder SP to be applied) is compared with the other soldering portions 14 to 16. Dimensions) have been increased.
  • Each of the first electronic component 31 and each third electronic component 33 is, for example, a chip resistor, a small capacitor such as a ceramic capacitor, a varistor, or the like, and is a terminal extending outward from the component body 34 (see FIG. 9) and the component body 34. 35 (see FIG. 9), and as shown in FIG. 1, the occupied area (area projected on the substrate 11) of each of the electronic components 31 and 33 on the substrate 11 is smaller than that of the second electronic component 32.
  • Each second electronic component 32 is a FET (Field effect transistor), a coil, a large capacitor, a microcomputer, etc., and the occupied area on the substrate 11 (the area projected from the direction perpendicular to the plate surface of the substrate 11) is (. It is larger than the first electronic component 31 and the third electronic component 33).
  • a method of manufacturing the circuit configuration 10 will be described. First, a substrate 11 (FIG. 2) on which the conductive path 13 and the plurality of soldered portions 14 to 17 are formed is prepared. (Mask process) Next, as shown in FIG. 5, a masking step of superimposing the mask 40 on the substrate 11 is performed.
  • the mask 40 is made of a plate-shaped metal, and as shown in FIGS. 4 and 5, a thick portion having a large thickness dimension in a region corresponding to the fourth soldering portion 17 (and the connector 20). It has a 41 and a thin portion 42 having a thickness dimension smaller than that of the thick portion 41 on the outside of the thick portion 41.
  • a step portion 43 whose height dimension changes in a step shape.
  • a plurality of solder through holes 41A, 42A, and 42B are formed through the mask 40 at positions corresponding to the soldering portions 14 to 17.
  • the plurality of solder through holes 41A, 42A, 42B have shallow holes 42A, 42B penetrating the thin portion 42, and deep holes 41A penetrating the thick portion 41 and penetrating deeper than the shallow holes 42A, 42B.
  • the shallow holes 42A and 42B have a first shallow hole 42A arranged along the step portion 43 in the vicinity of the step portion 43 and a second shallow hole 42B arranged at a position away from the step portion 43.
  • the paste-like solder SP is superposed on the mask 40.
  • the solder SP is superposed on the thick portion 41, but the solder SP is also superposed on the thin portion 42.
  • the columnar squeegee 50 is rotated on the thick portion 41 (the substrate 11), and the paste-like solder SP is moved while being crushed (for example, moved in the direction of arrow A1 in FIG. 6).
  • the solder through hole 41A is filled with the paste-like solder SP.
  • the solder SP is filled in the solder through holes 42A and 42B by rotating the squeegee 50 on the thin-walled portion 42 (board 11).
  • the solder SP is applied to the soldered portions 14 to 17 of the substrate 11 as shown in FIG.
  • the solder SP2 overlaps the solder SP filled in the first shallow hole 42A near the step portion 43, and the height of the solder SP on the soldered portion 14 is higher than that of the upper surface 40A of the mask 40.
  • the terminals 35 of the electronic components 31 to 33 are placed on the paste-like solder SPs stacked on the soldering portions 14 to 17. Then, for example, by passing the substrate 11 through a reflow furnace and heating it, the paste-like solder SP is put into a molten state. After that, the solder S solidifies, so that the terminals 35 and the connector terminals 22 of the electronic components 31 to 33 are soldered to the corresponding soldering portions 14 to 17. As a result, the circuit configuration 10 (FIG. 1) is formed.
  • the arrangement direction of the pair of soldering portions P1 and P2 soldered to the pair of terminals 35 of one electronic component 31 to 33 When is in the front-rear direction, there is a difference in the amount of solder SP adhering to the soldering portions P1 and P2 arranged in the front-rear direction (see FIG. 10), and soldering defects such as floating of the terminal 35 occur. I am concerned.
  • the arrangement direction of the pair of soldering portions 14, 14 soldered to the pair of terminals 35 of one electronic component 31 is in the left-right direction (in the arrangement direction of the plurality of terminals 35).
  • the circuit configuration 10 is housed in the case 60 (see FIG. 1) and mounted on the vehicle as an electrical connection box.
  • the terminals 35 of the first electronic component 31 can be soldered to the plurality of first soldering portions 14 arranged side by side along the arrangement direction of the plurality of connector terminals 22.
  • the mounting density of the electronic components 31 to 33 in the circuit configuration 10 can be increased.
  • the paste-like solder SP for soldering the connector terminal 22 is laminated on the paste-like solder SPs of the plurality of first soldering portions 14, and the paste on the first soldering portion 14 is laminated.
  • the plurality of first soldering portions 14 are arranged side by side along the arrangement direction of the plurality of connector terminals 22, the plurality of first soldering portions 14 are arranged side by side.
  • the paste-like solder SPs By stacking the paste-like solder SPs on each of the 14s to the same extent, it is possible to suppress variations in the height (amount) of the paste-like solder SPs on the plurality of first soldering portions 14. As a result, it is possible to suppress soldering defects such as floating of the terminals 35 due to different heights (amounts) of the solder S adhering to the plurality of terminals 35 of the electronic components 31 to 33.
  • the connector 20, the first electronic component 31 and the second electronic component 32 are surface-mounted on the substrate 11, but the present invention is not limited to this.
  • a through hole may be formed through the substrate 11, and the connector terminal 22 and the terminals 35 of the electronic components 31 to 33 may be inserted through the through hole and soldered.
  • the configuration may not include the third electronic component 33.
  • the pair of first soldered portions 14, 14 were arranged at the same positions in the front-rear direction on the substrate 11, but the amount of solder SP applied to the pair of first soldered portions 14, 14 was large. The positions may be displaced in the front-rear direction to the extent that they do not differ significantly.
  • the pair of third soldering portions 16 and 16 are also arranged at the same positions in the left-right direction on the substrate 11, but the amount of solder SP applied to the pair of soldering portions 16 and 16 is large. The positions may be displaced in the left-right direction to the extent that they do not differ significantly.
  • the terminals 35 of the first to third electronic components 31 to 33 may include an electrode portion of the electronic component (the terminal may be an electrode portion).
  • Circuit configuration 11 Board 12A: Connector mounting area 12B: Main component mounting area 12C: Sub component mounting area 13: Conductive path 14: First soldering section 15: Second soldering section 16: Third soldering section 17: 4th soldering part 20: Connector 21: Housing 22: Connector terminal 31: 1st electronic component 32: 2nd electronic component 33: 3rd electronic component 34: Component body 35: Terminal 40: Mask 40A: Top surface 41: Thick part 41A: Deep hole (solder through hole) 42: Thin wall portion 42A: First shallow hole (solder through hole) 42B: Second shallow hole (solder through hole) 43: Step 50: Squeegee 60: Case S: Solder SP: Paste-like solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une structure de circuit étant pourvue : d'un substrat ayant un trajet conducteur ; un connecteur ayant une pluralité de bornes de connecteur et un boîtier qui maintient la pluralité de bornes de connecteur dans un état agencé, la pluralité de bornes de connecteur étant soudée avec le trajet conducteur ; et un premier composant électronique ayant une pluralité de bornes qui sont soudées avec le trajet conducteur. Le trajet conducteur du substrat est pourvu d'une pluralité de premières parties de brasage avec lesquelles les bornes respectives du premier composant électronique sont brasées. La pluralité de premières parties de brasage sont agencées le long d'une direction dans laquelle la pluralité de bornes de connecteur sont agencées.
PCT/JP2021/005587 2020-03-06 2021-02-16 Structure de circuit et procédé de fabrication de structure de circuit WO2021177016A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020038394A JP7402415B2 (ja) 2020-03-06 2020-03-06 回路構成体の製造方法
JP2020-038394 2020-03-06

Publications (1)

Publication Number Publication Date
WO2021177016A1 true WO2021177016A1 (fr) 2021-09-10

Family

ID=77612611

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/005587 WO2021177016A1 (fr) 2020-03-06 2021-02-16 Structure de circuit et procédé de fabrication de structure de circuit

Country Status (2)

Country Link
JP (1) JP7402415B2 (fr)
WO (1) WO2021177016A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168516A (ja) * 1999-12-13 2001-06-22 Oki Comtec Ltd 電子部品の半田付け方法及び半田付け装置
JP2008103618A (ja) * 2006-10-20 2008-05-01 Mitsuba Corp 回路基板
JP2011060479A (ja) * 2009-09-08 2011-03-24 Yazaki Corp コネクタの基板表面実装構造
JP2018206850A (ja) * 2017-05-31 2018-12-27 住友電装株式会社 基板実装部品付きプリント基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6036513B2 (ja) 2013-04-19 2016-11-30 株式会社デンソー 車両用電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168516A (ja) * 1999-12-13 2001-06-22 Oki Comtec Ltd 電子部品の半田付け方法及び半田付け装置
JP2008103618A (ja) * 2006-10-20 2008-05-01 Mitsuba Corp 回路基板
JP2011060479A (ja) * 2009-09-08 2011-03-24 Yazaki Corp コネクタの基板表面実装構造
JP2018206850A (ja) * 2017-05-31 2018-12-27 住友電装株式会社 基板実装部品付きプリント基板の製造方法

Also Published As

Publication number Publication date
JP2021141224A (ja) 2021-09-16
JP7402415B2 (ja) 2023-12-21

Similar Documents

Publication Publication Date Title
JP2009054846A (ja) プリント配線基板及び電子装置製造方法
CN111668185B (zh) 电子装置模块以及该电子装置模块的制造方法
JP4854770B2 (ja) プリント基板ユニット及び電子機器
US20070017699A1 (en) Circuit board
JP2014504019A (ja) 絶縁された金属基板を有するプリント回路板
WO2021177016A1 (fr) Structure de circuit et procédé de fabrication de structure de circuit
WO2018123584A1 (fr) Structure de circuit et boîtier de connexion électrique
JP5869282B2 (ja) 電気コネクタ
CN113475170A (zh) 包括共用焊盘和位于空腔中的组件的电子板
JP6323622B2 (ja) 部品実装基板
JP7335732B2 (ja) プリント配線基板
JP2009130147A (ja) チップ状電子部品およびチップ状電子部品の実装方法
JP4840182B2 (ja) 電子装置
WO2012172890A1 (fr) Carte à circuits imprimés, structure de montage de composants électroniques et procédé de fabrication d'une structure de montage de composants électroniques
JPH0219635B2 (fr)
JP2008034672A (ja) チップ部品の実装方法および電子モジュール
JP2004207287A (ja) はんだ付け用ランド、プリント配線基板
JP2005032931A (ja) 回路基板、回路基板の製造方法及び電子回路装置
JP2007250815A (ja) フレキシブルプリント基板及びそれを用いた電子部品実装回路
CN219626637U (zh) 电路模块
JP7123236B2 (ja) 回路基板
JP3906563B2 (ja) 表面実装モジュール
JP2008130941A (ja) 基板実装方法
JP2007194462A (ja) チップ部品の実装構造および方法
JP2501678Y2 (ja) 回路基板装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21764011

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21764011

Country of ref document: EP

Kind code of ref document: A1