WO2021174645A1 - 可提高色域、ppi的像素排列显示设备及蒸镀方法 - Google Patents

可提高色域、ppi的像素排列显示设备及蒸镀方法 Download PDF

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Publication number
WO2021174645A1
WO2021174645A1 PCT/CN2020/084512 CN2020084512W WO2021174645A1 WO 2021174645 A1 WO2021174645 A1 WO 2021174645A1 CN 2020084512 W CN2020084512 W CN 2020084512W WO 2021174645 A1 WO2021174645 A1 WO 2021174645A1
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vapor deposition
pixel arrangement
pixels
color gamut
evaporation
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PCT/CN2020/084512
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English (en)
French (fr)
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何瑞亭
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武汉华星光电半导体显示技术有限公司
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Priority to US16/757,780 priority Critical patent/US20220310702A1/en
Publication of WO2021174645A1 publication Critical patent/WO2021174645A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels

Definitions

  • This application relates to the technical field of OLED device manufacturing, and in particular to a pixel arrangement display device and an evaporation method that can improve color gamut and PPI.
  • the need to increase the manufacturing process and additional process technology results in low production efficiency; the need to increase equipment and raw materials, and even the need to develop special raw materials, resulting in increased investment and cost. Even so, these new technologies are still difficult to produce ultra-high-resolution displays above 450ppi.
  • the small openings of the FMM pixels will increase the frequency of FMM cleaning during the continuous evaporation process, resulting in reduced production capacity, waste of evaporation materials, and loss of FMM due to the increase in the number of cleanings.
  • this application discloses a pixel arrangement display device and an evaporation method that can improve the color gamut and PPI.
  • the width of the opening and the connecting bridge of this application is larger and It is easy to process and not easy to deform.
  • the increase in the distance between different pixels helps to avoid color mixing and improves product yield.
  • the vapor deposition alignment margin is larger, the vapor deposition process is easy to proceed, and the increase in production capacity caused by the reduction in FMM replacement frequency is solved And reduce FMM cleaning loss.
  • a vapor deposition method for pixel arrangement that can improve color gamut and PPI.
  • the vapor deposition method includes the following steps:
  • S1 regards the pixels with the same appearance and color immediately adjacent to the vapor-deposited substrate as independent units
  • S2 sets the number of sub-pixels in each independent unit to 3N+1 or 3N+2, and N is a positive integer;
  • S3 sets FMM openings on the vapor-deposited substrate
  • S4 vapor-deposits all the pixel arrangement methods set in S2 and the same cell by the vapor deposition method of the same FMM opening into a film.
  • the evaporation includes an evaporation area, and the evaporation area is provided with an evaporation unit, an evaporation source, and an evaporation mask.
  • the vapor deposition source is provided with vapor deposition source openings that respectively emit vapor deposition particles, and restriction openings through which the vapor deposition particles discharged from the vapor deposition source openings respectively pass are provided by a restriction unit.
  • the vapor deposition masks are respectively provided with mask openings in the vapor deposition regions where the vapor deposition particles that restrict the openings reach.
  • a vapor deposition beam direction adjusting plate formed with vapor deposition beam passing holes is arranged between the vapor deposition source and the vapor deposition mask, and the vapor deposition particles emitted from the vapor deposition source are adjusted in the vapor deposition beam direction by passing The vapor deposition beam formed by the plate passes through the hole to control the direction of the vapor deposition beam.
  • each vapor deposition source opening is arranged at a fixed pitch along the X-axis direction, and each vapor deposition source opening has a nozzle shape that opens upward parallel to the Z axis, and emits light-emitting layer material toward the vapor deposition mask. Evaporated particles.
  • the vapor deposition mask is a plate-like object whose main surface is parallel to the XY plane, and a plurality of mask openings are formed at different positions in the X-axis direction along the X-axis direction, and the opening shape of the mask opening It is a triangular shape parallel to the Y axis.
  • the shape of the FMM opening is a triangle or other polygons except triangles.
  • a pixel arrangement display device capable of improving color gamut and PPI.
  • the display device is used to realize the above-mentioned pixel arrangement evaporation method capable of improving color gamut and PPI.
  • the display device includes a display device and an evaporation substrate, and the display device includes a plurality of pixels.
  • Each pixel includes a number of sub-pixels with different colors, and R pixels, G pixels, and B pixels with a triangular shape that can be independently controlled and emit light are arranged in sequence on the vapor deposition substrate; and the adjacent pixels with the same appearance and color are used as Independent units, in the independent units arranged in the same row, the number of pixels in the three monochromatic independent units can be the same.
  • the R pixel is a red color triangle
  • the G pixel is a green color triangle
  • the B pixel is a blue color triangle
  • sub-pixels of the same color in the independent unit are adjacent and symmetrical to each other, and the adjacent ones are the same.
  • the width of the vertical side and the adjacent side of the area composed of color sub-pixels is equal.
  • the MASK of R, G, and B pixels is easier to process and not deformed than the existing FMM technology MASK because the width of the opening and the connecting bridge is larger, and the distance between different pixels increases. , Which is beneficial to avoid color mixing, is beneficial to improve product yield, vapor deposition alignment Margin is larger, FMM replacement frequency is reduced, resulting in increased productivity and reduced FMM cleaning loss.
  • the FMM connecting bridge is wider, not easy to deform, and can produce OLEDs with higher pixel density. Display screen.
  • OLED device pixel arrangement design and evaporation method can not only improve the resolution of the device, improve the operability of FMM production and evaporation process, increase productivity and yield, and can stably provide OLED devices with excellent reliability and display quality at low cost .
  • Figure 1 is a schematic diagram of the evaporation principle of FMM pixel single-layer film evaporation in the existing mass production technology
  • Figure 2 is a schematic diagram of the pixel arrangement design and evaporation method of a high color gamut, high PPIOLED device
  • FIG. 3 is a schematic diagram of RGB pixels arranged on a vapor-deposited substrate according to an embodiment of the present application
  • FIG. 4 is another schematic diagram of RGB pixels arranged on a vapor-deposited substrate according to an embodiment of the present application
  • Figure 5 shows that the number of pixels in three single-color independent units can be the same.
  • the number of sub-pixels in each independent unit is 3N+1 or 3N+2. All the pixel arrangements where N is a positive integer and the same unit is made of the same FMM Schematic diagram of film formation by vapor deposition method with openings;
  • Figure 6 is a schematic diagram of an FMM opening method
  • FIG. 7 is a schematic diagram of another FMM opening method
  • FIG. 8 is a schematic block diagram of a vapor deposition method for pixel arrangement that can improve color gamut and PPI according to an embodiment of the present application.
  • this embodiment discloses an evaporation method for pixel arrangement that can improve color gamut and PPI, which includes the following steps:
  • S1 regards the pixels with the same appearance and color immediately adjacent to the vapor-deposited substrate as independent units
  • S2 sets the number of sub-pixels in each independent unit to 3N+1 or 3N+2, and N is a positive integer;
  • S3 sets FMM openings on the vapor-deposited substrate
  • S4 vapor-deposits all the pixel arrangement methods set in S2 and the same cell by the vapor deposition method of the same FMM opening into a film.
  • an evaporation zone is included during evaporation, and the evaporation zone is provided with an evaporation unit, an evaporation source, and an evaporation mask.
  • the vapor deposition source is provided with vapor deposition source openings that respectively emit vapor deposition particles, and restriction openings through which the vapor deposition particles discharged from the vapor deposition source openings respectively pass are provided by a restriction unit.
  • the vapor deposition masks are respectively provided with mask openings in vapor deposition regions where vapor deposition particles that restrict the openings reach.
  • a vapor deposition beam direction adjusting plate formed with vapor deposition beam passing holes is arranged between the vapor deposition source and the vapor deposition mask, and the vapor deposition beam is formed by passing the vapor deposition particles emitted from the vapor deposition source through the vapor deposition beam direction adjusting plate Through the hole, the direction of the vapor deposition beam is controlled.
  • the vapor deposition source openings are arranged at a fixed pitch in the X-axis direction, and each vapor deposition source opening has a nozzle shape that opens upward parallel to the Z axis, and emits vapor deposition particles that are the material of the light-emitting layer toward the vapor deposition mask.
  • the vapor deposition mask is a plate-like object whose main surface is parallel to the XY plane.
  • a plurality of mask openings are formed at different positions along the X-axis direction in the X-axis direction, and the shape of the openings of the mask openings is parallel to the Y-axis Triangle shape.
  • the shape of the FMM opening is a triangle or other polygons except triangles.
  • This embodiment discloses a high color gamut, high PPIOLED device pixel arrangement design and evaporation method, as shown in FIG. 2.
  • the purpose is to produce OLED screens with the same resolution.
  • the mask of the R, G, and B pixels of the present application is easier to process and not easily deformed because the width of the opening and the connecting bridge is larger. The increase in the distance between them is beneficial to avoid color mixing and improve the product yield.
  • the vapor deposition Margin is larger, the vapor deposition process is easy to perform, the production capacity is increased due to the reduction of FMM replacement frequency, and the FMM cleaning loss is reduced; or in other words, in When the width of the MASK opening is the same as that of the existing FMM technology, the FMM connecting bridge is wider and not easy to deform, and it can also produce OLEDs with higher pixel density and higher color gamut. Display screen.
  • the masks of R, G, and B pixels are easier to process and not easily deformed because of the larger width of the openings and connecting bridges than the masks of the existing FMM technology.
  • Increasing is beneficial to avoid color mixing, and is beneficial to improve product yield, vapor deposition alignment Margin is larger, FMM replacement frequency is reduced, resulting in increased productivity and reduced FMM cleaning loss.
  • the FMM connecting bridge when the width of the MASK opening is the same as that of the existing FMM technology, the FMM connecting bridge is wider and not easily deformed, and can produce OLEDs with higher pixel density. Display screen.
  • OLED device pixel arrangement design and evaporation method can not only improve the resolution of the device, improve the operability of FMM production and evaporation process, increase productivity and yield, and can stably provide OLED devices with excellent reliability and display quality at low cost .
  • This embodiment discloses a pixel arrangement display device and an evaporation method that can improve color gamut and PPI, as shown in FIG. 5.
  • R pixels, G pixels, and B pixels that can be independently controlled and emit light in a triangular shape are arranged in sequence; the adjacent pixels with the same appearance and color are regarded as independent units.
  • the independent units arranged in the same row three monochromatic
  • the number of pixels in independent units can be the same.
  • the number of sub-pixels in each independent unit is 3N+1 or 3N+2. All pixel arrangements where N is a positive integer and the same unit is vapor deposited by the same FMM hole. Film formation.
  • the FMM opening is shown in Figures 6 and 7.
  • the shape of the FMM opening is a triangle or other polygons except triangles.
  • the arrangement design of the R, G, and B pixels on the vapor deposition substrate is shown in Figs. 3 and 4, wherein the R pixel is a red triangle, the G pixel is a green triangle, and the B pixel is a blue triangle.
  • This embodiment includes an evaporation zone, and the evaporation zone is provided with an evaporation unit, an evaporation source, and an evaporation mask.
  • the vapor deposition source is provided with vapor deposition source openings that respectively emit vapor deposition particles, and restriction openings through which the vapor deposition particles discharged from the vapor deposition source openings respectively pass are provided by a restriction unit.
  • Each of the vapor deposition masks is provided with mask openings in vapor deposition regions where vapor deposition particles that restrict the openings reach.
  • a vapor deposition beam direction adjusting plate formed with vapor deposition beam passing holes is arranged between the vapor deposition source and the vapor deposition mask, and the vapor deposition beam is formed by passing the vapor deposition particles emitted from the vapor deposition source through the vapor deposition beam direction adjusting plate Through the hole, the direction of the vapor deposition beam is controlled.
  • the vapor deposition source openings are arranged at a fixed pitch in the X-axis direction, and each vapor deposition source opening has a nozzle shape that opens upward parallel to the Z axis, and emits vapor deposition particles that are the material of the light-emitting layer toward the vapor deposition mask.
  • the vapor deposition mask is a plate-like object whose main surface is parallel to the XY plane.
  • a plurality of mask openings are formed at different positions along the X-axis direction in the X-axis direction, and the shape of the openings of the mask openings is parallel to the Y-axis Triangle shape.
  • the sub-pixels of the same color of the pixels in the independent unit are adjacent to each other symmetrically, and the widths of the longitudinal side and the adjacent side of the area composed of the adjacent sub-pixels of the same color are equal.
  • the pixel arrangement design and evaporation method of the OLED device can not only improve the resolution of the device, improve the operability of the FMM production and evaporation process, increase the productivity and yield, and can stably provide reliability and low cost. OLED devices with excellent display quality.
  • This embodiment discloses a pixel arrangement display device and an evaporation method capable of improving color gamut and PPI.
  • R pixels, G pixels, and B pixels that can be independently controlled and emit light in a triangular shape are sequentially arranged on an evaporation substrate; Pixels with the same color are regarded as independent units.
  • the independent units arranged in the same row the number of pixels in the three monochromatic independent units can be the same.
  • the number of sub-pixels in each independent unit is 3N+1 or 3N+2, N All the pixel arrangements that are positive integers and the same unit are vapor-deposited into a film by the vapor-deposition method in which the same FMM is opened. It includes an evaporation zone, and the evaporation zone is provided with an evaporation unit, an evaporation source and an evaporation mask.
  • a vapor deposition beam direction adjusting plate in which a vapor deposition beam passing hole is formed is arranged between the vapor deposition source and the vapor deposition mask.
  • the directivity of the vapor deposition beam is improved.
  • the diameter of the vapor deposition beam passing hole is preferably about 0.1 mm to 1 mm.
  • the utilization efficiency of the vapor deposition material deteriorates.
  • the vapor deposition beam direction adjustment plate if the vapor deposition beam direction adjustment plate is applied, it is not necessary to improve the directivity of the vapor deposition beam. In the direction parallel to the moving direction of the substrate, the vapor deposition beam with poor directivity is trapped, resulting in vapor deposition. The material utilization efficiency is undesirably lowered.
  • R pixels, G pixels, and B pixels that can be independently controlled and emit light in a triangular shape are sequentially arranged on the vapor-deposited substrate; the adjacent pixels with the same appearance and color are used as independent units.
  • the number of pixels in the three monochromatic independent units can be the same.
  • the number of sub-pixels in each independent unit is 3N+1 or 3N+2. All pixel arrangements where N is a positive integer and the same unit is opened by the same FMM Evaporation method Evaporation to form a film.
  • the six sub-pixels with the same R, G, and B are arranged together as a unit.
  • This unit can be vapor-deposited through a triangular FMM opening, but the sub-pixels emit light separately.
  • the R, G, and B pixels are fabricated on the above-mentioned backplane, the distance between the same sub-pixels in one unit can be reasonably reduced, and the distance between the same sub-pixels and adjacent different units can be increased accordingly.
  • the MASK of R, G, and B pixels is easier to process and difficult to deform than the existing FMM technology MASK because of the larger width of the opening and the connecting bridge, and the distance between different pixels increases.
  • the FMM connecting bridge is wider and not easily deformed, and can produce an OLED display with a higher pixel density.
  • OLED device pixel arrangement design and evaporation method can not only improve device resolution, improve the operability of FMM production and evaporation process, increase productivity and yield, and can stably provide OLED devices with excellent reliability and display quality at low cost .
  • the subject of this application can be manufactured and used in industry and has industrial applicability.

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Abstract

本申请涉及一种可提高色域、PPI的像素排列显示设备及蒸镀方法。蒸镀基板上依次设置三角形、可独立控制、发光的R、G、B像素；并将紧邻相貌和颜色相同的像素作为独立单元，三个单色且同行排列的独立单元内的像素个数可相同，每独立单元为子像素个数3N+1或3N+2，N为正整数的像素排列，同一单元由同一FMM 开孔的蒸镀方式蒸镀成膜。

Description

可提高色域、PPI的像素排列显示设备及蒸镀方法 技术领域
本申请涉及OLED器件制作技术领域，具体涉及一种可提高色域、PPI的像素排列显示设备及蒸镀方法。
 背景技术
近年来，在各种商品和领域中使用平板显示器，要求平板显示器进一步大型化、高画质化、低耗电化。在这样的状况下，具备利用有机材料的电场发光（Electro Luminescence）的有机 EL组件的有机 EL 显示装置，作为全固体型且在能够低电压驱动、高速响应性、自发旋旋光性等 方面优异的平板显示器，受到了高度的关注。
目前OLED器件制作大多采用金属掩膜板(Fine Metal Mask, FMM)进行RGB像素 EL 膜层蒸镀，每个FMM开孔对应一个像素，现有量产技术FMM 设计一个开孔进行一个像素单层膜蒸镀，如图1所示。随着市场对高分辨需求的提高，FMM像素开孔直径越来越小，这大大增加了FMM 制作工艺以及OLED蒸镀工艺过程控制的难度。当分辨率达到300ppi以上时，这种排列方式要求精细金属掩模板（FMM）的开口及连接桥（连接相邻开孔的肋骨）均非常细小，致使不但掩模板（MASK）加工难度非常大，而且MASK对位精度、MASK阴影、MASK 受其他因素影响而变形等将严重影响有机发光材料蒸镀形成精细的彩色化像素图案。行业内针对该问题，韩国三星等领先企业虽也积极研究以LITI（激光热转印）为代表的新技术以期能够生产高分辨率的OLED显示屏，但这些新技术仍有诸多不足之处，目前还不能用于量产或量产时良率低下。比如需增加制程工序和额外的制程工艺而导致生产效率较低；需要增加设备和原材料，甚至需要开发特别的原材料，导致投资和成本增加等。即便如此，这些新技术仍难以生产450ppi以上的超高分辨率显示屏。同时FMM 像素开孔小也会增加连续蒸镀过程FMM清洗的频率，导致产能降低、蒸镀材料浪费以及FMM因清洗次数增多导致的损耗。
 技术问题
针对现有技术的不足，本申请公开了一种可提高色域、PPI的像素排列显示设备及蒸镀方法，在生产分辨率相同的OLED屏时，本申请开口及连接桥的宽度更大而易于加工且不易变形，不同像素之间距离的增大，有利于避免混色，有利于提高产品良率，蒸镀对位Margin更大，蒸镀工艺易进行，解决FMM 更换频率降低导致的产能提高以及降低FMM清洗损耗。
 技术解决方案
本申请通过以下技术方案予以实现：
一种可提高色域、PPI的像素排列蒸镀方法，所述蒸镀方法包括以下步骤：
S1将蒸镀基板上紧邻相貌和颜色相同的像素作为独立单元；
S2设置每个独立单元子像素个数为3N+1或3N+2，N为正整数；
S3在蒸镀基板上设置FMM 开孔；
S4将S2中设置后的所有像素排列方式以及同一单元由同一FMM 开孔的蒸镀方式蒸镀成膜。
更进一步的，所述S4中，蒸镀时包括蒸镀区，所述蒸镀区设有蒸镀单元、蒸镀源和蒸镀掩膜。
更进一步的，所述蒸镀源具备各自放出蒸镀颗粒的蒸镀源开口，并通过限制单元设置所述蒸镀源开口放出的上述蒸镀颗粒分别通过的限制开口。
更进一步的，所述蒸镀掩模分别通过限制开口的蒸镀颗粒到达的蒸镀区域内设置有掩模开口。
更进一步的，所述蒸镀源与蒸镀掩模之间配置形成有蒸镀束通过孔的蒸镀束方向调整板，通过使从蒸镀源放出的蒸镀颗粒通过在蒸镀束方向调整板形成的蒸镀束通过孔，控制蒸镀束的指向。
更进一步的，所述蒸镀源开口沿X轴方向以固定间距配置，各蒸镀源开口具有与Z轴平行地朝向上方开口的喷嘴形状，朝着蒸镀掩模放出作为发光层的材料的蒸镀颗粒。
更进一步的，所述蒸镀掩模是其主面与XY面平行的板状物，沿X 轴方向在X轴方向的不同位置形成有多个掩模开口，所述掩模开口的开口形状为与Y轴平行的三角形状。
更进一步的，所述FMM 开孔的形状为三角形或除三角形外的其他多边形。
一种可提高色域、PPI的像素排列显示设备，所述显示设备用于实现上述的可提高色域、PPI的像素排列蒸镀方法，包括显示装置和蒸镀基板，显示装置包括若干个像素，每一像素包括若干个颜色相异的子像素，在所述蒸镀基板上依次设置三角形状可独立控制、发光的R像素、G像素和B像素；并将紧邻相貌和颜色相同的像素作为独立单元，同一行排列的独立单元中，三个单色的独立单元内的像素个数可相同。
优选的，所述R像素为红颜色三角形，所述G像素为绿颜色三角形，所述B像素为蓝颜色三角形；所述独立单元中像素相同颜色的子像素彼此相邻对称，相邻的相同颜色的子像素组成的区域纵边和临边的宽度相等。
 有益效果
本申请的有益效果为：
本申请生产分辨率相同的OLED屏时，R、G、B像素 MASK 相比现有 FMM技术的MASK因为开口及连接桥的宽度更大而易于加工且不易变形，不同像素之间距离的增大，有利于避免混色，有利于提高产品良率、蒸镀对位Margin更大、FMM 更换频率降低导致产能提高以及降低FMM清洗损耗。
本申请在 MASK 开口宽度与现有 FMM 技术相同的情况下，FMM连接桥更宽，不易变形，可生产像素密度更高的 OLED 显示屏。OLED器件像素排列设计以及蒸镀方式既可提高器件分辨率，可提高FMM 制作、蒸镀工艺的可操作性，提高产能、良率，能够以低成本稳定地提供可靠性和显示品质优异OLED器件。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是现有量产技术FMM 像素单层膜蒸镀原理示意图；
图2是高色域、高PPIOLED器件像素排列设计以及蒸镀方式示意图；
图3是本申请实施例一种在蒸镀基板设置RGB像素示意图；
图4是本申请实施例另一种在蒸镀基板设置RGB像素示意图；
图5是三个单色的独立单元内的像素个数可相同，每个独立单元子像素个数为3N+1或3N+2，N为正整数的所有像素排列方式以及同一单元由同一FMM 开孔的蒸镀方式蒸镀成膜示意图；
图6是FMM一种开孔方式示意图；
图7是FMM另一种开孔方式示意图
图8是本申请实施例一种可提高色域、PPI的像素排列蒸镀方法原理框图。
 本发明的实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
实施例 1
如图8所示本实施例公开一种可提高色域、PPI的像素排列蒸镀方法，包括以下步骤：
S1将蒸镀基板上紧邻相貌和颜色相同的像素作为独立单元；
S2设置每个独立单元子像素个数为3N+1或3N+2，N为正整数；
S3在蒸镀基板上设置FMM 开孔；
S4将S2中设置后的所有像素排列方式以及同一单元由同一FMM 开孔的蒸镀方式蒸镀成膜。
S4中，蒸镀时包括蒸镀区，所述蒸镀区设有蒸镀单元、蒸镀源和蒸镀掩膜。蒸镀源具备各自放出蒸镀颗粒的蒸镀源开口，并通过限制单元设置所述蒸镀源开口放出的上述蒸镀颗粒分别通过的限制开口。
蒸镀掩模分别通过限制开口的蒸镀颗粒到达的蒸镀区域内设置有掩模开口。
蒸镀源与蒸镀掩模之间配置形成有蒸镀束通过孔的蒸镀束方向调整板，通过使从蒸镀源放出的蒸镀颗粒通过在蒸镀束方向调整板形成的蒸镀束通过孔，控制蒸镀束的指向。
蒸镀源开口沿X轴方向以固定间距配置，各蒸镀源开口具有与Z轴平行地朝向上方开口的喷嘴形状，朝着蒸镀掩模放出作为发光层的材料的蒸镀颗粒。蒸镀掩模是其主面与XY面平行的板状物，沿X 轴方向在X轴方向的不同位置形成有多个掩模开口，所述掩模开口的开口形状为与Y轴平行的三角形状。FMM 开孔的形状为三角形或除三角形外的其他多边形。
实施例 2
本实施例公开一种高色域、高PPIOLED器件像素排列设计以及蒸镀方式，如图2所示。其目的在于生产分辨率相同的OLED屏时，本申请方案的R、G、B像素 MASK 相比现有 FMM技术的MASK因为开口及连接桥的宽度更大而易于加工且不易变形，不同像素之间距离的增大，有利于避免混色，有利于提高产品良率，蒸镀对位Margin更大，蒸镀工艺易进行，FMM 更换频率降低导致的产能提高以及降低FMM清洗损耗；或者换言之，在 MASK 开口宽度与现有 FMM 技术相同的情况下，FMM连接桥更宽，不易变形，还可以生产像素密度更高、色域更高的 OLED 显示屏。
本申请实施例生产分辨率相同的OLED屏时，R、G、B像素 MASK 相比现有 FMM技术的MASK因为开口及连接桥的宽度更大而易于加工且不易变形，不同像素之间距离的增大，有利于避免混色，有利于提高产品良率、蒸镀对位Margin更大、FMM 更换频率降低导致产能提高以及降低FMM清洗损耗。
本申请实施例在 MASK 开口宽度与现有 FMM 技术相同的情况下，FMM连接桥更宽，不易变形，可生产像素密度更高的 OLED 显示屏。OLED器件像素排列设计以及蒸镀方式既可提高器件分辨率，可提高FMM 制作、蒸镀工艺的可操作性，提高产能、良率，能够以低成本稳定地提供可靠性和显示品质优异OLED器件。
实施例 3
本实施例公开一种可提高色域、PPI的像素排列显示设备及蒸镀方法，如图5所示。在蒸镀基板上依次设置三角形状可独立控制、发光的R像素、G像素和B像素；并将紧邻相貌和颜色相同的像素作为独立单元，同一行排列的独立单元中，三个单色的独立单元内的像素个数可相同，每个独立单元子像素个数为3N+1或3N+2，N为正整数的所有像素排列方式以及同一单元由同一FMM 开孔的蒸镀方式蒸镀成膜。
FMM开孔如图6和7所示，FMM 开孔的形状为三角形或除三角形外的其他多边形。
蒸镀基板上R、G、B像素排列设计如图3、图4所示，其中R像素为红颜色三角形，所述G像素为绿颜色三角形，所述B像素为蓝颜色三角形。
本实施例中包括蒸镀区，所述蒸镀区设有蒸镀单元、蒸镀源和蒸镀掩膜。蒸镀源具备各自放出蒸镀颗粒的蒸镀源开口，并通过限制单元设置所述蒸镀源开口放出的上述蒸镀颗粒分别通过的限制开口。
该蒸镀掩模分别通过限制开口的蒸镀颗粒到达的蒸镀区域内设置有掩模开口。蒸镀源与蒸镀掩模之间配置形成有蒸镀束通过孔的蒸镀束方向调整板，通过使从蒸镀源放出的蒸镀颗粒通过在蒸镀束方向调整板形成的蒸镀束通过孔，控制蒸镀束的指向。
蒸镀源开口沿X轴方向以固定间距配置，各蒸镀源开口具有与Z轴平行地朝向上方开口的喷嘴形状，朝着蒸镀掩模放出作为发光层的材料的蒸镀颗粒。蒸镀掩模是其主面与XY面平行的板状物，沿X 轴方向在X轴方向的不同位置形成有多个掩模开口，所述掩模开口的开口形状为与Y轴平行的三角形状。
独立单元中像素相同颜色的子像素彼此相邻对称，相邻的相同颜色的子像素组成的区域纵边和临边的宽度相等。
本实施例中，OLED器件像素排列设计以及蒸镀方式既可提高器件分辨率，可提高FMM 制作、蒸镀工艺的可操作性，提高产能、良率，能够以低成本稳定地提供可靠性和显示品质优异OLED器件。
实施例 4
本实施例公开一种可提高色域、PPI的像素排列显示设备及蒸镀方法，在蒸镀基板上依次设置三角形状可独立控制、发光的R像素、G像素和B像素；并将紧邻相貌和颜色相同的像素作为独立单元，同一行排列的独立单元中，三个单色的独立单元内的像素个数可相同，每个独立单元子像素个数为3N+1或3N+2，N为正整数的所有像素排列方式以及同一单元由同一FMM开孔的蒸镀方式蒸镀成膜。包括蒸镀区，所述蒸镀区设有蒸镀单元、蒸镀源和蒸镀掩膜。
在蒸镀源与蒸镀掩模之间配置形成有蒸镀束通过孔的蒸镀束方向调整板。通过使从蒸镀源放出的蒸镀颗粒通过在蒸镀束方向调整板形成的蒸镀束通过孔，提高蒸镀束的指向性。为了充分提高指向性，蒸镀束通过孔的直径优选约为0.1mm～1mm。但是，使用这种形成有小直径的蒸镀束通过孔的蒸镀束方向调整板时，与上述的提高掩模开口的纵横比时存在相同的问题。即蒸镀束通过孔，由其直径小，蒸镀颗粒容易附着于蒸镀束通过孔的内周面而导致堵塞。
另外，以高精度形成多个小直径的蒸镀束通过孔在技术上是困难的，成本变高。当为了改善加工性而增大蒸镀束通过孔的直径时，为了得到蒸镀束所期望的指向性，需要增厚蒸镀束方向调整板，其结果，蒸镀束方向调节板的自重引起挠曲变形，随之指向性、模糊部分的宽度变得不再固定。无法通过蒸镀束通过孔的蒸镀颗粒量多，蒸镀速率降低。
蒸镀材料的利用效率变差。新蒸镀法中适用蒸镀束方向调整板，则不需要提高蒸镀束的指向性，在与基板的移动方向平行的方向上，指向性差的蒸镀束被捕集，因此，导致蒸镀材料的利用效率不希望的降低。
本实施例中，具有能够对大型的基板进行分涂蒸镀的优点，在防止蒸镀材料的利用效率降低的同时减小模糊部分的宽度是困难的。为了使模糊部分不达到相邻的不同颜色的发光层区域，以使得不发生混色，需要减小像素的开口宽度或者增大像素间隔而增大非发光区域。但是，如果减小像素的开口幅度，则发光区域减小从而亮度降低。为了得到需要的亮度而提高电流密度，则有机EL组件寿命变短，或者变得容易损伤，可靠性下降。另一方面，如果增大像素间距，则不能实现高精细的显示，显示品质降低。
因此本实施例中在蒸镀基板上依次设置三角形状可独立控制、发光的R像素、G像素和B像素；并将紧邻相貌和颜色相同的像素作为独立单元，同一行排列的独立单元中，三个单色的独立单元内的像素个数可相同，每个独立单元子像素个数为3N+1或3N+2，N为正整数的所有像素排列方式以及同一单元由同一FMM开孔的蒸镀方式蒸镀成膜。
其R、G、B相同的六个子像素排列在一起作为一个单元，此单元可以通过一个三角形FMM开口蒸镀,但子像素单独发光。上述背板制作R、G、B像素时一个单元中的相同子像素之间距离可以合理减小，相应的其与相邻的不同单元之间距离增大。在生产分辨率相同的OLED屏时，R、G、B像素MASK相比现有FMM技术的MASK因为开口及连接桥的宽度更大而易于加工且不易变形，不同像素之间距离的增大，有利于避免混色，有利于提高产品良率、蒸镀对位Margin更大、FMM更换频率降低导致产能提高以及降低FMM清洗损耗。在MASK开口宽度与现有FMM技术相同的情况下，FMM连接桥更宽，不易变形，可生产像素密度更高的OLED显示屏。OLED器件像素排列设计以及蒸镀方式既可提高器件分辨率，可提高FMM制作、蒸镀工艺的可操作性，提高产能、良率，能够以低成本稳定地提供可靠性和显示品质优异OLED器件。
以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。
 工业实用性
本申请的主题可以在工业中制造和使用，具备工业实用性。

Claims (17)

  1. 一种可提高色域、PPI的像素排列蒸镀方法，其包括以下步骤：
    S1将蒸镀基板上紧邻相貌和颜色相同的像素作为独立单元；
    S2设置每个独立单元子像素个数为3N+1或3N+2，N为正整数；
    S3在蒸镀基板上设置FMM 开孔；
    S4将S2中设置后的所有像素排列方式以及同一单元由同一FMM 开孔的蒸镀方式蒸镀成膜。
  2. 根据权利要求1所述的可提高色域、PPI的像素排列蒸镀方法，其中，所述S4中，蒸镀时包括蒸镀区，所述蒸镀区设有蒸镀单元、蒸镀源和蒸镀掩膜。
  3. 根据权利要求2所述的可提高色域、PPI的像素排列蒸镀方法，其中，所述蒸镀源具备各自放出蒸镀颗粒的蒸镀源开口，并通过限制单元设置所述蒸镀源开口放出的上述蒸镀颗粒分别通过的限制开口。
  4. 根据权利要求2所述的可提高色域、PPI的像素排列蒸镀方法，其中，所述蒸镀掩模分别通过限制开口的蒸镀颗粒到达的蒸镀区域内设置有掩模开口。
  5. 根据权利要求2所述的可提高色域、PPI的像素排列蒸镀方法，其中，所述蒸镀源与蒸镀掩模之间配置形成有蒸镀束通过孔的蒸镀束方向调整板，通过使从蒸镀源放出的蒸镀颗粒通过在蒸镀束方向调整板形成的蒸镀束通过孔，控制蒸镀束的指向。
  6. 根据权利要求3所述的可提高色域、PPI的像素排列蒸镀方法，其中，所述蒸镀源开口沿X轴方向以固定间距配置，各蒸镀源开口具有与Z轴平行地朝向上方开口的喷嘴形状，朝着蒸镀掩模放出作为发光层的材料的蒸镀颗粒。
  7. 根据权利要求4所述的可提高色域、PPI的像素排列蒸镀方法，其中，所述蒸镀掩模是其主面与XY面平行的板状物，沿X 轴方向在X轴方向的不同位置形成有多个掩模开口，所述掩模开口的开口形状为与Y轴平行的三角形状。
  8. 根据权利要求1所述的可提高色域、PPI的像素排列蒸镀方法，其中，所述FMM 开孔的形状为三角形或除三角形外的其他多边形。
  9. 一种可提高色域、PPI的像素排列显示设备，所述显示设备用于实现如权利要求1所述的可提高色域、PPI的像素排列蒸镀方法，其包括显示装置和蒸镀基板，显示装置包括若干个像素，每一像素包括若干个颜色相异的子像素，在所述蒸镀基板上依次设置三角形状可独立控制、发光的R像素、G像素和B像素；并将紧邻相貌和颜色相同的像素作为独立单元，同一行排列的独立单元中，三个单色的独立单元内的像素个数可相同。
  10. 根据权利要求9所述的可提高色域、PPI的像素排列显示设备，其中，所述R像素为红颜色三角形，所述G像素为绿颜色三角形，所述B像素为蓝颜色三角形；所述独立单元中像素相同颜色的子像素彼此相邻对称，相邻的相同颜色的子像素组成的区域纵边和临边的宽度相等。
  11. 根据权利要求9所述的可提高色域、PPI的像素排列显示设备，其中，蒸镀时包括蒸镀区，所述蒸镀区设有蒸镀单元、蒸镀源和蒸镀掩膜。
  12. 根据权利要求11所述的可提高色域、PPI的像素排列显示设备，其中，所述蒸镀源具备各自放出蒸镀颗粒的蒸镀源开口，并通过限制单元设置所述蒸镀源开口放出的上述蒸镀颗粒分别通过的限制开口。
  13. 根据权利要求11所述的可提高色域、PPI的像素排列显示设备，其中，所述蒸镀掩模分别通过限制开口的蒸镀颗粒到达的蒸镀区域内设置有掩模开口。
  14. 根据权利要求11所述的可提高色域、PPI的像素排列显示设备，其中，所述蒸镀源与蒸镀掩模之间配置形成有蒸镀束通过孔的蒸镀束方向调整板，通过使从蒸镀源放出的蒸镀颗粒通过在蒸镀束方向调整板形成的蒸镀束通过孔，控制蒸镀束的指向。
  15. 根据权利要求12所述的可提高色域、PPI的像素排列显示设备，其中，所述蒸镀源开口沿X轴方向以固定间距配置，各蒸镀源开口具有与Z轴平行地朝向上方开口的喷嘴形状，朝着蒸镀掩模放出作为发光层的材料的蒸镀颗粒。
  16. 根据权利要求13所述的可提高色域、PPI的像素排列显示设备，其中，所述蒸镀掩模是其主面与XY面平行的板状物，沿X 轴方向在X轴方向的不同位置形成有多个掩模开口，所述掩模开口的开口形状为与Y轴平行的三角形状。
  17. 根据权利要求9所述的可提高色域、PPI的像素排列显示设备，其中，所述FMM 开孔的形状为三角形或除三角形外的其他多边形。 
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