WO2021168705A1 - 磁性元件转接装置以及电动汽车 - Google Patents

磁性元件转接装置以及电动汽车 Download PDF

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Publication number
WO2021168705A1
WO2021168705A1 PCT/CN2020/076837 CN2020076837W WO2021168705A1 WO 2021168705 A1 WO2021168705 A1 WO 2021168705A1 CN 2020076837 W CN2020076837 W CN 2020076837W WO 2021168705 A1 WO2021168705 A1 WO 2021168705A1
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Prior art keywords
circuit board
magnetic element
conversion circuit
adapter device
main power
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PCT/CN2020/076837
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English (en)
French (fr)
Inventor
李赞
胡定高
吴壬华
Original Assignee
深圳欣锐科技股份有限公司
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Application filed by 深圳欣锐科技股份有限公司 filed Critical 深圳欣锐科技股份有限公司
Priority to PCT/CN2020/076837 priority Critical patent/WO2021168705A1/zh
Priority to CN202080003121.5A priority patent/CN112602383B/zh
Publication of WO2021168705A1 publication Critical patent/WO2021168705A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Definitions

  • This application relates to the field of electrical technology, in particular to a magnetic element adapter device and an electric vehicle.
  • the magnetic components are generally directly soldered on the main power circuit board and then contacted with the radiator for heat dissipation.
  • This connection method may cause poor heat dissipation due to poor contact with the radiator; at the same time, the Method Due to the limitation of device density and the large number of pins of magnetic components, it is difficult to install magnetic components and affect production efficiency.
  • the devices installed by this method will be subject to certain stress due to the device. Increased risk of damage.
  • the present application provides a magnetic element adapter device.
  • the internal components of the magnetic component adapter device are reasonably installed, which facilitates the easy installation of magnetic components such as transformers and inductors, and solves the problem of large lead tolerances of magnetic components and more lead wires. Trouble with installation.
  • An embodiment of the present application provides a magnetic element adapter device, which may include a magnetic element, a conversion circuit board, and a main power circuit board.
  • the magnetic element may include M pins, where M is an integer greater than 0; the conversion circuit board It may include N electrical connectors, where N is an integer greater than 0 and less than M; the magnetic element is electrically connected to the N electrical connectors of the conversion circuit board through the M pins, wherein each is electrically connected
  • the main power circuit board is electrically connected to one or more pins, and each pin is connected to an electrical connector; the main power circuit board is electrically connected to the conversion circuit board through the N electrical connectors.
  • the magnetic element adapter device may further include a housing and a heat dissipation component housed in the housing, the heat dissipation component is used to dissipate heat for the main power circuit board, and the housing surface is provided with a recess. Groove, the groove is used to accommodate the magnetic element.
  • the magnetic element may include a first transformer, a second transformer, and a resonant inductor.
  • the conversion circuit board may further include at least one foolproof hole; the groove surface is provided with a mounting portion, and the mounting portion cooperates with the foolproof hole to make the conversion circuit board and The housing is connected.
  • the mounting portion may include at least one screw hole, and the screw hole is used to cooperate with the foolproof hole through a screw, so that the conversion circuit board and the housing are connected.
  • the conversion circuit board may further include M pin holes, and the M pin holes are electrically connected to the N electrical connectors through the conversion circuit of the conversion circuit board; The two pin holes are used to cooperate with the M pins, so that the magnetic element is electrically connected to the conversion circuit board.
  • the conversion circuit board may further include at least one potting hole for pouring heat dissipation potting glue into the groove; the heat dissipation potting glue is used for dissipating heat for the magnetic element.
  • the N electrical connectors may include N ring connectors for electrical connection between the main power circuit board and the conversion circuit board.
  • the heat dissipation component may include a water-cooled heat dissipation component or an air-cooled heat dissipation component.
  • the magnetic element is transferred to the main power circuit board through the conversion circuit board, so as to solve the pin tolerance in the process of direct connection of the magnetic element to the main power circuit board in the prior art Problems such as large and inconvenient installation.
  • the magnetic element is soldered to the conversion circuit board through the pins first, that is, the two are formed as a whole through Printed Circuit Board Assembly (PCBA), avoiding direct contact between the magnetic element and the main power circuit board .
  • PCBA Printed Circuit Board Assembly
  • the present application also provides an electric vehicle.
  • the electric vehicle may include a vehicle body and the magnetic element adapter device in the above-mentioned embodiments, the magnetic element adapter device is arranged in the vehicle body, and the magnetic element adapter device Used to install magnetic components.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a first magnetic element adapter device provided by an embodiment of this application;
  • FIG. 2 is an exploded schematic diagram of the three-dimensional structure of the first magnetic element adapter device provided by an embodiment of the application;
  • FIG. 3 is a schematic plan view of a first type of magnetic element adapter device provided by an embodiment of the application
  • FIG. 4 is a schematic diagram of a three-dimensional structure of a second type of magnetic element adapter device provided by an embodiment of the application;
  • FIG. 5 is an exploded schematic diagram of the three-dimensional structure of the second type of magnetic element adapter device provided by an embodiment of the application;
  • FIG. 6 is a schematic diagram of the installation structure of a magnetic element adapter device provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of a housing structure of a magnetic element adapter device provided by an embodiment of the application.
  • FIG. 8 is a schematic diagram of a three-dimensional structure of a magnetic element in a magnetic element adapter device provided by an embodiment of the application;
  • FIG. 9 is a schematic diagram of a housing installation structure of a magnetic element adapter device provided by an embodiment of the application.
  • FIG. 10 is a schematic diagram of a mounting structure of a conversion circuit board and a magnetic element according to an embodiment of the application;
  • FIG. 11 is a schematic diagram of a three-dimensional structure of a conversion circuit board provided by an embodiment of the application.
  • FIG. 12 is a circuit schematic diagram of a conversion circuit on a conversion circuit board provided by an embodiment of the application.
  • FIG. 13 is a schematic diagram of a structure of a potting hole provided by an embodiment of the application.
  • FIG. 14 is a schematic structural diagram of an electric vehicle provided by an embodiment of the application.
  • FIG. 1 is a schematic diagram of the three-dimensional structure of the first magnetic component adapter device provided by an embodiment of the application
  • FIG. 2 is a schematic diagram of the first magnetic component adapter device provided by an embodiment of the application.
  • Exploded schematic diagram of three-dimensional structure the magnetic element adapter device 10 may include a magnetic element 101, a conversion circuit board 102, and a main power circuit board 103.
  • the embodiment of the present application does not limit the specific electrical connection structure; the conversion circuit board 102 may include N electrical connections.
  • the specific connection structure is shown in FIG. 2, the magnetic element 101 is connected to the conversion circuit board 102, and the main power circuit board 103 is connected with the conversion circuit board 102 through the screw 105 and the electrical connector 1021.
  • the magnetic element is transferred to the main power circuit board through the conversion circuit board, so as to solve the pin tolerance in the process of direct connection of the magnetic element to the main power circuit board in the prior art Problems such as large and inconvenient installation.
  • the magnetic element is soldered to the conversion circuit board through the pins first, that is, the two are formed as a whole through Printed Circuit Board Assembly (PCBA), avoiding direct contact between the magnetic element and the main power circuit board .
  • PCBA Printed Circuit Board Assembly
  • the magnetic components are usually composed of windings and magnetic cores, used for energy storage, energy conversion and electrical isolation, etc., mainly including transformers and inductors; because magnetic components are one of the most important components of power electronics technology , Magnetic components are basically used in all power circuits.
  • the conversion circuit board 102 is electrically connected to the magnetic element 101 through pin holes on the circuit board, and is electrically connected to the main power circuit board 103 through an electrical connector on the circuit board. Electrical connection; in the embodiment of the present application, the magnetic element 101 is transferred to the main power circuit board 103 through the conversion circuit board 102, which solves the problem that the magnetic element is directly connected to the main power circuit board in the prior art There are problems with pin tolerances and inconvenience in installation.
  • the main power circuit board 103 is a circuit board that undertakes certain functions.
  • the main power circuit board may be a circuit board of an on-board power supply, which can convert voltage; the embodiment of the present application does not limit the role of the main power circuit board.
  • the magnetic element adapter device 10 in the embodiment of the present application is used to easily install magnetic elements such as transformers and inductors. Furthermore, a method for mounting magnetic components is provided for a circuit board with corresponding functions in a device (such as an electric vehicle) to which the magnetic component adapter device 10 is applied.
  • the circuit board with the corresponding function may be, but is not limited to, the on-board power supply circuit board in the electric vehicle.
  • the conversion circuit board 102 may be, but is not limited to, a printed circuit board (PCB), a ceramic circuit board, an ultra-thin circuit board, or the like.
  • the main power circuit board 103 may be, but is not limited to, a printed circuit board (PCB), a ceramic circuit board, an ultra-thin circuit board, or the like.
  • FIG. 3 is a schematic diagram of a plane structure of the first type of magnetic element adapter device provided by an embodiment of the application, and FIG. 3 shows a plane structure of the first type of magnetic component adapter device with a certain viewing angle.
  • the magnetic element adapter device 10 of this embodiment can be combined with the previously described embodiment.
  • the screw 105 may include a screw 105d
  • the electrical connector 1021 may include an electrical connector 102r.
  • the screw 105d and the electrical connector 102r may be connected by the structure shown in the figure (for example, the screw 105d passes through the hole corresponding to its own position on the main power circuit board 103, and screw the exposed threaded part along the internal thread of the circular electrical connector 102r to fix the two).
  • the screw connection structure of is not limited, such as the gasket used in the connection structure shown in the figure.
  • the screw 105d and the electrical connector 102r are only exemplary descriptions of the connection structure of the main power circuit board and the conversion circuit board, and other similar connection structures of the screw and the electrical connector will not be repeated here.
  • the embodiment of the present application does not limit the specific structure of the electrical connector and the specific structure of the screw.
  • FIG. 4 is a three-dimensional structural diagram of a second type of magnetic element transfer device provided by an embodiment of this application
  • FIG. 5 is a second type of magnetic element transfer device provided by an embodiment of this application.
  • FIG. 6 is a schematic diagram of the installation structure of a magnetic element adapter device provided by an embodiment of the application
  • FIG. 7 is a schematic diagram of the housing structure of a magnetic element adapter device provided by an embodiment of the application .
  • the magnetic element adapter device 10 of the embodiment of the present application may be combined with the previously described embodiments.
  • the magnetic element adapter device 10 may further include a housing 104 and a heat dissipation component housed in the housing 104
  • the heat dissipating component is used to dissipate heat for the main power circuit board 103, and the heat dissipating component is in contact with the main power circuit board 103.
  • the embodiment of the present application does not limit the type, position, and specific connection manner of the heat dissipating component.
  • the surface of the housing 104 is provided with a groove 1041, and the groove 1041 is used to receive the magnetic element 101.
  • the heat dissipation component may include a water-cooled heat dissipation component or an air-cooled heat dissipation component.
  • the main power circuit board 103 is housed in the housing 104.
  • the shape of the groove 1041 matches the shape of the magnetic element 101, and can match and accommodate the magnetic element 101, which not only plays a fixed role, but also reasonably and adequately. Utilize the space of the shell effectively.
  • FIG. 8 is a schematic diagram of a three-dimensional structure of a magnetic element in a magnetic element adapter device provided by an embodiment of the application.
  • the magnetic element adapter device 10 of the embodiment of the present application may be combined with the previously described embodiment.
  • the magnetic element 101 may be electrically connected to the conversion circuit board through pins.
  • the magnetic element 101 may include a first transformer 1011, a second transformer 1012, and a resonant inductor 1013.
  • the first transformer 1011 may include four pins
  • the second transformer 1012 may include four pins
  • the resonant inductor 1013 may include two pins; the specific structure of the magnetic element in the embodiment of the present application Not limited.
  • the magnetic element 101 is more compactly arranged on the conversion circuit board 102, and the magnetic element is reduced.
  • the occupied space of 101 reduces the area requirement of the conversion circuit board 102 and matches the groove 1041 appropriately, thereby reducing the volume of the magnetic element adapter device 10.
  • FIG. 9 is a schematic diagram of a housing installation structure of a magnetic element adapter device provided by an embodiment of the application.
  • the magnetic element adapter device 10 of the embodiment of the present application may be combined with the previously described embodiment.
  • the conversion circuit board 102 may further include at least one foolproof hole; the surface of the groove 1041 is provided with a mounting portion 10411, the mounting portion 10411 is matched with the foolproof hole, so that the conversion circuit board 102 is connected to the housing 104.
  • the present application does not limit the specific structure of the mounting portion.
  • the mounting portion may include a protrusion structure, a screw hole, and other structures capable of fixing and connecting.
  • the conversion circuit board 102 may include 4 foolproof holes, as shown in FIG. 9, may include a first foolproof hole 102a, a second foolproof hole 102b, a third foolproof hole 102c, and a fourth foolproof hole 102c.
  • the mounting portion 10411 may include 4 screw holes, specifically a first screw hole 10411a, a second screw hole 10411b, a third screw hole 10411c, and a fourth screw hole 10411d; as shown in FIG.
  • connection The magnetic components on the conversion circuit board are put into the corresponding grooves of the housing, and each screw of the screws is passed through the foolproof holes in turn, and then firmly combined with the screw holes, so that the conversion circuit board 102 and the housing 104 connection; for example, the first fool-proof hole 102a corresponds to the first screw hole 10411a, and the screw can be used to pass through the first fool-proof hole 102a, and then be connected and fixed with the first screw hole 10411a.
  • the first fool-proof hole 102a corresponds to the first screw hole 10411a
  • the screw can be used to pass through the first fool-proof hole 102a, and then be connected and fixed with the first screw hole 10411a.
  • the screws pass through the foolproof holes of the conversion circuit board and are locked and fixed with the screw holes of the housing.
  • the conversion circuit board 102 and the housing 104 are connected to fasten the conversion circuit board 102 and the housing 104.
  • the function of the shell 104 is to prevent the vibration and displacement of the components.
  • FIG. 10 is a schematic diagram of a mounting structure of a conversion circuit board and a magnetic element provided by an embodiment of the application
  • FIG. 11 is a schematic diagram of a three-dimensional structure of a conversion circuit board provided by an embodiment of the application
  • Figure 12 is a circuit schematic diagram of a conversion circuit on a conversion circuit board provided by an embodiment of the application.
  • the magnetic element adapter device 10 of the embodiment of the present application can be combined with any of the previously described embodiments.
  • the first transformer 1011 is welded to the third pin hole 102g through the first pin 1011a
  • the second pin 1011b is welded to the first pin hole 102e
  • the third pin 1011c is welded to the second pin hole 102f
  • the fourth pin 1011d is welded to the fourth pin hole 102h, so that the first transformer 1011 is mounted on
  • the conversion circuit board is electrically connected to the conversion circuit board, the pin 1013a of the resonant inductor 1013 and the ninth pin hole 102m are soldered, and the pin 1013b and the tenth pin hole 102n are soldered, so that the re
  • the conversion circuit board 102 may include a first electrical connector 102o, a second electrical connector 102p, a third electrical connector 102q, and a fourth electrical connector 102r.
  • the M pin holes are connected to the N electrical connectors through the corresponding circuits; the M pins can be matched with the M pin holes by welding or the like, which not only makes the M pins electrically connect with the N electrical connectors,
  • the magnetic element 101 is also electrically connected to the conversion circuit board 102.
  • the embodiment of the present application does not limit the matching manner of the pin hole and the pin, for example, by welding the pin in the pin hole. Among them, 10 pin holes are connected to 4 electrical connectors through the circuit shown in Figure 12. After the magnetic elements are installed, electrical connections are made between the magnetic elements and between the magnetic elements and the electrical connectors to meet the corresponding functions. Require.
  • the embodiment of the present application does not limit the specific conversion circuit.
  • A, B, C, and D are all electrical connectors, corresponding to the first electrical connector 102o, the second electrical connector 102p, the third electrical connector 102q, and the fourth electrical connector 102r in Figure 11 ,
  • Port 1, port 2, port 3, and port 4 of the transformer T1 correspond to the four pins of the first transformer 1011
  • port 1, port 2, port 3, and port 4 of the transformer T2 correspond to the second transformer
  • the four pins of 1012, port 1 and port 2 of the inductor L13 correspond to the two pins of the resonant inductor 1013.
  • the first transformer 1011 is welded to the third pin hole 102g through the first pin 1011a
  • the second pin 1011b is welded to the first pin hole 102e
  • the third pin 1011c is welded to the second pin hole 102f
  • the fourth pin 1011d is welded to the fourth pin hole 102h
  • the second transformer 1012 is welded to the fifth pin hole 102i through the fifth pin 1012a
  • the sixth pin 1012b is welded to the sixth pin hole 102j.
  • the seventh pin 1012c is welded to the seventh pin hole 102k, and the eighth pin 1012d is welded to the eighth pin hole 1021; the resonant inductor 1013 is welded to the ninth pin hole 102m through the ninth pin 1013a, and The tenth pin 1013b is welded to the tenth pin hole 102n, and the required magnetic components and the conversion circuit board are closely and effectively electrically connected.
  • FIG. 13 is a schematic diagram of the structure of a potting hole provided by an embodiment of the application.
  • the magnetic element adapter device 10 in the embodiment of the present application may be combined with the previously described embodiment, and the conversion circuit board 102 may also include at least one injection hole.
  • three injection holes are taken as an example To illustrate, it specifically includes a first potting hole 102s, a second potting hole 102t, and a third potting hole 102u.
  • the potting hole is used to fill the groove 1041 with heat-dissipating potting glue;
  • the sealing compound is used to dissipate heat for the magnetic element 101.
  • the groove 1041 can accommodate the conversion circuit board 102 and the magnetic element 101, it protects the conversion circuit board 102, the magnetic element 101, and related structures, thereby ensuring that the magnetic element
  • the adapter device 10 operates stably, and the injected heat dissipation potting glue plays a role of dissipating heat for the components.
  • FIG. 14 is a schematic structural diagram of an electric vehicle provided by an embodiment of the application.
  • the electric vehicle 1 may include a vehicle body 12 and the magnetic element adapter device 10, the magnetic element adapter device 10 is disposed in the vehicle body 12, and the magnetic element adapter device 10 is any one of the foregoing implementations.
  • the magnetic component adapter device in the example is used to switch the required magnetic component to the target circuit board. Since the magnetic component is switched by the magnetic component switching device 10, a series of problems caused by the direct connection of the pins of the magnetic component to the target circuit board are avoided.

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Abstract

一种磁性元件转接装置以及电动汽车，该磁性元件转接装置（10）包括磁性元件（101）、转换电路板（102）和主功率电路板（103），该磁性元件包括M个引脚，M为大于0的整数；该转换电路板包括N个电气连接器，N为大于0且小于M的整数；该磁性元件通过该M个引脚与该转换电路板的N个电气连接器电连接，其中，每个电气连接器与一个或多个引脚电连接，每个引脚连接一个电气连接器；该主功率电路板通过该N个电气连接器与该转换电路板电连接。由于磁性元件通过转换电路板转接在主功率电路板上，解决现有技术中磁性元件直接与主功率电路板连接过程中存在的引脚公差大以及不便安装等问题。

Description

磁性元件转接装置以及电动汽车 技术领域
本申请涉及电气技术领域，尤其涉及一种磁性元件转接装置以及电动汽车。
背景技术
近年来，随着新能源汽车行业的发展以及国家对环境的重视，新能源汽车需求量大幅增加，而电动汽车作为新能源汽车的主流产品，其中的车载电源作为新能源电动汽车的重要部件，其需求也日益增长。但是对车载电源的要求逐步提升，导致电源体积逐渐减小，功率密度不断上升，器件密度大幅增加。
目前，在安装车载电源的磁性元件过程中，一般直接将磁性元件焊接在主功率电路板上再与散热器接触散热，该连接方法可能由于与散热器接触不好而导致散热不良；同时，该方法由于器件密度限制以及磁性元件的引脚较多，导致磁性元件难以安装而影响生产效率；在汽车长期震动的运行环境中，采用该方法安装完成的器件会由于器件存在一定的应力，而导致损坏风险增加。
申请内容
本申请提供一种磁性元件转接装置，所述磁性元件转接装置的内部器件安装合理，便于简易安装变压器、电感等磁性元件，且解决了磁性元件的引脚公差较大以及引线较多而安装繁琐的问题。
本申请实施例提供一种磁性元件转接装置，可以包括磁性元件、转换电路板和主功率电路板，所述磁性元件可以包括M个引脚，M为大于0的整数；所述转换电路板可以包括N个电气连接器，N为大于0且小于M的整数；所述磁性元件通过所述M个引脚与所述转换电路板的N个电气连接器电连接，其中，每个电气连接器与一个或多个引脚电连接，每个引脚连接一个电气连接器；所述主功率电路板通过所述N个电气连接器与所述转换电路板电连接。
在一个实施例中，所述磁性元件转接装置还可以包括外壳和收容在所述外壳内的散热部件，所述散热部件用于为所述主功率电路板散热，所述外壳表面开设有凹槽，所述凹槽用于收容所述磁性元件。
在一个实施例中，所述磁性元件可以包括第一变压器、第二变压器和谐振 电感。
在一个实施例中，所述转换电路板还可以包括至少一个防呆孔；所述凹槽表面设置有安装部，所述安装部通过与所述防呆孔配合，使得所述转换电路板与所述外壳连接。
在一个实施例中，所述安装部可以包括至少一个螺丝孔，所述螺丝孔用于通过螺丝与所述防呆孔配合，使得所述转换电路板和所述外壳连接。
在一个实施例中，所述转换电路板还可以包括M个引脚孔，所述M个引脚孔通过所述转换电路板的转换电路与所述N个电气连接器电连接；所述M个引脚孔用于与所述M个引脚配合，使得所述磁性元件与所述转换电路板电连接。
在一个实施例中，所述转换电路板还可以包括至少一个灌胶孔，用于向所述凹槽灌入散热灌封胶；所述散热灌封胶用于为所述磁性元件散热。
在一个实施例中，所述N个电气连接器可以包括N个环形连接器，用于所述主功率电路板与所述转换电路板电连接。
在一个实施例中，所述散热部件可以包括水冷散热部件或者风冷散热部件。
在本申请实施例中，所述磁性元件通过所述转换电路板，转接在所述主功率电路板上，解决现有技术中磁性元件直接与主功率电路板连接过程中存在的引脚公差大以及不便安装等问题。具体地，由于所述磁性元件通过引脚先与所述转换电路板焊接，即两者通过印刷电路板装配(Printed Circuit Board Assembly，PCBA)组成一个整体，避免磁性元件与主功率电路板直接接触。然后通过螺丝和转换电路板上的电气连接器(电气连接器数量少于所述磁性元件的引脚数)进行电连接，使得所述主功率电路板和所述转换电路板能够进行电连接(或称电气连接)，不仅避免了多个引脚连接的问题，还便于磁性元件的安装。
本申请还提供一种电动汽车，所述电动汽车可以包括车体及上述实施例中的磁性元件转接装置，所述磁性元件转接装置设置在所述车体内，所述磁性元件转接装置用于安装磁性元件。
附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍。
图1为本申请实施例提供的第一种磁性元件转接装置的立体结构示意图；
图2为本申请实施例提供的第一种磁性元件转接装置的立体结构的爆炸示意图；
图3为本申请实施例提供的第一种磁性元件转接装置的平面结构示意图；
图4为本申请实施例提供的第二种磁性元件转接装置的立体结构示意图；
图5为本申请实施例提供的第二种磁性元件转接装置的立体结构的爆炸示意图；
图6为本申请实施例提供的一种磁性元件转接装置的安装结构示意图；
图7为本申请实施例提供的一种磁性元件转接装置的外壳结构示意图；
图8为本申请实施例提供的一种磁性元件转接装置中磁性元件的立体结构的示意图；
图9为本申请实施例提供的一种磁性元件转接装置的外壳安装结构示意图；
图10为本申请实施例提供的一种转换电路板和磁性元件的安装结构示意图；
图11为本申请实施例提供的一种转换电路板的立体结构示意图；
图12为本申请实施例提供的一种转换电路板上的转换电路的电路原理图；
图13为本申请实施例提供的一种灌胶孔的结构示意图；
图14为本申请实施例提供的一种电动汽车的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本申请的一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应属于本申请保护的范围。
本申请的说明书和权利要求书及所述附图中的术语“第一”、“第二”、“第三”和“第四”等是用于区别不同对象，而不是用于描述特定顺序。此外，术语“包 括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请一并参阅图1至图2，图1为本申请实施例提供的第一种磁性元件转接装置的立体结构示意图；图2为本申请实施例提供的第一种磁性元件转接装置的立体结构的爆炸示意图。在本实施例中，如图1所示，所述磁性元件转接装置10，可以包括磁性元件101、转换电路板102和主功率电路板103，所述磁性元件101可以包括M个引脚，在本实施例中，以M＝10进行说明，其中，引脚为电气连接的一种结构，本申请实施例对具体的电气连接结构不作限定；所述转换电路板102可以包括N个电气连接器，在本实施例中，以N＝4进行说明；所述磁性元件101通过所述M个引脚与所述转换电路板102的N个电气连接器电连接，其中，每个电气连接器与一个或多个引脚电连接，每个引脚连接一个电气连接器；所述主功率电路板103通过所述N个电气连接器与所述转换电路板102电连接。具体的连接结构如图2所示，磁性元件101与转换电路板102连接，主功率电路板103通过螺丝105和电气连接器1021配合，与转换电路板102连接。
在本申请实施例中，所述磁性元件通过所述转换电路板，转接在所述主功率电路板上，解决现有技术中磁性元件直接与主功率电路板连接过程中存在的引脚公差大以及不便安装等问题。具体地，由于所述磁性元件通过引脚先与所述转换电路板焊接，即两者通过印刷电路板装配(Printed Circuit Board Assembly，PCBA)组成一个整体，避免磁性元件与主功率电路板直接接触。然后通过螺丝和转换电路板上的电气连接器(电气连接器数量少于所述磁性元件的引脚数)进行电连接，使得所述主功率电路板和所述转换电路板能够进行 电连接(或称电气连接)，不仅避免了多个引脚连接的问题，还便于磁性元件的安装。
其中，所述磁性元件通常由绕组和磁芯构成，用于储能、能量转换及电气隔离等，主要包括变压器和电感器两大类；由于磁性元件是电力电子技术最重要的组成部分之一，所有电源电路中基本都会应用磁性元件。在本申请实施例中，所述转换电路板102，通过电路板上的引脚孔与所述磁性元件101进行电连接，且通过电路板上的电气连接器与所述主功率电路板103进行电连接；在本申请实施例中，所述磁性元件101通过所述转换电路板102转接在所述主功率电路板103上，解决现有技术中磁性元件直接与主功率电路板连接过程中存在的引脚公差以及不便安装等问题。所述主功率电路板103为承担一定功能的电路板，比如主功率电路板可以为车载电源的电路板，起到转换电压的作用；本申请实施例对主功率电路板的作用不作限定。
具体的，本申请实施例中的磁性元件转接装置10用于简易安装变压器以及电感等磁性元件。进而为所述磁性元件转接装置10所应用的装置(比如电动汽车)中相应功能的电路板提供一种磁性元件的安装方式。当所述磁性元件转接装置10所应用的装置为电动汽车时，所述相应功能的电路板可以为但不限于电动汽车中的车载电源电路板等。
可以理解的，所述转换电路板102可以为但不限于印刷电路板(printed circuit board,PCB)、陶瓷电路板、超薄电路板等的电路板。所述主功率电路板103可以为但不限于为印刷电路板(printed circuit board,PCB)、陶瓷电路板、超薄电路板等的电路板。
进一步地，请参阅图3，图3为本申请实施例提供的第一种磁性元件转接装置的平面结构示意图，图3所示为第一种磁性元件转接装置一定视角的平面结构。本实施例的磁性元件转接装置10可以结合前面描述的实施例，在本实施例中，所述N个电气连接器可以包括N个环形的电气连接器，以N＝4为例进行说明，用于所述主功率电路板与所述转换电路板电连接。由于环形的电气连接器的内螺纹结构，可以通过螺丝与环形的电气连接器连接并固定，从而使得主功率电路板和转换电路板能够通过螺丝和环形的电气连接器进行电气连接，以使得安装在转换电路板上的磁性元件与主功率电路板进行电气连接。具 体地，如图3所示，螺丝105可以包括螺丝105d，电气连接器1021可以包括电气连接器102r，具体地，螺丝105d和电气连接器102r，可以通过图示的结构进行连接(例如，螺丝105d穿过主功率电路板103上与自身位置对应的孔洞，将露出的带有螺纹的部分顺着环形电气连接器102r的内螺纹拧入，以使得两者固定)，本申请实施例对具体的螺丝连接结构不作限定，比如图示的连接结构中运用的垫片等。其中，螺丝105d和电气连接器102r只是主功率电路板和转换电路板连接结构的示例性描述，其他类似的螺丝与电气连接器的连接结构，在此不再赘述。本申请实施例对电气连接器的具体结构以及螺丝的具体结构不作限定。
进一步地，请一并参阅图4-图7，图4为本申请实施例提供的第二种磁性元件转接装置的立体结构示意图；图5为本申请实施例提供的第二种磁性元件转接装置的立体结构的爆炸示意图；图6为本申请实施例提供的一种磁性元件转接装置的安装结构示意图；图7为本申请实施例提供的一种磁性元件转接装置的外壳结构示意图。本申请实施例的磁性元件转接装置10可以结合前面描述的实施例，在本申请实施例中，所述磁性元件转接装置10还可以包括外壳104和收容在所述外壳104内的散热部件，所述散热部件用于为所述主功率电路板103散热，所述散热部件与所述主功率电路板103接触，本申请实施例对散热部件的类型、位置以及具体连接方式不作限定。如图7所示，所述外壳104的表面开设有凹槽1041，所述凹槽1041用于收容所述磁性元件101。可选地，所述散热部件可以包括水冷散热部件或者风冷散热部件。可选地，所述主功率电路板103收容在所述外壳104内。
由于所述外壳104表面开设有凹槽1041，所述凹槽1041的外形结构与所述磁性元件101的外形匹配，能够匹配收容所述磁性元件101，既起到一定的固定作用，同时合理充分地利用外壳的空间。
进一步地，请一并参阅图8，图8为本申请实施例提供的一种磁性元件转接装置中磁性元件的立体结构的示意图。本申请实施例的磁性元件转接装置10可以结合前面描述的实施例，在本申请实施例中，所述磁性元件101可以通过引脚与转换电路板进行电连接，具体地，所述磁性元件101可以包括第一变压器1011、第二变压器1012和谐振电感1013。其中，所述第一变压器1011 可以包括四个引脚，所述第二变压器1012可以包括四个引脚，所述谐振电感1013可以包括两个引脚；本申请实施例对磁性元件的具体结构不作限定。
由于所述第一变压器1011、所述第二变压器1012以及所述谐振电感1013依次紧密排列，使得所述磁性元件101更加紧凑地设置在所述转换电路板102上，减小了所述磁性元件101的占用空间，减小了所述转换电路板102的面积需求，且与所述凹槽1041匹配合适，从而减小了所述磁性元件转接装置10的体积。
请一并参阅图9，图9为本申请实施例提供的一种磁性元件转接装置的外壳安装结构示意图。本申请实施例的磁性元件转接装置10可以结合前面描述的实施例，在本实施例中，所述转换电路板102还可以包括至少一个防呆孔；所述凹槽1041表面设置有安装部10411，所述安装部10411通过与所述防呆孔配合，使得所述转换电路板102与所述外壳104连接。本申请对安装部的具体结构不作限定，比如，安装部可以包括突起结构、螺丝孔等能够起到固定以及连接作用的结构。
可选地，所述转换电路板102可以包括4个防呆孔，如图9所示，可以包括第一防呆孔102a、第二防呆孔102b、第三防呆孔102c和第四防呆孔102d；所述安装部10411可以包括4个螺丝孔，具体为第一螺丝孔10411a、第二螺丝孔10411b、第三螺丝孔10411c和第四螺丝孔10411d；如图9所示，将连接在转换电路板上的磁性元件放入外壳对应的凹槽内，将螺丝中的每一个螺丝分别依次通过防呆孔，再与螺丝孔紧固结合，使得所述转换电路板102和所述外壳104连接；例如，第一防呆孔102a与第一螺丝孔10411a对应，可以利用螺丝通过第一防呆孔102a，再与第一螺丝孔10411a连接固定，其他类似在此不再赘述。
通过螺丝穿过转换电路板的防呆孔，与外壳的螺丝孔进行锁紧固定，将所述转换电路板102和所述外壳104进行连接，起到紧固所述转换电路板102和所述外壳104的作用，以防止部件震动移位。
请一并参阅图10至图12，图10为本申请实施例提供的一种转换电路板和磁性元件的安装结构示意图；图11为本申请实施例提供的一种转换电路板的立体结构示意图；图12为本申请实施例提供的一种转换电路板上的转换电 路的电路原理图。本申请实施例的磁性元件转接装置10可以结合前面描述的任一实施例，在本实施例中，所述转换电路板102还可以包括M个引脚孔，以M＝10为例进行说明，如图10所示，可以包括第一引脚孔102e、第二引脚孔102f、第三引脚孔102g、第四引脚孔102h、第五引脚孔102i、第六引脚孔102j、第七引脚孔102k、第八引脚孔102l、第九引脚孔102m和第十引脚孔102n；例如，第一变压器1011通过第一引脚1011a与第三引脚孔102g焊接、第二引脚1011b和第一引脚孔102e焊接、第三引脚1011c和第二引脚孔102f焊接、以及第四引脚1011d和第四引脚孔102h焊接，使得第一变压器1011安装在转换电路板上并与转换电路板电连接，谐振电感1013的引脚1013a和第九引脚孔102m焊接，以及引脚1013b和第十引脚孔102n焊接，使得谐振电感安装在转换电路板上并与转换电路板电连接，其中，第二变压器的连接方式与第一变压器的连接方式基本一致，在此不再赘述。所述M个引脚孔通过所述转换电路板102的转换电路，如图12所示，与所述N个电气连接器电连接，以N＝4为例进行说明，如图11所示，转换电路板102可以包括第一电气连接器102o、第二电气连接器102p、第三电气连接器102q和第四电气连接器102r。所述M个引脚孔通过相应的电路与N个电气连接器；M个引脚可以通过焊接等方式与M个引脚孔配合，不仅使得M个引脚与N个电气连接器电连接，也使得所述磁性元件101与所述转换电路板102电连接。本申请实施例对引脚孔和引脚的配合方式不作限定，比如通过将引脚焊接在引脚孔内。其中，10个引脚孔通过图12所示的电路与4个电气连接器连接，在磁性元件安装后，使得磁性元件之间以及磁性元件与电气连接器之间进行电连接，满足相应的功能要求。本申请实施例对具体的转换电路不作限定。如图12所示，A、B、C、D均为电气连接器，对应图11中第一电气连接器102o、第二电气连接器102p、第三电气连接器102q和第四电气连接器102r，变压器T1的端口1、端口2、端口3和端口4，对应所述第一变压器1011的四个引脚，变压器T2的端口1、端口2、端口3和端口4，对应所述第二变压器1012的四个引脚，电感器L13的端口1和端口2，对应所述谐振电感1013的两个引脚。
由于所述第一变压器1011通过第一引脚1011a与第三引脚孔102g焊接、第二引脚1011b与第一引脚孔102e焊接、第三引脚1011c与第二引脚孔102f 焊接，以及第四引脚1011d与第四引脚孔102h焊接；所述第二变压器1012通过第五引脚1012a与第五引脚孔102i焊接、第六引脚1012b与第六引脚孔102j焊接、第七引脚1012c与第七引脚孔102k焊接，以及第八引脚1012d与第八引脚孔102l焊接；所述谐振电感1013通过第九引脚1013a与第九引脚孔102m焊接，以及第十引脚1013b与第十引脚孔102n焊接，将所需要的磁性元件和转换电路板紧密且有效地进行电气连接。
请一并参阅图13，图13为本申请实施例提供的一种灌胶孔的结构示意图。本申请实施例中的磁性元件转接装置10可以结合前面描述的实施例，所述转换电路板102还可以包括至少一个灌胶孔，在本申请实施例中，以三个灌胶孔为例进行说明，具体包括第一灌胶孔102s、第二灌胶孔102t和第三灌胶孔102u，所述灌胶孔用于向所述凹槽1041灌入散热灌封胶；所述散热灌封胶用于为所述磁性元件101散热。
由于所述凹槽1041能够收容所述转换电路板102和所述磁性元件101，对所述转换电路板102、所述磁性元件101以及相关结构起到保护的作用，从而保证了所述磁性元件转接装置10稳定运作，并且通过灌入的散热灌封胶起到为元器件散热的作用。
请一并参阅图14，图14为本申请实施例提供的一种电动汽车的结构示意图。所述电动汽车1可以包括车体12以及所述磁性元件转接装置10，所述磁性元件转接装置10设置在所述车体12内，所述磁性元件转接装置10为前述任一实施例中的磁性元件转接装置，用于将所需的磁性元件转接在目标电路板上。由于通过所述磁性元件转接装置10转接磁性元件，从而避免了磁性元件引脚直接与目标电路板连接带来的一系列问题。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易的想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种磁性元件转接装置，其特征在于，包括磁性元件、转换电路板和主功率电路板，所述磁性元件包括M个引脚，M为大于0的整数；所述转换电路板包括N个电气连接器，N为大于0且小于M的整数；所述磁性元件通过所述M个引脚与所述转换电路板的N个电气连接器电连接，其中，每个电气连接器与一个或多个引脚电连接，每个引脚连接一个电气连接器；所述主功率电路板通过所述N个电气连接器与所述转换电路板电连接。
  2. 如权利要求1所述的磁性元件转接装置，其特征在于，所述磁性元件转接装置还包括外壳和收容在所述外壳内的散热部件，所述散热部件用于为所述主功率电路板散热，所述外壳表面开设有凹槽，所述凹槽用于收容所述磁性元件。
  3. 如权利要求2所述的磁性元件转接装置，其特征在于，所述磁性元件包括第一变压器、第二变压器和谐振电感。
  4. 如权利要求2所述的磁性元件转接装置，其特征在于，所述转换电路板还包括至少一个防呆孔；所述凹槽表面设置有安装部，所述安装部通过与所述防呆孔配合，使得所述转换电路板与所述外壳连接。
  5. 如权利要求4所述的磁性元件转接装置，其特征在于，所述安装部包括至少一个螺丝孔，所述螺丝孔用于通过螺丝与所述防呆孔配合，使得所述转换电路板和所述外壳连接。
  6. 如权利要求1所述的磁性元件转接装置，其特征在于，所述转换电路板还包括M个引脚孔，所述M个引脚孔通过所述转换电路板的转换电路与所述N个电气连接器电连接；所述M个引脚孔用于与所述M个引脚配合，使得所述磁性元件与所述转换电路板电连接。
  7. 如权利要求1所述的磁性元件转接装置，其特征在于，所述转换电路板还包括至少一个灌胶孔，所述灌胶孔用于向所述凹槽灌入散热灌封胶；所述散热灌封胶用于为所述磁性元件散热。
  8. 如权利要求1所述的磁性元件转接装置，其特征在于，所述N个电气连接器为N个环形连接器，用于所述主功率电路板与所述转换电路板电连接。
  9. 如权利要求1-8任一项所述的磁性元件转接装置，其特征在于，所述散热部件包括水冷散热部件或者风冷散热部件。
  10. 一种电动汽车，其特征在于，所述电动汽车包括车体及如权利要求1-9中任意一项所述的磁性元件转接装置，所述磁性元件转接装置设置在所述车体内，所述磁性元件转接装置用于安装磁性元件。
PCT/CN2020/076837 2020-02-26 2020-02-26 磁性元件转接装置以及电动汽车 WO2021168705A1 (zh)

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