WO2021160090A1 - 显示面板以及显示装置 - Google Patents

显示面板以及显示装置 Download PDF

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Publication number
WO2021160090A1
WO2021160090A1 PCT/CN2021/076023 CN2021076023W WO2021160090A1 WO 2021160090 A1 WO2021160090 A1 WO 2021160090A1 CN 2021076023 W CN2021076023 W CN 2021076023W WO 2021160090 A1 WO2021160090 A1 WO 2021160090A1
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WO
WIPO (PCT)
Prior art keywords
display
substrate
area
circuit layer
light
Prior art date
Application number
PCT/CN2021/076023
Other languages
English (en)
French (fr)
Inventor
徐苗
周雷
陶洪
李民
李洪濛
徐华
陈子楷
邹建华
王磊
彭俊彪
Original Assignee
华南理工大学
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Publication date
Application filed by 华南理工大学 filed Critical 华南理工大学
Priority to US17/799,519 priority Critical patent/US20230075372A1/en
Publication of WO2021160090A1 publication Critical patent/WO2021160090A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/128—Active-matrix OLED [AMOLED] displays comprising two independent displays, e.g. for emitting information from two major sides of the display
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/18—Tiled displays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/82—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present application relates to the field of display technology, for example, to a display panel and a display device.
  • the display panel and the display device formed by splicing a single display unit have a problem that the non-display area occupies a relatively large area.
  • the present application provides a display panel and a display device, which solves the problem of a relatively large non-display area in the display panel and display device spliced by a single display unit in the related art.
  • an embodiment of the present application provides a display panel, including:
  • each of the display units includes a substrate, the substrate includes a display carrying area, and a splicing area located on at least one side of the display carrying area;
  • a flexible substrate located on the first surface of the substrate and located in the display carrying area, at least part of the flexible substrate extends out of the display carrying area of the substrate;
  • the light-emitting unit circuit layer is located on the surface of the flexible substrate on the side away from the substrate, and includes at least one bonding pad;
  • At least one driving chip is located on the flexible substrate extending out of the display carrying area of the substrate, on the surface on the side away from the circuit layer of the light-emitting unit or located in the splicing area, through the conductive
  • the connection layer is electrically connected to at least one of the pads.
  • the substrate includes a first splicing area located on the first side of the display carrying area, and at least part of the flexible substrate extends out of the display carrying area of the substrate opposite to the second splicing area disposed on the first side. side.
  • the substrate includes a second splicing area located on the second side of the display bearing area and a third splicing area located on the third side of the display bearing area, and the extension direction of the second splicing area is perpendicular to The extension direction of the third splicing area;
  • At least part of the flexible substrate extends out of the fourth side of the display carrying area of the substrate opposite to the second side and/or the fifth side opposite to the third side.
  • it further includes at least one first groove, which is located on the flexible substrate extending out of the display carrying area of the substrate, and on the surface of the side away from the circuit layer of the light-emitting unit;
  • the driving chip is located in the first groove, flush with the surface of the flexible substrate on the side away from the circuit layer of the light-emitting unit, and is connected to the pad through a conductive connection layer located on the side of the flexible substrate Electric connection.
  • it further includes at least one second groove located on the first surface of the splicing area, and the driving chip is located in the second groove, which is flat with the first surface or the second surface of the splicing area.
  • the first surface and the second surface are arranged opposite to each other, and the first surface is the first surface of the substrate through a conductive connection layer on the side of the flexible substrate. Surface; or,
  • It also includes at least one conductive via located in the splicing area, the driving chip is located on the second surface of the splicing area, and the conductive connection layer extends to the first surface of the splicing area through the conductive via It is electrically connected with the driving chip.
  • the conductive connection layer includes one or more conductive film layers.
  • the light-emitting unit circuit layer further includes a metal circuit layer, and the metal circuit layer includes a plurality of data lines, a plurality of scan lines, and a light-emitting unit determined by each data line and each scan line.
  • the first electrode of the unit is electrically connected to the data line
  • the second electrode of the light-emitting unit is electrically connected to the scan line;
  • the data line and the scan line are electrically connected to the pads, respectively.
  • the metal circuit layer further includes a signal input circuit layer and a light-emitting drive circuit layer, the signal input circuit layer is electrically connected to the data line and the scan line, and the signal input circuit layer is used for
  • the light-emitting driving circuit layer provides a driving power signal, and the light-emitting driving circuit layer is used to drive the light-emitting unit to emit light.
  • the substrate includes glass.
  • the flexible substrate includes polyimide or polyethylene naphthalate; the thickness of the flexible substrate is greater than or equal to 5 microns and less than or equal to 50 microns.
  • an embodiment of the present application provides a display device, including the display panel described in any of the first aspect.
  • the light-emitting unit circuit layer is located on the surface of the flexible substrate on the side away from the substrate, and the pads of the light-emitting unit circuit layer are connected to the display carrying area extending from the substrate through the conductive connection layer on the side of the flexible substrate.
  • the flexible substrate is electrically connected to the surface on the side away from the circuit layer of the light-emitting unit or the driving chip located in the splicing area.
  • the driving chip is located on the flexible substrate extending out of the display carrying area of the substrate, on the surface far away from the circuit layer of the light-emitting unit or located in the splicing area, and does not occupy a part of the area of the flexible substrate for display.
  • the splicing of two adjacent display units can be completed in the following manner: two adjacent display units, one of the display units, and a part of the flexible substrate extending from the substrate is placed in the splicing area of the previous display unit.
  • the splicing gap between the display units is eliminated.
  • the area ratio between the display area of the multiple display units and the entire display panel is increased, and the production cost is reduced.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of another display panel provided by an embodiment of the application.
  • FIG. 3 is a schematic structural diagram of a display unit provided by an embodiment of the application.
  • FIG. 4 is a schematic structural diagram of another display unit provided by an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of yet another display unit provided by an embodiment of the application.
  • FIG. 6 is a schematic structural diagram of another display unit provided by an embodiment of the application.
  • FIG. 7 is a schematic structural diagram of another display unit provided by an embodiment of the application.
  • FIG. 8 is a schematic structural diagram of a circuit layer of a light-emitting unit provided by an embodiment of the application.
  • FIG. 9 is a schematic structural diagram of another light-emitting unit circuit layer provided by an embodiment of the application.
  • An embodiment of the present application provides a display panel. See FIGS. 1 and 2.
  • the display panel is formed by splicing a plurality of display units, at least two display units 1, and each display unit 1 includes a substrate 10, and the substrate 10 includes The display carrying area A1 and the splicing area A2 located on at least one side of the display carrying area A1;
  • the flexible substrate 20 is located on the first surface of the substrate 10 and is located in the display carrying area, and at least part of the flexible substrate 20 extends beyond the display of the substrate 10 Carrying area A1; light-emitting unit circuit layer, located on the surface of the flexible substrate away from the substrate, including at least one pad; at least one driving chip, located on the flexible substrate extending out of the display bearing area of the substrate, one far away from the light-emitting unit circuit layer
  • the surface of the side or located in the splicing area is electrically connected to at least one pad through a conductive connection layer located on the side of the flexible substrate.
  • FIG. 1 exemplarily shows two display units 1
  • the substrate 10 includes a display bearing area A1, and a splicing area A2 located on one side of the display bearing area A1
  • FIG. 2 exemplarily shows four
  • the two display units 1 and the substrate 10 include a display carrying area A1 and splicing areas A2 located on both sides of the display carrying area A1.
  • the light-emitting unit circuit layer is located on the surface of the flexible substrate on the side away from the substrate, and the pads of the light-emitting unit circuit layer pass through the conductive connection layer on the side of the flexible substrate and are connected to the flexible display bearing area extending from the substrate.
  • the substrate is electrically connected to the surface on the side away from the circuit layer of the light-emitting unit or the driving chip located in the splicing area.
  • the driving chip is located on the flexible substrate extending out of the display carrying area of the substrate, on the surface on the side away from the circuit layer of the light-emitting unit or located in the splicing area, and does not occupy a part of the area of the flexible substrate 20 for display.
  • the flexible substrate 20 can be exemplified by polyimide (PI), which is one of the organic polymer materials with the best overall performance. Alternatively, the color of the polyimide may be yellow.
  • the flexible substrate 20 can also be exemplified by polyethylene naphthalene-2,6-dicarboxylate (PEN), which has high physical and mechanical properties and gas barrier properties. , Chemical stability and heat resistance, UV resistance, radiation resistance and other properties, is a new and excellent polymer.
  • two adjacent display units 1 can be spliced in the following manner: Referring to FIGS. 1 and 2, two adjacent display units 1 are displayed. One of the display units 1 extends out of a part of the flexible substrate of the substrate 10. 20 is placed in the mosaic area A2 of the previous display unit 1.
  • the display panel and the driving chip of the light-emitting unit circuit layer are often arranged on the substrate, occupying the area of the display screen, resulting in a relatively small area ratio between the display area of a single display unit and the substrate of the entire display unit.
  • a splicing gap occupied by the driving circuit appears, which further causes the area ratio between the display area of the splicing of the multiple display units and the entire display panel to be relatively small.
  • the light-emitting unit circuit layer is located on the surface of the flexible substrate on the side away from the substrate, and the pads of the light-emitting unit circuit layer are connected to the display carrying area extending from the substrate through the conductive connection layer located on the side of the flexible substrate.
  • the flexible substrate is electrically connected to the surface on the side away from the circuit layer of the light-emitting unit or the driving chip located in the splicing area.
  • the driving chip is located on the flexible substrate extending out of the display carrying area of the substrate, on the surface on the side away from the circuit layer of the light-emitting unit or located in the splicing area, and does not occupy a part of the area of the flexible substrate 20 for display.
  • the splicing of two adjacent display units 1 can be completed in the following manner: referring to Figs. 1 and 2, two adjacent display units 1, one of the display units 1, and a part of the flexible substrate 20 extending out of the substrate 10 is placed on the previous one.
  • Display unit 1 splicing area A2.
  • the splicing gap between the display units 1 is eliminated, and in the process of realizing a large-size display panel, the area ratio between the display area of the multiple display units 1 and the entire display panel is increased, and the production cost is reduced.
  • the substrate 10 includes a first splicing area A21 located on the first side of the display carrying area A2, and at least a part of the flexible substrate 20 extends out of the display carrying area A1 and the second display carrying area A1 of the substrate.
  • the splicing of two adjacent display units 1 can be completed in the following manner: two adjacent display units 1, one of the display units 1, and a part of the flexible substrate 20 extending from the substrate 10 is placed in the first splicing of the previous display unit 1.
  • Area A21 located on the first side of the display carrying area A2
  • the substrate 10 includes a second splicing area A22 located on the second side of the display bearing area A1 and a third splicing area A23 located on the third side of the display bearing area A1,
  • the extension direction of the second splicing area A22 is perpendicular to the extension direction of the third splicing area A23; at least part of the flexible substrate 20 extends beyond the fourth side of the display carrying area A1 of the substrate 10 opposite to the second side and/or the third side.
  • the fifth side opposite to the side.
  • the splicing of two adjacent display units 1 can be completed in the following manner: two adjacent display units 1, one of the display units 1, and a part of the flexible substrate 20 extending from the substrate 10 is placed in the second splicing of the previous display unit 1. Area A22 or the third splicing area A23.
  • the display unit shown in FIG. 4 is taken as an example for description.
  • the flexible substrate 20 is on the surface of the side away from the circuit layer 40 of the light-emitting unit; the driving chip 30 is located in the first groove 11 and is flush with the surface of the flexible substrate 20 on the side away from the circuit layer 40 of the light-emitting unit.
  • the conductive connection layer 50 on the side surface of 20 is electrically connected to the pad 41.
  • the light-emitting unit circuit layer is located on the surface of the flexible substrate away from the substrate.
  • the pad 41 of the light-emitting unit circuit layer 40 passes through the conductive connection layer 50 located on the side of the flexible substrate 20 and is located in the flexible display carrying area A1 extending from the substrate 10.
  • the substrate 20 is electrically connected to the driving chip 30 on the surface of the side away from the circuit layer 40 of the light-emitting unit.
  • the driving chip 30 is located on the flexible substrate 20 extending out of the display carrying area A1 of the substrate 10, on the surface of the side away from the circuit layer 40 of the light-emitting unit, and does not occupy a part of the display area of the flexible substrate 20.
  • the display unit shown in FIG. 4 is taken as an example for description, referring to FIG.
  • the driving chip 30 is located in the second groove 12, and is flush with the first surface or the second surface of the second splicing area A22 and the third splicing area A23 in the splicing area.
  • the conductive connection layer 50 on the side of the flexible substrate 20 is electrically connected to at least one pad 41, the first surface and the second surface are disposed opposite to each other, and the first surface is the first surface of the substrate 10; the light-emitting unit circuit layer 40 is located on the flexible substrate On the surface far away from the substrate, the pad 41 of the light-emitting unit circuit layer 40 is electrically connected by the driving chip 30 in the second groove 12 of the second splicing area A22 and the third splicing area A23 in the splicing area.
  • the driving chip 30 is located in the second groove 12 of the second splicing area A22 and the third splicing area A23 in the splicing area, and does not occupy a part of the area of the flexible substrate 20 for display.
  • the display unit shown in FIG. 4 is taken as an example for description. See FIG.
  • the driving chip 30 is located on the second surface of the second splicing area A22 and the third splicing area A23 in the splicing area, and the conductive connection layer 50 extends to the second splicing area A22 and the third splicing area A23 in the splicing area
  • the first surface is electrically connected to the driving chip 30 through the conductive via 13.
  • the light-emitting unit circuit layer is located on the surface of the flexible substrate away from the substrate.
  • the pad 41 and the conductive via 13 of the light-emitting unit circuit layer 40 are connected to the second splicing area A22 and the second splicing area A23 in the splicing area.
  • the driving chip 30 on the surface is electrically connected. Wherein, the driving chip 30 is located on the second surface of the second splicing area A22 and the third splicing area A23 in the splicing area, and does not occupy a part of the area of the flexible substrate 20 for display.
  • the conductive connection layer 50 includes one or more conductive film layers.
  • the preparation process of the conductive connection layer 50 is as follows: select a conductive solution: a conductive ink containing Ag, Au, Cu, Al and other nanoparticles, or a conductive paste formed by Ag, Cu, Au, Al and other nanoparticles and a high molecular polymer.
  • the pad 41 and the connection pad of the drive chip 30 are used as the target connection point to make a conductive solution.
  • a conductive connection is made Layer 50.
  • the solution processing method in this embodiment is not limited to the inkjet printing method, spraying method, and screen printing method.
  • the conductive solution in this embodiment is not limited to conductive inks containing Ag, Au, Cu, Al and other nanoparticles, or conductive pastes formed by Ag, Cu, Au, Al and other nanoparticles and high molecular polymers.
  • the conductive connection layer 50 prepared by the solution processing method using a conductive solution is used to electrically connect the pad 41 and the connection pad of the driving chip 30.
  • the adjacent There are splicing gaps between the display units 1.
  • the thickness of the conductive connection layer 50 may be 20 nm-2000 nm.
  • the light-emitting unit circuit layer 40 further includes a metal circuit layer 42, and the metal circuit layer 42 includes a plurality of data lines 420, a plurality of scan lines 421, and each data line 420.
  • This driving scheme is called PM driving scheme.
  • the metal circuit layer 42 further includes a signal input circuit layer and a light-emitting drive circuit layer.
  • the signal input circuit layer is electrically connected to the data line 420 and the scan line 421, and the signal input circuit layer is used for Provide a driving power signal for the light-emitting drive circuit layer, and the light-emitting drive circuit layer is used to drive the light-emitting unit to emit light.
  • the signal input circuit layer includes a first thin film transistor T1 and a capacitor C
  • the light-emitting driving circuit layer includes a second thin film transistor T2.
  • the first thin film transistor T1 and the second thin film transistor T2 are both P-type thin film transistors. This driving scheme is called AM driving scheme.
  • the thin film transistors T1 and T2 may be one or more of metal oxide semiconductor thin film transistors, amorphous silicon semiconductor thin film transistors, and low temperature oxide thin film transistors.
  • a thin film transistor array is fabricated, and the pad 41 of the driving wire is reserved in the display area, and then the light-emitting unit 422 is fabricated.
  • the flexible substrate 20 is removed from the carrier, aligned, and placed on the substrate 10. Then, using the silver paste, the silver paste is printed on the display bearing area A1 of the substrate 10 through an inkjet printing method, and is electrically connected to the driving chip 30 through the conductive connection layer 50.
  • the thickness of the flexible substrate 20 is greater than or equal to 5 micrometers and less than or equal to 50 micrometers.
  • the flexible substrate 20 less than 5 microns is not enough to support the light-emitting unit circuit layer 40; the thickness of the flexible substrate 20 is greater than 50 microns, which will cause the weight of the entire display panel to be too large.
  • the suppliers used can be: Ube Chemical, Kanemoto Chemical, Konica and other companies provide products.
  • the light emitting unit 422 includes an organic light emitting diode or an inorganic light emitting diode, where the inorganic light emitting diode includes a micro light emitting diode and/or a mini light emitting diode.
  • Mini LEDs and/or mini LEDs are small in size, can reduce the pixel pitch from millimeters to micrometers, and have the advantages of self-luminescence, high brightness, low power consumption, high color gamut, etc., so that the display panel can display high-quality At the same time of the picture, the production cost is reduced.
  • the substrate includes glass.
  • the substrate 10 includes glass.
  • the thickness of the glass may be 0.3-1 mm.
  • the embodiment of the present application also provides a display device. Since the display device provided in this embodiment adopts the above-mentioned display panel, the display device also has the same effect as the above-mentioned display panel.

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板以及显示装置，显示面板包括：至少两个显示单元（1），每一显示单元（1）包括：基板（10），基板（10）包括显示承载区（A1）、以及位于显示承载区（A1）至少一侧的拼接区（A2）；柔性衬底（20），位于基板（10）的第一表面，且位于显示承载区（A1），至少部分柔性衬底（20）延伸出基板（10）的显示承载区（A1）；发光单元电路层（40），位于柔性衬底（20）远离基板（10）一侧的表面，包括至少一个焊盘（41）；至少一个驱动芯片（30），位于延伸出基板（10）的显示承载区（A1）的柔性衬底（20），远离发光单元电路层（40）一侧的表面或者位于拼接区（A2），通过位于柔性衬底（20）侧面的导电连接层（50）与至少一个焊盘（41）电连接。

Description

显示面板以及显示装置
本申请要求在2020年02月14日提交中国专利局、申请号为202010092736.1的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，例如涉及一种显示面板以及显示装置。
背景技术
随着显示技术的进一步发展，由单个显示单元拼接而成的显示面板以及显示装置在舞台、会展等公共场所中得到了广泛的使用。
相关技术中的由单个显示单元拼接而成的显示面板以及显示装置存在非显示区占比较大的问题。
发明内容
本申请提供了一种显示面板以及显示装置，解决了相关技术中由单个显示单元拼接而成的显示面板以及显示装置存在非显示区占比较大的问题。
第一方面，本申请实施例提供了一种显示面板，包括：
至少两个显示单元，每一所述显示单元包括：基板，所述基板包括显示承载区、以及位于所述显示承载区至少一侧的拼接区；
柔性衬底，位于所述基板的第一表面，且位于所述显示承载区，至少部分所述柔性衬底延伸出所述基板的显示承载区；
发光单元电路层，位于所述柔性衬底远离所述基板一侧的表面，包括至少一个焊盘；
至少一个驱动芯片，位于延伸出所述基板的显示承载区的所述柔性衬底，远离所述发光单元电路层一侧的表面或者位于所述拼接区，通过位于所述柔性衬底侧面的导电连接层与至少一个所述焊盘电连接。
可选地，所述基板包括位于所述显示承载区第一侧的第一拼接区，至少部分所述柔性衬底延伸出所述基板的显示承载区与所述第一侧相对设置的第二侧。
可选地，所述基板包括位于所述显示承载区第二侧的第二拼接区和位于所述显示承载区的第三侧的第三拼接区，所述第二拼接区的延伸方向垂直于所述第三拼接区的延伸方向；
至少部分所述柔性衬底延伸出所述基板的显示承载区与所述第二侧相对设置的第四侧和/或与所述第三侧相对设置的第五侧。
可选地，还包括至少一个第一凹槽，位于延伸出所述基板的显示承载区的所述柔性衬底，远离所述发光单元电路层一侧的表面；
所述驱动芯片位于所述第一凹槽内，与所述柔性衬底远离所述发光单元电路层一侧的表面平齐，通过位于所述柔性衬底侧面的导电连接层与所述焊盘电连接。
可选地，还包括至少一个第二凹槽，位于所述拼接区的第一表面，所述驱动芯片位于所述第二凹槽内，与所述拼接区的第一表面或者第二表面平齐，通过位于所述柔性衬底侧面的导电连接层与至少一个所述焊盘电连接，所述第一表面与所述第二表面相对设置，所述第一表面为所述基板的第一表面；或者，
还包括至少一个导电通孔，位于所述拼接区，所述驱动芯片位于所述拼接区的第二表面，所述导电连接层延伸至所述拼接区的第一表面，通过所述导电通孔与所述驱动芯片电连接。
可选地，所述导电连接层包括一层或者多层导电膜层。
可选地，所述发光单元电路层还包括金属线路层，所述金属线路层包括多条数据线、多条扫描线以及每一数据线和每一扫描线交叉确定的发光单元，所述发光单元的第一电极与所述数据线电连接，所述发光单元的第二电极与所述扫描线电连接；
所述数据线和所述扫描线分别与所述焊盘电连接。
可选地，所述金属线路层还包括信号输入线路层以及发光驱动线路层，所述信号输入线路层分别与所述数据线和所述扫描线电连接，所述信号输入线路层用于为所述发光驱动线路层提供驱动电源信号，所述发光驱动线路层用于驱动所述发光单元发光。
可选地，所述基板包括玻璃。
可选地，所述柔性衬底包括聚酰亚胺或者聚萘二甲酸乙二醇酯；所述柔性衬底的厚度大于或等于5微米，且小于或等于50微米。
第二方面，本申请实施例提供了一种显示装置，包括第一方面任意所述的显示面板。
本实施例中的技术方案，发光单元电路层，位于柔性衬底远离基板一侧的表面，发光单元电路层的焊盘通过位于柔性衬底侧面的导电连接层与位于延伸出基板的显示承载区的柔性衬底，远离发光单元电路层一侧的表面或者位于拼 接区的驱动芯片电连接。其中，驱动芯片位于延伸出基板的显示承载区的柔性衬底，远离发光单元电路层一侧的表面或者位于拼接区，不占用柔性衬底的用于显示的部分区域。且相邻两个显示单元可以通过如下方式完成拼接：相邻两个显示单元，其中一个显示单元，延伸出基板的部分柔性衬底放置在前一个显示单元的拼接区。消除了显示单元之间的拼接缝隙，在实现大尺寸的显示面板的过程中，使得多个显示单元拼接的显示区与整个显示面板之间的面积比值增大，且降低了生产成本。
附图说明
图1为本申请实施例提供的一种显示面板的结构示意图；
图2为本申请实施例提供的另一种显示面板的结构示意图；
图3为本申请实施例提供的一种显示单元的结构示意图；
图4为本申请实施例提供的另一种显示单元的结构示意图；
图5为本申请实施例提供的又一种显示单元的结构示意图；
图6为本申请实施例提供的又一种显示单元的结构示意图；
图7为本申请实施例提供的又一种显示单元的结构示意图；
图8为本申请实施例提供的一种发光单元电路层的结构示意图；
图9为本申请实施例提供的另一种发光单元电路层的结构示意图。
具体实施方式
下面结合附图和实施例对本申请作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释本申请，而非对本申请的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与本申请相关的部分而非全部结构。
本申请实施例提供了一种显示面板，参见图1和图2，该显示面板由多个显示单元拼接而成，至少两个显示单元1，每一显示单元1包括：基板10，基板10包括显示承载区A1、以及位于显示承载区A1至少一侧的拼接区A2；柔性衬底20，位于基板10的第一表面，且位于显示承载区，至少部分柔性衬底20延伸出基板10的显示承载区A1；发光单元电路层，位于柔性衬底远离基板一侧的表面，包括至少一个焊盘；至少一个驱动芯片，位于延伸出基板的显示承载区的柔性衬底，远离发光单元电路层一侧的表面或者位于拼接区，通过位于柔性衬底侧面的导电连接层与至少一个焊盘电连接。
需要说明的是，图1示例性的示出了两个显示单元1，以及基板10包括显示承载区A1、以及位于显示承载区A1一侧的拼接区A2，图2示例性的示出了四个显示单元1，以及基板10包括显示承载区A1、以及位于显示承载区A1两侧的拼接区A2。
在本实施例中，发光单元电路层，位于柔性衬底远离基板一侧的表面，发光单元电路层的焊盘通过位于柔性衬底侧面的导电连接层与位于延伸出基板的显示承载区的柔性衬底，远离发光单元电路层一侧的表面或者位于拼接区的驱动芯片电连接。其中，驱动芯片位于延伸出基板的显示承载区的柔性衬底，远离发光单元电路层一侧的表面或者位于拼接区，不占用柔性衬底20的用于显示的部分区域。
在本实施例中，柔性衬底20示例性的可以是聚酰亚胺(Polyimide，PI)，聚酰亚胺，是综合性能最佳的有机高分子材料之一。可选地，聚酰亚胺的颜色可以是黄色。柔性衬底20示例性的还可以是聚萘二甲酸乙二醇酯(Polyethylene naphthalene-2,6-dicarboxylate，PEN)，聚萘二甲酸乙二醇酯具有较高的物理机械性能、气体阻隔性能、化学稳定性及耐热、耐紫外线、耐辐射等性能，是一种新兴的优良聚合物。
在本实施例中，相邻两个显示单元1可以通过如下方式完成拼接：参见图1和图2，相邻两个显示单元1，其中一个显示单元1，延伸出基板10的部分柔性衬底20放置在前一个显示单元1的拼接区A2。
相关技术中的显示面板，与发光单元电路层的驱动芯片经常设置在基板上，占用了显示屏的面积，导致单个显示单元的显示区与整个显示单元的基板之间的面积比值比较小，因而会导致多个显示单元在拼接的过程中，出现了被驱动电路占用的拼接缝隙，进一步导致多个显示单元拼接的显示区与整个显示面板之间的面积比值比较小。
本实施例中的技术方案，发光单元电路层，位于柔性衬底远离基板一侧的表面，发光单元电路层的焊盘通过位于柔性衬底侧面的导电连接层与位于延伸出基板的显示承载区的柔性衬底，远离发光单元电路层一侧的表面或者位于拼接区的驱动芯片电连接。其中，驱动芯片位于延伸出基板的显示承载区的柔性衬底，远离发光单元电路层一侧的表面或者位于拼接区，不占用柔性衬底20的用于显示的部分区域。且相邻两个显示单元1可以通过如下方式完成拼接：参见图1和图2，相邻两个显示单元1，其中一个显示单元1，延伸出基板10的部分柔性衬底20放置在前一个显示单元1的拼接区A2。消除了显示单元1之间的拼接缝隙，在实现大尺寸的显示面板的过程中，使得多个显示单元1拼接的显示区与整个显示面板之间的面积比值增大，且降低了生产成本。
可选地，在上述技术方案的基础上，参见图3，基板10包括位于显示承载区A2第一侧的第一拼接区A21，至少部分柔性衬底20延伸出基板的显示承载区A1与第一侧相对设置的第二侧。且相邻两个显示单元1可以通过如下方式完成拼接：相邻两个显示单元1，其中一个显示单元1，延伸出基板10的部分柔性衬底20放置在前一个显示单元1的第一拼接区A21。
可选地，在上述技术方案的基础上，参见图4，基板10包括位于显示承载区A1第二侧的第二拼接区A22和位于显示承载区A1的第三侧的第三拼接区A23，第二拼接区A22的延伸方向垂直于第三拼接区A23的延伸方向；至少部分柔性衬底20延伸出基板10的显示承载区A1与第二侧相对设置的第四侧和/或与第三侧相对设置的第五侧。且相邻两个显示单元1可以通过如下方式完成拼接：相邻两个显示单元1，其中一个显示单元1，延伸出基板10的部分柔性衬底20放置在前一个显示单元1的第二拼接区A22或者第三拼接区A23。
可选地，在上述技术方案的基础上，以图4示出的显示单元为例进行说明，参见图5，还包括至少一个第一凹槽11，位于延伸出基板10的显示承载区A1的柔性衬底20，远离发光单元电路层40一侧的表面；驱动芯片30位于第一凹槽11内，与柔性衬底20远离发光单元电路层40一侧的表面平齐，通过位于柔性衬底20侧面的导电连接层50与焊盘41电连接。发光单元电路层，位于柔性衬底远离基板一侧的表面，发光单元电路层40的焊盘41通过位于柔性衬底20侧面的导电连接层50与位于延伸出基板10的显示承载区A1的柔性衬底20，远离发光单元电路层40一侧的表面的驱动芯片30电连接。其中，驱动芯片30位于延伸出基板10的显示承载区A1的柔性衬底20，远离发光单元电路层40一侧的表面，不占用柔性衬底20的用于显示的部分区域。
可选地，在上述技术方案的基础上，以图4示出的显示单元为例进行说明，参见图6，还包括至少一个第二凹槽12，位于拼接区中的第二拼接区A22和第三拼接区A23的第一表面，驱动芯片30位于第二凹槽12内，与拼接区中的第二拼接区A22和第三拼接区A23的第一表面或者第二表面平齐，通过位于柔性衬底20侧面的导电连接层50与至少一个焊盘41电连接，第一表面与第二表面相对设置，第一表面为基板10的第一表面；发光单元电路层40，位于柔性衬底远离基板一侧的表面，发光单元电路层40的焊盘41通过位于拼接区中的第二拼接区A22和第三拼接区A23的第二凹槽12内的驱动芯片30电连接。其中，驱动芯片30位于拼接区中的第二拼接区A22和第三拼接区A23的第二凹槽12内，不占用柔性衬底20的用于显示的部分区域。
可选地，在上述技术方案的基础上，以图4示出的显示单元为例进行说明，参见图7，还包括至少一个导电通孔13，位于拼接区中的第二拼接区A22和第 三拼接区A23，驱动芯片30位于拼接区中的第二拼接区A22和第三拼接区A23的第二表面，导电连接层50延伸至拼接区中的第二拼接区A22和第三拼接区A23的第一表面，通过导电通孔13与驱动芯片30电连接。发光单元电路层，位于柔性衬底远离基板一侧的表面，发光单元电路层40的焊盘41和导电通孔13与位于拼接区中的第二拼接区A22和第三拼接区A23的第二表面的驱动芯片30电连接。其中，驱动芯片30位于拼接区中的第二拼接区A22和第三拼接区A23的第二表面，不占用柔性衬底20的用于显示的部分区域。
可选地，在上述技术方案的基础上，导电连接层50包括一层或者多层导电膜层。导电连接层50的制备过程如下：选取导电溶液：包含Ag、Au、Cu、Al等纳米颗粒的导电墨水，或者Ag、Cu、Au、Al等纳米颗粒与高分子聚合物共同成型的导电浆料，采用喷墨打印法、喷涂法以及丝网印刷法等溶液加工法，以焊盘41和驱动芯片30的连接焊盘作为目标连接点，制作导电溶液，导电溶液凝固后，便制得导电连接层50。本实施例中的溶液加工法并不局限于喷墨打印法、喷涂法以及丝网印刷法这几种。且本实施例中的导电溶液也不局限于包含Ag、Au、Cu、Al等纳米颗粒的导电墨水，或者Ag、Cu、Au、Al等纳米颗粒与高分子聚合物共同成型的导电浆料。
本实施例中，采用导电溶液采用溶液加工法制备的导电连接层50将焊盘41和驱动芯片30的连接焊盘电连接，在多个显示单元1拼接的过程中，不会使得相邻的显示单元1之间出现拼接缝隙，在实现大尺寸的显示面板的过程中，使得多个显示单元拼接的显示区与整个显示面板之间的面积比值增大，且降低了生产成本。导电连接层50的厚度可以是20nm-2000nm。
可选地，在上述技术方案的基础上，参见图8，发光单元电路层40还包括金属线路层42，金属线路层42包括多条数据线420、多条扫描线421以及每一数据线420和每一扫描线421交叉确定的发光单元422，发光单元422的第一电极与数据线420电连接，发光单元422的第二电极与扫描线421电连接；数据线420和扫描线421分别与焊盘41电连接。该驱动方案称之为PM驱动方案。
可选地，在上述技术方案的基础上，金属线路层42还包括信号输入线路层以及发光驱动线路层，信号输入线路层分别与数据线420和扫描线421电连接，信号输入线路层用于为发光驱动线路层提供驱动电源信号，发光驱动线路层用于驱动发光单元发光。示例性的，参见图9，信号输入线路层包括第一薄膜晶体管T1和电容C，发光驱动线路层包括第二薄膜晶体管T2。其中第一薄膜晶体管T1和第二薄膜晶体管T2均为P型薄膜晶体管。该驱动方案称之为AM驱动方案。
可选地，薄膜晶体管T1和T2，可以是金属氧化物半导体薄膜晶体管、非 晶硅半导体薄膜晶体管、低温氧化物薄膜晶体管中的一种或多种。可选地，柔性衬底20放置在载具上时，制作薄膜晶体管阵列，并在显示区域内预留驱动导线的焊盘41，然后制作发光单元422。之后将柔性衬底20从载具上取下，经过对位，并放置在基板10上。然后使用银浆，通过喷墨打印的方法，将银浆打印到基板10的显示承载区A1，通过导电连接层50和驱动芯片30电连接。
可选地，在上述技术方案的基础上，柔性衬底20的厚度大于或等于5微米，且小于或等于50微米。柔性衬底20小于5微米不足以支撑发光单元电路层40；柔性衬底20的厚度大于50微米，会导致整个显示面板的重量太大。采用的供货商可为：宇部化学，钟源化学，柯尼卡等公司提供的产品。
可选地，在上述技术方案的基础上，发光单元422包括有机发光二极管、或者无机发光二极管，其中无机发光二极管包括微型发光二极管和/或迷你发光二极管。微型发光二极管和/或迷你发光二极管尺寸较小，可以将像素间距从毫米级降低至微米级，且具有自发光、高亮度、低功耗、高色域等优点，使得显示面板可以显示优质的画面的同时，降低生产成本。
可选地，在上述技术方案的基础上，基板包括玻璃。可选地，在上述技术方案的基础上，基板10包括玻璃。在本实施例中，玻璃的厚度可以是0.3-1mm。
本申请实施例还提供了一种显示装置。本实施例提供的显示装置，由于采用了上述显示面板，因此，显示装置同样具有上述显示面板相同的效果。

Claims (11)

  1. 一种显示面板，包括：
    至少两个显示单元，每一所述显示单元包括：基板，所述基板包括显示承载区、以及位于所述显示承载区至少一侧的拼接区；
    柔性衬底，位于所述基板的第一表面，且位于所述显示承载区，至少部分所述柔性衬底延伸出所述基板的显示承载区；
    发光单元电路层，位于所述柔性衬底远离所述基板一侧的表面，包括至少一个焊盘；
    至少一个驱动芯片，位于延伸出所述基板的显示承载区的所述柔性衬底，远离所述发光单元电路层一侧的表面或者位于所述拼接区，通过位于所述柔性衬底侧面的导电连接层与至少一个所述焊盘电连接。
  2. 根据权利要求1所述的显示面板，其中，
    所述基板包括位于所述显示承载区第一侧的第一拼接区，至少部分所述柔性衬底延伸出所述基板的显示承载区与所述第一侧相对设置的第二侧。
  3. 根据权利要求2所述的显示面板，其中，
    所述基板包括位于所述显示承载区第二侧的第二拼接区和位于所述显示承载区的第三侧的第三拼接区，所述第二拼接区的延伸方向垂直于所述第三拼接区的延伸方向；
    至少部分所述柔性衬底延伸出所述基板的显示承载区与所述第二侧相对设置的第四侧和/或与所述第三侧相对设置的第五侧。
  4. 根据权利要求1所述的显示面板，其中，
    还包括至少一个第一凹槽，位于延伸出所述基板的显示承载区的所述柔性衬底，远离所述发光单元电路层一侧的表面；
    所述驱动芯片位于所述第一凹槽内，与所述柔性衬底远离所述发光单元电路层一侧的表面平齐，通过位于所述柔性衬底侧面的导电连接层与所述焊盘电连接。
  5. 根据权利要求1所述的显示面板，其中，
    还包括至少一个第二凹槽，位于所述拼接区的第一表面，所述驱动芯片位于所述第二凹槽内，与所述拼接区的第一表面或者第二表面平齐，通过位于所述柔性衬底侧面的导电连接层与至少一个所述焊盘电连接，所述第一表面与所述第二表面相对设置，所述第一表面为所述基板的第一表面；或者，
    还包括至少一个导电通孔，位于所述拼接区，所述驱动芯片位于所述拼接 区的第二表面，所述导电连接层延伸至所述拼接区的第一表面，通过所述导电通孔与所述驱动芯片电连接。
  6. 根据权利要求1所述的显示面板，其中，
    所述导电连接层包括一层或者多层导电膜层。
  7. 根据权利要求1所述的显示面板，其中，
    所述发光单元电路层还包括金属线路层，所述金属线路层包括多条数据线、多条扫描线以及每一数据线和每一扫描线交叉确定的发光单元，所述发光单元的第一电极与所述数据线电连接，所述发光单元的第二电极与所述扫描线电连接；
    所述数据线和所述扫描线分别与所述焊盘电连接。
  8. 根据权利要求7所述的显示面板，其中，
    所述金属线路层还包括信号输入线路层以及发光驱动线路层，所述信号输入线路层分别与所述数据线和所述扫描线电连接，所述信号输入线路层用于为所述发光驱动线路层提供驱动电源信号，所述发光驱动线路层用于驱动所述发光单元发光。
  9. 根据权利要求1所述的显示面板，其中，
    所述基板包括玻璃。
  10. 根据权利要求1所述的显示面板，其中，
    所述柔性衬底包括聚酰亚胺或者聚萘二甲酸乙二醇酯；所述柔性衬底的厚度大于或等于5微米，且小于或等于50微米。
  11. 一种显示装置，包括权利要求1-10任一项所述的显示面板。
PCT/CN2021/076023 2020-02-14 2021-02-08 显示面板以及显示装置 WO2021160090A1 (zh)

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