WO2021157470A1 - Dispositif de coupe, dispositif de transfert de matériau de liaison et dispositif de montage - Google Patents

Dispositif de coupe, dispositif de transfert de matériau de liaison et dispositif de montage Download PDF

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Publication number
WO2021157470A1
WO2021157470A1 PCT/JP2021/003128 JP2021003128W WO2021157470A1 WO 2021157470 A1 WO2021157470 A1 WO 2021157470A1 JP 2021003128 W JP2021003128 W JP 2021003128W WO 2021157470 A1 WO2021157470 A1 WO 2021157470A1
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WO
WIPO (PCT)
Prior art keywords
bonding material
transfer
chip component
cutting
mounting
Prior art date
Application number
PCT/JP2021/003128
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English (en)
Japanese (ja)
Inventor
真一 星野
寺田　勝美
幹夫 川上
Original Assignee
東レエンジニアリング株式会社
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Filing date
Publication date
Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Publication of WO2021157470A1 publication Critical patent/WO2021157470A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

Definitions

  • a device for mounting chip parts on a substrate using a bonding material a cutting device, a bonding material transfer device, and a mounting device.
  • FIG. 9 shows how the chip components are joined to the substrate using the bonding material, and as shown in FIG. 9A, the chip components are mounted between the chip component C and the substrate S from the state where the bonding material 101 is interposed.
  • the resin component of the bonding material 101 is cured, and the chip component C is mounted on the substrate S as shown in FIG. 9B.
  • the bonding material 101 is arranged at a plurality of locations on the substrate S as shown in FIG. 11 and then the chip component C is mounted, the heat during heat crimping passes through the substrate S.
  • the adjacent (before mounting) bonding material 101 may be heated and adversely affected. Further, when the joining material 101 is to be arranged at another place after mounting the chip component C, the mounted chip component C may become an obstacle.
  • FIG. 12 is a diagram illustrating a step of transferring the bonding material 101 to the chip component C.
  • the chip component C is arranged on the sheet-shaped transfer material 101 as shown in FIG. 12A, and FIG. 12B ), Then the chip component C is pressed by the transfer tool 32 and then separated as shown in FIG. 12 (c) to tear off the bonding material 101 having a size substantially equal to that of the chip component C and transfer it to the chip component C. You can.
  • the bonding material 101 is torn off, it is not always transferred in the same size as the chip component C, and an excess (including metal fine particles) may be generated at the end portion, so that the chip component C is mounted on the substrate. It may adversely affect the quality of the product.
  • Cited Document 1 proposes a method of forming a bonding material according to the size of the chip component by screen printing and then transferring the bonding material to the chip component. With this method, it is easy to transfer the bonding material with less edge disorder according to the size of the chip component.
  • Cited Document 1 it is necessary to prepare a stencil for each size of the chip part, which is costly and has a problem that it is difficult to handle a wide variety of products.
  • the present invention has been made in view of the above problems, and is a cutting device, a bonding material transfer device, and a mounting device for mounting a chip component on a substrate via a bonding material of an appropriate size at a relatively low cost. Is to provide.
  • the invention according to claim 1 is It is a cutting device that makes grid-like cuts on the surface of the bonding material layer of the bonding material sheet in which the bonding material is laminated on the surface of the mount. It is a cutting device including a cutting stage that holds the bonding material sheet from the mount side and can move in the in-plane direction, and a straight blade that makes a linear notch on the surface side of the bonding material layer.
  • the invention according to claim 2 is the cutting device according to claim 1.
  • the straight blade is a cutting device characterized in that the straight blade is machined so that the cross-sectional shape of the tip portion has a pinnacle shape.
  • the invention according to claim 3 is the cutting device according to claim 1 or 2.
  • the cutting device has a depth of cut of 80% or more of the thickness of the bonding material layer and does not penetrate the mount.
  • the invention according to claim 4 is the cutting device according to any one of claims 1 to 3.
  • the cutting stage is a cutting device having a function of rotating the joining material sheet in an in-plane direction by 90 degrees or more.
  • the invention according to claim 5 A bonding material transfer device that transfers a bonding material to a chip component according to the size of the chip component.
  • the cutting device according to any one of claims 1 to 4 and a transfer device for transferring a bonding material from the bonding material sheet to a chip component are provided.
  • the transfer device is a bonding material transfer device having a transfer stage that holds the bonding material sheet and can move in the in-plane direction, a transfer tool that holds the chip parts, and an alignment camera.
  • the invention according to claim 6 is the bonding material transfer device according to claim 5.
  • the transfer stage is a bonding material transfer device that holds the bonding material sheet via a buffer sheet.
  • the invention according to claim 7 is the bonding material transfer device according to claim 5 or 6.
  • the cutting stage is a bonding material transfer device that also functions as the transfer stage.
  • the invention according to claim 8 is A mounting device including the bonding material transfer device according to any one of claims 5 to 7, and a thermocompression bonding device for thermocompression bonding a chip component to which the bonding material has been transferred to a substrate.
  • the thermocompression bonding device is a mounting device having a mounting stage that holds the substrate and can move in the in-plane direction, a mounting tool that holds the chip components, and an alignment camera.
  • the invention according to claim 9 is the mounting device according to claim 8.
  • the transfer tool is a mounting device that also has the function of the mounting tool.
  • the present invention it is possible to easily obtain a bonding material according to the size of a chip component with high accuracy, and it is possible to improve the mounting quality at a relatively low cost.
  • FIG. 1 It is a figure which shows the structure of the bonding material transfer apparatus which concerns on embodiment of this invention. It relates to the cutting apparatus which concerns on embodiment of this invention, it is (a) the figure which shows the cross section of the blade suitable as a straight blade, (b) is the cross-sectional view which shows the state of making a cut in a joint material sheet. (C) It is sectional drawing explaining the depth of cut. It is a flow figure explaining the cutting process and the transfer process which concerns on embodiment of this invention. The movement of the cutting device according to the embodiment of the present invention will be described. It is a figure which shows the state which inserts (c) the state before making a second cut, and (d) the state which made a predetermined number of cuts in the direction of one side.
  • a state of the joining material sheet rotated 90 degrees in the direction (c) a state of making a notch in the joining material sheet rotated 90 degrees in the in-plane direction with a straight blade, and (d) a state in which a grid-like notch is formed in the joining material sheet. It is a figure which shows the state.
  • Another embodiment of the present invention will be described, wherein (a) a state in which a predetermined cut in the one-side direction of the joining material sheet is completed, and (b) a straight blade is used after the predetermined cut in the one-side direction is completed. It is a figure which shows the state which was rotated 90 degrees in the in-plane direction.
  • thermocompression bonding apparatus A state in which a chip component is mounted on a substrate using a bonding material is described, and is a diagram showing (a) a state before thermocompression bonding and (b) a state after thermocompression bonding.
  • a different method using a joining material is described, and is a diagram showing (a) an example of arranging the joining material on a substrate, and (b) an example of arranging the joining material on a chip component. It is a figure which shows the mounting process in the state that the bonding material is arranged on the substrate. The process of transferring the sheet-shaped joint material to the chip parts is explained. (A) The chip parts are placed on the joint material, (b) The chip parts are pressed against the joint material, and (c) The joint material. It is a figure explaining the state which separates a chip part while tearing off.
  • FIG. 1 is a diagram showing a configuration of a bonding material transfer device 1 according to an embodiment of the present invention.
  • the joining material transfer device 1 cuts the joining material 101 of the joining material sheet 10 to an appropriate size and then transfers it to the chip component C, and includes the cutting device 2 and the transfer device 3.
  • the joining material sheet 10 is a bonding material 101 laminated on the mount 100.
  • the mount 100 is a base sheet on which the bonding material 101 is laminated on the surface, and it is desirable that the mount 100 has a mold releasability with respect to the bonding material 101.
  • the thickness of the mount 100 varies depending on the thickness and composition of the bonding layer 101, but is about 20 ⁇ m to 200 ⁇ m.
  • the bonding material 101 is a resin in which submicron-sized metal fine particles are dispersed, and has a thickness of about 10 ⁇ m to 100 ⁇ m.
  • silver or copper is used as the metal fine particles, and the weight of the metal fine particles in the entire bonding material is usually 90% or more.
  • the cutting device 2 makes a grid-like notch on the surface of the joining material 101 of the joining material sheet 10, and includes a cutting stage 21 and a straight blade 22 as components.
  • the cutting stage 21 has a function of holding the joining material sheet 10 on the surface on the backing sheet 100 side and moving the joining material sheet 10 in the in-plane direction (X direction, Y direction). Further, it is desirable that the cutting stage 21 has a function of rotating the joining material sheet 10 on the same surface (rotation about the Z direction as an axis).
  • the straight blade 22 makes a linear notch from the surface of the joining material 101.
  • a notch can be formed with high precision, and a pinnacle shape obtained by cutting as shown in FIG. 2 (a) (so-called Pinnacle (registered trademark) shape) is desirable.
  • FIG. 2B shows a state in which a straight blade 22 having a cross section as shown in FIG. 2A is used to make a notch from the surface of the joining material 101.
  • the cutting device 2 has a driving means for allowing at least one of the cutting stage 21 and the straight blade 22 to move in the vertical direction (Z direction), and the cutting stage 21 and the straight blade 22. It also has control means for measuring and controlling the distance of 22. Therefore, it is also possible to control the cutting depth as shown in FIG. 2 (c).
  • the transfer device 3 transfers the bonding material 101 from the bonding material sheet 10 having a grid-like notch in the bonding material 101 to the chip component C by the cutting device 2.
  • the alignment camera 33 is a component.
  • the transfer stage 31 has a function of holding the joining material sheet 10 on the surface on the backing sheet 100 side and moving the joining material sheet 10 in the in-plane direction (X direction, Y direction). Further, it is desirable that the transfer stage 31 has a function of adjusting the angle of the joining material sheet 10 on the same surface (rotation angle about the Z direction). Further, when the transfer stage 31 holds the bonding material sheet 10, the buffer sheet 34 may be used.
  • the cutting stage 21 may also serve as the transfer stage 31.
  • the transfer tool 32 has a function of holding the chip component C, moves the chip component C picked up from the chip tray or the like onto the transfer stage 31, and moves the chip component C to which the bonding material 101 is transferred to the next process.
  • the transfer device 3 has a driving means that enables at least one of the transfer stage 31 and the transfer tool 32 to move in the vertical direction (Z direction), and the transfer stage 31 and the transfer tool 32. It is desirable to also have a control means for measuring and controlling the distance. By doing so, it is possible to avoid applying excessive pressure when the chip component C is brought into close contact with the bonding material 101.
  • step ST01 of FIG. 3 will be described with reference to FIG. Step ST01 is performed by the cutting device 2, and in FIG. 4, the cutting stage 21 holding the mount 100 side is omitted.
  • FIG. 4 shows how the straight blade 22 makes linear cuts at predetermined intervals.
  • the straight blade 22 is arranged at a predetermined position on the joining material 101 in order to make the first cut on one end side.
  • the straight blade 22 is pushed from the surface of the joint material 101 to make a notch SL.
  • the depth of the notch SL is It is desirable that the thickness is in the range of the thickness of the joining material 101 ⁇ 0.8 ⁇ the depth of the notch SL ⁇ the thickness of the joining material 101 + the thickness of the mount 101 ⁇ 0.5.
  • the mount 100 is cut when the bonding material 101 is transferred to the chip component C, and the chip component C is cut. It may be transferred with the mount 101 attached, which is not preferable.
  • the distance between the cutting stage 21 and the straight blade 22 is widened, and the state is as shown in FIG. 4 (c).
  • the notch SL is inserted to the other end side of the joining material 101 (FIG. 4 (d)).
  • the cutting stage 21 that can move in the XY direction may be moved in the X direction, but the straight blade 22 may have a function of moving in the X direction.
  • the predetermined distance between the notch SLs is substantially equal to the length of one side of the chip component C that transfers the bonding material 101.
  • step ST2 the pattern of the cut SL is made into a grid pattern by making the cut SL in the direction perpendicular to the direction of the cut SL made in step ST01.
  • step ST02 of the present embodiment first, as shown in FIG. 5A, the joining sheet 10 is rotated 90 degrees in the in-plane direction (rotation axis in the Z direction) to bring it into the state shown in FIG. 5B. Therefore, the cutting stage 21 has a function of rotating the joining material sheet 10 at least 90 degrees in the in-plane direction. After that, the cut SL is made in parallel with a predetermined interval from one end side as shown in FIG. 5 (c) to the other end side as shown in FIG. 5 (d).
  • this embodiment is a method of rotating the cutting stage 21, but as another embodiment, as shown in FIGS. 6A to 6B, the straight blade 22 is moved in the in-plane direction of the joining material 101.
  • a method of rotating 90 degrees may be used.
  • step ST03 as a preparatory step for the transfer step, a bonding sheet 10 having a bonding material 101 having a grid-like notch is arranged on the transfer stage 31. At this time, it is desirable to interpose the buffer sheet 34 between the bonding sheet 10 (mounting sheet 100) and the transfer stage 31. Although the cutting sheet 21 can be used as the transfer stage 31, it is preferable to sandwich the cushioning sheet 34 with the bonding sheet 10 before entering the transfer step.
  • step ST11 As a preparatory step for the transfer process, it is necessary for the transfer tool 32 to separately hold the chip component C from the chip tray or the like (step ST11). After these preparations are completed, the transfer material 101 is transferred to the chip component C by the transfer device 3.
  • step ST21 as shown in FIG. 7A, the alignment camera 33 is used to align the chip component C and the joining member 101 in a state where they are separated from each other.
  • the transfer stage 31 and the transfer tool 32 were formed by making notches SL in a grid pattern (the relative positional relationship between the rectangular bonding material 101 having substantially the same size as the chip component C and the chip component C was grasped. Is relatively moved in the XY in-plane direction, and a rectangular joining member 101 is arranged directly below the chip component C (FIG. 7 (b)).
  • step ST22 the transfer tool 32 and the transfer stage 31 are moved relative to each other in the Z direction to be brought close to each other, and then the chip component C is pressed against the bonding material 101 (FIG. 7 (c)).
  • the cushioning sheet 34 is arranged under the bonding material sheet 10, a strong adhesion force is generated between the chip component C and the bonding material 101 without damaging the chip component C by pressing.
  • the transfer tool 32 and the transfer stage are separated in the Z direction as step ST23, as shown in FIG. 7 (d).
  • the rectangular joining material 101 is transferred to the chip component C.
  • the bonding material 101 having a shape corresponding to the size of various chip parts C is obtained by the cutting device 2 having a relatively simple structure and can be obtained with high quality. Further, in addition to being a device having a relatively simple structure, by forming grid-like notches in the sheet-shaped joining material 101, the utilization efficiency of the joining material 101 is improved, and the joining material transfer process can be performed at low cost. You can.
  • the bonding material transfer device 1 of the present embodiment may be combined with the thermocompression bonding device 4 having a function of thermocompression bonding the chip component C to the substrate S as shown in FIG. 8 to form a mounting device.
  • the thermocompression bonding device 4 of FIG. 8 has a mounting stage 41 that holds the substrate S and can move in the in-plane direction, and a mounting tool that holds the chip component C and thermocompression-bonds to the substrate S on the mounting stage 41.
  • the configuration includes the 42 and the alignment camera 43
  • the transfer tool 32 may have the function of the mounting tool 42
  • the alignment camera 33 of the transfer device 3 functions as the alignment camera 43 of the thermocompression bonding device 4. You may have.
  • the description so far has assumed a mounting form in which face-up mounting is performed using a bonding material in which metal fine particles are dispersed, but the present invention has a face that joins the electrode surface of the chip component C and the electrode surface of the substrate. It can also be applied to down mounting. That is, with respect to the insulating film NCF and the anisotropic conductive film ACF, the shape corresponding to the size of the chip component C can be easily obtained with high accuracy, which can be useful for improving the mounting quality.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)

Abstract

Un dispositif de coupe, un dispositif de transfert de matériau de liaison et un dispositif de montage sont divulgués, destinés à réaliser, à un coût relativement bas, le montage d'un composant de puce sur un substrat avec un élément de liaison d'une taille appropriée interposée entre ceux-ci. En particulier, l'invention concerne un dispositif de coupe comprenant : un étage de coupe qui retient une feuille de matériau de liaison à partir d'un côté de papier de support de celui-ci, et qui peut se déplacer dans une direction dans le plan, ladite feuille de matériau de liaison ayant un matériau de liaison en couches sur une surface du papier de support ; et une lame droite qui introduit une coupe en forme de ligne droite dans le côté de la surface de la couche de matériau de liaison. L'invention concerne également un dispositif de transfert de matériau de liaison qui transfère un matériau de liaison à un composant de puce, ledit matériau de liaison ayant été conçu pour correspondre à la taille du composant de puce, et un dispositif de montage qui comprend le dispositif de coupe et le dispositif de transfert de matériau de liaison.
PCT/JP2021/003128 2020-02-06 2021-01-29 Dispositif de coupe, dispositif de transfert de matériau de liaison et dispositif de montage WO2021157470A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-018395 2020-02-06
JP2020018395A JP2021125572A (ja) 2020-02-06 2020-02-06 裁断装置、接合材転写装置および実装装置

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WO2021157470A1 true WO2021157470A1 (fr) 2021-08-12

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194135A (ja) * 2008-02-14 2009-08-27 Disco Abrasive Syst Ltd ダイボンディング方法及びダイボンダ
JP2018127518A (ja) * 2017-02-07 2018-08-16 古河電気工業株式会社 接着シートおよびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009194135A (ja) * 2008-02-14 2009-08-27 Disco Abrasive Syst Ltd ダイボンディング方法及びダイボンダ
JP2018127518A (ja) * 2017-02-07 2018-08-16 古河電気工業株式会社 接着シートおよびその製造方法

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