WO2021149426A1 - Ｌｅｄパッケージ - Google Patents

Ｌｅｄパッケージ Download PDF

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Publication number
WO2021149426A1
WO2021149426A1 PCT/JP2020/047445 JP2020047445W WO2021149426A1 WO 2021149426 A1 WO2021149426 A1 WO 2021149426A1 JP 2020047445 W JP2020047445 W JP 2020047445W WO 2021149426 A1 WO2021149426 A1 WO 2021149426A1
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WO
WIPO (PCT)
Prior art keywords
pair
led package
chip
resin
lens
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Application number
PCT/JP2020/047445
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English (en)
French (fr)
Japanese (ja)
Inventor
裕也 長谷川
雄史 牧村
智一郎 外山
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by ローム株式会社 filed Critical ローム株式会社
Priority to JP2021573014A priority Critical patent/JPWO2021149426A1/ja
Publication of WO2021149426A1 publication Critical patent/WO2021149426A1/ja

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue
    • A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Definitions

  • This disclosure relates to LED packages.
  • Patent Document 1 discloses an example of a human body information measurement module.
  • the module is used, for example, by being incorporated in a wristwatch.
  • the module includes a light emitting unit that irradiates an object with light and a light receiving unit that detects the light reflected by the object.
  • the light emitting unit emits a plurality of lights having different wavelengths depending on the type of measurement target (human body information).
  • the light receiving unit individually detects a plurality of lights reflected from the object according to the wavelength. For example, if the object is a blood vessel, green light can be used to measure the pulse wave. If the object is hemoglobin in the blood, the oxygen concentration in the blood can be measured using red light and infrared light.
  • the above-mentioned conventional module needs to be provided with a plurality of LED chips in order to measure a plurality of types of human body information. Further, in order to improve the measurement accuracy, it is desirable to individually set the light irradiation range according to the size of the object (blood vessel, hemoglobin, etc.). For example, when the object is a blood vessel, it is desirable that the light irradiation range is relatively wide. On the other hand, when the object is hemoglobin in blood, it is desirable that the irradiation range of light is relatively narrow.
  • one issue of this disclosure is to provide a new LED package.
  • the LED package provided by one aspect of the present disclosure includes a support member provided with wiring, a plurality of LED chips conducting the wiring, and a plurality of lenses that individually distribute light emitted from the plurality of LED chips.
  • a translucent resin including a portion is provided.
  • the plurality of LED chips include at least one first chip and at least one second chip, and the first chip and the second chip emit different wavelengths of light.
  • the plurality of lens units include a first lens unit that distributes light emitted from the first chip and a second lens unit that distributes light emitted from the second chip. The first lens portion and the second lens portion are located apart from each other, and the light distribution angle of the first lens portion is different from the light distribution angle of the second lens portion.
  • FIG. 5 is a cross-sectional view taken along the line VIII-VIII of FIG.
  • FIG. 16 is a partially enlarged cross-sectional view of the LED package shown in FIG. It is a top view of the LED package which concerns on 3rd Embodiment. It is a partially enlarged front view of the LED package shown in FIG. It is a partially enlarged sectional view of the LED package shown in FIG.
  • FIG. 2 is a cross-sectional view taken along the line XXII-XXII of FIG. It is sectional drawing explaining the operation of the LED package shown in FIG.
  • the LED package A10 includes a support member 10, a plurality of LED chips 20, a plurality of wires 30, a translucent resin 40, a resist layer 50, a case 60, and an adhesive layer 69.
  • the LED package A10 is used in a human body information measurement module together with a plurality of light receiving elements such as a photodiode.
  • FIG. 1 VIII-VIII, XX, and XI-XI lines are shown as alternate long and short dash lines.
  • the translucent resin 40, the case 60, and the adhesive layer 69 are not shown.
  • FIG. 9 corresponds to FIG.
  • the three directions orthogonal to each other are appropriately referred to.
  • the direction perpendicular to the paper surface of FIG. 1 is defined as the “thickness direction z”
  • one direction orthogonal to the thickness direction z is defined as the “first direction x”.
  • the direction orthogonal to both the thickness direction z and the first direction x is defined as the "second direction y”.
  • the LED package A10 has a rectangular shape when viewed along the thickness direction z (also referred to as “in a plan view”).
  • the LED package A10 shown in the figure is elongated in the first direction x, but the present disclosure is not limited thereto.
  • the support member 10 supports a plurality of LED chips 20.
  • the support member 10 has a base material 11, wiring 12, a plurality of terminals 13, a plurality of side terminals 14, connecting wiring 15, a plurality of vias 16, and a radiator 17.
  • wiring 12 a plurality of terminals 13, a plurality of side terminals 14, a connecting wiring 15, a plurality of vias 16, and a radiator 17 are arranged on the base material 11.
  • the base material 11 has electrical insulation.
  • the base material 11 has a main surface 11A, a bottom surface 11B, a side surface 11C, and a plurality of grooves (or penetrations) 11D.
  • the main surface 11A and the bottom surface 11B face opposite to each other in the thickness direction z. Of these, the main surface 11A is located closer to the plurality of LED chips 20 than the bottom surface 11B in the thickness direction z.
  • the bottom surface 11B faces the wiring board when the LED package A10 is mounted on the wiring board.
  • the side surface 11C is connected to the main surface 11A and the bottom surface 11B, and faces outward in a direction orthogonal to the thickness direction z.
  • the side surface 11C includes a pair of regions facing outward in the first direction x and a pair of regions facing outward in the second direction y (see FIG. 3).
  • Each of the plurality of groove portions 11D is recessed from the side surface 11C toward the inside of the base material 11, and is connected to the main surface 11A and the bottom surface 11B.
  • each of the plurality of groove portions 11D is recessed inward of the base material 11 from any of a pair of regions of the side surface 11C facing outward in the first direction x.
  • the plurality of groove portions 11D are arranged at predetermined intervals in the second direction y.
  • Each of the plurality of grooves 11D has a semicircular shape when viewed along the thickness direction z, but the present disclosure is not limited thereto.
  • the base material 11 has a multi-layer structure and includes an upper layer 111, a lower layer 112 and an intermediate layer 113 laminated in the thickness direction z.
  • the upper layer 111, the lower layer 112, and the intermediate layer 113 are all made of a material containing a glass epoxy resin.
  • the upper layer 111 forms the main surface 11A
  • the lower layer 112 forms the bottom surface 11B.
  • the intermediate layer 113 is sandwiched between the upper layer 111 and the lower layer 112.
  • the base material 11 is integrated by thermocompression bonding the upper layer 111, the lower layer 112, and the intermediate layer 113 to each other.
  • the wiring 12 is arranged on the main surface 11A of the base material 11 (upper layer 111).
  • the wiring 12 is conductive between the plurality of LED chips 20 and the wiring board on which the LED package A10 is mounted, together with the plurality of terminals 13, the plurality of side terminals 14, the connecting wiring 15, and the plurality of vias 16. It is a route.
  • the wiring 12 is composed of a plurality of metal layers. Examples of the plurality of metal layers include a copper (Cu) layer, a nickel (Ni) layer, and a gold (Au) layer in order from the main surface 11A.
  • the wiring 12 is mainly formed by electrolytic plating.
  • the wiring 12 includes a plurality of first pads 121, a plurality of second pads 122, and a plurality of third pads 123.
  • a plurality of LED chips 20 are bonded to the plurality of first pads 121, respectively.
  • six first pads 121 are used, which are arranged in a 2x3 matrix. That is, there are two rows extending in the first direction x (first row and second row from the top) and three columns extending in the second direction y (first column, second column, and third column from the left). ), Each row consists of three first pads 121, and each column consists of two first pads 121.
  • each of the plurality of second pads 122 is adjacent to any one of the plurality of first pads 121.
  • one second pad 122 is adjacent to each of the first pads 121 belonging to the first row and the third row.
  • two second pads 122 are adjacent to each of the first pads 121 belonging to the second row (center row), and they are adjacent to each other in the second direction y with the first pad 121 in between. They are spaced apart.
  • the plurality of third pads 123 are individually arranged with respect to the plurality of groove portions 11D of the base material 11.
  • Each of the plurality of third pads 123 has a band shape extending non-linearly when viewed along the thickness direction z, and in the illustrated example, it has a shape smoothly curved along an arc.
  • the plurality of terminals 13 are arranged on the bottom surface 11B of the base material 11 (lower layer 112).
  • the plurality of terminals 13 are individually arranged with respect to the plurality of groove portions 11D of the base material 11.
  • the plurality of terminals 13 are joined to the wiring board via solder.
  • each of the plurality of terminals 13 is composed of a plurality of metal layers.
  • the configuration of the plurality of metal layers is the same as that of the plurality of metal layers forming the wiring 12, for example.
  • the plurality of side terminal terminals 14 are individually arranged with respect to the plurality of groove portions 11D of the base material 11.
  • Each of the plurality of side surface terminals 14 is formed along a region of the side surface 11C of the base material 11 that defines each of the plurality of groove portions 11D.
  • Each side surface terminal 14 is connected to one of the plurality of third pads 123 at one end in the thickness direction z, and is connected to any of the plurality of terminals 13 at the other end.
  • the connecting wiring 15 is arranged in the lower layer 112 of the base material 11 and the intermediate layer 113 of the base material 11.
  • the communication wiring 15 forms a conduction path between the wiring 12 (the plurality of first pads 121 and the plurality of second pads 122) and the plurality of side terminals 14 together with the plurality of vias 16.
  • the connecting wiring 15 is made of, for example, copper.
  • the connecting wiring 15 includes the first wiring 151 and the second wiring 152.
  • the first wiring 151 is arranged on the lower layer 112 of the base material 11 on a surface facing the bottom surface 11B of the base material 11.
  • the first wiring 151 includes a plurality of regions. Each of the plurality of regions is connected to any of the plurality of side terminals 14.
  • the first wiring 151 is sandwiched between the lower layer 112 and the intermediate layer 113 of the base material 11.
  • the second wiring 152 is arranged on the intermediate layer 113 of the base material 11 so as to face the same side as the main surface 11A of the base material 11.
  • the second wiring 152 includes a plurality of regions. Each of the plurality of regions is connected to any of the plurality of side terminals 14.
  • the second wiring 152 is sandwiched between the intermediate layer 113 and the upper layer 111 of the base material 11.
  • the plurality of vias 16 are embedded in the base material 11. Each of the plurality of vias 16 is connected to any region of the connecting wiring 15. In addition, the plurality of vias 16 are individually connected to the plurality of first pads 121 and the plurality of second pads 122. Each via 16 is conductive and is made of, for example, copper. Each via 16 is a columnar shape extending in the thickness direction z. The plurality of vias 16 include a plurality of first vias 161 and a plurality of second vias 162.
  • each of the plurality of first vias 161 is embedded in the upper layer 111 of the base material 11 and the intermediate layer 113 of the base material 11.
  • Each first via 161 is connected to any region of the first wiring 151 at one end of the thickness direction z, and at the other end, a plurality of first pads 121 and a plurality of second pads 122. It is connected to one of.
  • each of the plurality of second vias 162 is embedded in the upper layer 111 of the base material 11. Therefore, the length of each of the plurality of second vias 162 is smaller than the length of each of the plurality of first vias 161.
  • Each second via 162 is connected to any region of the second wiring 152 at one end of the thickness direction z, and at the other end, the plurality of first pads 121 and the plurality of second pads 122. It is connected to one of.
  • the heat radiating body 17 is arranged on the bottom surface 11B of the base material 11 (lower layer 112).
  • the radiator 17 is located between the plurality of terminals 13.
  • the area of the radiator 17 is larger than the total area of the plurality of terminals 13.
  • each of the plurality of terminals 13 is composed of a plurality of metal layers. The configuration of the plurality of metal layers is the same as that of the plurality of metal layers forming the wiring 12, for example.
  • the plurality of LED chips 20 are individually bonded to the plurality of first pads 121 of the wiring 12.
  • the plurality of LED chips 20 are arranged in three rows with respect to the first direction x. In each of these rows, the pair of LED chips 20 are arranged in the second direction y at predetermined intervals, and the pair of LED chips 20 form a group in the LED package A10.
  • the plurality of LED chips 20 include four first chips 201 and a pair of second chips 202. The wavelengths of light emitted from the first chip 201 and the second chip 202 are different from each other.
  • the four first chips 201 form two rows (each extending in the second direction y) located on the left side and the right side of the first direction x. In each of these rows, a pair of first chips 201 are arranged in the second direction y at predetermined intervals.
  • the pair of first chips 201 is referred to as group 1 20A.
  • there are two first groups 20A (the first group 20A on the left and the first group 20A on the right).
  • one chip is a chip that emits red light (“red light chip”) and the other chip is a chip that emits infrared light (“infrared chip”).
  • Group 1 20A is used to measure the blood oxygen concentration of the human body.
  • the red light chip of the first group 20A is used to measure the total number of hemoglobin in blood per unit volume. Further, the infrared chip in the first group 20A is used to measure the total number of hemoglobins in the blood that do not carry oxygen among the hemoglobins in the blood per unit volume.
  • each first chip 201 has a first electrode 21 and a second electrode 22.
  • the first electrode 21 is provided so as to face the first pad 121 to which the first chip 201 is bonded.
  • the first electrode 21 is the anode of the first chip 201.
  • the first electrode 21 is bonded to the first pad 121 via the bonding layer 29.
  • the bonding layer 29 has conductivity.
  • the bonding layer 29 is made of a material containing, for example, silver (Ag) particles and an epoxy resin.
  • the first electrode 21 is conductive to the first pad 121 via the bonding layer 29.
  • the second electrode 22 is provided on the upper surface of the first chip 201.
  • the second electrode 22 is the cathode of the first chip 201.
  • the pair of second chips 202 form one row (second group 20B) located between the left and right two rows composed of the first chip 201.
  • the two second chips 202 are spaced apart from each other in the second direction y at predetermined intervals.
  • the second group 20B is located between the plurality of first chips 201 (four in the illustrated example).
  • the chips belonging to the second group 20B (second chip 202) emit light having the same wavelength as each other.
  • each second chip 202 emits green light. Therefore, the wavelength of the light emitted from each chip of the second group 20B is shorter than the wavelength of the light emitted from the four first chips 201.
  • the second group 20B (second chip 202) is used to measure the pulse wave (pulsation of blood vessels).
  • each second chip 202 has a first electrode 21 and a second electrode 22.
  • the first electrode 21 is the anode of the second chip 202.
  • the second electrode 22 is the cathode of the second chip 202.
  • the first electrode 21 and the second electrode 22 are provided on the upper surface of the second chip 202.
  • each second chip 202 is arranged between the two first chips 201 in the first direction x.
  • one of the two first chips 201 is a red light chip and the other is an infrared chip.
  • the two first chips 201 are both red light chips (or infrared chips).
  • each of the plurality of wires 30 has one end bonded to one of the plurality of second pads 122 of the wiring 12, and the other end is any one of the plurality of LED chips 20. It is joined to.
  • Each wire 30 is made of, for example, gold.
  • the plurality of wires 30 include a plurality of first wires 301 and a plurality of second wires 302.
  • each first wire 301 is joined to the first electrode 21 of the corresponding second chip 202 and the corresponding second pad 122.
  • the second pad 122 is the pad closest to the first electrode 21 among the plurality of second pads 122.
  • the first electrode 21 and the second pad 122 of the second chip 202 are electrically connected to each other via the first wire 301.
  • each second wire 302 is joined to the second electrode 22 of the corresponding one LED chip 20 and the corresponding second pad 122.
  • the second pad 122 is the pad closest to the second electrode 22 among the plurality of second pads 122.
  • the second electrode 22 and the second pad 122 of the LED chip 20 are electrically connected to each other via the second wire 302.
  • the translucent resin 40 is arranged on the main surface 11A of the base material 11 (upper layer 111), and the plurality of first pads 121 of the wiring 12 and the wiring. It covers twelve second pads 122, twelve LED chips 20, and twelve wires 30.
  • the translucent resin 40 transmits the light emitted from each LED chip 20.
  • the translucent resin 40 has a plurality of lens portions 401.
  • the plurality of lens portions 401 are arranged apart from each other. Each lens unit 401 distributes light emitted from one corresponding LED chip 20.
  • the translucent resin 40 is made of a material containing, for example, a silicone and an epoxy resin.
  • the translucent resin 40 is formed by transfer molding.
  • the translucent resin 40 includes a pair of the first resin 41 and the second resin 42. When viewed along the thickness direction z, the first resin 41 and the second resin 42 both have a band shape extending in the second direction y.
  • each of the pair of first resins 41 has a first pedestal portion 411, a pair of first lens portions 412, and a pair of first gate portions 413.
  • the first pedestal portion 411 extends in the second direction y.
  • the first pedestal portion 411 is in contact with the main surface 11A of the base material 11.
  • the first pedestal portion 411 includes a pair of first chips 201, a plurality of first pads 121 and second pads 122 related to the continuity of the pair of first chips 201, and a plurality of wires 30 (a pair of second wires). 302) and is covered.
  • the pair of first lens portions 412 are arranged in the second direction y.
  • the pair of first lens portions 412 are connected to the upper surface of the first pedestal portion 411 and project from the upper surface in the thickness direction z.
  • the pair of first lens units 412 is included in the plurality of lens units 401.
  • the pair of first lens units 412 individually distribute the light emitted from each of the pair of first chips 201.
  • the pair of first lens units 412 individually overlap with the pair of first chips 201.
  • the pair of first gate portions 413 are connected to both ends of the first pedestal portion 411 in the second direction y.
  • Each of the pair of first gate portions 413 extends in the second direction y and is in contact with the main surface 11A of the base material 11.
  • the thickness of each of the pair of first gate portions 413 is smaller than the thickness of the first pedestal portion 411.
  • the second resin 42 is located between the pair of first resins 41.
  • the second resin 42 is located apart from the pair of first resins 41 in the first direction x.
  • the second resin 42 has a first lens portion 412, a pair of second lens portions 422, and a pair of second gate portions 423.
  • the second pedestal portion 421 extends in the second direction y.
  • the second pedestal portion 421 is in contact with the main surface 11A of the base material 11.
  • the second pedestal portion 421 includes a pair of second chips 202, a plurality of first pads 121 related to conduction of the pair of second chips 202, a part of the second pads 122, and a plurality of wires 30 (plurality of wires 30). It covers one wire 301 and a plurality of second wires 302).
  • the pair of second lens portions 422 are arranged in the second direction y.
  • the pair of second lens portions 422 are connected to the upper surface of the second pedestal portion 421 and project from the upper surface in the thickness direction z.
  • the pair of second lens units 422 are included in the plurality of lens units 401.
  • the pair of second lens units 422 individually distribute the light emitted from each of the pair of second chips 202.
  • the pair of second lens portions 422 individually overlap with the pair of second chips 202.
  • the pair of second gate portions 423 are connected to both ends of the second pedestal portion 421 in the second direction y.
  • Each of the pair of second gate portions 423 extends in the second direction y and is in contact with the main surface 11A of the base material 11.
  • the thickness of each of the pair of second gate portions 423 is smaller than the thickness of the second pedestal portion 421.
  • the light distribution angle ⁇ 2 of the second lens unit 422 is larger than the light distribution angle ⁇ 1 of the first lens unit 412. Therefore, in the LED package A10, the light emitted from each of the pair of second chips 202 is irradiated to the object more widely than the light emitted from each of the four first chips 201.
  • Each of these light distribution angles is determined by the shape of each of the plurality of lens portions 401 over the light distribution angle.
  • the resist layer 50 is arranged on the main surface 11A of the base material 11 (upper layer 111) and the bottom surface 11B of the base material 11 (lower layer 112).
  • the resist layer 50 has electrical insulation.
  • the resist layer 50 is, for example, a solder resist film.
  • the resist layer 50 includes a first resist layer 51 and a second resist layer 52.
  • the first resist layer 51 is arranged on the main surface 11A of the base material 11.
  • the first resist layer 51 includes a plurality of regions arranged along the peripheral edge of the main surface 11A. A part of the region of the first resist layer 51 closes one end of each of the plurality of groove portions 11D of the base material 11 in the thickness direction z from above, and covers the plurality of third pads 123 of the wiring 12. ..
  • the second resist layer 52 is arranged on the bottom surface 11B of the base material 11.
  • the second resist layer 52 includes a pair of regions located apart from each other in the first direction x. Each of the pair of regions extends in the second direction y. Each of the pair of regions is located at any end of the bottom surface 11B in the first direction x and is located between a group of terminals 13 arranged in the second direction y and the radiator 17. do.
  • the case 60 surrounds a plurality of LED chips 20 and a plurality of lens portions 401.
  • the case 60 has a frame shape when viewed along the thickness direction z.
  • the case 60 is supported by the support member 10.
  • Each of the first pedestal portion 411 of the pair of first resin 41 and the second pedestal portion 421 of the second resin 42 are located apart from the case 60.
  • Each part of the gate portion 423 is located between the support member 10 and the case 60 in the thickness direction z.
  • the case 60 is made of a material containing, for example, polyphthalamide (PPA) or liquid crystal polymer (LCP).
  • the material of the case 60 is not limited to these, and may be any material having relatively high mechanical strength and excellent heat resistance.
  • the case 60 has a top surface 60A, a back surface 60B, an outer surface 60C, an inner surface 60D, and a plurality of recesses 61.
  • the top surface 60A faces the same side as the main surface 11A of the base material 11 (upper layer 111) in the thickness direction z.
  • the back surface 60B faces the side opposite to the main surface 11A in the thickness direction z.
  • the back surface 60B faces the main surface 11A.
  • the back surface 60B has a main surface 11A, a first resist layer 51, and a pair of a pair of first resins 41 via an adhesive layer 69 located between the support member 10 and the case 60 in the thickness direction z. It is bonded to the 1 gate portion 413 and the pair of the second gate portions 423 of the pair of the second resin 42.
  • the adhesive layer 69 is made of a material containing a synthetic resin.
  • the case 60 has a configuration in which the back surface 60B is supported by the support member 10.
  • the outer surface 60C is connected to the top surface 60A and the back surface 60B and faces outward in a direction orthogonal to the thickness direction z.
  • the outer side surface 60C includes a pair of regions facing the first direction x and a pair of regions facing the second direction y. Each of the plurality of regions included in the outer side surface 60C is flush with any of the plurality of regions included in the side surface 11C of the base material 11.
  • the inner side surface 60D is connected to the top surface 60A and the back surface 60B and faces inward in a direction orthogonal to the thickness direction z.
  • the inner side surface 60D includes a pair of first resin 41's first pedestal portion 411, a pair of first resin 41's pair of first lens portions 412, a second resin 42's second pedestal portion 421, and a second resin. It faces a pair of second lens portions 422 of 42.
  • each of the plurality of recesses 61 is recessed from the back surface 60B in the thickness direction z. Further, each recess 61 is connected to any one of a pair of regions of the outer surface 60C facing the second direction y and the inner surface 60D. In FIG. 10, for example, the recess 61 on the left side is connected to the region of the outer surface 60C facing left, and the recess 61 on the right side is connected to the region of the outer surface 60C facing right.
  • Each part of the pair of first gate portions 413 of the pair of first resin 41 and each part of each part of the pair of second gate portions 423 of the second resin 42 are individually formed with respect to the plurality of recesses 61. It is contained.
  • the adhesive layer 69 is a part of each of the pair of first gate portions 413 of the pair of first resin 41 housed in the recess 61, and the second. Any part of each of the pair of second gate portions 423 of the resin 42 is covered around the second direction y.
  • Each end surface 423A of the pair of second gate portions 423 of the resin 42 is exposed from any of the pair of regions of the outer surface 60C facing the second direction y.
  • Each end face 413A of the pair of first gate portions 413 of the pair of first resin 41 and each end face 423A of each end face 423A of the pair of second gate portions 423 of the second resin 42 are flush with any of the pair of regions. Is. 14 and 15 typically show any one of the pair of second gate portions 423 of the second resin 42.
  • the LED package A10 has a plurality of lens units 401 that individually distribute the light emitted from each of the plurality of LED chips 20.
  • the plurality of LED chips 20 include a first chip 201 and a second chip 202 having different wavelengths of emitted light.
  • the plurality of lens units 401 include a first lens unit 412 that distributes light emitted from the first chip 201 and a second lens unit 422 that distributes light emitted from the second chip 202.
  • the first lens unit 412 and the second lens unit 422 are located apart from each other. As shown in FIG. 9, the light distribution angle ⁇ 1 of the first lens unit 412 is different from the light distribution angle ⁇ 2 of the second lens unit 422.
  • the irradiation range of the light emitted from the first chip 201 with respect to the object is different from the irradiation range of the light emitted from the second chip 202. Therefore, according to the LED package A10, it is possible to individually set the irradiation range to the object for a plurality of lights having different wavelengths individually emitted from the plurality of LED chips 20.
  • the wavelength of the light emitted from the second chip 202 is shorter than the wavelength of the light emitted from the first chip 201.
  • the light distribution angle ⁇ 2 of the second lens unit 422 is larger than the light distribution angle ⁇ 1 of the first lens unit 412.
  • the irradiation range of the light emitted from the second chip 202 becomes wider than the irradiation range of the light emitted from the first chip 201. That is, when the LED package A10 is used for the human body information measurement module, the light emitted from the first chip 201 is applied for measuring the blood oxygen concentration of the human body, and the light emitted from the second chip 202 is applied for measuring the pulse wave of the human body. Therefore, the measurement accuracy of each of the plurality of human body information can be improved.
  • the translucent resin 40 includes a first resin 41 and a second resin 42 that are located apart from each other.
  • the first resin 41 has a first pedestal portion 411 that covers the first chip 201, and a first lens portion 412 that is connected to the first pedestal portion 411.
  • the second resin 42 has a second pedestal portion 421 that covers the second chip 202, and a second lens portion 422 that is connected to the second pedestal portion 421.
  • the first resin 41 and the second resin 42 are located apart from each other in the first direction x.
  • the first resin 41 has a pair of first gate portions 413 connected to both ends of the first pedestal portion 411 in the second direction y.
  • the second resin 42 has a pair of second gate portions 423 connected to both ends of the first lens portion 412 in the second direction y.
  • Each of the pair of first gate portions 413 and the pair of second gate portions 423 extend in the second direction y.
  • the translucent resin 40 can be integrally formed by transfer molding with the second direction y as the resin flow direction.
  • the first resin 41 and the second resin 42 are separated from each other.
  • each of the pair of first gate portions 413 is smaller than the thickness of the first pedestal portion 411.
  • the thickness of each of the pair of second gate portions 423 is smaller than the thickness of the second pedestal portion 421.
  • a part of the light emitted from the first chip 201 travels to the pair of first gate portions 413 via the first pedestal portion 411.
  • a part of the light emitted from the second chip 202 travels to the pair of second gate portions 423 via the second pedestal portion 421. If nothing is done, light leakage will occur, which may lead to a decrease in the accuracy of human body information measurement. Therefore, by adopting this configuration, it is possible to suppress the amount of light flux traveling to the pair of first gate portions 413 and the pair of second gate portions 423. Therefore, it is possible to suppress light leakage generated from the LED package A10.
  • the LED package A10 has a back surface 60B facing the main surface 11A of the base material 11, and further includes a case 60 in which the back surface 60B is supported by the support member 10.
  • the case 60 surrounds a plurality of LED chips 20 and a plurality of lens portions 401 of the translucent resin 40.
  • the first pedestal portion 411 and the second pedestal portion 421 are located apart from the case 60.
  • Each part of the pair of first gate portions 413 and the pair of second gate portions 423 is located between the support member 10 and the case 60 in the thickness direction z.
  • the case 60 is recessed from the back surface 60B in the thickness direction z, and has a plurality of recesses 61 connected to any of a pair of regions of the outer surface 60C of the case 60 facing the second direction y.
  • Each part of the pair of first gate portions 413 and the pair of second gate portions 423 are individually housed in the plurality of recesses 61.
  • the base material 11 has a plurality of grooves 11D that are recessed from the side surface 11C toward the inside of the base material 11 and are connected to the main surface 11A and the bottom surface 11B.
  • the support member 10 has a plurality of terminals 13 arranged on the bottom surface 11B, and a plurality of side surface terminals 14 individually arranged with respect to the plurality of groove portions 11D.
  • Each of the plurality of side terminals 14 is conductive to the wiring 12 and is connected to any of the plurality of terminals 13.
  • solder adheres to the plurality of side terminals 14 in addition to the plurality of terminals 13.
  • the mounting strength of the LED package A10 on the wiring board is improved.
  • the mounting state of the LED package A10 mounted on the wiring board can be easily confirmed.
  • the support member 10 has a radiator 17 arranged on the bottom surface 11B.
  • the heat radiating body 17 overlaps the wiring 12 (plurality of first pads 121) to which the plurality of LED chips 20 are joined. As a result, the heat generated from the plurality of LED chips 20 can be more efficiently released to the outside.
  • FIGS. 16 and 17 the LED package A20 according to the second embodiment will be described with reference to FIGS. 16 and 17.
  • elements that are the same as or similar to the LED package A10 described above are designated by the same reference numerals, and redundant description will be omitted.
  • the cross-sectional positions and ranges of FIG. 17 correspond to those of FIG.
  • the configuration of the translucent resin 40 is different from the configuration in the LED package A10 described above.
  • the translucent resin 40 has a coating layer 43.
  • the coating layer 43 covers at least a part of each of the pair of first gate portions 413 of the pair of first resin 41 and each of the pair of second gate portions 423 of the second resin 42.
  • the coating layer 43 is configured to include a plurality of regions individually covering them. Instead of this configuration, the coating layer 43 may be an integral configuration that surrounds the outer periphery of the pair of first pedestal portions 411 of the pair of first resin 41 and the pair of second pedestal portions 421 of the second resin 42. good.
  • the coating layer 43 has a light-shielding property.
  • the coating layer 43 is made of, for example, a material containing an epoxy resin.
  • FIG. 17 typically shows any one of the pair of second gate portions 423 of the second resin 42.
  • the covering layer 43 is located inward of the inner side surface 60D of the case 60 in a direction orthogonal to the thickness direction z (second direction y in the LED package A20). ..
  • the coating layer 43, the base material 11, and the case 60 all exhibit the same color.
  • the coating layer 43, the base material 11, and the case 60 are all black.
  • the LED package A20 has a plurality of lens units 401 that individually distribute the light emitted from each of the plurality of LED chips 20.
  • the plurality of LED chips 20 include a first chip 201 and a second chip 202 having different wavelengths of emitted light.
  • the plurality of lens units 401 include a first lens unit 412 that distributes light emitted from the first chip 201 and a second lens unit 422 that distributes light emitted from the second chip 202.
  • the first lens unit 412 and the second lens unit 422 are located apart from each other. As shown in FIG. 9, the light distribution angle ⁇ 1 of the first lens unit 412 is different from the light distribution angle ⁇ 2 of the second lens unit 422. Therefore, the LED package A20 also makes it possible to individually set the irradiation range for the object for a plurality of lights having different wavelengths individually emitted from the plurality of LED chips 20.
  • the translucent resin 40 has a coating layer 43.
  • the coating layer 43 covers at least a part of each of the pair of first gate portions 413 and the pair of second gate portions 423.
  • the coating layer 43 has a light-shielding property.
  • the coating layer 43 is located inward of the inner side surface 60D of the case 60 in a direction orthogonal to the thickness direction z.
  • a part of the light emitted from the first chip 201 travels to the pair of first gate portions 413 via the first pedestal portion 411.
  • a part of the light emitted from the second chip 202 travels to the pair of second gate portions 423 via the second pedestal portion 421.
  • the coating layer 43, the base material 11, and the case 60 are all preferably black. As a result, the light traveling through the pair of first gate portions 413 and the pair of second gate portions 423 is more effectively absorbed by the coating layer 43, the base material 11, and the case 60.
  • FIGS. 18 to 20 the LED package A30 according to the third embodiment will be described with reference to FIGS. 18 to 20.
  • elements that are the same as or similar to the LED package A10 described above are designated by the same reference numerals, and redundant description will be omitted.
  • the positions and ranges of FIG. 19 correspond to those of FIG.
  • the cross-sectional positions and ranges of FIG. 20 correspond to those of FIG.
  • the configuration of the translucent resin 40 is different from the configuration in the LED package A10 described above.
  • Each end surface 423A of the pair of second gate portions 423 of the resin 42 is located inside the pair of regions of the outer surface 60C facing the second direction y in the second direction y.
  • the end faces 413A of each of the pair of first gate portions 413 of the pair of first resin 41 and the end faces 423A of each of the pair of second gate portions 423 of the second resin 42 are , Covered by an adhesive layer 69. 19 and 20 typically show any one of the pair of second gate portions 423 of the second resin 42.
  • the LED package A30 has a plurality of lens units 401 that individually distribute the light emitted from each of the plurality of LED chips 20.
  • the plurality of LED chips 20 include a first chip 201 and a second chip 202 having different wavelengths of emitted light.
  • the plurality of lens units 401 include a first lens unit 412 that distributes light emitted from the first chip 201 and a second lens unit 422 that distributes light emitted from the second chip 202.
  • the first lens unit 412 and the second lens unit 422 are located apart from each other. As shown in FIG. 9, the light distribution angle ⁇ 1 of the first lens unit 412 is different from the light distribution angle ⁇ 2 of the second lens unit 422. Therefore, the LED package A30 also makes it possible to individually set the irradiation range for the object for a plurality of lights having different wavelengths individually emitted from the plurality of LED chips 20.
  • each end face 413A of the pair of first gate portions 413 facing the second direction y and each end face 423A of the pair of second gate portions 423 facing the second direction y are outside the case 60. It is located inside the second direction y with respect to the pair of regions of the side surface 60C facing the second direction y.
  • the pair of regions are connected to a plurality of recesses 61 in which a part of each of the pair of first gate portions 413 and the pair of second gate portions 423 are individually housed.
  • Each end face 413A of the pair of first gate portions 413 and each end face 423A of the pair of second gate portions 423 are covered with an adhesive layer 69.
  • a part of the light emitted from the first chip 201 travels to the pair of first gate portions 413 via the first pedestal portion 411.
  • a part of the light emitted from the second chip 202 travels to the pair of second gate portions 423 via the second pedestal portion 421. If nothing is done, light leakage will occur, which may lead to a decrease in the accuracy of human body information measurement. Therefore, by adopting this configuration, the light traveling to the pair of first gate portions 413 is blocked by the adhesive layer 69 at each end surface 413A of the pair of first gate portions 413.
  • the light traveling through the pair of second gate portions 423 is blocked by the adhesive layer 69 at each end surface 423A of the pair of second gate portions 423. Therefore, the light leakage generated from the LED package A30 can be suppressed more effectively than the LED package A10.
  • FIGS. 21 to 23 the LED package A40 according to the fourth embodiment will be described with reference to FIGS. 21 to 23.
  • elements that are the same as or similar to the LED package A10 described above are designated by the same reference numerals, and redundant description will be omitted.
  • FIG. 21 the XXII-XXII line is shown as an alternate long and short dash line.
  • the cross-sectional positions and ranges of FIG. 23 correspond to those of FIG.
  • the LED package A40 is different from the above-mentioned LED package A10 in that it includes a translucent member 70.
  • the translucent member 70 is supported by the top surface 60A of the case 60 and is configured to close the opening of the case 60.
  • the illustrated translucent member 70 has a rectangular plate shape in a plan view (see FIG. 21), but the present disclosure is not limited thereto.
  • the translucent resin 40 is housed in the internal space defined by the support member 10, the case 60, and the translucent member 70.
  • the translucent member 70 faces the translucent resin 40 at a position separated from the translucent resin 40 (first and second lens portions 421 and 422) by a predetermined distance, and is opposed to the translucent resin 40. It also has a function as a protective cover against 40.
  • the translucent member 70 (inner surface) may be configured to abut on at least one of the first and second lens portions 421 and 422.
  • the light transmitting member 70 transmits light emitted from a plurality of LED chips 20.
  • the translucent member 70 is made of, for example, optical glass.
  • the translucent member 70 is joined to the top surface 60A by, for example, an adhesive.
  • the translucent member 70 has a plurality of auxiliary lenses 71.
  • the plurality of auxiliary lenses 71 individually overlap each of the plurality of lens portions 401 of the translucent resin 40 when viewed along the thickness direction z.
  • Each auxiliary lens 71 is a Fresnel lens, but the present disclosure is not limited thereto.
  • the plurality of auxiliary lenses 71 include four first regions 711 and a pair of second regions 712.
  • the four first regions 711 individually overlap with the pair of first lens portions 412 of the pair of first resin 41 when viewed along the thickness direction z.
  • the pair of second regions 712 individually overlap with the pair of second lens portions 422 of the second resin 42 when viewed along the thickness direction z.
  • each light distribution angle ⁇ 1 of the four first regions 711 corresponds to each light distribution angle ⁇ 1 of the pair of first lens portions 412 of the pair of first resin 41 shown in FIG. ing.
  • Each light distribution angle ⁇ 2 of the pair of second regions 712 corresponds to each light distribution angle ⁇ 2 of the pair of second lens portions 422 of the second resin 42 shown in FIG.
  • the light distribution angles of the plurality of auxiliary lenses 71 are set to the light distribution angles of the lens portion 401 of any of the plurality of lens portions 401 of the translucent resin 40 which are viewed and overlapped along the thickness direction z. It corresponds.
  • the LED package A40 has a plurality of lens units 401 that individually distribute the light emitted from each of the plurality of LED chips 20.
  • the plurality of LED chips 20 include a first chip 201 and a second chip 202 having different wavelengths of emitted light.
  • the plurality of lens units 401 include a first lens unit 412 that distributes light emitted from the first chip 201 and a second lens unit 422 that distributes light emitted from the second chip 202.
  • the first lens unit 412 and the second lens unit 422 are located apart from each other. As shown in FIG. 9, the light distribution angle ⁇ 1 of the first lens unit 412 is different from the light distribution angle ⁇ 2 of the second lens unit 422. Further, as shown in FIG.
  • the light distribution angle ⁇ 1 of the first region 711 of the plurality of auxiliary lenses 71 is the light distribution angle ⁇ 2 of the second region 712 of the plurality of auxiliary lenses 71. different. Therefore, the LED package A40 also makes it possible to individually set the irradiation range for the object for a plurality of lights having different wavelengths individually emitted from the plurality of LED chips 20.
  • the LED package A40 includes a translucent member 70.
  • the translucent member 70 has a plurality of auxiliary lenses 71 that individually overlap with the plurality of lens portions 401 of the translucent resin 40 when viewed along the thickness direction z.
  • the light distribution angle of each of the plurality of auxiliary lenses 71 corresponds to the light distribution angle of one of the lens units 401 (corresponding one lens unit) of the plurality of lens units 401 that overlap when viewed along the thickness direction z. ing.
  • the height h2 of the case 60 in the LED package A40 can be made smaller than the height h1 of the case 60 in the LED package A10, so that the height h2 of the LED package A40 is low. It is possible to make a back.
  • each of the plurality of auxiliary lenses 71 preferably forms a Fresnel lens. As a result, the overall thickness of the translucent member 70 can be made smaller.
  • the wiring 12 is mainly composed of a plurality of metal layers formed by electrolytic plating.
  • the wiring 12 may be formed from, for example, a lead frame.
  • the present disclosure is not limited to the above-described embodiment, and the specific configuration of each part can be freely redesigned.

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JP2018107333A (ja) * 2016-12-27 2018-07-05 日亜化学工業株式会社 発光装置、及びその発光装置を備える光照射装置
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JP2000091647A (ja) * 1998-09-09 2000-03-31 Sharp Corp 通信用光学素子組立体
JP2000262459A (ja) * 1999-03-18 2000-09-26 Olympus Optical Co Ltd 内視鏡装置
JP2001196637A (ja) * 2000-01-11 2001-07-19 Toyoda Gosei Co Ltd 発光装置
JP2008264302A (ja) * 2007-04-23 2008-11-06 Denso Corp 生体状態検出装置
JP2013153845A (ja) * 2012-01-27 2013-08-15 Seiko Epson Corp 脈波測定装置及び検出装置
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