WO2021147991A1 - 触控基板及其制造方法、显示基板及其制造方法及显示装置及其制造方法 - Google Patents
触控基板及其制造方法、显示基板及其制造方法及显示装置及其制造方法 Download PDFInfo
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- WO2021147991A1 WO2021147991A1 PCT/CN2021/073256 CN2021073256W WO2021147991A1 WO 2021147991 A1 WO2021147991 A1 WO 2021147991A1 CN 2021073256 W CN2021073256 W CN 2021073256W WO 2021147991 A1 WO2021147991 A1 WO 2021147991A1
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- touch
- substrate
- signal
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- connection pad
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- 239000000758 substrate Substances 0.000 title claims abstract description 161
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Definitions
- the present disclosure belongs to the field of display technology, and specifically relates to a touch substrate, a display substrate and a display device.
- the touch screen generally includes: out-cell touch screen (the touch substrate is attached to the display screen), and the touch sensor is on the panel (on-cell) (The touch substrate is formed on the display screen), the touch sensor is in-cell (the touch substrate is formed on the display substrate in the display panel).
- an embodiment of the present disclosure provides a touch substrate having a touch area and a binding area;
- the touch substrate includes: a base; a plurality of first signal lines and a plurality of second signal lines, It is arranged on the substrate; and a plurality of touch units arranged in an array, arranged on the substrate and located in the touch area; wherein the touch units in the same row are connected to the same first Signal line, the touch units located in the same column are connected to the same second signal line, where each first signal line and each second signal line have a signal lead-in end, part of the first signal line The signal introduction end is located on the first side of the touch area, and the second signal introduction end of the other part of the first signal line is located on the second side of the touch area opposite to the first side.
- the first signal introduction end of the signal line is electrically connected to the corresponding first first fan-out line
- the second signal introduction end of the other part of the first signal line is respectively electrically connected to the corresponding second first fan-out line.
- the first first fan-out line and the second first fan-out line are located in the binding area, wherein the third signal introduction ends of the plurality of second signal lines are respectively electrically connected to the corresponding second fan-out lines, so
- the second fan-out line is located in the binding area, wherein the binding area is located on a third side of the touch area that is different from the first side and the second side.
- the touch substrate further includes a first first connection pad portion, a second first connection pad portion, and a second connection pad portion, wherein the second connection pad portion is located at the Between the first first connection pad portion and the second first connection pad portion, wherein the first first connection pad portion includes a plurality of first first connection pads, and the second The first connection pad portion includes a plurality of second first connection pads, the second connection pad portion includes a plurality of second connection pads, and each first first connection pad is associated with a corresponding first first connection pad.
- the fan-out lines are electrically connected, each of the second first connection pads is electrically connected to the corresponding second fan-out line, and each of the second connection pads is electrically connected to the corresponding second fan-out line.
- each first first connection pad, each second first connection pad, and each second connection pad are all bonded and connected to the flexible circuit board.
- the first signal introduction ends are arranged adjacently and spaced apart; the second signal introduction ends are arranged adjacently and spaced apart.
- the number of the first signal introduction end is approximately the same as the number of the second signal introduction end.
- each first signal line is at least partially disposed between two adjacent rows of touch units
- each second signal line is at least partially disposed between two adjacent rows of touch units
- the plurality of first signal lines and the plurality of second signal lines cross each other and are insulated.
- the plurality of first signal lines and the plurality of second signal lines are located on different layers in the substrate, or the plurality of first signal lines and the plurality of second signal lines The different layers in the substrate are located only at the intersection.
- the touch substrate further includes: a polarizer, which is located on a side of the base close to the plurality of touch units; and a first protective film, which is located on the polarizer away from the plurality of touch units; One side of the touch unit; and a second protective film located on the side of the substrate away from the plurality of touch units.
- each touch unit includes touch sensing electrode blocks, and the touch sensing electrode blocks are arranged at intervals.
- the touch substrate further includes a plurality of touch electrode blocks and a plurality of sensing electrode blocks, wherein the sensing electrode blocks located in the same row are connected to the same first signal line, and the sensing electrode blocks arranged adjacently are connected to the same first signal line.
- the electrode blocks are electrically connected to each other through the connecting portion, wherein the touch electrode blocks located in the same column are connected to the same second signal line, and the adjacent sensing electrode blocks are electrically connected to each other through the bridge portion, wherein the bridge portion and
- the connecting parts are insulated from each other, wherein each touch unit includes a connecting part and a bridge part that are arranged crosswise, and two 1/2 sensing electrode blocks and two 1/2 touch electrode blocks.
- each of the plurality of touch units are in the range of 4 mm to 4.5 mm, respectively.
- a display substrate having a display area; the display substrate includes an array substrate and the touch substrate as described above, wherein the array substrate includes a plurality of array substrates arranged in a matrix.
- the pixel unit, the plurality of pixel units are located in the display area, and the touch substrate is located on the light-emitting surface side of the array substrate.
- the orthographic projection of the display area on the touch substrate overlaps the touch area.
- an embodiment of the present disclosure provides a display device, including the touch substrate and the display panel as described above, wherein the touch substrate is disposed on the light-emitting surface side of the display panel.
- the display panel includes an organic electroluminescent diode panel.
- an embodiment of the present disclosure provides a display device including the display substrate as described above.
- an embodiment of the present disclosure provides a method for manufacturing a touch substrate, the touch substrate having a touch area and a binding area, and the method includes: providing a base; A plurality of touch units, a plurality of first signal lines and a plurality of second signal lines are formed in the touch area, wherein the plurality of first signal lines and the plurality of second signal lines Each of them has a signal lead-in end, part of the first signal lead-in end of the first signal line is located at the first side of the touch area, and another part of the second signal lead-in end of the first signal line is located at the touch area
- the touch units on the second side opposite to the first side and located in the same row are connected to the same first signal line, and the touch units located in the same column are connected to the same second signal line; formed on the substrate A plurality of first first fan-out lines, a plurality of second first fan-out lines, and a plurality of second fan-out lines, and the first signal lead-in ends of the part of the first signal lines are
- the manufacturing method further includes forming a first first connection pad portion, a second first connection pad portion, and a second connection pad portion in the bonding area, wherein the second The connection pad portion is located between the first first connection pad portion and the second first connection pad portion, and the first first connection pad portion includes a plurality of first first connection pads,
- the second first connection pad portion includes a plurality of second first connection pads, the second connection pad portion includes a plurality of second connection pads, and each first first connection pad is associated with a corresponding
- the first first fan-out line is electrically connected
- each second first connection pad is electrically connected to the corresponding second fan-out line
- each second connection pad is electrically connected to the corresponding second fan-out line.
- the manufacturing method further includes bonding and connecting each first connection pad portion, each second connection pad portion, and each second connection pad portion to the flexible circuit board.
- a method for manufacturing a display substrate including: forming an array substrate; forming a touch substrate using the manufacturing method described above; and disposing the touch substrate on the array substrate The light-emitting surface side.
- FIG. 1 is a schematic diagram of the structure of a touch substrate
- FIG. 2 is a schematic diagram of a structure of a touch substrate according to an embodiment of the present disclosure
- FIG. 3 is a schematic diagram of another structure of a touch substrate according to an embodiment of the present invention.
- FIG. 4 is a schematic diagram of another structure of a touch substrate according to an embodiment of the present disclosure.
- FIG. 5 is a schematic diagram of a touch unit of a touch substrate according to an embodiment of the present disclosure
- FIG. 6 is a schematic diagram of another structure of a touch substrate according to an embodiment of the present disclosure.
- FIG. 7 is a flowchart of a manufacturing method of a touch substrate according to an embodiment of the present disclosure.
- one of the first signal line and the second signal line in the touch substrate/display substrate of the embodiment of the present disclosure is a touch driving line, and the other is a touch sensing line.
- the first signal line is a touch sensing line and the second signal line is a touch driving line as an example for description.
- the first side and the second side of the touch area are arranged oppositely. Specifically, the first side refers to the left side in FIGS. 1 to 5, and the second side refers to the right side in FIGS. 1 to 5.
- a structure of a touch substrate is given.
- the touch substrate is divided into a touch area Q1 and a binding area Q2.
- the touch substrate includes: a base 10; a plurality of touch sensing lines 1 located on the base 10 and arranged in the touch area Q1, a plurality of touch driving lines 2; and a plurality of touch units 3 arranged in an array, wherein , The touch units 3 located in the same row are connected to the same touch sensing line 1, and the touch units 3 located in the same column are connected to the same touch driving line 2.
- the touch substrate further includes: a first connection pad portion and a second connection pad portion located on the base 10 and arranged in the bonding area Q2.
- the first connection pad portion includes a plurality of first connection pads 21, and the second connection pad portion includes a plurality of second connection pads 22.
- the multiple touch sensing lines 1 and the multiple touch driving lines 2 all have a signal lead-in terminal P.
- the signal lead-in terminal P of each touch sensing line 1 is electrically connected to the corresponding first connection pad 21 through the corresponding first fan-out line 11; the signal lead-in terminal P of each touch drive line 2 corresponds to it
- the second fan-out line 12 is connected to the corresponding second connection pad 22.
- the first connection pad 21 and the second connection pad 22 are bonded and connected to the flexible circuit board 4.
- the driving voltage can be applied to the touch driving line 2 column by row through the touch driving chip on the flexible circuit board 4.
- the touch signal sensed by the touch unit 3 corresponding to that position is summed
- the signal related to this position can be output through the touch sensing line 1 connected to the touch unit 3, and the controller on the flexible circuit board 4 can The signal is analyzed and the location where the touch occurs is determined, and the corresponding touch command can be further executed.
- Each touch sensing line 1 is connected to the corresponding first fan-out line 11 through its signal input terminal P, and each first fan-out line 11 is connected to the corresponding first connection pad 21. Since the signal input terminals P of each touch sensing line 1 are located on the same side (the left side in FIG. 1), the first fan-out lines 11 are all concentrated on the same side of the binding area Q2. In order to prevent each first fan-out line 11 from being short-circuited, a certain gap is required between adjacent first fan-out lines 11. This will inevitably lead to an increase in the width of the binding area Q2 in the vertical direction as shown in FIGS. 1 to 3, so that when the flexible circuit board 4 is bent, the width of the bent area will increase.
- connection pad first connection pad located in the bonding area Q2. 21 and the second connection pad 22
- an embodiment of the present disclosure provides a touch substrate, the touch substrate is divided into a touch area Q1 and a binding area Q2; the touch substrate includes: a base 10; located on the base 10 A plurality of touch sensing lines 1 and a plurality of touch driving lines 2 arranged on the touch area Q1; and a plurality of touch units 3 arranged in an array, wherein the touch units 3 in the same row are connected to The same touch sensing line 1 and the touch units 3 located in the same column are connected to the same touch driving line 2, wherein each touch sensing line 1 is at least partially arranged between two adjacent rows of touch units Each touch drive line 2 is at least partially disposed between two adjacent rows of touch units, and the multiple touch sensing lines 1 and the multiple touch drive lines 2 cross each other and are insulated.
- the multiple touch sensing lines 1 and the multiple touch driving lines 2 are located in different layers in the substrate, or the multiple touch sensing lines 1 and the multiple touch driving lines 2 are located in different layers in the substrate only at the intersections .
- the touch substrate further includes: two first connection pad portions located on the base 10 and arranged in the bonding area Q2, namely, a first first connection pad portion 20-1 and a second first connection pad portion 20- 2 and one second connection pad portion 30, wherein the second connection pad portion 30 is located between the two first connection pad portions.
- the multiple touch sensing lines 1 and the multiple touch driving lines 2 all have signal introduction ends (as shown in FIG. 2, P1, P2, and P3).
- the first signal lead-in terminal P1 of part of the touch sensing line 1 (part S1) is located on the first side (left side) of the touch substrate (or touch area Q1), and the other part of the touch sensing line 1 (part S2) is on the first side (left side).
- the second signal introduction terminal P2 is located on the second side (right side) of the touch substrate (or touch area Q1).
- the two first connection pad portions respectively include a plurality of first connection pads 21 (that is, the first first connection pad portion 20-1 includes a plurality of first first connection pads 21, and the second first connection pad
- the connection pad portion 20-1 includes a plurality of second first connection pads 21
- the second connection pad portion 30 includes a plurality of second connection pads 22, and the signal introduction terminals P1 and P2 of the touch sensing line 1 are respectively
- the corresponding first fan-out line 11 is connected to the corresponding first connection pad 21, and each first connection pad 21 is connected to one first fan-out line 11.
- the third signal lead-in terminal P3 of the touch drive line 2 (also shown as S3 in FIG.
- the touch signal and the touch signal sensed by the touch unit 3 corresponding to the position are The touch signals sensed by the touch units corresponding to other positions are different, the signals related to this position can be output through the touch sensing line 1 connected to the touch unit 3, and the controller on the flexible circuit board 4 can The signal is analyzed and the location of the touch is determined, and further the corresponding touch command can be executed.
- the second connection pad 22 is located in the middle part of the binding area Q2 of the touch substrate.
- P1 is located on the first side (left side) of the touch substrate, and the second signal introduction end P2 of the other part of the touch sensing line 1 is located on the second side of the touch substrate opposite to the first side.
- a first connection pad portion 20-1 is located on the first side (left side) of the second connection pad portion 30; the remaining part of the first fan-out line 11 (the second first fan-out line 11-2) and its connected
- the second first connection pad portion 20-2 is located on the first side (right side) of the second connection pad portion 30.
- the first connection pad 21 and the second connection pad 22 are divided into three parts and are respectively arranged in the bonding area Q2 of the touch substrate. In this way, the stress when the flexible circuit board 4 is bent can be effectively dispersed. , And the width of the bent area will not increase, so that a narrow frame of the touch substrate can be realized, and the connection pads (the first connection pad 21 and the second connection pad) located in the bonding area Q2 can also be avoided. 22) There is a risk of falling off.
- the first signal introduction end P1 of half of the touch sensing line 1 is located on the first side of the touch substrate, and the second signal introduction end P2 of the other half of the control sensing line 1 is located on the second side of the touch substrate. That is, half of the first fan-out line 11 is located on the left side of the second fan-out line 12, and the other half of the first fan-out line 11 is located on the right side of the second fan-out line 12. In this way, the stress of the bonding area Q2 when it is bent is evenly distributed, which can reduce the risk of falling off of the connection pads (the first connection pad 21 and the second connection pad 22) of the bonding area Q2 as much as possible.
- the first fan-out lines 11 on the first side of the touch substrate are arranged adjacently; the first fan-out lines on the second side of the touch substrate are arranged adjacently.
- the signal introduction end of the touch sensing line 1 in odd rows is located on the first side of the touch substrate, and the signal introduction end of the touch sensing line 1 in even rows is located on the second side of the touch substrate; alternatively The signal lead-in ends of the touch sensing lines 1 in odd rows are located on the second side of the touch substrate, and the signal lead-in ends of touch sensing lines 1 in even rows are located on the first side of the touch substrate. As long as the signal introduction ends of all the touch sensing lines 1 are located on the same side of the touch substrate.
- the touch substrate may be a self-capacitive touch substrate
- each touch unit 3 includes touch sensing electrode blocks 30, and each touch sensing electrode block 30 is arranged at intervals.
- the touch sensing electrode blocks 30 located in the same row are connected to the same touch sensing line 1, and the touch sensing electrode blocks 30 located in the same column are connected to the same touch driving line 2.
- the driving voltage is applied column by column to the touch sensing electrode block 30 through the touch driving chip on the flexible circuit board 4.
- the touch sensing electrode block 30 corresponding to that position will sense the touch
- the signal is different from the touch signal sensed by the touch sensing electrode block 30 corresponding to other positions, and the signal related to the position can be output through the touch sensing line 1 connected to the touch sensing electrode block 30, and the flexible circuit
- the controller on the board 4 can analyze the signal and determine the location where the touch occurs, and further can execute the corresponding touch command.
- the touch substrate may be a mutual-capacitive touch substrate.
- the touch substrate includes a plurality of touch electrode blocks 32 and a plurality of sensing electrode blocks 31.
- the electrode blocks 31 are connected to the same touch sensing line 1, and the adjacent sensing electrode blocks 31 are connected through the connecting portion; the touch electrode blocks 32 located in the same column are connected to the same touch driving line 2 and are arranged adjacently
- the touch electrode block 32 is connected by a bridge part; the bridge part and the connection part are insulated from each other.
- each touch unit 3 includes a connecting portion and a bridging portion that are arranged crosswise, two 1/2 sensing electrode blocks 31 and two 1/2 touch electrode blocks 32.
- the range of the length L and the width W of the touch unit 3 may be, but not limited to, 4 mm-4.5 mm.
- the size of the touch unit 3 needs to be specifically set according to the specific panel of its application.
- the touch substrate not only includes the above structure, but also includes: a polarizer 6 located on the side of the substrate close to the touch unit 3; and a first protective film 7 located on The polarizer 6 is on the side away from the touch unit 3; and the second protective film 5 is located on the side of the substrate away from the touch unit 3.
- a display device which includes the above-mentioned touch substrate and a display panel, wherein the touch substrate is located on the light emitting surface side of the display panel.
- the touch substrate can be pasted with the display panel through a transparent optical adhesive (OCA), that is, the display device is a touch substrate external display device.
- OCA transparent optical adhesive
- the frame is narrower and the yield rate is higher.
- the display panel is an organic electroluminescent diode (OLED) display panel.
- OLED organic electroluminescent diode
- the display panel can also be an electronic paper, a liquid crystal display panel, or the like.
- a display substrate having a display area; the display substrate includes an array substrate and the touch substrate as described above, wherein the array substrate includes a plurality of pixels arranged in a matrix Unit, the plurality of pixel units are located in the display area, and the touch substrate is located on the light emitting surface side of the array substrate.
- the orthographic projection of the display area on the touch substrate completely falls within the range of the touch area of the touch substrate.
- a display device which includes the above-mentioned display substrate.
- the display device includes the above-mentioned display substrate, the frame is narrower and the yield rate is higher.
- the display device in this embodiment may be any product or component with display function such as electronic paper, OLED panel, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc.
- a manufacturing method of a touch substrate the touch substrate having a touch area and a binding area, as shown in FIG. 7, the manufacturing method includes: providing a base ( Step S1); forming a plurality of touch units arranged in an array and a plurality of first signal lines and a plurality of second signal lines on the substrate and in the touch area (step S2), wherein the Each of the plurality of first signal lines and the plurality of second signal lines has a signal lead-in end, some of the first signal lead-in ends of the first signal line are located on the first side of the touch area, and another part of the first signal line is located on the first side of the touch area.
- the second signal lead-in end of a signal line is located on the second side of the touch area opposite to the first side, and touch units located in the same row are connected to the same first signal line, and touch units located in the same column Connected to the same second signal line; a plurality of first first fan-out lines, a plurality of second first fan-out lines and a plurality of second fan-out lines are formed on the substrate, and the part of the first signal line
- the first signal introduction end is electrically connected to the corresponding first first fan-out line
- the second signal introduction end of the other part of the first signal line is electrically connected to the second first fan-out line
- the plurality of The third signal introduction end of the second signal line is electrically connected to the corresponding second fan-out line (step S3), wherein the first first fan-out line, the second first fan-out line, and the second fan-out line are electrically connected to each other (step S3).
- the outlet line is located in the binding area, wherein the binding area is located on a third
- the manufacturing method further includes: forming a first first connection pad portion, a second first connection pad portion, and a second connection pad portion in the bonding area (step S4), wherein the second connection The pad portion is located between the first first connection pad portion and the second first connection pad portion, and the first first connection pad portion includes a plurality of first first connection pads, so The second first connection pad portion includes a plurality of second first connection pads, the second connection pad portion includes a plurality of second connection pads, and each first first connection pad is associated with a corresponding first connection pad.
- a first fan-out line is electrically connected, each of the second first connection pads is electrically connected to the corresponding second fan-out line, and each of the second connection pads is electrically connected to the corresponding second fan-out line.
- the manufacturing method further includes: binding and connecting each first connection pad, each second connection pad, and each second connection pad to the flexible circuit board (step S5).
- a method for manufacturing a display substrate including: forming an array substrate; forming a touch substrate using the manufacturing method as described above; The control substrate is arranged on the light emitting surface side of the array substrate.
- a method for manufacturing a display device including: forming a display panel; forming a touch substrate using the manufacturing method as described above; and disposing the touch substrate on the display panel The light-emitting surface side.
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Abstract
Description
Claims (20)
- 一种触控基板,其具有触控区和绑定区;所述触控基板包括:基底,多条第一信号线和多条第二信号线,其设置在所述基底上,以及多个触控单元,其呈阵列排布、设置在所述基底上并且位于所述触控区,其中,位于同一行的触控单元连接至同一条第一信号线,位于同一列的触控单元连接至同一条第二信号线,其中,每条第一信号线和每条第二信号线均具有信号引入端,部分第一信号线的第一信号引入端位于所述触控区的第一侧,另一部分第一信号线的第二信号引入端位于所述触控区的与第一侧相对的第二侧,其中,所述部分第一信号线的第一信号引入端分别与对应的第一第一扇出线电连接,所述另一部分第一信号线的第二信号引入端分别与对应的第二第一扇出线电连接,所述第一第一扇出线和所述第二第一扇出线位于所述绑定区,其中,所述多条第二信号线的第三信号引入端分别与对应的第二扇出线电连接,所述第二扇出线位于所述绑定区,并且所述绑定区位于所述触控区的不同于所述第一侧和所述第二侧的第三侧。
- 根据权利要求1所述的触控基板,还包括第一第一连接焊盘部、第二第一连接焊盘部和第二连接焊盘部,其中,所述第二连接焊盘部位于所述第一第一连接焊盘部和所述第二第一连接焊盘部之间,其中,所述第一第一连接焊盘部包括多个第一第一连接焊盘,所述第二第一连接焊盘部包括多个第二第一连接焊盘,所述第二连接焊盘部包括多个第二连接焊盘,并且各第一第一连 接焊盘与对应的第一第一扇出线电连接,各第二第一连接焊盘分别与对应的第二第一扇出线电连接,且各第二连接焊盘分别与对应的第二扇出线电连接。
- 根据权利要求2所述的触控基板,其中,各第一第一连接焊盘、各第二第一连接焊盘和各第二连接焊盘均与柔性线路板绑定连接。
- 根据权利要求1所述的触控基板,其中,所述第一信号引入端相邻且间隔地设置;所述第二信号引入端相邻且间隔地设置。
- 根据权利要求1所述的触控基板,其中,所述第一信号引入端的数量与所述第二信号引入端的数量大致相同。
- 根据权利要求1所述的触控基板,每条第一信号线至少部分地设置在相邻的两行触控单元之间,每条第二信号线至少部分地设置在相邻的两列触控单元之间,所述多条第一信号线和所述多条第二信号线彼此交叉且绝缘。
- 根据权利要求6所述的触控基板,所述多条第一信号线、所述多条第二信号线位于所述基底中的不同层,或者所述多条第一信号线、所述多条第二信号线仅在交叉处位于所述基底中的不同层。
- 根据权利要求1至7中任一项所述的触控基板,还包括:偏光片,其位于所述基底靠近所述多个触控单元的一侧;第一保护膜,其位于所述偏光片远离所述多个触控单元的一侧;以及第二保护膜,其位于所述基底背离所述多个触控单元的一侧。
- 根据权利要求1所述的触控基板,其中,每个触控单元均包括触控感应电极块,所述触控感应电极块间隔地设置。
- 根据权利要求1所述的触控基板,还包括:多个触控电极块和多个感应电极块,其中,位于同一行的感应电极块连接至同一条第一信号线,并且相邻设置的感应电极块通过连接部彼此电连接,其中,位于同一列的触控电极块连接至同一条第二信号线,并且相邻设置的感应电极块通过桥接部彼此电连接,其中,所述桥接部与所述连接部彼此绝缘,其中,每个触控单元包括交叉设置的连接部和桥接部以及两个1/2的感应电极块和两个1/2的触控电极块。
- 根据权利要求1所述的触控基板,其中,所述多个触控单元中的每一个的长度和宽度的范围分别是4mm至4.5mm。
- 一种显示基板,其具有显示区,所述显示基板包括阵列基板和权利要求1-9中任一项所述的触控基板,其中,所述阵列基板包括呈矩阵排列的多个像素单元,所述多个像素单元位于所述显示区中,所述触控基板位于所述阵列基板的出光面侧。
- 根据权利要求12所述的显示基板,其中,所述显示区在所述触控基板上的正投影与所述触控区有重叠。
- 一种显示装置,其包括权利要求1至11中任一项所述的触控基板和显示面板,其中,所述触控基板设置在所述显示面板的出光面侧。
- 根据权利要求14所述的显示装置,其中,所述显示面板包括有机电致发光二极管面板。
- 一种显示装置,其包括权利要求12显示基板。
- 一种触控基板的制造方法,所述触控基板具有触控区和绑定区,所述方法包括:提供基底;在所述基底上且在所述触控区中形成呈阵列排布的多个触控单元以及多条第一信号线和多条第二信号线,其中,所述多条第一信号线和所述多条第二信号线中的每一个均具有信号引入端,部分第一信号线的第一信号引入端位于所述触控区的第一侧,另一部分第一信号线的第二信号引入端位于所述触控区的与第一侧相对的第二侧,并且位于同一行的触控单元连接至同一条第一信号线,位于同一列的触控单元连接至同一条第二信号线;在所述基底上形成多条第一第一扇出线,多条第二第一扇出线和多条第二扇出线,并将所述部分第一信号线的第一信号引入端分别与对应的第一第一扇出线电连接、将所述另一部分第一信号线的第二信号引入端分别与对应的第二第一扇出线电连接、以及将所述多条第二信号线的第三信号引入端分别与对应的第二扇出线电连接,其中,所述第一第一扇出线、所述第二第一扇出线和所述第二扇出线位于所述绑定区,其中,所述绑定区位于所述触控区的不同于第一侧与第二侧的第三侧。
- 根据权利要求17所述的制造方法,还包括:在所述绑定区形成第一第一连接焊盘部、第二第一连接焊盘部和第二连接焊盘部,其中,所述第二连接焊盘部位于所述第一第一连接焊盘部和所述第二第一连接焊盘部之间,所述第一第一连接焊盘部包括多个第一第一连接焊盘,所述第二第一连接焊盘部包括多个第二第一连接焊盘,所述第二连接焊盘部包括多个第二连接焊盘,并且各第一第一连接焊盘与对应的第一第一扇出线电连接,各第二第一连接焊盘分别与对应的第二第一扇出线电连 接,且各第二连接焊盘分别与对应的第二扇出线电连接。
- 根据权利要求17所述的制造方法,还包括:将各第一第一连接焊盘、各第二第一连接焊盘和各第二连接焊盘与柔性线路板绑定连接。
- 一种显示基板的制造方法,包括:形成阵列基板利用权利要求17-19中任一项所述的制造方法形成触控基板;以及将所述触控基板设置在所述阵列基板的出光面侧。
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CN112114701A (zh) | 2020-09-07 | 2020-12-22 | 武汉华星光电半导体显示技术有限公司 | 显示面板 |
CN112578939B (zh) * | 2020-12-18 | 2023-03-03 | 上海中航光电子有限公司 | 触控面板及其制备方法、触控模组及触控显示模组 |
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