WO2021143124A1 - Module de carte de circuit imprimé souple fabriqué en utilisant de multiples films, et procédé de fabrication - Google Patents

Module de carte de circuit imprimé souple fabriqué en utilisant de multiples films, et procédé de fabrication Download PDF

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Publication number
WO2021143124A1
WO2021143124A1 PCT/CN2020/108994 CN2020108994W WO2021143124A1 WO 2021143124 A1 WO2021143124 A1 WO 2021143124A1 CN 2020108994 W CN2020108994 W CN 2020108994W WO 2021143124 A1 WO2021143124 A1 WO 2021143124A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
layer
film
module
Prior art date
Application number
PCT/CN2020/108994
Other languages
English (en)
Chinese (zh)
Inventor
王定锋
徐文红
冉崇友
徐磊
宋健
Original Assignee
王定锋
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 王定锋 filed Critical 王定锋
Publication of WO2021143124A1 publication Critical patent/WO2021143124A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Definitions

  • the invention relates to the field of circuit boards, in particular to flexible circuit board modules made of multiple films and a manufacturing method.
  • the present invention uses the following new invention technology to make flexible circuit board modules, and use higher temperature resistant films to make flexible circuit boards.
  • the components are attached to the front of the flexible circuit board, the components are soldered on the flexible On the circuit board, make a flexible circuit board with components for the upper layer, and then use a lower temperature resistant film to make a single-layer circuit.
  • the flexible circuit board without components is used on the lower layer, and then glue is used for the upper and lower flexible circuits.
  • the boards are glued together and soldered together, or the upper and lower flexible circuit boards are directly welded together.
  • the flexible circuit board modules with multiple films are the modules of double-layer flexible circuit boards, or A three-layer wire board module, the upper flexible circuit board made of a higher temperature resistant film, and when the film used is a PI film, the lower flexible circuit board is a single-layer flexible circuit board, Or a double-layer flexible circuit board, the lower temperature resistant film used is all PVC film, or all PET film, or one layer of PVC film and the other layer is PET film, the upper layer is resistant to higher temperature When the film used is a PET film, the flexible circuit board in the lower layer is a single-layer flexible circuit board or a double-layer flexible circuit board, and the lower temperature resistance The film is PVC film, or one layer of PVC film and the other layer is PET film.
  • the cost of flexible circuit board modules made of multiple films is significantly lower than that of flexible circuit board modules made of one film. the cost of.
  • the invention relates to a flexible circuit board module made of a variety of films and a manufacturing method. Specifically, a higher temperature resistant film is used to make a flexible circuit board on the upper layer. After components are attached to the front of the flexible circuit board, a lower temperature resistant film is used. Make the flexible circuit board of the lower single-layer circuit with the film, glue the single-layer flexible circuit board to the back of the upper flexible circuit board of the soldered component, and then use solder to make the several layers of circuits conductive, or directly connect the single-sided board It is placed on the back of the upper flexible circuit board of the soldered component, and then welded and connected to form a flexible double-layer or three-layer flexible circuit board module with multiple films. The cost of the flexible circuit board module made of multiple films is significantly lower than the cost of the flexible circuit board module made of one film.
  • a method for manufacturing flexible circuit board modules made of multiple films is provided. Specifically, a higher temperature resistant film is used to make the upper flexible circuit board, and the upper flexible circuit board is mounted on the front surface of the flexible circuit board. , Through reflow soldering, the components are soldered on the upper flexible circuit board to make the upper flexible circuit board with the components, and then the lower temperature resistant film is used to make the single-layer circuit and the lower flexible circuit board. Then use glue to glue the flexible circuit board with components on the upper layer and the flexible circuit board on the lower layer, and solder them together, or directly connect the flexible circuit board with components on the upper layer, and The flexible circuit boards in the lower layer are welded together to make a flexible circuit board module made of a variety of films.
  • the flexible circuit board module of the multiple films is a double-layer flexible circuit board module, or a three-layer flexible circuit board module.
  • a flexible circuit board made of a higher temperature resistant film, when the film used is a PET film, the flexible circuit board in the lower layer is a single-layer flexible circuit board or a double-layer flexible circuit board.
  • the lower temperature resistant film is PVC film, or one layer of PVC film and the other layer is PET film.
  • the bonding between all circuit layers of the flexible circuit board and the film is made by adhesive bonding. Overall, the cost of the flexible circuit board module made of multiple films is significantly lower than the cost of the flexible circuit board module made of one film.
  • a flexible circuit board module made of a variety of films including: components on the top layer; a flexible circuit board on the upper layer made of a higher temperature resistant film; and a lower temperature resistant film made The flexible circuit board in the lower layer; characterized in that the components on the top layer are soldered on the flexible circuit board on the upper layer, and the flexible circuit boards on the upper and lower layers are glued together and used Tin makes the flexible circuit boards on the upper and lower layers welded together, or the flexible circuit boards on the upper and lower layers are directly soldered together.
  • the flexible circuit board modules of the various films are described. It is a flexible circuit board module with a double-layer circuit, or a flexible circuit board module with a three-layer circuit.
  • the upper layer of the flexible circuit board is made of a higher temperature resistant film.
  • the flexible circuit board in the lower layer is a single-layer flexible circuit board, or a double-layer flexible circuit board
  • the lower temperature-resistant film used is a PVC film, or a PET film, or a layer of PVC
  • the other layer of the film is a PET film.
  • the flexible circuit board on the upper layer is made of a higher temperature resistant film.
  • the flexible circuit board on the lower layer is a single-layer film.
  • the flexible circuit board is either a double-layered flexible circuit board, the lower temperature resistant film in the lower layer is a PVC film, or a layer of PVC film and the other layer is a PET film, all of the flexible circuit board
  • the combination between the circuit layer and the film is made by adhesive bonding into a whole.
  • the cost of this flexible circuit board module made of multiple films is significantly lower than that of a flexible circuit made of one film The cost of the circuit board module.
  • the flexible circuit board module made of multiple films is characterized in that when the flexible circuit board module of the multiple films is a double-layer circuit module, the The flexible circuit board on the upper layer is a single-layer circuit flexible circuit board.
  • the flexible circuit board module made of multiple films is characterized in that when the flexible circuit board module of the multiple films is a three-layer circuit module, the The above-mentioned flexible circuit board is a double-layer circuit flexible circuit board.
  • the flexible circuit board module made of multiple types of films is characterized in that the multiple types are two or three types.
  • the flexible circuit board module made of multiple films is characterized in that, when the flexible circuit board in the lower layer is a layer of film, the flexible circuit board is in the lower layer.
  • the other side of the circuit of the flexible circuit board can be used to make an insulating layer with solder mask.
  • the flexible circuit board module made of multiple films is characterized in that the upper flexible circuit board is a flexible circuit board for soldering components.
  • the solder mask of the flexible circuit board on the side is an ink solder mask.
  • the flexible circuit board module made of multiple films is characterized in that the upper flexible circuit board is a flexible circuit board for soldering components.
  • the solder mask of the flexible circuit board on the surface is a cover film solder mask, and the cover film used is also a PI film or a PET film that is resistant to higher temperatures.
  • the flexible circuit board module made of multiple films is characterized in that the higher temperature resistant film is a film that can withstand the reflow temperature of the SMT process soldering components.
  • the reflow soldering temperature reaches at least 160 degrees Celsius.
  • the higher temperature resistant film is PI film or PET film.
  • the reflow soldering temperature with high temperature solder paste reaches at least 240 degrees Celsius.
  • the high-temperature-resistant film is PI film.
  • the flexible circuit board module made of multiple films is characterized in that the lower temperature-resistant film is compared in the flexible circuit board module, which is relatively
  • the higher temperature-resistant film has a lower temperature resistance level, and is a film that cannot withstand the reflow temperature when soldering components in the SMT process.
  • the reflow temperature when using low temperature solder paste is at least 160 degrees Celsius, and the reflow temperature when using high temperature solder paste At least 240 degrees Celsius.
  • Figure 1 is a plan view of a flexible circuit board with a single-layer circuit on the upper layer.
  • FIG. 2 is a schematic cross-sectional view of a flexible circuit board with a PI film single-layer copper-clad substrate and an upper single-layer circuit with a front PI cover film.
  • FIG. 3 is a schematic cross-sectional view of a flexible circuit board with a single-layer copper-clad PI film and a front-side solder resist ink.
  • FIG. 4 is a schematic cross-sectional view of a flexible circuit board with a PET film single-layer copper-clad substrate and an upper single-layer circuit with a front PET cover film.
  • Fig. 5 is a schematic cross-sectional view of a flexible circuit board with a single-layer copper-clad PET film and an upper single-layer circuit with a front solder resist ink.
  • Fig. 6 is a schematic plan view of the flexible circuit board of the upper double-layer circuit.
  • FIG. 7 is a schematic cross-sectional view of a flexible circuit board with a double-layer circuit on the upper layer of the PI cover film on the front and back sides of the PI substrate.
  • FIG. 8 is a schematic cross-sectional view of a flexible circuit board with a double-layer circuit on the upper layer of the front and back PET covering film and PI substrate.
  • FIG. 9 is a schematic cross-sectional view of a flexible circuit board with a double-layer circuit on the upper layer of the PET cover film on the front and back sides of the PET substrate.
  • FIG. 10 is a schematic cross-sectional view of a flexible circuit board with a double-layer circuit on the upper layer of the PI substrate with solder mask ink on the front and back sides.
  • FIG. 11 is a schematic cross-sectional view of a flexible circuit board with a double-layer circuit on the upper layer of a PET substrate with solder resist ink on the front and back sides.
  • Fig. 12 is a schematic plan view of a flexible circuit board module with an upper single-layer circuit with components.
  • Fig. 13 is a schematic plan view of a flexible circuit board module with an upper double-layer circuit with components.
  • Figure 14 is a schematic plan view of a single-layer flexible circuit board made of a layer of PVC film.
  • Figure 15 is a schematic plan view of a single-layer flexible circuit board made of a layer of PET film.
  • Figure 16 is a schematic plan view of a single-layer flexible circuit board made of two-layer PVC film on the front and PET on the back.
  • Figure 17 is a schematic plan view of a flexible circuit board module made of various films.
  • Fig. 18 is a schematic cross-sectional view showing that the flexible circuit boards on the upper and lower layers are not glued and only welded together.
  • Figure 19 is a schematic cross-sectional view of the flexible circuit boards on the upper and lower layers glued together and welded together.
  • the copper foil and the film of the copper-clad substrate are bonded together with an epoxy-based adhesive.
  • the solder mask with the pad window is pasted on the front.
  • the solder mask is also a higher temperature resistant PI cover film 2.1a with glue or a PET cover with glue.
  • Multiple copper-clad aluminum wires 7.1 are pasted with glued PET film 2.1b or PVC film 6.1 to form the lower single-layer single-layer sheet of the single-layer film (shown in Figure 14 and Figure 15).
  • a layer of glued PET film 2.1b and a layer of glued PVC film 6.1 are sandwiched and juxtaposed flat copper-clad aluminum-magnesium wire 7.1, and then laminated together, and then cut and connect the front flexible circuit with a laser on one side of the PET
  • the copper surface required for the board is formed with pads 8.1, and then the surface is treated with anti-oxidation to make the lower single-layer flexible circuit board (shown in Figure 16).

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un module de carte de circuit imprimé souple fabriqué en utilisant de multiples films, et un procédé de fabrication. Le procédé comprend les étapes suivantes : utilisation d'un film résistant aux hautes températures pour fabriquer une carte de circuit imprimé souple de couche supérieure, et fixation d'un composant (5.1) sur l'avant de la carte de circuit imprimé souple ; utilisation d'un film résistant aux basses températures pour fabriquer une carte de circuit imprimé souple de couche inférieure pourvue d'une couche unique de circuits ; et liaison, au moyen d'un adhésif (9.1), de la carte de circuit imprimé souple comportant la couche unique de circuits à l'arrière de la carte de circuit imprimé souple de couche supérieure soudée au composant (5.1), puis connexion des multiples couches de circuits entre elles au moyen d'un brasage, ou placement direct de la carte de circuit imprimé souple pourvue de la couche unique de circuits sur la face arrière de la carte de circuit imprimé souple de couche supérieure soudée au composant (5.1), puis mise en œuvre d'une connexion par soudage (8.1a), formant ainsi un module de carte de circuit imprimé souple comprenant de multiples films et pourvu de deux ou trois couches de circuits flexibles. Le coût du module de carte de circuit imprimé souple fabriqué en utilisant de multiples films est nettement inférieur au coût d'un module de carte de circuit imprimé souple fabriqué en utilisant un film unique.
PCT/CN2020/108994 2020-01-15 2020-08-13 Module de carte de circuit imprimé souple fabriqué en utilisant de multiples films, et procédé de fabrication WO2021143124A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010070176.X 2020-01-15
CN202010070176.XA CN113133228A (zh) 2020-01-15 2020-01-15 多种膜制作的柔性线路板模组及制作方法

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WO2021143124A1 true WO2021143124A1 (fr) 2021-07-22

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WO (1) WO2021143124A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101116383A (zh) * 2005-02-03 2008-01-30 3M创新有限公司 两块印刷电路板的连接方法及由此得到的印刷电路板
CN101231395A (zh) * 2007-01-26 2008-07-30 奥林巴斯株式会社 挠性基板的接合构造
CN103607845A (zh) * 2013-10-21 2014-02-26 溧阳市东大技术转移中心有限公司 一种柔性印刷电路板的制造方法
CN106028643A (zh) * 2016-05-25 2016-10-12 武汉华星光电技术有限公司 柔性主板、柔性显示设备及柔性主板的制作方法
US20170135217A1 (en) * 2015-11-11 2017-05-11 Kabushiki Kaisha Toshiba Flexibile printed circuit and electronic device
CN106852197A (zh) * 2014-04-28 2017-06-13 弗莱克英纳宝有限公司 结合柔性印刷电路的方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101116383A (zh) * 2005-02-03 2008-01-30 3M创新有限公司 两块印刷电路板的连接方法及由此得到的印刷电路板
CN101231395A (zh) * 2007-01-26 2008-07-30 奥林巴斯株式会社 挠性基板的接合构造
CN103607845A (zh) * 2013-10-21 2014-02-26 溧阳市东大技术转移中心有限公司 一种柔性印刷电路板的制造方法
CN106852197A (zh) * 2014-04-28 2017-06-13 弗莱克英纳宝有限公司 结合柔性印刷电路的方法
US20170135217A1 (en) * 2015-11-11 2017-05-11 Kabushiki Kaisha Toshiba Flexibile printed circuit and electronic device
CN106028643A (zh) * 2016-05-25 2016-10-12 武汉华星光电技术有限公司 柔性主板、柔性显示设备及柔性主板的制作方法

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