WO2021139705A1 - 晶体振荡装置、射频模组和电子设备 - Google Patents

晶体振荡装置、射频模组和电子设备 Download PDF

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Publication number
WO2021139705A1
WO2021139705A1 PCT/CN2021/070564 CN2021070564W WO2021139705A1 WO 2021139705 A1 WO2021139705 A1 WO 2021139705A1 CN 2021070564 W CN2021070564 W CN 2021070564W WO 2021139705 A1 WO2021139705 A1 WO 2021139705A1
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Prior art keywords
crystal
capacitor
filter unit
radio frequency
filter
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PCT/CN2021/070564
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English (en)
French (fr)
Inventor
谭宇翔
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Oppo广东移动通信有限公司
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Publication of WO2021139705A1 publication Critical patent/WO2021139705A1/zh

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/56—Monolithic crystal filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz

Definitions

  • This application relates to the field of radio frequency technology, in particular to a crystal oscillator, radio frequency module and electronic equipment.
  • the clock signal generated by the crystal in the crystal oscillator circuit is generally used as a reference signal for chip operation and has a very important role.
  • the ground pins of the crystal and the PCB main ground are connected by copper, which may cause the clock signal and its frequency multiplier signal generated by the crystal to be directly conducted or leaked to the PCB main ground and coupled to the crystal ground of other chips. , Produce radio frequency interference and affect radio frequency performance.
  • a crystal oscillation device a radio frequency module, and an electronic device are provided.
  • a crystal oscillating device including:
  • Substrate including signal layer and main ground layer
  • the crystal oscillator circuit is arranged on the signal layer.
  • the crystal oscillator circuit includes a crystal, a first capacitor, and a second capacitor.
  • the first pin of the crystal is connected to the crystal ground via the first capacitor, and the crystal
  • the second pin of is connected to the crystal ground via the second capacitor, and the first capacitor and the second capacitor are used to adjust the frequency deviation parameter of the crystal;
  • the filter network is arranged on the signal layer and between the crystal ground and the main ground; the filter network includes an input port and an output port, wherein the input port is connected to the first capacitor and/ Or the second capacitor is connected, and the output port is connected to the main ground through a via for filtering radio frequency interference signals.
  • a radio frequency module includes the above-mentioned crystal oscillation device.
  • An electronic device includes the above-mentioned radio frequency module.
  • the above-mentioned crystal oscillator, radio frequency module and electronic equipment add a filter network on the signal layer of the substrate.
  • the filter network is arranged between the crystal ground and the main ground, and the input port of the filter network is connected to the first capacitor respectively. And/or the second capacitor is connected, and the output port of the filter network is connected to the main ground through a via, which cuts off the interference conduction path of the interference signal, and prevents the interference signal generated from leaking from the crystal ground to the main ground of the substrate and coupling to other Radio frequency interference occurs in the chip's ground, which affects radio frequency performance, which can improve communication quality and radio frequency performance indicators.
  • Fig. 1 is a schematic circuit diagram of a crystal oscillator device in an embodiment
  • FIG. 2 is a schematic diagram of the structure of a crystal oscillator device in an embodiment
  • Figure 3 is a simulation diagram of a filter network in an embodiment
  • Fig. 4 is a schematic circuit diagram of a crystal oscillator device in another embodiment
  • Fig. 5 is a schematic circuit diagram of a crystal oscillator device in another embodiment
  • Fig. 6 is a schematic circuit diagram of a crystal oscillator device in another embodiment
  • Fig. 7 is a schematic circuit diagram of a crystal oscillator device in an embodiment
  • FIG. 8 is a block diagram of a part of the structure of a mobile phone related to a computer device provided in an embodiment of the present application.
  • a plurality of means at least two, such as two, three, etc., unless specifically defined otherwise.
  • “several” means at least one, such as one, two, etc., unless otherwise specifically defined.
  • a component when a component is called “fixed to” another component, it can be directly on the other component or there may be a centered component.
  • an element When an element is considered to be “connected” to another element, it can be directly connected to the other element or an intermediate element may be present at the same time.
  • the embodiment of the present application provides a crystal oscillator device.
  • the crystal oscillator device includes a substrate 10, a crystal oscillator circuit 20 and a filter network 30.
  • the substrate 10 can be a multi-layer printed circuit board (Printed Circuit Board, PCB), which refers to a printed circuit board with more than two layers. It is composed of several layers of insulating substrates 10 with connecting wires and pads for assembling and soldering electronic components. It has the function of conducting various layers of circuits and insulating each other.
  • the multi-layer board wiring can separate the power layer, the main ground layer and the signal layer, reducing the interference between the power supply, the ground and the signal.
  • the lines of the two adjacent layers of printed boards should be as perpendicular to each other as possible, or follow diagonal lines or curves, instead of parallel lines, so as to reduce the coupling and interference between layers of the substrate 10.
  • the substrate 10 in the embodiment of the present application is a 4-layer printed board, which may include a signal layer 110, a main ground layer 120, a power layer 130, and a signal layer 140 from the top layer to the bottom layer. It should be noted that the substrate 10 can also be a printed board with 6, 8, 10 or other layers, and the number of layers of the substrate 10 is not further limited in the embodiment of the present application.
  • the crystal oscillator circuit 20 is disposed on the signal layer 110.
  • the crystal oscillator circuit 20 includes a crystal Y1, a first capacitor C1, and a second capacitor C2.
  • the crystal Y1 may include two signal pins, which are respectively denoted as the first pin and the second pin.
  • the crystal Y1 can be called a passive crystal oscillator. It is a quartz crystal resonator. When the quartz crystal resonator is working, the excitation voltage is applied to both ends of the crystal Y1. Using the piezoelectric effect of the quartz crystal, the crystal oscillates mechanically, and the direct current The voltage is inverted to AC voltage.
  • Crystal Y1 is often used as a clock component in the circuit and plays an important role in the circuit system. Crystal Y1 can work with other components and output clock signals to generate the clock signals required by the clock chip IC. Within the frequency range of the clock signal, the higher the frequency of the clock signal provided by the crystal Y1, the faster the operation speed of the IC.
  • the first pin of the crystal Y1 is connected to the crystal ground via the first capacitor C1
  • the second pin of the crystal Y1 is connected to the crystal ground via the second capacitor C2.
  • the crystal ground can be understood as a pad set on the signal ground.
  • the first capacitor C1 and the second capacitor C2 can be understood as load capacitance (CL).
  • CL load capacitance
  • Both the first capacitor C1 and the second capacitor C2 are used to adjust the frequency offset parameter of the crystal Y1.
  • the frequency deviation refers to the deviation between the actual operating frequency of the crystal oscillator circuit 20 and the nominal frequency of the crystal Y1, and the frequency deviation can be referred to as the total frequency deviation.
  • the capacitance values of the first capacitor C1 and the second capacitor C2 may be the same.
  • the capacitance values of the first capacitor C1 and the second capacitor C2 may also be different.
  • the specific values of the capacitance values of the first capacitor C1 and the second capacitor C2 are not further limited, and can be set according to the actual operating frequency requirements of the real crystal oscillator circuit 20.
  • the filter network 30 is arranged on the signal layer 110.
  • the filter network 30 includes an input port and an output port.
  • the input port is connected to the first capacitor C1 and/or the second capacitor C2, and the output port is connected to the main ground layer 120 through a via 311 , Used to filter out radio frequency interference signals.
  • the via hole 311 can be understood as a via hole that penetrates the signal layer 110.
  • the via hole can be filled with conductive material and can be in contact with the main ground layer 120 to connect the output port of the filter network 30 with the main ground layer 120.
  • the interference signal is mainly generated by the crystal Y1 oscillation frequency f and its multiplication frequency n*f.
  • the frequency range that needs to be filtered can be detected by detecting the strength of the interference signal. That is, due to the large energy of the clock signal, generally the fundamental frequency and frequency multiplication components of the clock signal are likely to become interference signals of other radio frequency signals, which will affect the signal quality of other radio frequency signals. Further, the interference signal can also be radiated due to the antenna effect formed by the parasitic parameters of the crystal Y1 and the PCB traces in the substrate 10.
  • a corresponding filter network 30 can be set for the interference signal generated by the crystal oscillator circuit 20, and the filter network 30 can present different filtering characteristics in different frequency bands.
  • the corresponding interference signal may be a radio frequency signal of 40MHz, 80MHz, 120MHz, etc.
  • the corresponding filter network 30 can present a higher impedance for high-frequency signals and a low impedance for low-frequency signals, as shown in Figure 3, to isolate the ground (for the clock signal and its frequency multiplier component) and eliminate The clock signal and its frequency multiplication component in the main ground 120 of the substrate 10 cause radio frequency interference to other modules.
  • a filter network 30 is added to the signal layer 110 of the substrate 10, and the input port of the filter network 30 Connected to the first capacitor C1 and/or the second capacitor C2 respectively, and the output port of the filter network 30 is connected to the main ground 120 through the via 311, which cuts off the interference path of the interference signal, prevents the interference signal from affecting the wireless index, and can improve the radio frequency. Communication performance.
  • the filter network 30 includes a first filter unit 310.
  • the input port of the first filter unit 310 is connected to the first capacitor C1, and the output port of the first filter unit 310 is connected to the main ground 120 through the via 311.
  • the input ports of the first filter unit 310 are respectively connected to the first capacitor C1 on the signal layer 110 and the crystal ground on the signal layer 110, and the output port of the first filter is connected to the main ground layer 120 of the substrate 10 through the via 311.
  • the first filtering unit 310 includes a plurality of filters connected in series.
  • the filter may be an LC filter to perform filtering processing on the generated interference signal.
  • the interference signal generated on the side of the first capacitor C1 can be filtered out by the first filter unit 310, thereby preventing the interference signal generated from leaking from the ground of the crystal Y1 to the substrate 10
  • the main ground layer 120 is coupled to the ground of other chips to generate radio frequency interference, which affects radio frequency performance.
  • the filter network 30 includes a second filter unit 320.
  • the input port of the second filter unit 320 is connected to the second capacitor C2, and the output port of the second filter unit 320 is connected to the main ground 120 through the via 311.
  • the input ports of the second filter unit 320 are respectively connected to the second capacitor C2 on the signal layer 110 and the crystal ground on the signal layer 110, and the output port of the second filter is connected to the main ground layer 120 of the substrate 10 through the via 311.
  • the second filtering unit 320 includes a plurality of filters connected in series.
  • the filter may be an LC filter to perform filtering processing on the generated interference signal.
  • the interference signal generated on the side of the second capacitor C2 can be filtered out by the second filter unit 320, thereby preventing the interference signal generated from leaking from the ground of the crystal Y1 to the substrate 10
  • the main ground layer 120 is coupled to the ground of other chips to generate radio frequency interference, which affects radio frequency performance.
  • the filter network 30 includes a first filter unit 310 and a second filter unit 320.
  • the input port of the first filter unit 310 is connected to the first capacitor C1, and the output port of the first filter unit 310 is connected to the main ground 120 through the via 311.
  • the input port of the second filter unit 320 is connected to the second capacitor C2, and the output port of the second filter unit 320 is connected to the main ground 120 through the via 311.
  • the input ports of the first filter unit 310 are respectively connected to the first capacitor C1 on the signal layer 110 and the crystal ground on the signal layer 110, and the output port of the first filter is connected to the main ground layer 120 of the substrate 10 through the via 311. connection.
  • the input port of the second filter unit 320 is respectively connected to the second capacitor C2 on the signal layer 110 and the crystal ground on the signal layer 110, and the second filter output port is connected to the main ground layer 120 of the substrate 10 through the via 311.
  • the first filter unit 310 includes a plurality of filters connected in series
  • the second filter unit 320 includes a plurality of filters connected in series.
  • the interference signal generated on the side of the first capacitor C1 and the second capacitor C2 can be filtered by the first filter unit 310 and the second filter unit 320, and then It can prevent the interference signal generated from leaking from the ground of the crystal Y1 to the main ground pin of the substrate 10 and being coupled to the ground of other chips to cause radio frequency interference and affect the radio frequency performance.
  • the filter network 30 when the filter network 30 includes a first filter unit 310 and a second filter unit 320, the first filter unit 310 and the second filter unit 320 are arranged at intervals in the signal layer 110, and are separated by a predetermined distance. .
  • the first filter unit 310 and the second filter unit 320 are arranged at a predetermined distance in the signal layer 110, which can be spatially isolated to ensure the isolation between the two filter units.
  • the size of the preset distance can be set according to the size of the substrate 10, the PCB wiring, the frequency band and the intensity of the interference signal. In the embodiment of the present application, the specific value of the preset distance is not further limited.
  • the first filter unit 310 and the second filter unit 320 are the same. It should be noted that the first filtering unit 310 and the second filtering unit 320 are the same, and it can be understood that the first filtering unit 310 and the second filtering unit 320 exhibit the same filtering characteristics in the same frequency band.
  • the crystal oscillation device further includes a controller 40 and a current limiting circuit 50.
  • the controller 40 includes a crystal input pin XTAL in and a crystal output pin XTAL out.
  • the crystal input pin XTAL in is connected to the crystal Y1 and the first capacitor C1 respectively, and the crystal output pin XTAL out is connected to the crystal Y1 and the crystal Y1.
  • the second capacitor C2 is connected to drive the crystal Y1 to form a clock signal.
  • the controller 40 can be understood as a control chip IC for driving the crystal oscillator circuit 20.
  • the current limiting circuit 50 is respectively connected to the crystal output pin and the second capacitor C2, and is used to limit the driving current used to drive the crystal Y1, so as to prevent the crystal Y1 from being burnt due to excessive driving current.
  • the current-limiting circuit 50 may be a current-limiting resistor, and the larger the resistance of the current-limiting resistor, the smaller the driving current output through the current-limiting resistor.
  • the crystal Y1 oscillating device further includes a detection module 60.
  • the detection module 60 is respectively connected to the input port of the filter network 30 and the controller 40, and is used to detect the frequency band of the radio frequency interference signal.
  • the detection module 60 may be a detection loop for detecting the frequency band of the radio frequency interference signal and the signal strength of the radio frequency interference signal.
  • the detection module 60 can also be connected to the controller 40 and the filter network 30.
  • the detection module 60 can output the frequency band and signal strength of the detected radio frequency interference signal to the controller 40, and the controller 40 according to the frequency band and signal strength of the received radio frequency interference signal The signal strength is used to adjust the filter parameters of the filter network to filter out radio frequency interference signals.
  • An embodiment of the present application also provides a radio frequency module, including the crystal oscillation device in any of the above embodiments.
  • the radio frequency module can be used for receiving and sending signals during the process of sending and receiving information or talking, and can receive the downlink information sent by the base station; it can also send the uplink data to the base station.
  • the radio frequency module includes, but is not limited to, a crystal oscillator, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, and so on.
  • LNA low noise amplifier
  • the radio frequency module can also communicate with the network and other devices through wireless communication.
  • the above-mentioned wireless communication can use any communication standard or protocol, including but not limited to Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (Code Division) Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), Email, Short Messaging Service (SMS), etc.
  • GSM Global System of Mobile Communication
  • GPRS General Packet Radio Service
  • CDMA Code Division Multiple Access
  • WCDMA Wideband Code Division Multiple Access
  • LTE Long Term Evolution
  • Email Short Messaging Service
  • the embodiment of the present application also provides an electronic device. As shown in FIG. 8, for ease of description, only the parts related to the embodiment of the present application are shown. For specific technical details that are not disclosed, please refer to the method part of the embodiment of the present application.
  • the electronic device can be any terminal device including mobile phone, tablet computer, PDA (Personal Digital Assistant), POS (Point of Sales), on-board computer, wearable device, etc. Take the electronic device as a mobile phone as an example :
  • FIG. 8 is a block diagram of a part of the structure of a mobile phone related to an electronic device provided by an embodiment of the present application.
  • the mobile phone includes: a radio frequency (RF) module 810, a memory 820, an input unit 830, a display unit 840, a sensor 850, an audio circuit 860, a wireless fidelity (WiFi) module 870, a processor 880, and power supply 890 and other components.
  • RF radio frequency
  • the radio frequency module 810 can be used for receiving and sending signals during the process of sending and receiving information or talking. It can receive the downlink information of the base station and send it to the processor 880 for processing; it can also send uplink data to the base station.
  • the radio frequency module includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, and so on.
  • the radio frequency module 810 can also communicate with the network and other devices through wireless communication.
  • the above-mentioned wireless communication can use any communication standard or protocol, including but not limited to Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (Code Division) Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), Email, Short Messaging Service (SMS), etc.
  • GSM Global System of Mobile Communication
  • GPRS General Packet Radio Service
  • CDMA Code Division Multiple Access
  • WCDMA Wideband Code Division Multiple Access
  • LTE Long Term Evolution
  • Email Short Messaging Service
  • the memory 820 can be used to store software programs and modules.
  • the processor 880 executes various functional applications and data processing of the mobile phone by running the software programs and modules stored in the memory 820.
  • the memory 820 may mainly include a program storage area and a data storage area, where the program storage area may store an operating system, an application program required by at least one function (such as an application program for a sound playback function, an application program for an image playback function, etc.), etc.;
  • the data storage area can store data (such as audio data, address book, etc.) created according to the use of the mobile phone.
  • the memory 820 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state storage devices.
  • the input unit 830 may be used to receive inputted number or character information, and generate key signal input related to user settings and function control of the mobile phone 800.
  • the input unit 830 may include a touch panel 831 and other input devices 832.
  • the touch panel 831 which can also be called a touch screen, can collect the user's touch operations on or near it (for example, the user uses any suitable objects or accessories such as fingers, stylus, etc.) on the touch panel 831 or near the touch panel 831 Operation), and drive the corresponding connection device according to the preset program.
  • the touch panel 831 may include two parts: a touch detection device and a touch controller.
  • the touch detection device detects the user's touch position, and detects the signal brought by the touch operation, and transmits the signal to the touch controller 40; the touch controller 40 receives the touch information from the touch detection device and converts it into contact coordinates , And then sent to the processor 880, and can receive and execute the command sent by the processor 880.
  • the touch panel 831 can be implemented in multiple types such as resistive, capacitive, infrared, and surface acoustic wave.
  • the input unit 830 may also include other input devices 832.
  • the other input device 832 may include, but is not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.).
  • the display unit 840 may be used to display information input by the user or information provided to the user and various menus of the mobile phone.
  • the display unit 840 may include a display panel 841.
  • the display panel 841 may be configured in the form of a liquid crystal display (Liquid Crystal Display, LCD), an organic light emitting diode (Organic Light-Emitting Diode, OLED), etc.
  • the touch panel 831 can cover the display panel 841. When the touch panel 831 detects a touch operation on or near it, it transmits it to the processor 880 to determine the type of the touch event, and then the processor 880 determines the type of the touch event according to The type of touch event provides corresponding visual output on the display panel 841.
  • the touch panel 831 and the display panel 841 are used as two independent components to realize the input and input functions of the mobile phone, but in some embodiments, the touch panel 831 and the display panel 841 can be integrated Realize the input and output functions of the mobile phone.
  • the mobile phone 800 may also include at least one sensor 850, such as a light sensor, a motion sensor, and other sensors.
  • the light sensor may include an ambient light sensor and a proximity sensor.
  • the ambient light sensor can adjust the brightness of the display panel 841 according to the brightness of the ambient light.
  • the proximity sensor can close the display panel 841 and/or when the mobile phone is moved to the ear. Or backlight.
  • Motion sensors can include acceleration sensors, which can detect the magnitude of acceleration in various directions, and can detect the magnitude and direction of gravity when stationary, and can be used to identify mobile phone gestures (such as horizontal and vertical screen switching), vibration recognition related functions (such as Pedometer, percussion), etc.; in addition, the mobile phone can also be equipped with other sensors such as gyroscope, barometer, hygrometer, thermometer, infrared sensor and so on.
  • the audio circuit 860, the speaker 881 and the microphone 882 may provide an audio interface between the user and the mobile phone.
  • the audio circuit 860 can transmit the electric signal converted from the received audio data to the speaker 881, and the speaker 881 converts it into a sound signal for output; on the other hand, the microphone 882 converts the collected sound signal into an electric signal, and the audio circuit 860 converts the collected sound signal into an electric signal. After being received, it is converted into audio data, and then processed by the audio data output processor 880, and then sent to another mobile phone via the radio frequency module 810, or the audio data is output to the memory 820 for subsequent processing.
  • WiFi is a short-distance wireless transmission technology.
  • the mobile phone can help users send and receive emails, browse web pages, and access streaming media through the WiFi module 870. It provides users with wireless broadband Internet access.
  • FIG. 8 shows the WiFi module 870, it is understandable that it is not a necessary component of the mobile phone 800 and can be omitted as required.
  • the processor 880 is the control center of the mobile phone. It uses various interfaces and lines to connect various parts of the entire mobile phone, and executes by running or executing software programs and/or modules stored in the memory 820, and calling data stored in the memory 820. Various functions and processing data of the mobile phone can be used to monitor the mobile phone as a whole.
  • the processor 880 may include one or more processing units.
  • the processor 880 may integrate an application processor and a modem processor, where the application processor mainly processes an operating system, a user interface, and an application program; the modem processor mainly processes wireless communication. It can be understood that the foregoing modem processor may not be integrated into the processor 880.
  • the mobile phone 800 also includes a power source 890 (such as a battery) for supplying power to various components.
  • a power source 890 such as a battery
  • the power source may be logically connected to the processor 880 through a power management system, so that functions such as charging, discharging, and power management are realized through the power management system.
  • the mobile phone 800 may also include a camera, a Bluetooth module, and the like.

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Abstract

一种晶体振荡装置，包括：基板(10)，包括信号层(110)和主地层(120)；晶振电路(20)，设置在信号层(110)上，晶振电路(20)包括晶体(Y1)、第一电容(C1)和第二电容(C2)，其中，晶体(Y1)的第一引脚经第一电容(C1)与晶体地连接，晶体(Y1)的第二引脚经第二电容(C2)与晶体地连接，第一电容(C1)和第二电容(C2)用于调节晶体的频偏参数；滤波网络(30)，设置在信号层(110)上；滤波网络(30)包括输入端口和输出端口，其中，输入端口分别与第一电容(C1)和第二电容(C2)中的至少一种连接，输出端口通过过孔(311)与主地层(120)连接，用于滤除射频干扰信号。

Description

晶体振荡装置、射频模组和电子设备
相关申请的交叉引用
本申请要求于2020年1月7日提交中国专利局、申请号为2020100130918、发明名称为“晶体振荡装置、射频模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及射频技术领域，特别是涉及一种晶体振荡装置、射频模组和电子设备。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有示例性技术。
在电子设备的设计当中，晶振电路中由晶体产生的时钟信号一般作为芯片工作的参考信号，具有十分重要的作用。一般，晶体的地引脚和PCB主地之间通过铜皮连接起来，可能会造成晶体产生的时钟信号及其倍频信号直接传导或泄露到PCB主地上，并耦合到其他芯片的晶体地中，产生射频干扰，影响射频性能。
发明内容
根据本申请的各种实施例，提供一种晶体振荡装置、射频模组和电子设备。
一种晶体振荡装置，包括：
基板，包括信号层和主地层；
晶振电路，设置在所述信号层上，所述晶振电路包括晶体、第一电容和第二电容，其中，所述晶体的第一引脚经所述第一电容与晶体地连接，所述晶体的第二引脚经所述第二电容与晶体地连接，所述第一电容和所述第二电容用于调节所述晶体的频偏参数；
滤波网络，设置在所述信号层上，且设置在所述晶体地与主地层之间；所述滤波网络包括输入端口和输出端口，其中，所述输入端口分别与所述第一电容和/或第二电容连接，所述输出端口通过过孔与所述主地层连接，用于滤除射频干扰信号。
一种射频模组，包括上述的晶体振荡装置。
一种电子设备，包括上述的射频模组。
上述晶体振荡装置、射频模组和电子设备，通过在基板的信号层上增加了滤波网络，该滤波网络设置在晶体地与主地层之间，并将该滤波网络的输入端口分别与第一电容和/或第二电容连接，而滤波网络的输出端口通过过孔与主地层连接，切断了干扰信号的干扰传导路径，避免其产生的干扰信号从晶体地泄露至基板的主地层并耦合到其他芯片的地中产生射频干扰，影响射频性能的情况发生，可以提升通信质量和射频性能指标。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其他特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施 例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为一个实施例中晶体振荡装置的电路示意图；
图2为一个实施例中晶体振荡装置的结构示意图；
图3为一个实施例中滤波网络的仿真图；
图4为另一个实施例中晶体振荡装置的电路示意图；
图5为又一个实施例中晶体振荡装置的电路示意图；
图6为再一个实施例中晶体振荡装置的电路示意图；
图7为一个实施例中晶体振荡装置的电路示意图；
图8为与本申请实施例提供的计算机设备相关的手机的部分结构的框图。
具体实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳的实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。在本申请的描述中，“若干”的含义是至少一个，例如一个，两个等，除非另有明确具体的限定。
需要说明的是，当元件被称为：“固定于”另一个元件，它可以直接在另 一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。
本申请实施例提供一种晶体振荡装置。如图1和图2所示，在其中一个实施例中，晶体振荡装置包括基板10、晶振电路20和滤波网络30。
基板10可为多层印制板(Printed Circuit Board，PCB)就是指两层以上的印制板，它是由几层绝缘基板10上的连接导线和装配焊接电子元件用的焊盘组成，既具有导通各层线路，又具有相互间绝缘的作用。多层板走线可把电源层、主地层和信号层分开，减少电源、地、信号之间的干扰。相邻两层印制板的线条应尽量相互垂直或走斜线、曲线，不能走平行线，以减少基板10的层间耦合和干扰。
示例性的，本申请实施例中的基板10为4层印制板，其由顶层至底层可包括信号层110、主地层120、电源层130和信号层140。需要说明的是，基板10还可为6层、8层、10层或其他层的印制板，在本申请实施例中对基板10的层数不做进一步的限定。
晶振电路20，设置在信号层110上，晶振电路20包括晶体Y1、第一电容C1和第二电容C2。其中，晶体Y1可包括两个信号引脚，分别记为第一引脚、第二引脚。其中，该晶体Y1可称为无源晶振，是石英晶体谐振器，石英晶体谐振器在工作时，激励电压加在晶体Y1两端，利用石英晶片的压电效应，晶片发生机械振荡，将直流电压逆变为交流电压。晶体Y1常作为电路中的时钟元件，并且在电路系统中发挥着重要的作用，晶体Y1可配合其他元器件工作，输出时钟信号，即可产生时钟芯片IC所需的时钟信号，在IC所需要的时钟信号的频率范围内，晶体Y1提供的时钟信号的频率越高，IC的运行速度越快。
其中，晶体Y1的第一引脚经第一电容C1与晶体地连接，晶体Y1的第二 引脚经第二电容C2与晶体地连接。其中，晶体地可以理解为设置在信号用于接地的焊盘。
其中，第一电容C1和第二电容C2可以理解为负载电容(Load Capacitance,CL)。其中，负载电容的大小会影响标称频率的特性。第一电容C1与第二电容C2均用于调节晶体Y1的频偏参数。频偏是指晶振电路20的实际工作频率与晶体Y1标称频率的偏移量，频偏可以称为总频差。
在其中一个实施例中，第一电容C1、第二电容C2的电容值可以相同。
可选的，第一电容C1、第二电容C2的电容值也可以不相同。
在本申请实施例中，对第一电容C1、第二电容C2的电容值的具体数值不做进一步的限定，可以根据实晶振电路20的实际工作频率需求的来设定。
滤波网络30，设置在信号层110上，滤波网络30包括输入端口和输出端口，其中，输入端口与第一电容C1和/或第二电容C2连接，输出端口通过过孔311与主地层120连接，用于滤除射频干扰信号。具体的，过孔311可以理解为设置贯穿该信号层110的通孔，该通孔内可填充导电材料，并能够与主地层120接触，以使滤波网络30的输出端口与主地层120连接。
干扰信号主要是由晶体Y1振荡频率f和其倍频n*f产生，可以通过探测干扰信号强度来检测需要滤除的频段范围。也即，由于时钟信号能量较大，一般该时钟信号的基频、倍频分量容易成为其他射频信号的干扰信号，其会影响到其他射频信号的信号质量。进一步的，干扰信号还可由晶体Y1本身的寄生参数和基板10中的PCB走线形成的天线效应导致，而被辐射出来。
具体的，可针对晶振电路20产生的干扰信号来设置相应的滤波网络30，该滤波网络30能够在不同的频段下呈现出不同的滤波特征。示例性的，如该晶振电路20可产生40MHz的时钟信号，其对应的干扰信号可能为40MHz、80MHz、 120MHz等的射频信号。其对应设置的滤波网络30可以在在对高频信号时呈现较高的阻抗，对低频信号呈现低阻抗，如图3所示，来进行地隔离(针对时钟信号及其倍频分量)，消除基板10主地层120中的时钟信号及其倍频分量对其他模块的射频干扰。
由于晶体Y1的干扰信号一般通过耦合或者传导至主地层120来影响其他模块，本申请实施例中，通过在基板10的信号层110上增加了滤波网络30，并将该滤波网络30的输入端口分别与第一电容C1和/或第二电容C2连接，而滤波网络30的输出端口通过过孔311与主地层120连接，切断了干扰信号的干扰路径，避免干扰信号影响无线指标，能够提升射频通信性能。
如图4所示，在其中一个实施例中，滤波网络30包括第一滤波单元310。第一滤波单元310的输入端口与第一电容C1连接，第一滤波单元310的输出端口通过过孔311与主地层120连接。具体的，第一滤波单元310的输入端口分别与信号层110上的第一电容C1、信号层110上的晶体地连接，其第一滤波的输出端口通过过孔311与基板10的主地层120连接。进一步的，第一滤波单元310包括多个串联的滤波器。示例性的，该滤波器可以为LC滤波器，以针对产生的干扰信号进行滤波处理。
通过设置该第一滤波单元310，可以将在第一电容C1侧的产生的干扰信号被第一滤波单元310所滤除，进而可以避免其产生的干扰信号从晶体Y1的地泄露至基板10的主地层120并耦合到其他芯片的地中产生射频干扰，影响射频性能的情况发生。
如图5所示，在其中一个实施例中，滤波网络30包括第二滤波单元320。第二滤波单元320的输入端口与第二电容C2连接，第二滤波单元320的输出端口通过过孔311与主地层120连接。具体的，第二滤波单元320的输入端口分 别与信号层110上的第二电容C2、信号层110上的晶体地连接，其第二滤波的输出端口通过过孔311与基板10的主地层120连接。进一步的，第二滤波单元320包括多个串联的滤波器。示例性的，该滤波器可以为LC滤波器，以针对产生的干扰信号进行滤波处理。
通过设置该第二滤波单元320，可以将在第二电容C2侧的产生的干扰信号被第二滤波单元320所滤除，进而可以避免其产生的干扰信号从晶体Y1的地泄露至基板10的主地层120并耦合到其他芯片的地中产生射频干扰，影响射频性能的情况发生。
如图6所示，在其中一个实施例中，滤波网络30包括第一滤波单元310和第二滤波单元320。第一滤波单元310的输入端口与第一电容C1连接，第一滤波单元310的输出端口通过过孔311与主地层120连接。第二滤波单元320的输入端口与第二电容C2连接，第二滤波单元320的输出端口通过过孔311与主地层120连接。
具体的，第一滤波单元310的输入端口分别与信号层110上的第一电容C1、信号层110上的晶体地连接，其第一滤波的输出端口通过过孔311与基板10的主地层120连接。第二滤波单元320的输入端口分别与信号层110上的第二电容C2、信号层110上的晶体地连接，其第二滤波的输出端口通过过孔311与基板10的主地层120连接。进一步的，第一滤波单元310包括多个串联的滤波器，第二滤波单元320包括多个串联的滤波器。
通过设置第一滤波单元310和第二滤波单元320，可以将在第一电容C1、第二电容C2侧的产生的干扰信号，被第一滤波单元310和第二滤波单元320所滤除，进而可以避免其产生的干扰信号从晶体Y1的地泄露至基板10的主地引脚上并耦合到其他芯片的地中产生射频干扰，影响射频性能的情况发生。
在其中一个实施例中，当滤波网络30包括第一滤波单元310和第二滤波单元320时，其中，第一滤波单元310和第二滤波单元320在信号层110间隔设置，且间隔预设距离。
需要说明的是，将第一滤波单元310和第二滤波单元320在信号层110间隔预设距离设置，可以在空间上进行隔离以保证两个滤波单元之间的隔离度。需要说明的是，其预设距离的大小可以根据基板10的大小、PCB走线、干扰信号的频段和强度大小来设置。在本申请实施例中，对预设距离的具体值不做进一步的限定。
在其中一个实施例中，当晶振电路20中的第一电容C1和第二电容C2的电容值相同时，其第一滤波单元310和第二滤波单元320相同。需要说明的是，第一滤波单元310与第二滤波单元320相同可以理解为第一滤波单元310与第二滤波单元320在相同频段下所呈现的滤波特征相同。
如图7所示，在其中一个实施例中，晶体振荡装置还包括控制器40和限流电路50。其中，控制器40包括晶体输入引脚XTAL in和晶体输出引脚XTAL out，其中，晶体输入引脚XTAL in分别与晶体Y1、第一电容C1连接，晶体输出引脚XTAL out分别与晶体Y1、第二电容C2连接，用于驱动晶体Y1以形成时钟信号。示例性的，该控制器40可以理解为用于驱动该晶振电路20的控制芯片IC。
限流电路50，分别与晶体输出引脚、第二电容C2连接，用于限制用于驱动晶体Y1的驱动电流，以防止其驱动电流过大而烧毁其晶体Y1。示例性的，该限流电路50可以为限流电阻，其限流电阻的阻值越大，其经该限流电阻输出的驱动电流也就越小。
在其中一个实施例中，晶体Y1振荡装置还包括探测模块60。其中，该探 测模块60分别与滤波网络30的输入端口、控制器40连接，用于检测射频干扰信号的频段。探测模块60可以为探测环，用于检测其射频干扰信号的频段和射频干扰信号的信号强度。其探测模块60还可与控制器40、滤波网络30连接，探测模块60可以将探测的射频干扰信号的频段和信号强度输出给控制器40，控制器40根据接收到的射频干扰信号的频段和信号强度来调节滤波网路的滤波参数以对应滤除射频干扰信号。
本申请实施例还提供一种射频模组，包括上述任一实施例中的晶体振荡装置。射频模组可用于收发信息或通话过程中，信号的接收和发送，可接收基站发送的下行信息；也可以将上行的数据发送给基站。通常，射频模组包括但不限于晶体振荡装置、天线、至少一个放大器、收发信机、耦合器、低噪声放大器(Low Noise Amplifier，LNA)、双工器等。
通过在射频模组中增加该晶振振荡装置，通过在基板10的信号层110上增加了滤波网络30，并将该滤波网络30的输入端口分别与第一电容C1和/或第二电容C2、晶体地连接，而滤波网络30的输出端口通过过孔311与主地层120连接，切断了干扰信号的干扰路径，避免干扰信号影响无线指标，能够提升射频通信性能。
此外，射频模组还可以通过无线通信与网络和其他设备通信。上述无线通信可以使用任一通信标准或协议，包括但不限于全球移动通讯系统(Global System of Mobile communication，GSM)、通用分组无线服务(General Packet Radio Service，GPRS)、码分多址(Code Division Multiple Access，CDMA)、宽带码分多址(Wideband Code Division Multiple Access，WCDMA)、长期演进(Long Term Evolution，LTE))、电子邮件、短消息服务(Short Messaging Service，SMS)等。
本申请实施例还提供了一种电子设备。如图8所示，为了便于说明，仅示出了与本申请实施例相关的部分，具体技术细节未揭示的，请参照本申请实施例方法部分。该电子设备可以为包括手机、平板电脑、PDA(Personal Digital Assistant，个人数字助理)、POS(Point of Sales，销售终端)、车载电脑、穿戴式设备等任意终端设备，以电子设备为手机为例：
图8为与本申请实施例提供的电子设备相关的手机的部分结构的框图。参考图8，手机包括：射频(Radio Frequency，RF)模组810、存储器820、输入单元830、显示单元840、传感器850、音频电路860、无线保真(wireless fidelity，WiFi)模块870、处理器880、以及电源890等部件。本领域技术人员可以理解，图8所示的手机结构并不构成对手机的限定，可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置。
其中，射频模组810可用于收发信息或通话过程中，信号的接收和发送，可将基站的下行信息接收后，给处理器880处理；也可以将上行的数据发送给基站。通常，射频模组包括但不限于天线、至少一个放大器、收发信机、耦合器、低噪声放大器(Low Noise Amplifier，LNA)、双工器等。此外，射频模组810还可以通过无线通信与网络和其他设备通信。上述无线通信可以使用任一通信标准或协议，包括但不限于全球移动通讯系统(Global System of Mobile communication，GSM)、通用分组无线服务(General Packet Radio Service，GPRS)、码分多址(Code Division Multiple Access，CDMA)、宽带码分多址(Wideband Code Division Multiple Access，WCDMA)、长期演进(Long Term Evolution，LTE))、电子邮件、短消息服务(Short Messaging Service，SMS)等。
存储器820可用于存储软件程序以及模块，处理器880通过运行存储在 存储器820的软件程序以及模块，从而执行手机的各种功能应用以及数据处理。存储器820可主要包括程序存储区和数据存储区，其中，程序存储区可存储操作系统、至少一个功能所需的应用程序(比如声音播放功能的应用程序、图像播放功能的应用程序等)等；数据存储区可存储根据手机的使用所创建的数据(比如音频数据、通讯录等)等。此外，存储器820可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件、闪存器件、或其他易失性固态存储器件。
输入单元830可用于接收输入的数字或字符信息，以及产生与手机800的用户设置以及功能控制有关的键信号输入。具体地，输入单元830可包括触控面板831以及其他输入设备832。触控面板831，也可称为触摸屏，可收集用户在其上或附近的触摸操作(比如用户使用手指、触笔等任何适合的物体或附件在触控面板831上或在触控面板831附近的操作)，并根据预先设定的程式驱动相应的连接装置。在一个实施例中，触控面板831可包括触摸检测装置和触摸控制器两个部分。其中，触摸检测装置检测用户的触摸方位，并检测触摸操作带来的信号，将信号传送给触摸控制器40；触摸控制器40从触摸检测装置上接收触摸信息，并将它转换成触点坐标，再送给处理器880，并能接收处理器880发来的命令并加以执行。此外，可以采用电阻式、电容式、红外线以及表面声波等多种类型实现触控面板831。除了触控面板831，输入单元830还可以包括其他输入设备832。具体地，其他输入设备832可以包括但不限于物理键盘、功能键(比如音量控制按键、开关按键等)等中的一种或多种。
显示单元840可用于显示由用户输入的信息或提供给用户的信息以及手机的各种菜单。显示单元840可包括显示面板841。在一个实施例中，可以 采用液晶显示器(Liquid Crystal Display，LCD)、有机发光二极管(Organic Light-Emitting Diode,OLED)等形式来配置显示面板841。在一个实施例中，触控面板831可覆盖显示面板841，当触控面板831检测到在其上或附近的触摸操作后，传送给处理器880以确定触摸事件的类型，随后处理器880根据触摸事件的类型在显示面板841上提供相应的视觉输出。虽然在图8中，触控面板831与显示面板841是作为两个独立的部件来实现手机的输入和输入功能，但是在某些实施例中，可以将触控面板831与显示面板841集成而实现手机的输入和输出功能。
手机800还可包括至少一种传感器850，比如光传感器、运动传感器以及其他传感器。具体地，光传感器可包括环境光传感器及接近传感器，其中，环境光传感器可根据环境光线的明暗来调节显示面板841的亮度，接近传感器可在手机移动到耳边时，关闭显示面板841和/或背光。运动传感器可包括加速度传感器，通过加速度传感器可检测各个方向上加速度的大小，静止时可检测出重力的大小及方向，可用于识别手机姿态的应用(比如横竖屏切换)、振动识别相关功能(比如计步器、敲击)等；此外，手机还可配置陀螺仪、气压计、湿度计、温度计、红外线传感器等其他传感器等。
音频电路860、扬声器881和传声器882可提供用户与手机之间的音频接口。音频电路860可将接收到的音频数据转换后的电信号，传输到扬声器881，由扬声器881转换为声音信号输出；另一方面，传声器882将收集的声音信号转换为电信号，由音频电路860接收后转换为音频数据，再将音频数据输出处理器880处理后，经射频模组810可以发送给另一手机，或者将音频数据输出至存储器820以便后续处理。
WiFi属于短距离无线传输技术，手机通过WiFi模块870可以帮助用户 收发电子邮件、浏览网页和访问流式媒体等，它为用户提供了无线的宽带互联网访问。虽然图8示出了WiFi模块870，但是可以理解的是，其并不属于手机800的必须构成，可以根据需要而省略。
处理器880是手机的控制中心，利用各种接口和线路连接整个手机的各个部分，通过运行或执行存储在存储器820内的软件程序和/或模块，以及调用存储在存储器820内的数据，执行手机的各种功能和处理数据，从而对手机进行整体监控。在一个实施例中，处理器880可包括一个或多个处理单元。在一个实施例中，处理器880可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作系统、用户界面和应用程序等；调制解调处理器主要处理无线通信。可以理解的是，上述调制解调处理器也可以不集成到处理器880中。
手机800还包括给各个部件供电的电源890(比如电池)，优选的，电源可以通过电源管理系统与处理器880逻辑相连，从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。
在一个实施例中，手机800还可以包括摄像头、蓝牙模块等。
以上实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (21)

  1. 一种晶体振荡装置，其特征在于，包括：
    基板，包括信号层和主地层；
    晶振电路，设置在所述信号层上，所述晶振电路包括晶体、第一电容和第二电容，其中，所述晶体的第一引脚经所述第一电容与晶体地连接，所述晶体的第二引脚经所述第二电容与晶体地连接，所述第一电容和所述第二电容用于调节所述晶体的频偏参数；
    滤波网络，设置在所述信号层上，且设置在所述晶体地与主地层之间；所述滤波网络包括输入端口和输出端口，其中，所述输入端口分别与所述第一电容和第二电容中的至少一个连接，所述输出端口通过过孔与所述主地层连接，用于滤除射频干扰信号。
  2. 根据权利要求1所述的晶体振荡装置，其特征在于，所述滤波网络包括：
    第一滤波单元，所述第一滤波单元的输入端口与所述第一电容连接，所述第一滤波单元的输出端口通过过孔与所述主地层连接；
    第二滤波单元，所述第二滤波单元的输入端口与所述第二电容连接，所述第二滤波单元的输出端口通过过孔与所述主地层连接。
  3. 根据权利要求2所述的晶体振荡装置，其特征在于，所述第一滤波单元包括多个串联的滤波器，所述第二滤波单元包括多个串联的滤波器。
  4. 根据权利要求2所述的晶体振荡装置，其特征在于，所述第一电容和所述第二电容的电容值相同。
  5. 根据权利要求4所述的晶体振荡装置，其特征在于，所述第一滤波单元和所述第二滤波单元在相同频段下呈现的滤波特征相同。
  6. 根据权利要求2所述的晶体振荡装置，其特征在于，所述第一滤波单元和所述第二滤波单元在所述信号层间隔设置，且间隔预设距离。
  7. 根据权利要求1所述的晶体振荡装置，其特征在于，所述滤波网络包括第一滤波单元，其中，所述第一滤波单元的输入端口与所述第一电容连接，所述第一滤波单元的输出端口通过过孔与所述主地层连接。
  8. 根据权利要求7所述的晶体振荡装置，其特征在于，所述第一滤波单元包括多个串联的滤波器。
  9. 根据权利要求1所述的晶体振荡装置，其特征在于，所述滤波网络包括第二滤波单元，其中，所述第二滤波单元的输入端口与所述第二电容连接，所述第一滤波单元的输出端口通过过孔与所述主地层连接。
  10. 根据权利要求9所述的晶体振荡装置，其特征在于，所述第二滤波单元包括多个串联的滤波器。
  11. 根据权利要求1所述的晶体振荡装置，其特征在于，所述晶体振荡装置还包括：
    控制器，包括晶体输入引脚和晶体输出引脚，其中，所述晶体输入引脚分别与所述晶体、第一电容连接，所述晶体输出引脚分别与所述晶体、第二电容连接，用于驱动所述晶体以形成时钟信号；
    限流电路，分别与所述晶体输出引脚、第二电容连接，用于限制用于驱动所述晶体的驱动电流。
  12. 根据权利要求11所述的晶体振荡装置，其特征在于，所述限流电路为限流电阻。
  13. 根据权利要求11所述的晶体振荡装置，其特征在于，所述晶体振荡装置还包括：
    探测模块，分别与所述滤波网络的输入端口、控制器连接，用于检测所述射频干扰信号的频段；
    控制器还与所述滤波网络连接，用于根据所述射频干扰信号的频段调节所述滤波网路的滤波参数以对应滤除所述射频干扰信号。
  14. 根据权利要求13所述的晶体振荡装置，其特征在于，所述探测模块为探测环，用于检测所述射频干扰信号的频段和所述射频干扰信号的信号强度；
    所述控制器还用于根据接收到的所述射频干扰信号的频段和信号强度调节所述滤波网路的滤波参数。
  15. 根据权利要求1所述的晶体振荡装置，其特征在于，所述过孔为贯穿所述信号层的通孔，所述通孔内填充导电材料，并能够与所述主地层接触，以使所述滤波网络的输出端口与所述主地层连接。
  16. 一种射频模组，其特征在于，包括：
    基板，包括信号层和主地层；
    晶振电路，设置在所述信号层上，所述晶振电路包括晶体、第一电容和第二电容，其中，所述晶体的第一引脚经所述第一电容与晶体地连接，所述晶体的第二引脚经所述第二电容与晶体地连接，所述第一电容和所述第二电容用于调节所述晶体的频偏参数；
    滤波网络，设置在所述信号层上，且设置在所述晶体地与主地层之间；所述滤波网络包括输入端口和输出端口，其中，所述输入端口分别与所述第一电容和第二电容中的至少一个连接，所述输出端口通过过孔与所述主地层连接，用于滤除射频干扰信号。
  17. 根据权利要求16所述的射频模组，其特征在于，所述滤波网络包括：
    第一滤波单元，所述第一滤波单元的输入端口与所述第一电容连接，所述第一滤波单元的输出端口通过过孔与所述主地层连接；
    第二滤波单元，所述第二滤波单元的输入端口与所述第二电容连接，所述第二滤波单元的输出端口通过过孔与所述主地层连接。
  18. 根据权利要求17所述的射频模组，其特征在于，所述第一滤波单元和所述第二滤波单元在所述信号层间隔设置，且间隔预设距离。
  19. 根据权利要求16所述的射频模组，其特征在于，所述滤波网络包括第一滤波单元，其中，所述第一滤波单元的输入端口与所述第一电容连接，所述第一滤波单元的输出端口通过过孔与所述主地层连接。
  20. 根据权利要求16所述的射频模组，其特征在于，所述滤波网络包括第二滤波单元，其中，所述第二滤波单元的输入端口与所述第二电容连接，所述第一滤波单元的输出端口通过过孔与所述主地层连接。
  21. 一种电子设备，其特征在于，包括射频模组；其中，所述射频模组包括：
    基板，包括信号层和主地层；
    晶振电路，设置在所述信号层上，所述晶振电路包括晶体、第一电容和第二电容，其中，所述晶体的第一引脚经所述第一电容与晶体地连接，所述晶体的第二引脚经所述第二电容与晶体地连接，所述第一电容和所述第二电容用于调节所述晶体的频偏参数；
    滤波网络，设置在所述信号层上，且设置在所述晶体地与主地层之间；所述滤波网络包括输入端口和输出端口，其中，所述输入端口分别与所述第一电容和第二电容中的至少一个连接，所述输出端口通过过孔与所述主地层连接，用于滤除射频干扰信号。
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