WO2020216029A1 - 层叠板及终端设备 - Google Patents

层叠板及终端设备 Download PDF

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Publication number
WO2020216029A1
WO2020216029A1 PCT/CN2020/082773 CN2020082773W WO2020216029A1 WO 2020216029 A1 WO2020216029 A1 WO 2020216029A1 CN 2020082773 W CN2020082773 W CN 2020082773W WO 2020216029 A1 WO2020216029 A1 WO 2020216029A1
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WO
WIPO (PCT)
Prior art keywords
board
pad
connecting board
board pad
main
Prior art date
Application number
PCT/CN2020/082773
Other languages
English (en)
French (fr)
Inventor
陈艳
Original Assignee
Oppo广东移动通信有限公司
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Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020216029A1 publication Critical patent/WO2020216029A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Definitions

  • This application relates to the technical field of electronic equipment, and more specifically to a laminated board and terminal equipment.
  • the motherboard usually integrates electronic components such as processors, storage units, and baseband chips, which are very important components in terminal equipment.
  • a secondary board can also be provided in the terminal device, and the secondary board is electrically connected to the main board through the connecting board, so that signal communication can be performed between the secondary board and the main board.
  • the purpose of this application is to provide a laminated board and a terminal device to solve the technical problem that the main board and the secondary board in the existing laminated board are prone to cracking.
  • a laminated board which includes a main board, a ring-shaped connecting board, and a sub board that are stacked in sequence;
  • the side of the connecting board facing the main board is provided with a first connecting board pad and a second connecting board pad, and the side of the connecting board facing the secondary board is provided with a third connecting board pad and a fourth connecting board.
  • the main board is provided with a first main board pad and a second main board pad, the first main board pad is opposite and connected to the first connecting board pad, and the second main board pad is connected to the second main board
  • the board pads are opposite and connected;
  • the sub-board is provided with a first sub-board pad and a second sub-board pad, the first sub-board pad is opposite and connected to the third connecting board pad, and the second sub-board pad is connected to The pads of the fourth connecting board are opposite and connected.
  • the second connecting board pad is provided on the inner edge of the connecting board facing the main board, and the fourth connecting board pad is provided on the connecting board facing the secondary board.
  • the inner side surface of the connecting board is provided with an inner conductive layer, the inner conductive layer is connected to the second connecting board pad and the second main board pad, and the inner conductive layer is connected to the fourth connection Both the board pad and the second sub-board pad are connected.
  • connection board pad, the inner conductive layer, and the fourth connection board pad are integrally formed by electroplating copper.
  • the second main board pad and the second connecting board pad are soldered by solder paste, and the second sub-board pad and the fourth connecting board pad are soldered by solder paste.
  • the connecting board is further provided with a fifth connecting board pad, and the fifth connecting board pad is provided on the outer edge of the connecting board facing the main board;
  • the main board is further provided with a third main board pad, and the third main board pad is connected to the fifth connecting board pad.
  • an outer conductive layer is provided on the outer surface of the connecting board, and the outer conductive layer is connected to both the fifth connecting board pad and the third main board pad.
  • the connecting board is further provided with a sixth connecting board pad, and the sixth connecting board pad is provided on an outer edge of the connecting board facing the side of the auxiliary board;
  • the auxiliary board is further provided with a third auxiliary board pad, and the third auxiliary board pad is connected to the sixth connecting board pad;
  • Both the sixth connecting board pad and the third sub-board pad are connected to the outer conductive layer.
  • the cross-sectional size of the secondary board is larger than the cross-sectional size of the connecting board.
  • the fifth connecting board pad, the outer conductive layer, and the sixth connecting board pad are integrally formed by electroplating copper.
  • the sixth connecting board pad and the third sub-board pad are soldered by solder paste.
  • the fifth connection board pad and the third main board pad are soldered by solder paste.
  • a sealing layer is enclosed between the main board, the outer surface of the connecting board, and the auxiliary board.
  • the cross-sectional size of the secondary board is not greater than the cross-sectional size of the connecting board.
  • the cross-sectional size of the main board is larger than the cross-sectional size of the connecting board.
  • the length of the main board is at least 0.3 mm wider than the connecting board; the width of the main board is at least 0.3 mm wider than the connecting board.
  • first connecting board pad, the second connecting board pad, the third connecting board pad, and the fourth connecting board pad are all ring-shaped pads, and the The first connection board pad, the second connection board pad, the third connection board pad and the fourth connection board pad are all arranged along the annular surface of the connection board.
  • the widths of the second main board pad and the second sub-board pad are not less than 0.3mm, and the widths of the second connecting board pad and the fourth connecting board pad are not less than 0.2mm.
  • a terminal device including the above-mentioned laminated board.
  • the beneficial effects of the laminated board provided by the embodiments of the present application include at least: the present application provides the first connection board pad and the second connection board pad on the lower side of the connection board, and at the same time, the first motherboard pad and the The second motherboard pads are respectively connected to the above-mentioned first connecting board pads and the second connecting board pads.
  • the third connection board pad and the fourth connection board pad are arranged on the upper side of the connection board, and the first and second auxiliary board pads are respectively provided on the auxiliary board, respectively, respectively.
  • the three connecting board pads and the fourth connecting board pads are connected correspondingly.
  • Figure 1 is a schematic diagram of the structure of a laminated board in an example
  • FIG. 2 is a schematic diagram 1 of the front structure of a laminated board provided by an embodiment of the application;
  • FIG. 3 is a schematic diagram of the first structure of a laminated board provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of a second structure of a laminated board provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of a third structure of a laminated board provided by an embodiment of the application.
  • FIG. 6 is a second schematic diagram of the front structure of the laminated board provided by the embodiment of the application.
  • FIG. 7 is a schematic diagram of a fourth structure of a laminated board provided by an embodiment of the application.
  • FIG. 8 is a schematic diagram of a fifth structure of a laminated board provided by an embodiment of the application.
  • FIG. 9 is the third schematic diagram of the front structure of the laminated board provided by the embodiment of the application.
  • FIG. 10 is a schematic diagram of a sixth structure of a laminated board provided by an embodiment of the application.
  • FIG. 11 is a first structural diagram of a terminal device provided by an embodiment of this application.
  • FIG. 12 is a second structural diagram of a terminal device provided by an embodiment of this application.
  • this embodiment provides a laminated board 10, which includes a main board 11, a ring-shaped connecting board 12, and a sub board 13 that are laminated.
  • the side of the connection board 12 facing the main board 11 is provided with a first connection board pad 121 and a second connection board pad 122, and the side of the connection board 12 facing the secondary board 13 is provided with a third connection board pad 123 and a fourth connection.
  • the main board 11 is provided with a first main board pad 111 and a second main board pad 112.
  • the first main board pad 111 is opposite to and connected to the first connecting board pad 121
  • the second main board pad 112 is connected to the second connecting board pad 122. Relative and connected.
  • the sub-board 13 is provided with a first sub-board pad 131 and a second sub-board pad 132.
  • the first sub-board pad 131 and the third connecting board pad 123 are opposite and connected, and the second sub-board pad 132 is connected to the fourth
  • the connection pad 124 is opposite and connected.
  • the second connecting board pad 122 can be arranged on the inner edge of the connecting board 12 facing the main board 11, or it may be arranged in other positions, which is not limited here; the fourth connecting board pad 124 is arranged on the connecting board 12 facing the secondary board
  • the inner edge of side 13 can also be set in other positions, and there is no restriction here.
  • the connecting board 12 includes the inner side 1201 of the connecting board and the outer side 1202 of the connecting board.
  • the side of the connecting board 12 facing the main board 11 is marked as the lower side 1203 of the connecting board, and the connecting board 12 faces the auxiliary board.
  • One side of the plate 13 is marked as the upper side 1204 of the connecting plate, wherein the inner side 1201 of the connecting plate is opposite to the outer side 1202 of the connecting plate, and the lower side 1203 of the connecting plate is opposite to the upper side 1204 of the connecting plate.
  • the first connecting board pad 121 and the second connecting board pad 122 are both provided on the surface of the lower side 1203 of the connecting board, and the second connecting board pad 122 is close to the inner edge of the connecting board 1201.
  • the third connecting board pad 123 and the fourth connecting board pad 124 are both provided on the surface of the upper side 1204 of the connecting board, and the fourth connecting board pad 124 is close to the inner side 1201 edge of the connecting board.
  • a lower pad 141 is provided in the middle of the surface of the lower side 1203 of the connecting board
  • an upper pad 142 is provided in the middle of the surface of the upper side 1204 of the connecting board
  • the lower pad 141 is connected to the main board pad 110 provided on the surface of the main board 11.
  • the upper pad 142 is connected to the sub-board pad 130 provided on the surface of the sub-board 13.
  • the lower pad 141, the upper pad 142, the main board pad 110, and the sub-board pad 130 are all conventional pads, and the strength after soldering together is not high, and it is prone to cracking when subjected to stress, resulting in The connected pads are disconnected, and signal transmission between the main board 11 and the sub board 13 is not possible.
  • this embodiment proposes a completely different way, by adding pads on the upper and lower sides of the connecting plate 12 near the inner edge, and at the same time connecting the main board 11 and the auxiliary board 13 Pads are added at positions corresponding to the pads added to the board 12, so that the connection strength between the main board 11 and the connecting board 12, and between the connecting board 12 and the auxiliary board 13 can be effectively increased.
  • the first connection board pad 121 and the second connection board pad 122 are provided on the lower side 1203 of the connection board, and the first main board pad 111 and the second main board pad 112 are correspondingly provided on the main board 11. They are respectively connected to the first connection board pad 121 and the second connection board pad 122 mentioned above.
  • the connection between the main board 11 and the connection board 12 is made stronger, and it will not be under stress. Cracks occur, even if one of the pads is broken, there are other pads to realize the connection between the main board 11 and the connection board 12 and signal transmission.
  • the third connecting board pad 123 and the fourth connecting board pad 124 are provided on the upper side 1204 of the connecting board, and the first sub-board pad 131 and the second sub-board pad 132 are correspondingly provided on the sub board 13. They are respectively connected to the above-mentioned third connecting board pad 123 and fourth connecting board pad 124.
  • the connection between the sub-board 13 and the connecting board 12 is made firmer. Cracks will occur. Even if one of the pads is broken, there are other pads to realize the connection and signal transmission between the main board 11 and the sub board 13, so the electrical connection between the main board 11 and the sub board 13 is stable, and signal transmission can always be carried out .
  • the number of the first connection board pads 121 may be one, or may be more than two, which may be set as required.
  • the number of the first main board pads 111 corresponds to the number of the first connection board pads 121.
  • the number of the third connecting board pads 123 may be one, or two or more (for example, two), which can be set as required.
  • the number of the first sub-board pads 131 corresponds to the number of the third connection board pads 123. Since the connecting board 12 is a ring-shaped connecting board, the upper and lower surfaces are also ring-shaped surfaces.
  • the first connecting board pad 121, the second connecting board pad 122, the third connecting board pad 123, and the fourth The connecting board pads 124 are all ring-shaped pads, which are arranged along the ring-shaped surface of the connecting board 12.
  • the inner conductive layer 1205 is provided on the surface of the inner side 1201 of the connecting plate, and the inner conductive layer 1205 covers the entire surface of the inner side 1201 of the connecting plate, and its two ends are respectively connected to the second connecting plate pad 122 It is connected to the fourth connection board pad 142 to ensure that the second connection board pad 122 and the fourth connection board pad 142 are electrically connected.
  • the second connection board pad 122, the inner conductive layer 1205, and the fourth connection board pad 142 are integrally formed of electroplated copper, so that the production is simpler and more convenient, and the electrical connection is more stable.
  • the second main board pad 112 and the second connecting board pad 122 are soldered by solder paste 15, and the inner conductive layer 1205 is provided on the surface of the inner side 1201 of the connecting board, which helps to climb the tin during the soldering process.
  • the second main board pad 112 is simultaneously connected to the second connection board pad 122 and the inner conductive layer 1205 through the solder paste 15, and the soldering is stronger.
  • the second sub-board pad 132 and the fourth connecting board pad 124 are soldered by the solder paste 15, and the inner conductive layer 1205 is provided on the surface of the inner side 1201 of the connecting board, which helps to climb the tin during the soldering process.
  • the second sub-board pad 132 is simultaneously connected to the fourth connection board pad 124 and the inner conductive layer 1205 through the solder paste 15, so that the soldering is stronger.
  • the arrangement where the inner conductive layer 1205 is electrically connected to the second connecting board pad 122 and the fourth connecting board pad 124 can effectively prevent static electricity and electromagnetic interference, so that the main board 11 and the sub board 13 In the signal transmission path formed by the first main board pad 111, the first connecting board pad 121, the third connecting board pad 123 and the first sub-board pad 131, the signal will suffer less interference and signal transmission Higher quality.
  • the interconnected pads may be soldered by solder paste, or may be connected in other ways, and there is no limitation here.
  • the connecting board 12 is also provided with a fifth connecting board pad 125, which is provided on the outer edge of the connecting board 12 facing the main board 11 (that is, the edge of the lower side 1203 of the connecting board close to the outer side 1202 of the connecting board. );
  • the motherboard 11 is also provided with a third motherboard pad 113, and the third motherboard pad 113 is connected to the fifth connection board pad 125 correspondingly.
  • the main board 11 and the connecting board 12 are connected by at least three layers of pads, including the first connecting layer formed by connecting the second main board pad 112 on the inner layer and the second connecting board pad 122, and the first connecting layer in the middle.
  • the main board pad 111 is connected to the first connection board pad 121 to form a second connection layer
  • the third main board pad 113 on the outer layer is connected to the fifth connection board pad 125 to form a third connection layer, which effectively ensures that the main board 11 and The connecting plate 12 is firmly connected.
  • the outer conductive layer 1206 is provided on the outer surface of the connecting plate 12, and the outer conductive layer 1206 covers the entire surface of the outer side 1202 of the connecting plate, and one end of the outer conductive layer 1206 is connected to the fifth connecting plate pad 125 is connected to ensure that the fifth connection board pad 125 and the outer conductive layer 1206 are electrically connected.
  • the fifth connecting board pad 125 and the outer conductive layer 1206 are integrally formed of electroplated copper, so that the production is simpler and more convenient, and the electrical connection is more stable.
  • the fifth connecting board pad 125 and the third main board pad 113 are soldered by solder paste 15.
  • solder paste 15 By providing an outer conductive layer 1206 on the surface of the outer side 1202 of the connecting board, it helps to climb the tin during the soldering process.
  • the third main board pad 113 is simultaneously connected to the fifth connection board pad 125 and the outer conductive layer 1206 through the solder paste 15, and the soldering is stronger.
  • the arrangement of the outer conductive layer 1206 electrically connected to the fifth connecting board pad 125 can prevent static electricity and electromagnetic interference, so that the main board 11 and the sub board 13 pass through the first main board pad 111,
  • the signal transmission path formed by the first connection board pad 121, the third connection board pad 123, and the first sub-board pad 131 has less signal interference and higher signal transmission quality.
  • no pads are provided on one end edge of the auxiliary board 13 near the outer side 1202 of the connecting board.
  • the connecting board 12, the auxiliary board 13, the third connecting board pad 123 and the first A glue injection port is formed between the auxiliary board pads 131, through which glue is injected and filled between the auxiliary board 13, the outer side 1202 of the connecting board and the main board 11, so that the auxiliary board 13, the outer side 1202 of the connecting board and the main board can be filled
  • a sealing layer 1207 is formed between 11, which can play a good waterproof and stress buffer effect, thereby protecting the pad and preventing the pad from cracking due to stress.
  • the lower side 1203 of the connecting board may be provided with a fifth connecting board pad 125, so as to be connected to the third main board pad 113 through the fifth connecting board pad 125, or there may be no
  • the five connecting board pads 125 can be set as needed, and there is no restriction here.
  • the sealing layer 1207 can also be formed of other materials, and is not limited to the above-mentioned situation.
  • the connecting board 12 is further provided with a sixth connecting board pad 126, and the sixth connecting board pad 126 is provided on the outer edge of the connecting board 12 facing the side board 13 ( That is, the upper side 1204 of the connecting board is close to the edge of the outer side 1202 of the connecting board); at this time, the auxiliary board 13 is also provided with a third auxiliary board pad 133, and the third auxiliary board pad 133 is connected to the sixth connecting board pad 126 correspondingly.
  • the auxiliary board 13 and the connecting board 12 are connected by at least three layers of pads, including the first connecting layer formed by connecting the second auxiliary board pad 122 in the inner layer and the fourth connecting board pad 124, which is located in the middle.
  • the first sub-board pad 131 is connected to the third connecting board pad 123 to form a second connection layer, and the third sub-board pad 133 on the outer layer is connected to the sixth connecting board pad 126 to form a third connection layer, which effectively ensures Therefore, the auxiliary board 13 and the connecting board 12 are firmly connected.
  • the other end of the outer conductive layer 1206 is connected to the sixth connection board pad 126 to ensure that the sixth connection board pad 126 is electrically connected to the fifth connection board pad 125 through the outer conductive layer 1206.
  • the fifth connection board pad 125, the outer conductive layer 1206, and the sixth connection board pad 126 are integrally formed of electroplated copper, so that the production is simpler and more convenient, and the electrical connection is more stable.
  • the sixth connecting board pad 126 and the third sub-board pad 133 are soldered by solder paste 15.
  • solder paste 15 By providing an outer conductive layer 1206 on the surface of the outer side 1202 of the connecting board, it helps to climb the tin during the soldering process.
  • the third sub-board pad 133 is simultaneously connected to the sixth connection board pad 126 and the outer conductive layer 1206 through the solder paste 15, and the soldering is stronger.
  • the outer conductive layer 1206 is electrically connected to the fifth connection board pad 125 and the sixth connection board pad 126
  • the inner conductive layer 1205 is electrically connected to the second connection board pad 122 and the fourth connection board pad 124 , which forms two protective layers inside and outside, which can effectively prevent static electricity and electromagnetic interference, so that the main board 11 and the auxiliary board 13 pass through the first main board pad 111, the first connection board pad 121, and the third
  • the signal transmission path located between the above-mentioned two protective layers formed by the connecting board pad 123 and the first sub-board pad 131 has less signal interference and higher signal transmission quality.
  • the cross-sectional size of the main board 11 may be larger than the cross-sectional size of the connecting board 12.
  • the main board 11 is at least 0.3mm wider than the connection board 12 in both the length and width directions, so that a pad can be added at the place where the main board 11 is at least 0.15mm away from the outer side 1202 of the connection board (in this case, the third main board pad 113)
  • the size of the third main board pad 113 can be set as required.
  • the cross-sectional size of the sub-board 13 may be equal to or smaller than the cross-sectional size of the connecting board 12.
  • the auxiliary board 13 is at least 0.3mm wider than the connecting board 12 in both the length and width directions, so that pads can be added on the auxiliary board 13 at a position aligned with the outer side 1202 of the connecting board (this time refers to the third auxiliary board).
  • Pad 133 the size of the third sub-board pad 133 can be set as required.
  • the width of the second motherboard pad 112 and the third motherboard pad 113 is not less than 0.3mm (for example, it can be greater than 0.35mm), the widths of the second connecting board pad 122 and the fifth connecting board pad 125 are not less than 0.2mm, and the size of the pads added on the main board 11 is larger than the size of the pads corresponding to the connecting board 12. It helps to climb the tin on the inner side 1201 of the connecting board and the outer side 1202 of the connecting board during the welding process, making the connection between the main board 11 and the connecting board 12 more stable.
  • the widths of the second sub-board pad 132 and the third sub-board pad 133 are not less than 0.3mm
  • the width of the fourth and sixth connection board pads 124 and 126 are not less than 0.2mm
  • the sub-board The size of the pads added on 13 is larger than the size of the corresponding pads on the connecting board 12, which helps to climb the tin on the inner side 1201 of the connecting board and the outer side 1202 of the connecting board during the welding process, making the connection between the auxiliary board 13 and the connecting board 12 more stable .
  • the shape of the pad can be set according to needs, for example, its cross-section can be rectangular, square or circular, etc., which is not limited here.
  • the sizes of the main board 11, the connecting board 12, and the sub board 13 can also be other values, which are not limited here; the size of each pad can also be set as needed, and there is no limitation here.
  • the purpose of this embodiment is also to provide a terminal device 20, including the above-mentioned laminated board 10.
  • the terminal device 20 may be a mobile phone, a tablet computer or other devices, and there is no limitation here.
  • the terminal device 20 is provided with a accommodating space for accommodating the above-mentioned laminated board 10.
  • the main board 11 of the laminated board 10 can integrate the processor, storage unit, power management module, baseband chip and other electronic components of the terminal device 20.
  • the terminal device 20 also includes other components, such as electronic components such as batteries, microphones, and camera components, which are not fully listed here.
  • the terminal device 20 Since the terminal device 20 adopts the above-mentioned laminated board 10, it has better anti-static and anti-electromagnetic interference performance, and since the main board 11 and the secondary board 13 in the laminated board 10 are connected more stably, it will not happen when subjected to stress. Cracking, thereby effectively ensuring that the terminal device 20 has better performance.
  • FIG. 12 is a schematic structural diagram of a terminal device 20 according to an embodiment of the application.
  • the terminal device 20 may include a radio frequency (RF) circuit 501, a memory 502 including at least one computer-readable storage medium, an input unit 503, a display unit 504, a sensor 504, an audio circuit 506, and wireless fidelity (Wireless Fidelity).
  • RF radio frequency
  • WiFi wireless fidelity
  • a processor 508 including at least one processing core
  • power supply 509 power supply 509 and other components.
  • the structure of the terminal device 20 shown in FIG. 12 does not constitute a limitation on the terminal device 20, and may include more or less components than shown in the figure, or a combination of certain components, or a different component arrangement.
  • the radio frequency circuit 501 can be used for sending and receiving information, or receiving and sending signals during a call. In particular, after receiving the downlink information of the base station, it is processed by at least one processor 508; in addition, the uplink data is sent to the base station.
  • the radio frequency circuit 501 includes, but is not limited to, an antenna, at least one amplifier, a tuner, at least one oscillator, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, and a low noise amplifier (Low Noise Amplifier, LNA), duplexer, etc.
  • SIM Subscriber Identity Module
  • LNA Low Noise Amplifier
  • the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication.
  • the wireless communication can use any communication standard or protocol, including but not limited to Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (Code Division) Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), Email, Short Messaging Service (SMS), etc.
  • GSM Global System of Mobile Communication
  • GPRS General Packet Radio Service
  • CDMA Code Division Multiple Access
  • WCDMA Wideband Code Division Multiple Access
  • LTE Long Term Evolution
  • Email Short Messaging Service
  • the memory 502 can be used to store application programs and data.
  • the application program stored in the memory 502 contains executable code.
  • Application programs can be composed of various functional modules.
  • the processor 508 executes various functional applications and data processing by running application programs stored in the memory 502.
  • the memory 502 may mainly include a storage program area and a storage data area.
  • the storage program area may store an operating system, an application program required by at least one function (such as a sound playback function, an image playback function, etc.), etc.;
  • the data (such as audio data, phone book, etc.) created by the use of the terminal device 20, etc.
  • the memory 502 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state storage devices.
  • the memory 502 may further include a memory controller to provide the processor 508 and the input unit 503 to access the memory 502.
  • the input unit 503 can be used to receive inputted numbers, character information or user characteristic information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control.
  • the input unit 503 may include a touch-sensitive surface and other input devices.
  • a touch-sensitive surface also called a touch screen or a touchpad, can collect the user's touch operations on or near it (for example, the user uses any suitable objects or accessories such as fingers, stylus, etc.) on the touch-sensitive surface or on the touch-sensitive surface. Operation near the surface), and drive the corresponding connection device according to the preset program.
  • the touch-sensitive surface may include two parts: a touch detection device and a touch controller.
  • the touch detection device detects the user's touch position, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into contact coordinates, and then sends it To the processor 508, and can receive commands sent by the processor 508 and execute them.
  • the display unit 504 may be used to display information input by the user or information provided to the user and various graphical user interfaces of the terminal device 20. These graphical user interfaces may be composed of graphics, text, icons, videos, and any combination thereof.
  • the display unit 504 may include a display panel.
  • the display panel may be configured in the form of a liquid crystal display (Liquid Crystal Display, LCD), an organic light-emitting diode (Organic Light-Emitting Diode, OLED), etc.
  • the touch-sensitive surface may cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of the touch event, and then the processor 508 displays information based on the type of the touch event.
  • the corresponding visual output is provided on the display panel.
  • the touch-sensitive surface and the display panel are used as two independent components to realize the input and input functions, in some embodiments, the touch-sensitive surface and the display panel may be integrated to realize the input and output functions.
  • the display screen may include an input unit 503 and a display unit 504.
  • the terminal device 20 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors.
  • the light sensor may include an ambient light sensor and a proximity sensor.
  • the ambient light sensor can adjust the brightness of the display panel according to the brightness of the ambient light.
  • the proximity sensor can close the display panel and/or when the terminal device 20 is moved to the ear. Or backlight.
  • the gravity acceleration sensor can detect the magnitude of acceleration in various directions (usually three-axis), and can detect the magnitude and direction of gravity when it is stationary.
  • the terminal device 20 can also be configured with other sensors such as gyroscope, barometer, hygrometer, thermometer, infrared sensor, etc., here No longer.
  • the audio circuit 506 can provide an audio interface between the user and the terminal device 20 through a speaker and a microphone.
  • the audio circuit 506 can convert the received audio data into electrical signals, transmit them to the speakers, and then convert them into sound signals for output; on the other hand, the microphone converts the collected sound signals into electrical signals, which are converted into electrical signals after being received by the audio circuit 506.
  • the audio data is processed by the audio data output processor 508, and then sent to, for example, another terminal device 20 via the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing.
  • the audio circuit 506 may also include an earphone holder to provide communication between a peripheral earphone and the terminal device 20.
  • Wireless fidelity is a short-distance wireless transmission technology.
  • the terminal device 20 can help users send and receive e-mails, browse webpages, and access streaming media. It provides users with wireless broadband Internet access.
  • FIG. 12 shows the wireless fidelity module 507, it can be understood that it is not a necessary component of the terminal device 20 and can be omitted as needed without changing the essence of the invention.
  • the processor 508 is the control center of the terminal device 20, sometimes referred to as the main controller.
  • the processor 508 uses various interfaces and lines to connect the various parts of the entire terminal device 20, and runs or executes the application programs stored in the memory 502. , And call the data stored in the memory 502, execute various functions of the terminal device 20 and process data, so as to monitor the terminal device 20 as a whole.
  • the processor 508 may include one or more processing cores; optionally, the processor 508 may integrate an application processor and a modem processor, where the application processor mainly processes the operating system, user interface, and application programs. And so on, the modem processor mainly deals with wireless communication. It can be understood that the foregoing modem processor may not be integrated into the processor 508.
  • the terminal device 20 also includes a power supply 509 for supplying power to various components.
  • the power supply 509 may be logically connected to the processor 508 through a power management system, so that functions such as charging, discharging, and power consumption management can be managed through the power management system.
  • the power supply 509 may also include one or more DC or AC power supplies, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, and any other components.
  • the terminal device 20 may also include a Bluetooth module, etc., which will not be repeated here.
  • each of the above modules can be implemented as an independent entity, or can be combined arbitrarily, and implemented as the same or several entities.

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Abstract

本申请提供一种层叠板(10)及终端设备(20)，层叠板(10)包括主板(11)、呈环状的连接板(12)和副板(13)；连接板(12)的一侧设有第一连接板焊盘(121)和第二连接板焊盘(122)，连接板(12)的另一侧设有第三连接板焊盘(123)和第四连接板焊盘(124)；主板(11)设有第一主板焊盘(111)和第二主板焊盘(112)；副板(13)设有第一副板焊盘(131)和第二副板焊盘(132)；通过在连接板(12)的上下两侧增设焊盘，同时在主板(11)和副板(13)对应增设焊盘，可以有效增加主板(11)与连接板(12)、连接板(12)与副板(13)的连接强度。

Description

层叠板及终端设备
本申请要求于2019年04月23日在中华人民共和国专利局提交的、申请号为201910328837.1、发明名称为“一种层叠板及终端设备”的中华人民共和国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，更具体地说，是涉及一种层叠板及终端设备。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然构成现有技术。主板上通常集成了处理器、存储单元、基带芯片等电子元器件，是终端设备中非常重要的部件。为了使得终端设备可以具有更加丰富的功能，还可以在终端设备中设置副板，副板通过连接板与主板电性连接，以使得副板和主板之间可以进行信号通信。
目前主板和连接板之间、连接板和副板之间均采用常规焊盘的方式实现相互之间的连接，然而，在受到应力时焊盘之间很容易发生开裂，造成副板和主板之间形成开路，信号无法在主板和副板之间传递，影响终端设备的使用。
技术问题
本申请的目的在于提供一种层叠板及终端设备，以解决现有层叠板中主板和副板容易发生开裂的技术问题。
技术解决方案
为解决上述技术问题，本申请实施例采用的技术方案是：
第一方面，提供一种层叠板，包括依次层叠设置的主板、呈环状的连接板，以及副板；
所述连接板朝向所述主板的一侧设有第一连接板焊盘和第二连接板焊盘，所述连接板朝向所述副板的一侧设有第三连接板焊盘和第四连接板焊盘；
所述主板设有第一主板焊盘和第二主板焊盘，所述第一主板焊盘与所述第一连接板焊盘相对且连接，所述第二主板焊盘与所述第二连接板焊盘相对且连接；
所述副板设有第一副板焊盘和第二副板焊盘，所述第一副板焊盘与所述第三连接板焊盘相对且连接，所述第二副板焊盘与所述第四连接板焊盘相对且连接。
在一个实施例中，所述第二连接板焊盘设于所述连接板朝向所述主板一侧的内侧边缘，所述第四连接板焊盘设于所述连接板朝向所述副板一侧的内侧边缘；
所述连接板的内侧表面设有内导电层，所述内导电层与所述第二连接板焊盘和所述第二主板焊盘均连接，且所述内导电层与所述第四连接板焊盘和所述第二副板焊盘均连接。
在一个实施例中，所述第二连接板焊盘、所述内导电层以及所述第四连接板焊盘为电镀铜一体成型。
在一个实施例中，所述第二主板焊盘和所述第二连接板焊盘通过锡膏焊接，所述第二副板焊盘和所述第四连接板焊盘通过锡膏焊接。
在一个实施例中，所述连接板还设有第五连接板焊盘，所述第五连接板焊盘设于所述连接板朝向所述主板一侧的外侧边缘；
所述主板还设有第三主板焊盘，所述第三主板焊盘与所述第五连接板焊盘连接。
在一个实施例中，所述连接板的外侧表面设有外导电层，所述外导电层与所述第五连接板焊盘和所述第三主板焊盘均连接。
在一个实施例中，所述连接板还设有第六连接板焊盘，所述第六连接板焊盘设于所述连接板朝向所述副板一侧的外侧边缘；
所述副板还设有第三副板焊盘，所述第三副板焊盘与所述第六连接板焊盘连接；
所述第六连接板焊盘和所述第三副板焊盘均与所述外导电层连接。
在一个实施例中，所述副板的横截面尺寸大于所述连接板的横截面尺寸。
在一个实施例中，所述第五连接板焊盘、所述外导电层以及所述第六连接板焊盘为电镀铜一体成型。
在一个实施例中，所述第六连接板焊盘和所述第三副板焊盘通过锡膏焊接。
在一个实施例中，所述第五连接板焊盘和所述第三主板焊盘通过锡膏焊接。
在一个实施例中，所述主板、所述连接板的外侧表面以及所述副板之间围设有密封层。
在一个实施例中，所述副板的横截面尺寸不大于所述连接板的横截面尺寸。
在一个实施例中，所述主板的横截面尺寸大于所述连接板的横截面尺寸。
在一个实施例中，所述主板的长度比所述连接板至少宽0.3mm；所述主板的宽度比所述连接板至少宽0.3mm。
在一个实施例中，所述第一连接板焊盘、所述第二连接板焊盘、所述第三连接板焊盘以及所述第四连接板焊盘均为环状焊盘，所述第一连接板焊盘、所述第二连接板焊盘、所述第三连接板焊盘以及所述第四连接板焊盘均沿所述连接板的环状表面设置。
在一个实施例中，所述第二主板焊盘和所述第二副板焊盘的宽度不小于0.3mm，所述第二连接板焊盘和所述第四连接板焊盘的宽度不小于0.2mm。
第二方面，提供一种终端设备，包括上述的层叠板。
有益效果
本申请实施例提供的一种层叠板的有益效果至少包括：本申请在连接板下侧设置第一连接板焊盘和第二连接板焊盘，同时在主板上相应设置第一主板焊盘和第二主板焊盘，分别与上述的第一连接板焊盘和第二连接板焊盘对应连接，通过增设一组焊盘的方式，使得主板和连接板之间连接更加牢固，当受到应力时不会出现开裂。同时，本申请在连接板上侧设置第三连接板焊盘和第四连接板焊盘，同时在副板上相应设置第一副板焊盘和第二副板焊盘，分别与上述的 第三连接板焊盘和第四连接板焊盘对应连接，通过增设一组焊盘的方式，使得副板和连接板之间连接更加牢固，当受到应力时不会出现开裂，因而主板和副板之间电性连接稳定，始终可以进行信号的稳定传输。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为一个范例中的层叠板的结构示意图；
图2为本申请实施例提供的层叠板的正面结构示意图一；
图3为本申请实施例提供的层叠板的第一种结构示意图；
图4为本申请实施例提供的层叠板的第二种结构示意图；
图5为本申请实施例提供的层叠板的第三种结构示意图；
图6为本申请实施例提供的层叠板的正面结构示意图二；
图7为本申请实施例提供的层叠板的第四种结构示意图；
图8为本申请实施例提供的层叠板的第五种结构示意图；
图9为本申请实施例提供的层叠板的正面结构示意图三；
图10为本申请实施例提供的层叠板的第六种结构示意图；
图11为本申请实施例提供的终端设备的结构示意图一；
图12为本申请实施例提供的终端设备的结构示意图二。
本发明的实施方式
为了使本申请所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本申请进行详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。术语“第一”、“第二”仅用于便于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明技术特征的数量。当一个部件被称为“连接于”另一个部件，它可以是直接或者间 接连接至该另一个部件上。当部件被称为“固定于”或“设置于”另一个部件，它可以直接或者间接位于该另一个部件上。术语“上”、“下”、“左”、“右”、“前”、“后”等指示的方位或位置为基于附图所示的方位或位置，仅是为了便于描述，不能理解为对本技术方案的限制。
请参阅图2和图3，本实施例提供一种层叠板10，包括层叠设置的主板11、呈环状的连接板12，以及副板13。连接板12朝向主板11的一侧设有第一连接板焊盘121和第二连接板焊盘122，连接板12朝向副板13的一侧设有第三连接板焊盘123和第四连接板焊盘124。主板11设有第一主板焊盘111和第二主板焊盘112，第一主板焊盘111与第一连接板焊盘121相对且连接，第二主板焊盘112与第二连接板焊盘122相对且连接。副板13设有第一副板焊盘131和第二副板焊盘132，第一副板焊盘131与第三连接板焊盘123相对且连接，第二副板焊盘132与第四连接板焊盘124相对且连接。第二连接板焊盘122可以设于连接板12朝向主板11一侧的内侧边缘，也可以设于其他位置，此处不做限制；第四连接板焊盘124设于连接板12朝向副板13一侧的内侧边缘，也可以设于其他位置，此处不做限制。
请参阅图3，为了描述方便，在本实施例中，连接板12包括连接板内侧1201和连接板外侧1202，连接板12朝向主板11的一侧记为连接板下侧1203，连接板12朝向副板13的一侧记为连接板上侧1204，其中连接板内侧1201和连接板外侧1202相对，连接板下侧1203和连接板上侧1204相对。第一连接板焊盘121和第二连接板焊盘122均设于连接板下侧1203的表面，且第二连接板焊盘122靠近连接板内侧1201边缘。第三连接板焊盘123和第四连接板焊盘124均设于连接板上侧1204的表面，且第四连接板焊盘124靠近连接板内侧1201边缘。
请参阅图1，目前在将主板11和副板13通过连接板12电性连接时，主要是通过连接板12的相对两侧设置的焊盘分别与主板11和副板13连接来实现。例如连接板下侧1203的表面中部设有下侧焊盘141，连接板上侧1204的表面 中部设有上侧焊盘142，下侧焊盘141与主板11表面设置的主板焊盘110连接，上侧焊盘142与副板13表面设置的副板焊盘130连接。下侧焊盘141、上侧焊盘142、主板焊盘110和副板焊盘130均为常规焊盘，焊接在一起后的强度不高，当受到应力时很容易出现开裂等情况，从而导致连接在一起的焊盘断开，主板11和副板13之间无法进行信号传递。
请参阅图2和图3，本实施例则提出了一种完全不同的方式，通过在连接板12的上下两侧靠近内侧边缘的地方增设焊盘，同时在主板11和副板13上与连接板12增设的焊盘相对应的位置增设焊盘，从而可以有效增加主板11与连接板12之间、连接板12与副板13之间的连接强度。具体地，本实施例在连接板下侧1203设置第一连接板焊盘121和第二连接板焊盘122，同时在主板11上相应设置第一主板焊盘111和第二主板焊盘112，分别与上述的第一连接板焊盘121和第二连接板焊盘122对应连接，通过增设一组焊盘的方式，使得主板11和连接板12之间连接更加牢固，当受到应力时不会出现开裂，即使其中一个焊盘断裂，也有其它焊盘来实现主板11和连接板12之间的连接及信号传递。本实施例在连接板上侧1204设置第三连接板焊盘123和第四连接板焊盘124，同时在副板13上相应设置第一副板焊盘131和第二副板焊盘132，分别与上述的第三连接板焊盘123和第四连接板焊盘124对应连接，通过增设一组焊盘的方式，使得副板13和连接板12之间连接更加牢固，当受到应力时不会出现开裂，即使其中一个焊盘断裂，也有其它焊盘来实现主板11和副板13之间的连接及信号传递，因而主板11和副板13之间电性连接稳定，始终可以进行信号传递。
应当理解的是，第一连接板焊盘121的数量可以为一个，也可以为两个以上，可以根据需要进行设置。第一主板焊盘111的数量与第一连接板焊盘121的数量相对应。第三连接板焊盘123的数量可以为一个，也可以为两个以上(例如可以为两个)，可以根据需要进行设置。第一副板焊盘131的数量与第三连接板焊盘123的数量相对应。由于连接板12为环状连接板，因而上侧表面和下 侧表面也为环状表面，第一连接板焊盘121、第二连接板焊盘122、第三连接板焊盘123以及第四连接板焊盘124均为环状焊盘，其沿连接板12的环状表面设置。
请参阅图4，在一个实施例中，连接板内侧1201的表面设有内导电层1205，内导电层1205覆盖连接板内侧1201的整个表面，且其两端分别与第二连接板焊盘122和第四连接板焊盘142连接，从而确保第二连接板焊盘122和第四连接板焊盘142电性连接。可选地，第二连接板焊盘122、内导电层1205以及第四连接板焊盘142为电镀铜一体成型，从而制作更加简单方便，电性连接更加稳定。
在本实施例中，第二主板焊盘112和第二连接板焊盘122通过锡膏15焊接，通过在连接板内侧1201的表面设置内导电层1205，有助于在焊接过程中爬锡，此时第二主板焊盘112通过锡膏15同时与第二连接板焊盘122和内导电层1205连接，焊接更牢固。同理，第二副板焊盘132和第四连接板焊盘124通过锡膏15焊接，通过在连接板内侧1201的表面设置内导电层1205，有助于在焊接过程中爬锡，此时第二副板焊盘132通过锡膏15同时与第四连接板焊盘124和内导电层1205连接，焊接更牢固。不仅如此，内导电层1205与第二连接板焊盘122和第四连接板焊盘124均电性连接的设置，可以有效起到防静电和防电磁干扰的作用，使得主板11和副板13之间通过第一主板焊盘111、第一连接板焊盘121、第三连接板焊盘123以及第一副板焊盘131所形成的信号传递路径中信号所受到的干扰更小，信号传输质量更高。应当理解的是，在本实施例中，相互连接的焊盘之间均可以通过锡膏焊接，也可以通过其他方式连接，此处不做限制。
请参阅图5，在一个实施例中，为了增强主板11与连接板12之间的连接强度，可以增加两者之间连接焊盘的数量。例如，连接板12还设有第五连接板焊盘125，第五连接板焊盘125设于连接板12朝向主板11一侧的外侧边缘(即连接板下侧1203靠近连接板外侧1202的边缘)；此时主板11还设有第三主板 焊盘113，第三主板焊盘113与第五连接板焊盘125对应连接。此时主板11和连接板12之间至少通过三层焊盘连接，包括位于内层的第二主板焊盘112与第二连接板焊盘122连接形成的第一连接层，位于中间的第一主板焊盘111与第一连接板焊盘121连接形成第二连接层，位于外层的第三主板焊盘113与第五连接板焊盘125连接形成第三连接层，有效确保了主板11与连接板12连接牢固。
请参阅图6和图7，在一个实施例中，连接板12的外侧表面设有外导电层1206，外导电层1206覆盖连接板外侧1202的整个表面，且其一端与第五连接板焊盘125连接，从而确保第五连接板焊盘125和外导电层1206电性连接。可选地，第五连接板焊盘125以及外导电层1206为电镀铜一体成型，从而制作更加简单方便，电性连接更加稳定。
在本实施例中，第五连接板焊盘125和第三主板焊盘113通过锡膏15焊接，通过在连接板外侧1202的表面设置外导电层1206，有助于在焊接过程中爬锡，此时第三主板焊盘113通过锡膏15同时与第五连接板焊盘125和外导电层1206连接，焊接更牢固。不仅如此，外导电层1206与第五连接板焊盘125电性连接的设置，可以起到防静电和防电磁干扰的作用，使得主板11和副板13之间通过第一主板焊盘111、第一连接板焊盘121、第三连接板焊盘123以及第一副板焊盘131所形成的信号传递路径中信号所受到的干扰更小，信号传输质量更高。
请参阅图8，在一个实施例中，副板13靠近连接板外侧1202的一端边缘未设置焊盘，此时连接板12、副板13、相互连接的第三连接板焊盘123和第一副板焊盘131之间构成了一个注胶口，通过该注胶口在副板13、连接板外侧1202以及主板11之间注胶填充，从而可以在副板13、连接板外侧1202以及主板11之间围设形成密封层1207，可以起到良好的防水作用和应力缓冲作用，从而可以对焊盘起到保护作用，防止焊盘因应力而开裂。应当理解的是，在进行注胶时，连接板下侧1203可以设有第五连接板焊盘125，从而通过第五连接板焊盘125与第三主板焊盘113连接，也可以不设置第五连接板焊盘125，可根据需要 进行设置，此处不做限制。当然，密封层1207也可以由其他材料形成，并不仅限于上述的情形。
请参阅图9和图10，在一个实施例中，连接板12还设有第六连接板焊盘126，第六连接板焊盘126设于连接板12朝向副板13一侧的外侧边缘(即连接板上侧1204靠近连接板外侧1202的边缘)；此时副板13还设有第三副板焊盘133，第三副板焊盘133与第六连接板焊盘126对应连接。此时副板13和连接板12之间至少通过三层焊盘连接，包括位于内层的第二副板焊盘122与第四连接板焊盘124连接形成的第一连接层，位于中间的第一副板焊盘131与第三连接板焊盘123连接形成第二连接层，位于外层的第三副板焊盘133与第六连接板焊盘126连接形成第三连接层，有效确保了副板13与连接板12连接牢固。
在一个实施例中，外导电层1206的另一端与第六连接板焊盘126连接，从而确保第六连接板焊盘126通过外导电层1206与第五连接板焊盘125电性连接。可选地，第五连接板焊盘125、外导电层1206以及第六连接板焊盘126为电镀铜一体成型，从而制作更加简单方便，电性连接更加稳定。
在本实施例中，第六连接板焊盘126和第三副板焊盘133通过锡膏15焊接，通过在连接板外侧1202的表面设置外导电层1206，有助于在焊接过程中爬锡，此时第三副板焊盘133通过锡膏15同时与第六连接板焊盘126和外导电层1206连接，焊接更牢固。不仅如此，外导电层1206与第五连接板焊盘125和第六连接板焊盘126电性连接，内导电层1205与第二连接板焊盘122和第四连接板焊盘124电性连接，其形成了内外两层保护层，可以有效起到防静电和防电磁干扰的作用，使得主板11和副板13之间通过第一主板焊盘111、第一连接板焊盘121、第三连接板焊盘123以及第一副板焊盘131所形成的信号传递路径(位于上述的两层保护层之间)中信号所受到的干扰更小，信号传输质量更高。
请参阅图6，可选地，为了确保主板11与连接板12能够通过焊盘连接良好，主板11的横截面尺寸可以大于连接板12的横截面尺寸。例如，主板11在长度或宽度方向上均比连接板12至少宽0.3mm，从而可以在主板11距离连 接板外侧1202至少0.15mm处增加焊盘(此时指的是第三主板焊盘113)，第三主板焊盘113的尺寸可以根据需要进行设置。
可选地，请参阅图6和图7，当副板13上未设置第三副板焊盘133时，副板13的横截面尺寸可以等于或者小于连接板12的横截面尺寸，此时可以从整体上减小层叠板10的尺寸，一方面可以节省层叠板10所占用的终端设备20的空间，另一方面也便于进行注胶，密封过程更容易进行，密封效果更好。请参阅图9和图10，当副板13上设置第三副板焊盘133时，为了确保副板13与连接板12能够通过焊盘连接良好，副板13的横截面尺寸可以大于连接板12的横截面尺寸。例如，副板13在长度或宽度方向上均比连接板12至少宽0.3mm，从而可以在副板13上与连接板外侧1202对齐的位置处增加焊盘(此时指的是第三副板焊盘133)，第三副板焊盘133的尺寸可以根据需要进行设置。
请参阅图10，在一个实施例中，为了确保主板11和连接板12增设的焊盘能够连接稳固，第二主板焊盘112和第三主板焊盘113的宽度不小于0.3mm(例如可以大于0.35mm)，第二连接板焊盘122和第五连接板焊盘125的宽度不小于0.2mm，且主板11上增设的焊盘尺寸大于与连接板12上相对应的焊盘尺寸，从而有助于焊接过程中连接板内侧1201和连接板外侧1202爬锡，使得主板11和连接板12连接更加稳固。类似地，第二副板焊盘132和第三副板焊盘133的宽度不小于0.3mm，第四连接板焊盘124和第六连接板焊盘126的宽度不小于0.2mm，且副板13上增设的焊盘尺寸大于与连接板12上相对应的焊盘尺寸，从而有助于焊接过程中连接板内侧1201和连接板外侧1202爬锡，使得副板13和连接板12连接更加稳固。焊盘的形状可以根据需要进行设置，例如其截面可以是长方形，也可以是正方形或者圆形等，此处不做限制。
当然，在其他实施例中，主板11、连接板12以及副板13的尺寸还可以为其他值，此处不做限制；各焊盘的尺寸也可以根据需要进行设置，此处不做限制。
请参阅图11，本实施例的目的还在于提供一种终端设备20，包括上述的层 叠板10。终端设备20可以是手机，也可以是平板电脑或其他设备，此处不做限制。终端设备20内设有容置空间，用于容置上述的层叠板10，层叠板10的主板11上可以集成终端设备20的处理器、储存单元、电源管理模块、基带芯片等电子元器件。当然，终端设备20还包括其他部件，例如电池、麦克风以及摄像头组件等电子元器件，此处并未完全列出。由于终端设备20采用上述的层叠板10，因而其具有更好的防静电和防电磁干扰的性能，且由于层叠板10中主板11和副板13连接更加稳定，在遭受应力时也不会发生开裂，从而有效确保了终端设备20具有更好的使用性能。
参考图12，图12为本申请实施例提供的终端设备20的一种结构示意图。该终端设备20可以包括射频(Radio Frequency，RF)电路501、包括有至少一个计算机可读存储介质的存储器502、输入单元503、显示单元504、传感器504、音频电路506、无线保真(Wireless Fidelity，WiFi)模块507、包括有至少一个处理核心的处理器508以及电源509等部件。应当理解的是，图12中示出的终端设备20结构并不构成对终端设备20的限定，可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置。
射频电路501可用于收发信息，或通话过程中信号的接收和发送，特别地，将基站的下行信息接收后，交由至少一个处理器508处理；另外，将涉及上行的数据发送给基站。通常，射频电路501包括但不限于天线、至少一个放大器、调谐器、至少一个振荡器、用户身份模块(Subscriber Identity Module，SIM)卡、收发信机、耦合器、低噪声放大器(Low Noise Amplifier，LNA)、双工器等。此外，射频电路501还可以通过无线通信与网络和其他设备通信。该无线通信可以使用任一通信标准或协议，包括但不限于全球移动通信系统(Global System of Mobile communication，GSM)、通用分组无线服务(General Packet Radio Service，GPRS)、码分多址(Code Division Multiple Access，CDMA)、宽带码分多址(Wideband Code Division Multiple Access，WCDMA)、长期演进(Long Term Evolution，LTE)、电子邮件、短消息服务(Short Messaging  Service，SMS)等。
存储器502可用于存储应用程序和数据。存储器502存储的应用程序中包含有可执行代码。应用程序可以组成各种功能模块。处理器508通过运行存储在存储器502的应用程序，从而执行各种功能应用以及数据处理。存储器502可主要包括存储程序区和存储数据区，其中，存储程序区可存储操作系统、至少一个功能所需的应用程序(比如声音播放功能、图像播放功能等)等；存储数据区可存储根据终端设备20的使用所创建的数据(比如音频数据、电话本等)等。此外，存储器502可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件、闪存器件、或其他易失性固态存储器件。相应地，存储器502还可以包括存储器控制器，以提供处理器508和输入单元503对存储器502的访问。
输入单元503可用于接收输入的数字、字符信息或用户特征信息(比如指纹)，以及产生与用户设置以及功能控制有关的键盘、鼠标、操作杆、光学或者轨迹球信号输入。具体地，在一个具体的实施例中，输入单元503可包括触敏表面以及其他输入设备。触敏表面，也称为触摸显示屏或者触控板，可收集用户在其上或附近的触摸操作(比如用户使用手指、触笔等任何适合的物体或附件在触敏表面上或在触敏表面附近的操作)，并根据预先设定的程式驱动相应的连接装置。可选的，触敏表面可包括触摸检测装置和触摸控制器两个部分。其中，触摸检测装置检测用户的触摸方位，并检测触摸操作带来的信号，将信号传送给触摸控制器；触摸控制器从触摸检测装置上接收触摸信息，并将它转换成触点坐标，再送给处理器508，并能接收处理器508发来的命令并加以执行。
显示单元504可用于显示由用户输入的信息或提供给用户的信息以及终端设备20的各种图形用户接口，这些图形用户接口可以由图形、文本、图标、视频和其任意组合来构成。显示单元504可包括显示面板。可选的，可以采用液晶显示器(Liquid Crystal Display，LCD)、有机发光二极管(Organic  Light-Emitting Diode，OLED)等形式来配置显示面板。可选地，触敏表面可覆盖显示面板，当触敏表面检测到在其上或附近的触摸操作后，传送给处理器508以确定触摸事件的类型，随后处理器508根据触摸事件的类型在显示面板上提供相应的视觉输出。虽然在图12中，触敏表面与显示面板是作为两个独立的部件来实现输入和输入功能，但是在某些实施例中，可以将触敏表面与显示面板集成而实现输入和输出功能。可以理解的是，显示屏可以包括输入单元503和显示单元504。
终端设备20还可包括至少一种传感器505，比如光传感器、运动传感器以及其他传感器。具体地，光传感器可包括环境光传感器及接近传感器，其中，环境光传感器可根据环境光线的明暗来调节显示面板的亮度，接近传感器可在终端设备20移动到耳边时，关闭显示面板和/或背光。作为运动传感器的一种，重力加速度传感器可检测各个方向上(一般为三轴)加速度的大小，静止时可检测出重力的大小及方向，可用于识别手机姿态的应用(比如横竖屏切换、相关游戏、磁力计姿态校准)、振动识别相关功能(比如计步器、敲击)等；至于终端设备20还可配置的陀螺仪、气压计、湿度计、温度计、红外线传感器等其他传感器，在此不再赘述。
音频电路506可通过扬声器、传声器提供用户与终端设备20之间的音频接口。音频电路506可将接收到的音频数据转换成电信号，传输到扬声器，由扬声器转换为声音信号输出；另一方面，传声器将收集的声音信号转换为电信号，由音频电路506接收后转换为音频数据，再将音频数据输出处理器508处理后，经射频电路501以发送给比如另一终端设备20，或者将音频数据输出至存储器502以便进一步处理。音频电路506还可能包括耳机座，以提供外设耳机与终端设备20的通信。
无线保真(WiFi)属于短距离无线传输技术，终端设备20通过无线保真模块507可以帮助用户收发电子邮件、浏览网页和访问流式媒体等，它为用户提供了无线的宽带互联网访问。虽然图12示出了无线保真模块507，但是可以理 解的是，其并不属于终端设备20的必须构成，完全可以根据需要在不改变发明的本质的范围内而省略。
处理器508是终端设备20的控制中心，有时也可以称为主控制器，处理器508利用各种接口和线路连接整个终端设备20的各个部分，通过运行或执行存储在存储器502内的应用程序，以及调用存储在存储器502内的数据，执行终端设备20的各种功能和处理数据，从而对终端设备20进行整体监控。可选的，处理器508可包括一个或多个处理核心；可选地，处理器508可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作系统、用户界面和应用程序等，调制解调处理器主要处理无线通信。可以理解的是，上述调制解调处理器也可以不集成到处理器508中。
终端设备20还包括给各个部件供电的电源509。优选的，电源509可以通过电源管理系统与处理器508逻辑相连，从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。电源509还可以包括一个或一个以上的直流或交流电源、再充电系统、电源故障检测电路、电源转换器或者逆变器、电源状态指示器等任意组件。
尽管图12中未示出，但终端设备20还可以包括蓝牙模块等，在此不再赘述。具体实施时，以上各个模块可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个模块的具体实施可参见前面的方法实施例，在此不再赘述。
以上所述仅为本申请的可选实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本申请的保护范围之内。

Claims (18)

  1. 一种层叠板，其特征在于，包括依次层叠设置的主板、呈环状的连接板，以及副板；
    所述连接板朝向所述主板的一侧设有第一连接板焊盘和第二连接板焊盘，所述连接板朝向所述副板的一侧设有第三连接板焊盘和第四连接板焊盘；
    所述主板设有第一主板焊盘和第二主板焊盘，所述第一主板焊盘与所述第一连接板焊盘相对且连接，所述第二主板焊盘与所述第二连接板焊盘相对且连接；
    所述副板设有第一副板焊盘和第二副板焊盘，所述第一副板焊盘与所述第三连接板焊盘相对且连接，所述第二副板焊盘与所述第四连接板焊盘相对且连接。
  2. 如权利要求1所述的层叠板，其特征在于，所述第二连接板焊盘设于所述连接板朝向所述主板一侧的内侧边缘，所述第四连接板焊盘设于所述连接板朝向所述副板一侧的内侧边缘；
    所述连接板的内侧表面设有内导电层，所述内导电层与所述第二连接板焊盘和所述第二主板焊盘均连接，且所述内导电层与所述第四连接板焊盘和所述第二副板焊盘均连接。
  3. 如权利要求2所述的层叠板，其特征在于，所述第二连接板焊盘、所述内导电层以及所述第四连接板焊盘为电镀铜一体成型。
  4. 如权利要求2所述的层叠板，其特征在于，所述第二主板焊盘和所述第二连接板焊盘通过锡膏焊接，所述第二副板焊盘和所述第四连接板焊盘通过锡膏焊接。
  5. 如权利要求1所述的层叠板，其特征在于，所述连接板还设有第五连接板焊盘，所述第五连接板焊盘设于所述连接板朝向所述主板一侧的外侧边缘；
    所述主板还设有第三主板焊盘，所述第三主板焊盘与所述第五连接板焊盘连接。
  6. 如权利要求5所述的层叠板，其特征在于，所述连接板的外侧表面设有外导电层，所述外导电层与所述第五连接板焊盘和所述第三主板焊盘均连接。
  7. 如权利要求6所述的层叠板，其特征在于，所述连接板还设有第六连接板焊盘，所述第六连接板焊盘设于所述连接板朝向所述副板一侧的外侧边缘；
    所述副板还设有第三副板焊盘，所述第三副板焊盘与所述第六连接板焊盘连接；
    所述第六连接板焊盘和所述第三副板焊盘均与所述外导电层连接。
  8. 如权利要求7所述的层叠板，其特征在于，所述副板的横截面尺寸大于所述连接板的横截面尺寸。
  9. 如权利要求7所述的层叠板，其特征在于，所述第五连接板焊盘、所述外导电层以及所述第六连接板焊盘为电镀铜一体成型。
  10. 如权利要求7所述的层叠板，其特征在于，所述第六连接板焊盘和所述第三副板焊盘通过锡膏焊接。
  11. 如权利要求5所述的层叠板，其特征在于，所述第五连接板焊盘和所述第三主板焊盘通过锡膏焊接。
  12. 如权利要求5所述的层叠板，其特征在于，所述主板、所述连接板的外侧表面以及所述副板之间围设有密封层。
  13. 如权利要求12所述的层叠板，其特征在于，所述副板的横截面尺寸不大于所述连接板的横截面尺寸。
  14. 如权利要求1～13任一项所述的层叠板，其特征在于，所述主板的横截面尺寸大于所述连接板的横截面尺寸。
  15. 如权利要求14所述的层叠板，其特征在于，所述主板的长度比所述连接板至少宽0.3mm；所述主板的宽度比所述连接板至少宽0.3mm。
  16. 如权利要求1～13任一项所述的层叠板，其特征在于，所述第一连接板焊盘、所述第二连接板焊盘、所述第三连接板焊盘以及所述第四连接板焊盘均为环状焊盘，所述第一连接板焊盘、所述第二连接板焊盘、所述第三连接板焊 盘以及所述第四连接板焊盘均沿所述连接板的环状表面设置。
  17. 如权利要求1～13任一项所述的层叠板，其特征在于，所述第二主板焊盘和所述第二副板焊盘的宽度不小于0.3mm，所述第二连接板焊盘和所述第四连接板焊盘的宽度不小于0.2mm。
  18. 一种终端设备，其特征在于，包括如权利要求1～17任一项所述的层叠板。
PCT/CN2020/082773 2019-04-23 2020-04-01 层叠板及终端设备 WO2020216029A1 (zh)

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