CN1960600A - 印刷电路板 - Google Patents
印刷电路板 Download PDFInfo
- Publication number
- CN1960600A CN1960600A CNA200510101029XA CN200510101029A CN1960600A CN 1960600 A CN1960600 A CN 1960600A CN A200510101029X A CNA200510101029X A CN A200510101029XA CN 200510101029 A CN200510101029 A CN 200510101029A CN 1960600 A CN1960600 A CN 1960600A
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- pad
- crystal oscillator
- circuit board
- clock generator
- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10075—Non-printed oscillator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
一印刷电路板,包括一信号层、一位于信号层下方的电源层和一接地层,所述信号层上设有一晶振焊盘、一时钟发生器芯片焊盘以及两个电容焊盘,两条信号线将所述晶振焊盘和所述时钟发生器芯片焊盘连接在一起,所述信号线还将所述晶振焊盘和所述两个电容焊盘连接在一起,所述电源层被一电源分割线分割为具有不同电压两个电源区域,所述电源分割线位于所述晶振焊盘和时钟发生器芯片焊盘的一侧。
Description
【技术领域】
本发明涉及一印刷电路板,尤其是一种提高晶振频率稳定性的印刷电路板。
【背景技术】
石英晶体振荡器简称晶振是高精度和高稳定度的振荡器,被广泛应用于电视、计算机、遥控器等各类振荡电路中,以及在通信系统中用作频率发生器、为数据处理设备产生时钟信号和为特定系统提供基准信号。由于晶振具有小型化、高精度、高稳定度、低噪声、高频化、低功耗、快速启动等特点,还被应用于计算机主板上,与系统时钟发生器芯片连接在一起,晶振产生高频脉冲波,输入到时钟发生器芯片内,经过整形与分频,然后提供计算机所需要的各种频率。
如图1所示,一现有印刷电路板的信号层1’上设有一晶振焊盘11’,邻近所述晶振焊盘11’设有一时钟发生器芯片焊盘12’,所述晶振焊盘11’与所述时钟发生器芯片焊盘12’之间设有两个电容焊盘14’和15’。所述晶振焊盘11’具有两个过孔111’和112’,用来插接晶振(图未示)的两个引脚,晶振为插接式元件。从所述过孔111’和112’引出的两条信号线17’和16’分别经过电容焊盘14’和15’连接至所述时钟发生器芯片焊盘12’。所述信号线16’和17’的线宽约为5mil。所述印刷电路板1的电源层位于信号层下方并被电源分割线31’分割为具有不同电源电压的区域,所述电源分割线31’位于所述晶振焊盘11’的正下方,两种不同电源电压会对晶振的工作造成干扰,使晶振的频率不稳定,从而影响计算机系统的时钟频率。
【发明内容】
有鉴于此,有必要提供一种能提高晶振频率稳定性的印刷电路板。
一印刷电路板,包括一信号层、一位于信号层下方的电源层和一接地层,所述信号层上设有一晶振焊盘、一时钟发生器芯片焊盘以及两个电容焊盘,两条信号线将所述晶振焊盘和所述时钟发生器芯片焊盘连接在一起,所述信号线还将所述晶振焊盘和所述两个电容焊盘连接在一起,所述电源层被一电源分割线分割为具有不同电压两个电源区域,所述电源分割线位于所述晶振焊盘和时钟发生器芯片焊盘的一侧。
相较现有技术,所述印刷电路板上晶振工作频率具有较高的稳定性。
【附图说明】
下面结合附图及具体实施方式对本发明作进一步的详细说明。
图1是现有技术印刷电路板信号层以及电源分割线的结构图。
图2是石英晶体振荡器的电路原理图。
图3是本发明印刷电路板的截面图。
图4是本发明印刷电路板信号层以及电源分割线较佳实施方式的结构图。
【具体实施方式】
请参考图2,石英晶体振荡器的电路包括一晶振20、一时钟发生器芯片30、两个接地滤波电容40和50。所述晶振20与时钟发生器芯片30相连,且所述晶振20的两端分别连接所述接地滤波电容40和50。所述晶振20将会产生一系列高频脉冲波,这些原始的脉冲波再输入到时钟发生器芯片30内,经过整形与分频,然后分配给计算机需要的各种频率。
再请参考图3,一印刷电路板包括上下两信号层1、一电源层2和一接地层3。
请继续参考图4,所述印刷电路板的信号层1上设有一晶振焊盘11、一时钟发生器芯片焊盘12以及两个电容焊盘14和15。所述两个电容焊盘14和15位于晶振焊盘11和时钟发生器芯片焊盘12之间。所述晶振焊盘11具有两个过孔111和112,所述电容焊盘14具有两个小焊盘141和142,所述电容焊盘15也具有两个小焊盘151和152。所述时钟发生器芯片焊盘12由两排若干个小焊盘组成。两条信号线16和17分别连接所述晶振焊盘11的过孔112、111和所述时钟发生器芯片焊盘12的两个小焊盘,所述信号线16和17还分别经过所述电容焊盘14和15的小焊盘141和151。所述电容焊盘14和15的另一小焊盘142和152经由信号线接地。所述印刷电路板信号层1下方的电源层2被一电源分割线31分成两个电源区域,所述电源分割线31位于所述晶振焊盘11和时钟发生器焊盘12下方的一侧。所述信号线16和17的线宽约为10mil。
由于所述印刷电路板电源层3的电源分割线31绕开了所述晶振焊盘11,且所述信号线16和17的线宽达到10mil,因此当所述印刷电路板1上安装晶振进行工作后,所述晶振的工作频率的稳定性得到很大的提高。
Claims (4)
1.一印刷电路板,包括一信号层、一位于信号层下方的电源层和一接地层,所述信号层上设有一晶振焊盘、一时钟发生器芯片焊盘以及两个电容焊盘,两条信号线将所述晶振焊盘和所述时钟发生器芯片焊盘连接在一起,所述信号线还将所述晶振焊盘和所述两个电容焊盘连接在一起,所述电源层被一电源分割线分割为具有不同电压两个电源区域,其特征在于:所述电源分割线位于所述晶振焊盘和时钟发生器芯片焊盘的一侧。
2.如权利要求1所述的印刷电路板,其特征在于:所述两条信号线的线宽约为10mil。
3.如权利要求1所述的印刷电路板,其特征在于:所述晶振焊盘设有两个过孔,所述两条信号线从所述过孔引出。
4.如权利要求1所述的印刷电路板,其特征在于:每一电容焊盘设有两个小焊盘,所述两条信号线分别经过每一电容焊盘的一个小焊盘,每一电容焊盘的另一小焊盘经由信号线接地。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200510101029XA CN100490604C (zh) | 2005-11-04 | 2005-11-04 | 印刷电路板 |
US11/309,629 US7449969B2 (en) | 2005-11-04 | 2006-09-01 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200510101029XA CN100490604C (zh) | 2005-11-04 | 2005-11-04 | 印刷电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1960600A true CN1960600A (zh) | 2007-05-09 |
CN100490604C CN100490604C (zh) | 2009-05-20 |
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Application Number | Title | Priority Date | Filing Date |
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CNB200510101029XA Expired - Fee Related CN100490604C (zh) | 2005-11-04 | 2005-11-04 | 印刷电路板 |
Country Status (2)
Country | Link |
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US (1) | US7449969B2 (zh) |
CN (1) | CN100490604C (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101431860B (zh) * | 2007-11-07 | 2010-07-28 | 英业达股份有限公司 | 时脉产生器 |
CN101976543A (zh) * | 2009-12-31 | 2011-02-16 | 四川虹欧显示器件有限公司 | 驱动控制电路模组及其等离子显示屏 |
CN103716981A (zh) * | 2013-12-30 | 2014-04-09 | 惠州Tcl家电集团有限公司 | 稳定时钟信号的pcb及其布线方法 |
CN106879168A (zh) * | 2017-04-24 | 2017-06-20 | 广东欧珀移动通信有限公司 | 一种印刷电路板、pcba板以及电子设备 |
CN112739052A (zh) * | 2020-12-02 | 2021-04-30 | 上海伟世通汽车电子系统有限公司 | 一种pcb板晶振布线方法 |
WO2021139705A1 (zh) * | 2020-01-07 | 2021-07-15 | Oppo广东移动通信有限公司 | 晶体振荡装置、射频模组和电子设备 |
CN114040566A (zh) * | 2021-11-15 | 2022-02-11 | 无锡江南计算技术研究所 | 一种针对电源模块噪声抑制的pcb电路板 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111182714B (zh) * | 2020-01-17 | 2021-02-12 | 西安联飞智能装备研究院有限责任公司 | 无人机电路布设结构 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW483293B (en) | 2000-11-10 | 2002-04-11 | Via Tech Inc | Circuit daughter board and circuit board structure for stabilizing power source and strengthening grounding |
FI20002682A0 (fi) * | 2000-12-07 | 2000-12-07 | Micro Analog Syst Oy | Menetelmä kideoskillaattorin valmistamiseksi ja kideoskillaattori |
KR20030055681A (ko) * | 2001-12-27 | 2003-07-04 | 삼성전기주식회사 | 온도보상형 수정발진기 및 그 제조방법 |
JP2005223395A (ja) * | 2004-02-03 | 2005-08-18 | Toyo Commun Equip Co Ltd | 高安定圧電発振器 |
JP4707095B2 (ja) * | 2005-05-09 | 2011-06-22 | ルネサスエレクトロニクス株式会社 | 半導体回路 |
-
2005
- 2005-11-04 CN CNB200510101029XA patent/CN100490604C/zh not_active Expired - Fee Related
-
2006
- 2006-09-01 US US11/309,629 patent/US7449969B2/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101431860B (zh) * | 2007-11-07 | 2010-07-28 | 英业达股份有限公司 | 时脉产生器 |
CN101976543A (zh) * | 2009-12-31 | 2011-02-16 | 四川虹欧显示器件有限公司 | 驱动控制电路模组及其等离子显示屏 |
CN101976543B (zh) * | 2009-12-31 | 2013-03-20 | 四川虹欧显示器件有限公司 | 驱动控制电路模组及其等离子显示屏 |
CN103716981A (zh) * | 2013-12-30 | 2014-04-09 | 惠州Tcl家电集团有限公司 | 稳定时钟信号的pcb及其布线方法 |
CN103716981B (zh) * | 2013-12-30 | 2017-11-17 | 惠州Tcl家电集团有限公司 | 稳定时钟信号的pcb及其布线方法 |
CN106879168A (zh) * | 2017-04-24 | 2017-06-20 | 广东欧珀移动通信有限公司 | 一种印刷电路板、pcba板以及电子设备 |
WO2021139705A1 (zh) * | 2020-01-07 | 2021-07-15 | Oppo广东移动通信有限公司 | 晶体振荡装置、射频模组和电子设备 |
CN112739052A (zh) * | 2020-12-02 | 2021-04-30 | 上海伟世通汽车电子系统有限公司 | 一种pcb板晶振布线方法 |
CN114040566A (zh) * | 2021-11-15 | 2022-02-11 | 无锡江南计算技术研究所 | 一种针对电源模块噪声抑制的pcb电路板 |
Also Published As
Publication number | Publication date |
---|---|
CN100490604C (zh) | 2009-05-20 |
US20070103246A1 (en) | 2007-05-10 |
US7449969B2 (en) | 2008-11-11 |
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