WO2021125160A1 - 感光性樹脂組成物、隔壁、有機電界発光素子、及び画像表示装置 - Google Patents

感光性樹脂組成物、隔壁、有機電界発光素子、及び画像表示装置 Download PDF

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WO2021125160A1
WO2021125160A1 PCT/JP2020/046715 JP2020046715W WO2021125160A1 WO 2021125160 A1 WO2021125160 A1 WO 2021125160A1 JP 2020046715 W JP2020046715 W JP 2020046715W WO 2021125160 A1 WO2021125160 A1 WO 2021125160A1
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PCT/JP2020/046715
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French (fr)
Japanese (ja)
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麗華 裴
良尚 沢井
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三菱ケミカル株式会社
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Priority to CN202080087556.2A priority Critical patent/CN114846405A/zh
Priority to JP2021565586A priority patent/JPWO2021125160A1/ja
Priority to KR1020227017747A priority patent/KR20220119011A/ko
Publication of WO2021125160A1 publication Critical patent/WO2021125160A1/ja

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Definitions

  • the present invention relates to an image display device including a photosensitive resin composition, a partition wall obtained by curing the photosensitive resin composition, an organic electroluminescent element provided with a partition wall, and an organic electroluminescent element.
  • an organic electroluminescent element included in an organic electric field display or the like has been manufactured by forming a partition wall (bank) on a substrate and then laminating various functional layers in a region surrounded by the partition wall. ..
  • a method for easily forming such a partition wall a method of forming such a partition wall by a photolithography method using a photosensitive resin composition is known.
  • an ink containing the material constituting the functional layer is prepared, and then the prepared ink is injected into the region surrounded by the partition wall.
  • the inkjet method is often adopted because it is easy to accurately inject a predetermined amount of ink into a predetermined location.
  • the partition wall is ink-repellent (for the purpose of preventing the ink from adhering to the partition wall and preventing the inks injected between adjacent regions from being mixed with each other. It may be required to impart liquid repellency).
  • a method has been proposed in which the film thickness in the pixel region arranged in the second partition wall is uniformly controlled by applying the layer. Further, as a method for forming the first partition wall and the second partition wall, a method of collectively forming the first partition wall and the second partition wall having different heights by applying masks having different transmittances (halftone mask) has been proposed. There is.
  • Patent Document 2 by using a photosensitive resin composition containing a specific alkali-soluble resin, it is possible to form a partition wall having both a fine line pattern and a fine contact hole. It is described that sufficient ink repellency can be imparted to the partition wall by using a photopolymerization initiator. Further, Patent Document 3 describes that a spacer having desired elastic properties can be formed by using a photosensitive resin composition containing a specific polymer and a specific photopolymerization initiator.
  • Patent Document 1 describes that an organic light emitting layer having a uniform film thickness can be applied by controlling the liquid repellency of the first partition wall and the second partition wall, it is specific to control the step. There is no description about the method, and there is no description about the compatibility between the step and the inkjet coating property. Further, as a result of examination by the present inventors, it was found that it is difficult to achieve both control of the step and inkjet coating property with the photosensitive resin composition described in Patent Document 2. Patent Document 3 does not describe any liquid repellent, and it is unclear what kind of characteristics the liquid repellent will exhibit when the liquid repellent is used.
  • an object of the present invention is to provide a photosensitive resin composition capable of achieving both control of a step and ink jet coatability.
  • the present invention also provides an image display device including a partition wall obtained by curing a photosensitive resin composition, an organic electroluminescent device provided with the partition wall, and an organic electroluminescent device.
  • the gist of the present invention is as follows.
  • a photosensitive resin composition containing (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, and (D) a liquid repellent.
  • the photopolymerization initiator (A) contains a photopolymerization initiator represented by the following general formula (I).
  • a photosensitive resin composition, wherein the liquid repellent (D) contains an acrylic resin (D1) containing a repeating unit represented by the following general formula (II) and a fluorine atom.
  • R 1a represents an alkyl group which may have a substituent or an aromatic ring group which may have a substituent.
  • R 2a represents an alkyl group.
  • R 3a represents a monovalent substituent.
  • n 0 or 1.
  • h an integer of 0 to 2.
  • R 11 independently represents a hydrogen atom or a methyl group
  • R 3a is R 4a- O- (where R 4a is an alkyl group which may have a substituent or an aromatic ring which may have a substituent.
  • R e represents a hydrogen atom or a methyl group, gamma is a single bond, -CO-, may have a substituent group alkylene group, or may have a substituent group 2 Represents a valent cyclic hydrocarbon group.
  • the benzene ring in the formula (iii) may be further substituted with any substituent. * Represents a bond.
  • [7] The photosensitive resin composition according to any one of [1] to [6], which is used for forming a partition wall.
  • [8] The photosensitive resin composition according to [7], which is used for collectively forming partition walls having steps by a photolithography method.
  • a partition wall obtained by curing the photosensitive resin composition according to any one of [1] to [8].
  • An organic electroluminescent device including the partition wall according to [9].
  • An image display device including the organic electroluminescent device according to [10].
  • FIG. 1 is a plan view showing an example of a substrate provided with a partition wall having a step.
  • FIG. 2 is a cross-sectional view showing an example of a substrate provided with a partition wall having a step.
  • the present invention will be described in detail. The following description is an example of an embodiment of the present invention, and the present invention is not specified thereto unless the gist thereof is exceeded.
  • “(meth) acrylic” means “acrylic and / or methacryl”.
  • the “total solid content” means all components other than the solvent in the photosensitive resin composition.
  • the numerical range represented by using "-” means a range including the numerical values before and after "-" as the lower limit value and the upper limit value.
  • “A and / or B” means one or both of A and B, and specifically, A, B, or A and B.
  • the "(co) polymer” means that both a homopolymer and a copolymer are included, and the term “polybasic acid (anhydrous)" is used. , "Polybasic acid and / or polybasic acid anhydride”.
  • the weight average molecular weight means the polystyrene-equivalent weight average molecular weight (Mw) by GPC (gel permeation chromatography).
  • the acid value represents the acid value in terms of effective solid content and is calculated by neutralization titration.
  • the partition wall material refers to a bank material, a wall material, and a wall material, and similarly, the partition wall material refers to a bank, a wall, and a wall.
  • the light emitting portion refers to a portion that emits light when electrical energy is applied.
  • the photosensitive resin composition of the present invention contains (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, and (D) a liquid repellent.
  • the photopolymerization initiator contains a photopolymerization initiator represented by the general formula (I) described later, and (D) the liquid repellent agent is a repeating unit and fluorine represented by the general formula (II) described later.
  • the photosensitive resin composition of the present invention may further contain other components, if necessary, and may contain, for example, an ultraviolet absorber or a polymerization inhibitor.
  • the partition wall is for partitioning the functional layer (organic layer, light emitting portion) in the active drive type organic electroluminescent element, and for example, the functional layer is configured in the partitioned region (pixel region). It is used to form pixels including a functional layer and a partition wall by ejecting and drying ink, which is a material for producing ink.
  • the photosensitive resin composition of the present invention contains (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, and (D) a liquid repellent.
  • Photopolymerization Initiator The photosensitive resin composition of the present invention contains (A) a photopolymerization initiator.
  • the photopolymerization initiator is a compound that polymerizes the ethylenically unsaturated bond of the (C) photopolymerizable compound with active light.
  • the photopolymerization initiator (A) in the photosensitive resin composition of the present invention may be referred to as a photopolymerization initiator represented by the following general formula (I) (hereinafter, "photopolymerization initiator (a1)”. ) Is contained.
  • R 1a represents an alkyl group which may have a substituent or an aromatic ring group which may have a substituent.
  • R 2a represents an alkyl group.
  • R 3a represents a monovalent substituent.
  • n represents 0 or 1.
  • h represents an integer of 0 to 2.
  • the photopolymerization initiator (a1) Since the photopolymerization initiator (a1) has a sulfide skeleton, the surface curability is appropriate and it is easy to form a desired step. Therefore, it is considered that the organic light emitting layer can be uniformly applied on the second partition wall adjacent to the pixel region in a line shape. Further, since R 2a, which is a radical generation site, is an alkyl group, the mobility of the generated radical is large, and the liquid repellent can be sufficiently retained even on the side surface of the line-shaped first partition wall adjacent to the second partition wall. It is considered that the ink can be prevented from riding on the first partition wall at the time of application.
  • the alkyl group in R 1a in the above formula (I) may be linear, branched, cyclic, or a bond thereof.
  • the number of carbon atoms of the alkyl group is not particularly limited, but is usually 1 or more, preferably 20 or less, more preferably 10 or less, further preferably 6 or less, still more preferably 2 or less.
  • 1 to 20 is preferable
  • 1 to 10 is more preferable
  • 1 to 6 is further preferable
  • 1 to 2 is particularly preferable.
  • the internal curability tends to be high.
  • alkyl group examples include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, an isopentyl group, a hexyl group, a cyclopentyl group, a cyclohexyl group, a cyclopentylmethyl group, a cyclopentylethyl group, a cyclohexylmethyl group and a cyclohexylethyl group.
  • a methyl group, a hexyl group, an isopentyl group, a cyclopentylmethyl group, and a cyclohexylmethyl group are preferable, and a methyl group is more preferable.
  • Examples of the substituent that the alkyl group may have include an aromatic ring group, a hydroxyl group, and a carboxy group, and from the viewpoint of easiness of synthesis, no substitution is preferable.
  • Examples of the aromatic ring group in R 1a in the above formula (I) include an aromatic hydrocarbon ring group and an aromatic heterocyclic group.
  • the number of carbon atoms of the aromatic ring group is not particularly limited, but 4 or more is preferable, 5 or more is more preferable, 30 or less is preferable, 20 or less is more preferable, and 12 or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 30 is preferable, 5 to 20 is more preferable, and 5 to 12 is further preferable.
  • the solubility in a solvent tends to be good.
  • the internal curability tends to be high.
  • Examples of the aromatic ring group include a phenyl group, a naphthyl group, a pyridyl group, and a frill group. Among these, a phenyl group and a naphthyl group are preferable, and a phenyl group is more preferable from the viewpoint of developability.
  • Examples of the substituent that the aromatic ring group may have include a hydroxyl group and an alkyl group, and an alkyl group is preferable from the viewpoint of developability. Among these, from the viewpoint of internal curability, R 1a is preferably an alkyl group which may have a substituent.
  • the alkyl group in R 2a in the above formula (I) may be linear, branched, cyclic, or a bond thereof.
  • the number of carbon atoms of the alkyl group is not particularly limited, but is usually 1 or more, preferably 5 or less, more preferably 3 or less, still more preferably 2 or less.
  • 1 to 5 is preferable, 1 to 3 is more preferable, and 1 to 2 is further preferable.
  • the internal curability tends to be high.
  • alkyl group examples include a methyl group, an ethyl group, a propyl group and a pentyl group, and among these, a methyl group is preferable from the viewpoint of internal curability.
  • R 4a examples include an alkyl group which may have a substituent and an aromatic ring group which may have a substituent.
  • the alkyl group in R 4a may be linear, branched, cyclic, or bonded.
  • the number of carbon atoms of the alkyl group is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 8 or less, more preferably 5 or less, still more preferably 3 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 8 is preferable, 1 to 5 is more preferable, 1 to 3 is further preferable, and 2 to 3 is particularly preferable.
  • synthesis tends to be easy. Further, when the value is not more than the upper limit value, the developability tends to be improved.
  • Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, and a pentyl group. Among these, a methyl group and an ethyl group are preferable, and an ethyl group is more preferable, from the viewpoint of developability.
  • Examples of the substituent that the alkyl group may have include a hydroxyl group and a carboxy group, and a hydroxyl group is preferable from the viewpoint of developability.
  • Examples of the aromatic ring group in R 4a include an aromatic hydrocarbon ring group and an aromatic heterocyclic group.
  • the number of carbon atoms of the aromatic ring group is not particularly limited, but is usually 4 or more, preferably 5 or more, preferably 30 or less, more preferably 20 or less, and even more preferably 12 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 30 is preferable, 5 to 20 is more preferable, and 5 to 12 is further preferable.
  • the value is equal to or higher than the lower limit, synthesis tends to be easy. Further, when the value is not more than the upper limit value, the developability tends to be improved.
  • the aromatic ring group examples include a phenyl group, a naphthyl group, a thienyl group, a frill group, a benzothienyl group and a benzofuryl group.
  • a benzothienyl group and a benzofuryl group are preferable, and a benzofuryl group is more preferable.
  • the substituent that the aromatic ring group may have include an alkyl group, a hydroxyl group, and a carboxy group, which are preferably unsubstituted from the viewpoint of syntheticity.
  • n 0 or 1. From the viewpoint of appropriate internal curability, n is preferably 1. From the viewpoint of ease of synthesis, n is preferably 0.
  • h represents an integer of 0 to 2. From the viewpoint of developability, h is preferably 0 or 1, and more preferably 1.
  • the substitution position of R 3a is not particularly limited, but from the viewpoint of synthesis, the o-position or the p-position is preferable, and the p-position is more preferable.
  • Specific examples of the known compound of the photopolymerization initiator (a1) include the following.
  • the compound represented by the formula (a1-3) is preferable from the viewpoint of appropriate internal curability.
  • the photopolymerization initiator (A) in the photosensitive resin composition of the present invention may be referred to as a photopolymerization initiator other than the photopolymerization initiator (a1) (hereinafter, "other photopolymerization initiator (a2)"). .) May be further included.
  • the other photopolymerization initiator (a2) a photopolymerization initiator usually used in this field can be used.
  • photopolymerization initiators examples include hexaarylbiimidazole-based photopolymerization initiators, acylphosphine oxide-based photopolymerization initiators, oxime ester-based photopolymerization initiators other than the photopolymerization initiator (a1), and triazine-based photopolymerization initiators. Examples thereof include a photopolymerization initiator, an acetophenone-based photopolymerization initiator, and a benzophenone-based photopolymerization initiator.
  • the hexaarylbiimidazole-based photopolymerization initiator is represented by the following general formula (1-1) and / or the following general formula (1-2) from the viewpoint of absorbance and sensitivity and matching with the absorption wavelength of the ultraviolet absorber.
  • the hexaarylbiimidazole-based compound represented is preferable.
  • R 11 to R 13 represent an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom, and m, n, and l are independently integers of 0 to 5 respectively. Represents.
  • the number of carbon atoms of the alkyl group of R 11 to R 13 is not particularly limited as long as it is 1 to 4, but from the viewpoint of sensitivity, it is preferably 1 to 3, more preferably 1 to 2.
  • the alkyl group may be chain-like or cyclic. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group and an isopropyl group, and among them, a methyl group and an ethyl group are preferable.
  • the number of carbon atoms of the alkoxy groups of R 11 to R 13 is not particularly limited as long as it is 1 to 4, but from the viewpoint of sensitivity, it is preferably 1 to 3, more preferably 1 to 2.
  • the alkyl group portion of the alkoxy group may be chain-like or cyclic. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, an isopropyloxy group and a butoxy group, and among them, a methoxy group and an ethoxy group are preferable.
  • halogen atoms of R 11 to R 13 include chlorine atom, iodine atom, bromine atom, and fluorine atom. Among them, chlorine atom and fluorine atom are preferable, and chlorine atom is more preferable from the viewpoint of easiness of synthesis. preferable. Among these, from the viewpoint of sensitivity and ease of synthesis, R 11 to R 13 are preferably halogen atoms independently, and more preferably chlorine atoms.
  • n and l each independently represent an integer of 0 to 5, from the viewpoint of ease of synthesis, it is preferable that at least one of m, n and l is an integer of 1 or more, and m, n and l. It is more preferable that any one of them is 1 and the remaining 2 are 0.
  • Examples of the hexaarylbiimidazole-based compound represented by the general formula (1-1) and / or the general formula (1-2) include 2,2'-bis (o-chlorophenyl) -4,5,4'. , 5'-Tetraphenylbiimidazole, 2,2'-bis (o-methylphenyl) -4,5,4', 5'-tetraphenylbiimidazole, 2,2'-bis (o-chlorophenyl) -4 , 4', 5,5'-tetra (o, p-dichlorophenyl) biimidazole, 2,2'-bis (o, p-dichlorophenyl) -4,4', 5,5'-tetra (o, p-) Dichlorophenyl) biimidazole, 2,2'-bis (o-chlorophenyl) -4,4', 5,5'-tetra (p-fluorophenyl) biimi
  • hexaphenylbiimidazole compounds are preferable, and the o-position of the benzene ring bonded to the 2,2'-position on the imidazole ring is replaced with a methyl group, a methoxy group, or a halogen atom, and 4,4 on the imidazole ring. It is more preferable that the benzene ring bonded to the', 5, 5'-position is unsubstituted or substituted with a halogen atom or a methoxy group.
  • the other photopolymerization initiator (a2) either a hexaarylbiimidazole-based compound represented by the general formula (1-1) or a hexaarylbiimidazole-based compound represented by the general formula (1-2) is used. It may be used, or both may be used in combination. When used in combination, the ratio is not particularly limited.
  • acylphosphine oxide-based photopolymerization initiator examples include 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide.
  • Examples of the oxime ester-based photopolymerization initiator other than the photopolymerization initiator (a1) include 1,2-octanedione-1- [4- (phenylthio) phenyl] -2- (O-benzoyloxime) ethanone, 1. -[9-Ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl] -1- (O-acetyloxime), the compound described in JP-A-2004-534797, Japan-specific Compounds described in Japanese Patent Application Laid-Open No. 2000-80068, compounds described in International Publication No. 2012/45736, compounds described in Japanese Patent Application Laid-Open No.
  • triazine-based photopolymerization initiator examples include 2,4,6-tris (monochromomethyl) -s-triazine, 2,4,6-tris (dichloromethyl) -s-triazine, and 2,4,6-tris.
  • acetophenone-based photopolymerization initiator examples include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, and 1-hydroxy-1- (p-dodecylphenyl) ketone.
  • benzophenone-based photopolymerization initiator examples include benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2-carboxybenzophenone, 2-chlorobenzophenone, 4-bromobenzophenone, and Michler ketone.
  • the content of the photopolymerization initiator (A) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.5% by mass or more, preferably 1% by mass or more, in the total solid content of the photosensitive resin composition. Is more preferable, 1.5% by mass or more is further preferable, 2% by mass or more is particularly preferable, 10% by mass or less is more preferable, 8% by mass or less is more preferable, 6% by mass or less is further preferable, and 4% by mass is 4% by mass. The following are particularly preferred.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 0.5 to 10% by mass is preferable, 1 to 8% by mass is more preferable, 1.5 to 6% by mass is further preferable, and 2 to 4% by mass is preferable. Especially preferable.
  • the film does not decrease during development, a coating film is formed, and sufficient ink repellency tends to occur. Further, when the value is not more than the upper limit value, a desired pattern shape tends to be easily formed.
  • the content of the photopolymerization initiator (a1) in the photosensitive resin composition of the present invention is also not particularly limited, but is preferably 0.5% by mass or more, preferably 1% by mass or more, in the total solid content of the photosensitive resin composition. More preferably, 1.5% by mass or more is further preferable, 2% by mass or more is particularly preferable, 10% by mass or less is more preferable, 8% by mass or less is more preferable, 6% by mass or less is further preferable, and 4% by mass or less. Is particularly preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 0.5 to 10% by mass is preferable, 1 to 8% by mass is more preferable, 1.5 to 6% by mass is further preferable, and 2 to 4% by mass is preferable. Especially preferable.
  • 0.5 to 10% by mass is preferable, 1 to 8% by mass is more preferable, 1.5 to 6% by mass is further preferable, and 2 to 4% by mass is preferable.
  • it is set to the lower limit value or more, it tends to be easy to suppress the collapse and to easily form the second partition wall. Further, when the value is not more than the upper limit value, it tends to be easy to control the step.
  • the content of the photopolymerization initiator (a1) in the photopolymerization initiator (A) is also not particularly limited, but is preferably 20% by mass or more, more preferably 40% by mass or more, further preferably 60% by mass or more, and 70% by mass. % Or more is even more preferable, 80% by mass or more is particularly preferable, and usually 100% by mass or less. For example, 20 to 100% by mass is preferable, 40 to 100% by mass is more preferable, 60 to 100% by mass is further preferable, 70 to 100% by mass is further preferable, and 80 to 100% by mass is particularly preferable. When it is set to the lower limit value or more, it tends to be easy to suppress the collapse and to easily form the second partition wall.
  • the compounding ratio of the (A) photopolymerization initiator to the (C) photopolymerizable compound in the photosensitive resin composition is preferably 1 part by mass or more, preferably 2 parts by mass, based on 100 parts by mass of the (C) photopolymerizable compound. More than parts is more preferable, 3 parts by mass or more is further preferable, 200 parts by mass or less is preferable, 100 parts by mass or less is more preferable, 50 parts by mass or less is further preferable, 20 parts by mass or less is further preferable, and 10 parts by mass is preferable. Parts or less are particularly preferable, and 8 parts by mass or less is most preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 200 parts by mass is preferable, 1 to 100 parts by mass is more preferable, 2 to 50 parts by mass is further preferable, and 2 to 20 parts by mass is further preferable. 3 to 10 parts by mass is particularly preferable, and 3 to 8 parts by mass is most preferable.
  • the sensitivity tends to be appropriate.
  • the value is not more than the upper limit value, a desired pattern shape tends to be easily formed.
  • the sensitizer may be used in combination with the photopolymerization initiator.
  • the sensitizer improves the sensitivity and at the same time reduces the light transmittance inside the photosensitive resin composition, so that the taper angle tends to increase.
  • sensitizer a sensitizer usually used in this field can be used.
  • the sensitizer is characterized in that the energy obtained by absorption is transferred to the photopolymerization initiator or causes electron transfer with the photopolymerization initiator to efficiently promote the reaction radical polymerization reaction.
  • sensitizers include unsaturated ketones such as chalcone derivatives and dibenzalacetone; 1,2-diketone compounds such as benzyl and camphorquinone; benzoin compounds and fluorene compounds.
  • Polymethine dyes such as naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, oxonoll derivatives, etc.
  • thioxanthone-based compounds and benzophenone-based compounds are preferable from the viewpoint of improving sensitivity and increasing the taper angle.
  • thioxanthone compound examples include thioxanthone, 2-methylthioxanthone, 4-methylthioxanthone, 2,4-dimethylthioxanthone, 2-ethylthioxanthone, 4-ethylthioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 4 -Isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, 4-chlorothioxanthone, 2,4-dichlorothioxanthone and the like.
  • 2,4-diethylthioxanthone is preferable from the viewpoint of improving sensitivity and increasing the taper angle.
  • benzophenone compound examples include benzophenone, 4,4'-bis (dimethylamino) benzophenone, 4,4'-bis (diethylamino) benzophenone, and 4,4'-bis (ethylmethylamino) benzophenone.
  • 4,4'-bis (diethylamino) benzophenone is preferable from the viewpoint of improving sensitivity and increasing the taper angle.
  • the content of the sensitizer in the photosensitive resin composition is preferably 0.1% by mass or more, more preferably 0.1% by mass or more, based on the total solid content of the photosensitive resin composition. Is 0.3% by mass or more, more preferably 0.5% by mass or more, still more preferably 0.8% by mass or more, particularly preferably 1% by mass or more, most preferably 1.2% by mass or more, and It is preferably 10% by mass or less, more preferably 7% by mass or less, still more preferably 5% by mass or less, and particularly preferably 3% by mass or less.
  • the upper and lower limits can be arbitrarily combined, and for example, 0.1 to 10% by mass is preferable, 0.3 to 10% by mass is more preferable, 0.5 to 7% by mass is further preferable, and 0.8 to 0.8 to 7% by mass is preferable. 7% by mass is even more preferable, 1 to 5% by mass is particularly preferable, and 1.2 to 3% by mass is most preferable.
  • 0.1 to 10% by mass is preferable, 0.3 to 10% by mass is more preferable, 0.5 to 7% by mass is further preferable, and 0.8 to 0.8 to 7% by mass is preferable. 7% by mass is even more preferable, 1 to 5% by mass is particularly preferable, and 1.2 to 3% by mass is most preferable.
  • the photosensitive resin composition of the present invention contains (B) alkali-soluble resin.
  • the alkali-soluble resin is not particularly limited as long as it is a resin that can be developed with an alkaline developer.
  • Examples of the alkali-soluble resin include various resins containing a carboxy group and / or a hydroxyl group. Among them, a resin having a carboxy group is preferable from the viewpoint that a partition wall having an appropriate taper angle can be obtained, the outflow of the liquid repellent agent due to thermal melting of the partition wall surface during post-baking can be suppressed, and the ink repellency can be maintained.
  • the alkali-soluble resin (B) is an alkali-soluble resin (b) having an ethylenic double bond (hereinafter, may be abbreviated as "alkali-soluble resin (b)"). Is preferably included.
  • the specific structure of the alkali-soluble resin (b) having an ethylenic double bond is not particularly limited, but from the viewpoint of development solubility, the epoxy (meth) acrylate resin (b1) and / or the acrylic copolymer resin (b2) can be used.
  • the epoxy (meth) acrylate resin (b1) is more preferable from the viewpoint of reducing outgas.
  • the epoxy (meth) acrylate resin (b1) will be described in detail below.
  • Epoxy (meth) acrylate resin (b1) is a resin obtained by adding an acid or ester compound having an ethylenically unsaturated bond (ethyleney double bond) to the epoxy resin and further adding a polybasic acid or an anhydride thereof. is there. For example, by opening and adding a carboxy group of an acid having an ethylenically unsaturated bond to the epoxy group of an epoxy resin, an ethylenically unsaturated bond is added to the epoxy resin via an ester bond (-COO-). At the same time, one of the carboxy groups of the polybasic acid anhydride is added to the hydroxyl group generated at that time.
  • the epoxy (meth) acrylate resin (b1) also contains a resin obtained by reacting the carboxy group of the resin obtained in the above reaction with a compound having a functional group capable of further reacting.
  • the epoxy (meth) acrylate resin has substantially no epoxy group due to its chemical structure and is not limited to "(meth) acrylate", but the epoxy compound (epoxy resin) is used as a raw material. Yes, and since "(meth) acrylate" is a typical example, it is named in this way according to convention.
  • the epoxy resin includes a raw material compound before forming the resin by thermosetting, and the epoxy resin can be appropriately selected from known epoxy resins and used. Further, as the epoxy resin, a compound obtained by reacting a phenolic compound with epihalohydrin can be used.
  • the phenolic compound is preferably a compound having a divalent or divalent or higher phenolic hydroxyl group, and may be a monomer or a polymer. Specifically, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, biphenyl novolac epoxy resin, trisphenol epoxy resin, phenol and dicyclopentane.
  • Examples thereof include a diglycidyl etherified product of (4'-hydroxyphenyl) adamantan, and those having an aromatic ring in the main chain can be preferably used.
  • bisphenol A type epoxy resin bisphenol novolac epoxy resin, cresol novolac epoxy resin, epoxidized product of a polymer of phenol and dicyclopentadiene, 9,9-bis (4'-hydroxyphenyl).
  • a fluorene epoxy is preferable, and a bisphenol A type epoxy resin is more preferable.
  • Examples of the acid having an ethylenically unsaturated bond include (meth) acrylic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, pentaerythritol tri (meth) acrylate succinic anhydride adduct, and pentaerythritoltri (meth).
  • polybasic acid examples include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, and 4 -Ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid , Benzophenone tetracarboxylic acid, biphenyltetracarboxylic acid, and anhydrides thereof.
  • succinic anhydride succinic anhydride, maleic anhydride, and itaconic anhydride are preferable, and succinic anhydride is more preferable, from the viewpoint of reducing the residue of the pixel portion after development.
  • the molecular weight of the epoxy (meth) acrylate resin (b1) can be increased, branching can be introduced into the molecule, and the molecular weight and viscosity tend to be balanced.
  • the introduction rate of acid groups into the molecule can be increased, and there is a tendency for the sensitivity, adhesion, and the like to be easily balanced.
  • the polyhydric alcohol include trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol. These may be used alone or in combination of two or more.
  • the acid value of the epoxy (meth) acrylate resin (b1) is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, further preferably 40 mgKOH / g or more, still more preferably 60 mgKOH / g or more. Further, 200 mgKOH / g or less is preferable, 180 mgKOH / g or less is more preferable, 150 mgKOH / g or less is further preferable, 120 mgKOH / g or less is further preferable, and 100 mgKOH / g or less is particularly preferable.
  • the upper and lower limits can be arbitrarily combined, for example, 10 to 200 mgKOH / g is preferable, 10 to 180 mgKOH / g is more preferable, 20 to 150 mgKOH / g is further preferable, and 40 to 120 mgKOH / g is further preferable. 60 to 100 mgKOH / g is particularly preferable.
  • the value is equal to or higher than the lower limit, the residue can be easily reduced. Further, when the value is not more than the upper limit value, the outgas during light emission of the element tends to be reduced.
  • the weight average molecular weight (Mw) of the epoxy (meth) acrylate resin (b1) is not particularly limited, but is preferably 1000 or more, more preferably 2000 or more, still more preferably 3000 or more, still more preferably 4000 or more, and particularly preferably 5000. Above, it is particularly preferably 6000 or more, most preferably 7,000 or more, and preferably 30,000 or less, more preferably 20,000 or less, still more preferably 15,000 or less, and particularly preferably 10,000 or less.
  • the upper limit and the lower limit can be arbitrarily combined, preferably 1000 to 30000, more preferably 2000 to 30000, still more preferably 3000 to 20000, still more preferably 4000 to 20000, particularly preferably 5000 to 15000, and 6000 to 15000.
  • the content of the epoxy (meth) acrylate resin (b1) contained in the (B) alkali-soluble resin is not particularly limited, but is 30% by mass.
  • the above is preferable, 50% by mass or more is more preferable, 70% by mass or more is further preferable, 80% by mass or more is further preferable, 90% by mass or more is particularly preferable, and usually 100% by mass or less.
  • the upper and lower limits can be combined arbitrarily. For example, 30 to 100% by mass is preferable, 50 to 100% by mass is more preferable, 70 to 100% by mass is further preferable, 80 to 100% by mass is further preferable, and 90 to 100% by mass is particularly preferable. Outgas tends to decrease when the value is equal to or higher than the lower limit.
  • the epoxy (meth) acrylate resin (b1) can be synthesized by a conventionally known method. Specifically, the epoxy resin is dissolved in an organic solvent, and in the coexistence of a catalyst and a thermal polymerization inhibitor, the acid or ester compound having an ethylenically unsaturated bond is added and subjected to an addition reaction, and then a polybasic acid or its own. A method of adding an anhydride and continuing the reaction can be used.
  • Examples of the organic solvent include methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate.
  • Examples of the catalyst include tertiary amines such as triethylamine, benzyldimethylamine, and tribenzylamine; and quaternary amines such as tetramethylammonium chloride, methyltriethylammonium chloride, tetraethylammonium chloride, tetrabutylammonium chloride, and trimethylbenzylammonium chloride.
  • thermal polymerization inhibitor examples include hydroquinone, hydroquinone monomethyl ether, and methyl hydroquinone. These may be used alone or in combination of two or more.
  • the acid or ester compound having an ethylenically unsaturated bond is preferably 0.7 to 1.3 chemical equivalents, more preferably 0.9 to 1.1 chemical equivalents, relative to one chemical equivalent of the epoxy group of the epoxy resin. Can be used.
  • the temperature during the addition reaction is preferably 60 to 150 ° C, more preferably 80 to 120 ° C.
  • the polybasic acid (anhydrous) is preferably 0.1 to 1.2 chemical equivalents, more preferably 0.2 to 1.1 chemical equivalents, relative to one chemical equivalent of the hydroxyl group generated in the addition reaction. Can be used.
  • the epoxy (meth) acrylate resin (b1) is an epoxy (meth) acrylate resin (b1-1) containing a partial structure represented by the following general formula (i) from the viewpoint of outgassing when the element emits light (hereinafter, “epoxy”.
  • the epoxy (meth) acrylate resin (b1) is an epoxy (meth) acrylate resin (b1-1) containing a partial structure represented by the following general formula (i) from the viewpoint of reducing outgassing when the device emits light. It is preferably contained, and more preferably it is an epoxy (meth) acrylate resin (b1-1) containing a partial structure represented by the following general formula (i). It is presumed that one of the reasons is that it is difficult to decompose with heat because it has a rigid main skeleton.
  • Ra represents a hydrogen atom or a methyl group
  • R b represents a divalent hydrocarbon group which may have a substituent.
  • the benzene ring in formula (i) may be further substituted with any substituent. * Represents a bond.
  • R b represents a divalent hydrocarbon group which may have a substituent.
  • a divalent hydrocarbon group a divalent aliphatic group, a divalent aromatic ring group, a group in which a divalent aliphatic group of 1 or more and a divalent aromatic ring group of 1 or more are linked is used. Can be mentioned.
  • Examples of the divalent aliphatic group include linear, branched and cyclic groups. Among these, a linear one is preferable from the viewpoint of development solubility, while a cyclic one is preferable from the viewpoint of reducing the penetration of the developer into the exposed portion.
  • the carbon number is usually 1 or more, preferably 3 or more, more preferably 6 or more, preferably 20 or less, more preferably 15 or less, still more preferably 10 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 20 is preferable, 3 to 15 is more preferable, and 6 to 10 is further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group and an n-heptylene group. Among these, a methylene group is preferable from the viewpoint of residue reduction.
  • Examples of the divalent branched chain aliphatic group include the above-mentioned divalent linear aliphatic group and the side chains of methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group and isobutyl. Examples thereof include a structure having a group, a sec-butyl group, and a tert-butyl group.
  • the number of rings contained in the divalent cyclic aliphatic group is not particularly limited, but is usually preferably 1 or more, 2 or more, preferably 10 or less, and more preferably 5 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 is preferable, 1 to 5 is more preferable, and 2 to 5 is further preferable.
  • the value is equal to or higher than the lower limit, the residual film ratio tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the divalent cyclic aliphatic group include a group obtained by removing two hydrogen atoms from the cyclohexane ring, cycloheptane ring, cyclodecane ring, cyclododecane ring, norbornane ring, isobornane ring, and adamantane ring.
  • a group obtained by removing two hydrogen atoms from the adamantane ring is preferable from the viewpoint of development adhesion.
  • Examples of the substituent that the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, no substitution is preferable.
  • divalent aromatic ring group examples include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group.
  • the carbon number is usually 4 or more, preferably 5 or more, more preferably 6 or more, preferably 20 or less, more preferably 15 or less, still more preferably 10 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 20 is preferable, 5 to 15 is more preferable, and 6 to 10 is further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring.
  • the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, and a chrysene ring, which have two free atomic valences. Examples thereof include a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring.
  • the aromatic heterocycle in the divalent aromatic heterocyclic group may be a monocyclic ring or a condensed ring.
  • Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, and an indole having two free atomic valences.
  • a benzene ring having two free valences and a naphthalene ring are preferable, and a benzene
  • Examples of the substituent that the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, a propoxy group and a glycidyl ether group. Of these, no substitution is preferable from the viewpoint of curability.
  • the above-mentioned divalent aliphatic group is one or more, and the above-mentioned divalent aromatic ring group is used.
  • the number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, 2 or more, preferably 10 or less, more preferably 5 or less, still more preferably 3 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 are preferable, 1 to 5 are more preferable, and 2 to 3 are further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved.
  • the residue tends to be reduced.
  • the number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, 2 or more, preferably 10 or less, more preferably 5 or less, still more preferably 3 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 are preferable, 1 to 5 are more preferable, and 2 to 3 are further preferable.
  • the lower limit value or more the development adhesion tends to be improved.
  • the residue tends to be reduced.
  • Examples of the group in which one or more divalent aliphatic groups and one or more divalent aromatic ring groups are linked include groups represented by the following formulas (ia) to (iF). Be done. Among these, the group represented by the following formula (ia) is preferable from the viewpoint of the rigidity of the skeleton and the hydrophobicity of the membrane. * In the chemical formula represents the bond.
  • the benzene ring in the formula (i) may be further substituted with an arbitrary substituent.
  • substituent of the benzene ring in the formula (i) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group and a propoxy group.
  • the number of substituents is also not particularly limited, and may be one or two or more as long as it is chemically acceptable. From the viewpoint of curability, no substitution is preferable.
  • the partial structure represented by the formula (i) is preferably a partial structure represented by the following formula (i-1) from the viewpoint of development solubility.
  • R a and R b are synonymous with those in formula (i).
  • R 1 represents a divalent hydrocarbon group having 1 to 4 carbon atoms which may have a substituent. * Represents a bond.
  • the benzene ring in formula (i-1) may be further substituted with any substituent.
  • R 1 represents a divalent hydrocarbon group having 1 to 4 carbon atoms which may have a substituent.
  • Examples of the divalent hydrocarbon group include an alkylene group and an alkaneylene group.
  • the alkylene group may be a straight chain or a branched chain, but is preferably a straight chain from the viewpoint of development solubility.
  • the number of carbon atoms is not particularly limited, but is usually 1 or more, 2 or more, preferably 4 or less, and more preferably 3 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 4 are preferable, 1 to 3 are more preferable, and 2 to 3 are further preferable.
  • the value is equal to or higher than the lower limit, the residual film ratio tends to increase. Further, when the value is not more than the upper limit value, the amount of outgas generated when the element emits light tends to decrease.
  • alkylene group examples include a methylene group, an ethylene group, a propylene group, and a butylene group. From the viewpoint of reducing outgas, a methylene group or an ethylene group is preferable, and an ethylene group is more preferable.
  • the alkenylene group may be a straight chain or a branched chain, but it is preferable that the alkenylene group is a straight chain from the viewpoint of development solubility.
  • the number of carbon atoms is not particularly limited, but is usually 2 or more, preferably 4 or less, and more preferably 3 or less. For example, 2 to 4 are preferable, and 2 to 3 are more preferable.
  • the value is equal to or higher than the lower limit, the residual film ratio tends to increase. Further, when the value is not more than the upper limit value, the amount of outgas generated when the element emits light tends to decrease.
  • alkenylene group examples include an ethenylene group, a propenylene group, and a butyleneylene group, and an ethenylene group is preferable from the viewpoint of outgas.
  • the substituent that the divalent hydrocarbon group having 1 to 4 carbon atoms may have is not particularly limited, and examples thereof include a halogen atom, an alkoxy group, a benzoyl group, and a hydroxyl group, from the viewpoint of ease of synthesis. Is preferably unsubstituted.
  • R 1 is preferably a divalent alkylene group having 1 to 4 carbon atoms, more preferably a methylene group or an ethylene group, and even more preferably an ethylene group.
  • the partial structure represented by the above formula (i-1) contained in one molecule of the epoxy (meth) acrylate resin (b1-1) may be one kind or two or more kinds.
  • the number of partial structures represented by the formula (i) contained in one molecule of the epoxy (meth) acrylate resin (b1-1) is not particularly limited, but 1 or more is preferable, 2 or more is more preferable, and 3 or more is preferable. Is more preferable, 10 or less is preferable, and 8 or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 is preferable, 2 to 10 is more preferable, and 3 to 8 is further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the number of partial structures represented by the formula (i-1) contained in one molecule of the epoxy (meth) acrylate resin (b1-1) is not particularly limited, but 1 or more is preferable, and 2 or more is more preferable. 3 or more is more preferable, 10 or less is more preferable, and 8 or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 is preferable, 2 to 10 is more preferable, and 3 to 8 is further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • epoxy (meth) acrylate resin (b1-1) Specific examples of the epoxy (meth) acrylate resin (b1-1) are given below.
  • the epoxy (meth) acrylate resin (b1) is an epoxy (meth) acrylate resin (b1-2) containing a partial structure represented by the following formula (ii) from the viewpoint of development adhesion. Is preferable.
  • each R c independently represents a hydrogen atom or a methyl group.
  • R d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. * Represents a bond.
  • R d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain.
  • the cyclic hydrocarbon group include an aliphatic ring group and an aromatic ring group.
  • the number of rings contained in the aliphatic ring group is not particularly limited, but usually 1 or more and 2 or more is preferable, 10 or less is preferable, 5 or less is more preferable, and 3 or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 are preferable, 1 to 5 are more preferable, and 2 to 3 are further preferable.
  • the number of carbon atoms of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 30 or less, further preferably 20 or less, and particularly preferably 15 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 40 is preferable, 4 to 30 is more preferable, 6 to 20 is further preferable, and 8 to 15 is particularly preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring.
  • the adamantane ring is preferable from the viewpoint of development adhesion.
  • the number of rings contained in the aromatic ring group is not particularly limited, but usually 1 or more, 2 or more is preferable, 3 or more is more preferable, 10 or less is preferable, 5 or less is more preferable, and 4 or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 is preferable, 2 to 5 is more preferable, and 3 to 4 is further preferable.
  • the value is equal to or higher than the lower limit, the residue tends to be reduced. Further, when the value is not more than the upper limit value, the development adhesion tends to be improved.
  • the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group.
  • the number of carbon atoms of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, further preferably 10 or more, particularly preferably 12 or more, and preferably 40 or less, more preferably 30 or less. , 20 or less is more preferable, and 15 or less is particularly preferable.
  • the upper and lower limits can be arbitrarily combined, for example, 4 to 40 is preferable, 6 to 40 is more preferable, 8 to 30 is further preferable, 10 to 20 is more preferable, and 12 to 15 is particularly preferable.
  • the value is equal to or higher than the lower limit, the residue tends to be reduced. Further, when the value is not more than the upper limit value, the development adhesion tends to be improved.
  • Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. Ring is mentioned. Among these, the fluorene ring is preferable from the viewpoint of patterning characteristics.
  • the divalent hydrocarbon group in the divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is not particularly limited, but for example, a divalent aliphatic group, a divalent aromatic ring group, 1 or more 2 Examples thereof include a group in which a valent aliphatic group and one or more divalent aromatic ring groups are linked.
  • Examples of the divalent aliphatic group include linear, branched and cyclic groups. Among these, a linear one is preferable from the viewpoint of development solubility, while a cyclic one is preferable from the viewpoint of reducing the penetration of the developer into the exposed portion.
  • the carbon number is usually 1 or more, preferably 3 or more, more preferably 6 or more, preferably 25 or less, more preferably 20 or less, still more preferably 15 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 25 is preferable, 3 to 20 is more preferable, and 6 to 15 is further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group and an n-heptylene group. Among these, a methylene group is preferable from the viewpoint of residue.
  • Examples of the divalent branched chain aliphatic group include the above-mentioned divalent linear aliphatic group and the side chains of methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group and isobutyl. Examples thereof include a structure having a group, a sec-butyl group, and a tert-butyl group.
  • the number of rings contained in the divalent cyclic aliphatic group is not particularly limited, but is usually preferably 1 or more, 2 or more, preferably 10 or less, more preferably 5 or less, still more preferably 3 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 are preferable, 1 to 5 are more preferable, and 2 to 3 are further preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the divalent cyclic aliphatic group include a group obtained by removing two hydrogen atoms from a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring.
  • a group obtained by removing two hydrogen atoms from the adamantane ring is preferable from the viewpoint of development adhesion.
  • Examples of the substituent that the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, no substitution is preferable.
  • divalent aromatic ring group examples include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group.
  • the carbon number is usually 4 or more, preferably 5 or more, more preferably 6 or more, preferably 30 or less, more preferably 20 or less, still more preferably 15 or less.
  • the upper limit and the lower limit can be arbitrarily combined, for example, 4 to 30, more preferably 5 to 20, and even more preferably 6 to 15. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring.
  • the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, and a chrysene ring, which have two free atomic valences. Examples thereof include a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring.
  • the aromatic heterocycle in the divalent aromatic heterocyclic group may be a monocyclic ring or a condensed ring.
  • Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, and an indole having two free atomic valences.
  • a benzene ring having two free valences and a naphthalene ring are preferable, and a benzene
  • Examples of the substituent that the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group and a propoxy group. Of these, no substitution is preferable from the viewpoint of curability.
  • the above-mentioned divalent aliphatic group is one or more, and the above-mentioned divalent aromatic ring group is used.
  • the number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, 2 or more, preferably 10 or less, more preferably 5 or less, still more preferably 3 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 are preferable, 1 to 5 are more preferable, and 2 to 3 are further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved.
  • the residue tends to be reduced.
  • the number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, 2 or more, preferably 10 or less, more preferably 5 or less, still more preferably 3 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 are preferable, 1 to 5 are more preferable, and 2 to 3 are further preferable.
  • the lower limit value or more the development adhesion tends to be improved.
  • the residue tends to be reduced.
  • Examples of the group in which one or more divalent aliphatic groups and one or more divalent aromatic ring groups are linked include groups represented by the above formulas (ia) to (iF). Can be mentioned. Among these, the group represented by the above formula (IC) is preferable from the viewpoint of residue reduction.
  • the bonding mode of the cyclic hydrocarbon group which is a side chain, is not particularly limited with respect to these divalent hydrocarbon groups.
  • one hydrogen atom of an aliphatic group or an aromatic ring group is substituted with a side chain.
  • Examples thereof include an embodiment in which a cyclic hydrocarbon group as a side chain is formed including one of the carbon atoms of the aliphatic group.
  • the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-1) from the viewpoint of development adhesion.
  • R c is synonymous with the formula (ii).
  • R ⁇ represents a monovalent cyclic hydrocarbon group which may have a substituent.
  • n is an integer of 1 or more.
  • the benzene ring in formula (ii-1) may be further substituted with any substituent. * Represents a bond.
  • R ⁇ represents a monovalent cyclic hydrocarbon group which may have a substituent.
  • the cyclic hydrocarbon group include an aliphatic ring group and an aromatic ring group.
  • the number of rings contained in the aliphatic ring group is not particularly limited, but usually 1 or more and 2 or more is preferable, 6 or less is preferable, 4 or less is more preferable, and 3 or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 6 are preferable, 1 to 4 are more preferable, and 2 to 3 are further preferable.
  • the carbon number of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 30 or less, further preferably 20 or less, and particularly preferably 15 or less. preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 40 is preferable, 4 to 30 is more preferable, 6 to 20 is further preferable, and 8 to 15 is particularly preferable.
  • Examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring.
  • the adamantane ring is preferable from the viewpoint of development adhesion.
  • the number of rings contained in the aromatic ring group is not particularly limited, but usually 1 or more, 2 or more is preferable, 3 or more is more preferable, 10 or less is preferable, and 5 or less is more preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 is preferable, 2 to 10 is more preferable, and 3 to 5 is further preferable.
  • the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group.
  • the carbon number of the aromatic ring group is usually 4 or more, preferably 5 or more, more preferably 6 or more, preferably 30 or less, more preferably 20 or less, still more preferably 15 or less.
  • the upper limit and the lower limit can be arbitrarily combined, for example, 4 to 30, more preferably 5 to 20, and even more preferably 6 to 15.
  • the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring.
  • the fluorene ring is preferable from the viewpoint of development adhesion.
  • Examples of the substituent that the cyclic hydrocarbon group may have include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group and an amyl group.
  • An alkyl group having 1 to 5 carbon atoms such as an isoamyl group; an alkoxy group having 1 to 5 carbon atoms such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group can be mentioned from the viewpoint of easiness of synthesis. , Non-replacement is preferable.
  • n represents an integer of 1 or more, 2 or more is preferable, and 3 or less is preferable. For example, 1 to 3 is preferable, and 1 to 2 is more preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • R ⁇ is preferably a monovalent aliphatic ring group, and more preferably an adamantyl group.
  • the benzene ring in the formula (ii-1) may be further substituted with an arbitrary substituent.
  • substituents include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group and a propoxy group.
  • the number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, no substitution is preferable.
  • the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-2) from the viewpoint of development adhesion.
  • R c is synonymous with the formula (ii).
  • R ⁇ represents a divalent cyclic hydrocarbon group which may have a substituent.
  • the benzene ring in formula (ii-2) may be further substituted with any substituent. * Represents a bond.
  • R ⁇ represents a divalent cyclic hydrocarbon group which may have a substituent.
  • the cyclic hydrocarbon group include an aliphatic ring group and an aromatic ring group.
  • the number of rings contained in the aliphatic ring group is not particularly limited, but is usually preferably 1 or more, 2 or more, preferably 10 or less, and more preferably 5 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 are preferable, and 2 to 5 are more preferable.
  • the number of carbon atoms of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 35 or less, still more preferably 30 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 40 is preferable, 6 to 35 is more preferable, and 8 to 30 is further preferable.
  • the lower limit value or more When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring.
  • the adamantane ring is preferable from the viewpoint of development adhesion.
  • the number of rings contained in the aromatic ring group is not particularly limited, but usually 1 or more, 2 or more is preferable, 3 or more is more preferable, 10 or less is preferable, and 5 or less is preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 is preferable, 2 to 10 is more preferable, and 3 to 5 is further preferable.
  • the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group.
  • the carbon number of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, further preferably 10 or more, still preferably 40 or less, more preferably 30 or less, and further preferably 20 or less. It is preferable, and 15 or less is particularly preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 40 is preferable, 6 to 30 is more preferable, 8 to 20 is further preferable, and 10 to 15 is particularly preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring.
  • the fluorene ring is preferable from the viewpoint of development adhesion.
  • Examples of the substituent that the cyclic hydrocarbon group may have include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group and an amyl group.
  • Examples thereof include an alkyl group having 1 to 5 carbon atoms such as an isoamyl group; an alkoxy group having 1 to 5 carbon atoms such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. Of these, no substitution is preferable from the viewpoint of simplicity of synthesis.
  • R ⁇ is preferably a divalent aliphatic ring group, and more preferably a divalent adamantane ring group.
  • R ⁇ is preferably a divalent aromatic ring group, and more preferably a divalent fluorene ring group.
  • the benzene ring in the formula (ii-2) may be further substituted with an arbitrary substituent.
  • substituent of the benzene ring in the formula (ii-2) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group and a propoxy group.
  • the number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, no substitution is preferable.
  • the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-3) from the viewpoint of curability.
  • R c and R d are synonymous with the above formula (ii).
  • R 1 is synonymous with the above formula (i-1). * Represents a bond.
  • the partial structure represented by the above formula (ii-3) contained in one molecule of the epoxy (meth) acrylate resin (b1-2) may be one kind or two or more kinds.
  • the number of partial structures represented by the above formula (ii) contained in one molecule of the epoxy (meth) acrylate resin (b1-2) is not particularly limited, but 1 or more is preferable, 3 or more is more preferable, and more. 20 or less is preferable, 15 or less is more preferable, and 10 or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 20 is preferable, 1 to 15 is more preferable, and 3 to 10 is further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the epoxy (meth) acrylate resin (b1) is an epoxy (meth) acrylate resin (b1-) containing a partial structure represented by the following general formula (iii) from the viewpoint of reducing outgassing when the device emits light. 3) is preferable.
  • R e represents a hydrogen atom or a methyl group, gamma is a single bond, -CO-, may have a substituent group alkylene group, or a divalent which may have a substituent Represents the cyclic hydrocarbon group of.
  • the benzene ring in the formula (iii) may be further substituted with any substituent. * Represents a bond.
  • ⁇ represents a single bond, -CO-, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent.
  • the alkylene group may be linear or branched chain, but it is preferably linear from the viewpoint of development solubility and preferably branched chain from the viewpoint of development adhesion.
  • the number of carbon atoms is not particularly limited, but is usually 1 or more, 2 or more, preferably 6 or less, and more preferably 4 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 6 are preferable, and 2 to 4 are more preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • alkylene group examples include a methylene group, an ethylene group, a propylene group, a butylene group, a hexylene group, and a heptylene group. From the viewpoint of achieving both development adhesion and development solubility, a methylene group, an ethylene group, and a propylene group are used. Is preferable, and a dimethylmethylene group (2,2-propylene group) is more preferable.
  • Examples of the substituent that the alkylene group may have include an alkoxy group having 1 to 5 carbon atoms such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group.
  • Non-substitution is preferable from the viewpoint of achieving both developmental solubility.
  • divalent cyclic hydrocarbon group examples include a divalent aliphatic ring group and a divalent aromatic ring group.
  • the number of rings contained in the aliphatic ring group is not particularly limited, but is usually preferably 1 or more, 2 or more, preferably 10 or less, and more preferably 5 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 are preferable, and 2 to 5 are more preferable.
  • the number of carbon atoms of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 35 or less, still more preferably 30 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 40 is preferable, 6 to 35 is more preferable, and 8 to 30 is further preferable.
  • the lower limit value or more When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring.
  • the adamantane ring is preferable from the viewpoint of development adhesion.
  • the number of rings contained in the aromatic ring group is not particularly limited, but usually 1 or more, 2 or more is preferable, 3 or more is more preferable, 10 or less is preferable, and 5 or less is more preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 is preferable, 2 to 10 is more preferable, and 3 to 5 is further preferable.
  • the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group.
  • the number of carbon atoms of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, further preferably 10 or more, still preferably 40 or less, more preferably 30 or less, still more preferably 20 or less. 15 or less is particularly preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 40 is preferable, 6 to 30 is more preferable, 8 to 20 is further preferable, and 10 to 15 is particularly preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring.
  • the fluorene ring is preferable from the viewpoint of development adhesion.
  • Examples of the substituent that the cyclic hydrocarbon group may have include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group and an amyl group.
  • An alkyl group having 1 to 5 carbon atoms such as an isoamyl group; an alkoxy group having 1 to 5 carbon atoms such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group can be mentioned from the viewpoint of simplicity of synthesis. , Non-replacement is preferable.
  • ⁇ is preferably an alkylene group which may have a substituent, and more preferably dimethylmethylene.
  • the benzene ring in the formula (iii) may be further substituted with an arbitrary substituent.
  • substituent of the benzene ring in the formula (iii) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group and a propoxy group.
  • the number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, no substitution is preferable.
  • the partial structure represented by the formula (iii) is preferably a partial structure represented by the following formula (iii-1) from the viewpoint of development solubility.
  • Re and ⁇ are synonymous with the above formula (iii).
  • R 1 is synonymous with that of the above formula (i-1). * Represents a bond.
  • the benzene ring in the formula (iii-1) may be further substituted with any substituent.
  • the number of partial structures represented by the above formula (iii) contained in one molecule of the epoxy (meth) acrylate resin (b1-3) is not particularly limited, but is preferably 1 or more, more preferably 5 or more, and 10 or more. Is more preferable, 18 or less is preferable, and 15 or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 18 is preferable, 5 to 18 is more preferable, and 10 to 15 is further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the number of partial structures represented by the above formula (iii-1) contained in one molecule of the epoxy (meth) acrylate resin (b1-3) is not particularly limited, but 1 or more is preferable, and 3 or more is more preferable. 5 or more is more preferable, 18 or less is preferable, and 15 or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 18 is preferable, 3 to 18 is more preferable, and 5 to 15 is further preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • epoxy (meth) acrylate resin (b1-3) Specific examples of the epoxy (meth) acrylate resin (b1-3) are given below.
  • the acrylic copolymer resin (b2) preferably has an ethylenic double bond in the side chain.
  • the acrylic copolymer resin (b2) the acrylic copolymer resin (b2-1) containing a partial structure represented by the following general formula (I) is preferable from the viewpoint of development solubility.
  • R A and R B each independently represent a hydrogen atom or a methyl group. * Represents a bond.
  • the partial structure represented by the formula (I) is preferably a partial structure represented by the following general formula (I-1) from the viewpoint of developability.
  • R A and R B are the same as defined in formula (I).
  • R 1 is synonymous with that of the above formula (i-1).
  • the partial structure represented by the formula (I) is preferably a partial structure represented by the following formula (I-2) from the viewpoint of sensitivity.
  • the acrylic copolymer resin (b2-1) contains the partial structure represented by the general formula (I), the partial structure represented by the general formula (I) contained in the acrylic copolymer resin (b2-1).
  • the content of is not particularly limited, but is preferably 5 mol% or more, more preferably 20 mol% or more, further preferably 30 mol% or more, further preferably 50 mol% or more, particularly preferably 70 mol% or more, and 80 mol% or more. More than mol% is most preferable, 99 mol% or less is preferable, 97 mol% or less is more preferable, and 95 mol% or less is further preferable.
  • the upper and lower limits can be arbitrarily combined, and for example, 5 to 99 mol% is preferable, 20 to 99 mol% is more preferable, 30 to 97 mol% is further preferable, and 50 to 97 mol% is further preferable. 70-95 mol% is particularly preferable, and 80-95 mol% is most preferable.
  • the value is equal to or higher than the lower limit, the residue tends to be reduced. Further, when the value is not more than the upper limit value, the development adhesion tends to be improved.
  • the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I-1), it is represented by the general formula (I-1) contained in the acrylic copolymer resin (b2-1).
  • the content of the partial structure to be formed is not particularly limited, but is preferably 1 mol% or more, more preferably 5 mol% or more, further preferably 8 mol% or more, further preferably 10 mol% or more, and 99 mol%.
  • the following is preferable, 60 mol% or less is more preferable, 40 mol% or less is further preferable, 30 mol% or less is further preferable, and 20 mol% or less is particularly preferable.
  • the upper and lower limits can be arbitrarily combined, and for example, 1 to 99 mol% is preferable, 1 to 60 mol% is more preferable, 5 to 40 mol% is further preferable, and 8 to 30 mol% is further preferable. 10 to 20 mol% is particularly preferable.
  • the value is equal to or higher than the lower limit, the sensitivity tends to increase and the residue tends to decrease. Further, when the value is not more than the upper limit value, the development adhesion tends to be improved.
  • the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I-2), it is represented by the general formula (I-2) contained in the acrylic copolymer resin (b2-1).
  • the content of the partial structure to be formed is not particularly limited, but is preferably 10 mol% or more, more preferably 20 mol% or more, further preferably 30 mol% or more, still more preferably 40 mol% or more, and 50 mol% or more.
  • 70 mol% or more is most preferable, 99 mol% or less is preferable, 95 mol% or less is more preferable, 90 mol% or less is further preferable, and 85 mol% or less is particularly preferable.
  • the upper and lower limits can be arbitrarily combined, and for example, 10 to 99 mol% is preferable, 20 to 99 mol% is more preferable, 30 to 95 mol% is further preferable, and 40 to 95 mol% is further preferable. 50 to 90 mol% is particularly preferable, and 70 to 85 mol% is most preferable. Sensitivity tends to increase when the value is equal to or higher than the lower limit. Further, when the value is not more than the upper limit value, the developability tends to be improved.
  • the partial structure that may be contained is not particularly limited, but from the viewpoint of development adhesion, for example, It is preferable to include a partial structure represented by the following general formula (I').
  • R D represents a hydrogen atom or a methyl group
  • R E is an optionally substituted alkyl group, an optionally substituted aryl group (an aromatic ring group ), Or represents an alkenyl group which may have a substituent.
  • R E represents a substituent alkyl group which may have a, optionally substituted aryl group, or may have a substituent alkenyl group.
  • alkyl group in RE include linear, branched or cyclic alkyl groups.
  • the number of carbon atoms is preferably 1 or more, more preferably 3 or more, further preferably 5 or more, still preferably 20 or less, more preferably 18 or less, further preferably 16 or less, further preferably 14 or less, and even more preferably 12 or less. Is particularly preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 20 is preferable, 1 to 18 is more preferable, 3 to 16 is further preferable, 3 to 14 is further preferable, and 5 to 12 is particularly preferable.
  • 1 to 20 is preferable
  • 1 to 18 is more preferable
  • 3 to 16 is further preferable
  • 3 to 14 is further preferable
  • 5 to 12 is particularly preferable.
  • Examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group and a dodecanyl group. Among these, a dicyclopentanyl group and a dodecanyl group are preferable, and a dicyclopentanyl group is more preferable, from the viewpoint of film strength.
  • Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group and a carboxy group. , Acryloyl group and methacryloyl group, and from the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferable.
  • the aryl group in R E (aromatic ring group), a monovalent aromatic hydrocarbon ring group include a monovalent aromatic heterocyclic group.
  • the number of carbon atoms is preferably 4 or more, more preferably 6 or more, preferably 24 or less, more preferably 22 or less, further preferably 20 or less, and particularly preferably 18 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 4 to 24 is preferable, 4 to 22 is more preferable, 6 to 20 is further preferable, and 6 to 18 is particularly preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a monocyclic ring or a fused ring, and may be, for example, a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, or pyrene. Examples thereof include a ring, a benzpyrene ring, a ttracene ring, a triphenylene ring, an acenaphthene ring, a fluorantene ring, and a fluorene ring.
  • the aromatic heterocyclic group in the aromatic heterocyclic group may be a monocyclic ring or a fused ring, and may be, for example, a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrol ring, a pyrazole ring, or a imidazole ring.
  • a benzene ring group and a naphthalene ring group are preferable, and a benzene ring group is more preferable, from the viewpoint of curability.
  • the substituent that the aryl group may have include a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group and an oligo.
  • substituent that the aryl group may have include a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group and an oligo.
  • examples thereof include an ethylene glycol group, a phenyl group and a carboxy group, and a hydroxy group
  • alkenyl group in RE examples include linear, branched chain or cyclic alkenyl groups.
  • the number of carbon atoms is preferably 2 or more, preferably 22 or less, more preferably 20 or less, further preferably 18 or less, further preferably 16 or less, and particularly preferably 14 or less.
  • 2 to 22 is preferable, 2 to 20 is more preferable, 2 to 18 is further preferable, 2 to 16 is more preferable, and 2 to 14 is particularly preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the alkenyl group include an ethenyl group, a propenyl group, a butenyl group, and a cyclohexenyl group. Among these, an ethenyl group and a propenyl group are preferable, and an ethenyl group is more preferable, from the viewpoint of curability.
  • Examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferable.
  • R E an alkyl group, an alkenyl group, more preferably an alkyl group, dicyclopentanyl group is more preferred.
  • the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I'), it is represented by the general formula (I') contained in the acrylic copolymer resin (b2-1).
  • the content of the partial structure is not particularly limited, but is preferably 0.5 mol% or more, more preferably 1 mol% or more, further preferably 1.5 mol% or more, particularly preferably 2 mol% or more, and 90 mol. % Or less is preferable, 70 mol% or less is more preferable, 50% mol or less is further preferable, 30 mol% or less is further preferable, and 10 mol% or less is particularly preferable.
  • the upper and lower limits can be arbitrarily combined, and for example, 0.5 to 90 mol% is preferable, 0.5 to 70 mol% is more preferable, 1 to 50% mol is further preferable, and 1.5 to 30 mol% is preferable. % Is even more preferred, and 2-10 mol% is particularly preferred.
  • % Is even more preferred, and 2-10 mol% is particularly preferred.
  • the acrylic copolymer resin (b2-1) contains the partial structure represented by the general formula (I)
  • the partial structure represented by the following general formula (I ′′) is used from the viewpoint of heat resistance and film strength. It is preferable to further include it.
  • R F represents a hydrogen atom or a methyl group
  • R G is an alkyl group which may have a substituent, which may have a substituent alkenyl group, a hydroxyl group
  • t represents an integer from 0 to 5.
  • RG has an alkyl group which may have a substituent, an alkenyl group which may have a substituent, a hydroxyl group, a carboxy group, a halogen atom and a substituent.
  • Examples of the alkyl group in RG include linear, branched or cyclic alkyl groups.
  • the number of carbon atoms is preferably 1 or more, more preferably 3 or more, further preferably 5 or more, still preferably 20 or less, more preferably 18 or less, further preferably 16 or less, further preferably 14 or less, and even more preferably 12 or less. Is particularly preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 20 is preferable, 1 to 18 is more preferable, 3 to 16 is further preferable, 3 to 14 is further preferable, and 5 to 12 is particularly preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group and a dodecanyl group. Among these, a dicyclopentanyl group and a dodecanyl group are preferable, and a dicyclopentanyl group is more preferable, from the viewpoint of development adhesion.
  • Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group and a carboxy group. , Acryloyl group and methacryloyl group, and from the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferable.
  • alkenyl group in RG examples include linear, branched or cyclic alkenyl groups.
  • the number of carbon atoms is preferably 2 or more, preferably 22 or less, more preferably 20 or less, further preferably 18 or less, further preferably 16 or less, and particularly preferably 14 or less.
  • 2 to 22 is preferable, 2 to 20 is more preferable, 2 to 18 is further preferable, 2 to 16 is more preferable, and 2 to 14 is particularly preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the alkenyl group include an ethenyl group, a propenyl group, a butenyl group, and a cyclohexenyl group. Among these, an ethenyl group and a propenyl group are preferable, and an ethenyl group is more preferable, from the viewpoint of curability.
  • Examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferable.
  • halogen atom in RG examples include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, and among these, a fluorine atom is preferable from the viewpoint of ink repellency.
  • Examples of the alkoxy group in RG include linear, branched or cyclic alkoxy groups.
  • the number of carbon atoms is preferably 1 or more, preferably 20 or less, more preferably 18 or less, further preferably 16 or less, further preferably 14 or less, and particularly preferably 12 or less.
  • 1 to 20 is preferable, 1 to 18 is more preferable, 1 to 16 is further preferable, 1 to 14 is more preferable, and 1 to 12 is particularly preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • Examples of the substituent that the alkoxy group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group and a carboxy group. , Acryloyl group and methacryloyl group, and from the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferable.
  • alkyl sulfide group in RG examples include linear, branched or cyclic alkyl sulfide groups.
  • the carbon number is preferably 1 or more, preferably 20 or less, more preferably 18 or less, further preferably 16 or less, and even more preferably 14 or less. , 12 or less is particularly preferable.
  • 1 to 20 is preferable, 1 to 18 is more preferable, 1 to 16 is further preferable, 1 to 14 is more preferable, and 1 to 12 is particularly preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • alkyl sulfide group examples include a methyl sulfide group, an ethyl sulfide group, a propyl sulfide group, and a butyl sulfide group.
  • a methyl sulfide group and an ethyl sulfide group are preferable from the viewpoint of developability.
  • substituent that the alkyl group in the alkyl sulfide group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group and a phenyl group.
  • Examples thereof include a group, a carboxy group, an acryloyl group and a methacryloyl group, and a hydroxy group and an oligoethylene glycol group are preferable from the viewpoint of developability.
  • the RG is preferably a hydroxy group or a carboxy group, and more preferably a carboxy group.
  • t represents an integer of 0 to 5. From the viewpoint of developability, 0 to 2 is preferable, 0 to 1 is more preferable, and 0 is further preferable.
  • the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I ′′), it is represented by the general formula (I ′′) contained in the acrylic copolymer resin (b2-1).
  • the content of the partial structure to be formed is not particularly limited, but is preferably 1 mol% or more, more preferably 2 mol% or more, further preferably 3 mol% or more, particularly preferably 5 mol% or more, and 90 mol% or less. Is more preferable, 70 mol% or less is more preferable, 50 mol% or less is further preferable, 30 mol% or less is further preferable, 20 mol% or less is particularly preferable, and 10 mol% or less is most preferable.
  • the upper and lower limits can be arbitrarily combined, and for example, 1 to 90 mol% is preferable, 1 to 70 mol% is more preferable, 2 to 50 mol% is further preferable, and 2 to 30 mol% is further preferable. 3 to 20 mol% is particularly preferable, and 5 to 10 mol% is most preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I), it further includes a partial structure represented by the following general formula (I''') from the viewpoint of developability. Is preferable.
  • RH represents a hydrogen atom or a methyl group.
  • the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I ′ ′′), the general formula (I ′′ ′′) contained in the acrylic copolymer resin (b2-1).
  • the content of the partial structure represented by is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, further preferably 30 mol% or more, and preferably 90 mol% or less, preferably 80 mol%.
  • the following is more preferable, 70 mol% or less is further preferable, and 50 mol% or less is particularly preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 5 to 90 mol% is preferable, 5 to 80 mol% is more preferable, 10 to 70 mol% is further preferable, and 30 to 50 mol% is particularly preferable.
  • the value is equal to or higher than the lower limit, the residue tends to be reduced. Further, when the value is not more than the upper limit value, the development adhesion tends to be improved.
  • the acid value of the acrylic copolymer resin (b2) is not particularly limited, but is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, further preferably 20 mgKOH / g or more, still more preferably 25 mgKOH / g or more, and further. It is preferably 100 mgKOH / g or less, more preferably 80 mgKOH / g or less, further preferably 60 mgKOH / g or less, and even more preferably 40 mgKOH / g or less.
  • the upper and lower limits can be arbitrarily combined, for example, 5 to 100 mgKOH / g is preferable, 10 to 80 mgKOH / g is more preferable, 20 to 60 mgKOH / g is further preferable, and 25 to 40 mgKOH / g is even more preferable.
  • the value is equal to or higher than the lower limit, the residue tends to be reduced. Further, when the value is not more than the upper limit value, the development adhesion tends to be improved.
  • the weight average molecular weight (Mw) of the acrylic copolymer resin (b2) is not particularly limited, but is preferably 1000 or more, more preferably 2000 or more, still more preferably 3000 or more, still more preferably 4000 or more, and particularly preferably 5000 or more. Also, it is preferably 30,000 or less, more preferably 20,000 or less, still more preferably 15,000 or less, still more preferably 10,000 or less. Especially preferably, it is 8000 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1000 to 30000 is preferable, 2000 to 20000 is more preferable, 3000 to 15000 is further preferable, 4000 to 10000 is further preferable, and 5000 to 8000 is particularly preferable. When it is set to the lower limit value or more, the development adhesion tends to be improved. Further, when the value is not more than the upper limit value, the residue tends to be reduced.
  • the content of the acrylic copolymer resin (b2) contained in the (B) alkali-soluble resin is not particularly limited, but is preferably 5% by mass or more. 10% by mass or more is more preferable, 15% by mass or more is further preferable, 20% by mass or more is particularly preferable, and usually 100% by mass or less is more preferable, 80% by mass or less is more preferable, and 50% by mass or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 5 to 100% by mass is preferable, 10 to 100% by mass is more preferable, 15 to 80% by mass is further preferable, and 20 to 50% by mass is particularly preferable.
  • the development solubility tends to be good.
  • the taper angle tends to increase when the value is equal to or less than the upper limit.
  • the alkali-soluble resin may contain either the epoxy (meth) acrylate resin (b1) or the acrylic copolymer resin (b2) alone, or both may be contained. Further, the alkali-soluble resin (B) may contain an alkali-soluble resin other than the alkali-soluble resin (b).
  • the content of the (B) alkali-soluble resin in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 10% by mass or more in the total solid content of the photosensitive resin composition. 20% by mass or more, more preferably 30% by mass or more, particularly preferably 40% by mass or more, preferably 90% by mass or less, more preferably 70% by mass or less, still more preferably 60% by mass or less, particularly preferably. It is 50% by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 5 to 90% by mass is preferable, 10 to 90% by mass is more preferable, 20 to 70% by mass is further preferable, and 30 to 60% by mass is further preferable. 40 to 50% by mass is particularly preferable. When the value is equal to or higher than the lower limit, the developability tends to be improved. Further, by setting the value to the upper limit or less, there is a tendency to reduce the outgas when the element emits light.
  • the content of the epoxy (meth) acrylate resin (b1) is not particularly limited, but it is contained in the total solid content of the photosensitive resin composition.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 5 to 90% by mass is preferable, 10 to 90% by mass is more preferable, 20 to 70% by mass is further preferable, and 30 to 60% by mass is further preferable. 40 to 50% by mass is particularly preferable.
  • the value is equal to or higher than the lower limit, the developability tends to be improved. Further, by setting the value to the upper limit or less, there is a tendency to reduce the outgas when the element emits light.
  • the content of the acrylic copolymer resin (b2) is not particularly limited, but the total solid content of the photosensitive resin composition includes It is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 20% by mass or more, still more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 90% by mass or less. It is preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 5 to 90% by mass is preferable, 10 to 90% by mass is more preferable, 20 to 70% by mass is further preferable, and 30 to 60% by mass is further preferable. 40 to 50% by mass is particularly preferable.
  • the value is equal to or higher than the lower limit, the developability tends to be improved. Further, by setting the value to the upper limit or less, there is a tendency to reduce the outgas when the element emits light.
  • the total content of the (B) alkali-soluble resin and (C) photopolymerizable compound in the total solid content of the photosensitive resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, and further. It is preferably 30% by mass or more, more preferably 50% by mass or more, particularly preferably 70% by mass or more, still more preferably 80% by mass or more, most preferably 90% by mass or more, and preferably 99% by mass. It is mass% or less, more preferably 97 mass% or less, still more preferably 95 mass% or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 5 to 99% by mass is preferable, 10 to 99% by mass is more preferable, 30 to 99% by mass is further preferable, and 50 to 97% by mass is further preferable. 70 to 97% by mass is particularly preferable, 80 to 95% by mass is particularly preferable, and 90 to 95% by mass is most preferable.
  • the value is equal to or higher than the lower limit, the curability tends to be improved. Further, when the value is not more than the upper limit value, the outgas during light emission of the element tends to be reduced.
  • the blending ratio of the (B) alkali-soluble resin to the (C) photopolymerizable compound in the photosensitive resin composition is preferably 50 parts by mass or more, preferably 60 parts by mass, based on 100 parts by mass of the (C) photopolymerizable compound.
  • the above is more preferable, 70 parts by mass or more is further preferable, 80 parts by mass or more is particularly preferable, 400 parts by mass or less is preferable, 300 parts by mass or less is more preferable, 200 parts by mass or less is further preferable, and 120 parts by mass or less. Is particularly preferable.
  • the total upper limit and lower limit can be arbitrarily combined, and for example, 50 to 400 parts by mass is preferable, 60 to 300 parts by mass is more preferable, 70 to 200 parts by mass is further preferable, and 80 to 120 parts by mass is particularly preferable.
  • the lower limit value or more the development adhesion tends to be improved. Further, the curability tends to be improved by setting the value to the upper limit or less.
  • the photosensitive resin composition of the present invention contains (C) a photopolymerizable compound.
  • (C) It is considered that the sensitivity becomes high by containing the photopolymerizable compound.
  • the photopolymerizable compound used here means a compound having one or more ethylenically unsaturated bonds (ethyleney double bonds) in the molecule, and includes polymerizable, crosslinkable, and exposed parts associated therewith.
  • a compound having two or more ethylenically unsaturated bonds in the molecule is preferable from the viewpoint of expanding the difference in the solubility of the developing solution in the non-exposed portion. Further, it is more preferable that the unsaturated bond is derived from a (meth) acryloyloxy group, that is, a (meth) acrylate compound.
  • the photosensitive resin composition of the present invention it is particularly desirable to use a polyfunctional ethylenic monomer having two or more ethylenically unsaturated bonds in one molecule.
  • the number of ethylenically unsaturated groups contained in the polyfunctional ethylenic monomer is not particularly limited, but is preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, and particularly preferably 5 or more. Further, the number is preferably 15 or less, more preferably 10 or less, still more preferably 8 or less, and particularly preferably 7 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 2 to 15 are preferable, 3 to 10 are more preferable, 4 to 8 are further preferable, and 5 to 7 are particularly preferable.
  • the photopolymerizable compound include an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid; an ester of an aromatic polyhydroxy compound and an unsaturated carboxylic acid; an aliphatic polyhydroxy compound, an aromatic polyhydroxy compound, and the like.
  • Examples thereof include an ester obtained by an esterification reaction of a polyvalent hydroxy compound with an unsaturated carboxylic acid and a polybasic carboxylic acid.
  • ester of the aliphatic polyhydroxy compound and the unsaturated carboxylic acid examples include ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylol ethanetriacrylate, pentaerythritol diacrylate, and pentaerythritol triacrylate.
  • Pentaerythritol tetraacrylate dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, acrylic acid ester of aliphatic polyhydroxy compounds such as glycerol acrylate; methacrylic acid in which the acrylate of these compounds is replaced with methacrylate. Esters; itaconic acid esters in which the acrylates of these compounds are replaced with itaconates; crotonic acid esters in which the acrylates of these compounds are replaced with clonates; maleic acid esters in which the acrylates of these compounds are replaced with maleates;
  • ester of the aromatic polyhydroxy compound and the unsaturated carboxylic acid examples include acrylic acid esters and methacryl of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcin diacrylate, resorcin dimethacrylate, and pyrogallol triacrylate. Acid esters can be mentioned.
  • the ester obtained by the esterification reaction of a polyvalent hydroxy compound such as an aliphatic polyhydroxy compound or an aromatic polyhydroxy compound with an unsaturated carboxylic acid or a polybasic carboxylic acid is not necessarily a single product, but for example.
  • Acrylic acid, phthalic acid, and ethylene glycol condensate Acrylic acid, maleic acid, and diethylene glycol condensate; methacrylic acid, terephthalic acid, and pentaerythritol condensate; acrylic acid, adipic acid, butanediol, and glycerin condensate Things;
  • Examples of the photopolymerizable compound used in the photosensitive resin composition of the present invention other than the above include, for example, a polyisocyanate compound and a hydroxyl group-containing (meth) acrylic acid ester or a polyisocyanate compound and a polyol and a hydroxyl group-containing (meth) acrylic.
  • Urethane (meth) acrylates obtained by reacting an acid ester epoxy acrylates such as an addition reaction product of a polyvalent epoxy compound and a hydroxyl group-containing (meth) acrylic acid ester or (meth) acrylic acid
  • ethylene bis Acrylamides such as acrylamide
  • allyl esters such as diallyl phthalate
  • vinyl group-containing compounds such as divinylphthalate
  • urethane (meth) acrylates examples include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U- 10PA, U-33H, UA-53H, UA-32P, UA-1100H (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), UA-306H, UA-510H, UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.), UV-1700B, Examples thereof include UV-7600B, UV-7605B, UV-7630B, and UV7640B (manufactured by Nippon Kayaku Kagaku Kogyo Co., Ltd.).
  • ester (meth) acrylates or urethane (meth) acrylates are preferably used as the (C) photopolymerizable compound from the viewpoint of appropriate taper angle and sensitivity, and dipentaerythritol hexa (meth) acrylate, Dipentaerythritol Penta (meth) acrylate, 2-tris (meth) acryloyloxymethylethylphthalic acid, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate It is more preferable to use an acid anhydride adduct and a dibasic acid anhydride adduct of pentaerythritol tri (meth) acrylate. These may be used alone or in combination of two or more.
  • the molecular weight of the (C) photopolymerizable compound is not particularly limited, but is preferably 100 or more, more preferably 150 or more, and further, from the viewpoint of sensitivity, ink repellency, and taper angle. It is preferably 200 or more, more preferably 300 or more, particularly preferably 400 or more, most preferably 500 or more, preferably 1000 or less, and more preferably 700 or less.
  • the upper and lower limits can be arbitrarily combined, for example, 100 to 1000 is preferable, 150 to 1000 is more preferable, 200 to 1000 is further preferable, 300 to 700 is further preferable, 400 to 700 is particularly preferable, and 500.
  • ⁇ 700 is the most preferable.
  • the number of carbon atoms of the (C) photopolymerizable compound is not particularly limited, but from the viewpoint of sensitivity, ink repellency, and taper angle, it is preferably 7 or more, more preferably 10 or more, still more preferably 15 or more, still more preferably 20.
  • the above is particularly preferably 25 or more, preferably 50 or less, more preferably 40 or less, still more preferably 35 or less, and particularly preferably 30 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 7 to 50 is preferable, 10 to 50 is more preferable, 15 to 40 is further preferable, 20 to 35 is further preferable, and 25 to 30 is particularly preferable.
  • ester (meth) acrylates from the viewpoint of sensitivity, ink repellency, and taper angle, ester (meth) acrylates, epoxy (meth) acrylates, and urethane (meth) acrylates are preferable, and among them, pentaerythritol tetra (meth) acrylate and pentaerythritol tri (pentaerythritol tetra (meth) acrylate).
  • the content of the (C) photopolymerizable compound in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 10% by mass or more in the total solid content of the photosensitive resin composition. 20% by mass or more, more preferably 30% by mass or more, particularly preferably 40% by mass or more, preferably 80% by mass or less, more preferably 70% by mass or less, still more preferably 60% by mass or less, still more preferable. Is 55% by mass or less, particularly preferably 50% by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 5 to 80% by mass is preferable, 10 to 70% by mass is more preferable, 20 to 60% by mass is further preferable, and 30 to 55% by mass or more is further preferable. , 40 to 50% by mass is particularly preferable.
  • the value is equal to or higher than the lower limit, the internal curability tends to be appropriate.
  • the value is not more than the upper limit, the developability tends to be good.
  • composition (D) contains a repeating unit represented by the following general formula (II) and a fluorine atom. Contains acrylic resin (D1).
  • R 11 independently represents a hydrogen atom or a methyl group
  • the alkyl group of R 12 usually has 2 or more carbon atoms, preferably 4 or more carbon atoms, and usually 6 or less, preferably 5 or less carbon atoms.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 2 to 6 are preferable, and 4 to 5 are more preferable. By setting it to the above lower limit value or more, synthesis becomes easy. Further, when the value is not more than the upper limit, the degree of freedom of the ethylenically unsaturated bond is increased, and the curability and liquid repellency tend to be improved.
  • R 12 has a substituent
  • substituents include a hydroxyl group and an alkoxy group having 1 to 3 carbon atoms. It is preferably unsubstituted or substituted with a hydroxyl group, and more preferably unsubstituted.
  • R 12 the groups represented by- (C 2 H 4 ) 2- NHCOO- (C 2 H 4 ) 2 -,-(CH) 2- CHOH- (CH 2 )-are preferable in terms of liquid repellency. , -(C 2 H 4 ) 2- NHCOO- (C 2 H 4 ) 2-The groups represented by-are more preferred.
  • ink repellency liquid repellency
  • acrylic resin (D1) acrylic resin
  • the cross-linking reaction on the surface of the formed coating film can be accelerated when the formed coating film is exposed, and the liquid repellent can be developed. It is considered that the outflow is less likely to occur, and as a result, the obtained partition wall can exhibit high ink repellency.
  • the fluorine atom-containing resin tends to be oriented on the surface of the partition wall to prevent ink bleeding and color mixing. More specifically, the group having a fluorine atom tends to repel the ink and prevent the ink from bleeding or mixing due to the ink entering the adjacent region beyond the partition wall.
  • the acrylic resin (D1) preferably has either or both of a fluoroalkyl group and a fluoroalkylene group, and more preferably has either or both of a perfluoroalkyl group and a perfluoroalkylene ether chain.
  • a fluoroalkyl group and a fluoroalkylene group or one or both of a perfluoroalkyl group and a perfluoroalkylene ether chain
  • the fluorine atom-containing resin is more likely to be oriented on the surface of the partition wall. It exhibits higher ink repellency and tends to further prevent ink bleeding and color mixing.
  • Examples of the perfluoroalkyl group include a perfluorobutyl group, a perfluorohexyl group, and a perfluorooctyl group.
  • Examples of the perfluoroalkylene ether chain include -CF 2- O-,-(CF 2 ) 2- O-,-(CF 2 ) 3- O-, and -CF 2- C (CF 3 ) O-,-. Examples thereof include C (CF 3 ) -CF 2- O- and divalent groups having these repeating units.
  • the acrylic resin (D1) may have a structural unit other than the repeating unit represented by the general formula (II) and the structural unit containing a fluorine atom.
  • a structural unit containing an epoxy group, a structural unit containing a carboxy group, and a structural unit having an alkylene oxide chain can be mentioned.
  • the fluorine atom content in the acrylic resin (D1) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 20% by mass or more, and 25% by mass in the acrylic resin (D1). The above is even more preferable. Further, 50% by mass or less is preferable, and 35% by mass or less is more preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 50% by mass is preferable, 10 to 50% by mass is more preferable, 20 to 35% by mass is further preferable, and 25 to 35% by mass is further preferable.
  • the molecular weight of the acrylic resin (D1) is not particularly limited, and it may be a low molecular weight compound or a high molecular weight substance.
  • a high molecular weight substance is preferable because the fluidity due to post-baking can be suppressed and the outflow from the partition wall can be suppressed.
  • the weight average molecular weight of the acrylic resin (D1) is preferably 100 or more, and 500 or more. Is more preferable, 100,000 or less is preferable, and 10,000 or less is more preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 100 to 100,000 is preferable, and 500 to 10000 is more preferable.
  • Acrylic resin (D1) may be used alone or in combination of two or more.
  • a liquid repellent other than the acrylic resin (D1) may be used in combination as the (D) liquid repellent.
  • the content of the liquid repellent (D) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.05% by mass, in the total solid content of the photosensitive resin composition. % Or more, more preferably 0.1% by mass or more, particularly preferably 0.2% by mass or more, and preferably 5% by mass or less, more preferably 3% by mass or less, still more preferably 1% by mass or less. is there.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 0.01 to 5% by mass is preferable, 0.05 to 5% by mass is more preferable, 0.1 to 3% by mass is further preferable, and 0. 2 to 1% by mass is particularly preferable.
  • the ink repellency tends to be improved. Further, when the value is not more than the upper limit value, a uniform coating film tends to be easily obtained when the ink is applied to the pixel portion after the partition wall is formed.
  • the content of the acrylic resin (D1) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass, in the total solid content of the photosensitive resin composition. % Or more, more preferably 0.2% by mass or more, preferably 5% by mass or less, more preferably 3% by mass or less, still more preferably 1% by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 0.01 to 5% by mass is preferable, 0.1 to 3% by mass is more preferable, and 0.2 to 1% by mass is further preferable.
  • the value is equal to or higher than the lower limit, the ink repellency tends to be improved. Further, when the value is not more than the upper limit value, a uniform coating film tends to be easily obtained when the ink is applied to the pixel portion after the partition wall is formed.
  • the photosensitive resin composition of the present invention may contain (E) a chain transfer agent.
  • a chain transfer agent By including the chain transfer agent, radical inactivation due to oxygen inhibition in the vicinity of the surface is improved, surface curability can be enhanced, and the taper angle tends to be high. Further, by increasing the surface curability, the outflow of the liquid repellent can be suppressed, and the liquid repellent tends to be easily fixed in the vicinity of the surface of the partition wall and the contact angle tends to be high.
  • the chain transfer agent include a mercapto group-containing compound and carbon tetrachloride, and a mercapto group-containing compound is more preferable because the chain transfer effect tends to be high. Since the mercapto group-containing compound tends to cause bond cleavage and chain transfer reaction due to its small SH binding energy, it tends to be able to improve the surface curability.
  • a mercapto group-containing compound having an aromatic ring and an aliphatic mercapto group-containing compound are preferable from the viewpoint of taper angle and surface curability.
  • a compound represented by the following general formula (E-1) is preferably used from the viewpoint of the taper angle.
  • Z represents -O-, -S- or -NH-
  • R 61 , R 62 , R 63 and R 64 each independently represent a hydrogen atom or a monovalent substituent. ..
  • Z is preferably -S- or -NH-, and more preferably -NH-.
  • R 61 , R 62 , R 63 and R 64 are each independently preferably a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, and a hydrogen atom is more preferable. preferable.
  • Examples of the mercapto group-containing compound having an aromatic ring include 2-mercaptobenzothiazole, 2-mercaptobenzoimidazole, 2-mercaptobenzoxazole, 3-mercapto-1,2,4-triazole, and 2-mercapto-4 ( Examples thereof include mercapto group-containing compounds having an aromatic ring such as 3H) -quinazoline, ⁇ -mercaptonaphthalene, and 1,4-dimethylmercaptobenzene. From the viewpoint of taper angle, 2-mercaptobenzothiazole and 2-mercaptobenzoimidazole are used. preferable.
  • hexanedithiol, decanedithiol, or a compound represented by the following general formula (E-2) is preferably used from the viewpoint of surface curability.
  • m represents an integer of 0 to 4
  • n represents an integer of 2 to 4.
  • R 71 and R 72 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • X represents an n-valent group.
  • m is preferably 1 or 2 from the viewpoint of ease of synthesis.
  • n is preferably 3 or 4.
  • the alkyl group of R 71 and R 72 those having 1 to 3 carbon atoms are preferable from the viewpoint of surface curability.
  • R 72 is preferably a hydrogen atom, in which case R 71 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. Is preferable.
  • X is preferably an alkylene group having 1 to 6 carbon atoms which may have an ether bond and a branched portion. Among them, an alkylene group having 1 to 6 carbon atoms is more preferable, and an alkylene group having 4 carbon atoms is further preferable, from the viewpoint of surface curability and easiness of synthesis.
  • X is preferably a structure represented by the following general formula (E-2-1) or (E-2-2).
  • R 73 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a methylol group.
  • R 73 an ethyl group is preferable from the viewpoint of the taper angle.
  • R 74 represents an alkylene group having 1 to 4 carbon atoms.
  • R 74 an ethylene group is preferable from the viewpoint of the taper angle.
  • X has a structure represented by the following general formula (E-2-3).
  • Examples of the aliphatic mercapto group-containing compound include butanediol bis (3-mercaptopropionate), butanediol bisthioglycolate, ethylene glycol bis (3-mercaptopropionate), and ethylene glycol bisthioglycolate.
  • Trimethylol Propantris (3-Mercaptopropionate), Trimethylol Propanetristhioglycolate, Trishydroxyethyl Tristhiopropionate, Pentaerythritol Tetrakiss (3-Mercaptopropionate), Pentaerythritol Tris (3-Mercapto) Propionate), butanediol bis (3-mercaptobutyrate), ethylene glycol bis (3-mercaptobutyrate), trimethylolpropanthris (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptobutyrate), Pentaerythritol tris (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione Can be mentioned.
  • trimetylolpropanthris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritoltris (3-mercaptopropionate), trimetylolpropanthris (3-mercaptobuty) Rate), pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tris (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2 , 4, 6 (1H, 3H, 5H) -trione is preferable, and pentaerythritol tetrakis (3-mercaptopropionate) and pentaerythritol tetrakis (3-mercaptobutyrate) are more preferable.
  • 2-mercaptobenzothiazole 2-mercaptobenzimidazole
  • 2-mercaptobenzoxazole 2-mercaptobenzoxazole
  • 2-mercaptobenzothiazole 2-mercaptobenzimidazole
  • 2-mercaptobenzothiazole and 2-mercaptobenzimidazole may be used in combination.
  • one or more selected from the group consisting of pentaerythritol tetrakis (3-mercaptopropionate) and pentaerythritol tetrakis (3-mercaptobutyrate) may be used. preferable.
  • the content thereof is not particularly limited, but is preferably 0.01% by mass or more in the total solid content of the photosensitive resin composition. It is preferably 0.025% by mass or more, more preferably 0.05% by mass or more, still more preferably 0.1% by mass or more, particularly preferably 1% by mass or more, and preferably 5% by mass or less. It is preferably 4% by mass or less, more preferably 3% by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, for example, 0.01 to 5% by mass is preferable, 0.025 to 5% by mass is more preferable, 0.05 to 4% by mass is further preferable, and 0.1 to 0.1 to 4% by mass is preferable. 4% by mass is even more preferable, and 1 to 3% by mass is particularly preferable.
  • the taper angle tends to be high, the surface curability is high, and the ink repellency tends to be high. Further, when the value is not more than the upper limit value, a desired pattern tends to be easily formed.
  • the content thereof is based on 100 parts by mass of the mercapto group-containing compound having an aromatic ring.
  • the aliphatic mercapto group-containing compound is preferably 10 parts by mass or more, more preferably 50 parts by mass or more, further preferably 80 parts by mass or more, and preferably 400 parts by mass or less, more preferably 300 parts by mass or less. More preferably, it is 200 parts by mass or less, and particularly preferably 150 parts by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 10 to 400 parts by mass is preferable, 10 to 300 parts by mass is more preferable, 50 to 200 parts by mass is further preferable, and 80 to 150 parts by mass is particularly preferable.
  • 10 to 400 parts by mass is preferable
  • 10 to 300 parts by mass is more preferable
  • 50 to 200 parts by mass is further preferable
  • 80 to 150 parts by mass is particularly preferable.
  • the blending ratio of the (E) chain transfer agent to the (D) photopolymerization initiator in the photosensitive resin composition is preferably 10 parts by mass or more, preferably 25 parts by mass, based on 100 parts by mass of the (D) photopolymerization initiator. More than parts are more preferable, 50 parts by mass or more is further preferable, 80 parts by mass or more is particularly preferable, 500 parts by mass or less is more preferable, 400 parts by mass or less is more preferable, 300 parts by mass or less is further preferable, and 200 parts by mass is more preferable. The following is even more preferable, and 150 parts by mass or less is particularly preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 10 to 500 parts by mass is preferable, 10 to 400 parts by mass is more preferable, 25 to 300 parts by mass is further preferable, and 50 to 200 parts by mass is further preferable. 80 to 150 parts by mass is particularly preferable.
  • the taper angle tends to be high, the surface curability is high, and the ink repellency tends to be high. Further, when the value is not more than the upper limit value, a desired pattern tends to be easily formed.
  • the photosensitive resin composition of the present invention may contain an ultraviolet absorber.
  • the ultraviolet absorber is added for the purpose of controlling the photocuring distribution by absorbing a specific wavelength of the light source used for exposure by the ultraviolet absorber.
  • the ultraviolet absorber By including the ultraviolet absorber, there is a tendency to obtain effects such as improving the taper angle shape after development and reducing the residue remaining in the non-exposed portion after development.
  • the ultraviolet absorber for example, a compound having an absorption maximum between 250 nm and 400 nm can be used from the viewpoint of inhibiting light absorption by the photopolymerization initiator.
  • ultraviolet absorber examples include benzotriazole compounds, triazine compounds, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and its derivatives, dinaphthalene compounds, phenanthroline compounds, and dyes. These ultraviolet absorbers may be used alone or in combination of two or more.
  • a benzotriazole compound and / or a hydroxyphenyltriazine compound is preferable, and a benzotriazole compound is particularly preferable, from the viewpoint of increasing the taper angle.
  • the benzotriazole compound described by the following general formula (Z1) is preferable from the viewpoint of the tapered shape.
  • R 1e and R 2e are independently hydrogen atoms, an alkyl group which may have a substituent, a group represented by the following general formula (Z2), or the following general formula (Z3).
  • Z2 represents a group represented by the following general formula (Z2), or the following general formula (Z3).
  • Z3 represents a group.
  • R 3e represents a hydrogen atom or a halogen atom.
  • R 4e represents an alkylene group which may have a substituent
  • R 5e represents an alkyl group which may have a substituent
  • R 6e represents an alkylene group which may have a substituent
  • R 7e represents a hydrogen atom or a methyl group.
  • R 1e and R 2e are independently represented by a hydrogen atom, an alkyl group which may have a substituent, a group represented by the general formula (Z2), or a general formula (Z3).
  • the alkyl group include linear, branched or cyclic alkyl groups.
  • the carbon number is preferably 1 or more, more preferably 2 or more, further preferably 4 or more, preferably 10 or less, and more preferably 6 or less. It is more preferably 4 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 10 are preferable, 2 to 6 are more preferable, and 4 to 6 are further preferable.
  • alkyl group examples include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, and a tert-butyl group. Of these, the tert-butyl group is preferable.
  • substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group and a carboxy group. , Acryloyl group, methacryloyl group and the like.
  • R 3e represents a hydrogen atom or a halogen atom.
  • the halogen atom include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
  • R 3e is a hydrogen atom.
  • R 4e represents an alkylene group which may have a substituent.
  • the alkylene group include a linear, branched chain or cyclic alkylene group.
  • the carbon number is usually 1 or more, preferably 2 or more, preferably 6 or less, more preferably 4 or less, still more preferably 3 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 6 are preferable, 1 to 4 are more preferable, and 2 to 3 are further preferable.
  • alkylene group examples include a methylene group, an ethylene group, a propylene group, a propylene group and a butylene group. Of these, an ethylene group is preferable.
  • substituent that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group and a carboxy group. , Acryloyl group, methacryloyl group and the like.
  • R 4e is an ethylene group.
  • R 5e In the above formula (Z2), it represents an alkyl group which may have a substituent.
  • the alkyl group include linear, branched or cyclic alkyl groups.
  • the carbon number is preferably 4 or more, more preferably 5 or more, further preferably 7 or more, preferably 15 or less, and more preferably 10 or less. It is more preferably 9 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 5 to 15 are preferable, 5 to 10 are more preferable, and 7 to 9 are further preferable.
  • alkyl group examples include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a hepsyl group, an octyl group and a nonyl group.
  • substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group and a carboxy group. , Acryloyl group, methacryloyl group and the like.
  • R 5e is a heptyl group, an octyl group, or a nonyl group.
  • R 6e represents an alkylene group which may have a substituent.
  • the alkylene group include a linear, branched chain or cyclic alkylene group.
  • the carbon number is usually 1 or more, preferably 2 or more, preferably 6 or less, more preferably 4 or less, still more preferably 3 or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 1 to 6 are preferable, 1 to 4 are more preferable, and 2 to 3 are further preferable.
  • alkylene group examples include a methylene group, an ethylene group, a propylene group, a propylene group and a butylene group. Of these, an ethylene group is preferable.
  • substituent that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group and a carboxy group. , Acryloyl group, methacryloyl group and the like.
  • R 1e is a tert-butyl group
  • R 2e is a group represented by the above formula (Z2) (however, R 4e is an ethylene group and R 5e is an alkyl group having 7 to 9 carbon atoms.
  • R 3e is a hydrogen atom, or R 1e is a hydrogen atom
  • R 2e is a group represented by the above formula (Z3) (where R 6e is an ethylene group and R 7e is a methyl group)
  • R 3e Is preferably a hydrogen atom
  • R 1e is a tert-butyl group
  • R 2e is a group represented by the above formula (Z2) (where R 4e is an ethylene group and R 5e is an alkyl group having 7 to 9 carbon atoms).
  • a compound in which R 3e is a hydrogen atom is more preferable.
  • benzotriazole compound examples include 2- (5-methyl-2-hydroxyphenyl) benzotriazole, 2- (2-hydroxy-5-t-butylphenyl) -2H-benzotriazole, and octyl-3 [3-tert.
  • benzotriazole compounds examples include Sumisorb (registered trademark, the same applies hereinafter) 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical Co., Ltd.), JF77, JF78, JF79, JF80, etc.
  • JF83 (manufactured by Johoku Kagaku Kogyo Co., Ltd.), TINUVIN (registered trademark, the same applies hereinafter) PS, TINUVIN99-2, TINUVIN109, TINUVIN384-2, TINUVIN326, TINUVIN900, TINUVIN928, TINUVIN1130 (manufactured by BASF), EVERSORB70, EVERSORB71 , EVERSORB74, EVERSORB75, EVERSORB76, EVERSORB234, EVERSORB77, EVERSORB78, EVERSORB80, EVERSORB81 (Taiwan Eiko Chemical Industry Co., Ltd.) 701, SEESORB702, SEESORB703, SEESORB704, SEESORB706, SEESORB707, SEESORB709 (manufactured by Cipro Kasei Co., Ltd.), RUVA-93 (manufactured by Otsuka Chemical Co., Ltd
  • triazine compound examples include 2- [4,6-di (2,4-kisilyl) -1,3,5-triazine-2-yl] -5-octyloxyphenol and 2- [4,6-yl].
  • a hydroxyphenyltriazine compound is preferable from the viewpoint of taper angle and exposure sensitivity.
  • examples of commercially available triazine compounds include TINUVIN400, TINUVIN405, TINUVIN460, TINUVIN477, and TINUVIN479 (manufactured by BASF).
  • UV absorbers examples include Sumisorb 130 (manufactured by Sumitomo Chemical Co., Ltd.), EVERSORB10, EVERSORB11, EVERSORB12 (manufactured by Taiwan Eiko Chemical Industry Co., Ltd.), Tomisorb 800 (manufactured by AP Corporation), SEESORB100, SEESORB101, SEESORB101S, SEESORB102.
  • Benzophenone compounds such as SEESORB103, SEESORB105, SEESORB106, SEESORB107, SEESORB151 (manufactured by Cipro Chemical Co., Ltd.); benzoate compounds such as Sumisorb 400 (manufactured by Sumitomo Chemical Co., Ltd.), phenyl salicylate; Ceramic acid derivatives such as isopropyl methoxycinnamate and isoamyl methoxycinnamate; ⁇ -naphthal, ⁇ -naphthal, ⁇ -naphthal methyl ether, ⁇ -naphthal ethyl ether, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene.
  • 1,4-Dihydroxynaphthalene 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, Naphthalene derivatives such as 2,7-dihydroxynaphthalene; anthracene such as anthracene and 9,10-dihydroxyanthracene and their derivatives; azo dyes, benzophenone dyes, aminoketone dyes, quinoline dyes, anthraquinone dyes, diphenylcyanoacrylate dyes Dyes such as dyes, triazine dyes, p-aminobenzoic acid dyes; and the like; Among these, from the viewpoint of exposure sensitivity, it is preferable to use a cinnamic acid derivative and a naphthalene derivative, and it is particularly preferable to
  • the content of the ultraviolet absorber in the photosensitive resin composition is preferably 0.01% by mass or more in the total solid content of the photosensitive resin composition. , More preferably 0.05% by mass or more, still more preferably 0.1% by mass or more, still more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, and preferably 15% by mass or less. , More preferably 10% by mass or less, further preferably 5% by mass or less, and particularly preferably 3% by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 0.01 to 15% by mass is preferable, 0.05 to 15% by mass is more preferable, 0.1 to 10% by mass is further preferable, and 0.5 to 0.5% by mass is preferable. 5% by mass is even more preferable, and 1 to 3% by mass is particularly preferable.
  • the taper angle tends to increase when the value is equal to or higher than the lower limit. Further, when the value is not more than the upper limit value, the sensitivity tends to be high.
  • the compounding ratio with respect to (D) the photopolymerization initiator is preferably 1 part by mass or more with respect to 100 parts by mass of the (D) photopolymerization initiator. It is more preferably 10 parts by mass or more, further preferably 30 parts by mass or more, still more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, and preferably 500 parts by mass or less, more preferably 300 parts by mass or more. Hereinafter, it is more preferably 200 parts by mass or less, and particularly preferably 150 parts by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 10 to 500 parts by mass is preferable, 30 to 300 parts by mass is more preferable, 50 to 200 parts by mass is further preferable, and 80 to 150 parts by mass is particularly preferable.
  • the taper angle tends to increase when the value is equal to or higher than the lower limit. Further, when the value is not more than the upper limit value, the sensitivity tends to be high.
  • the photosensitive resin composition of the present invention may contain a polymerization inhibitor. Since radical polymerization is inhibited by containing a polymerization inhibitor, it is considered that the taper angle of the obtained partition wall can be increased.
  • the polymerization inhibitor include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, and 2,6-di-tert-butyl-4-cresol (BHT). Among these, methyl hydroquinone and methoxyphenol are preferable, and methyl hydroquinone is more preferable, from the viewpoint of polymerization inhibitory ability.
  • the polymerization inhibitor one type may be used alone, or two or more types may be used in combination.
  • a polymerization inhibitor may be contained in the resin, and this may be used as the polymerization inhibitor contained in the photosensitive resin composition of the present invention.
  • the same or different polymerization inhibitor may be added at the time of producing the photosensitive resin composition.
  • the content of the polymerization inhibitor in the photosensitive resin composition is preferably 0.0005% by mass or more in the total solid content of the photosensitive resin composition. , More preferably 0.001% by mass or more, still more preferably 0.01% by mass or more, and preferably 0.3% by mass or less, more preferably 0.2% by mass or less, still more preferably 0.1% by mass. % Or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 0.0005 to 0.3% by mass is preferable, 0.001 to 0.2% by mass is more preferable, and 0.01 to 0.1% by mass is further preferable. preferable.
  • the taper angle can be increased by setting it to the lower limit value or more. Further, when the value is not more than the upper limit value, high sensitivity tends to be maintained.
  • the photosensitive resin composition of the present invention may contain an amino compound in order to promote thermosetting.
  • the content of the amino compound in the photosensitive resin composition is preferably 40% by mass or less, more preferably 40% by mass or less, based on the total solid content of the photosensitive resin composition. Is 30% by mass or less. Further, it is preferably 0.5% by mass or more, and more preferably 1% by mass or more.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 0.5 to 40% by mass is preferable, and 1 to 30% by mass is more preferable. When the value is not more than the upper limit, storage stability tends to be maintained. When it is set to the lower limit value or more, sufficient thermosetting property tends to be ensured.
  • the amino compound examples include a methylol group as a functional group and an amino compound having at least two alkoxymethyl groups obtained by alcohol-condensation-modifying the methylol group with 1 to 8 carbon atoms.
  • a melamine resin obtained by polycondensing melamine and formaldehyde a benzoguanamine resin obtained by polycondensing benzoguanamine and formaldehyde
  • a glycoluryl resin obtained by polycondensing glycoluryl and formaldehyde
  • urea and formaldehyde are combined.
  • Polycondensation urea resin resin obtained by polycondensation of two or more kinds of melamine, benzoguanamine, glycoluryl, urea and the like with formaldehyde; modified resin obtained by alcohol condensation modification of the methylol group of the above-mentioned resin.
  • a melamine resin and a modified resin thereof are preferable, a modified resin having a methylol group modification ratio of 70% or more is more preferable, and a modified resin having a modification ratio of 80% or more is particularly preferable.
  • Examples of the melamine resin as an amino compound and the modified resin thereof include Cymel (registered trademark, the same applies hereinafter) 300, 301, 303, 350, 736, 738, 370, 771, 325, 327, 703, manufactured by Cytec. 701, 266, 267, 285, 232, 235, 238, 1141, 272, 254, 202, 1156, 1158, and Nikalac (registered trademark, the same shall apply hereinafter) manufactured by Sanwa Chemical Co., Ltd. MW-390, MW-100LM , MX-750LM, MW-30M, MX-45, MX-302.
  • Examples of the benzoguanamine resin and its modified resin include Cymel 1123, 1125 and 1128 manufactured by Cytec.
  • glycoluril resin and its modified resin examples include Cymel 1170, 1171, 1174, 1172 manufactured by Cytec Co., Ltd. and Nicarac MX-270 manufactured by Sanwa Chemical Co., Ltd.
  • examples of the urea resin and its modified resin include UFR (registered trademark, the same shall apply hereinafter) 65 and 300 manufactured by Cytec Co., Ltd. and Nicarac MX-290 manufactured by Sanwa Chemical Co., Ltd.
  • the photosensitive resin composition of the present invention may contain a colorant for the purpose of coloring the partition wall.
  • a colorant known colorants such as pigments and dyes can be used.
  • a pigment When a pigment is used, a known dispersant or dispersion aid may be used in combination so that the pigment can stably exist in the photosensitive resin composition without agglomeration.
  • the black colorant in addition to black dyes, black pigments, carbon black, titanium black, etc., mixing organic pigments to color black is also effective as an effect of imparting low conductivity.
  • the content of the colorant is preferably 60% by mass or less, more preferably 40% by mass or less, in the total solid content of the photosensitive resin composition from the viewpoint of plate-making property and color characteristics.
  • the content of the colorant in the photosensitive resin composition is low, for example, 20% by mass or less, more preferably 10% by mass or less, and 5% by mass, based on the total solid content of the photosensitive resin composition. % Or less is particularly preferable, and 0% by mass is most preferable.
  • the photosensitive resin composition of the present invention may contain a coatability improver and a development improver in order to improve coatability and development solubility. ..
  • a coatability improver or the development improver for example, a known surfactant can be used.
  • the surfactant can be used for the purpose of improving the coatability of the photosensitive resin composition as a coating liquid and the developability of the coating film, and among them, a fluorine-based surfactant or a silicone-based surfactant is preferable.
  • a silicone-based surfactant is preferable because it has an action of removing the residue of the photosensitive resin composition from the unexposed portion and a function of exhibiting wettability during development, and a polyether-modified silicone-based one is preferable.
  • Surfactants are more preferred.
  • a compound having a fluoroalkyl or fluoroalkylene group at at least one of the terminal, main chain and side chain is suitable. Specifically, 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, octaethylene glycol di (1,1,2,2-tetrafluorooctylhexyl ether).
  • 1,1,2,2-tetrafluorobutyl) ether 1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1,1,2,2- Tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecylsulfonate, 1,1,2,2,8,8,9, 9,10,10-decafluorodecane, 1,1,2,2,3,3-hexafluorodecane and the like can be mentioned.
  • Examples of these commercially available products include “BM-1000” and “BM-1100” manufactured by BM Chemie, “Mega Fvck F470", “Mega Fvck F475", “Mega Fvck F554" and “Mega Fvck F559” manufactured by DIC Corporation. , “FC430” manufactured by 3M Japan Ltd., and “DFX-18” manufactured by Neos Co., Ltd.
  • silicone-based surfactant examples include Toray Dow Corning's "DC3PA”, “SH7PA”, “DC11PA”, “SH21PA”, “SH28PA”, “SH29PA”, “8032Adaptive”, “SH8400”, and Big Chemie. Examples include “BYK (registered trademark, the same applies hereinafter) 323" and “BYK330” manufactured by the same manufacturer.
  • the surfactant may contain other surfactants other than the fluorine-based surfactant and the silicone-based surfactant, and the other surfactants include, for example, nonionic, anionic, cationic and amphoteric. Surfactants can be mentioned.
  • nonionic surfactants include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, polyoxyethylene alkyl esters, polyoxyethylene fatty acid esters, and glycerin. Fatty ester, polyoxyethylene glycerin fatty acid ester, pentaerythlit fatty acid ester, polyoxyethylene pentaerythlit fatty acid ester, sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, sorbit fatty acid ester, polyoxyethylene Examples include sorbit fatty acid esters. Examples of these commercially available products include polyoxyethylene-based surfactants such as "Emargen (registered trademark; the same applies hereinafter) 104P" and "Emargen A60" manufactured by Kao Corporation.
  • anionic surfactants include alkyl sulfonates, alkylbenzene sulfonates, alkylnaphthalene sulfonates, polyoxyethylene alkyl ether sulfonates, alkyl sulfates, alkyl sulfates, higher alcohol sulfates, and the like. Aliphatic alcohol sulfates, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkyl phosphoric acid ester salts, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphates, special polymer systems Surfactants can be mentioned.
  • special polymer-based surfactants are preferable, and special polycarboxylic acid-type polymer-based surfactants are even more preferable.
  • anionic surfactant include Kao's "Emar (registered trademark) 10" for alkyl sulfate esters and Kao's "Perex (registered trademark) NB-L” for alkylnaphthalene sulfonates.
  • special polymer-based surfactant include "Homogenol (registered trademark, the same applies hereinafter) L-18" and "Homogenol L-100" manufactured by Kao Corporation.
  • Examples of the cationic surfactant include quaternary ammonium salts, imidazoline derivatives, and alkylamine salts.
  • Examples of amphoteric surfactants include betaine-type compounds, imidazolium salts, imidazolines, and amino acids. Of these, quaternary ammonium salts are preferred, and stearyltrimethylammonium salts are even more preferred.
  • Examples of the cationic surfactant or benign surfactant include "Acetamine (registered trademark) 24" manufactured by Kao Corporation as an alkylamine salt, and "Coatamine” manufactured by Kao Corporation as a quaternary ammonium salt.
  • 24P ”and“ Coatamine 86W ” can be mentioned.
  • One type of surfactant may be used alone, or two or more types may be used in combination.
  • a combination of a silicone-based surfactant / a fluorine-based surfactant, a combination of a silicone-based surfactant / a special polymer-based surfactant, and a combination of a fluorine-based surfactant / a special polymer-based surfactant can be mentioned. .. Of these, a combination of a silicone-based surfactant / a fluorine-based surfactant is preferable.
  • silicone-based surfactant / fluorine-based surfactant for example, “BYK-300” or “BYK-330” manufactured by Big Chemie, “DFX-18” manufactured by Neos, and “BYK-300” manufactured by Big Chemie. , “BYK-330” / AGC Seimi Chemical Co., Ltd. "S-393”, Big Chemie Co., Ltd. "BYK-300” or “BYK-330” / DIC Co., Ltd.
  • the development improver for example, a known development improver containing an organic carboxylic acid or an anhydride thereof can also be used.
  • the content of the coatability improver or the development improver is included in the total solid content of the photosensitive resin composition from the viewpoint of sensitivity. , Preferably 20% by mass or less, more preferably 10% by mass or less, respectively.
  • the photosensitive resin composition of the present invention may contain a silane coupling agent in order to improve the adhesion to the substrate.
  • a silane coupling agent for example, an epoxy-based, methacryl-based, amino-based, or imidazole-based silane coupling agent can be used. From the viewpoint of improving adhesion, epoxy-based and imidazole-based silane coupling agents are particularly preferable.
  • the content of the silane coupling agent is preferably 20% by mass or less in the total solid content of the photosensitive resin composition from the viewpoint of adhesion. , More preferably 15% by mass or less.
  • the photosensitive resin composition of the present invention may contain a phosphoric acid adhesion improver in order to improve the adhesion to the substrate.
  • a phosphoric acid adhesion improver (meth) acryloyloxy group-containing phosphates are preferable, and among them, those represented by the following general formulas (Va), (Vb) and (Vc) are preferable.
  • R 8 represents a hydrogen atom or a methyl group
  • s is 1, 2 or 3.
  • the content thereof is not particularly limited, but is preferably 0.1% by mass or more in the total solid content of the photosensitive resin composition, and is 0. .2% by mass or more is more preferable, 0.3% by mass or more is further preferable, 5% by mass or less is preferable, 3% by mass or less is more preferable, and 1% by mass or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 0.1 to 5% by mass is preferable, 0.2 to 3% by mass is more preferable, and 0.3 to 1% by mass is further preferable.
  • the photosensitive resin composition of the present invention has an excellent coating film due to an appropriate interaction with an alkali-soluble resin (formation of a matrix structure) as well as an improvement in strength as a cured product.
  • An inorganic filler may be contained for the purpose of improving flatness and taper angle. Examples of the inorganic filler include talc, silica, alumina, barium sulfate, magnesium oxide, and those obtained by surface-treating these with various silane coupling agents.
  • the average particle size of the inorganic filler is preferably 0.005 to 20 ⁇ m, more preferably 0.01 to 10 ⁇ m.
  • the average particle size is a value measured by a laser diffraction / scattering particle size distribution measuring device manufactured by Beckman Coulter.
  • silica sol and modified silica sol are preferable because they tend to be excellent in the effect of improving the taper angle as well as the dispersion stability.
  • the photosensitive resin composition of the present invention contains an inorganic filler, the content thereof is preferably 5% by mass or more, more preferably 10 in the total solid content of the photosensitive resin composition from the viewpoint of sensitivity.
  • It is 0% by mass or more, preferably 80% by mass or less, and more preferably 70% by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 5 to 80% by mass is preferable, and 10 to 70% by mass is more preferable.
  • the photosensitive resin composition of the present invention usually contains a solvent and is used in a state in which each of the above-mentioned components is dissolved or dispersed in the solvent.
  • the solvent is not particularly limited, and examples thereof include the organic solvents described below.
  • Ethylene glycol monomethyl ether ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol-t-butyl ether, diethylene glycol monomethyl Ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethylpentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol, tri Glycol monoalkyl ethers such as ethylene glycol monomethyl ether, triethylene glycol monoethyl ether, and tripropylene glycol methyl ether; ethylene glycol dimethyl ether, ethylene glycol diethyl ether
  • solvents corresponding to the above include mineral spirit, balsol # 2, apco # 18 solvent, apco thinner, and socal solvent No. 1 and No. 2.
  • Solvesso # 150 Shell TS28 Solvent, Calbitol, Ethylcarbitol, Butylcarbitol, Methylcellosolve, Ethylcellosolve, Ethylcellosolve acetate, Methylcellosolve acetate, Diglyme (all trade names) can be mentioned.
  • the solvent can dissolve or disperse each component in the photosensitive resin composition and is selected according to the method of use of the photosensitive resin composition of the present invention, but from the viewpoint of coatability, it is under atmospheric pressure (from the viewpoint of coatability).
  • the boiling point at 1013.25 hPa) is preferably 60 to 280 ° C, more preferably 70 to 260 ° C.
  • propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate are preferable.
  • the total solid content of the solvent in the photosensitive resin composition is preferably 10% by mass or more, more preferably 15% by mass or more, still more preferably 18% by mass or more, and preferably 90% by mass or less, more preferably 90% by mass or less. It is preferably used so as to be 50% by mass or less, more preferably 40% by mass or less, and particularly preferably 30% by mass or less.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 10 to 90% by mass is preferable, 10 to 50% by mass is more preferable, 15 to 40% by mass is further preferable, and 18 to 30% by mass is particularly preferable.
  • photosensitive resin composition of the present invention is prepared by mixing each of the above components with a stirrer. In addition, you may filter using a membrane filter or the like so that the prepared photosensitive resin composition becomes uniform.
  • the photosensitive resin composition of the present invention can be suitably used for forming a partition wall, particularly a partition wall for partitioning an organic layer (light emitting portion) of an organic electroluminescent device.
  • the partition wall of the present invention is obtained by curing the photosensitive resin composition of the present invention.
  • the method for forming the partition wall using the photosensitive resin composition of the present invention is not particularly limited, and a conventionally known method can be adopted.
  • the method for forming the partition wall includes, for example, a coating step of applying a photosensitive resin composition on a substrate to form a photosensitive resin composition layer, and an exposure step of exposing the photosensitive resin composition layer.
  • the method can be mentioned.
  • a specific example of such a partition wall forming method is a photolithography method.
  • the photosensitive resin composition is applied to the entire surface of the region where the partition wall of the substrate is formed to form the photosensitive resin composition layer.
  • the formed photosensitive resin composition layer is exposed according to a predetermined partition wall pattern, and then the exposed photosensitive resin composition layer is developed to form a partition wall on the substrate.
  • a contact transfer type coating device such as a roll coater, a reverse coater, or a bar coater, or a spinner (rotation) is applied on the substrate on which a partition wall should be formed.
  • the photosensitive resin composition is applied using a non-contact coating device such as a type coating device) or a curtain flow coater, and if necessary, the solvent is removed by drying to form a photosensitive resin composition layer.
  • the photosensitive resin composition is irradiated with active energy rays such as ultraviolet rays and excimer laser light using a negative mask, and the photosensitive resin composition layer is partially divided according to the pattern of the partition wall.
  • active energy rays such as ultraviolet rays and excimer laser light using a negative mask
  • the photosensitive resin composition layer is partially divided according to the pattern of the partition wall.
  • a light source that emits ultraviolet rays such as a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a xenon lamp, and a carbon arc lamp can be used.
  • the amount of exposure varies depending on the composition of the photosensitive resin composition, but is preferably about 10 to 400 mJ / cm 2, for example.
  • the partition wall pattern is formed by developing the photosensitive resin composition layer exposed according to the partition wall pattern with a developing solution.
  • the developing method is not particularly limited, and a dipping method, a spraying method, or the like can be used.
  • Specific examples of the developing solution include organic ones such as dimethylbenzylamine, monoethanolamine, diethanolamine and triethanolamine, and aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia and quaternary ammonium salts. Can be mentioned. Further, an antifoaming agent or a surfactant can be added to the developing solution.
  • the partition wall is obtained by applying post-baking to the partition wall pattern after development and heat-curing.
  • Post-baking is preferably at 150-250 ° C. for 15-60 minutes.
  • the cleaning method is not particularly limited, and examples thereof include plasma irradiation, excimer light irradiation, and UV irradiation.
  • excimer light irradiation or UV irradiation active oxygen can decompose and remove organic substances adhering to the pixel portion by light irradiation.
  • the substrate used for forming the partition wall is not particularly limited, and is appropriately selected according to the type of the organic electroluminescent element manufactured by using the substrate on which the partition wall is formed.
  • Suitable substrate materials include glass and various resin materials.
  • Specific examples of the resin material include polyester such as polyethylene terephthalate; polyethylene and polyolefin such as polypropylene; polycarbonate; poly (meth) metaacrylic resin; polysulfone; polyimide.
  • polyester such as polyethylene terephthalate
  • polyethylene and polyolefin such as polypropylene
  • polycarbonate poly (meth) metaacrylic resin
  • polysulfone polyimide
  • glass and polyimide are preferable because they have excellent heat resistance.
  • a transparent electrode layer such as ITO or ZnO may be provided in advance on the surface of the substrate on which the partition wall is formed.
  • the photosensitive resin composition of the present invention is excellent in controlling surface curability and internal curability, it can be suitably used for forming a partition wall having a step.
  • the partition wall having a step means a partition wall having a first partition wall and a second partition wall having different heights, and for example, the first partition wall has a larger height than the second partition wall. ..
  • a partition wall having a step By using a partition wall having a step, there is a tendency that the film thickness of the organic layer (light emitting portion) can be made uniform. Further, by providing the second partition wall between the pixels, the insulating property between the pixels can be ensured, and the light emission other than the pixel portion can be suppressed.
  • the height of the step is preferably 0.7 ⁇ m or more, more preferably 0.8 ⁇ m or more, still more preferably 0.9 ⁇ m or more. Further, 1.3 ⁇ m or less is preferable, 1.2 ⁇ m or less is more preferable, and 1.1 ⁇ m or less is further preferable.
  • the upper limit and the lower limit can be arbitrarily combined, and for example, 0.7 to 1.3 ⁇ m is preferable, 0.8 to 1.2 ⁇ m is more preferable, and 0.9 to 1.1 ⁇ m is further preferable.
  • FIG. 1 and 2 show an example of a substrate provided with a partition wall having a step.
  • FIG. 1 is a plan view
  • FIG. 2 is a cross-sectional view taken along the line XX of FIG.
  • a partition wall 2 having a step is provided on the substrate 1, and an open area in the partition wall 2, that is, an area partitioned by the partition wall 2 is a pixel portion 3.
  • the partition wall 2 has an upper surface 11 of the first partition wall and an upper surface of the second partition wall, and a step 13 is formed by the height difference between the upper surface 11 of the first partition wall and the upper surface 12 of the second partition wall.
  • Examples of the method for forming the partition wall having a step include a method using a negative halftone mask in the exposure step of the forming method by the photolithography method described above.
  • a negative halftone mask for example, the portion corresponding to the pixel portion 3 is a light-shielding portion (light transmittance 0%), and the portion corresponding to the upper surface 11 of the first partition wall is an opening having the highest average light transmittance. (Completely transmitted opening), the portion corresponding to the upper surface 12 of the second partition wall is an opening (intermediately transmitted opening) having a lower average light transmittance than the completely transmitted opening.
  • a difference in the residual film ratio can be caused by the difference in the average light transmittance between the fully transmitted opening and the intermediate transmitted opening, that is, the difference in the exposure amount, and a step can be formed.
  • partition walls having steps can be collectively formed by the photolithography method. When collectively formed in this way, a continuous partition wall without a clear boundary between the first partition wall and the second partition wall can be obtained.
  • Organic electroluminescent device of the present invention includes the partition wall of the present invention.
  • Various organic electroluminescent devices are manufactured using the substrate having the partition wall pattern manufactured by the method described above.
  • the method for forming the organic electroluminescent element is not particularly limited, but preferably, after forming the pattern of the partition wall on the substrate by the above method, ink is injected into the region surrounded by the partition wall on the substrate to form a pixel or the like.
  • an organic electroluminescent device is manufactured. Examples of the type of the organic electroluminescent element include a bottom emission type and a top emission type.
  • a partition wall is formed on a glass substrate on which transparent electrodes are laminated, and a hole transport layer, a light emitting layer, an electron transport layer, and a metal electrode layer are laminated in an opening surrounded by the partition wall.
  • a partition wall is formed on a glass substrate on which a metal electrode layer is laminated, and an electron transport layer, a light emitting layer, a hole transport layer, and a transparent electrode layer are laminated in an opening surrounded by the partition wall. Will be done.
  • the light emitting layer include an organic electroluminescent layer as described in Japanese Patent Application Laid-Open No. 2009-146691 and Japanese Patent No. 5734681. Quantum dots as described in Japanese Patent No. 5653387 and Japanese Patent No. 5653101 may be used.
  • the solvent used when forming the ink for forming the organic layer water, an organic solvent, and a mixed solvent thereof can be used.
  • the organic solvent is not particularly limited as long as it can be removed from the film formed after the injection of the ink.
  • examples of the organic solvent include toluene, xylene, anisole, mesitylene, tetraline, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate and 3-phenoxytoluene. ..
  • a surfactant, an antioxidant, a viscosity modifier, and an ultraviolet absorber can be added to the ink.
  • the inkjet method is preferable because a small amount of ink can be easily injected into a predetermined place.
  • the ink used to form the organic layer is appropriately selected according to the type of organic electroluminescent device to be manufactured.
  • the viscosity of the ink is not particularly limited as long as the ink can be satisfactorily ejected from the inkjet head, but 4 to 20 mPa ⁇ s is preferable, and 5 to 10 mPa ⁇ s is more preferable.
  • the viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, and the like.
  • the image display device of the present invention includes the organic electroluminescent device of the present invention.
  • the model and structure of the image display device are not particularly limited as long as they include the organic electroluminescent element of the present invention, and for example, an active drive type organic electroluminescent element can be used for assembly according to a conventional method.
  • the image display device of the present invention is formed by a method as described in "Organic EL Display” (Ohmsha, published on August 20, 2004, by Shizushi Tokito, Chihaya Adachi, Hideyuki Murata). can do.
  • an organic electroluminescent element that emits white light and a color filter may be combined to display an image, or an organic electroluminescent element having a different emission color such as RGB may be combined to display an image.
  • BASF IRGACURE OXE-01 a-3 BASF IRGACURE OXE-02 a-4: PBG-305 manufactured by Changzhou Powerful Electronics New Materials Co., Ltd.
  • a-5 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetraphenyl-1,2'-biimidazole manufactured by Hodogaya Chemical Co., Ltd.
  • Alkali-soluble resin epoxy (meth) acrylate resin (solid acid value 80 mgKOH / g) having the following structural units, polystyrene-equivalent weight average molecular weight (Mw) 8000 measured by GPC, m and n are 1 A mixture of up to 20 things.)
  • DPHA Dipentaerythritol hexaacrylate
  • d-1 Megafuck RS-72-K manufactured by DIC Corporation (acrylic resin containing a repeating unit represented by the general formula (II) and a fluorine atom)
  • d-2 Megafuck RS-78 manufactured by DIC (an acrylic resin containing an ethylenically unsaturated group and a fluorine atom without containing a repeating unit represented by the general formula (II)).
  • d-3 Megafuck F-559 manufactured by DIC Co., Ltd.
  • each component is used in the blending ratio shown in Table 1, and each component is made uniform by using propylene glycol monomethyl ether acetate so that the total solid content of the photosensitive resin composition is 19% by mass.
  • the photosensitive resin compositions of Examples 1 to 3 and Comparative Examples 1 to 5 were prepared by stirring up to.
  • the blending ratio (mass%) of each component in Table 1 means the value of the solid content of each component in the total solid content of the photosensitive resin composition.
  • Each photosensitive resin composition was applied onto a glass substrate using a spinner so as to have a thickness of 1.5 ⁇ m after heat curing. Then, it was heated and dried on a hot plate at 95 ° C. for 2 minutes to obtain a coated substrate. Next, the obtained coating film was entirely exposed at an exposure amount of 60 mJ / cm 2 using an exposure machine MA-1100 manufactured by Dainippon Kaken Co., Ltd. without using a photomask. At this time, the intensity at a wavelength of 365 nm was 40 mW / cm 2 .
  • TMAH tetramethylammonium hydroxide
  • the contact angle was measured using a contact angle measuring device Drop Master 500 manufactured by Kyowa Interface Science Co., Ltd. under the condition of 23 ° C. and 50% humidity. 0.7 ⁇ L of propylene glycol methyl ether acetate was added dropwise to the contact angle measuring substrate, and the contact angle after 1 second was measured. The measurement results are shown in Table 1. The larger the contact angle, the higher the ink repellency.
  • Partition wall with steps and evaluation> Using each photosensitive resin composition, partition walls were formed and performance was evaluated by the methods described below.
  • Each photosensitive resin composition was coated on the ITO film of the glass substrate having the ITO film formed on the surface so as to have a thickness of 1.5 ⁇ m after heat curing using a spinner. Then, it was heated and dried on a hot plate at 95 ° C. for 2 minutes to obtain a coated substrate.
  • a photomask a line-shaped complete transmission opening having an opening width of 20 ⁇ m and a line-shaped intermediate transmission opening having an opening width of 60 ⁇ m are alternately arranged adjacent to each other on the obtained coating film, and 60 ⁇ m in the intermediate transmission opening.
  • a photomask in which a coating portion of ⁇ 240 ⁇ m was arranged at intervals of 70 ⁇ m
  • an exposure was made using an exposure machine MA-1100 manufactured by Dainippon Kaken Co., Ltd. with an exposure gap of 10 ⁇ m.
  • the intermediate transmission opening is a thin film of Cr oxide having a light transmittance of 5% at a wavelength of 365 nm.
  • the intensity at the wavelength of 365 nm at the time of exposure was 40 mW / cm 2 , the exposure amount was 60 mJ / cm 2 , and the exposure was performed under air.
  • it was spray-developed with a 2.38 mass% TMAH (tetramethylammonium hydroxide) aqueous solution at 24 ° C. for 60 seconds, and then washed with pure water for 1 minute.
  • TMAH tetramethylammonium hydroxide
  • the film thickness of the cured film (first partition wall) corresponding to the completely transparent opening and the cured film (second partition wall) corresponding to the intermediate transmission opening was set.
  • a three-dimensional non-contact surface shape measurement system Micromap MM3500-M100 manufactured by Ryoka System Co., Ltd. was used.
  • Step ⁇ H The film thickness difference (step, ⁇ H) between the first partition wall and the second partition wall was calculated and evaluated according to the following criteria. The results are shown in Table 1.
  • the step range is preferably A and B, more preferably A.
  • inkjet coating aptitude evaluation With respect to the partition wall substrate having the step, inkjet coating was performed on the pixel region corresponding to the covering portion using DMP-2831 manufactured by FUJIFILM Corporation.
  • a solvent isoamyl benzoate
  • 180 pL is applied per pixel area.
  • Whether the ink breaks (a phenomenon in which the ink gets over the first partition wall) and whether the ink can be applied in a line shape.
  • the evaluation was performed according to the following criteria. The higher the ink repellency of the partition wall, the more the breakage tends to be suppressed. Further, the more the step is in an appropriate range, the better the line-shaped coatability tends to be.
  • Line-shaped inkjet coating property A: The ink could be applied in a line without interruption on the second partition wall across the plurality of pixel regions.
  • Example 1 to 3 the step difference between the heights of the first partition wall and the second partition wall can be secured in an appropriate range.
  • the line-like coating property was good after inkjet coating, and there was no breakage.
  • the second partition wall could not be formed, and although line-shaped coating was possible at the time of inkjet coating, breakage occurred.
  • the film thickness of the second partition wall became thick, and the line-shaped ink coatability was insufficient.
  • a partition wall could not be formed.
  • Comparative Examples 4 to 5 the contact angle of the surface of the first partition wall was low, and breakage occurred during inkjet coating, and line-shaped coating could not be performed.
  • the surface hardening degree of the coating film is improved by using an oxime ester-based photopolymerization initiator that mainly uses i-ray as the photopolymerization initiator, it is useful as a method for ensuring liquid repellency on the partition wall surface.
  • an oxime ester-based photopolymerization initiator that mainly uses i-ray as the photopolymerization initiator
  • the first partition wall and the second partition wall are simultaneously exposed using a mask having openings having different transmittances, that is, a so-called halftone mask, and each partition wall is formed through a process of development and heat curing, the second partition wall
  • the degree of surface hardening tends to be excessively high, and it tends to be difficult to control the step with the first partition wall.
  • the photopolymerization initiator contained in the photosensitive resin composition of Comparative Example 2 has a carbazole skeleton, the surface hardening degree of the second partition wall becomes excessively high and the film thickness becomes thick. Therefore, a predetermined amount of ink stays in the pixel region at the time of inkjet coating, and cannot flow even on the second partition wall, resulting in insufficient line-shaped coating property.
  • a biimidazole-based initiator was used as the photopolymerization initiator and was used in combination with a chain transfer agent in order to improve the surface curability, but the photocurability was insufficient, so that the partition wall was used in the developing process. Was washed away by the developer, and the partition wall could not be formed.
  • the photopolymerization initiator contained in the photosensitive resin compositions of Example 1 and Comparative Example 1 both have a sulfide skeleton, the surface curability is not so high.
  • the radical generation site is a phenylcarbonyl group, the mobility of the generated radical is small, and the internal curability is also weakened. Conceivable. Therefore, it is presumed that the portion corresponding to the side wall of the first partition wall was excessively developed with the developing solution during development and the liquid repellent was not retained on the side wall, thereby causing breakage during inkjet coating. Further, it is considered that the second partition wall could not be formed due to the low internal curability.
  • the radical generation site is a methylcarbonyl group
  • the mobility of the generated radical is large, and the internal curability is also high. .. Therefore, it is presumed that the developability of the portion corresponding to the side wall of the first partition wall becomes appropriate at the time of development, the liquid repellent can be sufficiently retained even on the side wall, and the fracture is suppressed. Further, it is considered that the internal curability is moderately high, so that the second partition wall having a desired thickness can be formed, and the line-like coatability is also good.
  • Example 3 Even when the photopolymerization initiator represented by the general formula (I) and other photopolymerization initiators are used as in Example 3, there is a step difference in height between the first partition wall and the second partition wall. It was secured in an appropriate range, and the contact angle on the surface of the first partition wall and the line-shaped coatability were also good. However, in Example 1, the step was in a more preferable range. This is because the photosensitive resin composition of Example 1 has a higher ratio of the photopolymerization initiator represented by the general formula (I) in the total photopolymerization initiator, and thus has higher internal curability. it is conceivable that.
  • Comparative Example 4 an acrylic resin containing an ethylenically unsaturated group and a fluorine atom is used as the liquid repellent, but since the number of cross-linking groups is small, the liquid repellent is difficult to be fixed to the surface of the coating film after exposure to ultraviolet rays. It is probable that the liquid repellency could not be ensured because the contact angle on the surface of the partition wall became low due to the flow to the developer in the developing process. In Comparative Example 5, since the liquid repellent does not have the repeating unit represented by the general formula (II) and does not have an ethylenically unsaturated group, the contact angle of the partition wall surface is lowered and the liquid repellent property is ensured. could not.

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JP2017122912A (ja) * 2016-01-06 2017-07-13 Jnc株式会社 感光性組成物
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JP2017122912A (ja) * 2016-01-06 2017-07-13 Jnc株式会社 感光性組成物
JP2018197856A (ja) * 2017-05-22 2018-12-13 Jnc株式会社 硬化性組成物、硬化体及び液晶表示素子
JP2019119807A (ja) * 2018-01-05 2019-07-22 Jnc株式会社 硬化性組成物
WO2019146685A1 (ja) * 2018-01-26 2019-08-01 三菱ケミカル株式会社 着色感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明

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