WO2021120296A1 - 一种显示面板及其制备方法、显示装置 - Google Patents

一种显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2021120296A1
WO2021120296A1 PCT/CN2019/129099 CN2019129099W WO2021120296A1 WO 2021120296 A1 WO2021120296 A1 WO 2021120296A1 CN 2019129099 W CN2019129099 W CN 2019129099W WO 2021120296 A1 WO2021120296 A1 WO 2021120296A1
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Prior art keywords
barrier layer
layer
buffer layer
display panel
display
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PCT/CN2019/129099
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English (en)
French (fr)
Inventor
何超
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深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US16/753,849 priority Critical patent/US11302896B2/en
Publication of WO2021120296A1 publication Critical patent/WO2021120296A1/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • H10K50/8445Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the invention relates to the field of display panels, in particular to a display panel, a preparation method thereof, and a display device.
  • OLED Organic Light-Emitting Diode
  • the cathode materials are usually active metals with low work functions, such as magnesium and aluminum. These light-emitting materials and cathode materials are very sensitive to water vapor and oxygen, and the penetration of water/oxygen will The life span of OLEDs is greatly reduced. In order to meet the requirements of commercialization for the lifespan and stability of OLEDs, OLEDs have very high requirements for packaging effects. Therefore, packaging plays a very important role in the production of OLEDs and is one of the key factors affecting product yield.
  • thin film packaging is a preferred packaging method applied to self-luminous devices such as OLEDs.
  • OLEDs self-luminous devices
  • FIG. 1a and FIG. 1b are respectively the thin film packaging structures in two different display panels in the prior art.
  • the display panel includes a substrate layer 11, a display layer 22, a first barrier layer 33, a first buffer layer 44, a second barrier layer 55, a second buffer layer 66, and a third barrier layer 77 arranged in sequence.
  • the outside of the display layer is actually only blocked by a barrier layer.
  • the thin film packaging structure in the display panel uses three sizes of masks, and the outside of the display layer is blocked by three barrier layers, but the outer edge of the package is wider, which is not conducive to narrow frame design.
  • the object of the present invention is to provide a display panel to solve the problem that the thin film package has a wide outer edge in the prior art, which is not conducive to designing a narrow frame.
  • the present invention provides a display panel, which includes a substrate and a display layer provided on the substrate, wherein a thin film packaging structure is provided on the display layer; wherein the thin film packaging structure includes first The barrier layer and the first buffer layer, wherein both sides of the first barrier layer and the first buffer layer provided thereon are respectively wrapped with a first side barrier layer.
  • the widths of the first barrier layer and the first buffer layer are the same.
  • the width of the first side barrier layer ranges from 200 to 1000 um.
  • the thickness of the first side barrier layer ranges from 200 nm to 2000 nm.
  • the first buffer layer further includes a second barrier layer, a second buffer layer, and a second side barrier layer arranged in sequence
  • the second side barrier layer wraps the The side of the second barrier layer and the second buffer layer, and the second side barrier layer is in contact with the first side barrier layer.
  • the present invention also provides a method for preparing the display panel of the present invention, which includes the following steps:
  • Step S1 Provide a substrate layer and a display layer
  • Step S2 depositing a first barrier layer and a first buffer layer
  • Step S3 depositing a first side barrier layer on the sides of the first barrier layer and the first buffer layer, the first side barrier layer wrapping the sides of the first barrier layer and the first buffer layer.
  • the same mask is used when depositing the first barrier layer and the first buffer layer.
  • the first side barrier layer is deposited by laser-induced chemical vapor deposition.
  • the laser-induced chemical vapor deposition adopts a pyrolysis method or a photolysis method.
  • the deposition of the first barrier layer adopts a chemical vapor deposition method or an atomic layer deposition method.
  • the deposited first buffer layer adopts a chemical vapor deposition method, an inkjet printing method, or an atomic layer deposition method.
  • the material of the second thin-film encapsulation layer is one of titanium nitride, aluminum nitride, silicon nitride, silicon carbide, and titanium dioxide.
  • the present invention also provides a display device including the display panel related to the present invention.
  • the present invention provides a display panel, a preparation method thereof, and a display device.
  • a stacked film encapsulation layer is obtained by using a mask plate to form a laminated film.
  • the barrier layer and buffer layer only need one size mask, which reduces product operating costs and mask costs.
  • laser-induced chemical vapor deposition is used to make a barrier layer on both sides of the stacked barrier layer and buffer layer to protect the peripheral area of the film package.
  • laser-induced chemical vapor deposition requires low substrate temperature, it is actually The film-forming temperature is high, and the film encapsulation layer made is denser, which improves the encapsulation effect; and the display layer is protected by two barrier layers, which protects against the intrusion of water and oxygen around the panel, and the outer edge of the film encapsulation around the display layer is narrow , Can achieve the effect of narrow bezel.
  • FIG. 1a is a schematic diagram of the structure of a display panel in the prior art
  • FIG. 1b is a schematic diagram of the structure of a display panel in the prior art
  • FIG. 2 is a schematic diagram of the structure of a display panel provided by Embodiment 1 of the present invention.
  • Fig. 3 is a schematic flow chart of the preparation method provided in Example 1 of the present invention.
  • FIG. 4 is a schematic diagram of the structure of the display panel at step S1 in the manufacturing method provided by the embodiment 1 of the present invention.
  • FIG. 5 is a schematic diagram of the structure of the display panel at step S2 in the manufacturing method provided by the embodiment 1 of the present invention.
  • FIG. 6 is a schematic diagram of the structure of the display panel at step S3 in the manufacturing method provided by the embodiment 1 of the present invention.
  • FIG. 7 is a schematic structural diagram of a display panel provided by Embodiment 2 of the present invention.
  • Figure 8 is a schematic flow chart of the preparation method provided in Example 2 of the present invention.
  • FIG. 9 is a schematic diagram of the structure of the display panel at step S1 in the manufacturing method provided by Embodiment 2 of the present invention.
  • FIG. 10 is a schematic diagram of the structure of the display panel at step S2 in the manufacturing method provided by Embodiment 2 of the present invention.
  • FIG. 11 is a schematic diagram of the structure of the display panel at step S3 in the manufacturing method provided by Embodiment 2 of the present invention.
  • FIG. 12 is a schematic diagram of the structure of the display panel in step S4 in the manufacturing method provided by the embodiment 2 of the present invention.
  • FIG. 13 is a schematic diagram of the structure of the display panel at step S5 in the manufacturing method provided by Embodiment 2 of the present invention.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the characteristics defined by “first” and “second” may explicitly or implicitly include one or more of these characteristics.
  • FIG. 2 shows a schematic structural diagram of the display panel provided by this embodiment.
  • the display panel includes a substrate layer 1, a display layer 2 disposed on the substrate layer 1, and The first barrier layer 31 on the display layer 2, the first buffer layer 32 provided on the first barrier layer 31, the second barrier layer 33 provided on the first buffer layer 32, the second barrier layer 33 provided on the second barrier layer 33 The second buffer layer 34 and the third barrier layer 35 disposed on the second buffer layer 34.
  • the display panel further includes a side barrier layer 4, which is disposed on the sides of the first barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34, and the third barrier layer 35.
  • the side barrier layer 4 wraps the sides of the first barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34 and the third barrier layer 35 to form a protective layer to protect the surrounding water and oxygen of the display layer 2 Invasion. While the display layer 2 is protected by the two barrier layers, and the outer edge of the film encapsulation around the display layer 2 is narrow, the effect of a narrow frame can be achieved.
  • the width of the side barrier layer 4 is in the range of 200 to 1000 um, and the thickness is in the range of 200 to 2000 nm.
  • the widths of the first barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34, and the third barrier layer 35 are the same.
  • the first barrier layer 31, the first buffer layer 32, and the second barrier layer The barrier layer 33, the second buffer layer 34, and the third barrier layer 35 only need a mask of one size, which can reduce the operating cost of the product and the cost of the mask.
  • FIG. 3 shows a schematic flow chart of the method for manufacturing a display panel provided by this embodiment, including the following steps:
  • Step S1 Provide a substrate layer 1 and a display layer 2;
  • FIG. 4 is a schematic structural diagram of the display panel in step S1 of the manufacturing method provided by this embodiment.
  • Step S2 depositing the first barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34 and the third barrier layer 35;
  • FIG. 5 is a schematic structural diagram of the display panel in step S2 of the manufacturing method provided by this embodiment.
  • the widths of the first barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34, and the third barrier layer 35 are equal, and the first barrier layer 31, the first buffer layer 32, and the second barrier layer are deposited.
  • the barrier layer 33, the second buffer layer 34, and the third barrier layer 35 only need a mask of one size, which can reduce the operating cost of the product and the cost of the mask.
  • the deposition of the first barrier layer 31, the second barrier layer 33, and the third barrier layer 35 adopts a chemical vapor deposition method or an atomic layer deposition method.
  • the deposition of the first buffer layer 32 and the second buffer layer 34 adopts a chemical vapor deposition method, an inkjet printing method, or an atomic layer deposition method.
  • Step S3 Deposit a side barrier layer 4 on the sides of the first barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34, and the third barrier layer 35, and the side barrier layer 4 wraps the first barrier layer 4 A side portion of the barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34 and the third barrier layer 35;
  • FIG. 6 is a schematic structural diagram of the display panel in step S3 of the manufacturing method provided by this embodiment.
  • the side barrier layer 4 wraps the sides of the first barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34 and the third barrier layer 35 to form a protective layer to protect the surrounding water and oxygen of the display layer 2 Invasion. While the display layer 2 is protected by the two barrier layers, and the outer edge of the film encapsulation around the display layer 2 is narrow, the effect of a narrow frame can be achieved.
  • the side barrier layer 4 adopts a laser-induced chemical vapor deposition method, and the laser-induced chemical vapor deposition adopts a pyrolysis method or a photolysis method.
  • laser-induced chemical vapor deposition Compared with ordinary chemical vapor deposition, laser-induced chemical vapor deposition has the advantages of low temperature, low damage, refined processing and selective growth. Although laser-induced chemical vapor deposition requires low substrate temperature, the actual film-forming temperature is high, and the resulting thin-film packaging film layer is relatively dense, which improves the packaging effect. And laser-induced chemical vapor deposition is very convenient and fast.
  • the width of the side barrier layer 4 ranges from 200 to 1000 um, and the thickness ranges from 200 to 2000 nm.
  • the material of the side barrier layer 44 is one of titanium nitride, aluminum nitride, silicon nitride, silicon carbide, and titanium dioxide, which is not limited here.
  • This embodiment also provides a display device including the display panel involved in this embodiment.
  • FIG. 7 shows a schematic structural diagram of the display panel provided by this embodiment.
  • the display panel includes a substrate layer 1, disposed on the substrate layer 1, and disposed on the substrate layer 1.
  • the display layer 2 the first barrier layer 31 provided on the display layer 2, the first buffer layer 32 provided on the first barrier layer 31, and the second barrier layer 33 provided on the first buffer layer 32.
  • the display panel also includes a first side barrier layer 41.
  • the first side barrier layer 4 is disposed on the sides of the first barrier layer 31, the first buffer layer 32, and the second barrier layer 33.
  • the first side barrier layer 41 wraps The sides of the first barrier layer 31, the first buffer layer 32, and the second barrier layer 33 form a protective layer to prevent the intrusion of water and oxygen around the display layer 2. While the display layer 2 is protected by the two barrier layers, and the outer edge of the film encapsulation around the display layer 2 is narrow, the effect of a narrow frame can be achieved.
  • the display panel also includes a second buffer layer 34 provided on the second barrier layer 33, a third barrier layer 35 provided on the second buffer layer 34, and side portions of the second buffer layer 34 and the third barrier layer 35.
  • the second side barrier layer 42, the second side barrier layer 42 wraps the sides of the second buffer layer 34 and the third barrier layer 35, and the second side barrier layer 42 is connected to the first side barrier layer 41.
  • the widths of the first barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34 and the third barrier layer 35 are the same.
  • the barrier layer 33, the second buffer layer 34, and the third barrier layer 35 only need a mask of one size, which can reduce the operating cost of the product and the cost of the mask.
  • FIG. 8 shows a schematic flow chart of the method for manufacturing a display panel provided by this embodiment, including the following steps:
  • Step S1 Provide a substrate layer 1 and a display layer 2;
  • FIG. 9 is a schematic structural diagram of the display panel in step S1 of the manufacturing method provided by this embodiment.
  • Step S2 Depositing the first barrier layer 31, the first buffer layer 32, and the second barrier layer 33; please refer to FIG. 10, which shows the structure of the thin film packaging structure in step S2 in the thin film packaging method provided by this embodiment Schematic.
  • Step S3 Deposit a first side barrier layer 41 on the sides of the first barrier layer 31, the first buffer layer 32, and the second barrier layer 33.
  • the first side barrier layer 41 wraps the first barrier layer 31 and the first buffer layer.
  • FIG. 11 is a schematic structural diagram of the display panel in step S3 of the manufacturing method provided by this embodiment.
  • the first side barrier layer 41 wraps the sides of the first barrier layer 31, the first buffer layer 32 and the second barrier layer 33 to form a protective layer to prevent the intrusion of water and oxygen around the display layer 2. While the display layer 2 is protected by the two barrier layers, and the outer edge of the film encapsulation around the display layer 2 is narrow, the effect of a narrow frame can be achieved.
  • FIG. 12 is a schematic diagram of the structure of the display panel in step S4 in the manufacturing method provided by this embodiment.
  • the widths of the first barrier layer 31, the first buffer layer 32, the second barrier layer 33, the second buffer layer 34, and the third barrier layer 35 are equal.
  • the barrier layer 33, the second buffer layer 34, and the third barrier layer 35 only need a mask of one size, which can reduce the operating cost of the product and the cost of the mask.
  • the first barrier layer 31, the second barrier layer 33, and the third barrier layer 35 adopt a chemical vapor deposition method or an atomic layer deposition method.
  • the first buffer layer 32 and the second buffer layer 34 adopt a chemical vapor deposition method, an inkjet printing method, or an atomic layer deposition method.
  • Step S5 Depositing a second side barrier layer 42 on the sides of the second buffer layer 34 and the third barrier layer 35, and the second side barrier layer 42 wraps the sides of the second buffer layer 34 and the third barrier layer 35, The second side barrier layer 42 is connected to the first side barrier layer 41;
  • FIG. 13 is a schematic structural diagram of the display panel in step S5 of the manufacturing method provided by this embodiment.
  • the first side barrier layer 41 and the second side barrier layer 42 are both deposited by laser-induced chemical vapor deposition, and laser-induced chemical vapor deposition is by pyrolysis or photolysis.
  • laser-induced chemical vapor deposition Compared with ordinary chemical vapor deposition, laser-induced chemical vapor deposition has the advantages of low temperature, low damage, refined processing and selective growth. Although laser-induced chemical vapor deposition requires low substrate temperature, the actual film-forming temperature is high, and the resulting thin-film packaging film layer is relatively dense, which improves the packaging effect. And laser-induced chemical vapor deposition is very convenient and fast.
  • the material of the first side barrier layer 41 and the second side barrier layer 42 is one of titanium nitride, aluminum nitride, silicon nitride, silicon carbide, and titanium dioxide, which is not limited here.
  • This embodiment also provides a display device including the display panel involved in this embodiment.
  • the present invention provides a display panel, a preparation method thereof, and a display device.
  • a stacked film encapsulation layer, a stacked barrier layer and a buffer layer are obtained by using a mask for laminating film formation. Only one size of reticle is required, which reduces product operating costs and reticle costs.
  • laser-induced chemical vapor deposition is used to make a barrier layer on both sides of the stacked barrier layer and buffer layer to protect the peripheral area of the film package.
  • laser-induced chemical vapor deposition requires low substrate temperature, it is practical
  • the film-forming temperature is high, and the film encapsulation layer made is denser, which improves the encapsulation effect; and the display layer is protected by two barrier layers, which protects against the intrusion of water and oxygen around the panel, and the outer edge of the film encapsulation around the display layer is narrow , Can achieve the effect of narrow bezel.

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Abstract

一种显示面板及其制备方法、显示装置,所述显示面板包括基板层(1)和设置在所述基板层(1)上的显示层(2),其中所述显示层(2)上设置有薄膜封装结构;其中所述薄膜封装结构包括依次设置的第一阻隔层(31)和第一缓冲层(32),其中所述第一阻隔层(31)和其上设置的第一缓冲层(32)的两侧部还分别包裹有第一侧部阻隔层(41),所述第一阻隔层(31)、第一缓冲层(32)宽度相同。

Description

一种显示面板及其制备方法、显示装置 技术领域
本发明涉及显示面板领域,特别涉及一种显示面板及其制备方法、显示装置。
背景技术
有机电致发光二极管(Organic Light-Emitting Diode,OLED)以其良好的自发光特性、优越的对比度、快速响应以及柔性显示等优势,得到了广泛的应用。
由于OLED中的发光材料通常为聚合物或有机小分子,阴极材料通常为功函数较低的活泼金属如镁铝等,这些发光材料与阴极材料对水汽和氧气非常敏感,水/氧的渗透会大大缩减OLED的寿命,为了达到商业化对于OLED的使用寿命和稳定性的要求,OLED对于封装效果的要求非常高。因此,封装在OLED制作中处于非常重要的位置,是影响产品良率的关键因素之一。
目前薄膜封装是一种优选的应用于类似OLED等自发光器件的封装方式。通过在OLED基板表面沉积各功能层薄膜达到阻隔水氧的目的,无须使用其他盖板,易于实现柔性显示。
现有的薄膜封装方式一般会采用阻隔层和缓冲层交叠,为确保阻隔层宽度大于缓冲层宽度,也会使用两种不同尺寸的掩模版进行成膜。请参阅图1a和图1b,图1a和图1b分别是现有技术种两种不同的显示面板中的薄膜封装结构。
如图1a所示,显示面板包括依次设置的基板层11、显示层22、第一阻隔层33、第一缓冲层44、第二阻隔层55、第二缓冲层66和第三阻隔层77,虽然使用两种尺寸掩模版,但是显示层外侧实际只受到一层阻隔层的阻隔作用。如图1b所示,该显示面板中的薄膜封装结构使用了三种尺寸的掩模版,显示层外侧受到三层阻隔层的阻隔作用,但是封装外沿较宽,不利于窄边框设计。
因此确有必要来开发一种新型的薄膜封装结构,以克服现有技术的缺陷。
技术问题
本发明的目的是提供一种显示面板,以解决现有技术中存在的薄膜封装外沿较宽导致不利于设计窄边框的问题。
技术解决方案
为实现上述目的,本发明提供一种显示面板,其包括基板和设置在所述基板上的显示层,其中所述显示层上设置有薄膜封装结构;其中所述薄膜封装结构包括依次设置第一阻隔层和第一缓冲层,其中所述第一阻隔层和其上设置的第一缓冲层的两侧部还分别包裹有第一侧部阻隔层。
进一步的,在不同实施方式中,其中所述第一阻隔层和所述第一缓冲层的宽度相同。
进一步的,在不同实施方式中,其中所述第一侧部阻隔层的宽度范围为200~1000um。
进一步的,在不同实施方式中,其中所述第一侧部阻隔层的厚度范围为200~2000nm。
进一步的,在不同实施方式中,其中所述第一缓冲层上还包括依次设置的第二阻隔层、第二缓冲层和第二侧部阻隔层,所述第二侧部阻隔层包裹所述第二阻隔层和第二缓冲层的侧部,第二侧部阻隔层与第一侧部阻隔层相接。
为实现上述目的,本发明还提供一种制备本发明涉及的所述显示面板的方法,包括以下步骤:
步骤S1:提供一基板层和显示层;
步骤S2:沉积第一阻隔层、第一缓冲层;
步骤S3:在所述第一阻隔层和第一缓冲层的侧部沉积第一侧部阻隔层,所述第一侧部阻隔层包裹所述第一阻隔层和第一缓冲层的侧部。
进一步的,在不同实施方式中,其中沉积所述第一阻隔层、第一缓冲层时使用同一个掩模版。
进一步的,在不同实施方式中,其中沉积所述第一侧部阻隔层采用激光诱导化学气相沉积的的方式。
进一步的,在不同实施方式中,其中所述激光诱导化学气相沉积采用热解方式或者光解方式。
进一步的,在不同实施方式中,其中沉积所述第一阻隔层采用化学气相沉积方式或原子层沉积方式。
进一步的,在不同实施方式中,其中所沉积述第一缓冲层采用化学气相沉积方式或喷墨打印方式或原子层沉积方式。
进一步的,在不同实施方式中,其中所述第二薄膜封装层的材料采用氮化钛、氮化铝、氮化硅、碳化硅、二氧化钛中的一种。
为实现上述目的,本发明还提供一种显示装置,包括本发明涉及的所述显示面板。
有益效果
相对于现有技术,本发明的有益效果在于:本发明提供一种显示面板及其制备方法、显示装置,一方面通过使用一张掩模版进行叠层成膜,得到堆叠的薄膜封装层,堆叠的阻隔层和缓冲层只需一种尺寸的掩模版,降低产品运行成本与掩模版费用。
另一方面在堆叠的阻隔层和缓冲层两侧部使用激光诱导化学气相沉积的方式制作一层阻隔层,用于保护薄膜封装外围区域,激光诱导化学气相沉积虽然对基板温度要求低,但实际成膜温度高,制成的薄膜封装膜层比较致密,提升封装效果;而且显示层受到两层阻隔层的保护,在防护面板周围水氧入侵的同时,且显示层四周薄膜封装外沿较窄,能够实现窄边框的效果。
附图说明
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1a为现有技术中显示面板的结构示意图;
图1b为现有技术中显示面板的结构示意图;
图2为本发明实施例1提供的显示面板的结构示意图;
图3为本发明实施例1提供的制备方法的流程示意图;
图4为本发明实施例1提供的制备方法中步骤S1时的显示面板的结构示意图;
图5为本发明实施例1提供的制备方法中步骤S2时的显示面板的结构示意图;
图6为本发明实施例1提供的制备方法中步骤S3时的显示面板的结构示意图;
图7为本发明实施例2提供的显示面板的结构示意图;
图8为本发明实施例2提供的制备方法的流程示意图;
图9为本发明实施例2提供的制备方法中步骤S1时的显示面板的结构示意图;
图10为本发明实施例2提供的制备方法中步骤S2时的显示面板的结构示意图;
图11为本发明实施例2提供的制备方法中步骤S3时的显示面板的结构示意图;
图12为本发明实施例2提供的制备方法中步骤S4时的显示面板的结构示意图;
图13为本发明实施例2提供的制备方法中步骤S5时的显示面板的结构示意图。
本发明的实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
这里所公开的具体结构和功能细节仅仅是代表性的,并且是用于描述本发明的示例性实施例的目的。但是本发明可以通过许多替换形式来具体实现,并且不应当被解释成仅仅受限于这里所阐述的实施例。
在本发明的描述中,需要理解的是,术语“第一”“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定由“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。
实施例1
本实施例提供一种显示面板,请参阅图2,图2所示为本实施例提供的显示面板的结构示意图,显示面板包括基板层1、设置于基板层1上的显示层2、设置于显示层2上第一阻隔层31、设置于第一阻隔层31上的第一缓冲层32、设置于第一缓冲层32上的第二阻隔层33、设置于第二阻隔层33上的第二缓冲层34和设置于第二缓冲层34上的第三阻隔层35。
显示面板还包括侧部阻隔层4,侧部阻隔层4设置于第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35的侧部。侧部阻隔层4包裹第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35的侧部,形成保护层,防护显示层2周围水氧的入侵。显示层2受到两层阻隔层的保护的同时,且显示层2四周薄膜封装外沿较窄,能够实现窄边框的效果。
其中,侧部阻隔层4的宽度范围为200~1000um,厚度范围为200~2000nm。
第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35的宽度相同,在制作时第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35只需一种尺寸的掩模版,能够降低产品运行成本与掩模版费用。
本实施例还提供一种显示面板的制备方法,请参阅图3,图3所示为本实施例提供的显示面板的制备方法的流程示意图,包括以下步骤:
步骤S1:提供一基板层1和显示层2;
请参阅图4,图4所示为本实施例提供的制备方法中步骤S1时的显示面板的结构示意图。
步骤S2:沉积第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35;
请参阅图5,图5所示为本实施例提供的制备方法中步骤S2时的显示面板的结构示意图。
其中第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35的宽度相等,在沉积第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35时只需一种尺寸的掩模版,能够降低产品运行成本与掩模版费用。
其中沉积第一阻隔层31、第二阻隔层33和第三阻隔层35采用化学气相沉积方式或原子层沉积方式。
其中沉积第一缓冲层32和第二缓冲层34采用化学气相沉积方式或喷墨打印方式或原子层沉积方式。
步骤S3:在第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35的侧部沉积侧部阻隔层4,侧部阻隔层4包裹第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35的侧部;
请参阅图6,图6所示为本实施例提供的制备方法中步骤S3时的显示面板的结构示意图。
侧部阻隔层4包裹第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35的侧部,形成保护层,防护显示层2周围水氧的入侵。显示层2受到两层阻隔层的保护的同时,且显示层2四周薄膜封装外沿较窄,能够实现窄边框的效果。
其中侧部阻隔层4采用激光诱导化学气相沉积的的方式,激光诱导化学气相沉积采用热解方式或者光解方式。
激光诱导化学气相沉积相比于普通化学气相沉积方式有低温化,低损伤,加工精细化与选择生长等方面优点。激光诱导化学气相沉积虽然对基板温度要求低,但实际成膜温度高,制成的薄膜封装膜层比较致密,提升封装效果。并且激光诱导化学气相沉积很方便、快捷。
其中侧部阻隔层4的宽度范围为200~1000um,厚度范围为200~2000nm。
其中侧部阻隔层44的材料采用氮化钛、氮化铝、氮化硅、碳化硅、二氧化钛中的一种,在此不做限定。
本实施例还提供一种显示装置,包括本实施例涉及的所述显示面板。
实施例2
本实施例提供一种显示面板,请参阅图7,图7所示为本实施例提供的显示面板的结构示意图,显示面板包括基板层1、设置于基板层1上、设置于基板层1上的显示层2、设置于显示层2上第一阻隔层31、设置于第一阻隔层31上的第一缓冲层32、设置于第一缓冲层32上的第二阻隔层33。
显示面板还包括第一侧部阻隔层41,第一侧部阻隔层4设置于第一阻隔层31、第一缓冲层32和第二阻隔层33的侧部,第一侧部阻隔层41包裹第一阻隔层31、第一缓冲层32和第二阻隔层33的侧部,形成保护层,防护显示层2周围水氧的入侵。显示层2受到两层阻隔层的保护的同时,且显示层2四周薄膜封装外沿较窄,能够实现窄边框的效果。
显示面板还包设置于第二阻隔层33上的第二缓冲层34和设置于第二缓冲层34上的第三阻隔层35、设置于第二缓冲层34和第三阻隔层35侧部的第二侧部阻隔层42,第二侧部阻隔层42包裹第二缓冲层34和第三阻隔层35的侧部,第二侧部阻隔层42与第一侧部阻隔层41相接。
其中第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35的宽度相同,在制作第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35时只需一种尺寸的掩模版,能够降低产品运行成本与掩模版费用。
本实施例还提供一种显示面板的制备方法,请参阅图8,图8所示为本实施例提供的显示面板的制备方法的流程示意图,包括以下步骤:
步骤S1:提供一基板层1和显示层2;
请参阅图9,图9所示为本实施例提供的制备方法中步骤S1时的显示面板的结构示意图。
步骤S2:沉积第一阻隔层31、第一缓冲层32、第二阻隔层33;请参阅图10,图10所示为本实施例提供的薄膜封装方法中步骤S2时的薄膜封装结构的结构示意图。
步骤S3;在第一阻隔层31、第一缓冲层32、第二阻隔层33的侧部沉积第一侧部阻隔层41,第一侧部阻隔层41包裹第一阻隔层31、第一缓冲层32、第二阻隔层33的侧部;
请参阅图11,图11所示为本实施例提供的制备方法中步骤S3时的显示面板的结构示意图。
第一侧部阻隔层41包裹第一阻隔层31、第一缓冲层32和第二阻隔层33的侧部,形成保护层,防护显示层2周围水氧的入侵。显示层2受到两层阻隔层的保护的同时,且显示层2四周薄膜封装外沿较窄,能够实现窄边框的效果。
S4:沉积第二缓冲层34和第三阻隔层35;
请参阅图12,图12所示为本实施例提供的制备方法中步骤S4时的显示面板的结构示意图。
其中第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35的宽度相等,在沉第一阻隔层31、第一缓冲层32、第二阻隔层33、第二缓冲层34和第三阻隔层35时只需一种尺寸的掩模版,能够降低产品运行成本与掩模版费用。
其中第一阻隔层31、第二阻隔层33和第三阻隔层35采用化学气相沉积方式或原子层沉积方式。
其中第一缓冲层32和第二缓冲层34采用化学气相沉积方式或喷墨打印方式或原子层沉积方式。
步骤S5:在第二缓冲层34、第三阻隔层35的侧部沉积第二侧部阻隔层42,第二侧部阻隔层42包裹第二缓冲层34、第三阻隔层35的侧部,第二侧部阻隔层42与第一侧部阻隔层41相接;
请参阅图13,图13所示为本实施例提供的制备方法中步骤S5时的显示面板的结构示意图。
其中沉积第一侧部阻隔层41和第二侧部阻隔层42都采用激光诱导化学气相沉积的的方式,激光诱导化学气相沉积采用热解方式或者光解方式。
激光诱导化学气相沉积相比于普通化学气相沉积方式有低温化,低损伤,加工精细化与选择生长等方面优点。激光诱导化学气相沉积虽然对基板温度要求低,但实际成膜温度高,制成的薄膜封装膜层比较致密,提升封装效果。并且激光诱导化学气相沉积很方便、快捷。
其中第一侧部阻隔层41和第二侧部阻隔层42的材料采用氮化钛、氮化铝、氮化硅、碳化硅、二氧化钛中的一种,在此不做限定。
本实施例还提供一种显示装置,包括本实施例涉及的所述显示面板。
本发明的有益效果在于:本发明提供一种显示面板及其制备方法、显示装置,一方面通过使用一张掩模版进行叠层成膜,得到堆叠的薄膜封装层,堆叠的阻隔层和缓冲层只需一种尺寸的掩模版,降低产品运行成本与掩模版费用。
另一方面在堆叠的阻隔层和缓冲层两侧部使用激光诱导化学气相沉积的方式制作一层阻隔层,用于保护薄膜封装外围区域,激光诱导化学气相沉积虽然对基板温度要求低,但实际成膜温度高,制成的薄膜封装膜层比较致密,提升封装效果;而且显示层受到两层阻隔层的保护,在防护面板周围水氧入侵的同时,且显示层四周薄膜封装外沿较窄,能够实现窄边框的效果。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。

Claims (15)

  1. 一种显示面板,其包括基板和设置在所述基板上的显示层,其中,所述显示层上设置有薄膜封装结构;其中所述薄膜封装结构包括依次设置第一阻隔层和第一缓冲层,其中所述第一阻隔层和其上设置的第一缓冲层的两侧部还分别包裹有第一侧部阻隔层。
  2. 如权利要求1所述的显示面板,其中,所述第一阻隔层和所述第一缓冲层的宽度相同。
  3. 如权利要求1所述的显示面板,其中,所述第一侧部阻隔层的宽度范围为200~1000um。
  4. 如权利要求1所述的显示面板,其中,所述第一侧部阻隔层的厚度范围为200~2000nm。
  5. 如权利要求1所述的显示面板,其中,所述第一缓冲层上还包括依次设置的第二阻隔层、第二缓冲层,所述第二阻隔层和其上设置的第二缓冲层的两侧部还分别包裹有第二侧部阻隔层。
  6. 一种制备方法,用以制备如权利要求1所述的显示面板,其中,所述制备方法包括以下步骤:
    步骤S1:提供一基板层和显示层;
    步骤S2:沉积第一阻隔层、第一缓冲层;
    步骤S3:在所述第一阻隔层和第一缓冲层的侧部沉积第一侧部阻隔层,所述第一侧部阻隔层包裹所述第一阻隔层和第一缓冲层的侧部。
  7. 如权利要求6所述的制备方法,其中,沉积所述第一阻隔层、第一缓冲层时使用同一个掩模版。
  8. 如权利要求6所述的制备方法,其中,沉积所述第一侧部阻隔层采用激光诱导化学气相沉积的的方式。
  9. 如权利要求6所述的制备方法,其中,沉积所述第一阻隔层采用化学气相沉积方式或原子层沉积方式。
  10. 如权利要求6所述的制备方法,其中,所沉积述第一缓冲层采用化学气相沉积方式或喷墨打印方式或原子层沉积方式。
  11. 一种显示装置,其中,包括如权利要求1所述的显示面板。
  12. 如权利要求11所述的显示装置,其中,所述第一阻隔层和所述第一缓冲层的宽度相同。
  13. 如权利要求11所述的显示装置,其中,所述第一侧部阻隔层的宽度范围为200~1000um。
  14. 如权利要求11所述的显示装置,其中,所述第一侧部阻隔层的厚度范围为200~2000nm。
  15. 如权利要求11所述的显示装置,其中,所述第一缓冲层上还包括依次设置的第二阻隔层、第二缓冲层,所述第二阻隔层和其上设置的第二缓冲层的两侧部还分别包裹有第二侧部阻隔层。
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KR20130061471A (ko) * 2011-12-01 2013-06-11 엘지디스플레이 주식회사 유기전계 발광표시장치 및 그 제조방법
CN106450032A (zh) * 2016-11-08 2017-02-22 武汉华星光电技术有限公司 Oled显示器及其制作方法
CN108922982A (zh) * 2018-07-19 2018-11-30 云谷(固安)科技有限公司 显示面板、设有其的显示装置及显示面板形成方法
CN110048018A (zh) * 2019-04-02 2019-07-23 深圳市华星光电半导体显示技术有限公司 显示器封装结构及其制造方法

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