WO2020228203A1 - 一种显示面板及其制备方法 - Google Patents

一种显示面板及其制备方法 Download PDF

Info

Publication number
WO2020228203A1
WO2020228203A1 PCT/CN2019/105870 CN2019105870W WO2020228203A1 WO 2020228203 A1 WO2020228203 A1 WO 2020228203A1 CN 2019105870 W CN2019105870 W CN 2019105870W WO 2020228203 A1 WO2020228203 A1 WO 2020228203A1
Authority
WO
WIPO (PCT)
Prior art keywords
inorganic layer
layer
display panel
inorganic
organic layer
Prior art date
Application number
PCT/CN2019/105870
Other languages
English (en)
French (fr)
Inventor
朱超
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Publication of WO2020228203A1 publication Critical patent/WO2020228203A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the invention relates to the field of display technology, in particular to a display panel and a preparation method thereof.
  • AMOLED Active-matrix Organic Light-emitting Diode
  • OLED materials are easily corroded by water and oxygen and need to be packaged and protected. At present, OLEDs have two packaging methods, flexible and rigid.
  • Flexible packaging TFE has excellent bending performance.
  • the existing thin film packaging structures mostly use inorganic/organic stacked structures to encapsulate OLED devices, with 3 layers, 5 layers, or even more layers.
  • the inorganic layer mainly plays a role of blocking water and oxygen corrosion, but the inorganic layer is prone to defects and particles during the production process, which is not conducive to blocking water and oxygen.
  • the organic material in the organic layer has water absorption and also generates gas (Outgassing), which easily causes water and oxygen to invade the inorganic layer.
  • the adhesion between the organic layer and the inorganic layer is very weak, and it is easy to fall off, resulting in an unsatisfactory encapsulation effect of the inorganic layer, which in turn causes the light-emitting device to be damaged by water and oxygen, and affects the life of the display panel.
  • the rigid package TFE thin film package
  • the present invention provides a display panel and a preparation method thereof, so as to solve the technical problem that the flexible package in the prior art has excellent bending performance but poor water and oxygen isolation ability, which affects the life of the display panel, and the rigid package cannot achieve the bending effect.
  • the present invention provides a display panel, including a substrate, a light-emitting layer, a first inorganic layer, a second inorganic layer, an organic layer, and a third inorganic layer; the light-emitting layer is attached to one side of the substrate.
  • the first inorganic layer is attached to the surface of the light-emitting layer on the side away from the substrate; the second inorganic layer is attached to the surface of the first inorganic layer on the side away from the light-emitting layer;
  • the second inorganic layer is provided with a straight through hole; the organic layer is provided in the through hole and is attached to the surface of the first inorganic layer on the side away from the light-emitting layer; the third inorganic layer The layer is attached to the second inorganic layer, and the organic layer is away from the surface of the first inorganic layer.
  • the display panel further includes a touch layer, a polarizer, and a cover plate; the touch layer is provided on the surface of the third inorganic layer away from the substrate; the polarizer is provided on the The touch control layer is away from the surface of the substrate; the cover plate is arranged on the surface of the polarizer away from the substrate.
  • the thickness of the second inorganic layer is the same as or similar to the thickness of the organic layer.
  • the thickness of the first inorganic layer is 0.8um to 1.2um; and/or, the thickness of the third inorganic layer is 0.8um to 1.2um; and/or, the thickness of the second inorganic layer is equal to The thickness of the organic layer is 5um-7um.
  • the material of the first inorganic layer is SiNx; the material of the second inorganic layer is SION; the material of the third inorganic layer is SiNx; and the material of the organic layer is acrylic.
  • the width of the through hole is 11mm-15mm.
  • the present invention also provides a method for preparing a display panel, which includes a substrate vapor deposition step, a substrate is vapor deposited; a light emitting layer preparation step, a light emitting layer is formed on the upper surface of the substrate; and a first inorganic layer preparation step , Forming a first inorganic layer on the upper surface of the light-emitting layer; mask mounting step, aligning and attaching a mask on the upper surface of the first inorganic layer, including a linear shielding area; preparation of the second inorganic layer Step, forming a second inorganic layer on the upper surface of the first inorganic layer through the mask, and the second inorganic layer is provided with a straight through hole, and the position of the through hole is the same as that of the shielding area of the mask.
  • a mask removal step removing the mask
  • an organic layer preparation step forming an organic layer in the through hole
  • a third inorganic layer preparation step in the second inorganic layer
  • a third inorganic layer is formed on the upper surface of the organic layer.
  • the step of preparing the third inorganic layer further includes a step of attaching a touch layer to the upper surface of the third inorganic layer; a step of setting a polarizer on the touch layer A polarizer is arranged on the upper surface; and a cover plate setting step is to arrange a cover plate on the polarizer.
  • a chemical vapor deposition method is used in the preparation step of the first inorganic layer; and/or, in the preparation step of the second inorganic layer, a plasma enhanced chemical vapor deposition method is used in the first
  • the second inorganic layer is formed on the upper surface of the inorganic layer; and/or, in the preparation step of the third inorganic layer, a plasma-enhanced chemical vapor deposition method is used on the upper surface of the second inorganic layer and the organic layer.
  • the third inorganic layer is formed.
  • an inkjet printing method is used to fill the through holes with organic materials to form the organic layer.
  • the technical effect of the present invention is to provide a display panel and a preparation method thereof.
  • the display panel is bendable at the position corresponding to the organic layer.
  • the second inorganic layer is not bent, so that the area corresponding to the organic layer of the display panel is called the bending area, and the area corresponding to the second inorganic layer of the display panel is called the non-bending area, which can ensure The bending performance of the bending area is good, and the water and oxygen blocking capacity of the non-bending area can be improved, and the life of the display panel can be prolonged.
  • FIG. 1 is a schematic diagram of the structure of the display panel
  • Fig. 2 is a flow chart of the manufacturing method of the display panel
  • FIG. 3 is a schematic diagram of the structure formed by the second inorganic layer
  • FIG. 5 is a schematic diagram of the structure formed by the third inorganic layer.
  • This embodiment provides a display panel and a manufacturing method thereof, which will be described in detail below.
  • the display panel includes a substrate 1, a light-emitting layer 2, a thin-film packaging layer 3, a touch layer 4, a polarizer 5 and a cover 6.
  • the substrate 1 is a commonly used LTPS flexible substrate.
  • the light-emitting layer 2 is attached to the upper surface of the substrate 1.
  • the thin film encapsulation layer 3 is provided on the upper surface of the light emitting layer 2.
  • the thin film encapsulation layer 3 includes a first inorganic layer 31, a second inorganic layer 32, an organic layer 33, and a third inorganic layer 33.
  • the first inorganic layer 31 is formed on the upper surface of the light-emitting layer 2 by chemical vapor deposition.
  • the thickness of the first inorganic layer 31 is 0.8um ⁇ 1.2um, preferably 0.9um, 1um, and has good water and oxygen blocking ability.
  • the material of the first inorganic layer 31 is preferably SiNx, but is not limited to other materials, as long as the first inorganic layer 31 has good water and oxygen blocking ability.
  • a plasma-enhanced chemical vapor deposition method is used to deposit a second inorganic layer 32 on the upper surface of the first inorganic layer 31 and adhere to the upper surface of the first inorganic layer 31.
  • the thickness of the second inorganic layer 32 is 5um-7um, preferably 5.5um, 6um.
  • the second inorganic layer 32 can improve the water and oxygen blocking ability and improve the adhesion of the film package.
  • the material of the second inorganic layer 32 is preferably SION, but is not limited to other materials, as long as the water and oxygen blocking ability can be improved, and the adhesive force of the film package can be improved.
  • the second inorganic layer 32 is provided with a straight through hole, and the second inorganic layer 32 is divided into two parts by the through hole.
  • the organic material is completely filled in the through holes by inkjet printing to form the organic layer 33 and attached to the upper surface of the first inorganic layer 31.
  • the thickness of the organic layer 33 is 5 um-7 um, preferably 5.5 um, 6 um, so that the thickness of the second inorganic layer 32 is the same as or similar to the thickness of the organic layer 33 to ensure the encapsulation effect.
  • the material of the organic layer 33 is preferably acrylic, which can achieve a flexible packaging effect in the bending area 100, but it is not limited to other materials, as long as the effect of stress relief can be achieved.
  • the display panel is bendable at the position corresponding to the organic layer 33, and the second inorganic layer 32 on both sides of the organic layer 33 is not bendable.
  • the area of the display panel corresponding to the organic layer 33 is called a bending area 100, and the area of the display panel corresponding to the second inorganic layer 32 is called a non-bending area 200. In this way, the display panel can improve the water and oxygen blocking capacity of the non-bending area, and at the same time ensure the excellent bending performance of the bending area.
  • the non-bending area 200 includes a first non-bending area 201 and a second non-bending area 202 corresponding to two parts of the second inorganic layer 32 separated by the organic layer 33 respectively.
  • the distance between the first non-bending area 201 and the second non-bending area 202 is the width of the bending area 100, that is, the width of the organic layer 33.
  • the width of the organic layer 33 is 11 mm-15 mm, preferably 12 mm, 13 mm.
  • the third inorganic layer 34 is formed on the upper surfaces of the second inorganic layer 32 and the organic layer 33 by using a plasma enhanced chemical vapor deposition method.
  • the thickness of the third inorganic layer 34 is 0.8um ⁇ 1.2um, preferably 0.9um, 1um, which can ensure that the organic materials in the organic layer 33 are not invaded by water and oxygen, and improve the adhesion between the organic layer and the inorganic layer.
  • the material of the third inorganic layer 34 is preferably SiNx, but is not limited to other materials, as long as the third inorganic layer 34 can have good water and oxygen blocking ability and improve the adhesion between the organic layer and the inorganic layer.
  • the display panel further includes a touch layer 4, a polarizer 5 and a cover 6.
  • the touch control layer 4, the polarizer 5, and the cover plate 6 are sequentially disposed on the upper surface of the third inorganic layer 34.
  • the touch layer 4 is preferably a flexible touch layer, so that the touch layer 4 and the polarizer 5 have a good bonding effect.
  • this embodiment provides a method for manufacturing a display panel, including steps S1 to S11.
  • a light-emitting layer is formed on the substrate, refer to FIG. 3.
  • a layer of SiNx material is coated on the upper surface of the light-emitting layer by chemical vapor deposition to form a first inorganic layer with a thickness of 0.8um to 1.2um, refer to FIG. 3.
  • the thickness of the first inorganic layer 31 is preferably 0.9um or 1um.
  • a mask 20 is aligned and attached above the first inorganic layer 31, as shown in FIG. 3.
  • the mask 20 includes a linear shielding area with a width of 11mm-15mm, preferably 12mm, 13mm.
  • the second inorganic layer preparation step is to coat a layer of SiON material on the upper surface of the first inorganic layer 31 through the mask 20 by plasma-enhanced chemical vapor deposition to form a second inorganic layer 32, refer to FIG. 3 .
  • the thickness of the second inorganic layer 32 is 5 um-7 um, preferably 6 um, which improves the water and oxygen blocking ability and adhesion of the display panel.
  • the second inorganic layer 32 is provided with a straight through hole 10, which extends from the edge on one side of the second inorganic layer 32 to the edge on the other side, and divides the second inorganic layer 32 into two parts.
  • the bending area 201 and the second non-bending area 202 are shown in FIG. 3.
  • the position of the through hole 10 corresponds to the position of the shielding area of the mask 20.
  • the width of the through hole 10 is 11 mm to 15 mm, preferably 12 mm or 13 mm.
  • the second inorganic layer 32 is located in the non-bending area 200, which can improve the water and oxygen blocking ability of the non-bending area 200.
  • the mask 20 used in the above process is removed, referring to FIG. 4.
  • the through holes 10 are filled with organic materials by inkjet printing to form an organic layer 33, as shown in FIG. 4.
  • the organic material is preferably an acrylic material, and its thickness is 5um-7um, preferably 6um, which facilitates the implementation of subsequent processes.
  • the organic layer 33 can be made of acrylic material to improve the bendability of the bending zone 100, and other stress-relieving materials can be used instead of acrylic material to improve the bendability of the bending zone.
  • the width of the organic layer 33 is the width of the through hole.
  • the width of the organic layer 33 is the length of the bending area, that is, 11 mm to 15 mm, preferably 12 mm, 13 mm, so that the bending radius is small, making the display panel thinner, while ensuring the bending area 100 Excellent folding performance.
  • a plasma-enhanced chemical vapor deposition method is used to form a third inorganic layer 34 on the second inorganic layer 32 and the organic layer 33, as shown in FIG. 5.
  • the thickness of the third inorganic layer 34 is 0.8 um to 1.2 um, preferably 0.9 um, 1 um, thereby improving the adhesion between the organic layer and the inorganic layer.
  • the touch-control layer attaching step is to attach a touch-control layer 4 on the upper surface of the third inorganic layer 34, refer to FIG. 1.
  • a polarizer 5 is provided on the upper surface of the touch layer, refer to FIG. 1.
  • the present invention provides a display panel and a preparation method thereof.
  • the display panel is bendable at a position corresponding to the organic layer.
  • the second inorganic layer on both sides of the organic layer
  • the area corresponding to the organic layer of the display panel is called the bending area
  • the area corresponding to the second inorganic layer of the display panel is called the non-bending area, which can ensure the bending of the bending area.
  • the folding performance is good, and the water and oxygen blocking capacity in the non-bending area can be improved, and the life of the display panel can be extended.

Abstract

一种显示面板及其制备方法，显示面板包括基板（1）、发光层（2）、第一无机层（31）、第二无机层（32）、有机层（33）以及第三无机层（34）；显示面板的制备方法包括基板（1）蒸镀步骤（S1）、发光层（2）制备步骤（S2）、第一无机层（31）制备步骤（S3）、掩膜板（20）安装步骤（S4）、第二无机层（32）制备步骤（S5）、掩膜板（20）移除步骤（S6）、有机层（33）制备步骤（S7）以及第三无机层（34）制备步骤（S8）；通过在第二无机层（32）中设置一直线形的有机层（33），使得显示面板在有机层（33）对应的位置是可弯折的，有机层（33）两侧的第二无机层（32）是不弯折的，进而使得显示面板与有机层（33）对应的区域被称为弯折区（100），显示面板与第二无机层（32）对应的区域被称为非弯折区（200），既可以保证弯折区（100）的弯折性能良好，又可以提高非弯折区（200）的阻水氧能力，延长显示面板的寿命。

Description

一种显示面板及其制备方法 技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板及其制备方法。
 背景技术
近年来，随着显示技术的快速发展，有源矩阵有机发光二极体或主动矩阵有机发光二极体（Active-matrix Organic Light-emitting Diode，AMOLED ）柔性显示引起了人们极大关注，具有可折叠特征的柔性面板已成为后续智能手机发展的趋势，市面上的可折叠手机一般是固定位置弯折。
OLED材料容易受水氧侵蚀，需要对其封装保护，目前OLED有柔性和刚性两种封装方法。
柔性封装TFE（薄膜封装）弯折性能优良，现有的薄膜封装结构多以无机/有机堆叠结构对OLED器件进行封装，有3层、5层，甚至更多层。无机层主要起到阻隔水氧侵蚀的作用，但无机层在制作工艺过程中容易产生缺陷和颗粒，不利于阻隔水氧。有机层中的有机材料的具有吸水性，还会产生气体（Outgassing），容易导致水氧入侵无机层。因此，有机层与无机层之间的粘附力很弱，容易发生脱落，导致无机层的封装效果不理想，进而导致发光器件被水氧损伤，影响了显示面板的寿命。
刚性封装TFE（薄膜封装）是用玻璃阻隔水氧，虽然阻隔水氧的效果良好，但是无法实现弯折效果。
 技术问题
本发明提供一种显示面板及其制备方法，以解决现有技术存在的柔性封装的弯折性能优良但隔绝水氧能力差，影响显示面板的寿命，刚性封装无法实现弯折效果的技术问题。
 技术解决方案
为解决上述问题，本发明提供一种显示面板，包括基板、发光层、第一无机层、第二无机层、有机层以及第三无机层；所述发光层贴附于所述基板一侧的表面；所述第一无机层贴附于所述发光层远离所述基板一侧的表面；所述第二无机层贴附于所述第一无机层远离所述发光层一侧的表面；所述第二无机层设有一直线形的通孔；所述有机层设于所述通孔内，且贴附于所述第一无机层远离所述发光层一侧的表面；所述第三无机层贴附于所述第二无机层、所述有机层远离所述第一无机层一侧的表面。
进一步地，所述的显示面板还包括触控层、偏光片以及盖板；所述触控层设于所述第三无机层远离所述基板一侧的表面；所述偏光片，设于所述触控层远离所述基板一侧的表面；所述盖板设于所述偏光片远离所述基板一侧的表面。
进一步地，所述第二无机层的厚度与所述有机层的厚度相同或相近。
进一步地，所述第一无机层的厚度为0.8um~1.2um；和/或，所述第三无机层的厚度为0.8um~1.2um；和/或，所述第二无机层的厚度与所述有机层的厚度均为5um~7um。
进一步地，所述第一无机层的材质为SiNx；所述第二无机层的材质为SION；所述第三无机层的材质为SiNx；所述有机层的材料为亚克力。
进一步地，所述通孔的宽度为11mm~15mm。
为解决上述问题，本发明还提供一种显示面板的制备方法，包括基板蒸镀步骤，蒸镀一基板；发光层制备步骤，在所述基板上表面形成一发光层；第一无机层制备步骤，在所述发光层上表面形成一第一无机层；掩膜板安装步骤，在所述第一无机层上表面对位贴附一掩膜板，包括一直线形遮挡区；第二无机层制备步骤，透过该掩膜板在所述第一无机层上表面形成一第二无机层，该第二无机层具备一直线形的通孔，该通孔的位置与所述掩膜板遮挡区的位置相对应；掩膜板移除步骤，移除所述掩膜板；以及有机层制备步骤，在所述通孔内形成一有机层；第三无机层制备步骤，在所述第二无机层、所述有机层上表面形成第三无机层。
进一步地，在所述第三无机层制备步骤后，还包括触控层贴附步骤，在所述第三无机层上表面贴附一触控层；偏光片设置步骤，在所述触控层上表面设置一偏光片；以及盖板设置步骤，在所述偏光片上设置一盖板。
进一步地，在所述第一无机层制备步骤中，采用化学气相沉积的方法；和/或，在所述第二无机层制备步骤中，采用等离子体增强化学气相沉积的方法在所述第一无机层上表面形成所述第二无机层；和/或，在所述第三无机层制备步骤中，采用等离子体增强化学气相沉积的方法在所述第二无机层、所述有机层上表面形成所述第三无机层。
进一步地，在所述有机层制备步骤中，采用喷墨打印的方法在所述通孔内填满有机材料，形成所述有机层。
 有益效果
本发明的技术效果在于，提供一种显示面板及其制备方法，通过在第二无机层中设置一直线形的有机层，使得显示面板在有机层对应的位置是可弯折的，有机层两侧的第二无机层是不弯折的，进而使得显示面板与有机层对应的区域被称为弯折区，显示面板与第二无机层对应的区域被称为非弯折区，进而既可以保证弯折区的弯折性能良好，又可以提高非弯折区的阻水氧能力，延长显示面板的寿命。
 附图说明
图1为所述显示面板的结构示意图；
图2 为所述显示面板的制备方法的流程图；
图3为所述第二无机层形成的结构示意图；
图4为所述有机层形成的结构示意图；
图5为所述第三无机层形成的结构示意图。
附图部分标识如下：
1基板；2发光层；3薄膜封装层；4触控层；5偏光片；6盖板；
10通孔；20掩膜板；
100弯折区；200非弯折区；
         201第一非弯折区；202第二非弯折区；
31第一无机层；32第二无机层；33有机层；34第三无机层。
 本发明的实施方式
以下参考说明书附图介绍本发明的优选实施例，用以举例证明本发明可以实施，这些实施例可以向本领域中的技术人员完整介绍本发明的技术内容，使得本发明的技术内容更加清楚和便于理解。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例。
本发明的说明书和权利要求书以及上述附图中的术语“第一”、“第二”、“第三”等（如果存在）是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应当理解，这样描述的对象在适当情况下可以互换。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含。
本实施例提供一种显示面板及其制作方法，以下将分别进行详细说明。
如图1所示，所述显示面板包括基板1、发光层2、薄膜封装层3、触控层4、偏光片5以及盖板6。
基板1，为常用的LTPS柔性基板。发光层2贴附于基板1的上表面。
薄膜封装层3设于发光层2上表面。薄膜封装层3包括第一无机层31、第二无机层32、有机层33、第三无机层33。
采用化学气相沉积的方法在发光层2上表面形成第一无机层31。第一无机层31的厚度为0.8um~1.2um，优选为0.9um、1um，具有良好阻水氧能力。第一无机层31的材质优选为SiNx，但并不限于其他材质，只要能使第一无机层31具有良好阻水氧能力即可。
采用等离子体增强化学气相沉积的方法在第一无机层31的上表面沉积形成第二无机层32，且贴附于第一无机层31上表面。第二无机层32的厚度为5um~7um，优选为5.5um、6um。第二无机层32可以提高阻水氧能力，提高薄膜封装的粘合力。第二无机层32的材质优选为SION，但并不限于其他材质，只要可以提高阻水氧能力，提高薄膜封装的粘合力即可。
其中，第二无机层32设有一直线形的通孔，第二无机层32被所述通孔分隔成两部分。
采用喷墨打印的方法将有机材料完全填充于所述通孔内形成有机层33，且贴附于第一无机层31上表面。有机层33的厚度为5um~7um，优选为5.5um、6um，使得第二无机层32的厚度与有机层33的厚度相同或相近，保证封装的效果。
有机层33的材料优选为亚克力，可以实现弯折区100内的柔性封装效果，但并不限于其他材质，只要能达到缓解应力效果即可。所述显示面板在该有机层33对应的位置是可弯折的，有机层33两侧的第二无机层32是不可弯折的。所述显示面板与有机层33对应的区域被称为弯折区100，所述显示面板与第二无机层32对应的区域被称为非弯折区200。这样可以使显示面板提高非弯折区的阻水氧能力，同时保证弯折区的弯折性能优良效果。
非弯折区200包括第一非弯折区201、第二非弯折区202，分别与第二无机层32被有机层33隔开的两部分相对应。其中，第一非弯折区201与第二非弯折区202之间的距离为弯折区100的宽度，即为有机层33的宽度。本实施例中，有机层33的宽度为11mm~15mm，优选为12mm、13mm。
采用等离子体增强化学气相沉积的方法在第二无机层32、有机层33的上表面形成第三无机层34。第三无机层34的厚度为0.8um~1.2um，优选为0.9um、1um，可以保证有机层33中的有机材料不被水氧入侵，提高有机层与无机层的粘着力。第三无机层34的材质优选为SiNx，但并不限于其他材质，只要能使第三无机层34具有良好阻水氧能力，并提高有机层与无机层之间的粘着力即可。
所述显示面板还包括触控层4、偏光片5以及盖板6。其中，触控层4、偏光片5、盖板6依次设于第三无机层34上表面。触控层4优选为柔性触控层，可以使得触控层4与偏光片5具有良好的贴合效果。
如图2所示，本实施例提供一种显示面板的制备方法，包括步骤S1~S11。
S1基板蒸镀步骤，蒸镀一基板，参照图3。
S2发光层制备步骤，在所述基板上形成一发光层，参照图3。
S3第一无机层制备步骤，通过化学气相沉积的方法在发光层上表面涂覆一层SiNx材料，形成第一无机层，其厚度为0.8um~1.2um，参照图3。本实施例中，第一无机层31的厚度，优选为0.9um、1um。
S4掩膜板安装步骤，在第一无机层31上方对位贴附一掩膜板20，参照图3。掩膜板20包括一直线形遮挡区，其宽度为11mm~15mm，优选为12mm、13mm。
S5第二无机层制备步骤，透过该掩膜板20通过等离子体增强化学的气相沉积的方法在第一无机层31上表面涂覆一层SiON材料，形成第二无机层32，参照图3。第二无机层32的厚度为5um~7um，优选为6um，提高显示面板的阻水氧能力、粘附力。
第二无机层32具备一直线形的通孔10，通孔10从第二无机层32一侧的边缘延伸至另一侧的边缘，将第二无机层32分割成两部分，分别为第一非弯折区201、第二非弯折区202，参照图3。通孔10的位置与所述掩膜板20遮挡区的位置相对应。通孔10的宽度为11mm~15mm，优选为12mm、13mm。
本实施例中，第二无机层32位于非弯折区200内，可以提高非弯折区200的阻水氧能力。
S6掩膜板移除步骤，移除上述工艺过程中使用的掩膜板20，参照图4。
S7有机层制备步骤，通过喷墨打印的方法通孔10内填满有机材料，形成一有机层33，参照图4。该有机材料优选印亚克力材料，其厚度均为5um~7um，优选为6um，便于后续工艺的实施。本实施中，有机层33的材料除了可以为亚克力材料，提高弯折区100的弯折性，还可以用其他缓解应力材料代替亚克力材料，以提高弯折区的弯折性。
有机层33的宽度即为通孔的宽度。本实施例中，有机层33的宽度为弯折区的长度，即为11mm~15mm，优选为12mm、13mm，从而弯折半径较小，使得显示面板较薄，同时保证弯折区100的弯折性能优良效果。
S8第三无机层制备步骤，采用等离子体增强化学的气相沉积的方法在所述第二无机层32、所述有机层33形成第三无机层34，参照图5。第三无机层34厚度为0.8um~1.2um，优选为0.9um、1um，进而提高有机层与无机层之间的粘着力。
S9触控层贴附步骤，在所述第三无机层34上表面贴附一触控层4，参照图1。
S10偏光片设置步骤，在所述触控层上表面设置一偏光片5，参照图1。
S11盖板设置步骤，在所述偏光片上设置一盖板6，参照图1。
本发明提供一种显示面板及其制备方法，通过在第二无机层中设置一直线形的有机层，使得显示面板在有机层对应的位置是可弯折的，有机层两侧的第二无机层是不弯折的，进而使得显示面板与有机层对应的区域被称为弯折区，显示面板与第二无机层对应的区域被称为非弯折区，进而既可以保证弯折区的弯折性能良好，又可以提高非弯折区的阻水氧能力，延长显示面板的寿命。
以上所述仅是本发明的优选实施方法，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种显示面板，其中，
    所述显示面板包括：
    基板；
    发光层，贴附于所述基板一侧的表面；
    第一无机层，贴附于所述发光层远离所述基板一侧的表面；
    第二无机层，贴附于所述第一无机层远离所述发光层一侧的表面；所述第二无机层设有一直线形的通孔；
    有机层，设于所述通孔内，且贴附于所述第一无机层远离所述发光层一侧的表面；以及
    第三无机层，贴附于所述第二无机层、所述有机层远离所述第一无机层一侧的表面。
  2. 如权利要求1所述的显示面板，其中，还包括
    触控层，设于所述第三无机层远离所述基板一侧的表面；
    偏光片，设于所述触控层远离所述基板一侧的表面；
    盖板，设于所述偏光片远离所述基板一侧的表面。
  3. 如权利要求1所述的显示面板，其中，
    所述第二无机层的厚度与所述有机层的厚度相同或相近。
  4. 如权利要求1所述的显示面板，其中，
    所述第一无机层的厚度为0.8um~1.2um；和/或，
    所述第三无机层的厚度为0.8um~1.2um；和/或，
    所述第二无机层的厚度与所述有机层的厚度均为5um~7um。
  5. 如权利要求1所述的显示面板，其中，
    所述第一无机层的材质为SiNx；
    所述第二无机层的材质为SION；
    所述第三无机层的材质为SiNx；
    所述有机层的材料为亚克力。
  6. 如权利要求1所述的显示面板，其中，
    所述通孔的宽度为11mm~15mm。
  7. 一种显示面板的制备方法，其中，包括如下步骤：
    基板蒸镀步骤，蒸镀一基板；
    发光层制备步骤，在所述基板上表面形成一发光层；
    第一无机层制备步骤，在所述发光层上表面形成一第一无机层；
    掩膜板安装步骤，在所述第一无机层上表面对位贴附一掩膜板，包括一直线形遮挡区；
    第二无机层制备步骤，透过该掩膜板在所述第一无机层上表面形成一第二无机层，该第二无机层具备一直线形的通孔，该通孔的位置与所述掩膜板遮挡区的位置相对应；
    掩膜板移除步骤，移除所述掩膜板；以及
    有机层制备步骤，在所述通孔内形成一有机层；
    第三无机层制备步骤，在所述第二无机层、所述有机层上表面形成第三无机层。
  8. 如权利要求7所述的显示面板的制备方法，其中，
    在所述第三无机层制备步骤后，还包括如下步骤：
    触控层贴附步骤，在所述第三无机层上表面贴附一触控层；
    偏光片设置步骤，在所述触控层上表面设置一偏光片；以及
    盖板设置步骤，在所述偏光片上设置一盖板。
  9. 如权利要求7所述的显示面板的制备方法，其中，
    在所述第一无机层制备步骤中，采用化学气相沉积的方法；和/或，
    在所述第二无机层制备步骤中，采用等离子体增强化学气相沉积的方法在所述第一无机层上表面形成所述第二无机层；和/或，
    在所述第三无机层制备步骤中，采用等离子体增强化学气相沉积的方法在所述第二无机层、所述有机层上表面形成所述第三无机层。
  10. 如权利要求7所述的显示面板的制备方法，其中，
    在所述有机层制备步骤中，
    采用喷墨打印的方法在所述通孔内填满有机材料，形成所述有机层。
PCT/CN2019/105870 2019-05-16 2019-09-16 一种显示面板及其制备方法 WO2020228203A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910408323.7A CN110212106A (zh) 2019-05-16 2019-05-16 一种显示面板及其制备方法
CN201910408323.7 2019-05-16

Publications (1)

Publication Number Publication Date
WO2020228203A1 true WO2020228203A1 (zh) 2020-11-19

Family

ID=67787503

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/105870 WO2020228203A1 (zh) 2019-05-16 2019-09-16 一种显示面板及其制备方法

Country Status (2)

Country Link
CN (1) CN110212106A (zh)
WO (1) WO2020228203A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110212106A (zh) * 2019-05-16 2019-09-06 武汉华星光电半导体显示技术有限公司 一种显示面板及其制备方法
CN111312930A (zh) * 2020-04-02 2020-06-19 昆山国显光电有限公司 封装结构及其制备方法、显示面板及其制备方法
CN113299851B (zh) * 2021-05-10 2024-04-02 武汉华星光电半导体显示技术有限公司 曲面显示面板及其制备方法、显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170279073A1 (en) * 2016-03-23 2017-09-28 Japan Display Inc. Display device
CN207896125U (zh) * 2018-03-20 2018-09-21 京东方科技集团股份有限公司 一种封装结构及显示面板
CN109346625A (zh) * 2018-09-26 2019-02-15 武汉华星光电半导体显示技术有限公司 显示面板及其制作方法、显示模组
CN110212106A (zh) * 2019-05-16 2019-09-06 武汉华星光电半导体显示技术有限公司 一种显示面板及其制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170279073A1 (en) * 2016-03-23 2017-09-28 Japan Display Inc. Display device
CN207896125U (zh) * 2018-03-20 2018-09-21 京东方科技集团股份有限公司 一种封装结构及显示面板
CN109346625A (zh) * 2018-09-26 2019-02-15 武汉华星光电半导体显示技术有限公司 显示面板及其制作方法、显示模组
CN110212106A (zh) * 2019-05-16 2019-09-06 武汉华星光电半导体显示技术有限公司 一种显示面板及其制备方法

Also Published As

Publication number Publication date
CN110212106A (zh) 2019-09-06

Similar Documents

Publication Publication Date Title
WO2020228203A1 (zh) 一种显示面板及其制备方法
WO2019041386A1 (zh) Oled面板的制作方法及oled面板
CN106848088B (zh) 显示模组封装结构及其制备方法
WO2018086191A1 (zh) Oled显示器及其制作方法
US20190067629A1 (en) Oled panel fabrication method and oled panel
TWM529187U (zh) 顯示模組封裝結構
CN105047829A (zh) 有机电致发光器件的封装结构及封装方法、柔性显示装置
WO2020098135A1 (zh) 显示模组及其制作方法、电子装置
WO2016019638A1 (zh) 像素单元及其制作方法、显示面板、显示装置
CN206451712U (zh) 一种新型柔性amoled显示屏封装结构
WO2021031417A1 (zh) 一种柔性封装结构及柔性显示面板
WO2019237497A1 (zh) 一种柔性oled器件及其制备方法
WO2019051920A1 (zh) Oled显示面板的封装方法
WO2020155564A1 (zh) 一种oled显示面板及其制作方法
WO2021128540A1 (zh) 显示面板及其制作方法
WO2019080159A1 (zh) 制备oled薄膜封装层的方法、oled薄膜封装结构及oled结构
WO2021036179A1 (zh) 一种显示面板及掩膜板
WO2020124805A1 (zh) 显示屏及显示装置
CN106848087A (zh) 显示模组封装结构及其制备方法
US10707450B2 (en) OLED thin film packaging structure and method
WO2021027171A1 (zh) 一种柔性显示面板及其制备方法
WO2020237830A1 (zh) 柔性有机发光二极管显示面板及其制造方法
WO2021012402A1 (zh) 一种有机发光二极管显示面板及其制作方法
WO2020237827A1 (zh) 有机发光二极管显示面板
WO2020248408A1 (zh) 阵列基板、显示面板及阵列基板的制作方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19928661

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19928661

Country of ref document: EP

Kind code of ref document: A1