WO2021115152A1 - Dispositif électronique et procédé de préparation d'un film de protection de dispositif électronique - Google Patents

Dispositif électronique et procédé de préparation d'un film de protection de dispositif électronique Download PDF

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Publication number
WO2021115152A1
WO2021115152A1 PCT/CN2020/132860 CN2020132860W WO2021115152A1 WO 2021115152 A1 WO2021115152 A1 WO 2021115152A1 CN 2020132860 W CN2020132860 W CN 2020132860W WO 2021115152 A1 WO2021115152 A1 WO 2021115152A1
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WO
WIPO (PCT)
Prior art keywords
colloid
electronic device
cover glass
protective film
gap
Prior art date
Application number
PCT/CN2020/132860
Other languages
English (en)
Chinese (zh)
Inventor
刘宙
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021115152A1 publication Critical patent/WO2021115152A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds

Definitions

  • This application relates to the technical field of electronic products, and in particular to an electronic device and a method for preparing an electronic device protective film.
  • the electronic device and the method for preparing the protective film of the electronic device provided by the embodiments of the present application can form a transparent protective film on the cover glass of the electronic device. When the electronic device is dropped at a small angle, it can effectively form Fall protection.
  • an embodiment of the present application provides an electronic device.
  • the electronic device includes a cover glass, a middle frame, and a protective film, the cover glass is carried on the middle frame, the protective film has elasticity, and the The protective film partially covers the surface of the cover glass, and the protective film is partially located in the gap between the cover glass and the middle frame.
  • the embodiments of the present application provide a method for preparing a protective film for an electronic device, and the method for preparing the protective film for an electronic device includes:
  • the jig has a receiving space and an inlet, the inlet communicating with the receiving space;
  • the gap includes the cover glass and the electronic device The gap between the middle frame;
  • the electronic device is taken out of the jig, and the protective film on the edge of the cover glass is trimmed.
  • FIG. 2 is a schematic diagram of a structure of a jig for preparing an electronic device protective film provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of the AA cross-sectional view of the electronic device provided in FIG. 4.
  • FIG. 7 is a schematic diagram of a process corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of another structure of the preparation jig for the protective film of the electronic device provided by the embodiment of the present application.
  • FIG. 12 is a schematic diagram of preparing the first colloid on the surface of the cover glass of the electronic device by using a jig.
  • FIG. 13 is a schematic diagram of using a jig to prepare a second colloid on the surface of the cover glass of the electronic device.
  • FIG. 15 is a schematic flow diagram corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.
  • Fig. 17 is a schematic diagram of preparing a first filling layer into the gap between the cover glass and the middle frame by using a jig.
  • FIG. 19 is a schematic flowchart corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.
  • 20 is a schematic diagram of preparing a third filling layer into the gap between the cover glass and the middle frame by using a jig.
  • FIG. 21 is a schematic diagram of preparing a fourth filling layer on the surface of the cover glass by using a jig.
  • FIG. 23 is a schematic flow diagram corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.
  • FIG. 24 is a schematic diagram of the structure corresponding to step S250 in FIG. 23.
  • FIG. 25 is a schematic flow chart corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.
  • An embodiment of the present application provides an electronic device.
  • the electronic device includes a cover glass, a middle frame, and a protective film, the cover glass is carried on the middle frame, the protective film is elastic, and the protective film part Covering the surface of the cover glass, and the protective film is partially located in the gap between the cover glass and the middle frame.
  • the protective film is made of a transparent material.
  • the protective film includes a first protective layer and a second protective layer connected by bending, the first protective layer is attached to the surface of the cover glass, and the second protective layer is located between the cover glass and the cover glass. In the gap between the middle frames.
  • the embodiment of the present application also provides a method for preparing a protective film for an electronic device, and the method for preparing the protective film for an electronic device includes:
  • the jig has a receiving space and an inlet, the inlet communicating with the receiving space;
  • the electronic device is taken out of the jig, and the protective film on the edge of the cover glass is trimmed.
  • the gap includes the cover glass and the electronic device
  • the gap between the middle frame, and the gate part faces the surface of the cover glass of the electronic device, and part faces the cover glass and the middle frame of the electronic device The gap between.
  • the jig further includes a discharge port, the discharge port communicates with the containing space, the "filling the gate with a transparent liquid colloid, filling the gap with the liquid colloid, and curing the Liquid colloid to form a protective film on the surface of the cover glass and between the cover glass and the middle frame of the electronic device" includes:
  • the number of the inlet is multiple, and the number of the outlet is also multiple, and the inlet and the outlet are respectively located on opposite sides of the electronic device.
  • the direction of the suction force is set along the axial direction of the discharge port, and the density of the first colloid is greater than the density of the second colloid.
  • the direction of applying air pressure is set along the axial direction of the gate, and the density of the first colloid is greater than the density of the second colloid.
  • the "filling the transparent liquid colloid into the gate” includes:
  • the gate at least partly faces the gap between the cover glass and the middle frame, and the "filling the gate with a transparent liquid colloid, and filling the gap with the liquid colloid” And curing the liquid colloid to form a protective film on the surface of the cover glass and the gap between the cover glass and the middle frame of the electronic device" includes:
  • the gate fills the gate with a transparent liquid colloid, so that the colloid is filled on the surface of the cover glass, and the colloid is cured to form a second filling layer, the second filling layer and the first filling layer Together they constitute the protective film.
  • filling the gate with transparent liquid colloid at the first speed first includes:
  • the preparation method of the electronic device protective film further includes:
  • An isolation layer is formed on the peripheral side of the middle frame, and the isolation layer is used to prevent the glue from adhering to the surface of the middle frame.
  • a detachable upper cover plate and a lower cover plate are provided, the upper cover plate defines the gate, the lower cover plate has a receiving groove, and the upper cover plate covers the opening of the receiving groove;
  • the "removing the electronic device from the jig and trimming the protective film on the edge of the cover glass” includes:
  • the protective film on the edge of the cover glass is cut, polished and polished to remove burrs on the edge of the cover glass.
  • the gate 10b When the gate 10b is filled with liquid gel, the gel can flow into the receiving space 10a, and then cover the cover of the electronic device 20
  • the protective film 30 On the surface of the plate glass 210 and in the gap S between the cover glass 210 and the middle frame 220, the protective film 30 can be obtained after the colloid is solidified.
  • the material of the protective film 30 is soft at room temperature and has strong cushioning properties, which can be better. This reduces the possibility of breakage of the electronic device 20 when dropped from a large surface.
  • the middle frame 220 can be regarded as the frame of the electronic device 20, the middle frame 220 is used to carry the display components of the electronic device 20, and the middle frame 220 is usually made of metal.
  • the glue When the glue is filled, a sealed space is formed between the cover glass 210 and the edges of the display 230 and the middle frame 220 (the thickness of the space is 0.14 mm, which is the glue thickness), and the glue flows into the middle of the display 230 and the cover from the gate 10b.
  • the first colloid 410 and the second colloid 420 are both liquid colloids. Specifically, the process of filling the gate 10b with colloid and the process of applying suction to the colloid at the discharge port 10c are alternately performed. The first colloid 410 is filled into the gate 10b first, and then toward the first colloid at the discharge port 10c.
  • the 410 applies a suction force to promote the flow of the first colloid 410, and then fills the second colloid 420 into the gate 10b, and then applies a suction force to the second colloid 420 at the position of the discharge port 10c to promote the flow of the second colloid 420
  • the flow makes the second colloid 420 completely contact the first colloid 410, and the bubbles in the second colloid 420 can be discharged.
  • first colloid 410 and the second colloid 420 may be the same or different.
  • the density of the first colloid 410 is greater than the density of the second colloid 420. That is, the first glue 410 with a higher density is filled into the gate 10b first, so that part of the first glue 410 remains in the receiving space 10a of the jig 10, forming a preliminary covering effect on the surface of the cover glass 210.
  • the "S310: Fill the gate 10b with transparent liquid colloid" includes but not limited to S3101, S3102, S3103, and S3104.
  • S3103 and S3104 are introduced as follows.
  • S3103 Fill the second colloid 420 into the gate 10b. Please refer to Figure 13 again.
  • the receiving space 10a of the jig 10 is filled with the first colloid 410.
  • This process requires that the second colloid 420 is completely in contact with the first colloid 410, and the first colloid 410 and the second colloid 420 are promoted. Synchronous flow to fill the gap S between the cover glass 210 and the middle frame 220 and cover the surface of the cover glass 210. For this reason, a relatively large pressure is required to facilitate the synchronous flow of the first colloid 410 and the second colloid 420 , And can make the first colloid 410 and the second colloid 420 more densely filled in the containing space 10a, can enhance the compactness of the protective film 30, and thereby improve the protective performance of the protective film 30.
  • S302 Fill the gate 10b with a transparent liquid colloid, so that the colloid is filled on the surface of the cover glass 210, and the colloid is cured to form a second filling layer 402, the second filling layer 402 Together with the first filling layer 401, the protective film 30 is formed. Please continue to refer to Figure 18.
  • S300 Fill the gate 10b with a transparent liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid to
  • the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 of the electronic device 20 form a protective film 30" including but not limited to S303 and S304.
  • S303 and S304 are introduced as follows.
  • S304 Fill the gate 10b with a transparent liquid colloid at a second speed, so that the colloid is filled on the surface of the cover glass 210, and the colloid is cured to form a fourth filling layer 404.
  • the first speed is less than the second speed.
  • the gap S between the gaps S is relatively narrow, and only the slowly filled colloid can better discharge the bubbles in the gap S, which can make the third filling layer 403 more dense.
  • the surface space of the cover glass 210 is relatively large, and the colloid can be filled at a relatively high speed to form the fourth filling layer 404, which can improve the efficiency of forming the protective film 30.
  • buffer particles 50 can be added to the gate 10b, and the buffer particles 50 can flow in the colloid. Acting on the gap S filled between the cover glass 210 and the middle frame 220, the buffer particles 50 have elasticity.
  • the buffer particles 50 are transparent soft particles, which can be spherical.
  • the buffering characteristics of the protective film 30 can be increased, and on the other hand, the material of the third filling layer 403 can be made more dense, which can be effective for the electronic device 20. Waterproof and dustproof effect.
  • S300 Fill the gate 10b with a transparent liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid to Before the protective film 30" is formed on the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 of the electronic device 20, the method for preparing the protective film 30 of the electronic device 20 is also Including but not limited to S250.
  • S250 is introduced as follows.
  • An isolation layer 300 is formed on the peripheral side of the middle frame 220, and the isolation layer 300 is used to prevent glue from adhering to the surface of the middle frame 220. Please continue to refer to Figure 24.
  • the receiving slot 102a can limit the position of the electronic device 20.
  • the cover glass 210 of the electronic device 20 and the upper cover A gap is formed between the plates 101, and the gap is used for filling colloid.
  • the size of the gap space is closely related to the volume of the protective film 30 formed, and the thickness of the protective film 30 can be controlled by controlling the size of the gap.
  • S400 Take the electronic device 20 out of the jig 10, and trim the protective film 30 on the edge of the cover glass 210 "Including but not limited to S410, S410 is introduced as follows.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Geochemistry & Mineralogy (AREA)
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Abstract

Les modes de réalisation de la présente invention concernent un dispositif électronique, un procédé de préparation d'un film de protection de dispositif électronique. Le dispositif électronique comprend un verre de plaque de recouvrement, un cadre intermédiaire et un film protecteur, le verre de plaque de recouvrement étant porté sur le cadre intermédiaire, le film protecteur a une élasticité, une partie du film de protection recouvre la surface du verre de plaque de recouvrement, et une partie du film de protection est située dans un espace entre le verre de plaque de recouvrement et le cadre intermédiaire. Lorsque le dispositif électronique tombe avec un petit angle, le film protecteur peut efficacement former une protection contre les chutes pour le dispositif électronique.
PCT/CN2020/132860 2019-12-13 2020-11-30 Dispositif électronique et procédé de préparation d'un film de protection de dispositif électronique WO2021115152A1 (fr)

Applications Claiming Priority (2)

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CN201911283528.3 2019-12-13
CN201911283528.3A CN112968983B (zh) 2019-12-13 2019-12-13 电子设备及电子设备保护膜的制备方法

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CN114619608A (zh) * 2022-04-19 2022-06-14 吴秀兰 一种电子设备保护膜的成型方法和电子设备保护膜

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WO2016015567A1 (fr) * 2014-07-31 2016-02-04 宇龙计算机通信科技(深圳)有限公司 Dispositif d'affichage et terminal
CN105227705A (zh) * 2015-08-31 2016-01-06 广东欧珀移动通信有限公司 壳体组件成型工艺
CN205974271U (zh) * 2016-06-01 2017-02-22 维沃移动通信有限公司 一种盖板玻璃的保护结构及移动终端
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113870709A (zh) * 2021-09-29 2021-12-31 京东方科技集团股份有限公司 显示装置
CN113870709B (zh) * 2021-09-29 2023-08-25 京东方科技集团股份有限公司 显示装置

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