WO2021115152A1

WO2021115152A1 - Electronic device and preparation method for electronic device protective film

Info

Publication number: WO2021115152A1
Application number: PCT/CN2020/132860
Authority: WO
Inventors: 刘宙
Original assignee: Oppo广东移动通信有限公司
Priority date: 2019-12-13
Filing date: 2020-11-30
Publication date: 2021-06-17
Also published as: CN112968983B; CN112968983A

Abstract

Provided in the embodiments of the present application are an electronic device and a preparation method for an electronic device protective film. The electronic device comprises cover plate glass, a middle frame and a protective film, wherein the cover plate glass is borne on the middle frame, the protective film has elasticity, a part of the protective film covers the surface of the cover plate glass, and a part of the protective film is located in a gap between the cover plate glass and the middle frame. When the electronic device falls at a small angle, the protective film can effectively form a fall protection for the electronic device.

Description

Electronic equipment and preparation method of electronic equipment protective film

Technical field

This application relates to the technical field of electronic products, and in particular to an electronic device and a method for preparing an electronic device protective film.

Background technique

At present, most mobile phone manufacturers will stick a transparent protective film on the surface of the display. When the mobile phone accidentally falls, the protective film on the surface of the display first contacts the ground, which plays a certain buffering effect to protect the surface glass of the display from breaking . With the development of 2.5D screens and 3D screens, generally, protective films or tempered films are placed on the touch area of the display screen, and it is still easy to cause damage to the display screen when it is dropped from a small angle.

Summary of the invention

The electronic device and the method for preparing the protective film of the electronic device provided by the embodiments of the present application can form a transparent protective film on the cover glass of the electronic device. When the electronic device is dropped at a small angle, it can effectively form Fall protection.

In a first aspect, an embodiment of the present application provides an electronic device. The electronic device includes a cover glass, a middle frame, and a protective film, the cover glass is carried on the middle frame, the protective film has elasticity, and the The protective film partially covers the surface of the cover glass, and the protective film is partially located in the gap between the cover glass and the middle frame.

In a second aspect, the embodiments of the present application provide a method for preparing a protective film for an electronic device, and the method for preparing the protective film for an electronic device includes:

Provide a jig, the jig has a receiving space and an inlet, the inlet communicating with the receiving space;

Provide an electronic device, fix the electronic device in the accommodating space, and there is a gap between the cover glass of the electronic device and the jig, the gap includes the cover glass and the electronic device The gap between the middle frame;

Fill the gate with a transparent liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid so as to be on the surface of the cover glass, the cover glass and the electronic device The gap between the middle frame forms a protective film;

The electronic device is taken out of the jig, and the protective film on the edge of the cover glass is trimmed.

Description of the drawings

In order to more clearly describe the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are some embodiments of the present application, which are common in the field. As far as technical personnel are concerned, they can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic diagram of a process corresponding to a method for preparing a protective film for an electronic device according to an embodiment of the present application.

2 is a schematic diagram of a structure of a jig for preparing an electronic device protective film provided by an embodiment of the present application.

FIG. 3 is a schematic diagram of an exploded structure of the preparation jig for the protective film of the electronic device provided by the embodiment of the present application.

FIG. 4 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 5 is a schematic structural diagram of the AA cross-sectional view of the electronic device provided in FIG. 4.

FIG. 6 is a schematic structural diagram of a partial enlarged view of the area P in FIG. 5.

FIG. 7 is a schematic diagram of a process corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

FIG. 8 is a schematic diagram of another structure of the preparation jig for the protective film of the electronic device provided by the embodiment of the present application.

FIG. 9 is a schematic diagram of another structure of the preparation jig for the protective film of the electronic device provided by the embodiment of the present application.

FIG. 10 is a schematic flow diagram corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

FIG. 11 is a schematic flow diagram corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

FIG. 12 is a schematic diagram of preparing the first colloid on the surface of the cover glass of the electronic device by using a jig.

FIG. 13 is a schematic diagram of using a jig to prepare a second colloid on the surface of the cover glass of the electronic device.

FIG. 14 is a schematic diagram of a process corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

FIG. 15 is a schematic flow diagram corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

FIG. 16 is a schematic flow diagram corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

Fig. 17 is a schematic diagram of preparing a first filling layer into the gap between the cover glass and the middle frame by using a jig.

FIG. 18 is a schematic diagram of preparing a second filling layer on the surface of the cover glass by using a jig.

FIG. 19 is a schematic flowchart corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

20 is a schematic diagram of preparing a third filling layer into the gap between the cover glass and the middle frame by using a jig.

FIG. 21 is a schematic diagram of preparing a fourth filling layer on the surface of the cover glass by using a jig.

FIG. 22 is a schematic diagram of the structure of mixing buffer particles into a colloid in an embodiment of the present application.

FIG. 23 is a schematic flow diagram corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

FIG. 24 is a schematic diagram of the structure corresponding to step S250 in FIG. 23.

FIG. 25 is a schematic flow chart corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

FIG. 26 is a schematic diagram of the structure corresponding to step S110 in FIG. 25.

FIG. 27 is a schematic diagram of a process corresponding to another method for preparing a protective film for an electronic device according to an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of them. Based on the implementation manners in this application, all other implementation manners obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of this application. And the following embodiments are not independent, any combination of the embodiments can be made between the embodiments, and the technical features can be combined to form a new technical solution.

An embodiment of the present application provides an electronic device. The electronic device includes a cover glass, a middle frame, and a protective film, the cover glass is carried on the middle frame, the protective film is elastic, and the protective film part Covering the surface of the cover glass, and the protective film is partially located in the gap between the cover glass and the middle frame.

Wherein, between the protective film and the middle frame and between the protective film and the cover glass are detachable connections, and the protective film is made of a transparent material.

Wherein, the protective film includes a first protective layer and a second protective layer connected by bending, the first protective layer is attached to the surface of the cover glass, and the second protective layer is located between the cover glass and the cover glass. In the gap between the middle frames.

Wherein, the thickness of the second protective layer is greater than the thickness of the first protective layer.

The embodiment of the present application also provides a method for preparing a protective film for an electronic device, and the method for preparing the protective film for an electronic device includes:

Wherein, "provide electronic equipment, fix the electronic equipment in the accommodating space, and there is a gap between the cover glass of the electronic equipment and the jig, and the gap includes the cover glass and the fixture. "The gap between the middle frames of the electronic equipment" includes:

Provide an electronic device, fix the electronic device in the accommodating space, and there is a gap between the cover glass of the electronic device and the jig, the gap includes the cover glass and the electronic device The gap between the middle frame, and the gate part faces the surface of the cover glass of the electronic device, and part faces the cover glass and the middle frame of the electronic device The gap between.

Wherein, the jig further includes a discharge port, the discharge port communicates with the containing space, the "filling the gate with a transparent liquid colloid, filling the gap with the liquid colloid, and curing the Liquid colloid to form a protective film on the surface of the cover glass and between the cover glass and the middle frame of the electronic device" includes:

Fill the gate with a transparent liquid colloid. When a uniform colloid flows out from the outlet, the outlet is blocked, and the jig is kept under pressure for a preset period of time, so that the liquid colloid is evenly filled In the gap.

Wherein, the number of the inlet is multiple, and the number of the outlet is also multiple, and the inlet and the outlet are respectively located on opposite sides of the electronic device.

Wherein, the "filling the transparent liquid colloid into the gate" includes:

Fill the gate with colloid, and apply suction or pressure treatment to the colloid, so that the colloid flows and fills the surface of the cover glass and the center of the cover glass and the electronic device. The gap between the boxes.

Wherein, the "filling the transparent liquid colloid into the gate" includes:

Filling the first colloid into the gate;

Applying suction to the first colloid at the position of the discharge port;

Filling the second colloid into the gate;

A suction force is applied to the second colloid at the position of the discharge port, so that the second colloid flows out uniformly from the discharge port.

Wherein, the direction of the suction force is set along the axial direction of the discharge port, and the density of the first colloid is greater than the density of the second colloid.

Wherein, the "filling the transparent liquid colloid into the gate" includes:

Filling the first colloid into the gate;

Pressurize the first colloid at the gate position;

Filling the second colloid into the gate;

The second colloid at the gate position is pressurized to make the second colloid uniformly flow out from the outlet.

Wherein, the direction of applying air pressure is set along the axial direction of the gate, and the density of the first colloid is greater than the density of the second colloid.

Wherein, the "filling the transparent liquid colloid into the gate" includes:

The gel is filled into the gate, and the flow rate of the gel is a first speed, so that the flow rate of the gel flowing out through the discharge port is a second speed, and the second speed is less than the first speed.

Wherein, the gate at least partly faces the gap between the cover glass and the middle frame, and the "filling the gate with a transparent liquid colloid, and filling the gap with the liquid colloid" And curing the liquid colloid to form a protective film on the surface of the cover glass and the gap between the cover glass and the middle frame of the electronic device" includes:

First, fill the gate with a transparent liquid colloid, so that the colloid fills the gap between the cover glass and the middle frame, and solidify the colloid to form a first filling layer;

Then fill the gate with a transparent liquid colloid, so that the colloid is filled on the surface of the cover glass, and the colloid is cured to form a second filling layer, the second filling layer and the first filling layer Together they constitute the protective film.

Wherein, the “fill the transparent liquid colloid into the gate, fill the gap with the liquid colloid, and solidify the liquid colloid so as to be on the surface of the cover glass and the cover glass and The "protective film formed by the gap between the middle frames of the electronic device" includes:

First, fill the gate with a transparent liquid colloid at a first speed, so that the colloid fills the gap between the cover glass and the middle frame, and solidify the colloid to form a third filling layer;

Then fill the gate with a transparent liquid colloid at a second speed, so that the colloid is filled on the surface of the cover glass, and the colloid is cured to form a fourth filling layer, wherein the first speed is lower than the The second speed.

Wherein, "filling the gate with transparent liquid colloid at the first speed first" includes:

First, fill the gate with a transparent liquid colloid at the first speed, and add buffer particles into the gate, so that the colloid fills the gap between the cover glass and the middle frame, and solidifies The colloid forms a third filling layer; and the flow of the buffer particles in the liquid colloid is used to fill the gap between the cover glass and the middle frame; wherein the buffer particles have elasticity.

Wherein, in the "filling the gate with a transparent liquid colloid, filling the gap with the liquid colloid, and curing the liquid colloid, the surface of the cover glass and the cover glass Before forming a protective film in the gap between the middle frame of the electronic device and the electronic device, the preparation method of the electronic device protective film further includes:

An isolation layer is formed on the peripheral side of the middle frame, and the isolation layer is used to prevent the glue from adhering to the surface of the middle frame.

Wherein, the "providing a jig, the jig having a receiving space and an inlet, the inlet communicating with the receiving space" includes:

A detachable upper cover plate and a lower cover plate are provided, the upper cover plate defines the gate, the lower cover plate has a receiving groove, and the upper cover plate covers the opening of the receiving groove;

The "providing electronic equipment, fixing the electronic equipment in the accommodating space, and having a gap between the cover glass of the electronic equipment and the jig" includes:

The electronic device is fixed in the receiving groove so that a gap is formed between the cover glass of the electronic device and the upper cover plate.

Wherein, the "removing the electronic device from the jig and trimming the protective film on the edge of the cover glass" includes:

The protective film on the edge of the cover glass is cut, polished and polished to remove burrs on the edge of the cover glass.

Please refer to Figure 1, Figure 2, Figure 3, Figure 4, Figure 5, and Figure 6. The preparation methods of the electronic device protective film provided by the embodiments of the present application include but are not limited to S100, S200, S300 and S400. Regarding S100, S200, S300 and S400 are introduced as follows.

S100: Provide a jig 10, the jig 10 has a receiving space 10a and a gate 10b, and the gate 10b communicates with the receiving space 10a.

Wherein, the jig 10 is used to prepare a protective film 30 on the electronic device 20. The accommodating space 10a of the jig 10 is used to accommodate the electronic device 20, and the size of the accommodating space 10a is consistent with the size of the electronic device 20. When the electronic device 20 is accommodated in the accommodating space 10a, the electronic device 20 can be fixed. , The gate 10b partly faces the surface of the cover glass 210 of the electronic device 20, and partly faces the gap S between the cover glass 210 of the electronic device 20 and the middle frame 220. The gate 10b is used to fill the transparent liquid gel, and the gate 10b is connected to the receiving space 10a. When the gate 10b is filled with liquid gel, the gel can flow into the receiving space 10a, and then cover the cover of the electronic device 20 On the surface of the plate glass 210 and in the gap S between the cover glass 210 and the middle frame 220, the protective film 30 can be obtained after the colloid is solidified. The material of the protective film 30 is soft at room temperature and has strong cushioning properties, which can be better. This reduces the possibility of breakage of the electronic device 20 when dropped from a large surface.

Wherein, the electronic device 20 may be any device with a display function. For example: tablet computers, mobile phones, e-readers, remote controls, personal computers (Personal Computer, PC), notebook computers, in-vehicle devices, Internet TVs, wearable devices and other smart devices with display functions.

Specifically, the electronic device 20 provided by the embodiment of the present application includes a cover glass 210, a middle frame 220, and a protective film 30. The cover glass 210 is carried on the middle frame 220. The protective film 30 is elastic. The protective film 30 partially covers the surface of the cover glass 210, and the protective film 30 is partially located in the gap S between the cover glass 210 and the middle frame 220. Covering the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 with an elastic protective film 30 can protect the electronic device 20 more comprehensively. When the electronic device 20 falls at a small angle, a better protective effect can be formed on the cover glass 210, and thus the electronic device 20 can be protected from the fall.

Wherein, between the protective film 30 and the middle frame 220 and between the protective film 30 and the cover glass 210 are detachable connections, and the protective film 30 is made of a transparent material. When the protective film 30 is damaged, it can be directly removed from the cover glass 210 for replacement. The protective film 30 has elasticity and can play a better protective effect on the electronic device 20. The protective film 30 is prepared by a transparent colloid. For the preparation process of the protective film 30, please refer to the following introduction.

The protective film 30 includes a first protective layer 301 and a second protective layer 302 connected by bending, the first protective layer 301 is attached to the surface of the cover glass 210, and the second protective layer 302 is located on the In the gap S between the cover glass 210 and the middle frame 220. Wherein, the first protective layer 301 and the second protective layer 302 can be formed together in the same processing step, that is, the first protective layer 301 and the second protective layer 302 form a whole. The first protective layer 301 and the second protective layer 302 can also be separately formed in different processing steps. In this case, the first protective layer 301 and the second protective layer 302 can be considered to have different structures. In one embodiment, the thickness of the second protective layer 302 is greater than the thickness of the first protective layer 301. Since the second protective layer 302 is located in the gap S between the cover glass 210 and the middle frame 220, that is, the second protective layer 302 is used to protect the corners of the electronic device 20. When the thickness of the second protective layer 302 is When the thickness is greater than the thickness of the first protective layer 301, it helps to protect the electronic device 20 from falling at a small angle.

The middle frame 220 can be regarded as the frame of the electronic device 20, the middle frame 220 is used to carry the display components of the electronic device 20, and the middle frame 220 is usually made of metal.

S200: Provide an electronic device 20, fix the electronic device 20 in the accommodating space 10a, and there is a gap between the cover glass 210 of the electronic device 20 and the jig 10, and the gap includes the The gap S between the cover glass 210 and the middle frame 220 of the electronic device 20.

The electronic device 20 can be accommodated in the accommodating space 10a by means of a snap connection, that is, the accommodating space 10a of the jig 10 can limit the position of the electronic device 20, and when the electronic device 20 is accommodated in the accommodating space 10a There is a gap between the cover glass 210 of the electronic device 20 and the fixture 10 for filling the liquid colloid.

S300: Fill the gate 10b with a transparent liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid so as to be on the surface of the cover glass 210 and the cover glass 210 The gap S between and the middle frame 220 of the electronic device 20 forms a protective film 30.

Specifically, a transparent liquid gel is evenly injected into the gate 10b, so that the liquid gel fills the gap between the cover glass 210 and the middle frame 220, and the liquid gel covers the surface of the cover glass 210. After the liquid gel is solidified, a protective film 30 can be formed in the gap between the cover glass 210 and the middle frame 220 and the surface of the cover glass 210. Since the gap between the cover glass 210 and the middle frame 220 and the surface of the cover glass 210 are covered with the protective film 30, when the electronic device 20 falls at a small angle, the gap between the cover glass 210 and the middle frame 220 The protective film 30 in the S can protect the electronic device 20 from damage to the electronic device 20 when it is dropped from a small angle. When the glue is filled, a sealed space is formed between the cover glass 210 and the edges of the display 230 and the middle frame 220 (the thickness of the space is 0.14 mm, which is the glue thickness), and the glue flows into the middle of the display 230 and the cover from the gate 10b.

S400: Take the electronic device 20 out of the jig 10, and trim the protective film 30 on the edge of the cover glass 210.

Specifically, before the electronic device 20 is taken out of the accommodating space 10a of the jig 10, the electronic device 20 needs to be subjected to pressure maintaining treatment, and the electronic device 20 needs to be in a suitable temperature and pressure environment for a preset period of time. The surface of the cover glass 210 and the gel in the gap S between the cover glass 210 and the middle frame 220 are solidified, and then the electronic device 20 is taken out of the receiving space 10a of the fixture 10, and the edge of the cover glass 210 Part of the protective film 30 is trimmed to ensure that the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 are filled with the protective film 30.

In the method for preparing the protective film 30 of the electronic device 20 provided by the embodiment of the present application, the protective film 30 is formed on the surface of the cover glass 210 and in the gap S between the cover glass 210 and the middle frame 220, which can form a comparatively large area for the electronic device 20. Comprehensive protection. When the electronic device 20 falls at a small angle, a better protective effect can be formed on the cover glass 210, and thus the electronic device 20 can be protected from the fall. Moreover, the protective film 30 formed in this embodiment can be formed into various curved surfaces, and can be flexibly applied to 2.5D or 3D cover glass 210. Compared with the traditional flat protective film 30, the preparation method provided in the embodiment of the present application is prepared The application scenario of the protective film 30 that comes out is more complicated, and it can form a better fall protection for the electronic device 20.

Please continue to refer to Figures 7 and 8, in this embodiment, the fixture 10 further includes a discharge port 10c, the discharge port 10c is connected to the containing space 10a, the "S300: to the inlet 10b Fill the transparent liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid so as to be on the surface of the cover glass 210, the cover glass 210 and the middle frame of the electronic device 20 The protective film 30" formed between 220 includes but is not limited to S310. S310 is introduced as follows.

S310: Fill the gate 10b with a transparent liquid colloid, when the outlet 10c has a uniform colloid flowing out, block the outlet 10c, and hold the jig 10 for a preset period of time, So that the liquid colloid is evenly filled in the gap.

Specifically, by detecting the volume of the liquid colloid flowing out of the discharge port 10c per unit time, it is judged whether there is a uniform colloid flowing out. When the discharge port 10c has a uniform colloid flowing out, it can be considered that the filling of the colloid is relatively uniform. Hold the discharge port 10c, and then continue to fill the gate 10b with glue. When the glue overflows from the gate 10b, the jig 10 is pressure-maintained to make the liquid glue evenly cover the surface of the cover glass 210 , And the liquid gel is evenly filled in the gap S between the cover glass 210 and the middle frame 220.

Please continue to refer to Figure 9, further, in an embodiment, the number of the inlet 10b is multiple, the number of the discharge outlet 10c is also multiple, the inlet 10b and the row The outlets 10c are respectively located on two opposite sides of the electronic device 20, the inlets 10b are spaced at the top and edge of the electronic device 20, and the outlets 10c are spaced at the bottom of the electronic device 20. Among them, the number of the gate 10b can be 5, and the number of the discharge port 10c can be 3, and the gap S between the cover glass 210 and the middle frame 220 can be made through the cooperation of the gate 10b and the discharge port 10c. The protective film 30 is formed inside and on the surface of the cover glass 210.

Please continue to refer to FIG. 10, the "S310: Fill the gate 10b with a transparent liquid colloid" includes but is not limited to S311. S311 is introduced as follows.

S311: Fill the gate 10b with colloid, and apply suction or pressure treatment to the colloid, so that the colloid flows and fills the surface of the cover glass 210 and the cover glass 210 And the gap S between the middle frame 220 of the electronic device 20.

Please continue to refer to FIG. 11, in one embodiment, the "S310: Fill the gate 10b with transparent liquid colloid" includes but not limited to S315, S316, S317 and S318, regarding S315, S316, S317 And S318 are introduced as follows.

S315: Fill the first colloid 410 into the gate 10b. Refer to Figure 12.

S316: Apply a suction force to the first colloid 410 at the position of the discharge port 10c.

S317: Fill the second colloid 420 into the gate 10b. Refer to Figure 13.

S318: Apply a suction force to the second colloid 420 at the position of the discharge port 10c, so that the second colloid 420 uniformly flows out from the discharge port 10c.

Wherein, the first colloid 410 and the second colloid 420 are both liquid colloids. Specifically, the process of filling the gate 10b with colloid and the process of applying suction to the colloid at the discharge port 10c are alternately performed. The first colloid 410 is filled into the gate 10b first, and then toward the first colloid at the discharge port 10c. 410 applies a suction force to promote the flow of the first colloid 410, and then fills the second colloid 420 into the gate 10b, and then applies a suction force to the second colloid 420 at the position of the discharge port 10c to promote the flow of the second colloid 420 The flow makes the second colloid 420 completely contact the first colloid 410, and the bubbles in the second colloid 420 can be discharged.

Further, when the inlet 10b is filled with the first colloid 410, a suction force is first applied to the first colloid 410 in the discharge port 10c with a third force, so as to encourage the first colloid 410 to flow and fill the surface of the cover glass 210 , And make the first colloid 410 flow to fill the gap S between the cover glass 210 and the middle frame 220. Then the second colloid 420 is filled into the gate 10b so that the discharge port 10c has a uniform colloid flow out, and then a suction force is applied to the second colloid 420 in the discharge port 10c with a fourth force, so that the second colloid 420 flows and completely In contact with the first colloid 410, the application of suction can promote the flow of the colloid, wherein the fourth force is greater than the third force. When the first gel 410 is filled, the receiving space 10a of the jig 10 is filled with air. This process is mainly to exhaust the air remaining in the receiving space 10a. For this reason, it is necessary to apply a suction force with a small force to facilitate uniform The air in the storage space 10a is exhausted. When filling the second colloid 420, the receiving space 10a of the jig 10 is filled with the first colloid 410. This process requires that the second colloid 420 is completely in contact with the first colloid 410, and the first colloid 410 and the second colloid 420 are promoted. It flows synchronously to fill the gap S between the cover glass 210 and the middle frame 220 and cover the surface of the cover glass 210. For this reason, it is necessary to apply a greater force of suction to facilitate the first colloid 410 and the second colloid The 420 flows synchronously, and the first colloid 410 and the second colloid 420 can be more densely filled in the containing space 10a, which can enhance the compactness of the protective film 30, thereby improving the protective performance of the protective film 30.

Wherein, the direction in which the suction force is applied to the colloid in the discharge port 10c can be along the axis of the discharge port 10c, which can better promote the flow of the colloid, and can better make the colloid cover the surface of the cover glass 210, and flow filling The gap S between the cover glass 210 and the middle frame 220 forms a dense protective film 30 to improve the protective performance.

Furthermore, the first colloid 410 and the second colloid 420 may be the same or different. In a specific embodiment, the density of the first colloid 410 is greater than the density of the second colloid 420. That is, the first glue 410 with a higher density is filled into the gate 10b first, so that part of the first glue 410 remains in the receiving space 10a of the jig 10, forming a preliminary covering effect on the surface of the cover glass 210. Next, the second glue 420 with a lower density is filled into the gate 10b, so that the second glue 420 flows and fills the gap S between the cover glass 210 and the middle frame 220, and the second glue 420 flows and fills the first The small space formed by a colloid 410 is filled with colloids of different densities in different parts of the electronic device 20, which can make the filling of the colloid more thorough, help improve the density of the protective film 30, and thereby enhance the protection of the protective film 30 performance.

Please continue to refer to FIG. 14, in another embodiment, the "S310: Fill the gate 10b with transparent liquid colloid" includes but not limited to S3101, S3102, S3103, and S3104. S3103 and S3104 are introduced as follows.

S3101: Fill the first colloid 410 into the gate 10b. Please refer to Figure 12 again.

S3102: Pressurize the first colloid 410 at the position of the gate 10b.

S3103: Fill the second colloid 420 into the gate 10b. Please refer to Figure 13 again.

S3104: Pressurize the second colloid 420 at the position of the gate 10b, so that the second colloid 420 uniformly flows out from the outlet 10c.

Wherein, the first colloid 410 and the second colloid 420 are both liquid colloids. Specifically, the process of filling the gate 10b with colloid and the process of pressurizing the gate 10b are performed alternately. The first colloid 410 is filled into the gate 10b first, and then toward the first colloid at the position of the gate 10b. 410 applies the first air pressure to promote the flow of the first colloid 410 and help expel the bubbles in the first colloid 410, and then fill the second colloid 420 into the gate 10b, and then face the position of the gate 10b. A second air pressure is applied to the second colloid 420 to promote the flow of the second colloid 420, so that the second colloid 420 completely contacts the first colloid 410, and the bubbles in the second colloid 420 can be discharged.

Further, when the first gel 410 is filled in the gate 10b, the first pressure is applied to the first gel 410 in the gate 10b to force the first gel 410 to flow and fill the surface of the cover glass 210 , And make the first glue 410 flow to fill the gap S between the cover glass 210 and the middle frame 220, so that the first glue 410 is more dense. Then fill the second colloid 420 into the gate 10b so that the discharge port 10c has a uniform colloid flow out, and then apply air pressure to the second colloid 420 in the gate 10b at the second pressure, so that the second colloid 420 flows and completely In contact with the first colloid 410, the application of air pressure can promote the flow of the colloid, making the colloid more dense and can expel the bubbles in the colloid, wherein the second pressure is stronger than the first pressure. When filling the first gel 410, the receiving space 10a of the jig 10 is filled with air. This process is mainly to exhaust the air remaining in the receiving space 10a. For this reason, a smaller pressure is required to discharge the receiving space evenly. The air within 10a. When filling the second colloid 420, the receiving space 10a of the jig 10 is filled with the first colloid 410. This process requires that the second colloid 420 is completely in contact with the first colloid 410, and the first colloid 410 and the second colloid 420 are promoted. Synchronous flow to fill the gap S between the cover glass 210 and the middle frame 220 and cover the surface of the cover glass 210. For this reason, a relatively large pressure is required to facilitate the synchronous flow of the first colloid 410 and the second colloid 420 , And can make the first colloid 410 and the second colloid 420 more densely filled in the containing space 10a, can enhance the compactness of the protective film 30, and thereby improve the protective performance of the protective film 30.

Wherein, the direction of applying air pressure to the gel in the gate 10b can be along the axis of the gate 10b, which can better promote the flow of the gel, and can better make the gel cover the surface of the cover glass 210 and flow The gap S between the cover glass 210 and the middle frame 220 is filled to form a dense protective film 30 to improve the protective performance.

Please continue to refer to FIG. 15. In another embodiment, the "S310: Fill the gate 10b with a transparent liquid colloid" includes but is not limited to S312. S312 is introduced as follows.

S312: Fill the gate 10b with colloid, the flow rate of the colloid is the first speed, so that the flow rate of the colloid flowing out through the outlet 10c is the second speed, the second speed is less than the first speed One speed.

Specifically, in this embodiment, the gate 10b is continuously filled with colloid, when the flow rate of the colloid flowing into the gate 10b is the first speed, the speed of the colloid flowing out of the outlet 10c is the second speed, and the second speed When the speed is lower than the first speed, part of the glue can remain in the jig 10 and cover the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220.

Please continue to refer to FIG. 16, in this embodiment, the gate 10b at least partly faces the gap S between the cover glass 210 and the middle frame 220, and the "S300: to the inlet The opening 10b is filled with a transparent liquid colloid, the liquid colloid is filled into the gap, and the liquid colloid is solidified so as to be on the surface of the cover glass 210 and between the cover glass 210 and the electronic device 20 The gap S between the middle frames 220 forms a protective film 30" including but not limited to S301 and S302. S301 and S302 are introduced as follows.

S301: First fill the gate 10b with a transparent liquid colloid, so that the colloid fills the gap S between the cover glass 210 and the middle frame 220, and solidify the colloid to form a first filling layer 401. Please continue to refer to Figure 17.

S302: Fill the gate 10b with a transparent liquid colloid, so that the colloid is filled on the surface of the cover glass 210, and the colloid is cured to form a second filling layer 402, the second filling layer 402 Together with the first filling layer 401, the protective film 30 is formed. Please continue to refer to Figure 18.

Specifically, the gap S between the cover glass 210 and the middle frame 220 is filled with glue to form the first filling layer 401, and then the surface of the cover glass 210 is filled with glue to form the second filling layer 402, wherein, The hardness of the first filling layer 401 is less than the hardness of the second filling layer 402, that is, the hardness of the second filling layer 402 located in the gap S between the cover glass 210 and the middle frame 220 is relatively small, and the hardness of the second filling layer 402 is smaller than that of the second filling layer 402. The hardness of the first filling layer 401 on the surface of 210 is relatively high. The first filling layer 401 is used to protect the large area of the cover glass 210. The second filling layer 402 is made of soft material and is located on the cover glass 210 and the middle frame 220. The gap S between the two can play a buffering effect.

Please continue to refer to FIG. 19, in this embodiment, "S300: Fill the gate 10b with a transparent liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid to The surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 of the electronic device 20 form a protective film 30" including but not limited to S303 and S304. S303 and S304 are introduced as follows.

S303: First fill the gate 10b with a transparent liquid colloid at the first speed, so that the colloid fills the gap S between the cover glass 210 and the middle frame 220, and solidifies the colloid to form The third filling layer 403. Please continue to refer to Figure 20.

S304: Fill the gate 10b with a transparent liquid colloid at a second speed, so that the colloid is filled on the surface of the cover glass 210, and the colloid is cured to form a fourth filling layer 404. The first speed is less than the second speed. Please continue to refer to Figure 21.

Specifically, a third filling layer 403 is first formed in the gap S between the cover glass 210 and the middle frame 220, and a transparent liquid colloid is filled into the gate 10b at a first speed, and then the cover glass 210 The fourth filling layer 404 is formed on the surface, and the transparent liquid colloid is filled into the gate 10b at the second speed. The first speed is lower than the second speed, that is, the cover glass 210 and the middle frame are fed at a lower speed. The gap S between 220 is filled with colloid to form the third filling layer 403, and the surface of the cover glass 210 is filled with colloid at a higher speed to form the fourth filling layer 404. This is due to the cover glass 210 and the middle frame 220 The gap S between the gaps S is relatively narrow, and only the slowly filled colloid can better discharge the bubbles in the gap S, which can make the third filling layer 403 more dense. The surface space of the cover glass 210 is relatively large, and the colloid can be filled at a relatively high speed to form the fourth filling layer 404, which can improve the efficiency of forming the protective film 30.

Please continue to refer to FIG. 22. Further, in the process of filling the gate 10b with transparent liquid colloid at the first speed, buffer particles 50 can be added to the gate 10b, and the buffer particles 50 can flow in the colloid. Acting on the gap S filled between the cover glass 210 and the middle frame 220, the buffer particles 50 have elasticity. The buffer particles 50 are transparent soft particles, which can be spherical. When the buffer particles 50 are mixed in the colloid and filled in When inside the gap S between the cover glass 210 and the middle frame 220, on the one hand, the buffering characteristics of the protective film 30 can be increased, and on the other hand, the material of the third filling layer 403 can be made more dense, which can be effective for the electronic device 20. Waterproof and dustproof effect.

Please continue to refer to FIG. 23. In this embodiment, in "S300: Fill the gate 10b with a transparent liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid to Before the protective film 30" is formed on the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 of the electronic device 20, the method for preparing the protective film 30 of the electronic device 20 is also Including but not limited to S250. S250 is introduced as follows.

S250: An isolation layer 300 is formed on the peripheral side of the middle frame 220, and the isolation layer 300 is used to prevent glue from adhering to the surface of the middle frame 220. Please continue to refer to Figure 24.

Specifically, before placing the electronic device 20 in the accommodating space 10 a of the jig 10, an isolation layer 300 is formed on the peripheral side of the middle frame 220, and the isolation layer 300 covers a part of the surface of the middle frame 220. Then place the electronic device 20 in the accommodating space 10a of the fixture 10, and when the glue is filled into the gate 10b of the fixture 10, the isolation layer 300 can protect the surface of the middle frame 220 to prevent the glue from adhering to the middle frame 220 Surface, destroy the consistency of the appearance of the middle frame 220. The isolation layer 300 may be a protective film, which is attached to a part of the surface of the middle frame 220. The isolation layer 300 may also be an isolation plating layer. The isolation plating layer is formed on a part of the surface of the middle frame 220 to prevent the glue from adhering to the surface of the middle frame 220, and finally the isolation plating layer is removed.

Please continue to refer to FIG. 25. In this embodiment, the "S100: provide a jig 10, the jig 10 has a receiving space 10a and a gate 10b, and the gate 10b communicates with the receiving space 10a" Including but not limited to S110, S110 is introduced as follows.

S110: Provide an upper cover 101 and a lower cover 102 that are detachably connected, the upper cover 101 defines the gate 10b, the lower cover 102 has a receiving groove 102a, and the upper cover 101 covers At the opening of the receiving slot 102a. Please continue to refer to Figure 26.

The jig 10 is formed by covering the upper cover plate 101 and the lower cover plate 102, the gate 10b is opened on the upper cover plate 101, and the receiving groove 102a is formed on the lower cover plate 102. After the upper cover plate 101 and the lower cover plate 102 are covered, a receiving space 10a is formed on the lower cover plate 102. The upper cover plate 101 and the lower cover plate 102 can be metal molds. A protective film 30 is formed on the surface and in the gap S between the cover glass 210 and the middle frame 220.

The "S200: Provide an electronic device 20, fix the electronic device 20 in the receiving space 10a, and there is a gap between the cover glass 210 of the electronic device 20 and the fixture 10" includes but not Limited to S210, the introduction of S210 is as follows.

S210: Fix the electronic device 20 in the receiving groove 102a so that a gap is formed between the cover glass 210 of the electronic device 20 and the upper cover 101.

Place the electronic device 20 in the receiving slot 102a. The receiving slot 102a can limit the position of the electronic device 20. When the upper cover 101 is closed on the lower cover 102, the cover glass 210 of the electronic device 20 and the upper cover A gap is formed between the plates 101, and the gap is used for filling colloid. The size of the gap space is closely related to the volume of the protective film 30 formed, and the thickness of the protective film 30 can be controlled by controlling the size of the gap.

Please continue to refer to FIG. 27. In this embodiment, "S400: Take the electronic device 20 out of the jig 10, and trim the protective film 30 on the edge of the cover glass 210 "Including but not limited to S410, S410 is introduced as follows.

S410: Cut, polish and polish the protective film 30 on the edge of the cover glass 210 to remove burrs on the edge of the cover glass 210.

Specifically, the protective film 30 formed on the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 has an irregular outline. In order to obtain a more regular protective film 30, it is necessary to The protective film 30 at the edge of 210 is trimmed to obtain a protective film 30 with a relatively regular shape, which helps to improve the appearance consistency of the electronic device 20.

The embodiments of the application are described in detail above, and specific examples are used in this article to illustrate the principles and implementation of the application. The descriptions of the above embodiments are only used to help understand the methods and core ideas of the application; at the same time, for Those of ordinary skill in the art, based on the ideas of the application, will have changes in the specific implementation and the scope of application. In summary, the content of this specification should not be construed as limiting the application.

Claims

An electronic device, characterized in that the electronic device comprises a cover glass, a middle frame and a protective film, the cover glass is carried on the middle frame, the protective film has elasticity, and the protective film partially covers The surface of the cover glass, and the protective film part is located in the gap between the cover glass and the middle frame.
The electronic device of claim 1, wherein the protective film and the middle frame and between the protective film and the cover glass are detachable connections, and the protective film is transparent Material.
The electronic device of claim 1 or 2, wherein the protective film comprises a first protective layer and a second protective layer connected by bending, and the first protective layer is attached to the surface of the cover glass , The second protective layer is located in the gap between the cover glass and the middle frame.
8. The electronic device of claim 3, wherein the thickness of the second protective layer is greater than the thickness of the first protective layer.
A method for preparing a protective film for electronic equipment, characterized in that, the method for preparing a protective film for electronic equipment includes:

Provide a jig, the jig has a receiving space and an inlet, the inlet communicating with the receiving space;

Provide an electronic device, fix the electronic device in the accommodating space, and there is a gap between the cover glass of the electronic device and the jig, the gap includes the cover glass and the electronic device The gap between the middle frame;

Fill the gate with a transparent liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid so as to be on the surface of the cover glass, the cover glass and the electronic device The gap between the middle frame forms a protective film;

The electronic device is taken out of the jig, and the protective film on the edge of the cover glass is trimmed.
The method for preparing a protective film for an electronic device according to claim 5, characterized in that "an electronic device is provided, the electronic device is fixed in the accommodating space, and the cover glass of the electronic device and the treatment There is a gap between the tools, the gap including the gap between the cover glass and the middle frame of the electronic device" includes:

Provide an electronic device, fix the electronic device in the accommodating space, and there is a gap between the cover glass of the electronic device and the jig, the gap includes the cover glass and the electronic device The gap between the middle frame, and the gate part faces the surface of the cover glass of the electronic device, and part faces the cover glass and the middle frame of the electronic device The gap between.
The method for preparing a protective film for electronic equipment according to claim 5, wherein the jig further comprises a discharge port, the discharge port communicates with the containing space, and the "filling the gate with transparent Liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid to form a protective film on the surface of the cover glass and between the cover glass and the middle frame of the electronic device" includes :

Fill the gate with a transparent liquid colloid. When a uniform colloid flows out from the outlet, the outlet is blocked, and the jig is kept under pressure for a preset period of time, so that the liquid colloid is evenly filled In the gap.
The method for preparing a protective film for electronic equipment according to claim 7, wherein the number of the inlet is multiple, the number of the outlet is also multiple, and the inlet and the outlet The outlets are respectively located on opposite sides of the electronic device.
8. The method for preparing a protective film for electronic equipment according to claim 7, wherein said "filling the gate with a transparent liquid colloid" comprises:

Fill the gate with colloid, and apply suction or pressure treatment to the colloid, so that the colloid flows and fills the surface of the cover glass and the center of the cover glass and the electronic device. The gap between the boxes.
9. The method for preparing a protective film for an electronic device according to claim 9, wherein said "filling the gate with a transparent liquid colloid" comprises:

Filling the first colloid into the gate;

Applying suction to the first colloid at the position of the discharge port;

Filling the second colloid into the gate;

A suction force is applied to the second colloid at the position of the discharge port, so that the second colloid flows out uniformly from the discharge port.
The method for preparing a protective film for electronic equipment according to claim 10, wherein the direction of the suction force is set along the axial direction of the discharge port, and the density of the first colloid is greater than that of the second colloid. density.
9. The method for preparing a protective film for an electronic device according to claim 9, wherein said "filling the gate with a transparent liquid colloid" comprises:

Filling the first colloid into the gate;

Pressurize the first colloid at the gate position;

Filling the second colloid into the gate;

The second colloid at the gate position is pressurized to make the second colloid uniformly flow out from the outlet.
The method for preparing a protective film for electronic equipment according to claim 12, wherein the direction of applying air pressure is set along the axial direction of the gate, and the density of the first colloid is greater than the density of the second colloid .
9. The method for preparing a protective film for an electronic device according to claim 9, wherein said "filling the gate with a transparent liquid colloid" comprises:

The gel is filled into the gate, and the flow rate of the gel is a first speed, so that the flow rate of the gel flowing out through the discharge port is a second speed, and the second speed is less than the first speed.
The method for preparing a protective film for electronic equipment according to claim 5, wherein the gate at least partly faces the gap between the cover glass and the middle frame, and the “into the Fill the gate with transparent liquid colloid, fill the gap with the liquid colloid, and solidify the liquid colloid so as to be on the surface of the cover glass and between the cover glass and the middle frame of the electronic device "The gap forms a protective film" including:

First, fill the gate with a transparent liquid colloid, so that the colloid fills the gap between the cover glass and the middle frame, and solidify the colloid to form a first filling layer;

Then fill the gate with a transparent liquid colloid, so that the colloid is filled on the surface of the cover glass, and the colloid is cured to form a second filling layer, the second filling layer and the first filling layer Together they constitute the protective film.
5. The method for preparing a protective film for electronic equipment according to claim 5, wherein the "filling the gate with a transparent liquid colloid, filling the gap with the liquid colloid, and curing the liquid colloid , Forming a protective film on the surface of the cover glass and the gap between the cover glass and the middle frame of the electronic device" includes:

First, fill the gate with a transparent liquid colloid at a first speed, so that the colloid fills the gap between the cover glass and the middle frame, and solidify the colloid to form a third filling layer;

Then fill the gate with a transparent liquid colloid at a second speed, so that the colloid is filled on the surface of the cover glass, and the colloid is cured to form a fourth filling layer, wherein the first speed is lower than the The second speed.
The method for preparing a protective film for an electronic device according to claim 16, wherein "filling the gate with a transparent liquid colloid at the first speed first" comprises:

First, fill the gate with a transparent liquid colloid at the first speed, and add buffer particles into the gate, so that the colloid fills the gap between the cover glass and the middle frame, and solidifies The colloid forms a third filling layer; and the flow of the buffer particles in the liquid colloid is used to fill the gap between the cover glass and the middle frame; wherein the buffer particles have elasticity.
The method for preparing a protective film for an electronic device according to claim 5, wherein the “into the gate is filled with a transparent liquid colloid, the gap is filled with the liquid colloid, and the liquid is solidified. Before forming a protective film on the surface of the cover glass and the gap between the cover glass and the middle frame of the electronic device, the method for preparing the protective film for the electronic device further includes:

An isolation layer is formed on the peripheral side of the middle frame, and the isolation layer is used to prevent the glue from adhering to the surface of the middle frame.
The method for preparing a protective film for an electronic device according to claim 5, wherein the "providing a jig, the jig having an accommodation space and an inlet, the inlet communicating with the accommodation space" includes :

A detachable upper cover plate and a lower cover plate are provided, the upper cover plate defines the gate, the lower cover plate has a receiving groove, and the upper cover plate covers the opening of the receiving groove;

The "providing electronic equipment, fixing the electronic equipment in the accommodating space, and having a gap between the cover glass of the electronic equipment and the jig" includes:

The electronic device is fixed in the receiving groove so that a gap is formed between the cover glass of the electronic device and the upper cover plate.
5. The method for preparing a protective film for an electronic device according to claim 5, wherein the "remove the electronic device from the jig, and trim the protective film on the edge of the cover glass Treatment" includes:

The protective film on the edge of the cover glass is cut, polished and polished to remove burrs on the edge of the cover glass.