CN112968983B - Electronic equipment and preparation method of electronic equipment protective film - Google Patents
Electronic equipment and preparation method of electronic equipment protective film Download PDFInfo
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- CN112968983B CN112968983B CN201911283528.3A CN201911283528A CN112968983B CN 112968983 B CN112968983 B CN 112968983B CN 201911283528 A CN201911283528 A CN 201911283528A CN 112968983 B CN112968983 B CN 112968983B
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- colloid
- protective film
- cover plate
- filling
- electronic equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
Abstract
The embodiment of the application provides electronic equipment and a preparation method of a protective film of the electronic equipment. The electronic equipment comprises cover plate glass, a middle frame and a protective film, wherein the cover plate glass is supported on the middle frame, the protective film is elastic, the protective film partially covers the surface of the cover plate glass, and the protective film partially is positioned in a gap between the cover plate glass and the middle frame. When electronic equipment falls at a small angle, the protective film can effectively form fall protection for the electronic equipment.
Description
Technical Field
The present disclosure relates to electronic products, and particularly to an electronic device and a method for manufacturing a protective film of the electronic device.
Background
At present, most mobile phone manufacturers can paste the protective film made of transparent materials on the surface of the display screen, when the mobile phone drops carelessly, the protective film on the surface of the display screen contacts with the ground firstly, a certain buffering effect is achieved, and the surface glass of the protective screen is not cracked. With the development of 2.5D screens and 3D display screens, generally, a protective film or a toughened film is stuck to the surface of the display screen in a touch area of the display screen, so that the display screen is easily damaged when the display screen falls at a small angle.
Disclosure of Invention
According to the electronic equipment and the preparation method of the electronic equipment protective film, the transparent protective film can be formed on the cover plate glass of the electronic equipment, and when the electronic equipment falls at a small angle, the electronic equipment can be effectively protected from falling.
In a first aspect, an embodiment of the present application provides an electronic device, the electronic device includes cover glass, center and protection film, cover glass bear in the center, the protection film has elasticity, the protection film part cover in cover glass's surface, just the protection film part is located cover glass with in the gap between the center.
In a second aspect, an embodiment of the present application provides a method for preparing a protective film for an electronic device, where the method for preparing the protective film for an electronic device includes:
providing a jig, wherein the jig is provided with an accommodating space and a gate, and the gate is communicated with the accommodating space;
providing electronic equipment, fixing the electronic equipment in the accommodating space, wherein a gap is formed between cover plate glass of the electronic equipment and the jig, and the gap comprises a gap between the cover plate glass and a middle frame of the electronic equipment;
filling transparent liquid colloid into the inlet gate, filling the gap with the liquid colloid, and solidifying the liquid colloid to form a protective film on the surface of the cover plate glass and a gap between the cover plate glass and a middle frame of the electronic equipment;
and taking the electronic equipment out of the jig, and performing edge cutting treatment on the protective film at the edge part of the cover plate glass.
The electronic equipment that this application embodiment provided will have elastic protection film cover in the gap between cover plate glass's surface and cover plate glass and the center, can play comparatively comprehensive protection to electronic equipment. When electronic equipment falls with the low-angle, can form better protective effect to cover plate glass, and then can form the protection of falling to electronic equipment.
According to the preparation method of the electronic equipment protective film, the protective film is formed on the surface of the cover plate glass and in the gap between the cover plate glass and the middle frame, so that the electronic equipment can be comprehensively protected. When electronic equipment falls with the low-angle, can form better protective effect to cover plate glass, and then can form the protection of falling to electronic equipment.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart corresponding to a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a jig for manufacturing a protective film of an electronic device according to an embodiment of the present disclosure.
Fig. 3 is an exploded schematic view of a jig for manufacturing a protective film of an electronic device according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of an AA cross-sectional view of the electronic device provided in fig. 4.
Fig. 6 is a schematic structural view of a partially enlarged view of the region P in fig. 5.
Fig. 7 is a schematic flow chart corresponding to another method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 8 is another schematic structural diagram of a manufacturing fixture for a protective film of an electronic device according to an embodiment of the present application.
Fig. 9 is a schematic structural diagram of a fixture for manufacturing a protective film of an electronic device according to an embodiment of the present application.
Fig. 10 is a schematic flow chart illustrating a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 11 is a schematic flow chart illustrating a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 12 is a schematic diagram of preparing a first colloid on the surface of a cover glass of an electronic device by using a jig.
Fig. 13 is a schematic diagram of preparing a second colloid on the surface of a cover glass of an electronic device by using a jig.
Fig. 14 is a schematic flow chart illustrating a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 15 is a schematic flow chart illustrating a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 16 is a schematic flow chart illustrating a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 17 is a schematic view of a jig used to prepare a first filling layer into a gap between a cover glass and a middle frame.
Fig. 18 is a schematic view of preparing a second filling layer on the surface of the cover glass by using a jig.
Fig. 19 is a schematic flow chart illustrating a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 20 is a schematic view of a jig used for preparing a third filling layer into a gap between the cover glass and the middle frame.
Fig. 21 is a schematic view of preparing a fourth filling layer on the surface of the cover glass by using a jig.
Fig. 22 is a schematic structural view of mixing buffer particles into a colloid according to an embodiment of the present disclosure.
Fig. 23 is a schematic flow chart illustrating a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 24 is a schematic structural diagram corresponding to step S250 in fig. 23.
Fig. 25 is a schematic flow chart illustrating a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Fig. 26 is a schematic structural diagram corresponding to step S110 in fig. 25.
Fig. 27 is a schematic flow chart illustrating a method for manufacturing a protective film for an electronic device according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive effort based on the embodiments in the present application are within the scope of protection of the present application. The following embodiments are not independent, and the embodiments can be combined in any way, and the technical features can be combined to form a new technical scheme.
Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, and fig. 6, a method for manufacturing a protective film of an electronic device according to an embodiment of the present disclosure includes, but is not limited to, S100, S200, S300, and S400, and the following description is provided with respect to S100, S200, S300, and S400.
S100: providing a jig 10, wherein the jig 10 is provided with a containing space 10a and a gate 10b, and the gate 10b is communicated with the containing space 10 a.
The jig 10 is used for preparing a protective film 30 on the electronic device 20. The accommodating space 10a of the jig 10 is used for accommodating the electronic device 20, the size of the accommodating space 10a is consistent with that of the electronic device 20, when the electronic device 20 is accommodated in the accommodating space 10a, a fixing effect can be formed on the electronic device 20, the inlet 10b partially faces the surface of the cover glass 210 of the electronic device 20, and partially faces the gap S between the cover glass 210 and the middle frame 220 of the electronic device 20. The inlet gate 10b is used for filling transparent liquid colloid, the inlet gate 10b is communicated with the accommodating space 10a, when the inlet gate 10b is filled with the liquid colloid, the colloid can flow into the accommodating space 10a and further covers the surface of the cover plate glass 210 of the electronic equipment 20 and a gap S between the cover plate glass 210 and the middle frame 220, the protective film 30 can be obtained after the colloid is solidified, the protective film 30 is soft at normal temperature, the buffer property is strong, and the possibility that the electronic equipment 20 is broken when falling on a large surface can be better reduced.
The electronic device 20 may be any device having a display function. For example: the mobile terminal comprises intelligent equipment with a display function, such as a tablet Computer, a mobile phone, an electronic reader, a remote controller, a Personal Computer (PC), a notebook Computer, vehicle-mounted equipment, a network television, wearable equipment and the like.
Specifically, the electronic device 20 provided by the embodiment of the present application includes a cover glass 210, a middle frame 220 and a protection film 30, the cover glass 210 is supported by the middle frame 220, the protection film 30 has elasticity, the protection film 30 partially covers the surface of the cover glass 210, and the protection film 30 partially is located in the gap S between the cover glass 210 and the middle frame 220. The elastic protection film 30 covers the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220, so as to protect the electronic device 20 more completely. When the electronic device 20 falls at a small angle, a better protection effect can be formed on the cover glass 210, and then fall protection can be formed on the electronic device 20.
The protective film 30 and the middle frame 220 and the protective film 30 and the cover glass 210 are detachably connected, and the protective film 30 is made of a transparent material. When the protective film 30 is damaged, it can be directly detached from the cover glass 210 for replacement. The protective film 30 has elasticity and can provide better protection for the electronic device 20, and the protective film 30 is formed by preparing transparent colloid, and the following description is provided for the preparation process of the protective film 30.
The protective film 30 includes a first protective layer 301 and a second protective layer 302 which are connected in a bending manner, the first protective layer 301 is attached to the surface of the cover glass 210, and the second protective layer 302 is located in a gap S between the cover glass 210 and the middle frame 220. The first protective layer 301 and the second protective layer 302 may be formed together in the same process, that is, the first protective layer 301 and the second protective layer 302 are integrated. The first protective layer 301 and the second protective layer 302 may be formed separately in different processing steps, and in this case, the first protective layer 301 and the second protective layer 302 may have different structures. In one embodiment, the thickness of the second protective layer 302 is greater than the thickness of the first protective layer 301. Since the second protection layer 302 is located in the gap S between the cover glass 210 and the middle frame 220, that is, the second protection layer 302 is used to protect the corner portions of the electronic device 20, when the thickness of the second protection layer 302 is greater than that of the first protection layer 301, it is helpful to protect the electronic device 20 from falling at a small angle.
The middle frame 220 may be regarded as a frame of the electronic device 20, the middle frame 220 is used for carrying display components of the electronic device 20, and the middle frame 220 is usually made of metal.
S200: providing an electronic device 20, fixing the electronic device 20 in the accommodating space 10a, wherein a gap is formed between the cover glass 210 of the electronic device 20 and the jig 10, and the gap includes a gap S between the cover glass 210 and the middle frame 220 of the electronic device 20.
The electronic device 20 may be accommodated in the accommodating space 10a in a clamping manner, that is, the accommodating space 10a of the fixture 10 may limit the electronic device 20, and when the electronic device 20 is accommodated in the accommodating space 10a, a gap exists between the cover glass 210 of the electronic device 20 and the fixture 10 for filling the liquid colloid.
S300: filling transparent liquid colloid into the inlet gate 10b, filling the gap with the liquid colloid, and curing the liquid colloid to form a protective film 30 on the surface of the cover glass 210 and the gap S between the cover glass 210 and the center frame 220 of the electronic device 20.
Specifically, transparent liquid colloid is uniformly injected into the gate 10b, so that the liquid colloid fills the gap between the cover glass 210 and the middle frame 220, and the liquid colloid covers the surface of the cover glass 210, and after the liquid colloid is solidified, a layer of protective film 30 can be formed in the gap between the cover glass 210 and the middle frame 220 and the surface of the cover glass 210. Because the protective film 30 covers the gap between the cover glass 210 and the middle frame 220 and the surface of the cover glass 210, when the electronic device 20 falls at a small angle, the protective film 30 in the gap S between the cover glass 210 and the middle frame 220 can protect the electronic device 20, and damage to the electronic device 20 when the electronic device 20 falls at a small angle is avoided. When the glue is filled, a sealing space (the space thickness is 0.14mm, that is, the glue thickness) is formed between the cover glass 210 and the edges of the display screen 230 and the middle frame 220, and the glue flows into the middle of the display screen 230 and the cover plate from the gate 10 b.
S400: and taking the electronic equipment 20 out of the jig 10, and trimming the protective film 30 at the edge part of the cover glass 210.
Specifically, before the electronic device 20 is taken out of the accommodating space 10a of the fixture 10, the electronic device 20 needs to be subjected to pressure maintaining processing, and needs to be in a preset time duration in a proper temperature and proper pressure environment, after the surface of the cover glass 210 of the electronic device 20 and the colloid in the gap S between the cover glass 210 and the middle frame 220 are solidified, the electronic device 20 is taken out of the accommodating space 10a of the fixture 10, and meanwhile, the edge cutting processing is performed on the protective film 30 at the edge portion of the cover glass 210, so that the protective film 30 is ensured to be filled in the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220.
According to the preparation method of the protective film 30 of the electronic device 20 provided by the embodiment of the application, the protective film 30 is formed on the surface of the cover glass 210 and in the gap S between the cover glass 210 and the middle frame 220, so that the electronic device 20 can be protected comprehensively. When the electronic device 20 falls at a small angle, a better protection effect can be formed on the cover glass 210, and then fall protection can be formed on the electronic device 20. In addition, the protective film 30 formed in the embodiment can form various curved surface shapes, and can be flexibly applied to the 2.5D or 3D cover glass 210, and compared with the conventional planar protective film 30, the protective film 30 prepared by the preparation method provided by the embodiment of the application has a more complex application scene, and can form better drop protection for the electronic device 20.
Referring to fig. 7 and 8, in the present embodiment, the jig 10 further includes an outlet 10c, the outlet 10c communicates with the accommodating space 10a, and the "S300: filling the gate 10b with a transparent liquid colloid, filling the gap with the liquid colloid, and curing the liquid colloid to form a protective film 30 ″ on the surface of the cover glass 210 and between the cover glass 210 and the middle frame 220 of the electronic device 20, including but not limited to S310, as described below with respect to S310.
S310: and filling transparent liquid colloid into the gate 10b, blocking the discharge port 10c when the uniform colloid flows out from the discharge port 10c, and maintaining the pressure of the jig 10 for a preset time so as to uniformly fill the gap with the liquid colloid.
It is specific, judge whether there is even colloid to flow through the volume of the liquid colloid that detects the interior outflow of unit interval from discharge port 10c, when discharge port 10c has even colloid to flow, can consider the packing of colloid comparatively even, at this moment, plug up discharge port 10c, then carry out the filler that lasts to advancing runner 10b, when treating that it has the colloid to overflow to advance runner 10b, carry out the pressurize to tool 10, so that the even surface that covers cover plate glass 210 of liquid colloid, and make the even gap S that fills between cover plate glass 210 and center 220 of liquid colloid.
With reference to fig. 9, in a further embodiment, the number of the inlet gates 10b is multiple, the number of the outlet gates 10c is multiple, the inlet gates 10b and the outlet gates 10c are respectively located on two opposite sides of the electronic device 20, the inlet gates 10b are spaced at the top and the edge of the electronic device 20, and the outlet gates 10c are spaced at the bottom of the electronic device 20. The number of the in-gates 10b may be 5, and the number of the discharge ports 10c may be 3, and the protective film 30 may be formed in the gap S between the cover glass 210 and the middle frame 220 and on the surface of the cover glass 210 by the cooperation of the in-gates 10b and the discharge ports 10 c.
With continued reference to fig. 10, the "S310: the step of filling the inlet 10b with a transparent liquid colloid "includes, but is not limited to, S311, and the following description is provided with respect to S311.
S311: and filling colloid into the inlet gate 10b, and applying suction or pressurization to the colloid so that the colloid flows and fills the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 of the electronic device 20.
Continuing to refer to fig. 11, in one embodiment, the "S310: the filling of the gate 10b with the transparent liquid colloid "includes, but is not limited to, S315, S316, S317, and S318, and is described below with reference to S315, S316, S317, and S318.
S315: the first colloid 410 is filled into the gate 10 b. Please refer to fig. 12.
S316: suction is applied to the first gel 410 at the position of the discharge port 10 c.
S317: and filling a second colloid 420 into the gate 10 b. Please refer to fig. 13.
S318: suction is applied to the second colloid 420 at the position of the discharge port 10c so that the second colloid 420 flows out from the discharge port 10c uniformly.
The first colloid 410 and the second colloid 420 are both liquid colloids. Specifically, the process of filling the colloid into the inlet gate 10b and the process of applying a suction effect to the colloid at the position of the outlet 10c are performed alternately, the first colloid 410 is filled into the inlet gate 10b, then the suction effect is applied to the first colloid 410 at the position of the outlet 10c to promote the flow of the first colloid 410, then the second colloid 420 is filled into the inlet gate 10b, and then the suction effect is applied to the second colloid 420 at the position of the outlet 10c to promote the flow of the second colloid 420, so that the second colloid 420 is in full contact with the first colloid 410, and air bubbles in the second colloid 420 can be discharged.
Further, when the first colloid 410 is filled in the inlet 10b, a suction force is first applied to the first colloid 410 in the outlet 10c with a third force, so that the first colloid 410 flows and is filled on the surface of the cover glass 210, and the first colloid 410 flows and is filled in the gap S between the cover glass 210 and the middle frame 220. Then, the second colloid 420 is filled in the gate 10b, so that the colloid flows out uniformly from the outlet 10c, and then a fourth force is applied to the second colloid 420 in the outlet 10c, so that the second colloid 420 flows and completely contacts the first colloid 410, and the colloid can be promoted to flow by applying the suction force, wherein the fourth force is greater than the third force. Since the accommodating space 10a of the jig 10 is filled with air when the first glue 410 is filled, the process is mainly to exhaust the air remaining in the accommodating space 10a, and therefore, a smaller force is required to exert a suction force to uniformly exhaust the air in the accommodating space 10 a. When filling second colloid 420, accommodating space 10a of tool 10 is filled with first colloid 410, this process needs to make second colloid 420 contact in first colloid 410 completely, and impel first colloid 410 and second colloid 420 to flow in step in order to fill in the gap S between cover plate glass 210 and center 220, and cover in cover plate glass 210' S surface, for this reason, need adopt great dynamics to exert suction effect and be used for first colloid 410 and the synchronous flow of second colloid 420 of being convenient for, and can make first colloid 410 and the comparatively closely knit packing of second colloid 420 in accommodating space 10a, can strengthen the compactness of protection film 30, and then promote the barrier propterty of protection film 30.
The direction of the suction action applied to the colloid in the discharge port 10c can be along the axial direction of the discharge port 10c, so that the colloid flow can be better promoted, the colloid can be better covered on the surface of the cover glass 210, and the gap S between the cover glass 210 and the middle frame 220 is filled in a flowing manner, so that a compact protective film 30 is formed, and the protective performance is improved.
Further, the first colloid 410 and the second colloid 420 may be the same or different. In a specific embodiment, the density of the first colloid 410 is greater than the density of the second colloid 420. That is, the first glue 410 with a relatively high density is filled into the gate 10b, so that a part of the first glue 410 remains in the accommodating space 10a of the fixture 10, and a primary covering effect is formed on the surface of the cover glass 210. Then, the second colloid 420 with a smaller density is filled in the inlet 10b, so that the second colloid 420 is filled in the gap S between the cover glass 210 and the middle frame 220 in a flowing manner, the second colloid 420 is filled in the small space formed by the first colloid 410 in a flowing manner, and the colloids with different densities are filled in different parts of the electronic device 20, so that the colloid is filled more completely, the compactness of the protective film 30 is improved, and the protective performance of the protective film 30 is further improved.
Referring still to fig. 14, in another embodiment, the "S310: the filling of the inlet gate 10b with the transparent liquid colloid "includes, but is not limited to, S3101, S3102, S3103 and S3104, which are described below with reference to S3101, S3102, S3103 and S3104.
S3101: the first colloid 410 is filled into the gate 10 b. Please refer to fig. 12 again.
S3102: and pressurizing the first colloid 410 at the position of the inlet gate 10 b.
S3103: and filling a second colloid 420 into the gate 10 b. Please refer to fig. 13 again.
S3104: and pressurizing the second colloid 420 at the position of the gate 10b, so that the second colloid 420 uniformly flows out from the outlet 10 c.
The first colloid 410 and the second colloid 420 are both liquid colloids. Specifically, the process of filling the colloid into the gate 10b and the process of pressurizing the gate 10b are performed alternately, the first colloid 410 is filled into the gate 10b, then the first air pressure is applied to the first colloid 410 at the position of the gate 10b to promote the flow of the first colloid 410 and facilitate the discharge of air bubbles in the first colloid 410, then the second colloid 420 is filled into the gate 10b, and then the second air pressure is applied to the second colloid 420 at the position of the gate 10b to promote the flow of the second colloid 420, so that the second colloid 420 is in full contact with the first colloid 410 and air bubbles in the second colloid 420 can be discharged.
Further, when the gate 10b is filled with the first colloid 410, the first pressure is applied to the first colloid 410 in the gate 10b to promote the first colloid 410 to flow and fill on the surface of the cover glass 210, and the first colloid 410 flows and fills in the gap S between the cover glass 210 and the middle frame 220, so that the first colloid 410 is more compact. Then, the second colloid 420 is filled in the gate 10b, so that the uniform colloid flows out from the outlet 10c, and then, a second pressure is applied to the second colloid 420 in the gate 10b, so that the second colloid 420 flows and completely contacts with the first colloid 410, the colloid flows by being promoted by the applied pressure, the colloid is more compact, and air bubbles in the colloid can be discharged, wherein the second pressure is greater than the first pressure. Since the accommodating space 10a of the jig 10 is filled with air when the first glue 410 is filled, the process is mainly to exhaust the air remained in the accommodating space 10a, and therefore, a smaller pressure is required to uniformly exhaust the air in the accommodating space 10 a. When the second colloid 420 is filled, the accommodating space 10a of the jig 10 is filled with the first colloid 410, the second colloid 420 needs to be in full contact with the first colloid 410 in the process, the first colloid 410 and the second colloid 420 are enabled to flow synchronously to fill the gap S between the cover plate glass 210 and the middle frame 220, and the surface of the cover plate glass 210 is covered with the first colloid 410 and the second colloid 420, therefore, a larger pressure intensity is needed to be adopted so that the first colloid 410 and the second colloid 420 flow synchronously, the first colloid 410 and the second colloid 420 can be filled in the accommodating space 10a more compactly, the compactness of the protective film 30 can be enhanced, and the protective performance of the protective film 30 is further improved.
The direction of applying air pressure to the colloid in the inlet gate 10b can be along the axial direction of the inlet gate 10b, so that the colloid flow can be better promoted, the colloid can be better covered on the surface of the cover plate glass 210, and the gap S between the cover plate glass 210 and the middle frame 220 is filled in a flowing manner, so that a compact protective film 30 is formed, and the protective performance is improved.
Further, the first colloid 410 and the second colloid 420 may be the same or different. In a specific embodiment, the density of the first colloid 410 is greater than the density of the second colloid 420. That is, the first glue 410 with a relatively high density is filled into the gate 10b, so that a part of the first glue 410 remains in the accommodating space 10a of the fixture 10, and a primary covering effect is formed on the surface of the cover glass 210. Then, the second colloid 420 with a smaller density is filled in the inlet 10b, so that the second colloid 420 is filled in the gap S between the cover glass 210 and the middle frame 220 in a flowing manner, the second colloid 420 is filled in the small space formed by the first colloid 410 in a flowing manner, and the colloids with different densities are filled in different parts of the electronic device 20, so that the colloid is filled more completely, the compactness of the protective film 30 is improved, and the protective performance of the protective film 30 is further improved.
Referring to fig. 15, in another embodiment, the "S310: the step of filling the inlet 10b with a transparent liquid colloid "includes, but is not limited to, S312, and the following description is provided with respect to S312.
S312: and filling the glue into the inlet gate 10b, wherein the flow rate of the glue is a first speed, so that the flow rate of the glue flowing out from the outlet 10c is a second speed, and the second speed is less than the first speed.
Specifically, in the present embodiment, the inlet gate 10b is continuously filled with the colloid, and when the flow rate of the colloid flowing into the inlet gate 10b is the first speed, the speed of the colloid flowing out of the outlet 10c is the second speed, and the second speed is lower than the first speed, a part of the colloid may remain in the jig 10 and cover the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220.
Referring to fig. 16, in the present embodiment, the gate 10b at least partially faces the gap S between the cover glass 210 and the middle frame 220, and the "S300: filling the inlet gate 10b with a transparent liquid colloid, filling the gap with the liquid colloid, and curing the liquid colloid to form a protective film 30 ″ on the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 of the electronic device 20, including but not limited to S301 and S302, as described below with respect to S301 and S302.
S301: filling transparent liquid colloid into the gate 10b, so that the colloid is filled in the gap S between the cover glass 210 and the middle frame 220, and curing the colloid to form a first filling layer 401. Please continue to refer to fig. 17.
S302: then, the inlet gate 10b is filled with a transparent liquid colloid, so that the colloid is filled on the surface of the cover glass 210, and the colloid is cured to form a second filling layer 402, where the second filling layer 402 and the first filling layer 401 together form the protection film 30. Please continue to refer to fig. 18.
Specifically, a first filling layer 401 is formed by filling a colloid in a gap S between the cover glass 210 and the middle frame 220, and then a second filling layer 402 is formed by filling a colloid on the surface of the cover glass 210, wherein the hardness of the first filling layer 401 is less than that of the second filling layer 402, that is, the hardness of the first filling layer 401 in the gap S between the cover glass 210 and the middle frame 220 is less, the hardness of the second filling layer 402 on the surface of the cover glass 210 is greater, the second filling layer 402 is used for protecting a large area of the cover glass 210, the first filling layer 401 is made of a soft material, and the gap S between the cover glass 210 and the middle frame 220 has a buffering effect.
Referring to fig. 19, in the present embodiment, the "S300: filling the gate 10b with a transparent liquid colloid, filling the gap with the liquid colloid, and curing the liquid colloid to form a protective film 30 ″ on the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 of the electronic device 20, including but not limited to S303 and S304, as described below with respect to S303 and S304.
S303: filling transparent liquid colloid into the gate 10b at a first speed so that the colloid fills the gap S between the cover glass 210 and the middle frame 220, and curing the colloid to form a third filling layer 403. Please continue to refer to fig. 20.
S304: then, filling transparent liquid colloid into the gate 10b at a second speed, so that the colloid is filled on the surface of the cover glass 210, and curing the colloid to form a fourth filling layer 404, wherein the first speed is lower than the second speed. Please continue to refer to fig. 21.
Specifically, a third filling layer 403 is formed in the gap S between the cover glass 210 and the middle frame 220, the gate 10b is filled with a transparent liquid colloid at a first speed, a fourth filling layer 404 is formed on the surface of the cover glass 210, and the gate 10b is filled with the transparent liquid colloid at a second speed, where the first speed is lower than the second speed, that is, the gap S between the cover glass 210 and the middle frame 220 is filled with the colloid at a lower speed to form the third filling layer 403, and the surface of the cover glass 210 is filled with the colloid at a higher speed to form the fourth filling layer 404, because the gap S between the cover glass 210 and the middle frame 220 is narrow, only the slow filling colloid can better discharge bubbles in the gap S, so that the third filling layer 403 can be more dense. The cover glass 210 has a larger surface space, and can be filled with the adhesive at a higher speed to form the fourth filling layer 404, which can improve the efficiency of forming the protective film 30.
With reference to fig. 22, further, in the process of filling the transparent liquid colloid into the inlet 10b at the first speed, the buffering particles 50 may be added into the inlet 10b, and the buffering particles 50 act in the gap S between the cover glass 210 and the middle frame 220 in the flowing of the colloid, the buffering particles 50 have elasticity, the buffering particles 50 are transparent soft particles, which may be spherical, and when the buffering particles 50 are mixed in the colloid and filled in the gap S between the cover glass 210 and the middle frame 220, on one hand, the buffering characteristic of the protection film 30 may be increased, and on the other hand, the material of the third filling layer 403 may be more dense, which may achieve the waterproof and dustproof effects on the electronic device 20.
Referring to fig. 23, in the present embodiment, in the step "S300: the method for preparing the protective film 30 of the electronic device 20 further includes, but is not limited to, S250 before the transparent liquid colloid is filled into the inlet 10b, the gap is filled with the liquid colloid, and the liquid colloid is solidified to form the protective film 30 ″ on the surface of the cover glass 210 and the gap S between the cover glass 210 and the middle frame 220 of the electronic device 20, and the method for preparing the protective film 30 of the electronic device 20 further includes, but is not limited to, S250, which is described below with respect to S250.
S250: an isolation layer 300 is formed on the peripheral side of the middle frame 220, and the isolation layer 300 is used for preventing the adhesive from being attached to the surface of the middle frame 220. Please continue to refer to fig. 24.
Specifically, before the electronic device 20 is placed in the accommodating space 10a of the fixture 10, the isolation layer 300 is formed on the peripheral side of the middle frame 220, and the isolation layer 300 covers a part of the surface of the middle frame 220. The electronic device 20 is placed in the accommodating space 10a of the fixture 10, and when the mold compound is filled into the gate 10b of the fixture 10, the isolation layer 300 can protect the surface of the middle frame 220, so as to prevent the mold compound from adhering to the surface of the middle frame 220, and the appearance consistency of the middle frame 220 is damaged. The isolation layer 300 may be a protective film attached to a portion of the surface of the middle frame 220. The isolation layer 300 may also be an isolation plating layer formed on a portion of the surface of the middle frame 220 to prevent the glue from adhering to the surface of the middle frame 220, and finally, the isolation plating layer is removed.
Referring to fig. 25, in the present embodiment, the "S100: providing a jig 10, wherein the jig 10 has a receiving space 10a and an in-gate 10b, the in-gate 10b communicates with the receiving space 10a ″ including but not limited to S110, and the following description is provided with respect to S110.
S110: an upper cover plate 101 and a lower cover plate 102 which are detachably connected are provided, the upper cover plate 101 is provided with the inlet gate 10b, the lower cover plate 102 is provided with a containing groove 102a, and the upper cover plate 101 covers the opening of the containing groove 102 a. Please continue to refer to fig. 26.
The jig 10 is formed by covering an upper cover plate 101 and a lower cover plate 102, an inlet gate 10b is opened on the upper cover plate 101, and a receiving groove 102a is formed on the lower cover plate 102. The upper cover plate 101 and the lower cover plate 102 are covered to form a receiving space 10a on the lower cover plate 102, and the upper cover plate 101 and the lower cover plate 102 may be metal molds, which cooperate to form the protective film 30 on the surface of the cover glass 210 and in the gap S between the cover glass 210 and the middle frame 220.
The step of "S200: providing an electronic device 20, fixing the electronic device 20 in the accommodating space 10a, and having a gap between the cover glass 210 of the electronic device 20 and the jig 10 "includes but is not limited to S210, which is described below with respect to S210.
S210: the electronic device 20 is fixed in the receiving groove 102a, and a gap is formed between the cover glass 210 of the electronic device 20 and the upper cover 101.
The electronic device 20 is placed in the accommodating groove 102a, the accommodating groove 102a can limit the electronic device 20, when the upper cover plate 101 covers the lower cover plate 102, a gap is formed between the cover glass 210 of the electronic device 20 and the upper cover plate 101, the gap is used for filling glue, the size of the gap space is closely related to the size of the volume of the formed protective film 30, and the thickness of the protective film 30 can be controlled by controlling the size of the gap.
Referring to fig. 27, in the present embodiment, the "S400: the step of taking the electronic device 20 out of the jig 10 and trimming the protective film 30 at the edge of the cover glass 210 includes, but is not limited to, step S410, which is described below with respect to step S410.
S410: cutting, grinding and polishing the protective film 30 at the edge of the cover glass 210 to remove the burrs at the edge of the cover glass 210.
Specifically, the protective film 30 formed on the surface of the cover glass 210 and in the gap S between the cover glass 210 and the middle frame 220 has an irregular contour, and in order to obtain a more regular protective film 30, it is necessary to perform a trimming process on the protective film 30 at the edge portion of the cover glass 210 to obtain a more regular-shaped protective film 30, which is helpful to improve the appearance uniformity of the electronic device 20.
The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (12)
1. The utility model provides an electronic equipment, its characterized in that, electronic equipment includes cover glass, center and protection film, cover glass bear in the center, the protection film has elasticity, the protection film includes first protective layer and the second protective layer that the bending links to each other, the laminating of first protective layer cover glass's surface, the second protective layer is located cover glass with in the gap between the center, the hardness of first protective layer is greater than the hardness of second protective layer.
2. The electronic device of claim 1, wherein the protective film and the middle frame and the protective film and the cover glass are detachably connected, and the protective film is made of a transparent material.
3. A preparation method of an electronic equipment protective film is characterized in that the electronic equipment comprises cover plate glass and a middle frame, the cover plate glass is borne on the middle frame, and the preparation method of the electronic equipment protective film comprises the following steps:
providing a jig, wherein the jig is provided with an accommodating space and a gate, the gate is communicated with the accommodating space, and at least part of the gate is opposite to a gap between the cover plate glass and the middle frame;
providing electronic equipment, fixing the electronic equipment in the accommodating space, wherein a gap is formed between cover plate glass of the electronic equipment and the jig, and the gap comprises a gap between the cover plate glass and a middle frame of the electronic equipment;
filling transparent liquid colloid into the inlet gate, filling the gap with the liquid colloid, and solidifying the liquid colloid to form a protective film on the surface of the cover plate glass and a gap between the cover plate glass and a middle frame of the electronic equipment;
taking the electronic equipment out of the jig, and performing edge cutting treatment on the protective film at the edge part of the cover plate glass;
wherein, the step of filling transparent liquid colloid into the sprue, filling the gap with the liquid colloid, and curing the liquid colloid to form a protective film on the surface of the cover glass and in a gap between the cover glass and the center frame of the electronic device includes:
filling transparent liquid colloid into the sprue so that the colloid is filled in a gap between the cover plate glass and the middle frame, and curing the colloid to form a first filling layer;
and filling transparent liquid colloid into the inlet gate so that the colloid is filled on the surface of the cover plate glass, and curing the colloid to form a second filling layer, wherein the second filling layer and the first filling layer jointly form the protective film.
4. The method for preparing a protective film of an electronic device according to claim 3, wherein the jig further comprises a discharge port, the discharge port is communicated with the accommodating space, and the step of filling the transparent liquid colloid into the inlet gate, filling the gap with the liquid colloid, and curing the liquid colloid to form the protective film on the surface of the cover glass and between the cover glass and the center frame of the electronic device comprises the steps of:
and filling transparent liquid colloid into the sprue, blocking the discharge port when the uniform colloid flows out of the discharge port, and maintaining the pressure of the jig for a preset time so that the liquid colloid is uniformly filled in the gap.
5. The method for preparing a protective film for electronic equipment according to claim 4, wherein the step of filling the transparent liquid colloid into the inlet gate comprises:
and filling colloid into the inlet gate, and applying suction or pressurization treatment to the colloid so that the colloid flows and is filled on the surface of the cover plate glass and the gap between the cover plate glass and the middle frame of the electronic equipment.
6. The method for preparing a protective film for electronic equipment according to claim 5, wherein the step of filling the transparent liquid colloid into the inlet gate comprises:
filling a first colloid into the sprue;
applying suction to the first colloid at the discharge port;
filling a second colloid into the sprue;
and applying suction to the second colloid at the position of the discharge port so as to enable the second colloid to uniformly flow out of the discharge port.
7. The method for preparing a protective film for electronic equipment according to claim 5, wherein the step of filling the transparent liquid colloid into the inlet gate comprises:
filling a first colloid into the sprue;
pressurizing the first colloid at the position of the gate;
filling a second colloid into the sprue;
and pressurizing the second colloid at the position of the gate inlet so that the second colloid uniformly flows out from the discharge port.
8. The method for preparing a protective film for electronic equipment according to claim 5, wherein the step of filling the transparent liquid colloid into the inlet gate comprises:
and filling colloid into the inlet gate, wherein the flow rate of the colloid is a first speed, so that the flow rate of the colloid flowing out from the outlet is a second speed, and the second speed is less than the first speed.
9. The method for manufacturing a protective film for an electronic device according to claim 3, wherein before the step of filling the gap with a transparent liquid colloid and curing the liquid colloid to form the protective film on the surface of the cover glass and the gap between the cover glass and the center frame of the electronic device, the method further comprises:
and forming an isolation layer on the peripheral side of the middle frame, wherein the isolation layer is used for preventing the colloid from being attached to the surface of the middle frame.
10. The method for preparing a protective film of an electronic device according to claim 3, wherein said providing a jig having an accommodating space and an in-gate communicating with the accommodating space comprises:
providing an upper cover plate and a lower cover plate which are detachably connected, wherein the upper cover plate is provided with the sprue, the lower cover plate is provided with an accommodating groove, and the upper cover plate covers the opening of the accommodating groove;
the "providing the electronic equipment, will the electronic equipment is fixed in the accommodating space, and there is the clearance between electronic equipment's cover plate glass and the tool" includes:
and fixing the electronic equipment in the accommodating groove, and forming a gap between the cover plate glass of the electronic equipment and the upper cover plate.
11. The method for preparing the protective film of the electronic device according to claim 3, wherein the step of taking the electronic device out of the jig and performing the trimming process on the protective film at the edge of the cover glass comprises the steps of:
and cutting, grinding and polishing the protective film at the edge part of the cover plate glass to remove burrs at the edge part of the cover plate glass.
12. A preparation method of an electronic equipment protective film is characterized in that the electronic equipment comprises cover plate glass and a middle frame, the cover plate glass is borne on the middle frame, and the preparation method of the electronic equipment protective film comprises the following steps:
providing a jig, wherein the jig is provided with an accommodating space and a gate, the gate is communicated with the accommodating space, and at least part of the gate is opposite to a gap between the cover plate glass and the middle frame;
providing electronic equipment, fixing the electronic equipment in the accommodating space, wherein a gap is formed between cover plate glass of the electronic equipment and the jig, and the gap comprises a gap between the cover plate glass and a middle frame of the electronic equipment;
filling transparent liquid colloid into the inlet gate, filling the gap with the liquid colloid, and solidifying the liquid colloid to form a protective film on the surface of the cover plate glass and a gap between the cover plate glass and a middle frame of the electronic equipment;
taking the electronic equipment out of the jig, and performing edge cutting treatment on the protective film at the edge part of the cover plate glass;
wherein, the step of filling transparent liquid colloid into the sprue, filling the gap with the liquid colloid, and curing the liquid colloid to form a protective film on the surface of the cover glass and in a gap between the cover glass and the center frame of the electronic device includes:
filling transparent liquid colloid into the sprue at a first speed so that the colloid is filled in a gap between the cover plate glass and the middle frame, and curing the colloid to form a third filling layer;
and filling transparent liquid colloid into the inlet gate at a second speed so that the colloid is filled on the surface of the cover plate glass, and solidifying the colloid to form a fourth filling layer, wherein the first speed is lower than the second speed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911283528.3A CN112968983B (en) | 2019-12-13 | 2019-12-13 | Electronic equipment and preparation method of electronic equipment protective film |
| PCT/CN2020/132860 WO2021115152A1 (en) | 2019-12-13 | 2020-11-30 | Electronic device and preparation method for electronic device protective film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911283528.3A CN112968983B (en) | 2019-12-13 | 2019-12-13 | Electronic equipment and preparation method of electronic equipment protective film |
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| CN112968983A CN112968983A (en) | 2021-06-15 |
| CN112968983B true CN112968983B (en) | 2022-03-01 |
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| CN201911283528.3A Active CN112968983B (en) | 2019-12-13 | 2019-12-13 | Electronic equipment and preparation method of electronic equipment protective film |
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| RU2017103517A (en) * | 2014-07-31 | 2018-08-02 | Юйлун Компьютер Телекоммьюникейшн Сайнтифик (Шэньчжэнь) Ко., Лтд. | DISPLAY DEVICE AND TERMINAL |
| KR101634169B1 (en) * | 2015-08-28 | 2016-06-28 | 주식회사 테슬라앤코 | Method for attaching protective film on liquid crystal screen |
| CN105227705B (en) * | 2015-08-31 | 2018-03-02 | 广东欧珀移动通信有限公司 | Housing unit moulding process |
| KR101623905B1 (en) * | 2016-01-21 | 2016-05-24 | 주식회사 크레용인터네셔널 | Device of attaching protective film and method for attaching protective film using the same |
| CN205974271U (en) * | 2016-06-01 | 2017-02-22 | 维沃移动通信有限公司 | Glass cover plate's protection architecture and mobile terminal |
| CN106807602A (en) * | 2016-12-08 | 2017-06-09 | 广东东方亮彩精密技术有限公司 | A kind of housing protective layer and its processing method |
| CN108667958B (en) * | 2017-03-27 | 2020-05-26 | 蓝思科技股份有限公司 | Preparation method of transparent adhesive layer in frame hole area of mobile phone panel |
| CN107283727A (en) * | 2017-07-28 | 2017-10-24 | 广东欧珀移动通信有限公司 | Cover plate assembly, cover plate assembly processing method and electronic equipment |
| CN107241882B (en) * | 2017-07-31 | 2022-11-15 | Oppo广东移动通信有限公司 | Electronic device shell, electronic device and electronic device shell machining method |
| CN107839144B (en) * | 2017-09-30 | 2019-09-13 | Oppo广东移动通信有限公司 | A kind of processing method of shell, shell and mobile terminal |
-
2019
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| CN112968983A (en) | 2021-06-15 |
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