WO2021109331A1 - 一种服务器、主板及cpu安装固定加强模组 - Google Patents

一种服务器、主板及cpu安装固定加强模组 Download PDF

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Publication number
WO2021109331A1
WO2021109331A1 PCT/CN2020/073196 CN2020073196W WO2021109331A1 WO 2021109331 A1 WO2021109331 A1 WO 2021109331A1 CN 2020073196 W CN2020073196 W CN 2020073196W WO 2021109331 A1 WO2021109331 A1 WO 2021109331A1
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Prior art keywords
cpu
mounting
liner
module according
elastic plate
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English (en)
French (fr)
Inventor
李小政
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Suzhou Wave Intelligent Technology Co Ltd
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Suzhou Wave Intelligent Technology Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/184—Mounting of motherboards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the invention relates to the technical field of servers, in particular to a CPU installation and fixation strengthening module.
  • the invention also relates to a motherboard and a server.
  • the server is an important part of electronic equipment and a device that provides computing services. Since the server needs to respond to service requests and process them, in general, the server should have the ability to undertake the service and guarantee the service. Under the torrent of the Internet, big data, and cloud computing, higher requirements are put forward for the transmission and processing speed, storage capacity, and high-performance computing capabilities of massive data. Due to the impact of intensive computing, higher requirements are placed on the processing capacity of the server.
  • One of the current methods is to increase the area of a single processor, and integrate more or even more complex circuits in the increased area of the processor to improve the processing capacity of a single processor, such as Intel’s server CPU products.
  • Increasing the number of pins from 2011 to 3647 has increased the area of a single processor by nearly 80%.
  • the total pressure load on the CPU increases. It is much higher, and the retention force provided to the CPU and the processor socket is also transferred from the liner to the heat sink assembly. Because a large amount of heat is generated when the CPU is powered on, and an excessively high temperature can cause damage to the CPU, the heat sink assembly needs to be used to dissipate the CPU. Due to the large number of pins, it is necessary to apply sufficient pressure to the CPU to ensure the tight coupling between so many pins and the processor socket.
  • the working pressure of each pin of the CPU is 10 to 25g force when it is working.
  • the CPU installation module in the prior art has a complicated structure and many installation process steps. It is troublesome for the disassembly and assembly operations of the CPU module on the motherboard. More importantly, the installation and pressing force is general, and it is difficult to provide a CPU with an increased area. The increased total pressure load demand results in insufficient integration between the heat sink and the CPU. On the one hand, it is impossible to ensure that the CPU has sufficient heat dissipation capacity. On the other hand, there is a risk of poor physical contact between the CPU pins and the CPU socket.
  • the purpose of the present invention is to provide a CPU installation and fixation strengthening module, which can simplify the structure of the CPU installation module, improve the efficiency of disassembly and assembly, enhance the pressing force of the CPU, and ensure the heat dissipation performance and good physical contact.
  • Another object of the present invention is to provide a motherboard and a server.
  • the present invention provides a CPU mounting and fixing strengthening module, which includes a PCB board, a CPU socket opened on the surface thereof, and a CPU installed in the CPU socket, and also includes a CPU installed on the PCB A mounting backing plate distributed on the surface of the board and surrounding the CPU socket, a mounting back plate arranged on the back of the PCB board, and a heat sink mounted on the surface of the mounting backing plate and pressed against the surface of the CPU
  • the housing, the surface of the mounting liner is provided with an elastic plate that can be deformed in the vertical direction, both ends of the elastic plate are connected to the mounting liner through a first connecting piece, and the mounting liner is connected to the mounting liner.
  • the mounting backboard is tightened with each other through the first connecting member; the elastic plate is provided with a second connecting member, and the radiator shell is provided with a second connecting member for cooperating with the second connecting member and for making the The elastic plate generates elastic deformation to tighten the pre-tension adjusting member of the radiator shell.
  • the elastic plate includes a deformed portion, and a connecting portion connected to both ends of the deformed portion, the first connecting piece is arranged on each connecting portion, and the second connecting piece is arranged on the deformed portion. Ministry.
  • the elastic plate further includes a bent portion connected between the end of the deformed portion and the end of the connecting portion and used for increasing the maximum elastic deformation amount of the deformed portion through a bending structure.
  • the bending angle of the bending portion is 25-30° in a natural state.
  • the deformed portion is specifically a spring steel plate.
  • the first connecting member sequentially penetrates the connecting portion, the mounting lining board and the PCB board and tightens and fixes the three, and the mounting backplane is connected to the first through a fastener The ends of the pieces are connected to be tightened with the installation liner.
  • the first connecting member is a special-shaped nut or a rivet.
  • the second connecting member is fixed on the surface of the deformed portion and extends toward the pretension adjusting member.
  • the head end of the second connecting member is fixed on the bottom surface of the deformed portion, and the end of the second connecting member penetrates the deformed portion from the bottom surface and is vertically erected on the surface of the deformed portion.
  • the second connecting member is specifically a stud
  • the pretension adjusting member is specifically a rotatably arranged on the outer edge of the radiator housing for forming a threaded transmission with the second connecting member. Adjust the nut.
  • it further includes a CPU cover detachably connected to the bottom surface of the heat sink housing and used to form a pre-installed component with the CPU, and the bottom surface of the CPU cover and the surface of the mounting liner Removable connection.
  • a CPU cover detachably connected to the bottom surface of the heat sink housing and used to form a pre-installed component with the CPU, and the bottom surface of the CPU cover and the surface of the mounting liner Removable connection.
  • the surface of the mounting liner is provided with a plurality of positioning posts along the circumferential direction
  • the surface of the CPU cover plate is provided with a plurality of positioning posts along the circumferential direction for cooperating with the respective corresponding positioning posts. hole.
  • the present invention also provides a motherboard, including a board body and a CPU mounting and fixing strengthening module arranged on the board, wherein the CPU mounting and fixing strengthening module is specifically the CPU mounting and fixing strengthening module described in any one of the above Module.
  • the present invention also provides a server, including a cabinet and a main board arranged in the cabinet, wherein the main board is specifically the main board described in the previous item.
  • the CPU installation and fixation strengthening module mainly includes a PCB board, a CPU slot, a CPU, an installation liner, an installation back plate and a heat sink shell.
  • the CPU socket is opened on the surface of the PCB board, the CPU is installed in the CPU socket, the mounting backboard is arranged on the back of the PCB board, and the mounting backing board is arranged on the surface of the PCB board and is distributed around the CPU socket , Corresponding to the installation position of the installation backplane.
  • An elastic plate is provided on the surface of the mounting liner, which can be elastically deformed in the vertical direction, and both ends of the elastic plate are connected to the mounting liner through the first connecting piece, and at the same time, the mounting liner and the mounting back plate pass through the The first connecting pieces are tightened and fixed to each other.
  • a second connecting piece is arranged at the middle position of the elastic plate.
  • the radiator shell is covered on the mounting liner, the bottom surface is pressed against the surface of the CPU, and a pretension adjusting piece is arranged on the radiator shell, the pretension adjusting piece It is mainly used to form a coordinated installation with the second connecting piece to drive the second connecting piece to move up and down in the vertical direction, and the mating depth between the two is adjustable.
  • the fit between the pre-tightening adjustment piece and the second connecting piece can be gradually deepened, thereby driving the second connecting piece to rise vertically, and at the same time driving the elastic plate to produce a vertical direction
  • the elastic deformation Since both ends of the elastic plate are connected to the mounting backing plate through the first connecting piece, when the elastic plate deforms elastically, the first connecting piece will be pulled along the way to produce vertical upward elasticity to the first connecting piece. With the help of the elastic force, the mounting back plate can be pulled tighter. In the same way, the vertical downward elastic force generated by the elastic deformation of the elastic plate on the second connector will make the radiator shell more tightly pressed against the surface of the CPU.
  • the radiator shell and the mounting back plate are simultaneously squeezed inward, which greatly improves the degree of compression of the CPU installed therein, and ensures the heat dissipation performance and good physical contact.
  • the present invention can simplify the structure of the CPU installation module, improve the efficiency of disassembly and assembly, strengthen the pressing force on the CPU, and ensure the heat dissipation performance and good physical contact.
  • FIG. 1 is a schematic diagram of an exploded structure of a specific embodiment provided by the present invention.
  • Fig. 2 is a partial structural diagram of the mounting liner shown in Fig. 1.
  • PCB board-1 CPU socket-2, mounting liner-3, mounting backplane-4, heat sink shell-5, CPU cover-6;
  • Deformation part-311 Deformation part-311, bending part-312, connecting part-313.
  • FIG. 1 is a schematic diagram of an exploded structure of a specific embodiment provided by the present invention.
  • the CPU mounting and fixing strengthening module mainly includes a PCB board 1, a CPU socket 2, a mounting liner 3, a mounting back plate 4, a heat sink housing 5 and a CPU.
  • the CPU socket 2 is opened on the surface of the PCB board 1, the CPU is installed in the CPU socket 2, the mounting backboard 4 is arranged on the back of the PCB board 1, and the mounting backing board 3 is arranged on the surface of the PCB board 1. , And distributed around the CPU socket 2, corresponding to the installation position of the installation backplane 4.
  • An elastic plate 31 is provided on the surface of the mounting liner 3, the elastic plate 31 can be elastically deformed along the vertical direction, and both ends of the elastic plate 31 are connected to the mounting liner 3 by the first connecting member 32, and the mounting liner 3 is connected to the mounting liner 3 at the same time.
  • the back plates 4 are tightened and fixed to each other through the first connecting member 32.
  • a second connector 33 is provided at the middle position of the elastic plate 31, and the radiator housing 5 is covered on the mounting liner 3, while the bottom surface of the radiator housing 5 is pressed against the surface of the CPU, and is on the radiator housing 5.
  • a pre-tension adjusting member 51 is provided, and the pre-tension adjusting member 51 is mainly used to cooperate and fix the second connecting member 33 on the elastic plate 31, and the second connecting member 33 is driven to move vertically through the cooperation of the two, and The mating depth of the two is adjustable.
  • the fit between the pre-tightening adjuster 51 and the second connecting piece 33 can be gradually deepened, thereby driving the second connecting piece 33 to rise vertically (or lower)
  • the elastic plate 31 is driven to produce elastic deformation along the vertical direction. Since both ends of the elastic plate 31 are connected to the mounting backing plate 3 and the mounting back plate 4 through the first connecting member 32, when the elastic plate 31 undergoes elastic deformation, the first connecting member 32 will be pulled along with the first connecting member 32. 32 generates a vertical upward elastic force, with the aid of the tensioning force, the mounting back plate 4 can be pulled tighter.
  • this embodiment can simplify the structure of the CPU installation module, improve the efficiency of disassembly and assembly, strengthen the pressing force on the CPU, and ensure the heat dissipation performance and good physical contact.
  • FIG. 2 is a partial structural diagram of the mounting liner 3 shown in FIG. 1.
  • the elastic plate 31 may specifically be a spring steel plate, a hard rubber plate, etc., and mainly includes a deformed portion 311, a bent portion 312 and a connecting portion 313.
  • the deformed portion 311 is a regional structure that mainly produces elastic deformation on the elastic plate 31.
  • the bent portions 312 are respectively connected to the two ends of the deformed portion 311, and the connecting portions 313 are connected to the ends of the bent portions 312 on both sides.
  • the deformed portion 311 occupies a larger proportion of the total length of the elastic plate 31, while the proportion of the bent portion 312 to the connecting portion 313 is smaller.
  • the first connecting member 32 can be respectively connected to the connecting portions 313 on both sides, and the second connecting member 33 can be arranged on the deformed portion 311 in the middle.
  • the first connecting member 32 may specifically be a special-shaped nut, and sequentially penetrates the connecting portion 313 of the elastic plate 31, the mounting liner 3 and the PCB board 1 (not shown in the figure), so that the three are tightened and fixed. At the same time, the end of the first connecting member 32 also protrudes beyond the bottom surface of the PCB board 1.
  • the special-shaped nut rivets the connecting portion 313 of the elastic plate 31 and the surface of the mounting liner 3 into one body.
  • a thread is provided on the end of the special-shaped nut, and the mounting back plate 4 can be connected to the special-shaped through fasteners such as bolts.
  • the special-shaped nut can also connect the connecting portion 313 of the elastic plate 31 and the mounting liner 3 into one body through a threaded connection.
  • the overall structure of the special-shaped nut can be formed by one-time molding or splicing and assembly of multiple split structures.
  • the first connecting member 32 may also be a component such as a rivet.
  • the second connecting member 33 may specifically be a stud, the head end of which can be fixed (such as welding, etc.) on the bottom surface of the deformed portion 311, and the end can penetrate upward from the bottom surface of the deformed portion 311 of the elastic plate 31 to the convex deformed portion The surface of 311 and extends toward the pretension adjusting member 51.
  • the second connecting member 33 can be vertically erected on the surface of the elastic plate 31, which can also more smoothly drive the elastic plate 31 to undergo elastic deformation along the vertical direction.
  • the pretension adjusting member 51 may specifically be an adjusting nut, and is rotatably arranged at At the outer edge of the radiator housing 5.
  • the adjusting nut can form a threaded connection with the stud, and when the two are deepened in cooperation, because the adjusting nut itself cannot perform vertical displacement and can only rotate in the circumferential direction, a thread (or wire) is formed between the adjusting nut and the stud.
  • the lever is driven, and the stud is gradually lifted with the help of the vertical component force between the threads, thereby driving the deformed portion 311 of the elastic plate 31 to undergo vertical elastic deformation.
  • the deformed portion 311 of the elastic plate 31 is in a horizontal state in a natural state, and is tightly attached to the surface of the mounting lining board 3. Therefore, the second connecting member 33 is required to lift the deformed portion 311 in the vertical direction. Overcoming the elastic force of the elastic plate 31, on the contrary, the deformed portion 311 of the elastic plate 31 is restored under the action of elastic potential energy.
  • the bent portion 312 may be in a trapezoidal shape without a bottom cover, with a beveled side (waist side), a straight side (the other waist side) and a flat top, and the beveled side and The deformed part 311 is connected, the straight side is connected to the connecting part 313, and the flat top is connected between the oblique side and the straight side as a fulcrum of force.
  • the deformed portion 311 When the deformed portion 311 generates an elastic deformation along the vertical direction, the hypotenuse will follow the deformation of the deformed portion 311 and deform synchronously, which is equivalent to increasing the maximum amount of elastic deformation of the deformed portion 311.
  • the bending angle of the hypotenuse is 25-30° in the natural state (undeformed state), which is the dihedral angle between the hypotenuse and the surface where the liner 3 is installed.
  • a CPU cover 6 is added in this embodiment.
  • the CPU cover 6 is a ring plate, the center of which is hollowed out, the surface is detachably connected to the bottom surface of the radiator shell 5, and the bottom surface is detachably connected to the surface of the mounting liner 3 (need to avoid the elastic plate 31), as an intermediate connecting piece between the radiator shell 5 and the installation liner 3.
  • the CPU cover 6 and the radiator housing 5 and the mounting liner 3 can be connected by fasteners such as glue nails.
  • the hollowed-out area of the CPU cover 6 can be pre-installed with the CPU in advance, and then integrally installed between the installation liner 3 and the server housing.
  • a number of positioning posts are provided on the surface of the mounting liner 3, which can accurately locate the installation position of the CPU cover 6 on the mounting liner 3, ensuring that the pre-installed CPU on the CPU cover 6 can be accurately installed in Inside the CPU socket 2.
  • a number of positioning posts 34 are erected on the surface of the mounting liner 3 along the circumferential direction.
  • a number of positioning holes 61 are provided on the surface along the circumferential direction.
  • This embodiment also provides a motherboard, which mainly includes a board body and a CPU mounting and fixing strengthening module arranged on the board.
  • the main content of the CPU mounting and fixing strengthening module is the same as the above-mentioned related content, and will not be repeated here. .
  • This embodiment also provides a server, which mainly includes a cabinet and a mainboard arranged in the cabinet, wherein the main content of the mainboard is the same as the above-mentioned related content, and will not be repeated here.

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  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
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Abstract

一种CPU安装固定加强模组，包括PCB板、CPU插槽和安装于其内的CPU、设置于PCB板表面上并环绕CPU插槽分布的安装衬板、设置于PCB板背面上的安装背板、安装于安装衬板表面上并压紧在CPU表面上的散热器外壳，安装衬板的表面上设置有可沿垂向形变的弹性板，弹性板的两端均通过第一连接件与安装衬板相连，且安装衬板与安装背板通过第一连接件互相拉紧；弹性板上设置有第二连接件，且散热器外壳上设置有用于与第二连接件配合、用于使弹性板产生弹性形变以将散热器外壳拉紧的预紧调节件。本发明能够精简CPU安装模组结构，提高拆装效率，增强对CPU的压紧力度，保证散热性能和良好物理接触。一种主板及一种服务器，其有益效果如上所述。

Description

一种服务器、主板及CPU安装固定加强模组
本申请要求于2019年12月6日提交中国专利局、申请号为201911243168.4、发明名称为“一种服务器、主板及CPU安装固定加强模组”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及服务器技术领域，特别涉及一种CPU安装固定加强模组。本发明还涉及一种主板以及一种服务器。
背景技术
随着中国电子技术的发展，越来越多的电子设备已得到广泛使用。
服务器是电子设备中的重要组成部分，是提供计算服务的设备。由于服务器需要响应服务请求，并进行处理，因此一般来说服务器应具备承担服务并且保障服务的能力。在互联网、大数据和云计算的时代洪流下，对海量数据的传输和处理速度、存储能力与高性能计算能力均提出了更高的要求。由于密集计算带来的影响，对服务器的处理能力提出了更高的要求。
目前的一种方式是将单颗处理器的面积增大，在面积增大后的处理器内集成更多乃至更复杂的电路来提高单颗处理器的处理能力，例如英特尔的服务器CPU产品，将pin数由2011提高到3647，由此带来单颗处理器的面积增大了将近80％，然而由于处理器占用印制电路板PCB的面积是几乎固定的，对CPU的总压力载荷升高了很多，提供给CPU与处理器插槽的保持力也从衬板转移到散热器组件上。由于CPU通电工作过程中会产生大量热量，而过高的温度会导致CPU损坏，因此需要通过散热器组件对CPU进行散热。由于针脚数量庞大，要保证如此多的针脚与处理器插槽之间的紧密结合，需要对CPU施加足够的压力，CPU在工作时的每pin的工作压力为10到25g力。
现有技术中的CPU安装模组结构复杂，安装工艺步骤繁多，对于CPU模组在主板上的拆装操作均比较麻烦，更重要的是安装压紧力一般，难以提供面积增大后的CPU所增加的总压力载荷需求，导致散热器与CPU之间结合不够紧密，一方面无法保证CPU具有足够的散热能力，另一方面存 在CPU针脚与CPU插槽的物理接触不良的风险。
因此，如何精简CPU安装模组结构，提高拆装效率，增强对CPU的压紧力度，保证散热性能和良好物理接触，是本领域技术人员所面临的技术问题。
发明内容
本发明的目的是提供一种CPU安装固定加强模组，能够精简CPU安装模组结构，提高拆装效率，增强对CPU的压紧力度，保证散热性能和良好物理接触。本发明的另一目的是提供一种主板以及一种服务器。
为解决上述技术问题，本发明提供一种CPU安装固定加强模组，包括PCB板、开设于其表面上的CPU插槽和安装于所述CPU插槽内的CPU，还包括设置于所述PCB板表面上并环绕所述CPU插槽分布的安装衬板、设置于所述PCB板背面上的安装背板、安装于所述安装衬板表面上并压紧在所述CPU表面上的散热器外壳，所述安装衬板的表面上设置有可沿垂向形变的弹性板，所述弹性板的两端均通过第一连接件与所述安装衬板相连，且所述安装衬板与所述安装背板通过所述第一连接件互相拉紧；所述弹性板上设置有第二连接件，且所述散热器外壳上设置有用于与所述第二连接件配合、用于使所述弹性板产生弹性形变以将所述散热器外壳拉紧的预紧调节件。
优选地，所述弹性板包括形变部，以及连接于所述形变部两端的连接部，所述第一连接件设置在各所述连接部上，且所述第二连接件设置在所述形变部上。
优选地，所述弹性板还包括连接于所述形变部的端部与所述连接部的端部之间、用于通过弯折结构增加所述形变部的最大弹性形变量的弯折部。
优选地，所述弯折部的弯折角度在自然状态下为25～30°。
优选地，所述形变部具体为弹簧钢板。
优选地，所述第一连接件依次贯穿所述连接部、所述安装衬板和所述PCB板并将三者拉紧固定，且所述安装背板通过紧固件与所述第一连接件的末端相连以与所述安装衬板互相拉紧。
优选地，所述第一连接件具体为异形螺母或铆钉。
优选地，所述第二连接件固定于所述形变部的表面上并朝向所述预紧调节件延伸。
优选地，所述第二连接件的头端固定在所述形变部的底面上，且所述第二连接件的末端从底面贯穿所述形变部并沿垂向立设于其表面上。
优选地，所述第二连接件具体为螺柱，且所述预紧调节件具体为可旋转地设置于所述散热器外壳的外缘、用于与所述第二连接件形成螺纹传动的调节螺母。
优选地，还包括可拆卸地连接于所述散热器外壳的底面上、用于与所述CPU形成预安装组件的CPU盖板，且所述CPU盖板的底面与所述安装衬板的表面可拆卸连接。
优选地，所述安装衬板的表面上沿周向立设有若干个定位柱，且所述CPU盖板的表面上沿周向开设有若干个用于与各自对应的所述定位柱配合安装的定位孔。
本发明还提供一种主板，包括板体和设置于所述板体上的CPU安装固定加强模组，其中，所述CPU安装固定加强模组具体为上述任一项所述的CPU安装固定加强模组。
本发明还提供一种服务器，包括箱体和设置于所述箱体内的主板，其中，所述主板具体为上一项所述的主板。
本发明所提供的CPU安装固定加强模组，主要包括PCB板、CPU插槽、CPU、安装衬板、安装背板和散热器外壳。其中，CPU插槽开设在PCB板的表面上，CPU安装于CPU插槽内，安装背板设置在PCB板的背面上，而安装衬板设置在PCB板的表面上，并且环绕CPU插槽分布，与安装背板的安装位置对应。在安装衬板的表面上设置有弹性板，该弹性板能够沿垂向进行弹性形变，其两端均通过第一连接件与安装衬板相连，同时安装衬板与安装背板之间通过该第一连接件互相拉紧固定。弹性板的中间位置上设置有第二连接件，同时，散热器外壳罩设在安装衬板上，底面压紧CPU表面，并且在散热器外壳上设置有预紧调节件，该预紧调节件主要用于与第二连接件形成配合安装，以驱动第二连接件沿垂向进行升降运动，并且两者间的配合深度可调。在安装CPU模组时，通过调节预紧调节件，可使 预紧调节件与第二连接件之间的配合逐渐加深，从而驱动第二连接件垂向上升，同时带动弹性板产生沿垂向的弹性形变。由于弹性板的两端通过第一连接件将安装衬板与安装背板相连，因此，在弹性板产生弹性形变时，将顺势拉动第一连接件，对第一连接件产生垂向向上的弹性力，借助该弹性力可将安装背板拉得更紧。同理，弹性板的弹性形变对第二连接件产生的垂向向下的弹性力，将使散热器外壳对CPU的表面压得更紧。综合上述两部分作用，使得散热器外壳与安装背板同时向内挤压，大幅提高了对安装在其中的CPU的压紧程度，保证散热性能和良好物理接触。相比于现有技术，本发明能够精简CPU安装模组结构，提高拆装效率，增强对CPU的压紧力度，保证散热性能和良好物理接触。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1为本发明所提供的一种具体实施方式的分解结构示意图。
图2为图1中所示的安装衬板的局部结构示意图。
其中，图1—图2中：
CPU—a；
PCB板—1，CPU插槽—2，安装衬板—3，安装背板—4，散热器外壳—5，CPU盖板—6；
弹性板—31，第一连接件—32，第二连接件—33，定位柱—34，预紧调节件—51，定位孔—61；
形变部—311，弯折部—312，连接部—313。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例， 而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参考图1，图1为本发明所提供的一种具体实施方式的分解结构示意图。
在本发明所提供的一种具体实施方式中，CPU安装固定加强模组主要包括PCB板1、CPU插槽2、安装衬板3、安装背板4、散热器外壳5和CPU。
其中，CPU插槽2开设在PCB板1的表面上，CPU安装在CPU插槽2内，安装背板4设置在PCB板1的背面上，而安装衬板3设置在PCB板1的表面上，并且环绕CPU插槽2分布，与安装背板4的安装位置对应。
在安装衬板3的表面上设置有弹性板31，该弹性板31能够沿垂向进行弹性形变，其两端均通过第一连接件32与安装衬板3相连，同时安装衬板3与安装背板4之间通过该第一连接件32互相拉紧固定。
弹性板31的中间位置上设置有第二连接件33，散热器外壳5罩设在安装衬板3上，同时散热器外壳5的底面压紧在CPU的表面上，并且在散热器外壳5上设置有预紧调节件51，该预紧调节件51主要用于与弹性板31上的第二连接件33配合固定，通过两者的配合驱动第二连接件33沿垂向进行升降运动，并且两者的配合深度可调。
在安装CPU模组时，通过调节预紧调节件51，可使预紧调节件51与第二连接件33之间的配合逐渐加深，从而驱动第二连接件33垂向上升(反之则下降)，同时带动弹性板31产生沿垂向的弹性形变。由于弹性板31的两端通过第一连接件32将安装衬板3与安装背板4相连，因此，在弹性板31产生弹性形变时，将顺势拉动第一连接件32，对第一连接件32产生垂向向上的弹性力，借助该拉紧力可将安装背板4拉得更紧。
同理，弹性板31的弹性形变对第二连接件33产生的垂向向下的弹性力，将使散热器外壳5对CPU的表面压得更紧。综合上述两部分作用，使得散热器外壳5与安装背板4同时向内挤压，大幅提高了对安装在其中的CPU的压紧程度，保证散热性能和良好物理接触。相比于现有技术，本实 施例能够精简CPU安装模组结构，提高拆装效率，增强对CPU的压紧力度，保证散热性能和良好物理接触。
如图2所示，图2为图1中所示的安装衬板3的局部结构示意图。
在关于弹性板31的一种优选实施方式中，该弹性板31具体可为弹簧钢板、硬质橡胶板等，主要包括形变部311、弯折部312和连接部313。其中，形变部311为弹性板31上主要产生弹性形变的区域结构，弯折部312分别连接在形变部311的两端位置，而连接部313又与两侧的弯折部312的末端相连，如此形成形变部311在中间而连接部313在两侧的结构，并且，形变部311占弹性板31全长的比例较大，而弯折部312与连接部313的比例较小。同时，第一连接件32可分别连接在两侧的连接部313上，而第二连接件33则可设置在中间的形变部311上。
进一步的，第一连接件32具体可为异形螺母，并且依次贯穿了弹性板31的连接部313、安装衬板3和PCB板1(图中未示出)，如此将三者拉紧固定，同时第一连接件32的末端还凸出至PCB板1的底面之外。具体的，异形螺母将弹性板31的连接部313与安装衬板3的表面铆接成一体，同时，在异形螺母的末端上设置有螺纹，安装背板4可通过螺栓等紧固件与该异形螺母的末端形成螺纹连接，从而将安装背板4紧贴在PCB板1的底面上，并与安装衬板3拉紧固定。当然，异形螺母还可以通过螺纹连接的方式将弹性板31的连接部313与安装衬板3连接成一体。并且，异形螺母的整体结构可通过一次成型或者通过多个分体式结构进行拼接组装而成。此外，第一连接件32还可为铆钉等部件。
第二连接件33具体可为螺柱，其头端可固定(如焊接等)在形变部311的底面上，并且其末端可从弹性板31的形变部311的底面向上贯穿至凸出形变部311的表面，并朝向预紧调节件51延伸。为方便与服务器外壳上的装配孔51形成配合，第二连接件33可垂直立设在弹性板31的表面上，如此也能更加顺利地带动弹性板31进行沿垂向方向的弹性形变。同时，为使装配孔51在与第二连接件33的配合程度变化时，能够顺利进行垂向升降运动，本实施例中，预紧调节件51具体可为调节螺母，并且可旋转地设置在散热器外壳5的外缘位置处。该调节螺母可与螺柱形成螺纹连接，并 且两者在配合加深时，由于调节螺母自身无法进行垂向位移，只能周向旋转，因此在调节螺母与螺柱之间形成了螺纹(或丝杠)传动，借助螺纹间的垂向分力逐渐提升螺柱，进而带动弹性板31的形变部311进行垂向弹性形变。当然，弹性板31的形变部311在自然状态下是处于水平状态的，并且紧贴在安装衬板3的表面上，因此，第二连接件33在垂向举升形变部311时，是需要克服弹性板31的弹性力的，反之则使弹性板31的形变部311在弹性势能作用下复原。
在关于弯折部312的一种优选实施方式中，该弯折部312具体可呈不封底的梯形形状，具有斜边(腰边)、直边(另一腰边)和平顶，斜边与形变部311相连，而直边与连接部313相连，平顶则连接在斜边与直边之间，作为受力支点。当形变部311产生沿垂向的弹性形变时，斜边将跟随形变部311的形变而同步形变，相当于增加了形变部311的最大弹性形变量。一般的，斜边的弯折角度在自然状态(未形变状态)下为25～30°，该角度即斜边与安装衬板3的表面之间的二面角。
另外，本实施例中还增设了CPU盖板6。具体的，该CPU盖板6为环板，其中心镂空，表面可拆卸地连接在散热器外壳5的底面上，同时底面可拆卸地连接在安装衬板3的表面上(需要避开弹性板31的安装位置)，作为散热器外壳5与安装衬板3之间的中间连接件。一般的，CPU盖板6与散热器外壳5、安装衬板3之间可通过胶钉等紧固件进行连接。并且，CPU盖板6的镂空区域可事先与CPU形成预安装，之后再整体安装进安装衬板3与服务器外壳之间。当然，在安装衬板3的表面上设置有若干个定位柱，可精确地定位CPU盖板6在安装衬板3上的安装位置，保证CPU盖板6上预安装的CPU能够精确地安装进CPU插槽2内。
为方便CPU盖板6与安装衬板3之间形成可拆卸连接，本实施例在安装衬板3的表面上沿着周向方向立设有若干个定位柱34，同时在CPU盖板6的表面上沿着周向开设有若干个定位孔61。如此设置，通过各个定位柱34与各个定位孔61的配合，可方便地实现CPU盖板6在安装衬板3上的定位安装。
本实施例还提供一种主板，主要包括板体和设置在板体上的CPU安装 固定加强模组，其中，该CPU安装固定加强模组的主要内容与上述相关内容相同，此处不再赘述。
本实施例还提供一种服务器，主要包括箱体和设置在箱体内的主板，其中，该主板的主要内容与上述相关内容相同，此处不再赘述。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (14)

  1. 一种CPU安装固定加强模组，包括PCB板(1)、开设于其表面上的CPU插槽(2)和安装于所述CPU插槽(2)内的CPU(a)，其特征在于，还包括设置于所述PCB板(1)表面上并环绕所述CPU插槽(2)分布的安装衬板(3)、设置于所述PCB板(1)背面上的安装背板(4)、安装于所述安装衬板(3)表面上并压紧在所述CPU(a)表面上的散热器外壳(5)，所述安装衬板(3)的表面上设置有可沿垂向形变的弹性板(31)，所述弹性板(31)的两端均通过第一连接件(32)与所述安装衬板(3)相连，且所述安装衬板(3)与所述安装背板(4)通过所述第一连接件(32)互相拉紧；所述弹性板(31)上设置有第二连接件(33)，且所述散热器外壳(5)上设置有用于与所述第二连接件(33)配合、用于使所述弹性板(31)产生弹性形变以将所述散热器外壳(5)拉紧的预紧调节件(51)。
  2. 根据权利要求1所述的CPU安装固定加强模组，其特征在于，所述弹性板(31)包括形变部(311)，以及连接于所述形变部(311)两端的连接部(313)，所述第一连接件(32)设置在各所述连接部(313)上，且所述第二连接件(33)设置在所述形变部(311)上。
  3. 根据权利要求2所述的CPU安装固定加强模组，其特征在于，所述弹性板(31)还包括连接于所述形变部(311)的端部与所述连接部(313)的端部之间、用于通过弯折结构增加所述形变部(311)的最大弹性形变量的弯折部(312)。
  4. 根据权利要求3所述的CPU安装固定加强模组，其特征在于，所述弯折部(312)的弯折角度在自然状态下为25～30°。
  5. 根据权利要求4所述的CPU安装固定加强模组，其特征在于，所述形变部(311)具体为弹簧钢板。
  6. 根据权利要求2所述的CPU安装固定加强模组，其特征在于，所述第一连接件(32)依次贯穿所述连接部(313)、所述安装衬板(3)和所述PCB板(1)并将三者拉紧固定，且所述安装背板(4)通过紧固件与所 述第一连接件(32)的末端相连以与所述安装衬板(3)互相拉紧。
  7. 根据权利要求6所述的CPU安装固定加强模组，其特征在于，所述第一连接件(32)具体为异形螺母或铆钉。
  8. 根据权利要求2所述的CPU安装固定加强模组，其特征在于，所述第二连接件(33)固定于所述形变部(311)的表面上并朝向所述预紧调节件(51)延伸。
  9. 根据权利要求8所述的CPU安装固定加强模组，其特征在于，所述第二连接件(33)的头端固定在所述形变部(311)的底面上，且所述第二连接件(33)的末端从底面贯穿所述形变部(311)并沿垂向立设于其表面上。
  10. 根据权利要求9所述的CPU安装固定加强模组，其特征在于，所述第二连接件(33)具体为螺柱，且所述预紧调节件(51)具体为可旋转地设置于所述散热器外壳(5)的外缘、用于与所述第二连接件(33)形成螺纹传动的调节螺母。
  11. 根据权利要求1所述的CPU安装固定加强模组，其特征在于，还包括可拆卸地连接于所述散热器外壳(5)的底面上、用于与所述CPU(a)形成预安装组件的CPU盖板(6)，且所述CPU盖板(6)的底面与所述安装衬板(3)的表面可拆卸连接。
  12. 根据权利要求11所述的CPU安装固定加强模组，其特征在于，所述安装衬板(3)的表面上沿周向立设有若干个定位柱(34)，且所述CPU盖板(6)的表面上沿周向开设有若干个用于与各自对应的所述定位柱(34)配合安装的定位孔(61)。
  13. 一种主板，包括板体和设置于所述板体上的CPU安装固定加强模组，其特征在于，所述CPU安装固定加强模组具体为权利要求1-12任一项所述的CPU安装固定加强模组。
  14. 一种服务器，包括箱体和设置于所述箱体内的主板，其特征在于，所述主板具体为权利要求13所述的主板。
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US12444664B2 (en) * 2020-12-23 2025-10-14 Sk Hynix Nand Product Solutions Corp. Loading frame for high I/O count packaged semiconductor chip
US12315780B2 (en) * 2021-02-26 2025-05-27 Intel Corporation Technologies for processor loading mechanisms
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2657343Y (zh) * 2003-11-01 2004-11-17 鸿富锦精密工业（深圳）有限公司 散热器固定装置
JP2005057070A (ja) * 2003-08-05 2005-03-03 Matsushita Electric Ind Co Ltd 電子機器の放熱構造
CN203827678U (zh) * 2014-03-28 2014-09-10 番禺得意精密电子工业有限公司 支撑架
TWM526255U (zh) * 2015-12-03 2016-07-21 嘉澤端子工業股份有限公司 支撐架
CN107577285A (zh) * 2017-07-05 2018-01-12 华为技术有限公司 一种处理器固定结构、组件及计算机设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2440224Y (zh) * 2000-09-29 2001-07-25 华硕电脑股份有限公司 中央处理器散热片的固定装置
US7133287B2 (en) * 2004-03-31 2006-11-07 Intel Corporation ATCA integrated heatsink and core power distribution mechanism
CN110007721B (zh) * 2018-01-05 2023-08-22 联想企业解决方案(新加坡)有限公司 计算机服务器和主板组件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005057070A (ja) * 2003-08-05 2005-03-03 Matsushita Electric Ind Co Ltd 電子機器の放熱構造
CN2657343Y (zh) * 2003-11-01 2004-11-17 鸿富锦精密工业（深圳）有限公司 散热器固定装置
CN203827678U (zh) * 2014-03-28 2014-09-10 番禺得意精密电子工业有限公司 支撑架
TWM526255U (zh) * 2015-12-03 2016-07-21 嘉澤端子工業股份有限公司 支撐架
CN107577285A (zh) * 2017-07-05 2018-01-12 华为技术有限公司 一种处理器固定结构、组件及计算机设备

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