US20120216988A1 - Heat sink fastener - Google Patents

Heat sink fastener Download PDF

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Publication number
US20120216988A1
US20120216988A1 US13/034,927 US201113034927A US2012216988A1 US 20120216988 A1 US20120216988 A1 US 20120216988A1 US 201113034927 A US201113034927 A US 201113034927A US 2012216988 A1 US2012216988 A1 US 2012216988A1
Authority
US
United States
Prior art keywords
heat sink
latch
depressor
frame seat
fastener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/034,927
Inventor
Jen-Hao Kang
Shu-Zhang Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cooler Master Co Ltd
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to US13/034,927 priority Critical patent/US20120216988A1/en
Assigned to COOLER MASTER CO., LTD. reassignment COOLER MASTER CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KANG, JEN-HAO, WU, SHUN-ZHANG
Publication of US20120216988A1 publication Critical patent/US20120216988A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to heat sinks, particularly to fasteners for fixing a heat sink on an electronic device.
  • heat sinks for electronic components have become indispensible.
  • a heat sink must be firmly mounted on an electronic component by a fastener. Such a fastener must be easy to be installed and detached.
  • Taiwan patent No. 505267 discloses a typical heat sink fastener.
  • TW '267 employs a lever to install or detach the heat sink, but the lever is in direct contact with the heat sink.
  • some heat sinks may be improper for being directly depressed because direct depression may cause damage, deformation or instability.
  • An object of the invention is to provide a heat sink fastener which may prevent the heat sink from being damaged by means of indirect depression.
  • the fastener of the invention includes a frame seat, a latch and two depressors.
  • the frame seat is formed with a hollow for accommodating the heat sink and the latch is moveably mounted on the frame seat.
  • the depressors may be selectively pressed or released by the latch against the frame seat.
  • the heat sink can be fastened by the depressors when the depressors are pressed by the latch.
  • FIG. 1 is an exploded view of the invention
  • FIG. 2 is a schematic view showing the invention and a circuit board
  • FIG. 3 is a side plan view of the invention when the latch is released
  • FIG. 4 is a side plan view of the invention when the latch is being locked
  • FIG. 5 is a side plan view of the invention when the latch has been locked.
  • FIG. 6 is a cross-sectional view of the invention mounted on a circuit board.
  • the invention provides a fastener for fixing a heat sink 2 onto an electronic component 30 on a circuit board 3 .
  • the fastener 1 includes a frame seat 10 , a latch 11 and two depressors 12 .
  • the frame seat 10 is formed with a hollow 100 for accommodating the heat sink 2 .
  • the heat sink 2 includes a base 20 and a fin set 21 thereon. When the heat sink 2 is placed in the hollow 100 of the frame seat 10 , the base 20 of the heat sink 2 may be in contact with the electronic component 30 .
  • the frame seat 10 is provided with a plurality of fixing holes 101 for being fixed on the circuit board 3 by a flexible fixer 31 as shown in FIG. 6 .
  • the latch 11 is moveably mounted on the frame seat 10 to depress or release the depressors 12 . Please refer to FIGS. 3-5 .
  • the latch 11 may be rotated to press the depressors 12 when the heat sink 2 has not been fixed on the electronic component 30 yet. Then the heat sink 2 can be fastened on the electronic component 30 by the depressors 12 because the depressors 12 are pressed by the latch 11 .
  • the latch 11 is formed into a U shape. Two ends of the U-shaped latch 11 are separately formed with two protrusions 110 corresponding to two opposite side walls 102 of the frame seat 10 . Each of the side walls 102 is provided with a receiving hole 103 for receiving the protrusions 110 .
  • the protrusions 110 are unfixedly inserted into the receiving holes 103 when the latch 11 is perpendicular to the frame seat 10 as shown in FIG. 3 .
  • the protrusion 110 is further extended with a hook 111 which can prevent the protrusion 110 from escaping the receiving hole 103 when the latch 11 exerts pressure between the frame seat 10 and depressors 12 as shown in FIG. 5 .
  • an upper edge of the receiving hole 103 is formed with a slant 104 for guiding the protrusion 110 to lean against one side of the receiving hole 103 .
  • two ends of the latch 11 are further separately formed with two pressing portions 112 .
  • each of the depressors 12 is formed into a zigzag plate including an upper pressed section 120 and a lower pressing section 121 .
  • the pressed section 120 is pressed by the pressing portion 112 of the latch 11 and the pressing section 121 overlaps the base 20 of the heat sink 2 as shown in FIG. 6 .
  • the zigzag shape of the depressor 12 may provide an effect of buffer to reduce damage to the heat sink 2 .
  • the pressed section 120 may be further extended with a connecting section 122 having a connecting hole 123 .
  • the frame seat 10 is provided with a connecting sheet 105 inserted into the connecting hole 123 .
  • the connecting hole 123 is larger than the connecting sheet 105 in size, so the connecting hole 123 may be movably inserted by the connecting sheet 105 . This can provide a positioning effect between the depressor 12 and the frame seat 10 .
  • the pressing section 121 of the depressor 12 is provided with at least one threaded hole 124 and the base 20 is provided with at least one through hole 200 corresponding to the threaded hole 124 .
  • a bolt 201 may pass through the through hole 200 to screw into the threaded hole 124 for fastening the depressor 12 on the heat sink 2 .
  • the frame seat 10 is provided with a nut post 106 and the latch 11 is provided with a fixing hole 113 corresponding to the nut post 106 .
  • Another bolt 114 may pass through the fixing hole 113 to screw into the nut post 106 for fastening the latch 11 on the frame seat 10 .

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A fastener for fixing a heat sink on an electronic component is disclosed. The fastener includes a frame seat, a latch and two depressors. The frame seat is formed with a hollow for accommodating the heat sink and the latch is moveably mounted on the frame seat. The depressors may be selectively pressed or released by the latch against the frame seat. The heat sink can be fastened by the depressors when the depressors are pressed by the latch.

Description

    BACKGROUND OF THE INVENTION
  • 1. Technical Field
  • The invention relates to heat sinks, particularly to fasteners for fixing a heat sink on an electronic device.
  • 2. Related Art
  • With the advancement of semiconductor technology, electronic components such as the CPUs run with higher and higher frequency. Thus heat sinks for electronic components have become indispensible. A heat sink must be firmly mounted on an electronic component by a fastener. Such a fastener must be easy to be installed and detached.
  • Taiwan patent No. 505267 discloses a typical heat sink fastener. TW '267 employs a lever to install or detach the heat sink, but the lever is in direct contact with the heat sink. However, some heat sinks may be improper for being directly depressed because direct depression may cause damage, deformation or instability.
    • SUMMARY OF THE INVENTION
  • An object of the invention is to provide a heat sink fastener which may prevent the heat sink from being damaged by means of indirect depression.
  • To accomplish the above object, the fastener of the invention includes a frame seat, a latch and two depressors. The frame seat is formed with a hollow for accommodating the heat sink and the latch is moveably mounted on the frame seat. The depressors may be selectively pressed or released by the latch against the frame seat. The heat sink can be fastened by the depressors when the depressors are pressed by the latch.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of the invention;
  • FIG. 2 is a schematic view showing the invention and a circuit board;
  • FIG. 3 is a side plan view of the invention when the latch is released;
  • FIG. 4 is a side plan view of the invention when the latch is being locked;
  • FIG. 5 is a side plan view of the invention when the latch has been locked; and
  • FIG. 6 is a cross-sectional view of the invention mounted on a circuit board.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Please refer to FIGS. 1 and 2. The invention provides a fastener for fixing a heat sink 2 onto an electronic component 30 on a circuit board 3. The fastener 1 includes a frame seat 10, a latch 11 and two depressors 12.
  • The frame seat 10 is formed with a hollow 100 for accommodating the heat sink 2. The heat sink 2 includes a base 20 and a fin set 21 thereon. When the heat sink 2 is placed in the hollow 100 of the frame seat 10, the base 20 of the heat sink 2 may be in contact with the electronic component 30. The frame seat 10 is provided with a plurality of fixing holes 101 for being fixed on the circuit board 3 by a flexible fixer 31 as shown in FIG. 6.
  • The latch 11 is moveably mounted on the frame seat 10 to depress or release the depressors 12. Please refer to FIGS. 3-5. The latch 11 may be rotated to press the depressors 12 when the heat sink 2 has not been fixed on the electronic component 30 yet. Then the heat sink 2 can be fastened on the electronic component 30 by the depressors 12 because the depressors 12 are pressed by the latch 11.
  • Please refer back to FIGS. 1 and 2. In the shown embodiment, the latch 11 is formed into a U shape. Two ends of the U-shaped latch 11 are separately formed with two protrusions 110 corresponding to two opposite side walls 102 of the frame seat 10. Each of the side walls 102 is provided with a receiving hole 103 for receiving the protrusions 110. The protrusions 110 are unfixedly inserted into the receiving holes 103 when the latch 11 is perpendicular to the frame seat 10 as shown in FIG. 3. The protrusion 110 is further extended with a hook 111 which can prevent the protrusion 110 from escaping the receiving hole 103 when the latch 11 exerts pressure between the frame seat 10 and depressors 12 as shown in FIG. 5. Furthermore, an upper edge of the receiving hole 103 is formed with a slant 104 for guiding the protrusion 110 to lean against one side of the receiving hole 103. Besides, two ends of the latch 11 are further separately formed with two pressing portions 112.
  • The depressors 12 are pressed by the latch 11 to exert pressure onto the heat sink 2. In other words, the heat sink 2 is not directly pressed by the latch 11 to avoid damage. In the shown embodiment, each of the depressors 12 is formed into a zigzag plate including an upper pressed section 120 and a lower pressing section 121. The pressed section 120 is pressed by the pressing portion 112 of the latch 11 and the pressing section 121 overlaps the base 20 of the heat sink 2 as shown in FIG. 6. The zigzag shape of the depressor 12 may provide an effect of buffer to reduce damage to the heat sink 2. The pressed section 120 may be further extended with a connecting section 122 having a connecting hole 123. The frame seat 10 is provided with a connecting sheet 105 inserted into the connecting hole 123. The connecting hole 123 is larger than the connecting sheet 105 in size, so the connecting hole 123 may be movably inserted by the connecting sheet 105. This can provide a positioning effect between the depressor 12 and the frame seat 10.
  • The pressing section 121 of the depressor 12 is provided with at least one threaded hole 124 and the base 20 is provided with at least one through hole 200 corresponding to the threaded hole 124. A bolt 201 may pass through the through hole 200 to screw into the threaded hole 124 for fastening the depressor 12 on the heat sink 2. As shown in FIG. 5, the frame seat 10 is provided with a nut post 106 and the latch 11 is provided with a fixing hole 113 corresponding to the nut post 106. Another bolt 114 may pass through the fixing hole 113 to screw into the nut post 106 for fastening the latch 11 on the frame seat 10.
  • While the forgoing is directed to a preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof. As such, the appropriate scope of the invention is to be determined according to the claims.

Claims (12)

1. A heat sink fastener comprising:
a frame seat having a hollow for accommodating a heat sink;
a latch movably rotatably assembled on the frame seat; and
a depressor;
wherein the latch is capable of pressing and releasing the depressor between the frame seat and the depressor, and the depressor exerts pressure on the heat sink when the latch presses the depressor.
2. The heat sink fastener of claim 1, wherein the frame seat is provided with a plurality of fixing holes separately passed by flexible fixers.
3. The heat sink fastener of claim 1, wherein the frame seat is provided with a nut post, the latch is provided with a fixing hole corresponding to the nut post, and a bolt passes through the fixing hole to screw into the nut post when the latch is pressing the depressor.
4. The heat sink fastener of claim 1, wherein the latch is of a U shape.
5. The heat sink fastener of claim 4, wherein two ends of the U-shaped latch are separately formed with two pressing portions pressing the depressor.
6. The heat sink fastener of claim 4, wherein two ends of the U-shaped latch are separately formed with two protrusions, the frame seat is formed with two opposite side walls on two edges of the hollow, each of the side walls is provided with a receiving hole for receiving the protrusions.
7. The heat sink fastener of claim 6, wherein each of the protrusions is further extended with a protrudent hook.
8. The heat sink fastener of claim 6, wherein an upper edge of the receiving hole is formed with a progressively rising slant.
9. The heat sink fastener of claim 1, wherein the depressor is a zigzag plate.
10. The heat sink fastener of claim 9, wherein the zigzag depressor includes an upper pressed section and a lower pressing section, the pressed section is pressed by the latch, and the pressing section overlaps the heat sink.
11. The heat sink fastener of claim 9, wherein the pressed section is further extended with a connecting section having a connecting hole, the frame seat is provided with a connecting sheet inserted into the connecting hole.
12. The heat sink fastener of claim 9, wherein the depressor is provided with a threaded hole for being fixed on the heat sink.
US13/034,927 2011-02-25 2011-02-25 Heat sink fastener Abandoned US20120216988A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/034,927 US20120216988A1 (en) 2011-02-25 2011-02-25 Heat sink fastener

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/034,927 US20120216988A1 (en) 2011-02-25 2011-02-25 Heat sink fastener

Publications (1)

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US20120216988A1 true US20120216988A1 (en) 2012-08-30

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130118781A1 (en) * 2011-11-11 2013-05-16 Foxconn Technology Co., Ltd. Electronic device having heat dissipation device
US20170105316A1 (en) * 2015-10-13 2017-04-13 Asia Vital Components Co., Ltd. Thermal module assembling structure
US11109477B2 (en) * 2019-06-12 2021-08-31 Fuding Precision Components (Shenzhen) Co., Ltd. Heat sink fastening mechanism for use with electrical connector

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5933326A (en) * 1997-07-12 1999-08-03 Hon Hai Precision Ind. Co., Ltd. Clipping device for heat sink
US5933325A (en) * 1998-06-17 1999-08-03 Hon Hai Precision Ind. Co., Ltd. Detachable fastening device for use with heat sink
US6025994A (en) * 1998-06-29 2000-02-15 Chiou; Ming Horng Heat sink fastener
US6037660A (en) * 1998-05-06 2000-03-14 Liu; Yen-Wen Device for securing a finned radiating structure to a computer chip
US6181559B1 (en) * 1998-07-21 2001-01-30 Samsung Electronics Co., Ltd. Device for attaching a heat sink
US20020118513A1 (en) * 2001-01-04 2002-08-29 Yoshitsugu Koseki Heat sink assembly retainer for electronic integrated circuit package
US6450248B1 (en) * 2001-10-29 2002-09-17 Hoya Tech Co., Ltd. Heat sink retainer
US6563213B1 (en) * 1999-10-18 2003-05-13 Intel Corporation Integrated circuit heat sink support and retention mechanism
US6600650B1 (en) * 2002-06-11 2003-07-29 Cheng-Ping Lee Fastening device of CPU heat sink
US6611999B1 (en) * 2002-03-28 2003-09-02 Glacialtech, Inc. Detent means for a heat sink
US6636424B2 (en) * 2001-12-05 2003-10-21 Foxconn Precision Components, Co., Ltd. Heat dissipation device
US20040017662A1 (en) * 2002-07-26 2004-01-29 Liu Heben Retaining device for heat sink
US20040052053A1 (en) * 2002-09-13 2004-03-18 Lee Hsieh Kun Clip for heat sink
US7072183B2 (en) * 2003-11-21 2006-07-04 Hon Hai Precision Industry Co., Ltd Locking device for heat dissipating device
US7433194B2 (en) * 2006-12-22 2008-10-07 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink fastening assembly

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5933326A (en) * 1997-07-12 1999-08-03 Hon Hai Precision Ind. Co., Ltd. Clipping device for heat sink
US6037660A (en) * 1998-05-06 2000-03-14 Liu; Yen-Wen Device for securing a finned radiating structure to a computer chip
US5933325A (en) * 1998-06-17 1999-08-03 Hon Hai Precision Ind. Co., Ltd. Detachable fastening device for use with heat sink
US6025994A (en) * 1998-06-29 2000-02-15 Chiou; Ming Horng Heat sink fastener
US6181559B1 (en) * 1998-07-21 2001-01-30 Samsung Electronics Co., Ltd. Device for attaching a heat sink
US6563213B1 (en) * 1999-10-18 2003-05-13 Intel Corporation Integrated circuit heat sink support and retention mechanism
US20020118513A1 (en) * 2001-01-04 2002-08-29 Yoshitsugu Koseki Heat sink assembly retainer for electronic integrated circuit package
US6450248B1 (en) * 2001-10-29 2002-09-17 Hoya Tech Co., Ltd. Heat sink retainer
US6636424B2 (en) * 2001-12-05 2003-10-21 Foxconn Precision Components, Co., Ltd. Heat dissipation device
US6611999B1 (en) * 2002-03-28 2003-09-02 Glacialtech, Inc. Detent means for a heat sink
US6600650B1 (en) * 2002-06-11 2003-07-29 Cheng-Ping Lee Fastening device of CPU heat sink
US20040017662A1 (en) * 2002-07-26 2004-01-29 Liu Heben Retaining device for heat sink
US20040052053A1 (en) * 2002-09-13 2004-03-18 Lee Hsieh Kun Clip for heat sink
US7072183B2 (en) * 2003-11-21 2006-07-04 Hon Hai Precision Industry Co., Ltd Locking device for heat dissipating device
US7433194B2 (en) * 2006-12-22 2008-10-07 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink fastening assembly

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130118781A1 (en) * 2011-11-11 2013-05-16 Foxconn Technology Co., Ltd. Electronic device having heat dissipation device
US8686296B2 (en) * 2011-11-11 2014-04-01 Foxconn Technology Co., Ltd. Electronic device having heat dissipation device
US20170105316A1 (en) * 2015-10-13 2017-04-13 Asia Vital Components Co., Ltd. Thermal module assembling structure
US10021813B2 (en) * 2015-10-13 2018-07-10 Asia Vital Components Co., Ltd. Thermal module assembling structure
US11109477B2 (en) * 2019-06-12 2021-08-31 Fuding Precision Components (Shenzhen) Co., Ltd. Heat sink fastening mechanism for use with electrical connector

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AS Assignment

Owner name: COOLER MASTER CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KANG, JEN-HAO;WU, SHUN-ZHANG;SIGNING DATES FROM 20110113 TO 20110117;REEL/FRAME:025864/0233

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION