US20120115411A1 - Air conduction device - Google Patents
Air conduction device Download PDFInfo
- Publication number
- US20120115411A1 US20120115411A1 US12/978,522 US97852210A US2012115411A1 US 20120115411 A1 US20120115411 A1 US 20120115411A1 US 97852210 A US97852210 A US 97852210A US 2012115411 A1 US2012115411 A1 US 2012115411A1
- Authority
- US
- United States
- Prior art keywords
- air conduction
- conduction device
- slanted
- connection board
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present disclosure relates to air conduction devices, and particularly to an air conduction device used in a computer.
- An air conduction device is often used in a computer with a fan to assist in heat dissipation.
- the air conduction device includes an airduct covering the heat generating components of the computer, and a fan installed at or near the inlet of the airduct to generate airflow to dissipate heat from the heat generating components covered by the airduct.
- airflow from the airduct is non-variant, if the heat generating components generate more heat, the components may still be overheated, which may harm the components.
- FIG. 1 is an exploded, isometric view of an air conduction device, and a circuit board with two heat sinks and two heat generating members.
- FIG. 2 is an assembled, isometric view of the air conduction device and the circuit board of FIG. 1 .
- FIGS. 3 and 4 are cross-sectional views of FIG. 2 , but respectively showing different usage states of the air conduction device.
- an air conduction device is provided to dissipate heat from a first heat generating member 10 and a second heat generating member 20 mounted on a circuit board 11 of an electronic apparatus.
- the air conduction device includes a main body 30 , and first and second adjusting members 40 .
- a first heat sink 13 and a second heat sink 14 are mounted to the circuit board 11 .
- the first heat sink 13 is adjacent to the first heat generating member 10 and diagonal to the second heat sink 14 , and aligns with the second heat generating member 20 .
- the second heat sink 14 is adjacent to the second heat generating member 20 , and aligns with the first heat generating member 10 .
- the main body 30 includes a top plate 31 , and two side plates 32 extending downward from opposite sides of the top plate 31 .
- a plurality of protrusions 322 extends from a bottom of each side plate 32 .
- a clapboard 33 extends downward from the top plate 31 , between the side plates 32 , therefore, a first passage 35 and a second passage 34 are formed between the clapboard 33 and the side plates 32 .
- a plurality of protrusions 332 extends from a bottom of the clapboard 33 .
- the top plate 31 defines a substantially trapezoid-shaped cutout 36 communicating with the first passage 35 .
- the cutout 36 includes two opposite slanted sidewalls 362 connected between the clapboard 33 and the corresponding side plate 32 .
- Each slanted sidewall 362 defines a plurality of slots 364 aligned in a slanting line from an upper portion to a lower portion of the slanted sidewall 362 .
- Two bar-shaped guide members 334 extend from the clapboard 33 , facing the cutout 36 . Each guide member 334 is adjacent and parallel to the corresponding slanted sidewall 362 .
- Each adjusting member 40 includes a substantially L-shaped connection portion 42 and a lock portion 44 .
- the connection portion 42 includes a connection board 422 and a guide board 424 substantially extending down from a side of the connection board 422 .
- a depressed portion 426 is defined in the connection potion 42 , extending from a first side of the connection board 42 opposite to the lock portion 44 to the guide board 424 .
- a gap 43 is defined between the connection board 422 and a side of the depressed potion 426 opposite to the guide board 424 .
- the lock portion 44 slantingly extends from a second side of the connection board 422 opposite to the first side, at an angle equaling to the slanting angle of the corresponding slanted sidewall 362 .
- An elastic hook 442 extends from the lock portion 44 .
- connection board 422 of the second adjusting member 40 extends through the gap 43 of the first adjusting member 40 . Therefore, the adjusting members 40 are mounted together, and slidable relative to each other along a length direction of the gap 43 .
- the guide boards 424 can be adjusted to slide to resist against each other.
- the lock portions 44 can be moved towards or away from each other, while the adjusting members 40 are slid.
- the adjusting members 40 are received in the cutout 36 .
- the lock portion 44 of each adjusting member 40 is sandwiched between the guide member 334 and the slanted sidewall 362 , and the lock portion 44 is slidable along the slanted sidewall 362 .
- the elastic hook 442 is selectively engaged in any one of the slots 364 , and the guide boards 424 of the adjusting members 40 abut against an inner side of the side plate 32 . Ends of the adjusting members 40 opposite to the corresponding guide boards 424 resist against the clapboard 33 .
- the protrusions 322 and 332 are engaged in the circuit board 11 , and the main body 30 of the air conduction device covers the first and second heat generating members 10 and 20 , and the first and second heat sinks 13 and 14 .
- the first heat generating member 10 and the second heat sink 14 are accommodated in the second passage 34 .
- the second heat generating member 20 and the first heat sink 13 are accommodated in the first passage 35 , and the cutout 36 of the main body 30 is located above the second heat generating member 20 .
- the adjusting members 40 are slid relative to each other, with the lock portions 44 sliding up or down along the slanted sidewall 362 , to move the connection boards 422 of the adjusting members 40 up or down relative to the second heat generating member 20 . Therefore, a distance between the second heat generating member 20 and the connection boards 422 can be adjusted, to adjust airflow flowing through the first and second passage 35 and 34 .
- the elastic hook 442 of each adjusting member 40 is engaged in a corresponding one of the slots 364 .
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to air conduction devices, and particularly to an air conduction device used in a computer.
- 2. Description of Related Art
- Electronic devices, such as computers, use heat dissipation assemblies for dissipating heat generated by components therein, thus preventing the components from becoming overheated. An air conduction device is often used in a computer with a fan to assist in heat dissipation. The air conduction device includes an airduct covering the heat generating components of the computer, and a fan installed at or near the inlet of the airduct to generate airflow to dissipate heat from the heat generating components covered by the airduct. However, airflow from the airduct is non-variant, if the heat generating components generate more heat, the components may still be overheated, which may harm the components.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an exploded, isometric view of an air conduction device, and a circuit board with two heat sinks and two heat generating members. -
FIG. 2 is an assembled, isometric view of the air conduction device and the circuit board ofFIG. 1 . -
FIGS. 3 and 4 are cross-sectional views ofFIG. 2 , but respectively showing different usage states of the air conduction device. - The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- Referring to
FIGS. 1 and 2 , an air conduction device is provided to dissipate heat from a firstheat generating member 10 and a secondheat generating member 20 mounted on acircuit board 11 of an electronic apparatus. The air conduction device includes amain body 30, and first and second adjustingmembers 40. - A
first heat sink 13 and asecond heat sink 14 are mounted to thecircuit board 11. Thefirst heat sink 13 is adjacent to the firstheat generating member 10 and diagonal to thesecond heat sink 14, and aligns with the secondheat generating member 20. Thesecond heat sink 14 is adjacent to the secondheat generating member 20, and aligns with the firstheat generating member 10. - The
main body 30 includes atop plate 31, and twoside plates 32 extending downward from opposite sides of thetop plate 31. A plurality ofprotrusions 322 extends from a bottom of eachside plate 32. Aclapboard 33 extends downward from thetop plate 31, between theside plates 32, therefore, afirst passage 35 and asecond passage 34 are formed between theclapboard 33 and theside plates 32. A plurality ofprotrusions 332 extends from a bottom of theclapboard 33. Thetop plate 31 defines a substantially trapezoid-shaped cutout 36 communicating with thefirst passage 35. Thecutout 36 includes two oppositeslanted sidewalls 362 connected between theclapboard 33 and thecorresponding side plate 32. Eachslanted sidewall 362 defines a plurality ofslots 364 aligned in a slanting line from an upper portion to a lower portion of theslanted sidewall 362. Two bar-shaped guide members 334 extend from theclapboard 33, facing thecutout 36. Eachguide member 334 is adjacent and parallel to the correspondingslanted sidewall 362. - Each adjusting
member 40 includes a substantially L-shaped connection portion 42 and alock portion 44. Theconnection portion 42 includes aconnection board 422 and aguide board 424 substantially extending down from a side of theconnection board 422. Adepressed portion 426 is defined in theconnection potion 42, extending from a first side of theconnection board 42 opposite to thelock portion 44 to theguide board 424. Agap 43 is defined between theconnection board 422 and a side of thedepressed potion 426 opposite to theguide board 424. - The
lock portion 44 slantingly extends from a second side of theconnection board 422 opposite to the first side, at an angle equaling to the slanting angle of the correspondingslanted sidewall 362. Anelastic hook 442 extends from thelock portion 44. - Referring to
FIG. 2 , in assembly, theconnection board 422 of the second adjustingmember 40 extends through thegap 43 of the first adjustingmember 40. Therefore, the adjustingmembers 40 are mounted together, and slidable relative to each other along a length direction of thegap 43. Theguide boards 424 can be adjusted to slide to resist against each other. Thelock portions 44 can be moved towards or away from each other, while the adjustingmembers 40 are slid. The adjustingmembers 40 are received in thecutout 36. Thelock portion 44 of each adjustingmember 40 is sandwiched between theguide member 334 and theslanted sidewall 362, and thelock portion 44 is slidable along theslanted sidewall 362. Theelastic hook 442 is selectively engaged in any one of theslots 364, and theguide boards 424 of the adjustingmembers 40 abut against an inner side of theside plate 32. Ends of the adjustingmembers 40 opposite to thecorresponding guide boards 424 resist against theclapboard 33. - In use, the
protrusions circuit board 11, and themain body 30 of the air conduction device covers the first and secondheat generating members heat generating member 10 and thesecond heat sink 14 are accommodated in thesecond passage 34. The secondheat generating member 20 and thefirst heat sink 13 are accommodated in thefirst passage 35, and thecutout 36 of themain body 30 is located above the secondheat generating member 20. - Referring to
FIGS. 3 and 4 , the adjustingmembers 40 are slid relative to each other, with thelock portions 44 sliding up or down along theslanted sidewall 362, to move theconnection boards 422 of the adjustingmembers 40 up or down relative to the secondheat generating member 20. Therefore, a distance between the secondheat generating member 20 and theconnection boards 422 can be adjusted, to adjust airflow flowing through the first andsecond passage members 40 are moved to an appropriate height, theelastic hook 442 of each adjustingmember 40 is engaged in a corresponding one of theslots 364. - It is believed that the present embodiments and theirs advantages will be understood from the foregoing description, and they will be apparent that various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of their material advantages, the examples hereinbefore described merely being exemplary embodiment.
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105388443A CN102467194A (en) | 2010-11-10 | 2010-11-10 | Air director |
CN201010538844.3 | 2010-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120115411A1 true US20120115411A1 (en) | 2012-05-10 |
Family
ID=46020059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/978,522 Abandoned US20120115411A1 (en) | 2010-11-10 | 2010-12-24 | Air conduction device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120115411A1 (en) |
CN (1) | CN102467194A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130052934A1 (en) * | 2011-08-25 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Air guiding device |
US20200060042A1 (en) * | 2018-08-16 | 2020-02-20 | Wistron Corporation | Apparatus case with a rotatable airflow-blocking portion and server therewith |
US20230051861A1 (en) * | 2020-02-14 | 2023-02-16 | Hewlett-Packard Development Company, L.P. | Sizeable conduits |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104470320A (en) * | 2013-09-25 | 2015-03-25 | 鸿富锦精密电子(天津)有限公司 | Main board module |
CN105022464A (en) * | 2015-07-23 | 2015-11-04 | 浪潮电子信息产业股份有限公司 | Heat sink optimization design method based on heat flow channel for Rack |
Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6400568B1 (en) * | 2001-07-11 | 2002-06-04 | Sun Microsystems, Inc. | Method and apparatus for cooling electronic components |
US6736196B2 (en) * | 2002-01-30 | 2004-05-18 | Hon Hai Precision Ind. Co., Ltd. | Fan duct assembly |
US6822863B1 (en) * | 2003-08-18 | 2004-11-23 | Dell Products L.P. | Airflow shroud mounted fan system and method for cooling information handling system components |
US6970353B2 (en) * | 2003-05-29 | 2005-11-29 | Sun Microsystems, Inc. | Fan holder and components cooling duct assembly |
US7492590B2 (en) * | 2006-12-15 | 2009-02-17 | Hong Fu Jin Pecision Industry (Shenzhen) Co., Ltd. | Computer enclosure |
US7508664B2 (en) * | 2006-07-28 | 2009-03-24 | International Business Machines Corporation | Mechanical assembly to support orthogonal airflow devices in a normal airflow slot of a server chassis |
US7643292B1 (en) * | 2008-12-23 | 2010-01-05 | Chenbro Micom Co., Ltd. | Adjustable air director |
US20100238626A1 (en) * | 2008-09-18 | 2010-09-23 | Linhares Jr Manuel D | Modular Air Management Devices |
US7839631B2 (en) * | 2008-07-07 | 2010-11-23 | Hon Hai Precision Industry Co., Ltd. | Computer enclosure with airflow-guiding device |
US20110043450A1 (en) * | 2009-08-21 | 2011-02-24 | Hong Fu Jin Precision Industry (Shenzhen) Co. Ltd. | Computer mouse |
US7965505B2 (en) * | 2009-10-09 | 2011-06-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guiding cover |
US20110171899A1 (en) * | 2010-01-08 | 2011-07-14 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Airflow guide |
US8068341B2 (en) * | 2009-10-28 | 2011-11-29 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Electronic device with expansion card and holder |
US8077459B2 (en) * | 2009-10-29 | 2011-12-13 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Electronic device with expansion card |
US8081444B2 (en) * | 2009-10-14 | 2011-12-20 | Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. | Computer system with airflow guiding duct |
US8102651B2 (en) * | 2009-10-02 | 2012-01-24 | International Business Machines Corporation | Airflow barriers for efficient cooling of memory modules |
US20120058718A1 (en) * | 2010-09-02 | 2012-03-08 | Hon Hai Precision Industry Co., Ltd. | Fan duct |
US20120080986A1 (en) * | 2010-09-30 | 2012-04-05 | Hon Hai Precision Industry Co., Ltd. | Computer enclosure |
US20130029584A1 (en) * | 2011-07-26 | 2013-01-31 | Hon Hai Precision Industry Co., Ltd. | Airflow guide cover |
US20130052934A1 (en) * | 2011-08-25 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Air guiding device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201174851Y (en) * | 2008-04-02 | 2008-12-31 | 英业达股份有限公司 | Wind guiding cover |
CN201444275U (en) * | 2009-08-05 | 2010-04-28 | 浪潮电子信息产业股份有限公司 | Sliding adjustable wind scooper |
-
2010
- 2010-11-10 CN CN2010105388443A patent/CN102467194A/en active Pending
- 2010-12-24 US US12/978,522 patent/US20120115411A1/en not_active Abandoned
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6400568B1 (en) * | 2001-07-11 | 2002-06-04 | Sun Microsystems, Inc. | Method and apparatus for cooling electronic components |
US6736196B2 (en) * | 2002-01-30 | 2004-05-18 | Hon Hai Precision Ind. Co., Ltd. | Fan duct assembly |
US6970353B2 (en) * | 2003-05-29 | 2005-11-29 | Sun Microsystems, Inc. | Fan holder and components cooling duct assembly |
US6822863B1 (en) * | 2003-08-18 | 2004-11-23 | Dell Products L.P. | Airflow shroud mounted fan system and method for cooling information handling system components |
US7508664B2 (en) * | 2006-07-28 | 2009-03-24 | International Business Machines Corporation | Mechanical assembly to support orthogonal airflow devices in a normal airflow slot of a server chassis |
US7492590B2 (en) * | 2006-12-15 | 2009-02-17 | Hong Fu Jin Pecision Industry (Shenzhen) Co., Ltd. | Computer enclosure |
US7839631B2 (en) * | 2008-07-07 | 2010-11-23 | Hon Hai Precision Industry Co., Ltd. | Computer enclosure with airflow-guiding device |
US20100238626A1 (en) * | 2008-09-18 | 2010-09-23 | Linhares Jr Manuel D | Modular Air Management Devices |
US8355246B2 (en) * | 2008-09-18 | 2013-01-15 | Linhares Jr Manuel D | Modular air management devices |
US7643292B1 (en) * | 2008-12-23 | 2010-01-05 | Chenbro Micom Co., Ltd. | Adjustable air director |
US20110043450A1 (en) * | 2009-08-21 | 2011-02-24 | Hong Fu Jin Precision Industry (Shenzhen) Co. Ltd. | Computer mouse |
US8102651B2 (en) * | 2009-10-02 | 2012-01-24 | International Business Machines Corporation | Airflow barriers for efficient cooling of memory modules |
US7965505B2 (en) * | 2009-10-09 | 2011-06-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guiding cover |
US8081444B2 (en) * | 2009-10-14 | 2011-12-20 | Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. | Computer system with airflow guiding duct |
US8068341B2 (en) * | 2009-10-28 | 2011-11-29 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Electronic device with expansion card and holder |
US8077459B2 (en) * | 2009-10-29 | 2011-12-13 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Electronic device with expansion card |
US20110171899A1 (en) * | 2010-01-08 | 2011-07-14 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Airflow guide |
US20120058718A1 (en) * | 2010-09-02 | 2012-03-08 | Hon Hai Precision Industry Co., Ltd. | Fan duct |
US20120080986A1 (en) * | 2010-09-30 | 2012-04-05 | Hon Hai Precision Industry Co., Ltd. | Computer enclosure |
US20130029584A1 (en) * | 2011-07-26 | 2013-01-31 | Hon Hai Precision Industry Co., Ltd. | Airflow guide cover |
US20130052934A1 (en) * | 2011-08-25 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Air guiding device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130052934A1 (en) * | 2011-08-25 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Air guiding device |
US20200060042A1 (en) * | 2018-08-16 | 2020-02-20 | Wistron Corporation | Apparatus case with a rotatable airflow-blocking portion and server therewith |
US10813245B2 (en) * | 2018-08-16 | 2020-10-20 | Wistron Corporation | Apparatus case with a rotatable airflow-blocking portion and server therewith |
US20230051861A1 (en) * | 2020-02-14 | 2023-02-16 | Hewlett-Packard Development Company, L.P. | Sizeable conduits |
Also Published As
Publication number | Publication date |
---|---|
CN102467194A (en) | 2012-05-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHAN, HUNG-CHOU;YE, ZHEN-XING;ZHANG, ZI-XUAN;AND OTHERS;REEL/FRAME:025568/0318 Effective date: 20101223 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHAN, HUNG-CHOU;YE, ZHEN-XING;ZHANG, ZI-XUAN;AND OTHERS;REEL/FRAME:025568/0318 Effective date: 20101223 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |