US20110171899A1 - Airflow guide - Google Patents
Airflow guide Download PDFInfo
- Publication number
- US20110171899A1 US20110171899A1 US12/764,965 US76496510A US2011171899A1 US 20110171899 A1 US20110171899 A1 US 20110171899A1 US 76496510 A US76496510 A US 76496510A US 2011171899 A1 US2011171899 A1 US 2011171899A1
- Authority
- US
- United States
- Prior art keywords
- sidewall
- airflow guide
- sliding
- duct
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 210000002105 tongue Anatomy 0.000 claims description 5
- 230000015654 memory Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present disclosure relates to an airflow guide.
- a thermal design for a desktop computer only primary heat generating elements of a motherboard, such as a central processing unit (CPU), require dedicated cooling for dissipating heat.
- a fan, a heat sink, and/or an airflow guide is/are commonly provided for a CPU for dissipating heat.
- DDR double date rate
- FIGS. 1 to 3 are isometric views of an embodiment of an airflow guide in different states.
- FIG. 4 is an inverted view of FIG. 1 .
- FIG. 5 shows the airflow guide in FIG. 3 in use.
- an embodiment of an airflow guide 10 includes a main duct 20 , and a sub-duct 30 .
- the main duct 20 includes a top surface 23 , a first sidewall 21 , and a second sidewall 22 .
- the first sidewall 21 and the second sidewall 22 depend from opposite sides of the top surface 23 , respectively.
- the top surface 23 , the first sidewall 21 , and the second sidewall 22 cooperatively bound a channel for airflow.
- An air intake 28 of the channel is formed at a first end of the main duct 20 .
- An air outlet 29 of the channel is formed at a second end of the main duct 20 , opposite to the first end of the main duct 20 .
- a rectangular opening 40 is defined in the first sidewall 21 .
- Two opposite raised bars 50 extend horizontally from an outer surface of the first sidewall 21 , and are located between the opening 40 and the air intake 28 .
- a sliding groove 500 is defined in each raised bar 50 .
- the sub-duct 30 includes a sliding portion 60 , and a rotating portion 70 .
- the sliding portion 60 includes a rectangular main body 61 .
- the main body 61 is mounted between the raised bars 50 of the first sidewall 21 of the main duct 20 .
- Two sliding tongues 62 extend from a top side and a bottom side of the main body 61 at a first end of the main body 61 adjacent to the air intake 28 , respectively, and are received in the corresponding sliding grooves 500 of the raised bars 50 . Therefore, the main body 61 is slidable between the first and second ends of the main duct 20 relative to the first sidewall 21 , via action of the sliding tongues 62 in the corresponding sliding grooves 500 .
- the rotating portion 70 includes a side sheet 71 , and a top sheet 72 .
- the side sheet 71 has a shape corresponding to and precisely covering the opening 40 of the main duct 20 .
- a first end of the side sheet 71 is rotatably mounted to a second end of the main body 61 opposite to the first end of the main body 61 , wherein the side sheet 71 rotates parallel to the movement axis of the main body 61 , so that the rotating portion 70 opens and closes relative to the first sidewall 21 of the main duct 20 .
- the rotating portion 70 is closed (as shown FIGS. 1 and 4 )
- the side sheet 71 covers the opening 40 of the first sidewall 21 .
- the top sheet 72 is generally quadrant-shaped with a center located at the rotation axis of the side sheet 71 , and extends from a top side of the side sheet 71 into the main duct 20 .
- the airflow guide 10 may be mounted to a motherboard 80 , wherein the top surface 23 of the main duct 20 is opposite to the motherboard 80 , and the air outlet 29 of the main duct 20 faces a heat sink 81 of a central processing unit (CPU) (not shown).
- a fan 90 is mounted to the air intake 28 of the main duct 20 . When the fan 90 operates, airflow is guided by the main duct 20 over the heat sink 81 for dissipating heat generated from the CPU. When other elements, taking memories 82 as an example, require dissipation of heat, the rotating portion 70 of the sub-duct 30 rotates out of the opening 40 to open (as shown in FIGS. 2 , 3 , and 5 ).
- an opening angle of the rotating portion 70 can be adjusted according to the number of memories 82 .
- the sliding portion 60 of the sub-duct 30 can adjust a distance between the rotating portion 70 and the memories 82 .
- the airflow guide 10 can dissipate heat from the CPU via the main duct 20 , as well as from other elements via the sub-duct 30 as needed.
- the airflow guide 10 is practical and versatile, and has low cost.
- action of the sliding portion 60 of the sub-duct 30 can alternatively be accomplished as follows.
- the sliding grooves 500 and the sliding tongues 62 may be interchanged, such as the sliding grooves 500 may be defined in the main body 61 of the sliding portion 60 , and the sliding tongues 62 may extend from the raised bars 50 of the main duct 20 into the corresponding sliding grooves 500 .
- the raised bars 50 together with the sliding grooves 500 may be omitted entirely and a slot directly defined in the first sidewall 21 , with a sliding piece extending from the main body 61 of the sliding portion 60 and received in the slot.
- the sliding portion 60 may be immovably mounted to the first sidewall 21 of the main duct 20 , or the sliding portion 60 and the raised bar 50 may be omitted and the rotating portion 70 may be rotatably mounted to the first sidewall 21 directly.
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Air-Flow Control Members (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to an airflow guide.
- 2. Description of Related Art
- In a thermal design for a desktop computer, only primary heat generating elements of a motherboard, such as a central processing unit (CPU), require dedicated cooling for dissipating heat. For example, a fan, a heat sink, and/or an airflow guide is/are commonly provided for a CPU for dissipating heat.
- In fact, processing ability of computers has rapidly advanced, heat generated from other elements of the motherboard, such as a Southbridge and hard disks, has increased. Therefore, dedicated cooling for these elements may be required. As an example, a motherboard can support double date rate (DDR) memories, such as DDR2 and DDR3. If only DDR2 memory is present, no dedicated cooling is required, since heat generated therefrom is minimal If DDR3 memory is employed, dedicated cooling may be required, due to increased heat generated from the DDR3. However, such dedicated cooling solely for DDR3 memory is uneconomical, and not easily provided.
-
FIGS. 1 to 3 are isometric views of an embodiment of an airflow guide in different states. -
FIG. 4 is an inverted view ofFIG. 1 . -
FIG. 5 shows the airflow guide inFIG. 3 in use. - Referring to
FIGS. 1 to 4 , an embodiment of anairflow guide 10 includes amain duct 20, and asub-duct 30. - The
main duct 20 includes atop surface 23, afirst sidewall 21, and asecond sidewall 22. Thefirst sidewall 21 and thesecond sidewall 22 depend from opposite sides of thetop surface 23, respectively. Thetop surface 23, thefirst sidewall 21, and thesecond sidewall 22 cooperatively bound a channel for airflow. Anair intake 28 of the channel is formed at a first end of themain duct 20. Anair outlet 29 of the channel is formed at a second end of themain duct 20, opposite to the first end of themain duct 20. Arectangular opening 40 is defined in thefirst sidewall 21. Two opposite raisedbars 50 extend horizontally from an outer surface of thefirst sidewall 21, and are located between theopening 40 and theair intake 28. Asliding groove 500 is defined in each raisedbar 50. - The
sub-duct 30 includes a slidingportion 60, and a rotatingportion 70. The slidingportion 60 includes a rectangularmain body 61. Themain body 61 is mounted between the raisedbars 50 of thefirst sidewall 21 of themain duct 20. Two slidingtongues 62 extend from a top side and a bottom side of themain body 61 at a first end of themain body 61 adjacent to theair intake 28, respectively, and are received in the correspondingsliding grooves 500 of the raisedbars 50. Therefore, themain body 61 is slidable between the first and second ends of themain duct 20 relative to thefirst sidewall 21, via action of thesliding tongues 62 in the correspondingsliding grooves 500. The rotatingportion 70 includes aside sheet 71, and atop sheet 72. Theside sheet 71 has a shape corresponding to and precisely covering the opening 40 of themain duct 20. A first end of theside sheet 71 is rotatably mounted to a second end of themain body 61 opposite to the first end of themain body 61, wherein theside sheet 71 rotates parallel to the movement axis of themain body 61, so that therotating portion 70 opens and closes relative to thefirst sidewall 21 of themain duct 20. When the rotatingportion 70 is closed (as shownFIGS. 1 and 4 ), theside sheet 71 covers the opening 40 of thefirst sidewall 21. Thetop sheet 72 is generally quadrant-shaped with a center located at the rotation axis of theside sheet 71, and extends from a top side of theside sheet 71 into themain duct 20. - Referring to
FIG. 5 , in use, theairflow guide 10 may be mounted to amotherboard 80, wherein thetop surface 23 of themain duct 20 is opposite to themotherboard 80, and theair outlet 29 of themain duct 20 faces aheat sink 81 of a central processing unit (CPU) (not shown). Afan 90 is mounted to theair intake 28 of themain duct 20. When thefan 90 operates, airflow is guided by themain duct 20 over theheat sink 81 for dissipating heat generated from the CPU. When other elements, takingmemories 82 as an example, require dissipation of heat, the rotatingportion 70 of thesub-duct 30 rotates out of theopening 40 to open (as shown inFIGS. 2 , 3, and 5). Accordingly, airflow is guided by thesub-duct 30 over thememories 82, dissipating heat therefrom. Furthermore, an opening angle of the rotatingportion 70 can be adjusted according to the number ofmemories 82. The slidingportion 60 of thesub-duct 30 can adjust a distance between the rotatingportion 70 and thememories 82. - Accordingly, the
airflow guide 10 can dissipate heat from the CPU via themain duct 20, as well as from other elements via thesub-duct 30 as needed. Theairflow guide 10 is practical and versatile, and has low cost. - In other embodiments, action of the sliding
portion 60 of thesub-duct 30 can alternatively be accomplished as follows. Thesliding grooves 500 and the slidingtongues 62 may be interchanged, such as thesliding grooves 500 may be defined in themain body 61 of thesliding portion 60, and the slidingtongues 62 may extend from the raisedbars 50 of themain duct 20 into the correspondingsliding grooves 500. In another example, the raisedbars 50 together with thesliding grooves 500 may be omitted entirely and a slot directly defined in thefirst sidewall 21, with a sliding piece extending from themain body 61 of thesliding portion 60 and received in the slot. - In other embodiments, the
sliding portion 60 may be immovably mounted to thefirst sidewall 21 of themain duct 20, or the slidingportion 60 and the raisedbar 50 may be omitted and the rotatingportion 70 may be rotatably mounted to thefirst sidewall 21 directly. - It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclose to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010300114.XA CN102122201B (en) | 2010-01-08 | 2010-01-08 | Wind guide device |
CN201010300114.X | 2010-01-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110171899A1 true US20110171899A1 (en) | 2011-07-14 |
Family
ID=44250770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/764,965 Abandoned US20110171899A1 (en) | 2010-01-08 | 2010-04-22 | Airflow guide |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110171899A1 (en) |
CN (1) | CN102122201B (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120115411A1 (en) * | 2010-11-10 | 2012-05-10 | Hon Hai Precision Industry Co., Ltd. | Air conduction device |
US20130052934A1 (en) * | 2011-08-25 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Air guiding device |
US20130250517A1 (en) * | 2012-03-22 | 2013-09-26 | Wen-Hsiung Yang | Heat dissipating module having enhanced heat dissipating efficiency |
US20140318648A1 (en) * | 2013-04-24 | 2014-10-30 | Hon Hai Precision Industry Co., Ltd. | Chassis with air guiding member |
US20140334093A1 (en) * | 2013-05-10 | 2014-11-13 | Hon Hai Precision Industry Co., Ltd. | Electronic device with air duct |
US20160224079A1 (en) * | 2015-02-02 | 2016-08-04 | International Business Machines Corporation | Implementing dimm air flow baffle |
JP2017022268A (en) * | 2015-07-10 | 2017-01-26 | 富士通株式会社 | Electronic apparatus |
US9961796B1 (en) * | 2016-11-02 | 2018-05-01 | Inventec (Pudong) Technology Corporation | Server |
US10372176B2 (en) * | 2018-01-03 | 2019-08-06 | Dell Products, Lp | Information handling system with a common air duct for multiple air flow guiding configurations |
US11249523B2 (en) * | 2020-05-06 | 2022-02-15 | Quanta Computer Inc. | Adjustable air baffle for directing air flow in a computer system |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103135719A (en) * | 2011-12-05 | 2013-06-05 | 鸿富锦精密工业(深圳)有限公司 | Electronic device |
JP5920074B2 (en) * | 2012-07-12 | 2016-05-18 | 富士通株式会社 | Cooling method of electronic equipment and heat generating parts |
CN104142720A (en) * | 2013-05-09 | 2014-11-12 | 鸿富锦精密工业(深圳)有限公司 | Air director |
CN109189193B (en) * | 2018-11-28 | 2024-04-09 | 郑州云海信息技术有限公司 | Air guide device and air guide method for realizing uniform distribution of airflow in chassis |
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USD296834S (en) * | 1985-02-15 | 1988-07-19 | Mcdermott Danile R | Trash chute |
US5733191A (en) * | 1995-01-31 | 1998-03-31 | Lam; Peter K. F. | Directional vent register |
US6736196B2 (en) * | 2002-01-30 | 2004-05-18 | Hon Hai Precision Ind. Co., Ltd. | Fan duct assembly |
US20070091566A1 (en) * | 2005-10-24 | 2007-04-26 | Hon Hai Precision Industry Co., Ltd. | Fan duct and heat dissipation module comprising the same |
US20080101018A1 (en) * | 2006-10-27 | 2008-05-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080160899A1 (en) * | 2006-03-06 | 2008-07-03 | Henry Matthew S | Methods for Distributing Air in a Blade Server |
US7835149B2 (en) * | 2008-10-22 | 2010-11-16 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Computer enclosure with airflow guide |
US20110083832A1 (en) * | 2009-10-14 | 2011-04-14 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating blower |
US20110189935A1 (en) * | 2010-02-04 | 2011-08-04 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guide |
US20120026680A1 (en) * | 2010-07-27 | 2012-02-02 | Hon Hai Precision Industry Co., Ltd. | Air duct and electronic device incorporating the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6253834B1 (en) * | 1998-10-28 | 2001-07-03 | Hewlett-Packard Company | Apparatus to enhance cooling of electronic device |
-
2010
- 2010-01-08 CN CN201010300114.XA patent/CN102122201B/en not_active Expired - Fee Related
- 2010-04-22 US US12/764,965 patent/US20110171899A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD296834S (en) * | 1985-02-15 | 1988-07-19 | Mcdermott Danile R | Trash chute |
US5733191A (en) * | 1995-01-31 | 1998-03-31 | Lam; Peter K. F. | Directional vent register |
US6736196B2 (en) * | 2002-01-30 | 2004-05-18 | Hon Hai Precision Ind. Co., Ltd. | Fan duct assembly |
US20070091566A1 (en) * | 2005-10-24 | 2007-04-26 | Hon Hai Precision Industry Co., Ltd. | Fan duct and heat dissipation module comprising the same |
US20080160899A1 (en) * | 2006-03-06 | 2008-07-03 | Henry Matthew S | Methods for Distributing Air in a Blade Server |
US20080101018A1 (en) * | 2006-10-27 | 2008-05-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7835149B2 (en) * | 2008-10-22 | 2010-11-16 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Computer enclosure with airflow guide |
US20110083832A1 (en) * | 2009-10-14 | 2011-04-14 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating blower |
US20110189935A1 (en) * | 2010-02-04 | 2011-08-04 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guide |
US20120026680A1 (en) * | 2010-07-27 | 2012-02-02 | Hon Hai Precision Industry Co., Ltd. | Air duct and electronic device incorporating the same |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120115411A1 (en) * | 2010-11-10 | 2012-05-10 | Hon Hai Precision Industry Co., Ltd. | Air conduction device |
US20130052934A1 (en) * | 2011-08-25 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Air guiding device |
US9235242B2 (en) * | 2012-03-22 | 2016-01-12 | Wistron Corporation | Heat dissipating module having enhanced heat dissipating efficiency |
US20130250517A1 (en) * | 2012-03-22 | 2013-09-26 | Wen-Hsiung Yang | Heat dissipating module having enhanced heat dissipating efficiency |
US9723749B2 (en) * | 2013-04-24 | 2017-08-01 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Chassis with air guiding member |
US20140318648A1 (en) * | 2013-04-24 | 2014-10-30 | Hon Hai Precision Industry Co., Ltd. | Chassis with air guiding member |
US20140334093A1 (en) * | 2013-05-10 | 2014-11-13 | Hon Hai Precision Industry Co., Ltd. | Electronic device with air duct |
US20160224079A1 (en) * | 2015-02-02 | 2016-08-04 | International Business Machines Corporation | Implementing dimm air flow baffle |
US20160223222A1 (en) * | 2015-02-02 | 2016-08-04 | International Business Machines Corporation | Implementing dimm air flow baffle |
US9915987B2 (en) * | 2015-02-02 | 2018-03-13 | International Business Machines Corporation | Implementing DIMM air flow baffle |
US9921623B2 (en) * | 2015-02-02 | 2018-03-20 | International Business Machines Corporation | Implementing DIMM air flow baffle |
JP2017022268A (en) * | 2015-07-10 | 2017-01-26 | 富士通株式会社 | Electronic apparatus |
US9961796B1 (en) * | 2016-11-02 | 2018-05-01 | Inventec (Pudong) Technology Corporation | Server |
US10372176B2 (en) * | 2018-01-03 | 2019-08-06 | Dell Products, Lp | Information handling system with a common air duct for multiple air flow guiding configurations |
US11249523B2 (en) * | 2020-05-06 | 2022-02-15 | Quanta Computer Inc. | Adjustable air baffle for directing air flow in a computer system |
Also Published As
Publication number | Publication date |
---|---|
CN102122201A (en) | 2011-07-13 |
CN102122201B (en) | 2013-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YE, ZHEN-XING;TANG, XIAN-XIU;REEL/FRAME:024268/0519 Effective date: 20100419 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YE, ZHEN-XING;TANG, XIAN-XIU;REEL/FRAME:024268/0519 Effective date: 20100419 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |