CN105022464A - Heat sink optimization design method based on heat flow channel for Rack - Google Patents
Heat sink optimization design method based on heat flow channel for Rack Download PDFInfo
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- CN105022464A CN105022464A CN201510438404.3A CN201510438404A CN105022464A CN 105022464 A CN105022464 A CN 105022464A CN 201510438404 A CN201510438404 A CN 201510438404A CN 105022464 A CN105022464 A CN 105022464A
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005457 optimization Methods 0.000 title abstract description 4
- 230000005855 radiation Effects 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000006260 foam Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 3
- 230000006866 deterioration Effects 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013316 zoning Methods 0.000 description 1
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Abstract
The invention provides a heat sink optimal design method based on a heat flow channel for Rack, which comprises the following steps: 1) evaluating a heat flow channel according to the layout of the 1U nodes, and confirming a main heat flow channel influencing heat dissipation, wherein for the 1U nodes, the hard disk area and the computing mainboard are arranged in parallel, and the important heat flow channel is mainly a heat flow channel passing through a CPU (central processing unit) radiator on the computing mainboard and the heat flow channel of the hard disk area; 2) the optimized design direction of the radiator is judged through the adjustment of the heat dissipation flow of different heat flow channels, and the flow resistance characteristic of the heat flow channel is changed by using a structural member, so that the adjustment of the heat dissipation air quantity in the heat flow channel is realized; along with the change of the heat dissipation air volume in the heat flow channel, the temperature of a main device in the heat flow channel can be obtained through a temperature test means, so that the condition of the radiator is judged; 3) and according to the design direction of the radiator, finishing the optimized design of the radiator structure. The invention can quickly, simply and conveniently realize the optimization of the radiator structure, thereby improving the radiating condition of the 1U node.
Description
Technical field
The present invention relates to a kind of Optimization Design of heating radiator, specifically a kind of Optimal design of heat sinks method based on heat passage for Rack.
Background technology
Along with the development of Electronic Encapsulating Technology and the lifting of server design level, 1U node often configures the calculating mainboard of increasing hard disk and powerful, to realize the storage that requires day by day to increase and calculated performance.In order to meet Rack product design requirement, often for the special hard disk memory region of 1U node division and zoning.This patent by the heat passage of assessment 1U node layout, can determine the optimal design direction of heating radiator, thus determines best heat spreader structures, improves the heat radiation of 1U node.
Summary of the invention
Technical assignment of the present invention solves the deficiencies in the prior art, provides a kind of Optimal design of heat sinks method based on heat passage for Rack.
Technical scheme of the present invention realizes in the following manner:
For the Optimal design of heat sinks method based on heat passage of Rack, the method comprises the following steps:
1) according to 1U node layout, assessment heat passage, confirms the heat passage of main impact heat radiation, for 1U node, hard disk district and calculating mainboard laid out in parallel, therefore, important heat passage is mainly and calculates on mainboard by the heat passage of cpu heat and the heat passage in hard disk district;
2) by the adjustment of different heat passage heat radiation flow, Optimal design of heat sinks direction is judged;
3) according to the design direction of heating radiator, the optimal design of heat spreader structures is completed.
Above-mentioned steps 2) in, after the two large heat passages confirming 1U node, in order to improve the heat radiation calculating CPU on mainboard, hard disk district heat passage need be reduced, thus make mainboard cpu heat obtain larger heat radiation air quantity; Based on such thinking, can structural member be used, as foam, wind deflector, change the flow resistance characteristic of heat passage, thus realize the adjustment of heat radiation air quantity in heat passage; Along with the change of the air quantity that dispels the heat in heat passage, the temperature of main devices in heat passage can be obtained by the means of temperature test, thus judge heating radiator situation.
Above-mentioned steps 3) in by comparison CPU heat passage regulate before and after temperature, if cpu temperature improves significantly, then show that current heat spreader structures is close to optimal design, because, the structure of heating radiator both met cooling requirements, did not also cause air quantity of fan to decline because heat radiation air quantity increases.If cpu temperature does not improve significantly, even occurred deterioration, then show that the structure of heating radiator is too tight, the heat radiation air quantity causing fan to provide declines, and the spacing of fin of heating radiator should be increased; Repeat same method, improve until obtain heat radiation.
A kind of beneficial effect compared with prior art produced based on the Optimal design of heat sinks method of heat passage for Rack of the present invention is:
The present invention is by using structural member, as foam, wind deflector, change the flow resistance characteristic of heat passage, thus realize the adjustment of heat radiation air quantity in heat passage, along with the change of the air quantity that dispels the heat in heat passage, the temperature of main devices in heat passage can be obtained by the means of temperature test, thus judge heating radiator situation; The present invention can realize the optimization of heat spreader structures fast, easily, thus improves the heat dissipating state of 1U node.
Embodiment
Below a kind of Optimal design of heat sinks method based on heat passage for Rack of the present invention is described in detail below.
A kind of Optimal design of heat sinks method based on heat passage for Rack of the present invention, the method comprises the following steps:
1) according to 1U node layout, assessment heat passage, confirms the heat passage of main impact heat radiation, for 1U node, hard disk district and calculating mainboard laid out in parallel, therefore, important heat passage is mainly and calculates on mainboard by the heat passage of cpu heat and the heat passage in hard disk district.
2) by the adjustment of different heat passage heat radiation flow, Optimal design of heat sinks direction is judged; After the two large heat passages confirming 1U node, in order to improve the heat radiation calculating CPU on mainboard, hard disk district heat passage need be reduced, thus make mainboard cpu heat obtain larger heat radiation air quantity; Based on such thinking, can structural member be used, as foam, wind deflector, change the flow resistance characteristic of heat passage, thus realize the adjustment of heat radiation air quantity in heat passage; Along with the change of the air quantity that dispels the heat in heat passage, the temperature of main devices in heat passage can be obtained by the means of temperature test, thus judge heating radiator situation.
3) according to the design direction of heating radiator, complete the optimal design of heat spreader structures, by the temperature of comparison CPU before and after heat passage regulates, if cpu temperature improves significantly, then show that current heat spreader structures is close to optimal design, because the structure of heating radiator both met cooling requirements, also air quantity of fan was not caused to decline because heat radiation air quantity increases.If cpu temperature does not improve significantly, even occurred deterioration, then show that the structure of heating radiator is too tight, the heat radiation air quantity causing fan to provide declines, and the spacing of fin of heating radiator should be increased; Repeat same method, improve until obtain heat radiation.
Method for designing of the present invention comprises the assessment of (1) 1U node heat passage layout; (2) regulate heat passage, judge Optimal design of heat sinks direction; (3) optimize heat spreader structures, improve node dispel the heat three parts composition.
Wherein, in step 2) in, regulate heat passage, judge Optimal design of heat sinks direction: for 1U node, by foam shutoff hard disk district heat passage, the air quantity that makes more to dispel the heat enters calculating mainboard heat passage.Two cpu temperatures on mainboard, CPU0 temperature raises, and CPU1 temperature reduces.This situation shows, the structure of heating radiator is comparatively tight, and the heat radiation air quantity causing system fan to provide reduces, and should improve the dense degree of heat radiator fin, increases spacing of fin.
Optimize heat spreader structures, improve node heat radiation: according to the situation of change of cpu temperature, determine increase heat radiator fin spacing.Therefore, change heat radiator fin spacing and increase twice trendy heating radiator, again test the temperature of two CPU, all had obvious improvement.
Following table 1 is the cpu test data in whole heating radiator optimizing process
Table 1
Claims (3)
1., for the Optimal design of heat sinks method based on heat passage of Rack, it is characterized in that, the method comprises the following steps:
1) according to 1U node layout, assessment heat passage, confirms the heat passage of main impact heat radiation, for 1U node, hard disk district and calculating mainboard laid out in parallel, therefore, important heat passage is mainly and calculates on mainboard by the heat passage of cpu heat and the heat passage in hard disk district;
2) by the adjustment of different heat passage heat radiation flow, Optimal design of heat sinks direction is judged;
3) according to the design direction of heating radiator, the optimal design of heat spreader structures is completed.
2. a kind of Optimal design of heat sinks method based on heat passage for Rack according to claim 1, it is characterized in that, above-mentioned steps 2) in, after the two large heat passages confirming 1U node, in order to improve the heat radiation calculating CPU on mainboard, hard disk district heat passage need be reduced, thus make mainboard cpu heat obtain larger heat radiation air quantity; Based on such thinking, can structural member be used, as foam, wind deflector, change the flow resistance characteristic of heat passage, thus realize the adjustment of heat radiation air quantity in heat passage; Along with the change of the air quantity that dispels the heat in heat passage, the temperature of main devices in heat passage can be obtained by the means of temperature test, thus judge heating radiator situation.
3. a kind of Optimal design of heat sinks method based on heat passage for Rack according to claim 1, it is characterized in that, above-mentioned steps 3) in by comparison CPU heat passage regulate before and after temperature, if cpu temperature improves significantly, then show that current heat spreader structures is close to optimal design, because the structure of heating radiator both met cooling requirements, also air quantity of fan was not caused to decline because heat radiation air quantity increases; If cpu temperature does not improve significantly, even occurred deterioration, then show that the structure of heating radiator is too tight, the heat radiation air quantity causing fan to provide declines, and the spacing of fin of heating radiator should be increased; Repeat same method, improve until obtain heat radiation.
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| CN201510438404.3A CN105022464A (en) | 2015-07-23 | 2015-07-23 | Heat sink optimization design method based on heat flow channel for Rack |
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| CN201510438404.3A CN105022464A (en) | 2015-07-23 | 2015-07-23 | Heat sink optimization design method based on heat flow channel for Rack |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112613248A (en) * | 2020-12-25 | 2021-04-06 | 北京大学 | Method and system for improving embedded micro-fluid structure design |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6813149B2 (en) * | 2001-06-29 | 2004-11-02 | Intel Corporation | High capacity air-cooling systems for electronic apparatus and associated methods |
| CN101699941A (en) * | 2009-11-09 | 2010-04-28 | 中国北车股份有限公司大连电力牵引研发中心 | Heat dissipation equipment |
| CN201557358U (en) * | 2009-11-25 | 2010-08-18 | 英业达股份有限公司 | Radiating device and electronic computing system thereof |
| CN102467194A (en) * | 2010-11-10 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | Air director |
| CN103079386A (en) * | 2012-12-31 | 2013-05-01 | 迈普通信技术股份有限公司 | Heat dissipation structure of rack-mounted communication equipment |
| CN104317372A (en) * | 2014-09-30 | 2015-01-28 | 杭州华为数字技术有限公司 | Method and device for regulating cooling of terminal and terminal |
| CN104460908A (en) * | 2014-12-16 | 2015-03-25 | 浪潮电子信息产业股份有限公司 | Multichannel heat radiation design method of 1U server |
-
2015
- 2015-07-23 CN CN201510438404.3A patent/CN105022464A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6813149B2 (en) * | 2001-06-29 | 2004-11-02 | Intel Corporation | High capacity air-cooling systems for electronic apparatus and associated methods |
| CN101699941A (en) * | 2009-11-09 | 2010-04-28 | 中国北车股份有限公司大连电力牵引研发中心 | Heat dissipation equipment |
| CN201557358U (en) * | 2009-11-25 | 2010-08-18 | 英业达股份有限公司 | Radiating device and electronic computing system thereof |
| CN102467194A (en) * | 2010-11-10 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | Air director |
| CN103079386A (en) * | 2012-12-31 | 2013-05-01 | 迈普通信技术股份有限公司 | Heat dissipation structure of rack-mounted communication equipment |
| CN104317372A (en) * | 2014-09-30 | 2015-01-28 | 杭州华为数字技术有限公司 | Method and device for regulating cooling of terminal and terminal |
| CN104460908A (en) * | 2014-12-16 | 2015-03-25 | 浪潮电子信息产业股份有限公司 | Multichannel heat radiation design method of 1U server |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112613248A (en) * | 2020-12-25 | 2021-04-06 | 北京大学 | Method and system for improving embedded micro-fluid structure design |
| CN112613248B (en) * | 2020-12-25 | 2024-04-05 | 北京大学 | Method and system for improving embedded micro-fluid structure design |
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Application publication date: 20151104 |