WO2022028099A1

WO2022028099A1 - Uniform temperature heat-dissipation apparatus for electronic device

Info

Publication number: WO2022028099A1
Application number: PCT/CN2021/099294
Authority: WO
Inventors: 陈前; 巫跃凤; 刘方宇; 杨作兴
Original assignee: 深圳比特微电子科技有限公司
Priority date: 2020-08-07
Filing date: 2021-06-10
Publication date: 2022-02-10
Also published as: CN111867338A

Abstract

Disclosed is a uniform temperature heat-dissipation apparatus for an electronic device. The uniform temperature heat-dissipation apparatus comprises a housing unit and a substrate unit. The housing unit has an air inlet and an air outlet arranged opposite to each other along a first direction; the substrate unit is provided in the housing unit, and has a first surface and a second surface which extend from the air inlet to the air outlet; a first distance is formed between a first end of the substrate unit close to the air inlet, and the air inlet, so that a first uniform flow area is formed between the first end of the substrate unit and the air inlet.

Description

Heat-dissipating device for electronic equipment

This application claims the priority of the Chinese patent application filed on August 7, 2020 with the application number 202010787207.3, and the application name is "Equal Temperature Heat Dissipating Device for Electronic Equipment".

technical field

The present application relates to the technical field of heat dissipation, and in particular, to a temperature uniform heat dissipation device for electronic equipment.

Background of the Invention

In electronic equipment, since chips and the like generate a large amount of heat during operation, they need to be dissipated.

In the existing air cooling and heat dissipation, a cooling fan is usually installed at one end of the electronic device, and the cooling fan blows air from one end of the electronic device to the other end, thereby realizing air cooling and heat dissipation of the electronic device.

However, in the above solution, due to structural limitations, the cooling fan cannot perform uniform air-cooling and heat dissipation on the electronic equipment. Under the blowing of the cooling fan, the heating elements such as chips on the surface of the electronic equipment still exist in different areas. The temperature difference will cause the electronic equipment to not achieve the ideal working performance. Therefore, how to reduce the temperature difference of heating elements such as chips in electronic equipment is an urgent problem to be solved.

SUMMARY OF THE INVENTION

An embodiment of the present application provides a temperature-equalizing and heat-dissipating device for electronic equipment, wherein the temperature-equalizing and heat-dissipating device includes a housing unit and a substrate unit; the housing unit has an air inlet and an air outlet, and the substrate unit is placed in the housing unit, The base plate unit has a first surface and a second surface extending from the air inlet to the air outlet direction, and the first surface and the second surface are used for placing heating chips; wherein, a first surface and a second surface are also provided between the base plate unit and the air inlet. flow area.

According to the embodiment of the present application, by lengthening one end of the air inlet of the housing unit, a first equalizing area is formed between the substrate unit and the air inlet. The first equalizing area can be used as a buffer for cooling air. In the uniform flow area, the wind speed of the cross section of the cooling air perpendicular to the blowing direction is adjusted uniformly, and then flows to the substrate unit, so that the cooling air volume received between different areas of the substrate unit and between different substrate units can be uniform, so as to adjust the substrate unit. Unit temperature difference due to uneven cooling air flow. That is to say, the temperature equalization and heat dissipation device of the embodiment of the present application can simultaneously reduce the temperature difference between the substrate units in different positions in the housing unit and between the heating elements in different areas on the same substrate unit, thereby solving the problem of wind During cooling and heat dissipation, there is a large temperature difference between heating elements such as chips of electronic equipment, so that chips and the like on electronic equipment can be in ideal working performance.

The embodiment of the present application provides an apparatus for uniform temperature and heat dissipation of electronic equipment, and the apparatus for uniform temperature and heat dissipation includes:

a housing unit, the housing unit has an air inlet and an air outlet arranged oppositely along the first direction;

a base plate unit, arranged in the housing unit, the base plate unit includes a first surface and a second surface, the first surface and the second surface extend from the air inlet to the air outlet direction;

Wherein, the first end of the substrate unit close to the air inlet is separated from the air inlet by a first distance, so that a first flow equalization area is formed between the first end of the substrate unit and the air inlet.

Brief Description of Drawings

FIG. 1 is a schematic structural diagram of an air cooling and heat dissipation of a computing power board in the prior art.

FIG. 2 is a schematic structural diagram of the temperature uniform heat dissipation device according to the embodiment of the present application.

FIG. 3 is a schematic cross-sectional structure diagram of FIG. 2 .

FIG. 4 is a schematic structural diagram of installing the heat sink unit on the substrate unit according to the embodiment of the present application.

FIG. 5 is a schematic diagram of the cooling air and the first heating element row as the temperature increases in the first direction in the embodiment of the application.

FIG. 6 is a schematic structural diagram of the substrate unit in the embodiment of the present application.

FIG. 7 is a schematic structural diagram of the second heat sink according to the embodiment of the present application.

FIG. 8 is a schematic structural diagram of the second heat sink according to the embodiment of the present application.

FIG. 9 is a schematic structural diagram of the second heat sink according to the embodiment of the present application.

FIG. 10 is a schematic cross-sectional structural diagram of parts Q1 to Q8 in FIG. 9 .

FIG. 11 is a schematic structural diagram of the air deflector provided in the first flow equalization region in the embodiment of the present application.

FIG. 12 is a schematic structural diagram of the first flow-equalizing region provided with the flow-equalizing plate in the embodiment of the present application.

FIG. 13 is a schematic diagram of the deviation angle of the blowing direction of the fan unit compared to the first direction in the embodiment of the application.

reference number

01-Hashboard, 02-Fan,

10-shell unit, 11-air inlet, 12-air outlet, 13-first equalizing area, 14-second equalizing area,

20-Substrate unit, 21-First heating element row, 22-Boundary line, 23-First heat dissipation area, 24-Second heat dissipation area,

30 - heat sink unit, 31 - first heat sink, 32 - second heat sink,

40 - fan unit,

50-wind deflector,

60 - equalizing plate,

A1-first direction, A2-second direction,

d1-first distance, d2-second distance.

Implementation

In order to better understand the above technical solutions, the above technical solutions will be described in detail below with reference to the accompanying drawings and specific embodiments.

At present, since electronic equipment generally needs air cooling to dissipate heat, computing power equipment using ASIC chips for computing has been widely used, especially the generation of virtual currency represented by Bitcoin, which further promotes the large-scale use of computing power equipment. There are multiple computing power boards on a computing power device. Dozens or hundreds of ASIC chips are concentrated on one computing power board. When they work at full load, the heat generated by a single chip is as low as a few watts and as high as a dozen or so. Watts vary. Usually, the heat dissipation method is to set radiators above and below the chip, and then use fans for air cooling and heat dissipation. The cooling air flows in from one side of the computing power device and flows out from the other side.

As the power of a single chip increases, the power of the whole machine increases, and the performance requirements of the whole machine are getting higher and higher, and the chip needs to work within a certain temperature range to achieve the best performance. Reducing the temperature difference between the boards and the chips within the computing power board and controlling it within the ideal temperature range has become an indispensable consideration in the field of computing power equipment design.

Existing commonly used air cooling solutions expose at least two problems:

First, as shown in FIG. 1 , there is a large difference in heat dissipation between the computing power boards 01 of the computing power equipment.

For the structure of traditional computing power equipment, since the wind from fan 02 is a spiral streamline, and there is no streamline flowing out from the central area of the fan shaft, in addition, the fan is close to the computing power board, and the wind immediately enters the gap of the radiator after flowing out from the fan, which is calculated as The force plate is forced to divide the air volume, which will inevitably lead to an unbalanced air volume between the hash plate and the hash plate, and the temperature control of the whole machine will be controlled at the highest temperature point. The computing power board deviates far from the optimal temperature point and cannot achieve the optimal performance, and the control is to suppress the highest temperature point, and the fan speed will be high, which is not conducive to the energy saving of computing power equipment.

Second, the temperature consistency of the chips inside the hash board is poor.

According to Q= _{CQ_m} ΔT, the specific heat capacity C of the air is relatively low. Even in the case of a large air volume _{Q_m} , the temperature rise ΔT of the air itself is still several tens of degrees Celsius, which will inevitably lead to different positions of the chip from the air inlet side to the air outlet side. The temperature of the corresponding cooling medium wind is different. Assuming that the chip distribution spacing and the heat sink area are the same, for a certain chip, the temperature difference between the cooling medium wind and the chip is constant, then from the air inlet side to the air outlet side, the chip temperature will increase with the cooling medium wind temperature. And it increases, and the temperature difference between the front and rear chips is the same as the temperature rise ΔT of the air itself, which is as high as tens of degrees Celsius. Therefore, with the flow of the cooling medium wind, there is a large and non-negligible temperature difference between the front and rear chips, which also causes the hash board to fail to achieve optimal performance.

Based on the above, an embodiment of the present application provides a temperature equalization and heat dissipation device for an electronic device. Referring to FIG. 2 , the temperature equalization and heat dissipation device includes a housing unit 10 and a substrate unit 20 : the housing unit 10 has a direction along the first direction. The air inlet 11 and the air outlet 12 are oppositely arranged; the first direction is the direction in which the air inlet points to the air outlet; the base plate unit 20 is arranged in the housing unit 10, and the base plate unit 20 includes a first surface and a second surface , the first surface and the second surface extend from the air inlet 11 to the air outlet 12; wherein, the first end of the base unit 20 close to the air inlet 11 is separated from the air inlet 11 by a first distance, so as to A first equalizing region 13 is formed between the first end of the substrate unit 20 and the air inlet 11 .

In this embodiment, referring to FIG. 2 , the housing unit is, for example, a rectangular parallelepiped, and a substrate unit is arranged in the housing unit. The substrate unit can be, for example, a computing power board in a virtual currency mining machine. The second surface extends from the air inlet to the air outlet, and the first surface and the second surface are used for placing the heating chip; wherein, a first equalizing area is provided between the substrate unit and the air inlet.

According to the embodiment of the present application, by lengthening one end of the air inlet of the housing unit, a first equalizing area is formed between the substrate unit and the air inlet. The first equalizing area can be used as a buffer for cooling air. In the uniform flow area, the wind speed of the cross section of the cooling air perpendicular to the blowing direction is adjusted uniformly, and then flows to the substrate unit, so that the cooling air volume received between different areas of the substrate unit and between different substrate units can be uniform, so as to adjust the substrate unit. The temperature difference of the unit due to the uneven cooling air volume; that is to say, the temperature uniformity heat dissipation device of the embodiment of the present application can simultaneously make the heating elements between the substrate units in different positions in the housing unit and the heating elements in different areas on the same substrate unit The temperature difference between them is reduced, so as to solve the situation that the heating elements such as the chips of the electronic equipment have a large temperature difference in the air-cooled heat dissipation, so that the chips and the like on the electronic equipment can be in an ideal working performance.

In a possible implementation manner, the air inlet 11 is arranged with a fan unit 40, and the blowing direction of the fan unit 40 is from the air inlet 11 to the air outlet 12; the first distance d should not be less than the value (D ₀ /2 )/tanθ, where D ₀ is the hub diameter of the fan unit 40; preferably, (D ₀ /2)/tanθ≤d≤D/tanθ; wherein, D is the impeller diameter of the fan unit 40, and θ is the diameter of the fan unit The deviation angle of the blowing direction compared to the first direction.

13 , in the embodiment of the present application, the extended first distance is related to the fan unit placed at the air inlet. Specifically, the first distance should not be less than the value (D ₀ /2)/tanθ, where D ₀ is the diameter of the non-rotating hub in the fan unit, θ is the deviation angle of the blowing direction generated by the rotation of the impeller compared to the first direction, and, according to the actual fan unit used, the deviation angle θ can be obtained through simulation tests.

In a possible implementation manner, the temperature equalization and heat dissipation device includes a housing unit 10, a substrate unit 20 and a heat sink unit 30; the housing unit 10 has an air inlet 11 and an air outlet 12 oppositely arranged along the first direction A1; the The base plate unit 20 is arranged in the housing unit 10, the base plate unit 20 includes a first surface and a second surface, the first surface and the second surface extend from the air inlet 11 to the air outlet 12 direction; the heat sink unit 30 includes a plurality of The first heat sink 31 and the plurality of second heat sinks 32 are arranged on the first surface in parallel and spaced along the second direction A2 perpendicular to the first direction A1, and the plurality of second heat sinks 32 are arranged along the first surface. The second direction is arranged on the second surface in parallel and spaced apart; wherein, along the first direction, the first surface is provided with a plurality of first heating element rows 21 at intervals, and the heat dissipation area of the first heating element row 21 is along the first direction. The direction increases; the first end of the substrate unit 20 close to the air inlet 11 is separated from the air inlet 11 by a first distance, so that a first flow equalization area 13 is formed between the first end of the substrate unit 20 and the air inlet 11 .

Specifically, referring to FIG. 2 , the housing unit is, for example, a rectangular parallelepiped, and a substrate unit is arranged in the housing unit. The substrate unit can be, for example, a computing power board in a virtual currency mining machine. The surface extends from the air inlet to the air outlet, and then, a plurality of first heat dissipation fins and a plurality of second heat dissipation fins are respectively provided on the first surface and the second surface. 3 and 4, the plurality of first heat sinks are arranged on the first surface in parallel and spaced along a second direction perpendicular to the first direction. Similarly, the plurality of second heat sinks are arranged in parallel and spaced in the second direction along the second direction. is arranged on the second surface, and the first heat sink and the second heat sink extend from the first surface and the second surface to both sides of the base plate unit respectively. In this way, for example, an air duct for cooling air is formed between a plurality of first heat sinks. During the process of cooling air flowing from the air inlet to the air outlet, the cooling air absorbs heat from the surface of the first heat sink and cools the first heat sink. When the heating element on the base plate unit is conducted to the first heat sink through the base plate unit, the cooling process of the second heat sink is similar to that of the first heat sink, and will not be repeated here.

It can be understood that, for example, a heat sink may be provided on the first surface and the second surface, respectively, and the heat dissipation fins of the heat sink are the first heat sink and the second heat sink.

Then, on the one hand, referring to FIG. 6 , a first heating element row is provided on the first surface of the substrate unit, the first heating element row is arranged at intervals along the above-mentioned first direction, and the heat dissipation area of the first heating element row is along the increasing in the first direction. Therefore, in this embodiment, by adjusting the heat dissipation area of each first heating element row, the heat absorbed by the cooling air in the process of flowing from the air inlet to the air outlet can be adjusted.

Specifically referring to FIG. 5 , the X direction is the flow direction of the cooling air. It is understandable that before the heat dissipation area corresponding to the first heating element row is adjusted, it is assumed that the heat dissipation area of each chip in the first heating element row is large enough , and the heat dissipation area of each chip is the same, and the cooling air flows from one end of the substrate unit to the other end. During this process, the temperature of the cooling air rises due to the absorption of heat by the cooling air (temperature curve F1 in Figure 5), and it is assumed that the cooling air In the process of air cooling and heat dissipation for the first heating element row, the temperature difference between the cooling air and the first heating element row is fixed, then, along the flow direction of the cooling air (X direction in FIG. 5 ), the temperature difference of the first heating element row is constant. The temperature rises (temperature curve F2 in Fig. 5).

That is to say, at this time, there is a temperature difference between the air inlet and the air outlet of the first heating element. The temperature difference causes uneven temperature of the heating elements in different regions on the substrate unit, thereby affecting the overall performance of the substrate unit.

According to the embodiments of the present application, as described above, the temperature difference between the heating elements and the cooling air is gradually increased by gradually reducing the heat dissipation area corresponding to each first heating element row against the flow direction of the cooling air. That is to say, through the above arrangement in the embodiment of the present application, the temperature difference between the heating element row and the cooling air can be gradually increased at one end of the air inlet, and the temperature difference between the heating element row and the cooling air can be gradually reduced at the air outlet end. Therefore, the temperature of the heating element on the substrate unit gradually tends to be uniform along the direction of the cooling air.

Combined with Figure 5, the left end of the temperature curve F2 in Figure 5 rises, and the right end remains unchanged (for the set target temperature), and then tends to be horizontal (curve F3), thereby reducing the temperature difference between the air inlet and the air outlet of the heating element , the temperature uniformity between the heating elements in different regions of the substrate unit along the first direction is improved.

In addition, on the other hand, referring to FIG. 2 , there is a first distance between the first end of the base unit close to the air inlet and the air inlet of the housing unit, that is, the housing unit is elongated at one end of the air inlet, so that the A buffer area is formed between the first end of the substrate unit and the air inlet, that is, the first equalization area, which can make the cooling air flowing from the air inlet uniform in the cross section perpendicular to the flow direction, and then , the cooling air with uniform flow rate everywhere flows through the substrate unit, which can make the substrate unit dissipate heat evenly, and improve the temperature uniformity of the substrate unit in the cross section perpendicular to the first direction.

In the embodiment of the present application, the temperature equalization and heat dissipation device includes a housing unit, a substrate unit and a heat sink unit; the housing unit has an air inlet and an air outlet, the substrate unit is placed in the housing unit, and the substrate unit has an air inlet The first surface and the second surface extending in the direction of the air outlet are respectively arranged with a plurality of first cooling fins and a plurality of second cooling fins; A plurality of first heating element rows are arranged at intervals in the direction; then, the heat dissipation area of the first heating element row increases along the first direction; in addition, a first current equalization area is also provided between the substrate unit and the air inlet.

According to the embodiment of the present application, on the one hand, by lengthening one end of the housing unit, a first equalizing area is formed between the substrate unit and the air inlet, and the first equalizing area can be used as a buffer area for cooling air. In a uniform flow area, the wind speed of the cross-section of the cooling air perpendicular to the flow direction is adjusted uniformly, and then flows to the base plate unit, so that the cooling air volume received between different base plate units can be uniform, so as to adjust the cooling air volume between the base plate units due to the difference in the cooling air volume. uniform temperature difference.

On the other hand, it is understandable that since the cooling air will continuously absorb heat in the process of flowing through the substrate unit, and then the temperature of the cooling air will gradually increase, which leads to the temperature of the chips etc. disposed on the substrate unit. It will gradually increase along the flow direction of the cooling air, that is, the temperature of the chip will be uneven, the temperature of the chip at the air inlet is low, and the temperature of the chip at the air outlet is high. According to the embodiment of the present application, the temperature difference between the heating element and the cooling air is gradually increased by gradually reducing the heat dissipation area corresponding to each first heating element row against the flow direction of the cooling air. That is to say, through the above arrangement in the embodiment of the present application, the temperature difference between the heating element row and the cooling air can be gradually increased at one end of the air inlet, and the temperature difference between the heating element row and the cooling air can be gradually reduced at the air outlet end. Therefore, the temperature of the heating element on the substrate unit gradually tends to be uniform along the direction of the cooling air.

Therefore, the temperature equalization and heat dissipation device of the embodiment of the present application can simultaneously reduce the temperature difference between the substrate units in different positions in the housing unit and between the heating elements in different areas on the same substrate unit, thereby solving the problem of air cooling. During the heat dissipation, there is a large temperature difference between heating elements such as chips of electronic equipment, so that chips and the like on electronic equipment can be in ideal working performance.

In a possible implementation manner, along the first direction, the distance between adjacent first heating element rows 21 remains unchanged, and the heat dissipation area of the second heat sink 32 increases, so that the heat dissipation area of the first heating element row 21 is or, along the first direction, the heat dissipation area of the second heat sink 32 remains unchanged, and the distance between adjacent first heating element rows 21 increases, so that the heat dissipation area of the first heating element row 21 increases Increment in the first direction.

It is understandable that the substrate unit can be, for example, an aluminum substrate, and the heat transfer performance of the aluminum substrate is good. In this way, most of the heat generated by the first heating element row disposed on the first surface of the aluminum substrate is conducted to the second heat sink through the aluminum substrate. , and then dissipated by cooling air. That is, for the first heating element row disposed on the first surface of the substrate unit, the heat generated by the row is mainly dissipated by the second heat sink.

Furthermore, it can be understood that the distance between adjacent first heating element rows and the heat dissipation area of the second heat sink both affect the heat dissipation area of the first heating element row, wherein the heat dissipation area of the first heating element row includes all the heat dissipation areas of the first heating element row. The corresponding area of the aluminum substrate and the heat dissipation area of the corresponding radiator; the area of the aluminum substrate is the heat conduction area that dissipates the heat in the form of heat conduction after the chip heat comes out, and the heat dissipation area of the heat sink is the convection heat transfer form when the heat is finally dissipated to the air. The convection heat exchange area for heat dissipation, which is the two stages in which the heat of the heating element is dissipated. According to this embodiment, the above technical effect of changing the heat dissipation area of the first heating element row can be achieved by, for example, changing the pitch of the first heating element row or changing the heat dissipation area of the second heat sink.

Specifically, along the first direction, the distance between adjacent first heating element rows can be kept unchanged, and then the heat dissipation area of the second heat sink is gradually increased, so that the heat dissipation area corresponding to the first heating element row can be gradually increased. or, along the first direction, the spacing between adjacent first heating element rows can be gradually increased, while keeping the heat dissipation area of the second heat sink unchanged, so that the first heating element row can be achieved. Corresponding to the effect of gradually increasing the heat dissipation area.

In the above embodiment, for example, when the spacing between adjacent first heating element rows increases, the density of heating elements on the substrate unit decreases, and when the heat dissipation area of the second heat sink increases, the overall occupied space of the substrate unit increases. big.

In order to balance the above-mentioned defects, in a possible implementation, referring to FIG. 4 , the substrate unit 20 includes a first heat dissipation area 23 close to the air inlet 11 and a second heat dissipation area 24 close to the air outlet 12; in the first heat dissipation area 23, The distance between the adjacent first heating element rows 21 remains unchanged, and the heat dissipation area of the second heat sink 32 increases along the first direction; in the second heat dissipation area 24, the heat dissipation area of the second heat sink 32 remains unchanged, and the The pitches adjacent to the first heating element row 21 increase along the first direction.

According to this embodiment, the above-mentioned changing of the spacing of adjacent first heating element columns and changing of the heat dissipation area of the second heat sink are combined and applied, so that the structural limitation caused by separate application can be avoided.

In a possible implementation manner, in the first heat dissipation area 23, the distance between adjacent first heating element columns 21 remains unchanged at the first distance d1; in the second heat dissipation area 24, along the first direction, adjacent The spacing of the heating element rows 21 increases from the first spacing d1 to the second spacing d2, and the second spacing d2 is greater than the first spacing d1.

Referring to FIG. 6 , in the first heat dissipation area, for example, the spacing of the adjacent first heating element rows remains unchanged with a smaller first spacing, and then, in the second heat dissipation area, the adjacent first heating element rows The pitch gradually increases from a smaller first pitch to a larger second pitch. That is, in the first heat dissipation area, the temperature difference between the heating element and the cooling air is gradually reduced by the gradually increasing heat dissipation area of the second heat dissipation fin, while in the second heat dissipation area, in order to overcome the increasing number of second heat dissipation fins Due to the structural limitation caused by the large heat dissipation area, the spacing between adjacent first heating element rows can be gradually increased, thereby gradually reducing the temperature difference between the heating element and the cooling air.

In a possible implementation manner, in the first heat dissipation area 23, the height of the second heat dissipation fin 32 increases along the first direction, so that the heat dissipation area of the second heat dissipation fin 32 increases along the first direction; in the second heat dissipation area 24 , the height of the second heat sink 32 remains unchanged, so that the heat dissipation area of the second heat sink 32 remains unchanged.

7 and 8, in this embodiment, the heat dissipation area of the second heat sink is changed by changing the height of the second heat sink, thereby changing the heat dissipation area corresponding to the first heating element row. For example, in the first heat dissipation area, the height of the second heat dissipation fin gradually increases from the first height to the second height, and then, in the second heat dissipation area, the second heat dissipation fin remains unchanged at the second height.

More specifically, in the first heat dissipation area, for example, referring to FIG. 7 , the height of the second heat dissipation fin increases linearly along the first direction, or, referring to FIG. 8 , the height of the second heat dissipation fin increases along the first direction. The steps increase.

In a possible implementation manner, in the first heat dissipation area 23, the density of the parallel and spaced arrangement of the second heat dissipation fins 32 increases along the first direction, so that the heat dissipation area of the second heat dissipation fins 32 increases along the first direction; In the two heat dissipation areas 24, the density of the second heat dissipation fins 32 arranged in parallel and spaced apart remains unchanged, so that the heat dissipation area of the second heat dissipation fins remains unchanged.

Referring to FIGS. 9 and 10 , in this embodiment, the heat dissipation area of the second heat sink is changed by changing the parallel spacing density of the second heat sink, thereby changing the heat dissipation area corresponding to the first heating element row. For example, in the first heat dissipation area, the density of the second heat sink increases gradually from the first density (part Q1 in FIG. 10 ) to the second density (part Q8 in FIG. 10 ), and then, in the second heat dissipation area, the The second heat sink remains unchanged at the second density (portion Q8 in Figure 10).

In a possible implementation, in the housing unit, a plurality of substrate units are stacked and arranged in parallel. With reference to the above and FIGS. 2 and 3 , after the cooling air flows through the first flow equalization area, the flow velocity is uniform everywhere on the cross section perpendicular to the first direction. The flow rate of the cooling air that can be received is uniform, so that each substrate unit can be uniformly dissipated from each other.

In a possible implementation manner, the second end of the substrate unit 20 close to the air outlet 12 is separated from the air outlet 12 by a second distance, so that the second end of the substrate unit 20 and the air outlet 12 form a second equalizing area 14 .

Referring to Figure 2, since there is no space to form a negative pressure area when the air outlet is close to the computing power board, this will affect the temperature equalization effect. A second equalizing area is arranged between the second end of the base unit close to the air outlet and the air outlet, and then a negative pressure fan is arranged at the air outlet. In this way, the second equalizing area can avoid the influence of the fan shaft, which can further improve the cooling effect. The flow velocity of the wind is uniform on the cross section perpendicular to the flow direction; wherein, the second distance should be between the diameter of the hub of the negative pressure fan at the air outlet and half the diameter of the hub.

In a possible embodiment, an air guide plate 50 is provided in the first flow equalization area 13, one end of the air guide plate 50 is overlapped with the first end of the base plate unit 20, and the other end of the air guide plate 50 is overlapped with the first end of the base unit 20. The air inlet 11; and/or, a flow equalizing plate 60 is provided in the first equalizing area 13, the equalizing plate 60 is arranged perpendicular to the first direction, and the equalizing plate 60 is provided with an equalizing flow hole.

That is, in this embodiment, in order to better adjust the uniformity of the cooling air flow rate, on the one hand, referring to FIG. 11 , an air guide plate may be provided in the first flow equalization area, and the two ends of the air guide plate are respectively overlapped with the base plate. The first end of the unit and the air inlet, in this way, it is understandable that according to actual needs and measurements, by adjusting the inclination angle of the air deflector, the air deflector can evenly divide the cooling air, so that the cooling air can be used for the substrate unit. Evenly dissipate heat on the cross-section perpendicular to the cooling air flow direction.

On the other hand, referring to FIG. 12 , an equalizing plate may be provided in the first equalizing region, the equalizing plate is arranged perpendicular to the first direction, and the equalizing plate is provided with an equalizing flow hole. In this way, it can be understood that, according to actual needs and measurements, by adjusting the distribution and aperture of the equalizing holes, the equalizing plate can adjust the uniformity of the cooling air on the cross section perpendicular to the flow direction, so as to uniformly dissipate heat to the substrate unit.

In the above-mentioned embodiment, the wind deflector and the equalizing plate can be used separately, or can be used in combination.

In a possible implementation, the second surface is arranged with a plurality of second heating element rows along the first direction; in the first heat dissipation area, the spacing between adjacent second heating element rows remains unchanged, and the first heat sink The heat dissipation area of the first heat sink increases along the first direction; in the second heat dissipation area, the heat dissipation area of the first heat sink remains unchanged, and the spacing between adjacent second heating element columns increases along the first direction.

The above describes the case where heating elements are arranged on one side of the substrate unit, that is, the first row of heating elements is arranged on the first surface of the substrate unit. It is understood that the substrate unit can also arrange heating elements on both surfaces, that is , the second surface is arranged with a plurality of second heating element rows along the first direction. At this time, similarly, the arrangement of the second heating element row and the first heat sink can refer to the above-mentioned embodiment, and will not be repeated.

Specifically, regarding a possible implementation method for the determination of the first distance and the second distance, and the division of the first heat dissipation area and the second heat dissipation area in the above embodiment, the following steps may be referred to:

S1. Carry out thermal simulation of a single heating element according to the optimized working conditions of temperature (heating power of the heating element and air volume of the fan unit) (at this time, the heat dissipation area of the chip is large enough), and preliminarily determine the maximum temperature required by a single heating element according to the simulation results. The optimal spacing d2 (the above-mentioned second spacing) and the temperature difference Δt1 between the heating element and the cooling air, it can be determined that the substrate unit can reduce the chip temperature of the hottest heating element to T=T2+Δt1 under the optimized working condition, where T2 In order to determine the temperature of the cooling medium at the position of the substrate unit close to the air outlet, the target temperature t=T for the optimization of the temperature uniformity of the substrate unit is determined.

S2. Perform thermal simulation of multiple heating elements according to the optimized working conditions of temperature (heating power of the heating element and air volume of the fan unit), wherein the plurality of heating elements are arranged along the cooling air flow direction at the minimum equal spacing d1 (the first spacing above) , so as to determine the temperature difference Δt2 between the heating element and the cooling air under the condition of the minimum distance d1.

S3. Assuming that the total number of rows of the first heating element row arranged along the cooling air flow direction on the substrate unit is n, then the cooling air can be calculated according to the optimized working conditions (heating power of the heating element and air volume of the fan unit) through the first heating element in a single row. Temperature rise after heating element row

It is also assumed that the first heating element row in the first heat dissipation area is arranged at the minimum distance d1 and the number of columns is m, then the chip temperature of the mth column is

Tm=T1+mΔt3+Δt2=t,

Among them, T1 is the temperature of the cooling medium at the position of the substrate unit close to the air inlet, which is calculated from this

Rounding is performed to determine the boundary line where the first heating element columns are arranged at the minimum pitch and the pitch is increased, that is, the boundary line 22 between the first heat dissipation area and the second heat dissipation area.

S4. The spacing of the first heating element rows in the second heat dissipation area is gradually sparse. By widening the spacing of the first heating element rows, the heat dissipation area of the aluminum substrate (substrate unit) is increased, the temperature difference between the heating element and the cooling air is reduced, and the The small temperature difference value is used to balance the temperature rise value Δt3 caused by the heat absorption of the cooling air passing through the heating element row, so as to keep the chip temperature of the first heating element row in the second heat dissipation area at the target temperature t, and the specific pitch change gradient The size can be adjusted and determined according to the thermal simulation of the whole machine, thereby determining the arrangement space required for the n-column first heating element row of the substrate unit, and then determining the length of the substrate unit.

S5. The spacing of the first heating element row in the first heat dissipation area is arranged at equal intervals of d1. If the structure and size of the second heat sink in this area are the same, the temperature of the first heating element row will be continuously absorbed by the cooling wind along the flow direction. The temperature rises High influence, from the first heating element row at the air inlet to the last first heating element row near the air outlet presents a linear climbing shape. In addition, the second heat sink on the aluminum substrate is used as the main heat dissipation path, and the chip temperature Tm of the last row of the first heating element row in the first heat dissipation area is used as the target temperature of the average temperature. Therefore, the second heat dissipation in the first heat dissipation area The heat dissipation area of the fin needs to be adjusted along the law of increasing cooling air flow. By reducing the heat dissipation area of the second heat sink near the air inlet, the temperature difference between the first heating element row and the cooling air is increased. The increased temperature difference is used for Balance the temperature rise value Δt3 caused by the heat absorption of the cooling air through the first heating element row.

That is, the size and change gradient of the second heat sink can be adjusted according to the temperature rise of the cooling air. The lower the temperature of the cooling air, the smaller the area of the second heat sink, thereby increasing the temperature difference between the heating element and the cooling air at that location, allowing the first heat dissipation to dissipate. The chip temperature of the first heating element column in the zone is controlled at the target temperature t.

The specific embodiment can be that the second heat sink in the first heat dissipation area is made into a slope type, that is, the area of the second heat sink is changed by changing the height of the heat sink fin, and the height of the second heat sink from the air inlet to the dividing point presents Linear change, the height of the second heat sink in the second heat dissipation area at the tail remains unchanged.

The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be pointed out that the advantages, advantages, effects, etc. mentioned in the present application are only examples rather than limitations, and these advantages, advantages, effects, etc., are not considered to be Required for each embodiment of this application. In addition, the specific details disclosed above are only for the role of example and the role of facilitating understanding, rather than limiting, and the above-mentioned details do not limit the application to be implemented by using the above-mentioned specific details.

The block diagrams of devices, apparatus, apparatuses, and systems referred to in this application are only illustrative examples and are not intended to require or imply that the connections, arrangements, or configurations must be in the manner shown in the block diagrams. As those skilled in the art will appreciate, these means, apparatuses, apparatuses, systems may be connected, arranged, and configured in any manner. Words such as "including", "including", "having" and the like are open-ended words meaning "including but not limited to" and are used interchangeably therewith. As used herein, the words "or" and "and" refer to and are used interchangeably with the word "and/or" unless the context clearly dictates otherwise. As used herein, the word "such as" refers to and is used interchangeably with the phrase "such as but not limited to".

It should also be pointed out that in the apparatus, equipment and method of the present application, each component or each step can be decomposed and/or recombined. These disaggregations and/or recombinations should be considered as equivalents of the present application.

The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Therefore, this application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for the purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize that certain variations, modifications, changes, additions and sub-combinations thereof are intended to be included within the scope of this application.

Claims

A temperature uniformity heat dissipation device for electronic equipment, wherein the temperature uniformity heat dissipation device comprises:

a housing unit (10), the housing unit (10) having an air inlet (11) and an air outlet (12) oppositely arranged along a first direction;

A base plate unit (20), provided in the housing unit (10), the base plate unit (20) includes a first surface and a second surface, the first surface and the second surface are connected from the air inlet (11) extending in the direction of the air outlet (12);

Wherein, the first end of the base plate unit (20) close to the air inlet (11) is separated from the air inlet (11) by a first distance, so that the first end of the base plate unit (20) is close to the air inlet (11). A first equalizing area (13) is formed between the air inlets (11).
The temperature-equalizing heat dissipation device according to claim 1, wherein a fan unit (40) is arranged on the air inlet (11), and the blowing direction of the fan unit (40) is from the air inlet (11) to the blowing direction the air outlet (12);

The first distance is not less than the value (D 0 /2)/tanθ, where D 0 is the diameter of the hub of the fan unit (40), and θ is the difference between the blowing direction of the fan unit and the first direction. deviation angle.
The temperature equalization heat dissipation device according to claim 2, wherein the first distance is not greater than a value D/tanθ, wherein D is the diameter of the impeller of the fan unit (40).
The uniform temperature heat dissipation device according to claim 1, wherein the uniform temperature heat dissipation device further comprises:

A heat dissipation fin unit (30), comprising a plurality of first heat dissipation fins (31) and a plurality of second heat dissipation fins (32), the plurality of first heat dissipation fins (31) along a second direction perpendicular to the first direction The directions are parallel and spaced apart on the first surface, and the plurality of second cooling fins (32) are disposed on the second surface in parallel and spaced apart directions along the second direction;

Wherein, along the first direction, the first surface is spaced with a plurality of first heating element rows (21), and the heat dissipation area of the first heating element row (21) increases along the first direction .
The temperature equalization heat dissipation device according to claim 4, wherein,

Along the first direction, the spacing between adjacent first heating element rows (21) remains unchanged, and the heat dissipation area of the second heat sink (32) increases, so that the first heating element rows ( 21) The heat dissipation area increases along the first direction; or,

Along the first direction, the heat dissipation area of the second heat sink (32) remains unchanged, and the spacing between the adjacent first heating element rows (21) increases, so that the first heating element rows ( 21) The heat dissipation area increases along the first direction.
The heat dissipation device according to claim 4, wherein the substrate unit (20) comprises a first heat dissipation area (23) close to the air inlet (11) and a second heat dissipation area (23) close to the air outlet (12) heat dissipation area (24);

In the first heat dissipation area (23), the distance between adjacent first heating element rows (21) remains unchanged, and the heat dissipation area of the second heat dissipation fins (32) increases along the first direction;

In the second heat dissipation area (24), the heat dissipation area of the second heat dissipation fins (32) remains unchanged, and the spacing between the adjacent first heating element rows (21) increases along the first direction.
The temperature equalization heat dissipation device according to claim 6, wherein,

In the first heat dissipation area (23), the distance between the adjacent first heating element columns (21) remains unchanged at the first distance;

In the second heat dissipation area (24), along the first direction, the spacing between the adjacent first heating element rows (21) increases from the first spacing to a second spacing, and the second spacing greater than the first distance.
The temperature equalization heat dissipation device according to claim 6, wherein,

In the first heat dissipation area (23), the height of the second heat dissipation fin (32) increases along the first direction, so that the heat dissipation area of the second heat dissipation fin (32) is along the first direction increment;

In the second heat dissipation area (24), the height of the second heat dissipation fin (32) remains unchanged, so that the heat dissipation area of the second heat dissipation fin (32) remains unchanged.
The temperature equalization heat dissipation device according to claim 8, wherein,

In the first heat dissipation area (23), the height of the second heat dissipation fin (32) linearly increases along the first direction; or,

In the first heat dissipation area (23), the height of the second heat dissipation fin (32) increases stepwise along the first direction.
The temperature equalization heat dissipation device according to claim 6, wherein,

In the first heat dissipation area (23), the density of the parallel and spaced arrangement of the second heat dissipation fins (32) increases along the first direction, so that the heat dissipation area of the second heat dissipation fins (32) is arranged along the first direction. increase in the first direction;

In the second heat dissipation area (24), the density of the parallel and spaced arrangement of the second heat dissipation fins (32) remains unchanged, so that the heat dissipation area of the second heat dissipation fins (32) remains unchanged.
The temperature-equalizing heat dissipation device according to claim 1, wherein, in the housing unit (10), a plurality of the substrate units (20) are stacked and arranged in parallel.
The temperature equalization heat dissipation device according to claim 1, wherein the second end of the substrate unit (20) close to the air outlet (12) is separated from the air outlet (12) by a second distance, so that the A second equalizing area (14) is formed between the second end of the substrate unit (20) and the air outlet (12).
The temperature equalization heat dissipation device according to claim 12, wherein a negative pressure fan is provided at the air outlet, and the second distance is between half the diameter of the hub of the negative pressure fan and the diameter of the hub.
The temperature equalization heat dissipation device according to any one of claims 1 to 13, wherein,

A wind deflector (50) is provided in the first flow equalization area (13), one end of the wind deflector (50) is overlapped with the first end of the base plate unit (20), and the wind deflector (50) The other end of (50) is overlapped with the air inlet (11); and/or,

An equalizing plate (60) is provided in the first equalizing region (13), the equalizing plate (60) is arranged perpendicular to the first direction, and an equalizing plate (60) is provided with an equalizing flow plate (60). hole.
The temperature equalization heat dissipation device according to any one of claims 6 to 10, wherein a plurality of second heating element rows are arranged along the first direction on the second surface;

In the first heat dissipation area (23), the spacing between the adjacent second heating element rows remains unchanged, and the heat dissipation area of the first heat dissipation fin (31) increases along the first direction;

In the second heat dissipation area (24), the heat dissipation area of the first heat dissipation fins (31) remains unchanged, and the spacing between adjacent second heating element columns increases along the first direction.