CN111867338A - Uniform temperature heat dissipation device of electronic equipment - Google Patents

Uniform temperature heat dissipation device of electronic equipment Download PDF

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Publication number
CN111867338A
CN111867338A CN202010787207.3A CN202010787207A CN111867338A CN 111867338 A CN111867338 A CN 111867338A CN 202010787207 A CN202010787207 A CN 202010787207A CN 111867338 A CN111867338 A CN 111867338A
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China
Prior art keywords
heat dissipation
heat
temperature
dissipation area
air
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CN202010787207.3A
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Chinese (zh)
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陈前
巫跃凤
刘方宇
杨作兴
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Shenzhen MicroBT Electronics Technology Co Ltd
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Shenzhen MicroBT Electronics Technology Co Ltd
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Priority to CN202010787207.3A priority Critical patent/CN111867338A/en
Publication of CN111867338A publication Critical patent/CN111867338A/en
Priority to PCT/CN2021/099294 priority patent/WO2022028099A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The application discloses a temperature-equalizing heat dissipation device of electronic equipment, which comprises a shell unit and a substrate unit; the shell unit is provided with an air inlet and an air outlet, the substrate unit is arranged in the shell unit, the substrate unit is provided with a first surface and a second surface, the first surface and the second surface extend from the air inlet to the air outlet, and the first surface and the second surface are used for placing heating chips; a first flow equalizing area is arranged between the substrate unit and the air inlet; that is, in the embodiment of the present application, one end of the air inlet of the housing unit is lengthened, so that a first flow equalizing region is formed between the substrate unit and the air inlet, and the first flow equalizing region can be used as a buffer region for cooling air, so that the cooling air received between different regions of the substrate unit and between different substrate units is uniform in air volume, thereby solving the problem that heating elements such as chips of electronic equipment have large temperature difference in air-cooling heat dissipation, and further enabling the chips on the electronic equipment to be in ideal working performance.

Description

Uniform temperature heat dissipation device of electronic equipment
Technical Field
The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a uniform-temperature heat dissipation device of electronic equipment.
Background
In an electronic apparatus, since a chip or the like generates a large amount of heat at the time of operation, it is necessary to dissipate the heat.
In the existing air cooling heat dissipation, a heat dissipation fan is usually installed at one end of an electronic device, and the heat dissipation fan blows air to flow from one end of the electronic device to the other end, so that the air cooling heat dissipation of the electronic device is realized.
However, in the above solution, due to structural limitations, the heat dissipation fan cannot perform uniform air-cooling heat dissipation on the electronic device, and under the blowing of the heat dissipation fan, the temperature difference of the heat generating elements such as chips on the surface of the electronic device still exists in different areas, so that the electronic device cannot achieve ideal working performance, that is, how to reduce the temperature difference of the heat generating elements such as chips in the electronic device is an urgent problem to be solved.
Disclosure of Invention
The embodiment of the application provides a temperature-equalizing heat dissipation device of electronic equipment, wherein the temperature-equalizing heat dissipation device comprises a shell unit and a substrate unit; the shell unit is provided with an air inlet and an air outlet, the substrate unit is arranged in the shell unit, the substrate unit is provided with a first surface and a second surface, the first surface and the second surface extend from the air inlet to the air outlet, and the first surface and the second surface are used for placing heating chips; a first flow equalizing area is arranged between the substrate unit and the air inlet;
that is, in the embodiment of the present application, one end of the air inlet of the housing unit is lengthened, so that a first flow equalizing region is formed between the substrate unit and the air inlet, and the first flow equalizing region can be used as a buffer region for cooling air, in which the air speed of the cross section of the cooling air perpendicular to the blowing direction is adjusted to be uniform, and then the cooling air flows to the substrate unit, so that the cooling air received between different regions of the substrate unit and between different substrate units is uniform, and the temperature difference of the substrate unit caused by the non-uniform air quantity of the cooling air is adjusted; that is to say, the temperature-equalizing heat dissipation device of the embodiment of the present application can simultaneously reduce the temperature difference between the substrate units at different positions in the housing unit and between the heating elements in different areas on the same substrate unit, thereby solving the problem that the heating elements such as chips of electronic equipment have a large temperature difference during air-cooling heat dissipation, and further enabling the chips and the like on the electronic equipment to be in ideal working performance.
The embodiment of the application provides a samming heat abstractor of electronic equipment, samming heat abstractor includes:
the air conditioner comprises a shell unit, a fan unit and a control unit, wherein the shell unit is provided with an air inlet and an air outlet which are oppositely arranged along a first direction;
the substrate unit is arranged in the shell unit and comprises a first surface and a second surface, and the first surface and the second surface extend from the air inlet to the air outlet;
the first end of the substrate unit close to the air inlet is away from the air inlet by a first distance, so that a first flow equalizing area is formed between the first end of the substrate unit and the air inlet.
In the embodiment of the disclosure, the air inlet is provided with a fan unit, and the blowing direction of the fan unit is from the air inlet to the air outlet;
the first distance should not be less than a value (D)02)/tan theta, wherein D0Theta is a deviation angle of the blowing direction of the fan unit from the first direction, which is a hub diameter of the fan unit.
In the embodiment of the present disclosure, the first distance is not greater than a value D/tan θ, where D is an impeller diameter of the fan unit 40.
In the embodiment of the present disclosure, the temperature-equalizing heat dissipation device further includes:
a fin unit including a plurality of first fins arranged on the first surface in parallel at intervals in a second direction perpendicular to the first direction and a plurality of second fins arranged on the second surface in parallel at intervals in the second direction;
the first surface is provided with a plurality of first heating element rows at intervals along the first direction, and the heat dissipation areas of the first heating element rows are increased progressively along the first direction.
In the embodiment of the disclosure, along the first direction, the distance between adjacent first heat-generating element rows is kept constant, and the heat dissipation area of the second heat dissipation fin is increased progressively, so that the heat dissipation area of the first heat-generating element rows is increased progressively along the first direction; alternatively, the first and second electrodes may be,
the heat dissipation area of the second heat dissipation plate is kept constant along the first direction, and the distance between every two adjacent first heat generation element columns is increased, so that the heat dissipation area of the first heat generation element columns is increased along the first direction.
In the embodiment of the present disclosure, the substrate unit includes a first heat dissipation area near the air inlet and a second heat dissipation area near the air outlet;
in the first heat dissipation area, the distance between adjacent first heat generating element columns is kept unchanged, and the heat dissipation area of the second heat dissipation fins is increased along the first direction;
in the second heat dissipation area, the heat dissipation area of the second heat dissipation plate is kept unchanged, and the distance between every two adjacent first heat generation element columns is increased along the first direction.
In the first heat dissipation area in the disclosed embodiment, the distance between adjacent first heat generating element columns is kept constant at a first distance;
in the second heat dissipation area, along the first direction, the spacing between adjacent first heat generation element columns is increased from the first spacing to a second spacing, and the second spacing is larger than the first spacing.
In the disclosed embodiment, in the first heat dissipation area, the height of the second heat dissipation fin increases along the first direction, so that the heat dissipation area of the second heat dissipation fin increases along the first direction;
in the second heat dissipation area, the height of the second heat dissipation fin is kept constant, so that the heat dissipation area of the second heat dissipation fin is kept constant.
In the disclosed embodiment, in the first heat dissipation area, the height of the second heat dissipation fin increases linearly along the first direction; alternatively, the first and second electrodes may be,
in the first heat dissipation area, the height of the second heat dissipation fin is increased in a stepwise manner along the first direction.
In the disclosed embodiment, in the first heat dissipation area, the density of the parallel spaced arrangement of the second heat dissipation fins increases along the first direction, so that the heat dissipation area of the second heat dissipation fins increases along the first direction;
in the second heat dissipation area, the density of the parallel and spaced arrangement of the second heat dissipation fins is kept unchanged, so that the heat dissipation area of the second heat dissipation fins is kept unchanged.
In the embodiment of the present disclosure, in the housing unit, a plurality of the substrate units are stacked in parallel.
In the embodiment of the present disclosure, a second distance is formed between the second end of the substrate unit close to the air outlet and the air outlet, so that a second flow equalizing region is formed between the second end of the substrate unit and the air outlet.
In the embodiment of the present disclosure, a negative pressure fan is disposed at the air outlet, and the second distance is between half of a diameter of a hub of the negative pressure fan and the diameter of the hub.
In the embodiment of the disclosure, an air deflector is arranged in the first flow equalizing area, one end of the air deflector is connected to the first end of the substrate unit in an overlapping manner, and the other end of the air deflector is connected to the air inlet in an overlapping manner; and/or the presence of a gas in the gas,
the first flow equalizing area is provided with a flow equalizing plate, the flow equalizing plate is perpendicular to the first direction, and flow equalizing holes are formed in the flow equalizing plate.
In the embodiment of the present disclosure, the second surface is provided with a plurality of second heating element rows along the first direction;
in the first heat dissipation area, the distance between adjacent second heat generation element columns is kept unchanged, and the heat dissipation area of the first heat dissipation plate is increased progressively along the first direction;
in the second heat dissipation area, the heat dissipation area of the first heat dissipation sheet is kept unchanged, and the distance between adjacent second heat generation element columns is increased along the first direction.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
in the embodiment of the application, the temperature-equalizing heat-dissipating device comprises a shell unit and a substrate unit; the shell unit is provided with an air inlet and an air outlet, the substrate unit is arranged in the shell unit, the substrate unit is provided with a first surface and a second surface, the first surface and the second surface extend from the air inlet to the air outlet, and the first surface and the second surface are used for placing heating chips; a first flow equalizing area is arranged between the substrate unit and the air inlet; that is, in the embodiment of the present application, one end of the air inlet of the housing unit is lengthened, so that a first flow equalizing region is formed between the substrate unit and the air inlet, and the first flow equalizing region can be used as a buffer region for cooling air, in which the air speed of the cross section of the cooling air perpendicular to the blowing direction is adjusted to be uniform, and then the cooling air flows to the substrate unit, so that the cooling air received between different regions of the substrate unit and between different substrate units is uniform, and the temperature difference of the substrate unit caused by the non-uniform air quantity of the cooling air is adjusted; that is to say, the temperature-equalizing heat dissipation device of the embodiment of the present application can simultaneously reduce the temperature difference between the substrate units at different positions in the housing unit and between the heating elements in different areas on the same substrate unit, thereby solving the problem that the heating elements such as chips of electronic equipment have a large temperature difference during air-cooling heat dissipation, and further enabling the chips and the like on the electronic equipment to be in ideal working performance.
Drawings
Fig. 1 is a schematic structural diagram of an air-cooling heat dissipation structure of a force calculation plate in the prior art.
Fig. 2 is a schematic structural diagram of the uniform temperature heat dissipation device in the embodiment of the present application.
Fig. 3 is a schematic cross-sectional structure of fig. 2.
Fig. 4 is a schematic structural diagram of the substrate unit mounted with the heat sink unit in the embodiment of the present application.
Fig. 5 is a schematic view illustrating that the temperature of the cooling wind and the first heat-generating element row increases along with the temperature increase in the first direction in the embodiment of the present application.
Fig. 6 is a schematic structural diagram of the substrate unit in the embodiment of the present application.
Fig. 7 is a schematic structural diagram of the second heat sink in the embodiment of the present application.
Fig. 8 is a schematic structural diagram of the second heat sink in the embodiment of the present application.
Fig. 9 is a schematic structural diagram of the second heat sink in the embodiment of the present application.
Fig. 10 is a schematic sectional structure view of portions Q1 to Q8 in fig. 9.
Fig. 11 is a schematic structural view illustrating that the air deflector is disposed in the first flow equalizing region in the embodiment of the present application.
Fig. 12 is a schematic structural view illustrating that the flow equalizing plate is disposed in the first flow equalizing region in the embodiment of the present application.
Fig. 13 is a schematic view illustrating a deviation angle of the blowing direction of the fan unit from the first direction in the embodiment of the present application.
Reference numerals
01-force calculating board, 02-fan,
10-shell unit, 11-air inlet, 12-air outlet, 13-first flow equalizing area, 14-second flow equalizing area,
20-substrate unit, 21-first heat-generating element row, 22-boundary line, 23-first heat dissipation area, 24-second heat dissipation area,
30-a fin unit, 31-a first fin, 32-a second fin,
40-a fan unit, the fan unit,
50-the air deflector is arranged on the upper surface of the air deflector,
60-a flow equalizing plate, wherein the flow equalizing plate is arranged on the upper surface of the shell,
a 1-first direction, a 2-second direction,
d 1-first spacing, d 2-second spacing.
Detailed Description
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
SUMMARY
At present, electronic equipment generally needs air cooling heat dissipation due to heat generation. Computing power equipment using ASIC chips has been widely used, and the generation of virtual money, such as bitcoin, has promoted the use of computing power equipment in large quantities. A power calculating device is provided with a plurality of power calculating plates, one power calculating plate is concentrated with dozens of or hundreds of ASIC chips, when the power calculating plates work at full load, the heat generated by a single chip is as low as a few watts and as high as a dozen or so watts, the common heat dissipation mode is that a radiator is arranged above and below the chip and then air cooling heat dissipation is carried out by a fan, and cooling air flows in from one side of the power calculating device and flows out from the other side of the power calculating device.
Along with the rise of single-chip power, the whole machine power is increased, the requirement on the whole machine performance is higher and higher, the chip needs to work within a certain temperature range to achieve the optimal performance, and how to reduce the temperature difference between the whole computing board and the chip in the computing board of the computing equipment and control the temperature difference within an ideal temperature interval becomes an indispensable consideration factor in the field of computing equipment design.
The existing common air-cooled heat dissipation scheme at least exposes two problems:
first, the difference in heat dissipation between the force computing plates 01 of the force computing device is large. For the traditional power calculation equipment structure, because the air outlet of the fan 02 is a spiral streamline, no streamline flows out of the central area of a fan shaft, in addition, the fan is close to the power calculation board, the air enters a radiator gap immediately after flowing out of the fan, the forced air distribution of the power calculation board inevitably causes the unbalanced air quantity between the power calculation board and the power calculation board, the temperature control of the whole machine is controlled by the highest temperature point, the difference between the boards is larger, certain power calculation boards are inevitably deviated from the optimal temperature point to be far away, the optimal performance cannot be achieved, the highest temperature point is suppressed in control, the rotating speed of the fan is higher, and the energy saving of the power calculation equipment is not facilitated.
Secondly, the temperature consistency of the chip inside the force calculation board is poor. From Q ═ CQ \umΔ T is known to be a relatively low air specific heat capacity C even in high windsQuantity Q \umUnder the condition, the temperature rise delta T of the air is still dozens of ℃, which inevitably causes the temperature of the cooling medium air corresponding to the chips at different positions from the air inlet side to the air outlet side to be different, and if the distribution distance of the chips and the area of the radiator are consistent, the temperature difference between the cooling medium air and the chips is constant for a certain chip, so that the temperature of the chip is increased along with the increase of the temperature of the cooling medium air from the air inlet side to the air outlet side, and the temperature difference between the front chip and the rear chip is the same as the temperature rise delta T of the air and reaches dozens of degrees centigrade. That is, there is a large, non-negligible temperature difference between the front and rear chips with the flow of the cooling medium wind, and this temperature difference also results in the performance of the force computing board not being optimal.
Based on the above, an embodiment of the present application provides a temperature-equalizing heat dissipation device for an electronic device, where the temperature-equalizing heat dissipation device includes a housing unit 10 and a substrate unit 20: the shell unit 10 is provided with an air inlet 11 and an air outlet 12 which are oppositely arranged along a first direction; the first direction is the direction of the air inlet pointing to the air outlet; the substrate unit 20 is disposed in the housing unit 10, and the substrate unit 20 includes a first surface and a second surface, and the first surface and the second surface extend from the air inlet 11 to the air outlet 12; the first end of the substrate unit 20 close to the air inlet 11 is a first distance away from the air inlet 11, so that a first flow equalizing region 13 is formed between the first end of the substrate unit 20 and the air inlet 11.
In this embodiment, referring to fig. 2, the housing unit is, for example, a rectangular parallelepiped, a substrate unit is disposed in the housing unit, the substrate unit is, for example, a computing board in a virtual currency mining machine, a first surface and a second surface of the substrate unit extend from the air inlet to the air outlet, and the first surface and the second surface are used for placing a heat generating chip; wherein, be equipped with the first region of flow equalizing between base plate unit and income wind gap.
That is, in the embodiment of the present application, one end of the air inlet of the housing unit is lengthened, so that a first flow equalizing region is formed between the substrate unit and the air inlet, and the first flow equalizing region can be used as a buffer region for cooling air, in which the air speed of the cross section of the cooling air perpendicular to the blowing direction is adjusted to be uniform, and then the cooling air flows to the substrate unit, so that the cooling air received between different regions of the substrate unit and between different substrate units is uniform, and the temperature difference of the substrate unit caused by the non-uniform air quantity of the cooling air is adjusted; that is to say, the temperature-equalizing heat dissipation device of the embodiment of the present application can simultaneously reduce the temperature difference between the substrate units at different positions in the housing unit and between the heating elements in different areas on the same substrate unit, thereby solving the problem that the heating elements such as chips of electronic equipment have a large temperature difference during air-cooling heat dissipation, and further enabling the chips and the like on the electronic equipment to be in ideal working performance.
In a possible embodiment, the air inlet 11 is provided with a fan unit 40, and the blowing direction of the fan unit 40 is from the air inlet 11 to the air outlet 12; the first distance D should not be less than the value (D)02)/tan theta, wherein D0Is the hub diameter of the fan unit 40; preferably, (D)0D is more than or equal to D and less than or equal to D/tan theta; where D is the diameter of the impeller of the fan unit 40, and θ is the deviation angle of the blowing direction of the fan unit from the first direction.
Referring to fig. 13, in the embodiment of the present application, the first distance is related to the fan unit disposed at the air inlet, and specifically, the first distance should not be less than the value (D)02)/tan theta, wherein D0The diameter of the hub which is not rotated in the fan unit, theta is a deviation angle of the blowing direction generated by the rotation of the impeller compared with the first direction, and the deviation angle theta can be obtained through simulation tests according to the fan unit which is actually used.
In one possible embodiment, the temperature-equalizing heat sink comprises a housing unit 10, a substrate unit 20 and a heat sink unit 30; the housing unit 10 has an air inlet 11 and an air outlet 12 oppositely arranged along a first direction a 1; the substrate unit 20 is disposed in the housing unit 10, and the substrate unit 20 includes a first surface and a second surface, and the first surface and the second surface extend from the air inlet 11 to the air outlet 12; the fin unit 30 includes a plurality of first fins 31 and a plurality of second fins 32, the plurality of first fins 31 being arranged on the first surface in parallel spaced along a second direction a2 perpendicular to the first direction a1, the plurality of second fins 32 being arranged on the second surface in parallel spaced along the second direction; along a first direction, a plurality of first heating element rows 21 are distributed on the first surface at intervals, and the heat dissipation areas of the first heating element rows 21 increase progressively along the first direction; the first end of the substrate unit 20 close to the air inlet 11 is a first distance away from the air inlet 11, so that a first flow equalizing region 13 is formed between the first end of the substrate unit 20 and the air inlet 11.
Specifically, referring to fig. 2, the housing unit is, for example, a rectangular parallelepiped, a substrate unit is disposed in the housing unit, the substrate unit is, for example, a computing board in a virtual currency mining machine, a first surface and a second surface of the substrate unit extend from an air inlet to an air outlet, and then a plurality of first cooling fins and a plurality of second cooling fins are disposed on the first surface and the second surface, respectively; with reference to fig. 3 and 4, the plurality of first heat dissipation fins are arranged on the first surface in parallel at intervals along a second direction perpendicular to the first direction, and similarly, the plurality of second heat dissipation fins are arranged on the second surface in parallel at intervals along the second direction, and the first heat dissipation fins and the second heat dissipation fins extend from the first surface and the second surface to two sides of the substrate unit respectively; thus, for example, an air channel of cooling air is formed between the plurality of first cooling fins, and the cooling air absorbs heat from the surfaces of the first cooling fins and cools the first cooling fins in the process of flowing from the air inlet to the air outlet, the heat is conducted to the first cooling fins by the heating element arranged on the substrate unit through the substrate unit, and the cooling process of the second cooling fins is similar to that of the first cooling fins and is not repeated.
It is understood that, for example, a heat sink may be provided on the first surface and the second surface, respectively, and the heat dissipation fins of the heat sink are the first heat dissipation fin and the second heat dissipation fin.
Then, on the one hand, with reference to fig. 6, a first heat-generating element row is provided on the first surface of the substrate unit, the first heat-generating element row is arranged at intervals along the first direction, and the heat dissipation area of the first heat-generating element row increases progressively along the first direction; that is, in this embodiment, the heat quantity absorbed by the cooling air in the process of flowing from the air inlet to the air outlet is adjusted by adjusting the heat dissipation area of each first heat-generating element row.
Specifically, referring to fig. 5, the direction X is the flow direction of the cooling air, and it can be understood that before the heat dissipation area corresponding to the first heat-generating element row is not adjusted, the temperature of the cooling air rises due to the heat absorbed by the cooling air (temperature curve F1 in fig. 5) in the process that the heat dissipation area of each chip in the first heat-generating element row is large enough and the heat dissipation area of each chip is consistent, and the temperature difference between the cooling air and the first heat-generating element row is constant in the process that the cooling air absorbs heat and dissipates heat, and then the temperature of the first heat-generating element row rises along the flow direction of the cooling air (direction X in fig. 5) (temperature curve F2 in fig. 5); that is, at this time, the temperature difference exists between the air inlet and the air outlet of the first heating element array, and the temperature difference causes the temperature of the heating elements in different areas on the substrate unit to be uneven, thereby affecting the improvement of the overall working performance of the substrate unit; in the embodiment of the present application, as described above, against the flow direction of the cooling air, the temperature difference between the heat generating elements and the cooling air is gradually increased by gradually decreasing the heat dissipation area corresponding to each first heat generating element row; that is, through the above arrangement in the embodiment of the present application, the temperature difference between the heating element array and the cooling air can be gradually increased at one end of the air inlet, and the temperature difference between the heating element array and the cooling air can be gradually decreased at one end of the air outlet, so that the temperatures of the heating elements on the substrate unit gradually tend to be consistent along the direction of the cooling air; that is, referring to fig. 5, the left end of the temperature curve F2 in fig. 5 rises, the right end remains unchanged (is the set target temperature), and then it tends to be horizontal (curve F3), so that the temperature difference of the heating elements at the air inlet and the air outlet is reduced, and the temperature uniformity of the substrate unit among the heating elements in different regions along the first direction is improved.
In addition, on the other hand, with reference to fig. 2, a first distance is provided between the first end of the substrate unit close to the air inlet and the air inlet of the housing unit, that is, the housing unit is lengthened at one end of the air inlet, so that a buffer region, that is, a first flow equalizing region is formed between the first end of the substrate unit and the air inlet, the first flow equalizing region can make the flow velocity of the cooling air flowing from the air inlet uniform on the cross section perpendicular to the flow direction, and then the cooling air with uniform flow velocity flows through the substrate unit, so that the substrate unit can uniformly dissipate heat, and the temperature uniformity of the substrate unit at each cross section perpendicular to the first direction is improved.
In the embodiment of the application, the temperature-equalizing heat-dissipating device comprises a shell unit, a substrate unit and a heat-dissipating fin unit; the shell unit is provided with an air inlet and an air outlet, the substrate unit is arranged in the shell unit, the substrate unit is provided with a first surface and a second surface which extend from the air inlet to the air outlet, and a plurality of first radiating fins and a plurality of second radiating fins are respectively arranged on the first surface and the second surface; a plurality of first heating element rows which are arranged at intervals along a first direction are arranged on the first surface; then, the heat dissipation area of the first heat generation element row increases progressively along the first direction; in addition, a first flow equalizing area is arranged between the substrate unit and the air inlet;
that is, in the embodiment of the present application, on one hand, a first flow equalizing region is formed between the substrate unit and the air inlet by lengthening one end of the housing unit, and the first flow equalizing region can be used as a buffer region for cooling air, in which the air speed of the cross section of the cooling air perpendicular to the flow direction is uniformly adjusted, and then the cooling air flows to the substrate unit, so that the air volume of the cooling air received between different substrate units is uniform, and the temperature difference between the substrate units caused by the non-uniform air volume of the cooling air is adjusted;
on the other hand, it can be understood that, in the process that the cooling air flows through the substrate unit, the cooling air continuously absorbs heat, and then the temperature of the cooling air gradually rises, which causes the temperature of the chips and the like arranged on the substrate unit to gradually increase along the flow direction of the cooling air, i.e. causes the temperature of the chips to be uneven, the temperature of the chips at the air inlet is lower, and the temperature of the chips at the air outlet is higher; in the embodiment of the application, against the flow direction of the cooling air, the temperature difference between the heating elements and the cooling air is gradually increased by gradually reducing the heat dissipation area corresponding to each first heating element row; that is, through the above arrangement in the embodiment of the present application, the temperature difference between the heating element array and the cooling air can be gradually increased at one end of the air inlet, and the temperature difference between the heating element array and the cooling air can be gradually decreased at one end of the air outlet, so that the temperatures of the heating elements on the substrate unit gradually tend to be consistent along the direction of the cooling air;
that is to say, the temperature-equalizing heat dissipation device of the embodiment of the present application can simultaneously reduce the temperature difference between the substrate units at different positions in the housing unit and between the heating elements in different areas on the same substrate unit, thereby solving the problem that the heating elements such as chips of electronic equipment have a large temperature difference during air-cooling heat dissipation, and further enabling the chips and the like on the electronic equipment to be in ideal working performance.
In one possible embodiment, the distance between adjacent first heat-generating element rows 21 is kept constant along the first direction, and the heat-dissipating area of the second heat-dissipating fin 32 is increased, so that the heat-dissipating area of the first heat-generating element rows 21 is increased along the first direction; alternatively, the heat dissipation area of the second heat dissipation plate 32 is kept constant along the first direction, and the pitch between adjacent first heat generation element rows 21 is increased, so that the heat dissipation area of the first heat generation element rows 21 is increased along the first direction.
Understandably, the substrate unit can be, for example, an aluminum substrate, which has good heat transfer performance, so that most of the heat generated by the first heat generating element row arranged on the first surface of the aluminum substrate is transferred to the second heat sink through the aluminum substrate, and then is cooled by cooling air to dissipate heat, that is, for the first heat generating element row arranged on the first surface of the substrate unit, the generated heat is mainly dissipated by the second heat sink; furthermore, it can be understood that the distance between adjacent first heat-generating element rows and the heat dissipation area of the second heat sink affect the heat dissipation area of the first heat-generating element row; the heat dissipation area of the first heat generation element row comprises the area of the corresponding aluminum substrate and the heat dissipation area of the corresponding radiator; the area of the aluminum substrate is the heat conduction area for heat dissipation in a heat conduction mode after the heat of the chip comes out, the heat dissipation area of the radiator is the heat convection area for heat dissipation in a heat convection mode when the heat is finally dissipated to air, and the heat dissipation area is two stages of heat dissipation of the heating element; in this embodiment, the technical effect of changing the heat dissipation area of the first heat-generating element row can be achieved by changing the pitch of the first heat-generating element row or changing the heat dissipation area of the second heat sink, for example.
Specifically, along the first direction, the distance between adjacent first heat-generating element rows can be kept unchanged, and then the heat-dissipating area of the second heat-dissipating fin is gradually increased, so that the effect that the heat-dissipating area corresponding to the first heat-generating element rows is gradually increased is realized; or, along the first direction, the distance between adjacent first heat-generating element rows can be gradually increased, while the heat dissipation area of the second heat sink is kept unchanged, so that the effect of gradually increasing the heat dissipation area corresponding to the first heat-generating element rows is achieved.
In the above embodiments, for example, when the pitch between adjacent first heat-generating element rows increases, the density of the heat-generating elements on the substrate unit decreases, and when the heat dissipation area of the second heat sink increases, the overall occupied space of the substrate unit increases.
In order to balance the above drawbacks, in one possible embodiment, the substrate unit 20 includes a first heat dissipation area 23 near the air inlet 11 and a second heat dissipation area 24 near the air outlet 12; in the first heat dissipation area 23, the distance between adjacent first heat generating element rows 21 is kept constant, and the heat dissipation area of the second heat dissipation fins 32 increases in the first direction; in the second heat dissipation region 24, the heat dissipation area of the second heat dissipation fin 32 is kept constant, and the pitch between adjacent first heat generation element rows 21 increases in the first direction.
That is, in the present embodiment, the above-mentioned change of the pitch between adjacent first heat-generating element rows and the change of the heat dissipation area of the second heat sink are combined and applied, so that the structural limitation caused by the separate application can be avoided.
In one possible embodiment, in the first heat dissipation area 23, the spacing between adjacent first heat generation element rows 21 is kept constant at the first spacing d 1; in the second heat dissipation region 24, the spacing between adjacent first heat generating element rows 21 increases from the first spacing d1 to a second spacing d2 along the first direction, wherein the second spacing d2 is greater than the first spacing d 1.
Referring to fig. 6, in the first heat dissipation area, for example, the pitch of the adjacent first heat-generating element columns is kept constant at a smaller first pitch, and then, in the second heat dissipation area, the pitch of the adjacent first heat-generating element columns is gradually increased from the smaller first pitch to a larger second pitch; that is, in the first heat dissipation area, the temperature difference between the heat generating elements and the cooling air is gradually reduced by virtue of the gradually increasing heat dissipation area of the second heat dissipation fins, and in the second heat dissipation area, in order to overcome the structural limitation caused by the continuously increasing heat dissipation area of the second heat dissipation fins, the distance between the adjacent first heat generating element rows can be gradually increased, so that the temperature difference between the heat generating elements and the cooling air is gradually reduced.
In one possible embodiment, in the first heat dissipation area 23, the height of the second heat dissipation fin 32 increases along the first direction, so that the heat dissipation area of the second heat dissipation fin 32 increases along the first direction; in the second heat dissipation area 24, the height of the second heat dissipation fin 32 is kept constant, so that the heat dissipation area of the second heat dissipation fin 32 is kept constant.
With reference to fig. 7 and 8, in the present embodiment, the heat dissipation area of the second heat dissipation plate is changed by changing the height of the second heat dissipation plate, so as to change the heat dissipation area corresponding to the first heat generation element row; for example, the height of the second heat sink is gradually increased from the first height to the second height in the first heat dissipation region, and then the second heat sink is kept constant at the second height in the second heat dissipation region.
More specifically, in the first heat dissipation region, for example, referring to fig. 7, the height of the second heat dissipation fin increases linearly in the first direction, or, referring to fig. 8, the height of the second heat dissipation fin increases stepwise in the first direction.
In one possible embodiment, in the first heat dissipation area 23, the density of the parallel spaced second heat dissipation fins 32 increases along the first direction, so that the heat dissipation area of the second heat dissipation fins 32 increases along the first direction; in the second heat dissipation area 24, the density of the parallel spaced arrangement of the second heat dissipation fins 32 is kept constant, so that the heat dissipation area of the second heat dissipation fins is kept constant.
With reference to fig. 9 and 10, in the present embodiment, the heat dissipation area of the second heat dissipation plate is changed by changing the parallel spacing density of the second heat dissipation plate, so as to change the heat dissipation area corresponding to the first heat generation element row; for example, the density of the second fins is gradually increased from the first density (portion Q1 in fig. 10) to the second density (portion Q8 in fig. 10) in the first heat dissipation region, and then the second fins are kept constant at the second density (portion Q8 in fig. 10) in the second heat dissipation region.
In one possible embodiment, a plurality of substrate units are stacked in parallel within the housing unit. In combination with the above description and fig. 2 and 3, since the flow velocity is uniform throughout the cross section perpendicular to the first direction after the cooling air flows through the first flow equalizing region, when the plurality of substrate units are stacked, the flow velocity of the cooling air that can be received between the substrate units is uniform, thereby enabling the substrate units to radiate heat uniformly from each other.
In one possible embodiment, the second end of the substrate unit 20 close to the outlet 12 is spaced apart from the outlet 12 by a second distance, so that a second flow equalizing region 14 is formed between the second end of the substrate unit 20 and the outlet 12.
Referring to fig. 2, when the air outlet is close to the force calculation plate, there is no space to form a negative pressure region, which may affect the temperature equalization effect, in this embodiment, the air outlet is also lengthened similarly to the first flow equalization region, i.e., a second flow equalization region may be further disposed between the second end of the substrate unit near the air outlet and the air outlet, and then a negative pressure fan is disposed at the air outlet, so that the second flow equalization region may avoid the influence of the fan shaft, and may further make the flow velocity of the cooling air uniform on the cross section perpendicular to the flow direction; the second distance is between the diameter of the hub of the negative pressure fan at the air outlet and half of the diameter of the hub.
In one possible embodiment, a wind deflector 50 is disposed in the first flow equalizing region 13, one end of the wind deflector 50 is connected to the first end of the substrate unit 20, and the other end of the wind deflector 50 is connected to the wind inlet 11; and/or, a flow equalizing plate 60 is arranged in the first flow equalizing area 13, the flow equalizing plate 60 is arranged perpendicular to the first direction, and flow equalizing through holes are arranged on the flow equalizing plate 60.
That is, in this embodiment, in order to better adjust the uniformity of the flow velocity of the cooling air, on one hand, referring to fig. 11, an air deflector may be disposed in the first flow equalizing region, and two ends of the air deflector are respectively connected to the first end of the substrate unit and the air inlet, so that it can be understood that, according to actual needs and measurement, the air deflector can uniformly divide the cooling air by adjusting the inclination angle of the air deflector, and thus the cooling air can uniformly dissipate heat of the substrate unit on the cross section perpendicular to the flow direction of the cooling air; on the other hand, referring to fig. 12, a flow equalizing plate may be disposed in the first flow equalizing region, the flow equalizing plate being perpendicular to the first direction, and flow equalizing through holes being disposed on the flow equalizing plate, so that it can be understood that the flow equalizing plate can adjust the uniformity of the cooling air on the cross section perpendicular to the flow direction by adjusting the distribution and the aperture of the flow equalizing through holes according to actual needs and measurements, thereby uniformly dissipating heat from the substrate unit.
In the above embodiments, the air deflector and the flow equalizing plate can be used separately or in combination.
In one possible implementation, the second surface is provided with a plurality of second heating element rows along the first direction; in the first heat dissipation area, the distance between adjacent second heating element rows is kept unchanged, and the heat dissipation area of the first heat dissipation sheet is increased progressively along the first direction; in the second heat dissipation area, the heat dissipation area of the first heat dissipation plate is kept unchanged, and the distance between adjacent second heating element rows is increased progressively along the first direction.
In the above description, the case where the heating element is disposed on one surface of the substrate unit, that is, the first heating element row is disposed on the first surface of the substrate unit, it can be understood that the heating element may also be disposed on both surfaces of the substrate unit, that is, the second surface is disposed with a plurality of second heating element rows along the first direction, and at this time, similarly, the arrangement of the second heating element rows and the first heat sink may refer to the above embodiments, and will not be described again.
Specifically, with respect to the determination of the first pitch and the second pitch and the division of the first heat dissipation area and the second heat dissipation area in the above embodiments, the following steps may be referred to for one possible implementation method.
The method comprises the following specific steps:
s1, performing thermal simulation of a single heating element (at this time, the heat dissipation area of the chip is large enough) according to a temperature equalization optimization condition (the heating power of the heating element and the air volume of the fan unit), and preliminarily determining an optimal distance d2 (the second distance) required by the single heating element and a temperature difference Δ T1 between the heating element and the cooling air according to a simulation result, thereby determining that the temperature of the chip of the hottest heating element can be theoretically reduced to T2+ Δ T1 under the optimization condition of the substrate unit, where T2 is the temperature of the cooling medium at a position of the substrate unit near the air outlet, and further determining a target temperature T ═ T of the temperature equalization optimization of the substrate unit.
And S2, performing thermal simulation on a plurality of heating elements according to the temperature equalization optimization working condition (the heating power of the heating elements and the air volume of the fan unit), wherein the plurality of heating elements are arranged at the minimum equal interval d1 (the first interval) along the flow direction of cooling air, so as to determine the temperature difference delta t2 between the heating elements and the cooling air under the condition of the minimum interval d 1.
S3, assuming that the total number of the first heating element rows arranged along the flow direction of the cooling air on the substrate unit is n, the temperature rise of the cooling air passing through the single first heating element row can be calculated according to the theory of the optimized working condition (the heating power of the heating elements and the air volume of the fan unit)
Figure BDA0002622436040000121
Assuming that the number of the first heat-generating element rows arranged at the minimum pitch d1 in the first heat dissipation area is m, the chip temperature Tm in the m-th row is T1+ m Δ T3+ Δ T2, where T1 is the temperature of the cooling medium at the position of the substrate unit near the air inlet, and the temperature is calculated accordingly
Figure BDA0002622436040000122
Rounding to determine a boundary line between the first heat-generating element row arranged at the minimum pitch and the pitch-increased row, i.e., the boundary line 22 between the first heat-dissipating area and the second heat-dissipating area.
S4, the distance between the first heating element rows in the second heat dissipation area is gradually sparse, the heat dissipation area of the aluminum substrate (substrate unit) is increased by widening the distance between the first heating element rows, the temperature difference between the heating elements and cooling air is reduced, the reduced temperature difference value is used for balancing a temperature rise value delta t3 caused by the fact that the cooling air absorbs heat through the heating element rows, therefore, the temperature of the chips of the first heating element rows in the second heat dissipation area is kept at a target temperature t, the specific distance change gradient size can be determined according to thermal simulation adjustment of the whole machine, the arrangement space needed by the n first heating element rows in the substrate unit arrangement is determined, and further the length of the substrate unit is determined.
S5, the first heat dissipation area is arranged with the first heat generating element row spacing according to d1 equal spacing, if the second heat dissipation plate structure size in the area is consistent, the temperature of the first heating element row is influenced by the temperature rise of the cooling wind along the flow direction, the first heating element row from the air inlet to the last first heating element row close to the air outlet is in a linear climbing form, and the second radiating fins on the aluminum substrate are used as a main radiating path, and the chip temperature Tm of the last row of the first heat-generating element rows in the first heat dissipation area is used as the target temperature for temperature equalization, therefore, the heat dissipation area of the second heat dissipation plate in the first heat dissipation area needs to be adjusted along the rule that the flow direction of cooling air increases gradually, the temperature difference between the first heating element row and the cooling air is increased by reducing the heat dissipation area of the second heat dissipation fins close to the air inlet, and the increased temperature difference is used for balancing the temperature rise value delta t3 caused by the fact that the cooling air absorbs heat through the first heating element row. The size and the change gradient of the second radiating fin can be adjusted according to the temperature rise of cooling air, the area of the second radiating fin is smaller at the lower position of the cooling air temperature, so that the temperature difference between the heating element at the position and the cooling air is increased, and the temperature of the chip of the first heating element row in the first radiating area is controlled at a target temperature t.
The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.
The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".
It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of exemplary aspects and embodiments have been discussed above, those of skill in the art will recognize that certain variations, modifications, alterations, additions and sub-combinations thereof are encompassed within the scope of the invention.

Claims (15)

1. A temperature-equalizing heat dissipation device of an electronic device, the temperature-equalizing heat dissipation device comprising:
the air conditioner comprises a shell unit (10), wherein the shell unit (10) is provided with an air inlet (11) and an air outlet (12) which are oppositely arranged along a first direction;
the base plate unit (20) is arranged in the shell unit (10), the base plate unit (20) comprises a first surface and a second surface, and the first surface and the second surface extend from the air inlet (11) to the air outlet (12);
the first end of the substrate unit (20) close to the air inlet (11) is a first distance away from the air inlet (11), so that a first flow equalizing region (13) is formed between the first end of the substrate unit (20) and the air inlet (11).
2. The temperature-equalizing heat dissipation device according to claim 1, wherein a fan unit (40) is disposed at the air inlet (11), and a blowing direction of the fan unit (40) is from the air inlet (11) to the air outlet (12);
the first distance is not less than a value (D)02)/tan theta, wherein D0Theta is a deviation angle of an air blowing direction of the fan unit from the first direction, and theta is a hub diameter of the fan unit (40).
3. The temperature-equalizing heat sink according to claim 2, wherein the first distance is not greater than a value D/tan θ, where D is an impeller diameter of the fan unit (40).
4. The temperature-equalizing heat sink device according to claim 1, further comprising:
a fin unit (30) including a plurality of first fins (31) and a plurality of second fins (32), the plurality of first fins (31) being arranged in parallel at intervals on the first surface in a second direction perpendicular to the first direction, the plurality of second fins (32) being arranged in parallel at intervals on the second surface in the second direction;
wherein, along the first direction, a plurality of first heating element rows (21) are arranged on the first surface at intervals, and the heat dissipation area of the first heating element rows (21) increases progressively along the first direction.
5. The temperature-equalizing heat sink device as recited in claim 4,
the distance between the adjacent first heat-generating element rows (21) is kept constant along the first direction, and the heat dissipation area of the second heat dissipation fins (32) is increased, so that the heat dissipation area of the first heat-generating element rows (21) is increased along the first direction; alternatively, the first and second electrodes may be,
along the first direction, the heat dissipation area of the second heat dissipation fins (32) is kept constant, and the distance between adjacent first heat-generating element columns (21) is increased, so that the heat dissipation area of the first heat-generating element columns (21) is increased along the first direction.
6. The temperature-equalizing heat sink according to claim 4, wherein the substrate unit (20) comprises a first heat dissipation area (23) adjacent to the air inlet (11) and a second heat dissipation area (24) adjacent to the air outlet (12);
in the first heat dissipation area (23), the distance between the adjacent first heat generating element rows (21) is kept constant, and the heat dissipation area of the second heat dissipation fins (32) is increased along the first direction;
in the second heat dissipation area (24), the heat dissipation area of the second heat dissipation fins (32) is kept constant, and the distance between adjacent first heat generation element columns (21) increases along the first direction.
7. The temperature-equalizing heat sink device according to claim 6,
in the first heat dissipation area (23), the spacing between adjacent first heat-generating element columns (21) is kept constant at a first spacing;
in the second heat dissipation area (24), along the first direction, the pitch of the adjacent first heat generation element columns (21) increases from the first pitch to a second pitch, and the second pitch is larger than the first pitch.
8. The temperature-equalizing heat sink device according to claim 6,
at the first heat dissipation region (23), the height of the second heat dissipation fin (32) increases along the first direction, so that the heat dissipation area of the second heat dissipation fin (32) increases along the first direction;
in the second heat dissipation area (24), the height of the second heat dissipation fin (32) is kept constant, so that the heat dissipation area of the second heat dissipation fin (32) is kept constant.
9. The temperature-equalizing heat sink device according to claim 8,
-in the first heat dissipation area (23), the height of the second heat sink (32) increases linearly in the first direction; alternatively, the first and second electrodes may be,
in the first heat dissipation region (23), the height of the second heat dissipation fin (32) is increased stepwise in the first direction.
10. The temperature-equalizing heat sink device according to claim 6,
in the first heat dissipation area (23), the density of the parallel spaced arrangement of the second heat dissipation fins (32) increases along the first direction, so that the heat dissipation area of the second heat dissipation fins (32) increases along the first direction;
in the second heat dissipation area (24), the density of the parallel spaced arrangement of the second heat dissipation fins (32) is kept constant, so that the heat dissipation area of the second heat dissipation fins (32) is kept constant.
11. The temperature-equalizing heat sink device according to claim 1, wherein a plurality of the substrate units (20) are stacked in parallel in the housing unit (10).
12. The uniform-temperature heat sink according to claim 1, wherein the second end of the substrate unit (20) close to the air outlet (12) is at a second distance from the air outlet (12), so that a second uniform-flow region (14) is formed between the second end of the substrate unit (20) and the air outlet (12).
13. The temperature-equalizing heat sink device according to claim 12, wherein a negative pressure fan is disposed at the air outlet, and the second distance is between half of a hub diameter of the negative pressure fan and the hub diameter.
14. The temperature-equalizing heat sink device as claimed in any one of claims 1 to 13,
an air deflector (50) is arranged in the first flow equalizing area (13), one end of the air deflector (50) is connected to the first end of the substrate unit (20) in an overlapping mode, and the other end of the air deflector (50) is connected to the air inlet (11) in an overlapping mode; and/or the presence of a gas in the gas,
the first flow equalizing area (13) is provided with a flow equalizing plate (60), the flow equalizing plate (60) is perpendicular to the first direction, and flow equalizing through holes are formed in the flow equalizing plate (60).
15. The temperature-equalizing heat sink device according to any one of claims 6 to 13, wherein the second surface is provided with a plurality of second heating element rows along the first direction;
in the first heat dissipation area (23), the distance between adjacent second heat generating element columns is kept unchanged, and the heat dissipation area of the first heat dissipation sheet (31) is increased along the first direction;
in the second heat dissipation area (24), the heat dissipation area of the first heat dissipation fins (31) is kept constant, and the distance between adjacent second heat generation element columns increases along the first direction.
CN202010787207.3A 2020-08-07 2020-08-07 Uniform temperature heat dissipation device of electronic equipment Pending CN111867338A (en)

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