WO2021098149A1 - 表面等离激元增强型InGaN/GaN多量子阱光电极及其制备方法 - Google Patents
表面等离激元增强型InGaN/GaN多量子阱光电极及其制备方法 Download PDFInfo
- Publication number
- WO2021098149A1 WO2021098149A1 PCT/CN2020/087443 CN2020087443W WO2021098149A1 WO 2021098149 A1 WO2021098149 A1 WO 2021098149A1 CN 2020087443 W CN2020087443 W CN 2020087443W WO 2021098149 A1 WO2021098149 A1 WO 2021098149A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- quantum well
- gan
- ingan
- multiple quantum
- metal
- Prior art date
Links
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 61
- 238000005516 engineering process Methods 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 11
- 229910002601 GaN Inorganic materials 0.000 claims description 96
- 239000002061 nanopillar Substances 0.000 claims description 23
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 18
- 239000003792 electrolyte Substances 0.000 claims description 18
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 16
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 229910001868 water Inorganic materials 0.000 claims description 10
- 239000000725 suspension Substances 0.000 claims description 9
- 238000004151 rapid thermal annealing Methods 0.000 claims description 8
- 239000011780 sodium chloride Substances 0.000 claims description 8
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 7
- 239000000243 solution Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000002923 metal particle Substances 0.000 claims description 6
- 238000005566 electron beam evaporation Methods 0.000 claims description 5
- 229910000042 hydrogen bromide Inorganic materials 0.000 claims description 5
- 239000012266 salt solution Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 4
- 229910000510 noble metal Inorganic materials 0.000 claims description 4
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 4
- 150000007522 mineralic acids Chemical class 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 230000005672 electromagnetic field Effects 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract description 4
- 238000010168 coupling process Methods 0.000 abstract description 4
- 238000005859 coupling reaction Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- 230000005684 electric field Effects 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 239000002073 nanorod Substances 0.000 abstract 2
- 238000001228 spectrum Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 11
- 239000010931 gold Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 230000031700 light absorption Effects 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000002082 metal nanoparticle Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000002070 nanowire Substances 0.000 description 2
- 230000001699 photocatalysis Effects 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/02—Hydrogen or oxygen
- C25B1/04—Hydrogen or oxygen by electrolysis of water
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/50—Processes
- C25B1/55—Photoelectrolysis
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/36—Hydrogen production from non-carbon containing sources, e.g. by water electrolysis
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
- Y02P20/133—Renewable energy sources, e.g. sunlight
Definitions
- the invention relates to a surface plasmon-enhanced InGaN/GaN multiple quantum well photoelectrode, a solar photoelectrochemical cell prepared by using the surface plasmon-enhanced InGaN/GaN multiple quantum well photoelectrode, and a preparation method thereof, belonging to Solar cell technology field.
- the basic principle of the solar photoelectrochemical cell is that the photoelectrode material absorbs the energy of a certain wavelength of sunlight, generates electron-hole pairs inside the material, and separates each other under the action of an external voltage or internal electric field, and the holes move to the anode surface for electrolyte oxidation In the reaction, the electrons move to the vicinity of the cathode to carry out the electrolyte reduction reaction and generate the hydrogen energy that we need.
- the semiconductor photoelectrode material is its core component, which can be divided into two types: photoanode and photocathode. Due to the lower solar energy conversion efficiency, the choice of photoanode material has become a hot issue in solar photocell research.
- Group III nitride materials have attracted wide attention due to their stable physical and chemical properties, high electron mobility and energy bands that can meet the requirements of water redox potential, especially the band gap of InGaN and its alloy materials is continuous from 0.7eV to 3.4eV Adjustable, can design electrode materials that meet the requirements according to requirements.
- noble metals such as Au, Ag, Cu and other nanoparticles exhibit strong broadband light absorption characteristics in the visible light region.
- the purpose of the present invention is to provide a surface plasmon enhanced InGaN/GaN multiple quantum well photoelectrode.
- the technical scheme adopted by the present invention is: a surface plasmon-enhanced InGaN/GaN multiple quantum well photoelectrode, which exposes the In x Ga 1-x N/GaN multiple quantum well active layer by controlling the etching depth of the nano-column , The position of the active layer of the multiple quantum well between the In x Ga 1-x N/GaN nano-pillars is filled with plasmon metal, where 0 ⁇ x ⁇ 1.
- the substrate material of the plasmon-enhanced InGaN/GaN multiple quantum well photoelectrode is a general blue/green LED epitaxial wafer, and the substrate is etched to form a penetrating p-GaN layer, as deep as In x Ga 1- x N/GaN multiple quantum well active layer nano-column structure, the diameter of the nano-column is 70-500 nm, and the thickness of the In x Ga 1-x N/GaN multiple quantum well active layer is 150-250 nm.
- the plasmonic metal is spherical or cylindrical, with a spherical diameter of 10 to 200 nm, a cylindrical diameter of 10 to 50 nm, and a height of 50 to 200 nm.
- the plasmonic metal is selected from Au, Ag, and Cu.
- the invention also discloses a solar photoelectrochemical cell, which includes a working level, a counter electrode, a reference electrode, an electrolytic cell, and an external circuit.
- the external circuit includes a positive and negative electrode, the negative electrode is connected to the counter electrode, and the positive electrode is connected in parallel with the working electrode and
- the reference electrode, the electrolytic cell is filled with electrolyte, the working level, the counter electrode, and the reference electrode are all inserted into the electrolyte, characterized in that: the working electrode is the surface according to any one of claims 1 to 3, etc. Ion-enhanced InGaN/GaN multiple quantum well photoelectrode.
- the invention also discloses a method for preparing a surface plasmon-enhanced InGaN/GaN multiple quantum well photoelectrode, the steps of which include:
- the Ni metal film on the surface of the insulating layer is annealed at a high temperature to form Ni metal particles, which serve as a nano-pillar etching mask;
- step 7 Using rapid thermal annealing technology, the sample obtained in step 7 is subjected to rapid thermal annealing under N 2 atmosphere to form an ohmic contact;
- the invention also discloses a preparation method of the solar photoelectrochemical cell, which comprises the following steps:
- the electrolyte is water or acid-base salt solution, including NaCl, HBr, NaOH or KOH.
- the counter electrode can be platinum or gold precious metals.
- precious metals you need to meet: one is to provide good conductivity; the other is that the metal material hardly reacts with any acid-base salt solution, and has high chemical stability; the third is the metal work function of the metal and the commonly used electrolyte The fermi level of the solution is close, and it is not easy to form an energy barrier at the interface between the metal and the electrolyte, so it will not hinder the photoelectrochemical reaction.
- the reference electrode is Ag/AgCl, which is mainly used to measure the relative potential difference between the semiconductor electrode and the Pt electrode.
- the electrolyte should not only provide a suitable oxidation-reduction potential, but also avoid photochemical reactions with the photoelectrode material.
- Water or acid-base salt solutions can be selected, including but not limited to NaCl, HBr, NaOH, KOH.
- the plasmonic metal used for surface plasmon enhancement can be selected from Au, Ag, Cu and other noble metals whose light absorption band is in the visible light band.
- the light absorption range of the metal can be adjusted to make It has more absorption spectrum overlap with semiconductor materials, and can better couple to achieve the purpose of enhancing the efficiency of solar photochemical cells.
- the external circuit includes positive and negative electrodes, the negative electrode is connected to the counter electrode, the working electrode and the reference electrode are connected in parallel, and the bias voltage is set from -5V to 20V.
- the present invention etches the InGaN/GaN multi-quantum well nano-column structure through the self-assembled Ni mask top-down etching method, exposing the InGaN/GaN multi-quantum well part, and lays the nano metal so that it can be more than InGaN/GaN.
- the active regions of the quantum wells are coupled with each other, so that the efficiency of the solar photoelectrochemical cell is effectively improved.
- the invention uses the nano-metal surface plasmon effect to enhance the InGaN/GaN multi-quantum well photoelectrode to realize high-efficiency photocatalytic water splitting and hydrogen production.
- the InGaN/GaN multiple quantum well nanocolumn structure is etched by etching technology, so that the nano metal can be coupled with the InGaN/GaN multiple quantum well active area.
- the solar simulator Due to the light absorption band of the plasma metal There is a certain overlap with the absorption band of the InGaN/GaN multiple quantum well active region. Plasma metal and the multiple quantum well active region produce close electromagnetic field coupling.
- the electromagnetic field on the surface of the InGaN/GaN multiple quantum well will accelerate the photogenerated electrons generated in the surface region.
- the separation of hole pairs further promotes the generation of electron-hole pairs at the interface of multiple quantum wells, transfers the energy in the metal to the semiconductor surface, increases the rate of electron-hole pair generation on the surface of the quantum well, and improves the light absorption capacity of the photoelectrode.
- This method can reasonably adjust the light absorption range of metal nanoparticles by changing the size and shape of the metal nanoparticle, so that it can overlap as much as possible with the absorption spectrum of the InGaN/GaN multiple quantum well active region. This is an effective way to improve solar photoelectrochemistry.
- the method of battery efficiency is an effective way to improve solar photoelectrochemistry.
- FIG. 1 is a schematic diagram of the structure of the InGaN/GaN multiple quantum well LED substrate obtained in step A1 of the present invention.
- FIG. 3 is a schematic diagram of the deposition of a Ni metal film layer on the InGaN/GaN multiple quantum well LED obtained in step A2 of the present invention.
- FIG. 4 is a schematic diagram of the structure of the Ni particle mask formed on the surface of the InGaN/GaN multiple quantum well LED obtained in step A3 of the present invention.
- FIG. 5 is a schematic diagram of the structure of the disordered nano-pillar array on the SiO 2 insulating layer obtained in step A4 of the present invention.
- Fig. 6 is a schematic structural diagram of the InGaN/GaN multiple quantum well nanopillar array obtained in step A5 of the present invention (with SiO 2 and metal on the top).
- FIG. 7 is a schematic structural diagram of the InGaN/GaN multiple quantum well nanopillar array obtained in step A5 of the present invention.
- FIG. 8 is a schematic structural diagram of an InGaN/GaN multiple quantum well nanopillar array with n-type GaN steps obtained in step A6 of the present invention.
- FIG. 9 is a schematic diagram of the structure of the InGaN/GaN multiple quantum well nano-column photoelectrode obtained in step A7 of the present invention.
- step B of the present invention is a schematic diagram of the structure of the InGaN/GaN multi-quantum well nano-column photoelectrode deposited with nano-metal obtained in step B of the present invention.
- step E of the present invention is a schematic diagram of the working state of the solar photoelectrochemical cell obtained in step E of the present invention.
- Figure 12 shows the photoelectric conversion efficiency of InGaN/GaN multiple quantum well nanopillars containing plasmonic metals.
- Figure 13 shows the photocurrent of InGaN/GaN multiple quantum well nanopillars containing plasmonic metals.
- 1 is the sapphire substrate layer
- 2 is the undoped u-GaN layer
- 3 is the n-type GaN layer
- 4 is the In x Ga 1-x N/GaN quantum well active layer
- 5 is the p Type GaN layer
- 6 is a silicon dioxide dielectric film layer
- 7 is a Ni metal film layer
- 8 is a Ti/Al/Ni/Au metal electrode layer
- 9 is a nano-structured plasma metal.
- the preparation method of the solar photoelectrochemical cell includes the following steps:
- A1 In the InGaN/GaN multi-quantum well LED substrate with an In composition of 0.3, an emission wavelength of 510nm, and a quantum well period of 10 (as shown in Figure 1, it includes an n-type GaN layer 3 with a thickness of 2 ⁇ m, and the period is In x Ga 1-x N/GaN quantum well active layer 4 with a thickness of 10 and 150 nm (the thickness of the InGaN well layer is 3 nm, the thickness of the GaN barrier layer is 12 nm) and the p-type GaN layer 5 with a thickness of 500 nm)
- a 200nm thick SiO 2 dielectric film layer 6 is grown on top, as shown in FIG. 2, a 10nm thick Ni metal film 7 is vapor-deposited on the surface of the SiO 2 dielectric film 6, as shown in FIG. 3;
- step A2 Using rapid thermal annealing technology, the sample obtained in step A is annealed for 3 minutes at 850°C in a nitrogen atmosphere, and a 10nm-thick Ni metal film is annealed to form Ni metal particles 7 with diameters ranging from 50-200nm, as shown in Figure 4. Shown
- etching parameters CF 4 and O 2 flow rates are 30sccm and 10sccm, power is 150W, pressure is 4Pa, and etching time is 3min40s;
- A6 Using electron beam evaporation technology, evaporate a Ti/Al/Ni/Au metal film layer on the n-type GaN step with a thickness of 30nm/150nm/50nm/100nm, as shown in Figure 9;
- thermal annealing is performed in N 2 atmosphere to form n-type ohmic contacts, annealing temperature is 750°C, annealing time is 30s;
- A8 Disperse the gold-coated silver plasmonic metal nanowires in a solvent, and sonicate them for 40-70 minutes to make the plasmonic metal distribute as evenly as possible in the solution to obtain a plasmonic metal suspension;
- the plasmon-enhanced InGaN/GaN multiple quantum well prepared in step B corresponds to the working electrode, Pt is the counter electrode, and Ag/AgCl is the reference electrode;
- the electrolyte can also be water or HBr, NaOH, KOH.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Photovoltaic Devices (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Abstract
Description
Claims (9)
- 一种表面等离激元增强型InGaN/GaN多量子阱光电极,其特征在于:通过控制纳米柱刻蚀深度,露出In xGa 1-xN/GaN多量子阱有源层,在In xGa 1-xN/GaN纳米柱之间的多量子阱有源层的位置填充等离金属,其中0≤x≤1。
- 根据权利要求1所述的表面等离激元增强型InGaN/GaN多量子阱光电极,其特征在于:其衬底材料为蓝光/绿光LED外延片,基片刻蚀形成贯穿p-GaN层,深至In xGa 1-xN/GaN多量子阱有源层的纳米柱结构,纳米柱直径为70~500nm,In xGa 1-xN/GaN多量子阱有源层厚度150~250nm。
- 根据权利要求1或2所述的表面等离激元增强型InGaN/GaN多量子阱光电极,其特征在于:所述等离金属为球形或圆柱形,球型直径10~200nm,圆柱型直径10~50nm,高度50~200nm,等离金属从Au、Ag、Cu中选择。
- 权利要求1-3中任一项所述的表面等离激元增强型InGaN/GaN多量子阱光电极在作为太阳能光电化学电池的工作电极中的应用。
- 一种太阳能光电化学电池,包括工作电级、对电极、参考电极、电解池、外电路,所述外电路包括正负电极,负电极连接对电极,正电极并联工作电极和参考电极,所述电解池中填充电解液,工作电级、对电极、参考电极均插入电解液中,其特征在于:所述工作电极为权利要求1-3中任一项所述的表面等离激元增强型InGaN/GaN多量子阱光电极。
- 根据权利要求5所述的太阳能光电化学电池,其特征在于:所述电池的偏压设置-5V~20V,所述电解液为水或酸碱盐溶液,包括NaCl、HBr、NaOH或KOH。
- 一种表面等离激元增强型InGaN/GaN多量子阱光电极的制备方法,其步骤包括:(1)、在InGaN/GaN多量子阱LED基片上采用PECVD技术生长一层SiO 2绝缘层;(2)、采用电子束蒸发技术,在绝缘层表面上蒸镀Ni金属膜层;(3)、采用快速热退火技术,使绝缘层表面的Ni金属膜层在高温下退火形成Ni金属颗粒,作为纳米柱刻蚀掩模;(4)、采用RIE技术,以Ni金属颗粒为掩模,通入CF 4和O 2的混合气体,各向异性刻蚀SiO 2绝缘层,得到无序的SiO 2纳米柱阵列结构;(5)、采用ICP技术,以SiO 2绝缘层为掩模,通入Cl 2和CF 4的混合气体,各向异性刻蚀p型氮化镓层、In xGa 1-xN/GaN多量子阱有源层,形成贯穿p型氮化镓层,深至In xGa 1-xN/GaN多量子阱有源层的InGaN/GaN多量子阱纳米柱阵列,将样品放置在无机酸、碱溶液水浴去除刻蚀损伤,然后去除残余的绝缘层;(6)、采用ICP技术,以适当大小的硅片为掩模,通入Cl 2和CF 4的混合气体,各向异性刻蚀p-GaN层、In xGa 1-xN/GaN量子阱有源层、n-GaN层,露出n型GaN,形成n型GaN台阶;(7)、采用电子束蒸发技术,在n型台阶上蒸镀Ti/Al/Ni/Au金属电极;(8)、采用快速热退火技术,在N 2氛围下对步骤7中所得的样品进行快速热退火处理,形成欧姆接触;(9)、将等离金属分散在乙醇溶剂中,超声,使等离金属在溶液中尽可能均匀分布,制得等离金属悬浊液;(10)、将制备的InGaN/GaN多量子阱基片置于热台上,将等离金属悬浊液滴在样品表面,然后烘烤,将等离金属悬浊液蒸干,使得等离金属分散在InGaN/GaN多量子阱纳米柱之间。
- 一种太阳能光电化学电池的制备方法,包括以下步骤:A、在电解池中倒入电解液;B、连接外电路,外电路的负电极连接对电极,正电极并联工作电极和参考电极,其中权利要求7制得的表面等离激元增强型InGaN/GaN多量子阱光电极作为工作电极,贵金属为对电极,Ag/AgCl为参考电极;C、将对电极、工作电极和参考电极插入NaCl电解液中,形成太阳能光电化学电池。
- 根据权利要求8所述的太阳能光电化学电池的制备方法,其特征在于:所述电解液为水或酸碱盐溶液,包括NaCl、HBr、NaOH或KOH。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911133039.X | 2019-11-19 | ||
CN201911133039.XA CN110835766B (zh) | 2019-11-19 | 2019-11-19 | 表面等离激元增强型InGaN/GaN多量子阱光电极及其制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021098149A1 true WO2021098149A1 (zh) | 2021-05-27 |
Family
ID=69576598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/087443 WO2021098149A1 (zh) | 2019-11-19 | 2020-04-28 | 表面等离激元增强型InGaN/GaN多量子阱光电极及其制备方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN110835766B (zh) |
WO (1) | WO2021098149A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110835766B (zh) * | 2019-11-19 | 2021-03-23 | 南京集芯光电技术研究院有限公司 | 表面等离激元增强型InGaN/GaN多量子阱光电极及其制备方法 |
CN114530759B (zh) * | 2020-11-02 | 2023-04-07 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种表面等离激元激光器的制作方法 |
CN113192998A (zh) * | 2021-04-29 | 2021-07-30 | 京东方科技集团股份有限公司 | 一种显示装置及其制备方法 |
CN113279008B (zh) * | 2021-05-18 | 2022-03-22 | 河北工业大学 | 一种用于人工光合作用氮化镓串联cigs的器件及其制备方法 |
CN113451881B (zh) * | 2021-06-29 | 2022-07-12 | 南京大学 | 栅状电极增强表面等离激元激光器及其制备方法 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101364482A (zh) * | 2008-09-19 | 2009-02-11 | 南京大学 | 一种可见光铟镓氮基光电化学电池及制备方法 |
CN103094434A (zh) * | 2012-11-27 | 2013-05-08 | 南京大学 | ICP刻蚀GaN基多量子阱制备纳米阵列图形的方法 |
CN103325901A (zh) * | 2013-05-22 | 2013-09-25 | 中国科学院半导体研究所 | 垂直结构表面等离激元增强GaN基纳米柱LED及制备方法 |
CN103325900A (zh) * | 2013-05-22 | 2013-09-25 | 中国科学院半导体研究所 | 表面等离激元增强GaN基纳米柱LED及制备方法 |
CN104868023A (zh) * | 2015-05-11 | 2015-08-26 | 南京大学 | Iii族氮化物半导体/量子点混合白光led器件及其制备方法 |
CN105552149A (zh) * | 2015-11-16 | 2016-05-04 | 华南师范大学 | 基于自支撑GaN衬底的高In组分InGaN/GaN量子阱结构太阳能电池及其制法 |
WO2018136323A1 (en) * | 2017-01-23 | 2018-07-26 | Sabic Global Technologies B.V. | Electrochemical apparatus and its use for screening of nanostructure catalysts |
CN108550963A (zh) * | 2018-05-03 | 2018-09-18 | 南京大学 | 一种利用极化调控提高InGaN/GaN材料多量子阱太阳能光电化学电池效率的方法 |
WO2018203274A1 (en) * | 2017-05-03 | 2018-11-08 | Sabic Global Technologies B.V. | Indium gallium nitride nanostructure systems and uses thereof |
CN108855173A (zh) * | 2017-05-12 | 2018-11-23 | 中国科学院福建物质结构研究所 | 一种光电催化分解水产氢的方法及其中使用的等离子体催化剂和制法 |
CN109402653A (zh) * | 2018-09-29 | 2019-03-01 | 华南理工大学 | 一种Si衬底上InGaN纳米柱@Au纳米粒子复合结构及其制备方法与应用 |
CN110835766A (zh) * | 2019-11-19 | 2020-02-25 | 南京集芯光电技术研究院有限公司 | 表面等离激元增强型InGaN/GaN多量子阱光电极及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100418240C (zh) * | 2005-10-18 | 2008-09-10 | 南京大学 | 在β三氧化二镓衬底上生长InGaN/GaN量子阱LED器件结构的方法 |
WO2009021206A1 (en) * | 2007-08-08 | 2009-02-12 | The Regents Of The University Of California | Nonpolar iii-nitride light emitting diodes with long wavelength emission |
CN101922015B (zh) * | 2010-08-25 | 2012-07-04 | 中国科学院半导体研究所 | 一种InGaN半导体光电极的制作方法 |
CN102304738B (zh) * | 2011-07-22 | 2013-07-31 | 南京大学 | 铟镓氮基光电极的表面处理方法 |
WO2013147946A1 (en) * | 2012-03-30 | 2013-10-03 | The Regents Of The University Of Michigan | Gan-based quantum dot visible laser |
CN103966621B (zh) * | 2014-01-21 | 2016-07-13 | 南京大学 | 一种布拉格反射镜增强InGaN电极、制备与利用 |
CN105405938B (zh) * | 2015-12-29 | 2018-06-19 | 中国科学院半导体研究所 | 可见光通信用单芯片白光led及其制备方法 |
CN106129204B (zh) * | 2016-08-02 | 2018-09-14 | 南京大学 | 表面等离激元增强InGaN/GaN偏振出光LED及其制备方法 |
CN106785913A (zh) * | 2017-01-04 | 2017-05-31 | 南京大学 | GaN基金属‑超薄氧化物‑半导体的复合结构纳米激光器及其制备方法 |
CN108193230B (zh) * | 2017-12-29 | 2019-07-30 | 厦门理工学院 | 一种钽衬底上生长InxGa1-xN纳米线的光电极及其制备方法 |
CN108615797B (zh) * | 2018-04-28 | 2019-07-02 | 南京大学 | 具有表面等离激元圆台纳米阵列的AlGaN基紫外LED器件及其制备方法 |
CN109825843B (zh) * | 2019-01-28 | 2021-02-05 | 北京工业大学 | 一种基于多晶GaN纳米线的自支撑电催化制氢电极 |
CN110112172B (zh) * | 2019-05-22 | 2021-06-22 | 南京大学 | 基于氮化镓纳米孔阵列/量子点混合结构的全色微米led显示芯片及其制备方法 |
CN110311023A (zh) * | 2019-06-24 | 2019-10-08 | 南京大学 | 利用表面等离激元增强led光通信器件及其制备方法 |
-
2019
- 2019-11-19 CN CN201911133039.XA patent/CN110835766B/zh active Active
-
2020
- 2020-04-28 WO PCT/CN2020/087443 patent/WO2021098149A1/zh active Application Filing
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101364482A (zh) * | 2008-09-19 | 2009-02-11 | 南京大学 | 一种可见光铟镓氮基光电化学电池及制备方法 |
CN103094434A (zh) * | 2012-11-27 | 2013-05-08 | 南京大学 | ICP刻蚀GaN基多量子阱制备纳米阵列图形的方法 |
CN103325901A (zh) * | 2013-05-22 | 2013-09-25 | 中国科学院半导体研究所 | 垂直结构表面等离激元增强GaN基纳米柱LED及制备方法 |
CN103325900A (zh) * | 2013-05-22 | 2013-09-25 | 中国科学院半导体研究所 | 表面等离激元增强GaN基纳米柱LED及制备方法 |
CN104868023A (zh) * | 2015-05-11 | 2015-08-26 | 南京大学 | Iii族氮化物半导体/量子点混合白光led器件及其制备方法 |
CN105552149A (zh) * | 2015-11-16 | 2016-05-04 | 华南师范大学 | 基于自支撑GaN衬底的高In组分InGaN/GaN量子阱结构太阳能电池及其制法 |
WO2018136323A1 (en) * | 2017-01-23 | 2018-07-26 | Sabic Global Technologies B.V. | Electrochemical apparatus and its use for screening of nanostructure catalysts |
WO2018203274A1 (en) * | 2017-05-03 | 2018-11-08 | Sabic Global Technologies B.V. | Indium gallium nitride nanostructure systems and uses thereof |
CN108855173A (zh) * | 2017-05-12 | 2018-11-23 | 中国科学院福建物质结构研究所 | 一种光电催化分解水产氢的方法及其中使用的等离子体催化剂和制法 |
CN108550963A (zh) * | 2018-05-03 | 2018-09-18 | 南京大学 | 一种利用极化调控提高InGaN/GaN材料多量子阱太阳能光电化学电池效率的方法 |
CN109402653A (zh) * | 2018-09-29 | 2019-03-01 | 华南理工大学 | 一种Si衬底上InGaN纳米柱@Au纳米粒子复合结构及其制备方法与应用 |
CN110835766A (zh) * | 2019-11-19 | 2020-02-25 | 南京集芯光电技术研究院有限公司 | 表面等离激元增强型InGaN/GaN多量子阱光电极及其制备方法 |
Non-Patent Citations (3)
Title |
---|
TAO TAO ET AL.: ""Significant improvements in InGaN/GaN nano-photoelectrodes for hydrogen generation by structure and polarization optimization"", SCIENTIFIC REPORTS, vol. 6, 8 February 2016 (2016-02-08), XP055814197, ISSN: 2045-2322 * |
YIMENG SANG; BIN LIU; TAO TAO; DI JIANG; YAOZHENG WU; XIANGTIAN CHEN; WENJUN LUO; JIANDONG YE; RONG ZHANG: "Plasmon-enhanced photoelectrochemical water splitting by InGaN/GaN nano-photoanodes", SEMICONDUCTOR SCIENCE TECHNOLOGY, IOP PUBLISHING LTD, GB, vol. 35, no. 2, 17 January 2020 (2020-01-17), GB, pages 025017, XP020350756, ISSN: 0268-1242, DOI: 10.1088/1361-6641/ab615a * |
YUN JIN-HYEON, CHO HAN-SU, BAE KANG-BIN, SUDHAKAR SELVAKUMAR, KANG YEON SU, LEE JONG-SOO, POLYAKOV ALEXANDER Y., LEE IN-HWAN: "Enhanced optical properties of nanopillar light-emitting diodes by coupling localized surface plasmon of Ag/SiO 2 nanoparticles", APPLIED PHYSICS EXPRESS, JAPAN SOCIETY OF APPLIED PHYSICS; JP, JP, vol. 8, no. 9, 1 September 2015 (2015-09-01), JP, pages 092002, XP055814191, ISSN: 1882-0778, DOI: 10.7567/APEX.8.092002 * |
Also Published As
Publication number | Publication date |
---|---|
CN110835766A (zh) | 2020-02-25 |
CN110835766B (zh) | 2021-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2021098149A1 (zh) | 表面等离激元增强型InGaN/GaN多量子阱光电极及其制备方法 | |
Yuan et al. | Cadmium sulfide-based nanomaterials for photocatalytic hydrogen production | |
Rosman et al. | Photocatalytic properties of two-dimensional graphene and layered transition-metal dichalcogenides based photocatalyst for photoelectrochemical hydrogen generation: an overview | |
Chu et al. | Solar water oxidation by an InGaN nanowire photoanode with a bandgap of 1.7 eV | |
AlOtaibi et al. | High efficiency photoelectrochemical water splitting and hydrogen generation using GaN nanowire photoelectrode | |
JP5743039B2 (ja) | 光半導体電極、およびそれを具備する光電気化学セルを用いて水を光分解する方法 | |
Chandrasekaran et al. | Nanostructured silicon photoelectrodes for solar water electrolysis | |
Dahal et al. | Realizing InGaN monolithic solar-photoelectrochemical cells for artificial photosynthesis | |
Atabaev | Plasmon-enhanced solar water splitting with metal oxide nanostructures: a brief overview of recent trends | |
Narangari et al. | Improved photoelectrochemical performance of GaN nanopillar photoanodes | |
Hong et al. | Preparation and enhanced photoelectrochemical performance of selenite-sensitized zinc oxide core/shell composite structure | |
CN108550963A (zh) | 一种利用极化调控提高InGaN/GaN材料多量子阱太阳能光电化学电池效率的方法 | |
WO2014034004A1 (ja) | 二酸化炭素還元用光化学電極、および該光化学電極を用いて二酸化炭素を還元する方法 | |
Liu et al. | Near-infrared CdSexTe1-x@ CdS “giant” quantum dots for efficient photoelectrochemical hydrogen generation | |
Zou et al. | Fabrication, optoelectronic and photocatalytic properties of some composite oxide nanostructures | |
Xu et al. | Correlations among morphology, composition, and photoelectrochemical water splitting properties of InGaN nanorods grown by molecular beam epitaxy | |
Butson et al. | Photoelectrochemical studies of InGaN/GaN MQW photoanodes | |
Tijent et al. | Recent advances in InGaN nanowires for hydrogen production using photoelectrochemical water splitting | |
Rashed et al. | Synthesis and characterization of Au: CuO nanocomposite by laser soldering on porous silicon for photodetector | |
KR101639616B1 (ko) | 금속 초박층을 포함하는 탠덤 구조의 광전기화학전지용 광전극 및 이를 포함하는 광전기화학전지 | |
Ganguly et al. | Production and storage of energy with one-dimensional semiconductor nanostructures | |
Khalid et al. | Metal oxide semiconductors for photoelectrochemical water splitting | |
Kumar | Photoelectrochemical splitting of water to produce a power appetizer Hydrogen: A green system for future–(A short review) | |
KR102155363B1 (ko) | 광전기화학전지용 광전극 및 그 제조방법과 광전극을 포함하는 광전기화학전지 | |
Sharma et al. | MoSe2 nanosheets/SiNWs heterojunction-based photocathode for efficient photoelectrochemical water splitting applications |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20889760 Country of ref document: EP Kind code of ref document: A1 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20889760 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 01/06/2023) |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20889760 Country of ref document: EP Kind code of ref document: A1 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20889760 Country of ref document: EP Kind code of ref document: A1 |