WO2021095553A1 - Dispositif de transport et procédé de transport - Google Patents

Dispositif de transport et procédé de transport Download PDF

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Publication number
WO2021095553A1
WO2021095553A1 PCT/JP2020/040728 JP2020040728W WO2021095553A1 WO 2021095553 A1 WO2021095553 A1 WO 2021095553A1 JP 2020040728 W JP2020040728 W JP 2020040728W WO 2021095553 A1 WO2021095553 A1 WO 2021095553A1
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WO
WIPO (PCT)
Prior art keywords
work
transport
width
center position
transport path
Prior art date
Application number
PCT/JP2020/040728
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English (en)
Japanese (ja)
Inventor
悠太 吉田
Original Assignee
株式会社エム・シー・ケー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社エム・シー・ケー filed Critical 株式会社エム・シー・ケー
Priority to JP2021556010A priority Critical patent/JPWO2021095553A1/ja
Priority to KR1020227019491A priority patent/KR20220100623A/ko
Publication of WO2021095553A1 publication Critical patent/WO2021095553A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Definitions

  • the present invention relates to a transport device and a transport method for transporting a work.
  • the work when processing such as attaching a film to a work such as a substrate, the work is conveyed to a target position and positioned.
  • a target position For example, when a substantially circular substrate on which a semiconductor is formed is transported to a target position, the substrate is imaged by a camera, and positioning is performed so that the center position of the substrate matches the target position.
  • a technique relating to an apparatus for positioning a work is described in, for example, Patent Document 1.
  • An object of the present invention is to position a workpiece more easily at a lower cost.
  • the transport device is A storage means for accommodating a work having an orientation flat
  • 1st sensor and A center position acquisition means for acquiring the center position of the work in a direction along the first transport path based on the longest passage distance among the passage distances of the work detected by the plurality of first sensors.
  • the transport means is characterized in that the work is installed in the installation means based on the center position of the work in a direction along the first transport path.
  • the workpiece can be positioned easily at a lower cost.
  • FIG. 1 is a side view schematically showing the configuration of the entire transport device 1 according to the present embodiment.
  • FIG. 2 is a top view schematically showing the configuration of the entire transport device 1 according to the present embodiment.
  • the transport device 1 transports a work 100 such as a substrate having an orientation flat (hereinafter, referred to as “orifra”) 101 from the rack 10 and positions it at a position for processing (here, film is attached). It is a device to be placed.
  • a work 100 such as a substrate having an orientation flat (hereinafter, referred to as “orifra”) 101 from the rack 10 and positions it at a position for processing (here, film is attached). It is a device to be placed.
  • orifra orientation flat
  • two optical sensors 40a and 40b installed at intervals wider than the width of the orientation flat 101 and narrower than the width of the work 100 are used without using expensive equipment such as a camera, and the work 100 is used.
  • the passing distance when the camera is conveyed in one direction is measured, and the center position of the work 100 in the conveying direction is detected based on the measured passing distance.
  • the direction intersecting the transport direction of the work 100 is regulated by the accommodation space of the rack 10, the straight-line accuracy of the arm 20 that transports the work 100, and the alignment action of the edge clamp 31 of the stage 30 on which the work 100 is placed. , Mechanically guarantees the accuracy of the position.
  • the transport device 1 includes a rack 10, an arm 20, a stage 30, optical sensors 40a and 40b, and a control unit 50.
  • the rack 10 is provided with a plurality of rails supporting the work 100 on opposite side walls in the room, and by holding the work 100 on one set of facing rails, the rack 10 accommodates the plurality of work 100 in a stacked state.
  • an optical sensor 10a for detecting the amount of protrusion of the work 100 is installed in the opening 11 of the rack 10. When the optical sensor 10a detects that the work 100 protrudes from the opening 11 of the rack 10 by a certain amount or more set, it is treated as an error.
  • the arm 20 takes out the work 100 housed in the rack 10 from the rack 10 and conveys it to the stage 30.
  • the arm 20 for example, a robot arm having a hand for sucking the work 100 from the back surface (the surface on which the product region is not formed) can be used.
  • the stage 30 is installed at a predetermined distance from the opening 11 of the rack 10, and when the arm 20 conveys the work 100 from the rack 10 to the stage 30, the work 100 is transferred to the opening of the rack 10. After carrying out from 11, the work 100 is carried straight to the position of the stage 30.
  • optical sensors 40a and 40b which will be described later, are installed in the transport path through which the work 100 passes, and the work 100 passes through the optical detection regions of the optical sensors 40a and 40b in the transport direction of the work 100. The center position is detected.
  • the stage 30 places the work 100 to be processed at a set position, and holds the work 100 in the processing step (here, the film sticking step). Further, the stage 30 includes an edge clamp 31 that presses and holds the peripheral edge of the work 100 conveyed by the arm 20 from the outside toward the center of the stage 30.
  • the edge clamp 31 is composed of, for example, a resin member that abuts on the peripheral edge of the work 100 and presses it toward the center of the stage 30.
  • a plurality of edge clamps 31 (here, four) are installed around the stage 30, and each edge clamp 31 is equidistant from the center of the stage 30 and at equal intervals in the circumferential direction.
  • the distance from the center of the stage 30 of the edge clamp 31 is a predetermined distance (a distance slightly longer than the assumed transfer error of the work 100) than the radius of the work 100.
  • the work 100 conveyed by the arm 20 is controlled to stop in the area surrounded by the plurality of edge clamps 31 above the stage 30.
  • the stop position of the work 100 in the transport direction (direction traveling straight from the opening 11 of the rack 10) is controlled with reference to the center position in the transport direction of the work 100 detected by the optical sensors 40a and 40b.
  • the position in the direction intersecting the transport direction of the work 100 is kept within a predetermined error due to the position regulation by the rail of the rack 10 and the straight-ahead accuracy of the arm 20.
  • the work 100 stopped in the area surrounded by the plurality of edge clamps 31 is pressed from the outside of the stage 30 toward the center by the plurality of edge clamps 31 to press the peripheral edge of the work 100 toward the center of the stage 30. Aligned with. Further, the edge clamp 31 holding the work 100 is lowered to release the work 100, so that the work 100 is positioned at the target installation position of the stage 30.
  • the optical sensors 40a and 40b are composed of sensors that detect the passage of an object by reflecting light (or shading, etc.). Further, the optical sensors 40a and 40b are installed in the transport path of the work 100 from the opening of the rack 10 to the stage 30, and the path through which the center of the work 100 is assumed to pass (hereinafter, referred to as "center path"). It is installed at a position equidistant from the central path (that is, a position equidistant from the central path in the width direction) on a line orthogonal to the central path. Further, the optical sensors 40a and 40b are installed so that the distance between them is larger than the width of the orientation flat 101 formed on the work 100 and smaller than the diameter of the work 100.
  • the center of the work 100 in the transport direction is calculated by calculating the position of 1/2 of the optical sensors 40a and 40b by using the passing distance of the work 100 detected on the side where the orientation flat 101 does not pass. The position can be detected.
  • the control unit 50 controls the entire transfer device 1 to transfer and position the work 100, detect the center position of the work 100, and the like. Specifically, the control unit 50 controls the operation of the arm 20, takes out the work 100 housed in the rack 10 from the rack 10, and conveys it to the stage 30. At this time, when the optical sensor 10a detects that the work 100 protrudes from the opening 11 of the rack 10 by a certain amount or more set, the control unit 50 assumes that an error has occurred and conveys the work 100. The operation of the device 1 is stopped.
  • control unit 50 controls the operation of the arm 20 so that the work 100 passes through the positions where the optical sensors 40a and 40b are installed, and the optical sensors 40a and 40b detect the passing distance of the work 100. Then, the control unit 50 uses the passing distance (that is, the longer passing distance) of the work 100 detected on the side of the optical sensors 40a and 40b that the Orifra 101 does not pass through, and uses 1/2 of the passing distance. Calculate the position. Further, the control unit 50 detects the calculated position as the center position in the transport direction of the work 100.
  • control unit 50 stops the work 100 in a region surrounded by the edge clamp 31 above the stage 30 based on the detected center position. Then, the control unit 50 moves the edge clamp 31 from the outside toward the center of the stage 30, and aligns the work 100 with the center of the stage 30. Further, the control unit 50 positions the work 100 at the target installation position of the stage 30 by lowering the edge clamp 31 holding the work 100 and releasing the work 100. Machining is continuously performed on the positioned work 100.
  • the orientation of the work 100 (the position of the orientation flat 101 in the circumferential direction) may vary. Due to the variation in the orientation of the work 100, the passage distance of the work 100 detected by the optical sensors 40a and 40b that the orifra 101 has passed through and the passage of the work 100 detected by the one that the orifra 101 has not passed through. It will be different from the distance. Of the optical sensors 40a and 40b, the position where the passing distance of the work 100 detected by the one through which the orientation flat 101 has passed is halved does not represent the center position of the work 100 in the transport direction.
  • the optical sensors 40a and 40b are installed at positions equidistant from the central path on a line orthogonal to the central path where the center of the work 100 is assumed to pass, the optical sensors 40a and 40b of the optical sensors 40a and 40b. At least one of them detects the passing distance of the work 100 that the Orifla 101 does not pass through.
  • a specific method for detecting the center position of the work 100 in the transport direction with respect to the variation in the orientation of the work 100 held by the arm 20 will be described.
  • FIG. 3 is a schematic view showing a state in which the work 100 is held in a normal position.
  • the normal position of the work 100 means a state in which the position of the orientation flat 101 in the circumferential direction is located on the front side with respect to the transport direction.
  • the optical sensors 40a and 40b detect the distance passed by a portion of the work 100 other than the orientation flat 101. Become. Therefore, the position where the passing distance of the work 100 detected on one of the optical sensors 40a and 40b is halved can be set as the center position in the transport direction of the work 100.
  • FIG. 4 is a schematic view showing a state in which the work 100 is held with a large deviation from the normal position.
  • the state in which the work 100 is held with a large deviation from the normal position means a state in which the Orifra 101 is held with a deviation of about 90 degrees from the normal position.
  • a situation may occur in which one of the optical sensors 40a and 40b does not detect the passage of the work 100.
  • the distance passed by a portion of the work 100 other than the orientation flat 101 is detected. Therefore, in the detection result of the optical sensors 40a and 40b that have detected the passage of the work 100, the position where the passage distance of the work 100 is halved is set as the center position of the work 100 in the transport direction. be able to.
  • FIG. 5 is a schematic view showing a state in which the work 100 is held with a slight deviation from the normal position.
  • the state in which the work 100 is held with a slight deviation from the normal position means a state in which the orientation flat 101 is held with a deviation of more than 0 degrees and less than 90 degrees from the normal position.
  • one of the optical sensors 40a and 40b detects the distance passed by a portion of the work 100 other than the orientation flat 101. It will be.
  • the position where the passing distance (that is, the longer passing distance) of the work 100 detected by the portion other than the orientation flat 101 is halved is the position where the work 100 is conveyed. It can be the center position in the transport direction in the direction.
  • FIG. 6 is a flowchart showing the flow of the work transfer process executed by the transfer device 1.
  • the work transfer process is started when the control unit 50 instructs the execution of the work transfer process.
  • step S1 the control unit 50 makes an error in the accommodation state of the work 100 in the rack 10 based on the detection result of the optical sensor 10a (that is, the work 100 protrudes by the allowable amount set from the opening 11 or more). ) Is generated or not. If an error has occurred in the accommodation state of the work 100 in the rack 10, a YES is determined in step S1, and the work transfer process ends. On the other hand, if no error has occurred in the accommodation state of the work 100 in the rack 10, NO is determined in step S1, and the process proceeds to step S2.
  • step S2 the control unit 50 takes out the work 100 from the rack 10 by the arm 20.
  • step S3 the control unit 50 conveys the work 100 by the arm 20 and passes the positions of the optical sensors 40a and 40b.
  • step S4 the control unit 50 detects the center position of the work 100 in the transport direction based on the detection results of the optical sensors 40a and 40b.
  • step S5 the control unit 50 stops the work 100 in the region surrounded by the edge clamp 31 above the stage 30 based on the detected center position.
  • step S6 the control unit 50 moves the edge clamp 31 from the outside toward the center of the stage 30, and aligns the work 100 with the center of the stage 30.
  • step S7 the control unit 50 positions the work 100 at the target installation position of the stage 30 by lowering the edge clamp 31 holding the work 100 and releasing the work 100.
  • step S8 the control unit 50 executes machining on the work 100.
  • step S9 the control unit 50 determines whether or not the end of the work transfer process is instructed. For example, when the processing of all the works 100 is completed, the end of the work transfer process is instructed. If the end of the work transfer process is not instructed, NO is determined in step S9, and the process proceeds to step S1. On the other hand, when the end of the work transfer process is instructed, YES is determined in step S9, and the work transfer process ends.
  • the transport device 1 in the present embodiment is larger than the width of the orientation flat 101 formed on the work 100 and is larger than the width of the work 100 in the path for transporting the work 100 from the rack 10 to the stage 30 in a straight line. It includes optical sensors 40a and 40b installed in the width direction at intervals smaller than the diameter. Then, the transport device 1 sets the position where the longer passage distance of the passage distance of the work 100 passing through the optical sensors 40a and 40b is halved as the center position in the transport direction of the work 100. Further, the transfer device 1 stops the work 100 in a region surrounded by the edge clamp 31 above the stage 30 with reference to the center position in the transfer direction of the work 100, and moves the edge clamp 31 from the outside to the stage 30. The work 100 is aligned with the center of the stage 30 by moving it toward the center. Then, the transfer device 1 positions the work 100 at the target installation position of the stage 30 by lowering the edge clamp 31 holding the work 100 and releasing the work 100.
  • the position converges within the region surrounded by the edge clamp 31 of the stage 30 due to the regulation by the accommodation space of the rack 10 and the straight-ahead accuracy of the arm 20 that transports the work 100.
  • the alignment action of the edge clamp 31 mechanically guarantees the accuracy of the position.
  • the center position of the work 100 in the transport direction can be detected by detecting the passage of the work 100 with a sensor such as an optical sensor that detects the presence or absence of an object without using an expensive device such as a camera. it can. Therefore, the work can be positioned easily at a lower cost.
  • FIG. 7 is a schematic view showing an example of detecting the center position of the work 100 in a plurality of directions. As shown in FIG.
  • the center position of the work 100 when detecting the center position of the work 100 in a plurality of directions, for example, a first direction straight from the opening 11 of the rack 10 and a second direction deviated from the first direction by a predetermined angle.
  • the work 100 can be moved in a direction (a direction deviated by an angle larger than 0 degrees and smaller than 180 degrees) to calculate the center position of the work 100 in the first direction and the second direction, respectively.
  • the center position of the entire work 100 is detected by detecting the center position of the work 100 in each direction in the transport direction from the rack 10 to the stage 30 and in the direction deviated from the transport direction by a predetermined angle. can do.
  • the predetermined angle set for moving the work 100 does not have to be the same as the transport direction, and is determined based on an error allowed for detecting the center position, the detection accuracy of the optical sensor, or the like. Can be done.
  • the optical sensor is used as the sensor for detecting the passage of the work 100, but the present invention is not limited to this.
  • the passage of the work 100 may be detected by a magnetic sensor, a sensor using sound waves or ultrasonic waves, or the like.
  • the present invention is not limited to the above-described embodiments. Further, the effects described in the present embodiment merely list the most preferable effects arising from the present invention, and the effects according to the present invention are not limited to those described in the present embodiment.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

[Objectif] Positionner une pièce à usiner à moindre coût et de manière simple. [Solution] Dispositif de transport comprenant : un moyen formant contenant pour contenir une pièce à usiner ayant une orientation plate ; un moyen d'installation sur lequel la pièce à usiner est installée ; un moyen de transport pour transporter la pièce à usiner du moyen formant contenant au moyen d'installation ; une pluralité de premiers capteurs pour détecter le passage de la pièce à usiner, les premiers capteurs étant installés, à un intervalle plus large que la largeur de l'orientation plate et plus étroite que la largeur de la pièce à usiner, dans la direction de la largeur d'un premier trajet de transport pour le transport linéaire de la pièce à usiner par le moyen de transport ; et un moyen d'acquisition de position centrale pour acquérir, sur la base de la plus grande distance de passage parmi les distances de passage de pièce à usiner détectées par la pluralité de premiers capteurs, la position centrale de la pièce à usiner dans une direction le long du premier trajet de transport. Le dispositif de transport est caractérisé en ce que le moyen de transport installe la pièce à usiner sur le moyen d'installation sur la base de la position centrale de la pièce à usiner dans la direction le long du premier trajet de transport.
PCT/JP2020/040728 2019-11-13 2020-10-29 Dispositif de transport et procédé de transport WO2021095553A1 (fr)

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JP2021556010A JPWO2021095553A1 (fr) 2019-11-13 2020-10-29
KR1020227019491A KR20220100623A (ko) 2019-11-13 2020-10-29 반송 장치 및 반송 방법

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JP2019-205821 2019-11-13

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737967A (ja) * 1993-07-15 1995-02-07 Sony Corp ウエハの位置合わせ装置および位置合わせ方法
JP2003254738A (ja) * 2002-02-28 2003-09-10 Olympus Optical Co Ltd ウエハ芯出し装置及び方法並びにプログラム
JP2011018828A (ja) * 2009-07-10 2011-01-27 Lintec Corp 位置認識装置及び位置認識方法並びに位置決め装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106158715B (zh) 2015-04-24 2021-04-02 上海微电子装备（集团）股份有限公司 用于晶圆的预对准装置及方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737967A (ja) * 1993-07-15 1995-02-07 Sony Corp ウエハの位置合わせ装置および位置合わせ方法
JP2003254738A (ja) * 2002-02-28 2003-09-10 Olympus Optical Co Ltd ウエハ芯出し装置及び方法並びにプログラム
JP2011018828A (ja) * 2009-07-10 2011-01-27 Lintec Corp 位置認識装置及び位置認識方法並びに位置決め装置

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