WO2021092852A1 - Enceintes à finition en céramique à brillant élevé - Google Patents

Enceintes à finition en céramique à brillant élevé Download PDF

Info

Publication number
WO2021092852A1
WO2021092852A1 PCT/CN2019/118513 CN2019118513W WO2021092852A1 WO 2021092852 A1 WO2021092852 A1 WO 2021092852A1 CN 2019118513 W CN2019118513 W CN 2019118513W WO 2021092852 A1 WO2021092852 A1 WO 2021092852A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal substrate
plasmic
micro
polished
oxide film
Prior art date
Application number
PCT/CN2019/118513
Other languages
English (en)
Inventor
Yacheng CHUANG
Yongjun Li
Yongyong Xu
Qingyong GUO
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/CN2019/118513 priority Critical patent/WO2021092852A1/fr
Publication of WO2021092852A1 publication Critical patent/WO2021092852A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/026—Anodisation with spark discharge
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/16—Pretreatment, e.g. desmutting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/30—Anodisation of magnesium or alloys based thereon

Definitions

  • a lustrous/glossy finish such as a metal finish
  • enclosures such as a back cover, front cover, and base frame of the devices.
  • Fig. 1 illustrates a flow-chart showing a method for treating a metal substrate, according to an example of the present disclosure
  • Fig. 2 illustrates a flow chart showing a method for forming an enclosure for an electronic device, according to an example of the present disclosure
  • Fig. 3 illustrates a cross-section on an enclosure having high gloss ceramic finish, according to an example of the present disclosure.
  • metal substrate refers to substrates made of magnesium, aluminum, copper, titanium, or a combination thereof, that are strong, and are light in weight. Such metal substrates are used for manufacturing body parts, housings, and enclosures of portable or handheld devices, such as mobile phones, tablets, laptops, styluses, keyboards, and the like.
  • coating refers to deposition on a surface.
  • Electronic devices such as a laptop, a tablet, and a mobile phone, are widely used for personal purposes in addition to office use. While making purchase decisions, consumers often evaluate the electronic devices based on aesthetics and ease of use in addition to assessing the electronic devices based on their configuration. For instance, to enhance the aesthetics, a lustrous finish, such as a metal finish, may be provided to an exterior surface of the laptop.
  • a lustrous finish such as a metal finish
  • the electronic devices are made of metal or non-metal substrates.
  • the substrates may form an enclosure, for example, a cover of an electronic device or a device housing of the electronic device which may house multiple components of the electronic device.
  • substrates made from metals including aluminum and magnesium are generally utilized. While such substrates are light, directly providing any lustrous texture or finish on these substrates is difficult due to their poor color stability, hardness, and chemical resistance. For instance, magnesium-alloy substrate may get oxidized on the surface owing to which the magnesium-alloy substrate may not be usable for obtaining metallic luster. Enhancement of aesthetics, such as high gloss finish is particularly considered desirable, however the employment of metal substrates, such as magnesium alloy, aluminum alloy among others typically yield poorer finish. Surface treatment of the metal substrates is used for ensuring acceptable finish.
  • an enclosure for an electronic device can be formed with high gloss mirror effect.
  • the enclosure exhibits a gloss value of from about 80 to about 100 units as measured by American Society for Testing and Materials (ASTM) D523 at a 60°viewing angle.
  • ASTM American Society for Testing and Materials
  • the treatment method of the present disclosure may provide the enclosure, a metallic feeling with high gloss finish.
  • the enclosure may have hardness of approximately 6H or more without any peel-off issues.
  • a metal substrate may be polished in presence of a magnetorheological fluid to obtain a polished metal substrate.
  • the magnetorheological fluid may have a viscosity of from about 0.1 Pa s to about 0.2 Pa s.
  • the magnetorheological fluid may comprise at least one polishing agent in an amount of from about 1 wt%to about 8 wt%, at least one stabilizer in an amount of from about 30 wt%to about 40 wt%based on the total weight of the magnetorheological fluid, and at least one carrier fluid in an amount of from about 50 wt%to about 55 wt%based on the total weight of the magnetorheological fluid.
  • polishing the metal substrate in the presence of magnetorheological fluid may result in the formation of polished metal substrate having a surface roughness of from about 0.5 ⁇ m to about 1 ⁇ m.
  • the polished metal substrate may have a thickness of from about 0.5 mm to about 1.0 mm.
  • the polished metal substrate may be coated with a micro-plasmic oxide film by micro-plasmic oxidation.
  • the micro-plasmic oxidation carried out at a potential of from about 300 to about 600 V for a period of from about 20 to about 50 minutes at a temperature of from about 15 °Cto about 30°C.
  • the micro-plasmic oxide film may have a thickness of from about 15 ⁇ m to about 45 ⁇ m.
  • the micro-plasmic oxide film may be formed using the micro-plasmic oxidation process.
  • the micro-plasmic oxidation may include electrolysis of an electrolyte solution with the polished metal substrate fully immersed in the electrolyte solution.
  • the electrolyte solution may be an alkaline solution having having a pH of from about 11 to 15.
  • the electrolyte may comprise at least one silicate salt, at least one phosphate salt, at least one borate salt, at least one cupric salt, at least one amine, at least one base, and at least one alkaline earth metal oxide.
  • electrolyte may be selected from the group consisting of sodium silicate, sodium phosphate, potassium fluoride, potassium hydroxide, sodium hydroxide, fluorozirconate, sodium hexametaphosphate, sodium fluoride, aluminum oxide, silicon dioxide, ferric ammonium oxalate, phosphoric acid salt, polyethylene oxide alkylphenolic ether, and combinations thereof.
  • the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 10°C to about 45°C. In another example, the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 15°C to about 40°C.
  • the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 20°C to about 35°C. In another example, the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 25°C to about 30 °C.
  • the micro-plasmic oxide film may be polished to obtain a mirror finish substrate with a surface roughness of from about 0.01 ⁇ m to about 0.1 ⁇ m. In another example, asurface of the micro-plasmic oxide film may be polished to obtain a mirror finish substrate with a surface roughness of from about 0.01 ⁇ m to about 0.1 ⁇ m.
  • Polishing a surface of the micro-plasmic oxide film may be carried out in the presence of a second magnetorheological fluid.
  • the second magnetorheological fluid comprises an aqueous carrier vehicle, at least one magnetic particle having a mean particle size of from about 0.1 ⁇ m to about 1 ⁇ m, at least one abrasive particle having a mean particle size of from about 0.1 ⁇ m to about 0.1 ⁇ m, and at least one stabilizer.
  • the methodology of polishing a metal substrate and further coating of a micro-plasmic oxide film followed by polishing the micro-plasmic oxide film, according to the present subject matter is simple and easy, and the enclosures thus obtained are aesthetically appealing, while also being mechanically stable.
  • Fig. 1 illustrates a flow-chart showing a method for treating a metal substrate, according to an example of the present disclosure.
  • the method 100 comprises providing a metal substrate, 102, wherein the metal substrate may be selected from magnesium metal, magnesium alloy, aluminum metal, or aluminium alloy.
  • the aluminum alloy in the present disclosure may be selected from AL5005, A380, AL5050, AL5052, AL5154, AL5252, AL6061, AL6063, AL6151, AL6162, AL6205, AL7072, AL7075, AL7475, AL1100, AL575, A413, ADC12, or combinations thereof.
  • the magnesium alloy may be selected from AZ31B, AZ91D, AZ61, AZ60, AZ80, AM60, LZ91, LZ141, LZ142, ALZ691, or combinations thereof.
  • the metal substrate may be selected from Al6063, Al5052, Al6061; AZ31B, or AZ91 D.
  • the metal substrate prior to polishing in presence of magnetorheological fluid, 104, may be cleaned, washed, polished, degreased, and/or activated.
  • the metal substrate may be chemically cleaned using an alkaline agent, for example, sodium hydroxide.
  • the metal substrate may be washed in a buffer solution. The cleaning and washing of the metal substrate may help in removing foreign particles, if any, present on the surface of the metal substrate.
  • the metal substrate may be chemically polished using abrasives to remove irregularities that may be present on the surface of the metal substrate.
  • the metal substrate may also be degreased through ultrasonic degreasing to remove impurities, such as fat, grease, or oil from the surface of the metal substrate.
  • the metal substrate may also be activated through acid treatment for removing the natural oxide layer, if any, present on the surface of the metal substrate.
  • the metal substrate or the treated metal substrate may be polished in presence of a magnetorheological fluid, 104, to obtain a polished metal substrate.
  • polishing the metal substrate in presence of a magnetorheological fluid to obtain a polished metal substrate may be carried out at for a time-period of from about 50 seconds to about 70 seconds.
  • polishing the metal substrate in presence of a magnetorheological fluid to obtain a polished metal substrate may be carried out at for a time-period of from about 60 seconds to about 70 seconds.
  • the magnetorheological fluid may be a colloidal suspension which may stiffen into semi-solid when subjected to a magnetic field.
  • the surface roughness of the polished metal substrate may be controlled by magnetorheological fluid under the different magnetic field.
  • the magnetorheological fluid may have a viscosity of from about 0.1 Pa s to about 0.2 Pa s.
  • the magnetorheological fluid may comprise at least one polishing agent in an amount of from about 1 wt%to about 8 wt%, at least one stabilizer in an amount of from about 30 wt%to about 40 wt%based on the total weight of the magnetorheological fluid, and at least one carrier fluid in an amount of from about 50 wt%to about 55 wt%based on the total weight of the magnetorheological fluid.
  • the magnetorheological fluid may comprise at least one polishing agent in an amount of from about 2 wt%to about 6 wt%, at least one stabilizer in an amount of from about 32 wt%to about 38 wt%based on the total weight of the magnetorheological fluid, and at least one carrier fluid in an amount of from about 52 wt%to about 54 wt%based on the total weight of the magnetorheological fluid.
  • the at least one polishing agent may comprise diamond powder or cerium oxide powder.
  • the at least one polishing agent may have a mean particle size of from about 1 ⁇ m to about 5 ⁇ m.
  • the at least one polishing agent may have a mean particle size of from about 2 ⁇ m to about 4 ⁇ m.
  • the at least one stabilizer may be selected from carbonyl iron powder (Fe (CO) 5 ) or micron carbonyl iron powder.
  • the micron carbonyl iron powder may have particle size of from about 20 ⁇ m to about 30 ⁇ m.
  • the at least one carrier fluid may be selected from an aqueous solvent, such as water.
  • the carrier fluid may comprise surface active agent, such as, oleic acid or polyacrylic acid.
  • polishing the metal substrate in the presence of magnetorheological fluid may result in the formation of polished metal substrate having a surface roughness of from about 0.5 ⁇ m to about 1 ⁇ m.
  • the polished metal substrate may have a surface roughness of from about 0.6 ⁇ m to about 1 ⁇ m.
  • the polished metal substrate may have a surface roughness of from about 0.8 ⁇ m to about 1 ⁇ m.
  • the polished metal substrate may have a thickness of from about 0.5 mm to about 1.0 mm.
  • the polished metal substrate may have a thickness of from about 0.6 mm to about 1.0 mm.
  • the polished metal substrate may have a thickness of from about 0.8 mm to about 1.0 mm.
  • coating the polished metal substrate, 106 may be carried out by micro-plasmic oxidation to obtain a micro-plasmic oxide film.
  • the micro-plasmic oxidation may be carried out at a potential of from about 300 to about 600 V for a period of from about 20 to about 50 minutes at a temperature of from about 15 °Cto about 30°C.
  • the micro-plasmic oxidation may be carried out at a potential of from about 350 to about 500 V for a period of from about 20 to about 40 minutes at a temperature of from about 15 °Cto about 25°C.
  • the micro-plasmic oxidation may be carried out at a potential of from about 350 to about 450 V for a period of from about 25 to about 40 minutes at a temperature of from about 20 °Cto about 25°C.
  • the micro-plasmic oxide film, formed by micro-plasmic oxidation process on the polished metal substrate may have a thickness of from about 15 ⁇ m to about 45 ⁇ m.
  • the micro-plasmic oxide film may have thickness of form about 15 ⁇ m to about 40 ⁇ m.
  • the micro-plasmic oxide film may have thickness of form about 20 ⁇ m to about 40 ⁇ m.
  • the micro-plasmic oxidation may include electrolysis of an electrolyte solution with the polished metal substrate fully immersed in the electrolyte solution.
  • the electrolyte solution may be an alkaline solution having having a pH of from about 11 to 15.
  • the electrolyte may comprise at least one silicate salt, at least one phosphate salt, at least one borate salt, at least one cupric salt, at least one amine, at least one base, and at least one alkaline earth metal oxide.
  • electrolyte may be selected from the group consisting of sodium silicate, sodium phosphate, potassium fluoride, potassium hydroxide, sodium hydroxide, fluorozirconate, sodium hexametaphosphate, sodium fluoride, aluminum oxide, silicon dioxide, ferric ammonium oxalate, phosphoric acid salt, polyethylene oxide alkylphenolic ether, and combinations thereof.
  • the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 10°C to about 45°C. In another example, the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 15°C to about 40°C.
  • the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 20°C to about 35°C. In another example, the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 25°C to about 30°C.
  • polishing a surface of the micro-plasmic oxide film, 108 may be carried out in presence of a second magnetorheological fluid, to obtain a mirror finish substrate with surface roughness of from about 0.01 ⁇ m to about 0.1 ⁇ m.
  • the micro-plasmic oxide film may be polished to obtain a mirror finish substrate with a surface roughness of from about 0.05 ⁇ m to about 0.1 ⁇ m.
  • asurface of the micro-plasmic oxide film may be polished to obtain a mirror finish substrate with a surface roughness of from about 0.05 ⁇ m to about 0.1 ⁇ m.
  • the second magnetorheological fluid comprises an aqueous carrier vehicle, at least one magnetic particle having a mean particle size of from about 0.1 ⁇ m to about 1 ⁇ m,at least one abrasive particle having a mean particle size of from about 0.1 ⁇ m to about 0.1 ⁇ m, and at least one stabilizer. Polishing in presence of a second magnetorheological fluid may reduce surface roughness and improve the surface characteristics of the micro-plasmic oxide film, thereby providing lustrous/glossy finish.
  • Fig. 2 illustrates a flow chart showing a method for forming an enclosure for an electronic device, according to an example of the present disclosure.
  • the method 200 comprises providing a metal substrate, 202, wherein the metal substrate may be selected from magnesium metal, magnesium alloy, aluminum metal, or aluminium alloy.
  • the aluminum alloy in the present disclosure may be selected from AL5005, A380, AL5050, AL5052, AL5154, AL5252, AL6061, AL6063, AL6151, AL6162, AL6205, AL7072, AL7075, AL7475, AL1100, AL575, A413, ADC12, or combinations thereof.
  • the magnesium alloy may be selected from AZ31B, AZ91D, AZ61, AZ60, AZ80, AM60, LZ91, LZ141, LZ142, ALZ691, or combinations thereof.
  • the metal substrate may be selected from Al6063, Al5052, Al6061; AZ31B, or AZ91D.
  • the metal substrate prior to polishing at least one portion of the metal substrate in presence of magnetorheological fluid, 204, may be cleaned, washed, polished, degreased, and/or activated.
  • the metal substrate may be chemically cleaned using an alkaline agent, for example, sodium hydroxide.
  • the metal substrate may be washed in a buffer solution. The cleaning and washing of the metal substrate may help in removing foreign particles, if any, present on the surface of the metal substrate.
  • the metal substrate may be chemically polished using abrasives to remove irregularities that may be present on the surface of the metal substrate.
  • the metal substrate may also be degreased through ultrasonic degreasing to remove impurities, such as fat, grease, or oil from the surface of the metal substrate.
  • the metal substrate may also be activated through acid treatment for removing the natural oxide layer, if any, present on the surface of the metal substrate.
  • the at least one portion of the metal substrate or the treated metal substrate may be polished in presence of a first magnetorheological fluid, 204, to obtain a polished metal substrate.
  • polishing the metal substrate in presence of a first magnetorheological fluid to obtain a polished metal substrate may be carried out at for a time-period of from about 50 seconds to about 70 seconds.
  • polishing the metal substrate in presence of a first magnetorheological fluid to obtain a polished metal substrate may be carried out at for a time-period of from about 60 seconds to about 70 seconds.
  • the first magnetorheological fluid may be a colloidal suspension which may stiffen into semi-solid when subjected to a magnetic field.
  • the surface roughness of the polished metal substrate may be controlled by the first magnetorheological fluid under the different magnetic field.
  • the first magnetorheological fluid may have a viscosity of from about 0.1 Pa s to about 0.2 Pa s.
  • the first magnetorheological fluid may comprise at least one polishing agent in an amount of from about 1 wt%to about 8 wt%based on the total weight of the first magnetorheological fluid, at least one stabilizer in an amount of from about 30 wt%to about 40 wt%based on the total weight of the first magnetorheological fluid, and at least one carrier fluid in an amount of from about 50 wt%to about 55 wt%based on the total weight of the first magnetorheological fluid.
  • the first magnetorheological fluid may comprise at least one polishing agent in an amount of from about 2 wt%to about 6 wt%based on the total weight of the first magnetorheological fluid, at least one stabilizer in an amount of from about 32 wt%to about 38 wt%based on the total weight of the first magnetorheological fluid, and at least one carrier fluid in an amount of from about 52 wt%to about 54 wt%based on the total weight of the first magnetorheological fluid.
  • the at least one polishing agent may comprise diamond powder or cerium oxide powder.
  • the at least one polishing agent may have a mean particle size of from about 1 ⁇ m to about 5 ⁇ m.
  • the at least one polishing agent may have a mean particle size of from about 2 ⁇ m to about 4 ⁇ m.
  • the at least one stabilizer may be selected from carbonyl iron powder (Fe (CO) 5 ) or micron carbonyl iron powder.
  • the micron carbonyl iron powder may have particle size of from about 20 ⁇ m to about 30 ⁇ m.
  • the at least one carrier fluid may be selected from an aqueous solvent, such as water.
  • the carrier fluid may comprise surface active agent, such as, oleic acid or polyacrylic acid.
  • polishing the metal substrate in the presence of first magnetorheological fluid may result in the formation of polished metal substrate having a surface roughness of from about 0.5 ⁇ m to about 1 ⁇ m.
  • the polished metal substrate may have a surface roughness of from about 0.6 ⁇ m to about 1 ⁇ m.
  • the polished metal substrate may have a surface roughness of from about 0.8 ⁇ m to about 1 ⁇ m.
  • the polished metal substrate may have a thickness of from about 0.5 mm to about 1.0 mm.
  • the polished metal substrate may have a thickness of from about 0.6 mm to about 1.0 mm.
  • the polished metal substrate may have a thickness of from about 0.8 mm to about 1.0 mm.
  • depositing a micro-plasmic oxide film, 206, on the polished metal substrate may be carried out by micro-plasmic oxidation.
  • the micro-plasmic oxidation may be carried out at a potential of from about 300 to about 600 V for a period of from about 20 to about 50 minutes at a temperature of from about 15 °Cto about 30°C.
  • the micro-plasmic oxidation may be carried out at a potential of from about 350 to about 500 V for a period of from about 20 to about 40 minutes at a temperature of from about 15 °Cto about 25°C.
  • the micro-plasmic oxidation may be carried out at a potential of from about 350 to about 450 V for a period of from about 25 to about 40 minutes at a temperature of from about 20 °Cto about 25°C.
  • the micro-plasmic oxide film, formed by micro-plasmic oxidation process on the polished metal substrate may have a thickness of from about 15 ⁇ m to about 45 ⁇ m.
  • the micro-plasmic oxide film may have thickness of form about 15 ⁇ m to about 40 ⁇ m.
  • the micro-plasmic oxide film may have thickness of form about 20 ⁇ m to about 40 ⁇ m.
  • the micro-plasmic oxidation may include electrolysis of an electrolyte solution with the polished metal substrate fully immersed in the electrolyte solution.
  • the electrolyte solution may be an alkaline solution having a pH of from about 11 to 15.
  • the electrolyte may comprise at least one silicate salt, at least one phosphate salt, at least one borate salt, at least one cupric salt, at least one amine, at least one base, and at least one alkaline earth metal oxide.
  • electrolyte may be selected from the group consisting of sodium silicate, sodium phosphate, potassium fluoride, potassium hydroxide, sodium hydroxide, fluorozirconate, sodium hexametaphosphate, sodium fluoride, aluminum oxide, silicon dioxide, ferric ammonium oxalate, phosphoric acid salt, polyethylene oxide alkylphenolic ether, and combinations thereof.
  • the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 10°C to about 45°C. In another example, the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 15°C to about 40°C.
  • the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 20°C to about 35°C. In another example, the electrolyte solution may be kept inside an electrolytic bath and maintained at a temperature in a range of about 25°C to about 30°C.
  • polishing at least one portion of the micro-plasmic oxide film, 208 may be carried out in presence of a second magnetorheological fluid, to obtain a mirror finish substrate.
  • the mirror finish substrate may have a surface roughness of from about 0.01 ⁇ m to about 0.1 ⁇ m. In an example, the mirror finish substrate may have a surface roughness of from about 0.05 ⁇ m to about 0.1 ⁇ m.
  • the mirror finish substrate may have a surface roughness of from about 0.05 ⁇ m to about 0.1 ⁇ m.
  • the second magnetorheological fluid comprises an aqueous carrier vehicle, at least one magnetic particle having a mean particle size of from about 0.1 ⁇ m to about 1 ⁇ m, at least one abrasive particle having a mean particle size of from about 0.1 ⁇ m to about 0.1 ⁇ m, and at least one stabilizer. Polishing in presence of a second magnetorheological fluid may reduce surface roughness and improve the surface characteristics of the micro-plasmic oxide film, thereby providing lustrous/glossy finish.
  • coating the mirror finish substrate with an anti-finger print coating may be followed by baking the coating at a temperature of from about 60°Cto about 80°Cfor a time-period of from about 20 minutes to about 30 minutes to obtain the enclosure.
  • the anti-finger print coating may comprise polymers selected from the group consisting of vinylidene fluoride homopolymer, vinylidene fluoride copolymer, and combinations thereof.
  • coating the mirror finish substrate with an anti-finger print coating may be carried out by spray coating.
  • the anti-finger print coating deposited by spray coating may be followed by heat treatment at a temperature of from about 60 °Cto about 80 °Cfor period in a range of from about 15 to about 40 minutes to obtain the enclosure.
  • the anti-finger print coating deposited by spray coating may be followed by UV treatment in a range of from about 700 mJ/cm 2 to about 1200 mJ/cm 2 for a period in a range of from about 10 seconds to about 30 seconds to obtain the enclosure.
  • the anti-finger print coating deposited by spray coating may be followed by UV treatment in a range of from about 800 mJ/cm 2 to about 1100 mJ/cm 2 for a period in a range of from about 15 seconds to about 25 seconds to obtain the enclosure.
  • the anti-finger print coating deposited by spray coating may be followed by UV treatment of about 950 mJ/cm 2 for a period of about 20 seconds to obtain the enclosure.
  • Fig. 3 illustrates a cross-section on an enclosure having high gloss ceramic finish, according to an example of the present disclosure.
  • the high gloss ceramic finish enclosure 300 comprises a polished metal substrate, 302, a polished micro-plasmic oxide film, 304, formed on at least one portion of the polished metal substrate and an anti-finger print coating, 306, provided over the polished micro-plasmic oxide film.
  • the enclosure may exhibit a gloss value of from about 80 to about 100 measured by American Society for Testing and Materials (ASTM) D523 at a 60°viewing angle.
  • ASTM American Society for Testing and Materials
  • the polished metal substrate, 302 may have a thickness of from about 0.5 mm to about 1.0 mm.
  • the polished metal substrate, 302 may have a thickness of from about 0.6 mm to about 1.0 mm.
  • the polished metal substrate, 302 may have a thickness of from about 0.6 mm to about 0.8 mm.
  • the polished micro-plasmic oxide film, 304 may have a thickness of from about 15 ⁇ m to about 45 ⁇ m.
  • the polished micro-plasmic oxide film, 304 may have a thickness of from about 15 ⁇ m to about 40 ⁇ m.
  • the polished micro-plasmic oxide film, 304 may have a thickness of from about 20 ⁇ m to about 40 ⁇ m.
  • the anti-finger print coating, 306 may have a thickness of from about 1 ⁇ m to about 2 ⁇ m.
  • the anti-finger print coating, 306, may have a thickness of from about 1 ⁇ m to about 1.8 ⁇ m. In yet another example, the anti-finger print coating, 306, may have a thickness of from about 1 ⁇ m to about 1.5 ⁇ m.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

L'invention concerne un procédé de traitement d'un substrat métallique pour former une enceinte à finition en céramique à brillant élevé. Dans un exemple, un procédé (100) pour traiter un substrat métallique consiste à fournir un substrat métallique (102); à polir le substrat métallique en présence d'un fluide magnétorhéologique (104) pour obtenir un substrat métallique poli; à revêtir le substrat métallique poli par une oxydation microplasmique (106) pour obtenir un film d'oxyde microplasmique; et à polir une surface du film d'oxyde microplasmique (108) pour obtenir un substrat à finition à effet miroir ayant une rugosité de surface d'environ 0,01 µm à environ 0,1 µm.
PCT/CN2019/118513 2019-11-14 2019-11-14 Enceintes à finition en céramique à brillant élevé WO2021092852A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/118513 WO2021092852A1 (fr) 2019-11-14 2019-11-14 Enceintes à finition en céramique à brillant élevé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/118513 WO2021092852A1 (fr) 2019-11-14 2019-11-14 Enceintes à finition en céramique à brillant élevé

Publications (1)

Publication Number Publication Date
WO2021092852A1 true WO2021092852A1 (fr) 2021-05-20

Family

ID=75911631

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/118513 WO2021092852A1 (fr) 2019-11-14 2019-11-14 Enceintes à finition en céramique à brillant élevé

Country Status (1)

Country Link
WO (1) WO2021092852A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101139504A (zh) * 2007-10-30 2008-03-12 西安工业大学 磁流变抛光液及其制备方法
CN103298300A (zh) * 2012-02-24 2013-09-11 宏达国际电子股份有限公司 电子装置机壳及其制造方法
CN106078364A (zh) * 2016-06-23 2016-11-09 东莞金稞电子科技有限公司 铝合金的表面镜面处理工艺
CN106191956A (zh) * 2016-08-29 2016-12-07 深圳天珑无线科技有限公司 一种铝合金的表面处理方法及相应的铝合金
CN107641828A (zh) * 2017-09-21 2018-01-30 东莞市铭通金属科技有限公司 一种微弧氧化液及微弧氧化工艺
WO2018067148A1 (fr) * 2016-10-05 2018-04-12 Hewlett-Packard Development Company, L.P. Substrat en alliage à revêtement extérieur
CN108093591A (zh) * 2017-11-20 2018-05-29 广东欧珀移动通信有限公司 板材及其制备方法、移动终端壳体、移动终端

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101139504A (zh) * 2007-10-30 2008-03-12 西安工业大学 磁流变抛光液及其制备方法
CN103298300A (zh) * 2012-02-24 2013-09-11 宏达国际电子股份有限公司 电子装置机壳及其制造方法
CN106078364A (zh) * 2016-06-23 2016-11-09 东莞金稞电子科技有限公司 铝合金的表面镜面处理工艺
CN106191956A (zh) * 2016-08-29 2016-12-07 深圳天珑无线科技有限公司 一种铝合金的表面处理方法及相应的铝合金
WO2018067148A1 (fr) * 2016-10-05 2018-04-12 Hewlett-Packard Development Company, L.P. Substrat en alliage à revêtement extérieur
CN107641828A (zh) * 2017-09-21 2018-01-30 东莞市铭通金属科技有限公司 一种微弧氧化液及微弧氧化工艺
CN108093591A (zh) * 2017-11-20 2018-05-29 广东欧珀移动通信有限公司 板材及其制备方法、移动终端壳体、移动终端

Similar Documents

Publication Publication Date Title
EP1915473B1 (fr) Prétraitement de substrats de magnésium pour une finition galvanique
JP4201600B2 (ja) 金属表面の被覆方法および該方法により被覆した支持体の使用
US10165699B2 (en) Oxidied and coated articles and methods of making same
JPH10259486A (ja) 表面処理方法、装飾品および電子機器
KR102085626B1 (ko) 아연계 전기 도금 강판
CN110770018B (zh) 镀敷钢材
US2428749A (en) Surface treatment of magnesium alloys
CN103343345A (zh) 一种用于不锈钢金属制品的新型环保型抛光工艺
CN107438340B (zh) 一种外壳、电子设备及外壳的制备方法
Schwankl et al. The influence of sandblasting on the morphology of electroless deposited zinclayers on aluminum sheets
KR20130133920A (ko) 양극산화처리된 부품의 미용적 결함 저감
CN106191564A (zh) 家装用深色镜面高光泽铝合金及其制备工艺
CN112877742A (zh) 一种铝合金压铸件的复合表面处理方法
CN105109260B (zh) 压铸铝合金外观表面处理方法及手机外壳
WO2004063405A2 (fr) Alliages d'aluminium contenant du magnesium, et procede d'anodisation
WO2021092852A1 (fr) Enceintes à finition en céramique à brillant élevé
WO2019154142A1 (fr) Procédé de fabrication de film d'oxyde et dispositif terminal
CN105171581A (zh) 一种金属件的抛光加工工艺
JP6100557B2 (ja) マグネシウム基材の表面処理方法
JPS60181282A (ja) アルミニウム合金の表面処理法
CN113564568A (zh) 一种镁铝件表面高抗氧化纳米涂层工艺
JP2002120495A (ja) 表面処理方法、装飾品および電子機器
EP3865608A1 (fr) Procédé de traitement de surface d'une pièce en alliage d'aluminium et pièce en alliage d'aluminium anodisé
JP2010285660A (ja) マグネシウム合金へのすずめっき方法及びマグネシウム合金のエッチング液
JP5091667B2 (ja) 表面処理金属製品

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19952391

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19952391

Country of ref document: EP

Kind code of ref document: A1