WO2021090517A1 - Dispositif électroluminescent et procédé de fabrication de dispositif électroluminescent - Google Patents

Dispositif électroluminescent et procédé de fabrication de dispositif électroluminescent Download PDF

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Publication number
WO2021090517A1
WO2021090517A1 PCT/JP2020/007985 JP2020007985W WO2021090517A1 WO 2021090517 A1 WO2021090517 A1 WO 2021090517A1 JP 2020007985 W JP2020007985 W JP 2020007985W WO 2021090517 A1 WO2021090517 A1 WO 2021090517A1
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WO
WIPO (PCT)
Prior art keywords
light
emitting device
light emitting
phosphor
holding member
Prior art date
Application number
PCT/JP2020/007985
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English (en)
Japanese (ja)
Inventor
祐幸 森戸
Original Assignee
株式会社球体研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020017854A external-priority patent/JP2021077842A/ja
Application filed by 株式会社球体研究所 filed Critical 株式会社球体研究所
Publication of WO2021090517A1 publication Critical patent/WO2021090517A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings

Definitions

  • the present invention relates to a light emitting device and a method for manufacturing the light emitting device.
  • a light emitting device having a semiconductor laser diode and a phosphor capable of converting the wavelength of light emitted by the semiconductor laser diode is known (see, for example, Patent Documents 1 and 2).
  • Patent Document 1 includes a laser diode that emits blue light and a wavelength conversion unit that absorbs a part of the light emitted by the laser diode to convert a wavelength, and the wavelength conversion unit is a single YAG system.
  • a light emitting device including a crystalline phosphor and having an irradiance of 80 W / mm 2 or more of light emitted from the laser diode and irradiating the wavelength conversion unit is disclosed. Further, it is disclosed that the wavelength conversion unit is held by a heat radiating member made of aluminum nitride, alumina, SiN, Cu, or Al.
  • Patent Document 2 discloses a wavelength conversion element including a wavelength conversion layer made of a sintered body of a particle group of a single crystal phosphor. It is disclosed that the phosphor contained in the wavelength conversion layer is a YAG-based single crystal phosphor. Further, it is disclosed that the wavelength conversion element is fixed to the heat sink by soldering. It is disclosed that the heat sink is made of a material having high thermal conductivity such as Cu, CuW, CuMo, SiC, AlN, and diamond.
  • the wavelength conversion unit is composed of one YAG-based single crystal phosphor or a plurality of particle-like single crystal phosphors bonded to each other by a binder.
  • the wavelength conversion unit processed into a flat plate can be obtained by cutting the ingot of the single crystal phosphor obtained by the liquid phase growth method.
  • the wavelength conversion unit processed into a flat plate is joined to a holding member (heat sink) made of a metal material having high thermal conductivity such as Cu by soldering, for example.
  • the above-mentioned conventional light emitting device has a problem that it is not easy to attach the wavelength conversion unit processed into a flat plate to the holding member. Further, there is a problem that it is not easy to process an ingot of a single crystal phosphor into a flat plate shape to manufacture a large amount of wavelength conversion units.
  • An object of the present invention is to provide a light emitting device and a method for manufacturing a light emitting device, which can easily attach a wavelength conversion unit made of a material containing a phosphor to a holding member and can be manufactured at a lower cost. And.
  • a light emitting device including a light source and a wavelength conversion unit that converts the wavelength of light emitted from the light source.
  • the wavelength conversion unit is composed of a spherical phosphor in which a material containing a phosphor is formed in a spherical shape.
  • a light emitting device in which a light incident surface on which light emitted from the light source is incident is formed on the spherical phosphor.
  • a holding member for holding the wavelength conversion unit is provided.
  • a method for manufacturing a light emitting device including a light source and a wavelength conversion unit that converts the wavelength of light emitted from the light source.
  • the process of forming a material containing a phosphor into a spherical shape to obtain a spherical phosphor A method for manufacturing a light emitting device, comprising a step of forming a light incident surface on which light emitted from the light source is incident on the spherical phosphor to obtain the wavelength conversion unit.
  • the method for manufacturing a light emitting device according to (8) which comprises a step of forming a light emitting surface on the spherical phosphor that emits light whose wavelength has been converted to the outside.
  • (10) The method for manufacturing a light emitting device according to (8) or (9), which comprises a joining step of joining the spherical phosphor to a holding member for holding the spherical phosphor by soldering.
  • (11) The method for manufacturing a light emitting device according to (10), wherein in the joining step, the spherical phosphor and the holding member are immersed in a solder tank in a state of being assembled by a jig.
  • (12) The method for manufacturing a light emitting device according to any one of (8) to (11), which comprises a step of forming a light reflecting film on the surface of the spherical phosphor by silver plating or silver vapor deposition.
  • (13) The method for manufacturing a light emitting device according to any one of (8) to (12), wherein the light source is a blue semiconductor laser diode.
  • the present invention it is possible to easily attach a wavelength conversion unit made of a material containing a phosphor to a holding member, and to provide a light emitting device and a method for manufacturing the light emitting device, which can be manufactured at a lower cost. Can be done.
  • FIG. 2 is a cross-sectional view taken along the line AA of the wavelength conversion unit and the holding member shown in FIG. It is a top view of the wavelength conversion part and the holding member of 2nd Embodiment.
  • FIG. 5 is a cross-sectional view taken along the line BB of the wavelength conversion unit and the holding member shown in FIG.
  • FIG. 10 is a cross-sectional view taken along the line CC of the holding member shown in FIG. It shows a holding member formed by laminating two plate-shaped members having a collar portion up and down. It is a top view which shows another Example of a holding member.
  • FIG. 13 is a sectional view taken along line DD of the holding member shown in FIG. It shows a holding member formed by sticking two plate-shaped members having a holding portion up and down.
  • FIG. 1 shows a schematic configuration of the light emitting device 10 of the present embodiment.
  • the light emitting device 10 includes a light source 12 and a wavelength conversion unit 14 that converts the wavelength of light emitted from the light source 12.
  • the light source 12 is composed of, for example, a semiconductor light emitting element.
  • the semiconductor light emitting element for example, a light emitting diode (LED) or a laser diode (LD) can be used.
  • the light emitted by the semiconductor light emitting device may be blue-purple light, blue light, or light of another wavelength. Further, the semiconductor light emitting device may emit light having a plurality of wavelengths.
  • An incident optical system 16 for guiding the light emitted from the light source 12 to the wavelength conversion unit 14 may be provided between the light source 12 and the wavelength conversion unit 14.
  • the incident optical system 16 may be composed of, for example, one or a plurality of optical elements.
  • the optical element for example, a lens, a mirror, or an optical fiber can be used.
  • the wavelength conversion unit 14 converts the wavelength of at least a part of the light emitted from the light source 12.
  • the wavelength conversion unit 14 can be formed of, for example, a material containing a phosphor that is excited by incident light and emits light having a wavelength longer than that of the incident light. For example, when the light emitting device 10 generates white light, a part of the blue light emitted from the light source 12 is converted into yellow light by the wavelength conversion unit 14. The mixture of blue and yellow light produces light that the human eye perceives as white.
  • the wavelength conversion unit 14 is formed of a material containing a phosphor.
  • the wavelength conversion unit 14 may be formed by one single crystal phosphor, or may be formed by particles of a plurality of single crystal phosphors bonded by a binder.
  • the binder for example, a transparent resin or glass can be used.
  • the wavelength conversion unit 14 may be formed of a sintered body obtained by sintering a plurality of phosphor particles.
  • the type of phosphor can be appropriately selected according to the wavelength of the incident light and the wavelength of the required emitted light.
  • the wavelength conversion unit 14 may be formed of a material containing a yellow phosphor.
  • the yellow fluorescent substance for example, a YAG fluorescent substance or a sialon fluorescent substance can be used.
  • the wavelength conversion unit 14 is composed of a spherical phosphor 18 in which a material containing a phosphor is formed in a spherical shape.
  • a light incident surface 20 on which light emitted from the light source 12 is incident is formed at one end of the spherical phosphor 18.
  • a light emitting surface 22 that emits light whose wavelength has been converted by the phosphor 18 to the outside is formed.
  • the light incident surface 20 and the light emitting surface 22 can be formed, for example, by polishing the end portion of the spherical phosphor 18 into a flat surface. Light reflection for inwardly reflecting the light incident on the spherical phosphor 18 or the light whose wavelength has been converted by the phosphor on the outer surface other than the light incident surface 20 and the light emitting surface 22 of the spherical phosphor 18.
  • a film may be formed.
  • the light reflective film can be formed, for example, by silver plating or silver vapor deposition.
  • the spherical phosphor 18 is fixed to a holding member 24 formed of a metal material such as copper having high conductivity.
  • the holding member 24 can hold the spherical phosphor 18 in a predetermined position. Further, the holding member 24 serves as a heat sink capable of releasing the heat generated in the spherical phosphor 18 to the outside.
  • the holding member 24 may be made of other metallic materials such as aluminum, iron and nickel.
  • FIG. 2 is a plan view of the wavelength conversion unit 14 and the holding member 24.
  • FIG. 3 is a sectional view taken along line AA of the wavelength conversion unit 14 and the holding member 24 shown in FIG.
  • the holding member 24 is formed in a substantially quadrangular plate shape, and a substantially circular through hole 26 is formed in the central portion thereof.
  • the wavelength conversion unit 14 is held inside the through hole 26 formed in the holding member 24.
  • the wavelength conversion unit 14 can be joined to the inner wall of the through hole 26 by, for example, soldering. In this case, the solder S used for joining is filled between the wavelength conversion unit 14 and the inner wall of the through hole 26.
  • the wavelength conversion unit 14 may be joined to the holding member 24 by means other than soldering.
  • the wavelength conversion unit 14 may be bonded to the holding member 24 with a conductive paste.
  • the holding member 24 is formed with four substantially circular holes 28a to 28d. These four holes 28a to 28d are used when the wavelength conversion unit 14 is attached to the holding member 24 by a jig described later.
  • the wavelength conversion unit 14 is composed of a spherical phosphor 18 in which a material containing a phosphor is formed in a spherical shape.
  • the spherical phosphor 18 can be easily produced from, for example, one single crystal phosphor by cutting, polishing, or the like. In addition, it can be easily produced from an ingot obtained by binding a plurality of phosphor particles with a binder. Further, it can be easily produced from a sintered body obtained by sintering a plurality of phosphor particles. Therefore, according to the light emitting device 10 of the present embodiment, it is possible to manufacture a large number of wavelength conversion units at a lower cost than before.
  • the work of attaching the spherical phosphor 18 to the holding member 24 is easy, it is possible to manufacture a large number of light emitting devices at a lower cost than before.
  • the work of attaching the spherical phosphor 18 to the holding member 24 will be described in detail later.
  • FIG. 4 is a plan view of the wavelength conversion unit 14 and the holding member 24 of the second embodiment.
  • FIG. 5 is a sectional view taken along line BB of the wavelength conversion unit 14 and the holding member 24 shown in FIG.
  • the holding member 24 can be formed by laminating two substantially quadrangular plate-shaped members 30a and 30b.
  • the two plate-shaped members 30a and 30b can be formed of a metal material such as copper having high thermal conductivity.
  • the two plate-shaped members 30a and 30b can be joined to each other by using, for example, soldering or a conductive paste.
  • the two plate-shaped members 30a and 30b may be formed with recesses 32 and convex portions 34 that can be fitted to each other (the concave portions 32 and the convex portions 34 are shown in FIGS. 4 and 5, respectively). An example in which four are formed is shown).
  • the concave portion 32 is a substantially quadrangular bottomed hole
  • the convex portion 34 is a square columnar protrusion having substantially the same shape as the concave portion 32.
  • the two plate-shaped members 30a and 30b are fixed so as not to move to each other.
  • a substantially circular through hole 26 is formed at substantially the center of the two plate-shaped members 30a and 30b.
  • a tapered portion 36 is formed on the inner circumference of the through hole 26 so that its diameter gradually increases toward the center in the thickness direction.
  • the tapered portion 36 allows the wavelength conversion portion 14 to be held inside the through hole 26.
  • the wavelength conversion unit 14 can be joined to the inner wall of the through hole 26 by, for example, soldering. In this case, the solder S used for joining is filled between the wavelength conversion unit 14 and the inner wall of the through hole 26. Further, the wavelength conversion unit 14 can be joined to the inner wall of the through hole 26 by, for example, a conductive paste.
  • four substantially circular holes 28a to 28d are formed in the holding member 24. These four holes 28a to 28d are used when the wavelength conversion unit 14 is attached to the holding member 24 by a jig described later, and details will be described later.
  • the same operation and effect as the light emitting device 10 of the first embodiment described above can be obtained.
  • FIG. 6 is a schematic configuration diagram of the light emitting device 50 of the third embodiment.
  • the light emitting device 50 includes a light source 12 and a wavelength conversion unit 52 that converts the wavelength of light emitted from the light source 12.
  • the wavelength conversion unit 52 is composed of a spherical phosphor 54 in which a material containing a phosphor is formed in a spherical shape.
  • a light incident surface 56 on which light emitted from the light source 12 is incident is formed at one end of the spherical phosphor 54.
  • a light reflecting film 58 for reflecting the light incident on the spherical phosphor 54 or the light whose wavelength is changed by the phosphor is directed inward. It is formed.
  • the light reflecting film 58 can be formed by, for example, silver plating or silver vapor deposition. The light incident on the light incident surface 56 or the light whose wavelength is changed by the phosphor is reflected by the light reflecting film 58 and then emitted from the light incident surface 56.
  • the light emitting device 50 of the third embodiment since almost all the light incident on the light incident surface 56 is reflected by the light reflecting film 58, it is possible to efficiently generate white light.
  • a material containing a phosphor is processed into a spherical shape to obtain a spherical phosphor 18.
  • a spherical phosphor 18 may be obtained by processing the ingot obtained by binding a plurality of phosphor particles with a binder into a spherical shape.
  • a spherical phosphor 18 may be obtained by processing a sintered body obtained by sintering a plurality of phosphor particles into a spherical shape.
  • a known processing method such as cutting or polishing can be used.
  • the obtained spherical phosphor 18 is soldered to a holding member 24 formed of a metal material such as copper (bonding step).
  • the upper end of the spherical phosphor 18 is polished so as to be substantially flush with the upper surface of the holding member 24.
  • the light emitting surface 22 can be formed on the upper end of the spherical phosphor 18.
  • the lower end of the spherical phosphor 18 is polished so as to be substantially flush with the lower surface of the holding member 24.
  • the light incident surface 20 can be formed at the lower end of the spherical phosphor 18.
  • the order of (c) and (d) in FIG. 7 may be reversed. That is, the light emitting surface 22 may be formed after the light incident surface 20 is formed on the spherical phosphor 18. In the case of the light emitting device 50 shown in FIG. 6, the step of forming the light emitting surface 22 on the spherical phosphor 18 is unnecessary.
  • a light reflecting film may be formed on the surface of the spherical phosphor 18 by silver plating or silver vapor deposition.
  • the step of forming the light reflecting film may be before or after the step of joining the spherical phosphor 18 to the holding member 24.
  • FIG. 8 is a perspective view showing an example of a jig 60 that can be used in the joining process.
  • FIG. 9 is an enlarged perspective view of the tip end portion of the jig 60.
  • the jig 60 includes two arms 62a and 62b.
  • the two arms 62a and 62b are connected to each other by a hinge 64 so as to be openable and closable.
  • Four protrusions 66a to 66d are provided inside the tip of one arm 62a.
  • Four protrusions 66a to 66d are also provided inside the tip of the other arm 62b.
  • a cylindrical accommodating portion 68 is provided at substantially the center of the four protrusions 66a to 66d.
  • the two arms 62a and 62b can be formed of, for example, a metal material.
  • the four holes 28a to 28d provided in the holding member 24 are fitted into the four protrusions 66a to 66d provided at the tip of one arm 62a. Thereby, the holding member 24 can be attached to the tip of one arm 62a.
  • the spherical phosphor 18 is fitted into the through hole 26 provided in the center of the holding member 24.
  • the spherical phosphor 18 and the holding member 24 are sandwiched together by the two arms 62a and 62b. In the state of FIG. 9, the protrusions 66a to 66d are inserted into the four holes 28a to 28d provided in the holding member 24.
  • the spherical phosphor 18 is housed in a cylindrical housing portion 68 provided on each of the two arms 62a and 62b, respectively. In this way, by using the jig 60, the spherical phosphor 18 and the holding member 24 can be assembled to each other.
  • the spherical phosphor 18 and the holding member 24 are immersed in a solder bath in a state of being assembled with each other by a jig 60. Since a gap is secured between the through hole 26 and the spherical phosphor 18, solder flows between the through hole 26 and the spherical phosphor 18. As a result, the spherical phosphor 18 can be bonded to the holding member 24 by soldering.
  • the light emitting device of this embodiment can be used as a light source for various devices.
  • various devices such as lighting devices using optical fibers, lighting devices using liquid light guides, projectors, machine vision, microscope lighting, endoscopic lighting, lighting for inspection equipment, lighting for clinics, and lighting for dental clinics. It can be used as a light source.
  • FIG. 10 is a plan view showing another embodiment of the holding member 24.
  • FIG. 11 is a sectional view taken along line CC of the holding member 24 shown in FIG.
  • the holding member 24 is formed of a substantially quadrangular plate-shaped member.
  • the holding member 24 is made of, for example, a metal material such as copper having high thermal conductivity.
  • a substantially circular through hole 26 is formed at substantially the center of the holding member 24.
  • the inner peripheral surface of the collar 40 is a spherical surface. Therefore, it is possible to hold the spherical phosphor 18 inside the collar portion 40. Further, since the inner peripheral surface of the flange portion 40 is in close contact with the outer surface of the spherical phosphor 18, the spherical phosphor 18 can be firmly held. For example, even when the spherical phosphor 18 generates heat due to the light emitted from the light source 12 and the solder is melted, it is possible to prevent the spherical phosphor 18 from coming off from the holding member 24.
  • the holding member 24 having the flange portion 40 can be manufactured, for example, by press molding.
  • FIG. 12 shows a holding member 24 formed by vertically bonding two plate-shaped members 30a and 30b having a flange portion 40.
  • the spherical phosphor 18 can be more firmly held inside the collar portion 40. ..
  • the two plate-shaped members 30a and 30b can be joined to each other by using, for example, soldering or a conductive paste.
  • FIG. 13 is a plan view showing another embodiment of the holding member 24.
  • FIG. 14 is a sectional view taken along line DD of the holding member 24 shown in FIG.
  • the holding member 24 is formed of a substantially quadrangular plate-shaped member.
  • the holding member 24 is made of, for example, a metal material such as copper having high thermal conductivity.
  • a substantially circular through hole 26 is formed at substantially the center of the holding member 24.
  • a holding portion 42 formed so that its diameter gradually decreases downward is formed on the inner circumference of the through hole 26.
  • the inner peripheral surface of the holding portion 42 is a spherical surface. Therefore, it is possible to hold the spherical phosphor 18 inside the holding portion 42. Further, since the inner peripheral surface of the holding portion 42 is in close contact with the outer surface of the spherical phosphor 18, the spherical phosphor 18 can be firmly held. For example, even when the spherical phosphor 18 generates heat due to the light emitted from the light source 12 and the solder is melted, it is possible to prevent the spherical phosphor 18 from coming off from the holding member 24.
  • the holding portion 42 can be formed by using, for example, a ball end mill.
  • FIG. 15 shows a holding member 24 formed by vertically bonding two plate-shaped members 30a and 30b having a holding portion 42.
  • the spherical phosphor 18 can be more firmly held inside the holding portion 42 by vertically bonding the two plate-shaped members 30a and 30b having the holding portion 42. ..
  • the two plate-shaped members 30a and 30b can be joined to each other by using, for example, soldering or a conductive paste.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un dispositif électroluminescent qui permet de fixer facilement une partie de conversion de longueur d'onde comprenant un matériau comprenant un luminophore à un élément de maintien, et qui peut être fabriqué à moindre coût, et un procédé de fabrication d'un dispositif électroluminescent.　Un dispositif électroluminescent 10 est pourvu d'une source de lumière 12, et d'une partie de conversion de longueur d'onde 14 pour convertir la longueur d'onde de la lumière émise par la source de lumière 12. La partie de conversion de longueur d'onde 14 comprend un luminophore sphérique 18 obtenu par formation d'un matériau comprenant un luminophore en une forme sphérique. Dans le luminophore sphérique 18, une surface d'incidence de lumière 20 sur laquelle la lumière émise par la source de lumière 12 est incidente, et une surface d'émission de lumière 22 pour émettre la lumière convertie en longueur d'onde vers l'extérieur sont formées.
PCT/JP2020/007985 2019-11-06 2020-02-27 Dispositif électroluminescent et procédé de fabrication de dispositif électroluminescent WO2021090517A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-201397 2019-11-06
JP2019201397 2019-11-06
JP2020017854A JP2021077842A (ja) 2019-11-06 2020-02-05 発光装置及び発光装置の製造方法
JP2020-017854 2020-02-05

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WO2021090517A1 true WO2021090517A1 (fr) 2021-05-14

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080054280A1 (en) * 2006-09-06 2008-03-06 Gelcore Llc Light emitting packages and methods of making same
JP2008305936A (ja) * 2007-06-07 2008-12-18 Nichia Corp 半導体発光装置
WO2015020205A1 (fr) * 2013-08-09 2015-02-12 株式会社光波 Dispositif luminescent
JP2017120864A (ja) * 2015-12-28 2017-07-06 株式会社タムラ製作所 発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080054280A1 (en) * 2006-09-06 2008-03-06 Gelcore Llc Light emitting packages and methods of making same
JP2008305936A (ja) * 2007-06-07 2008-12-18 Nichia Corp 半導体発光装置
WO2015020205A1 (fr) * 2013-08-09 2015-02-12 株式会社光波 Dispositif luminescent
JP2017120864A (ja) * 2015-12-28 2017-07-06 株式会社タムラ製作所 発光装置

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