WO2021085191A1 - Composition de résine thermodurcissable, feuille de résine, feuille métallique équipée de résine, plaque stratifiée et carte de circuit imprimé - Google Patents

Composition de résine thermodurcissable, feuille de résine, feuille métallique équipée de résine, plaque stratifiée et carte de circuit imprimé Download PDF

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Publication number
WO2021085191A1
WO2021085191A1 PCT/JP2020/039155 JP2020039155W WO2021085191A1 WO 2021085191 A1 WO2021085191 A1 WO 2021085191A1 JP 2020039155 W JP2020039155 W JP 2020039155W WO 2021085191 A1 WO2021085191 A1 WO 2021085191A1
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Prior art keywords
resin
ethylene
propylene
metal foil
layer
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PCT/JP2020/039155
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English (en)
Japanese (ja)
Inventor
幸一 青木
朋之 青木
斉藤　英一郎
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パナソニックＩｐマネジメント株式会社
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Publication of WO2021085191A1 publication Critical patent/WO2021085191A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present disclosure relates to a heat-curable resin composition, a resin sheet, a metal foil with a resin, a laminated board, and a printed wiring board.
  • the heat-curable resin composition a dried product or a semi-cured product of the heat-curable resin composition.
  • the present invention relates to a printed wiring board provided with an insulating layer containing a cured product of a curable resin composition.
  • Patent Document 1 as a material for producing an insulating layer in a printed wiring board, a vinyl compound having a polyphenylene ether skeleton, a maleimide resin having two or more maleimide groups, and a polyolefin block and polystyrene containing a polyphenylene skeleton as main components.
  • a thermosetting adhesive composition containing an elastomer, which is a copolymer of blocks, in a predetermined ratio is disclosed.
  • Patent Document 1 describes that this thermosetting adhesive composition has a low dielectric constant and a low dielectric loss tangent, exhibits high adhesive strength to an LCP film and a copper foil, and has high heat resistance and the like. (See paragraph 0036 of Patent Document 1).
  • thermosetting adhesive composition disclosed in Patent Document 1 is not sufficient.
  • An object of the present disclosure is a resin sheet containing a thermocurable resin composition in which the cured product can have a low dielectric constant, a low dielectric tangent and high heat resistance, and a dried or semi-cured product of the thermocurable resin composition.
  • the thermosetting resin composition according to one aspect of the present disclosure contains an ethylene-propylene-diene copolymer (A) and an organic compound (B) having a polymerizable functional group.
  • the ethylene-propylene-diene copolymer (A) contains a branched ethylene-propylene-diene copolymer (A1) in an amount of 15% by mass or more and 50% by mass based on the ethylene-propylene-diene copolymer (A). It is contained in a percentage of% or less.
  • the resin sheet according to one aspect of the present disclosure includes a dried product or a semi-cured product of the thermosetting resin composition.
  • the metal foil with resin includes a metal foil and a resin layer that overlaps the metal foil.
  • the resin layer contains a dried product or a semi-cured product of the thermosetting resin composition.
  • the resin-attached metal foil includes a metal foil, a first resin layer that overlaps the metal foil, and a second resin layer that overlaps the first resin layer.
  • the first resin layer contains at least one component selected from the group consisting of liquid crystal polymer resin, polyimide resin, polyamide-imide resin, fluororesin and polyphenylene ether resin.
  • the second resin layer contains a dried product or a semi-cured product of the thermosetting resin composition.
  • the laminated board according to one aspect of the present disclosure includes an insulating layer and a metal foil.
  • the insulating layer contains a cured product of the thermosetting resin composition.
  • the printed wiring board according to one aspect of the present disclosure includes an insulating layer and conductor wiring.
  • the insulating layer contains a cured product of the thermosetting resin composition.
  • FIG. 1A is a schematic cross-sectional view showing a resin sheet according to the embodiment of the present disclosure
  • FIG. 1B is a schematic cross-sectional view showing an example of a printed wiring board made from the resin sheet shown in FIG. 1A
  • FIGS. 2A and 2B is a schematic cross-sectional view showing an example of a metal leaf with a resin according to an embodiment of the present disclosure
  • FIGS. 3A, 3B, 3C and 3D is a schematic cross-sectional view showing an example of a laminated board according to an embodiment of the present disclosure
  • 4A, 4B, 4C and 4D are schematic cross-sectional views showing an example of a printed wiring board according to an embodiment of the present disclosure.
  • thermosetting resin composition (hereinafter referred to as composition (X)) according to one embodiment of the present disclosure is an ethylene-propylene-diene copolymer (A) and an organic compound (B) having a polymerizable functional group. And contains.
  • the ethylene-propylene-diene copolymer (A) is a branched ethylene-propylene-diene copolymer (A1) in an amount of 15% by mass or more and 50% by mass based on the ethylene-propylene-diene copolymer (A). It is contained in the following percentages.
  • the branched ethylene-propylene-diene copolymer (A1) has a Mooney viscosity (ML (1 + 4)) of 10 or more and 300 or less at 100 ° C. and 10 or more and 150 or less at 125 ° C. At least one of the above is satisfied.
  • thermosetting resin composition in which the cured product can have a low dielectric constant, a low dielectric loss tangent, and a high heat resistance.
  • a resin sheet containing a dried or semi-cured product of the heat-curable resin composition, a metal foil with a resin including a resin layer containing the semi-cured product of the heat-curable resin composition, and the heat-curable resin composition a laminated board having an insulating layer containing a cured product of the above, and a printed wiring board having an insulating layer containing a cured product of the heat-curable resin composition can be obtained.
  • the ethylene-propylene-diene copolymer (A1) is a branched type, the crosslink density of the cured product of the composition (X) can be increased, and the cured product tends to have high heat resistance.
  • the Mooney viscosity (ML (1 + 4)) of the ethylene-propylene-diene copolymer (A1) satisfies at least one of 10 or more at 100 ° C. and 10 or more at 125 ° C.
  • the cured product tends to have particularly high heat resistance and toughness.
  • at least one of the Mooney viscosity (ML (1 + 4)) of the ethylene-propylene-diene copolymer (A1) is 300 or less at 100 ° C. and 150 or less at 125 ° C. is satisfied, ethylene is used.
  • the -propylene-diene copolymer (A1) does not easily increase the melt viscosity of the composition (X).
  • the cured product has particularly high heat resistance. It is easy to have properties and it is difficult to increase the melt viscosity of the thermosetting resin composition.
  • the composition (X) is suitable as a material for producing an insulating layer in a laminated board and a printed wiring board.
  • the composition (X) has good high frequency characteristics and good characteristics for a printed wiring board. Reliability can be given.
  • composition (X) The components of the composition (X) will be described in detail.
  • the ethylene-propylene-diene copolymer (A) (hereinafter, also referred to as the copolymer (A)) is generally also referred to as EPDM rubber (ethylene-propylene-diene monomer rubber).
  • the copolymer (A) can easily improve the moldability when the composition (X) is molded into a sheet to prepare a resin film, easily reduce the dielectric constant of the cured product, and increase the coefficient of linear expansion of the cured product. It is easy to lower it, and it is easy to increase the heat resistance of the cured product.
  • the diene constituting the copolymer (A) preferably contains 5-ethylidene-2-norbornene. That is, for example, the copolymer (A) preferably contains a component represented by the following formula (1).
  • each of n, m and l is a natural number and indicates the number of structural units in the formula (1).
  • 5-Etylidene-2-norbornene can contribute to the speeding up of the curing reaction of the composition (X), and the time required for curing the composition (X) can be shortened.
  • the mass ratio of the structural unit derived from diene (hereinafter, also referred to as diene structural unit) to the entire copolymer (A) is preferably 3% or more. This can contribute to improving the heat resistance of the cured product. It is more preferable that the ratio of the diene structural unit is 3% or more and 15% or less.
  • the mass ratio of the structural unit derived from ethylene (hereinafter, also referred to as ethylene structural unit) to the entire copolymer (A) is preferably 50% or more.
  • the composition (X) can be easily formed into a sheet. It is more preferable that the ratio of ethylene structural units is 50% or more and 75% or less.
  • the copolymer (A) contains a branched ethylene-propylene-diene copolymer (A1) (hereinafter, also referred to as a first copolymer (A1)).
  • the first copolymer (A1) must satisfy at least one of a Mooney viscosity (ML (1 + 4)) of 10 or more and 300 or less at 100 ° C. and 10 or more and 150 or less at 125 ° C. preferable. Since the first copolymer (A1) has branches, the heat resistance of the cured product can be improved as described above.
  • the first copolymer (A1) can be obtained, for example, by polymerizing a monomer containing 5-vinyl-2-norbornene as a cross-linking component in addition to a general raw material for EPDM.
  • Specific examples of the first copolymer (A1) include EPT8030M and EPT9040M manufactured by Mitsui Chemicals, Inc.
  • the Mooney viscosity (ML (1 + 4)) of the first copolymer (A1) is 10 or more at 100 ° C., as described above, the first copolymer (A1) tends to increase the toughness of the cured product. Therefore, the insulating layer containing the cured product is not easily damaged.
  • the Mooney viscosity (ML (1 + 4)) is more preferably 20 or more at 100 ° C., and even more preferably 30 or more. Further, as described above, the Mooney viscosity (ML (1 + 4)) of the first copolymer (A1) is less than 70 at 125 ° C., so that the first copolymer (A1) has the viscosity of the composition (X). Is difficult to raise. Therefore, the composition (X) can be easily formed into a sheet.
  • the Mooney viscosity (ML (1 + 4)) is more preferably 60 or less at 125 ° C., and even more preferably 30 or less.
  • the copolymer (A) may contain only the first copolymer (A1), or may further contain components other than the first copolymer (A1).
  • the copolymer (A) contains a component other than the first copolymer (A1)
  • the copolymer (A) is a linear ethylene-propylene-diene copolymer (A2) (hereinafter referred to as the first copolymer). It is preferable to contain a dicopolymer (also referred to as A2)).
  • the composition (X) is particularly easy to form into a sheet.
  • the second copolymer (A2) must satisfy at least one of a Mooney viscosity (ML (1 + 4)) of 1 or more and 200 or less at 100 ° C. and 1 or more and 100 or less at 125 ° C. preferable. If at least one of the Mooney viscosity (ML (1 + 4)) of 1 or more at 100 ° C. and 1 or more at 125 ° C. is satisfied, the second copolymer (A2) determines the toughness of the cured product. Easy to raise. Therefore, the insulating layer containing the cured product is less likely to be damaged.
  • the Mooney viscosity (ML (1 + 4)) is more preferably 5 or more at 100 ° C., and even more preferably 10 or more.
  • the Mooney viscosity (ML (1 + 4)) is more preferably 5 or more at 125 ° C., and even more preferably 10 or more. Further, when at least one of the Mooney viscosity of 200 or less at 100 ° C. and 100 or less at 125 ° C. is satisfied, the second copolymer (A2) increases the viscosity of the composition (X). Hateful. Therefore, the composition (X) is particularly easy to form into a sheet.
  • the Mooney viscosity (ML (1 + 4)) is more preferably 80 or less at 125 ° C., and even more preferably 70 or less.
  • the Mooney viscosity ML (1 + 4) is defined by JIS K6300-1: 2013.
  • the percentage of the first copolymer (A1) to the ethylene-propylene-diene copolymer (A) is 15% by mass or more and 50% by mass or less.
  • the percentage of the first copolymer (A1) is 15% by mass or more, the heat resistance of the cured product tends to be particularly improved.
  • the percentage of the first copolymer (A1) is 50% by mass or less, the melt viscosity of the composition (X) is unlikely to increase excessively, and therefore the composition (X) can be easily molded into a sheet shape.
  • the percentage of the first copolymer (A1) is more preferably 20% by mass or more. Further, it is more preferable that the percentage of the first copolymer (A1) is 40% by mass or less.
  • the first copolymer (A2) is compared with the ethylene-propylene-diene copolymer (A).
  • the percentage is preferably 50% by mass or more and 85% by mass or less.
  • the percentage of the first copolymer (A2) is 50% by mass or more, the composition (X) is particularly easy to be formed into a sheet.
  • the percentage of the second copolymer (A2) is 85% by mass or less, the heat resistance of the cured product tends to be particularly improved.
  • the percentage of the second copolymer (A2) is more preferably 60% by mass or more. Further, it is more preferable that the percentage of the first copolymer (A1) is 80% by mass or less.
  • the composition (X) further contains an organic compound (B) having a polymerizable functional group other than the copolymer (A).
  • the polymerizable functional group is, for example, a polymerizable unsaturated group.
  • the polymerizable unsaturated group includes, for example, at least one group selected from the group consisting of a vinyl group, an allyl group, a metharyl group, a styryl group, a meta (acrylic) group, and a maley middle group.
  • the organic compound (B) when the organic compound (B) contains a monofunctional compound having one polymerizable functional group, the monofunctional compound can reduce the melt viscosity of the composition (X) and improve the moldability. Further, when the organic compound (B) contains a polyfunctional compound having a plurality of polymerizable functional groups, the polyfunctional compound can increase the crosslink density of the cured product. Thereby, the polyfunctional compound can contribute to the improvement of the toughness of the cured product, the improvement of the glass transition point and the heat resistance associated therewith, the reduction of the coefficient of linear expansion, and the improvement of the adhesion with the resin.
  • Polyfunctional compounds include, for example, divinylbenzene, dicyclopentadiene, methylcyclopentadiene dimer, trivinylcyclohexane, triallyl isocyanurate (TAIC), dicyclopentadiene dimethanol dimethacrylate, nonanediol dimethacrylate, 1,3-diisopropenyl.
  • TAIC triallyl isocyanurate
  • dicyclopentadiene dimethanol dimethacrylate nonanediol dimethacrylate
  • 1,3-diisopropenyl 1,3-diisopropenyl.
  • R in the formula (2) is a single bond or a divalent organic group, and the organic group is, for example, a hydrocarbon group.
  • An example of the compound represented by the formula (2) is DD-1 manufactured by Shikoku Chemicals Corporation.
  • bismaleimide 4,4'-diphenylmethane bismaleimide, m-phenylene bismaleimide, bisphenol A diphenyl ether bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, 4 Examples thereof include -methyl-1,3-phenylene bismaleimide and 1,6-bismaleimide- (2,2,4-trimethyl) hexane.
  • the components that the polyfunctional compound can contain are not limited to the above.
  • the amount of the copolymer (A) with respect to a total of 100 parts by mass of the copolymer (A) and the organic compound (B) is preferably 70 parts by mass or more and 99 parts by weight or less. That is, the amount of the organic compound (B) with respect to a total of 100 parts by mass of the copolymer (A) and the organic compound (B) is preferably 1 part by mass or more and 30 parts by weight or less. When the amount of the organic compound (B) is 1 part by mass or more, the organic compound (B) can particularly contribute to the improvement of the physical properties of the thermosetting resin composition or the cured product.
  • the organic compound (B) contains a polyfunctional compound
  • the adhesion of the cured product to the resin is particularly likely to be improved.
  • the amount of the organic compound (B) is 30 parts by mass or less, the dielectric constant of the cured product tends to be lowered.
  • the composition (X) may contain an inorganic filler (C).
  • the inorganic filler (C) can contribute to the improvement of the dielectric property of the cured product, the improvement of heat resistance, the improvement of flame retardancy, the improvement of toughness, and the reduction of the coefficient of thermal expansion.
  • the inorganic filler (C) is at least one material selected from the group consisting of, for example, silica, alumina, talc, aluminum hydroxide, magnesium hydroxide, titanium oxide, mica, aluminum borate, barium sulfate, and calcium carbonate. Can be contained.
  • the material that can be contained in the inorganic filler (C) is not limited to the above.
  • the inorganic filler (C) is surface-treated with a polymerizable organic compound.
  • the polymerizable organic compound is, for example, a surface treatment agent having a polymerizable unsaturated bond.
  • polymerizable unsaturated bonds include a vinyl group, an allyl group, a metalyl group, a styryl group, an acryloyl group, a methacryloyl group, and a maleimide group.
  • surface treatment agents include silane coupling agents having a polymerizable unsaturated bond.
  • the surface of the inorganic filler (C) is surface-treated with a polymerizable organic compound, so that the surface has a polymerization reactivity.
  • the polymerizable organic compound is a surface treatment agent having a polymerizable unsaturated bond
  • the inorganic filler (C) has a polymerization reactivity by having a polymerizable unsaturated bond on the surface. Therefore, when the composition (X) is cured, the surface of the inorganic filler (C) can react with the copolymer (A), which can increase the crosslink density of the cured product. As a result, the inorganic filler (C) can particularly contribute to improving the heat resistance of the cured product.
  • the amount of the inorganic filler (C) shall be 30 parts by mass or more and 500 parts by mass or less with respect to 100 parts by mass in total of the copolymer (A) and the organic compound (B) in the composition (X). Is preferable.
  • the inorganic filler (C) can further contribute to the improvement of the heat resistance of the cured product, and the amount of the inorganic filler (C) is 100 parts by mass or more. It is also preferable, and in this case, the inorganic filler (C) can particularly contribute to the reduction of the coefficient of linear expansion of the cured product. Further, when the amount of the inorganic filler (C) is 500 parts by mass or less, the relative permittivity of the cured product can be maintained particularly low.
  • the composition (X) may contain a thermal radical polymerization initiator.
  • the thermal radical polymerization initiator can accelerate the curing of the composition (X) when it is heated.
  • the thermal radical polymerization initiator preferably contains an organic peroxide.
  • the thermal radical polymerization initiator is, for example, ⁇ , ⁇ '-bis (t-butylperoxy-m-isopropyl) benzene, 2,5-dimethyl-2,5-di (t-butylperoxy) -3-hexine. , Benzoyl peroxide, 3,3', 5,5'-tetramethyl-1,4-diphenoquinone, chloranyl, 2,4,6-tri-t-butylphenoxyl, t-butylperoxyisopropyl monocarbonate, and azo It contains at least one component selected from the group consisting of bisisobutyronitrile.
  • the components that can be contained in the thermal radical polymerization initiator are not limited to the above.
  • the amount of the thermal radical polymerization initiator is, for example, 0.1 part by mass or more and 3 parts by mass or less with respect to 100 parts by mass of the total of the copolymer (A) and the organic compound (B), but is not limited thereto. ..
  • the composition (X) may further contain additives other than the above components.
  • additives include defoamers such as flame retardants, polymerization inhibitors, silicone defoamers, and acrylic acid ester defoamers, heat stabilizers, antistatic agents, UV absorbers, dyes, pigments, lubricants. , And dispersants such as wet dispersants.
  • defoamers such as flame retardants, polymerization inhibitors, silicone defoamers, and acrylic acid ester defoamers, heat stabilizers, antistatic agents, UV absorbers, dyes, pigments, lubricants.
  • dispersants such as wet dispersants.
  • the additives that can be contained in the composition (X) are not limited to the above.
  • the composition (X) may contain a solvent (D), if necessary.
  • the solvent (D) preferably contains at least one component selected from the group consisting of an aliphatic hydrocarbon solvent, an aromatic hydrocarbon solvent and a ketone solvent. In this case, the moldability when the composition (X) is molded into a sheet is improved.
  • the resin sheet according to this embodiment contains a dried product or a semi-cured product of the composition (X).
  • the resin sheet can be applied as a material for producing a laminated board and a printed wiring board. By curing the resin sheet, an insulating layer containing the cured product of the composition (X) can be produced.
  • the composition (X) is first molded into a sheet shape.
  • the method for molding the composition (X) include, but are not limited to, a coating method.
  • the composition (X) is dried or semi-cured by heating.
  • a resin sheet containing a dried product or a semi-cured product of the composition (X) is obtained.
  • the heating temperature during heating may be any temperature at which the solvent contained in the composition (X) can be dried or the composition (X) can be semi-cured, and is, for example, 100 ° C. or higher and 160 ° C. or lower.
  • the heating time during heating is, for example, 5 minutes or more and 10 minutes or less.
  • an insulating layer containing the cured product of the composition (X) can be produced.
  • the heating temperature during heating is, for example, 160 ° C. or higher and 200 ° C. or lower, preferably 180 ° C. or higher and 200 ° C. or lower.
  • the heating time during heating is, for example, 30 minutes or more and 120 minutes or less, preferably 60 minutes or more and 120 minutes or less.
  • the resin sheet can be used as a bonding sheet for adhering base materials such as a plurality of printed wiring boards.
  • the composition (X) is first applied to a support film 8 made of polyethylene terephthalate or the like to form a sheet, and then the composition (X) is dried or semi-cured to form a resin.
  • Sheet 7 is prepared (see FIG. 1A).
  • the resin sheet 7 is attached to a base material (first base material 91) such as a printed wiring board, and then the support film 8 is peeled off from the resin sheet 7.
  • another base material (second base material 92) is superposed on the resin sheet 7 on the first base material 91.
  • a laminate containing the first base material 91, the second base material 92, and the resin sheet 7 interposed between the first base material 91 and the second base material 92 can be obtained.
  • the resin sheet 7 is melted and then cured to prepare an insulating layer 30 (adhesive layer).
  • the first base material 91 and the second base material 92 are adhered to each other via the insulating layer 30.
  • the resin sheet 7 melts in a state of overlapping the conductor wiring 93.
  • the printed wiring board 3 includes an insulating layer 94 and a conductor wiring 93 derived from the first base material 91, an insulating layer 94 and a conductor wiring 93 derived from the second base material 92, and a first base material 91 and a second base. It includes an insulating layer 30 made of a resin sheet 7 interposed between the material 92 and the material 92.
  • the metal foil 1 with resin will be described.
  • the resin-attached metal foil 1 includes a metal foil 10 and a resin layer 20 that overlaps the metal foil 10, and the resin layer 20 contains a dried product or a semi-cured product of the composition (X).
  • a laminated board or a printed wiring board can be produced from the metal foil 1 with resin.
  • the resin-attached metal foil 1 includes a metal foil 10 and a resin layer 20 that overlaps the metal foil 10, and the resin layer 20 includes the above-mentioned resin sheet 7, so that the resin layer 20 is formed.
  • the metal leaf 10 is, for example, a copper foil.
  • the thickness of the metal foil 10 is, for example, 2 ⁇ m or more and 105 ⁇ m or less, preferably 5 ⁇ m or more and 35 ⁇ m or less.
  • the metal foil 10 may be, for example, a copper foil in a 2 ⁇ m thick copper foil with an 18 ⁇ m thick copper carrier foil.
  • the resin layer 20 shown in FIG. 2A has a first resin layer 21 that overlaps the metal foil 10 and a second outermost layer that overlaps the first resin layer 21 and is opposite to the metal foil 10 in the resin layer 20. Includes a resin layer 22.
  • the second resin layer 22 is made of a resin sheet 7, and the first resin layer 21 has a composition different from that of the second resin layer 22.
  • the resin layer 20 and the insulating layer made from the resin layer 20 are imparted with characteristics according to the composition of the first resin layer 21.
  • the first resin layer 21 can produce a flexible laminated board or a printed wiring board from the resin-attached metal foil 1 by imparting good flexibility to the insulating layer.
  • the thickness of the first resin layer 21 is, for example, 1 ⁇ m or more and 50 ⁇ m or less.
  • the thickness of the second resin layer 22 is, for example, 5 ⁇ m or more and 200 ⁇ m or less, preferably 10 ⁇ m or more and 150 ⁇ m or less.
  • the first resin layer 21 contains at least one component (hereinafter, also referred to as a specific resin component) selected from the group consisting of, for example, a liquid crystal polymer resin, a polyimide resin, a polyamide-imide resin, a fluororesin, and a polyphenylene ether resin.
  • the first resin layer 21 is made of a resin liquid or a sheet material containing a specific resin component.
  • the sheet material may have a base material such as glass cloth inside thereof and may be reinforced with this base material.
  • the sheet material may be, for example, a prepreg.
  • the first resin layer 21 can be produced, for example, by applying a resin liquid to the metal foil 10 and then drying it, or by stacking a sheet material on the metal foil 10 and then heat-pressing it.
  • the first resin layer 21 may be a single layer as shown in FIG. 2A, but may be composed of a plurality of layers.
  • the first resin layer 21 may include a first layer 211 and a second layer 212 having different compositions from each other, as shown in FIG. 2B.
  • each of the first layer 211 and the second layer 212 contains a specific resin component and has a different composition from each other.
  • the first resin layer 21 may include three or more layers.
  • the second resin layer 22 is made of the resin sheet 7 as described above.
  • the composition (X) is formed into a sheet on the first resin layer 21 by a coating method or the like, and then dried or semi-cured by heating to form a second resin composed of the resin sheet 7.
  • Layer 22 can be made.
  • the resin layer 20 may be a single layer containing only the resin sheet 7.
  • the composition (X) is formed into a sheet on the metal foil 10 by a coating method or the like, and then dried or semi-cured by heating to form a resin layer 20 containing only the resin sheet 7. Can be made.
  • the laminated board 2 As shown in FIGS. 3A to 3D, the laminated plate 2 includes an insulating layer 30 and a metal foil 10.
  • the laminated plate 2 is provided with a metal foil 10 on the outermost layer thereof.
  • the laminated plate 2 may include one metal foil 10 or a plurality of metal foils 10.
  • the laminated plate 2 includes one of the plurality of metal foils 10 in its outermost layer.
  • the insulating layer 30 contains a cured product of the composition (X).
  • the insulating layer 30 may further contain a specific resin component.
  • the laminated plate 2 may be provided with only one insulating layer 30 as shown in FIGS. 3A and 3B, or may be provided with two or more insulating layers 30 as shown in FIGS. 3C and 3D.
  • the insulating layer 30 includes, for example, only a layer containing a cured product of the composition (X), or a second layer containing a cured product of the composition (X). It includes 302 and the other first layer 301.
  • the first layer 301 contains, for example, a specific resin component.
  • the thickness of the first layer 301 is, for example, 1 ⁇ m or more and 50 ⁇ m or less.
  • the thickness of the second layer 302 is, for example, 5 ⁇ m or more and 50 ⁇ m or less.
  • At least one of the two or more insulating layers 30 may include a cured product of the composition (X). Further, at least one of the two or more insulating layers 30 may contain a specific resin component. At least one of the two or more insulating layers 30 may contain a cured product of the composition (X) and a specific resin component. In this case, at least one of the two or more insulating layers 30 may be a layer including the first layer 301 and a second layer 302 overlapping the first layer 301. Each of the two or more insulating layers 30 may contain a specific resin component.
  • the material and thickness of the metal leaf 10 may be the same as that of the metal leaf 10 in the above-mentioned metal leaf 1 with resin.
  • the insulating layer 30 containing the cured product of the composition (X) in the laminated plate 2 it is easy to realize a low dielectric constant, a low dielectric loss tangent, and an improvement in heat resistance of the insulating layer 30.
  • the laminated plate 2 shown in FIG. 3A includes a metal foil 10, a first layer 301, and a second layer 302, which are laminated in this order.
  • the laminated plate 2 shown in FIG. 3A is manufactured, for example, by heating the above-mentioned metal foil 1 with resin.
  • the manufacturing method of the laminated board 2 is not limited to this.
  • the laminated plate 2 can be manufactured by stacking the metal foil 10, the sheet material containing the components of the first layer 301, and the above-mentioned resin sheet 7 in this order and then heat-pressing them.
  • the metal leaf 10, the second layer 302, and the first layer 301 may be laminated in this order.
  • the first layer 301 may include two or more layers. In that case, the two layers in direct contact within the first layer 301 have different compositions from each other.
  • the laminated plate 2 shown in FIG. 3B includes a metal foil 10 (first metal foil 11), an insulating layer 30, and a metal foil 10 (second metal foil 12), and these are laminated in this order.
  • the laminated plate 2 is manufactured, for example, by superimposing a metal foil on the resin layer 20 of the above-mentioned resin-attached metal foil 1 and heat-pressing it.
  • the manufacturing method of the laminated board 2 is not limited to this.
  • a sheet material containing the components of the first metal foil 11, the first layer 301, the above-mentioned resin sheet 7, and the second metal foil 12 are prepared, laminated in this order, and then heat-pressed. As a result, the laminated plate 2 may be manufactured.
  • the laminated plate 2 shown in FIG. 3C includes a metal foil 10 (first metal foil 11), an insulating layer 30 (first insulating layer 31), a conductor layer 50, and an insulating layer 30 (second insulating layer 32). ) And are laminated in this order.
  • the first insulating layer 31 includes a first layer 301 and a second layer 302. The configuration of the first insulating layer 31 may be the same as that of the insulating layer 30 in the laminated plate 2 shown in FIG. 3A.
  • the second insulating layer 32 contains at least one component selected from the group consisting of, for example, a cured product of the composition (X), a liquid crystal polymer resin, a polyimide resin, a polyamide-imide resin, a fluororesin, and a polyphenylene ether resin.
  • the conductor layer 50 is a conductor wiring, but may be a metal foil.
  • a core material including a second insulating layer 32 and a conductor layer 50 (conductor wiring) overlapping the second insulating layer 32 is prepared.
  • the resin layer 20 of the above-mentioned metal foil 1 with resin is superposed on the surface of the core material on the conductor layer 50 side.
  • the laminated plate 2 can be manufactured by hot-pressing the core material and the metal foil 1 with resin.
  • the resin sheet 7 in the resin layer 20 of the metal foil 1 with resin is melted in a state of being overlapped with the conductor layer 50 and then cured.
  • the insulating layer 31 is likely to be sufficiently filled in the gaps between the conductor layers 50.
  • the manufacturing method of the laminated board 2 is not limited to the above.
  • a metal foil 10 first metal foil 11
  • a sheet material containing the components of the first layer 301 the above-mentioned resin sheet 7, the conductor layer 50, and a sheet material containing the components of the second insulating layer 32.
  • the laminated plate 2 can be manufactured by stacking these in the above order and heat-pressing them.
  • the laminated plate 2 shown in FIG. 3D includes a metal foil 10 (first metal foil 11), an insulating layer 30 (first insulating layer 31), a conductor layer 50, an insulating layer 30 (second insulating layer 32), and a metal.
  • Foil 10 (second metal foil 12) is provided by laminating in this order.
  • the first insulating layer 31 includes a first layer 301 and a second layer 302.
  • the conductor layer 50 is a conductor wiring, but may be a metal foil. That is, the laminated plate 2 shown in FIG. 3D has the same configuration as the laminated plate 2 shown in FIG. 3C except that the second metal foil 12 is further provided.
  • the laminated plate 2 For example, a core material having a structure in which the second metal foil 12, the second insulating layer 32, and the conductor layer 50 (conductor wiring) are laminated in this order is prepared.
  • the resin layer 20 of the above-mentioned metal foil 1 with resin is superposed on the surface of the core material on the conductor layer 50 side.
  • the laminated plate 2 can be manufactured by hot-pressing the core material and the metal foil 1 with resin.
  • the resin sheet 7 in the resin layer 20 of the metal foil 1 with resin is melted in a state of being overlapped with the conductor layer 50 and then cured.
  • the insulating layer 31 is likely to be sufficiently filled in the gaps between the conductor layers 50.
  • the manufacturing method of the laminated board 2 is not limited to the above.
  • a sheet material containing the components of the first metal foil 11, the first layer 301, the above-mentioned resin sheet 7, the conductor layer 50, the sheet material containing the components of the second insulating layer, and the second metal foil 12. Prepare.
  • the laminated plate 2 can be manufactured by laminating these in this order and heat-pressing them.
  • the laminated plate 2 may include one or more metal foils 10, two or more conductor layers 50, and three or more insulating layers 30.
  • the conductor layer 50 is interposed between two adjacent insulating layers 30.
  • the metal leaf 10 is on the outermost layer of the laminated plate 2.
  • At least one of the three or more insulating layers 30 contains a cured product of the composition (X).
  • At least one of the three or more insulating layers 30 contains, for example, a specific resin component.
  • the printed wiring board 3 includes an insulating layer 30 and a conductor wiring 60.
  • the printed wiring board 3 includes a conductor wiring 60 on the outermost layer thereof.
  • the insulating layer 30 contains a cured product of the composition (X). In this case, it is easy to improve the heat resistance of the insulating layer 30, reduce the coefficient of linear expansion, and improve the flame retardancy.
  • the printed wiring board 3 may include one insulating layer 30 as shown in FIGS. 4A and 4B, and may include a plurality of insulating layers 30 as shown in FIGS. 4C and 4D.
  • the printed wiring board 3 includes a plurality of insulating layers 30, at least one insulating layer 30 contains the composition (X). Further, it is preferable that at least one insulating layer 30 contains a specific resin component.
  • the printed wiring board 3 shown in FIGS. 4C and 4D is also a multilayer printed wiring board 4 because it includes one or more conductor wirings 60 and two or more insulating layers 30.
  • the insulating layer 30 may be composed of a single layer or may be composed of a plurality of layers.
  • the printed wiring board 3 shown in FIGS. 4A to 4D includes an insulating layer 30 composed of a first layer 301 and a second layer 302 overlapping the first layer 301.
  • the structure of the insulating layer 30 is the same as that of the insulating layer 30 in the laminated plate 2 described above.
  • the printed wiring board 3 shown in FIGS. 4A to 4D will be described in more detail.
  • the printed wiring board 3 shown in FIG. 4A includes a conductor wiring 60, a first layer 301, and a second layer 302 laminated in this order.
  • the printed wiring board 3 has the same configuration as the laminated board 2 shown in FIG. 3A, except that the printed wiring board 3 has a conductor wiring 60 instead of the metal foil 10.
  • the printed wiring board 3 can be manufactured, for example, by removing unnecessary portions of the metal foil 10 in the laminated board 2 shown in FIG. 3A by etching or the like to manufacture the conductor wiring 60.
  • the printed wiring board 3 shown in FIG. 4B includes a conductor wiring 60, an insulating layer 30, and a conductor layer 50 stacked in this order.
  • FIG. 3B except that the printed wiring board 3 includes a conductor wiring 60 instead of the first metal foil 11 and a conductor layer 50 (second conductor layer 52) instead of the second metal foil 12. It has the same configuration as the laminated board 2 shown in 1. Therefore, the printed wiring board 3 can be manufactured, for example, by removing unnecessary portions of the first metal foil 11 in the laminated board 2 shown in FIG. 3B by etching or the like to manufacture the conductor wiring 60.
  • the printed wiring board 3 shown in FIG. 4C includes a conductor wiring 60, an insulating layer 30 (first insulating layer 31), a conductor layer 50, and an insulating layer 30 (second insulating layer 32) laminated in this order. ing.
  • the printed wiring board 3 has the same configuration as the laminated board 2 shown in FIG. 3C, except that the printed wiring board 3 has a conductor wiring 60 instead of the metal foil 10.
  • the printed wiring board 3 can be manufactured, for example, by removing unnecessary portions of the metal foil 10 in the laminated board 2 shown in FIG. 3C by etching or the like to manufacture the conductor wiring 60.
  • the printed wiring board 3 shown in FIG. 4D includes a conductor wiring 60, an insulating layer 30 (first insulating layer 31), a conductor layer 50 (first conductor layer 51), and an insulating layer 30 (second insulating layer 32). And the conductor layer 50 (second conductor layer 52) are laminated and provided in this order.
  • FIG. 3D except that the printed wiring board 3 includes a conductor wiring 60 instead of the first metal foil 11 and a conductor layer 50 (second conductor layer 52) instead of the second metal foil 12. It has the same configuration as the laminated board 2 shown in 1.
  • the printed wiring board 3 can be manufactured, for example, by removing an unnecessary portion of the first metal foil 11 in the laminated board 2 shown in FIG. 3D by etching or the like to produce a conductor wiring 60.
  • the printed wiring board 3 shown in FIGS. 4C and 4D includes, but is not limited to, two insulating layers 30.
  • the printed wiring board 3 may include three or more insulating layers 30.
  • the composition was applied onto a polyethylene terephthalate film having a thickness of 38 ⁇ m using a comma coater and a dryer connected thereto, and then the composition was heated at 110 ° C. for 5 minutes. As a result, a resin sheet having a thickness of 25 ⁇ m was produced on the polyethylene terephthalate film.
  • Copolymer 1 Linear ethylene-propylene-diene copolymer, Mooney viscosity (ML (1 + 4)) 15 at 100 ° C., ethylene content 72%, diene content 3.6%, Mitsui Chemicals Co., Ltd. Made, part number EPT X-3012P.
  • Copolymer 2 Branched ethylene-propylene-diene copolymer, Mooney viscosity (ML (1 + 4)) 32 at 100 ° C., ethylene content 47%, diene content 9.5%, manufactured by Mitsui Kagaku Co., Ltd. , Part number EPT 8030M.
  • -Copolymer 3 Linear ethylene-propylene-diene copolymer, Mooney viscosity (ML (1 + 4)) 47 at 125 ° C., ethylene content 61%, diene content 5.4%, Mitsui Chemicals Co., Ltd. Made, part number EPT 3070.
  • Copolymer 4 Branched ethylene-propylene-diene copolymer, Mooney viscosity (ML (1 + 4)) 58 at 125 ° C., ethylene content 41%, diene content 14.0%, manufactured by Mitsui Kagaku Co., Ltd. , Part number EPT 9040M.
  • -Organic compound having a polymerizable functional group 1 Triallyl isocyanurate, manufactured by Mitsubishi Chemical Corporation, TAIC.
  • -Organic compound with polymerizable functional group 2 Tricyclodecanedimethanol dimethacrylate, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., DCP.
  • -Inorganic filler Spherical silica surface-treated with vinylsilane, manufactured by Admatex Co., Ltd., product number SC2300-SVJ.
  • -Thermal radical polymerization initiator manufactured by NOF CORPORATION, product name Perbutyl P.
  • the Mooney viscosity (ML (1 + 4)) cannot be specified, and the copolymer 3 and the copolymer 4 do not flow at 100 ° C. Therefore, the Mooney viscosity (ML (1 + 4)) cannot be specified. Further, since the copolymer 5 does not flow at either 100 ° C. or 125 ° C., the Mooney viscosity (ML (1 + 4)) cannot be specified.
  • Evaluation test 2-1 Dielectric properties (relative permittivity and dielectric loss tangent) Two copper foils having a thickness of 18 ⁇ m were arranged so that their glossy surfaces faced each other, and a resin sheet was arranged between the two copper foils. Samples were prepared by heating and pressing these at 200 ° C. and 2 MPa for 1 hour. By etching this sample to remove the copper foils on both sides, a test piece made of a cured product of a resin sheet was prepared. The relative permittivity and dielectric loss tangent of this test piece at a test frequency of 10 GHz were measured based on IPC TM-650 2.5.5.5.
  • Peeling strength 1 (Peeling strength against resin) Two base materials having a copper foil having a thickness of 12 ⁇ m and an insulating layer made of polyamide-imide having a thickness of 3 ⁇ m were prepared. The two base materials were arranged so that the insulating layers face each other, and a resin sheet was further arranged between the insulating layers. Samples were prepared by heating and pressing these at 200 ° C. and 2 MPa for 1 hour. The 90 ° peel strength of the cured product of the resin sheet with respect to the insulating layer made of polyamide-imide of this sample was measured.
  • Peeling strength 2 (Peeling strength against metal)
  • a base material provided with a copper foil having a thickness of 12 ⁇ m and an insulating layer made of polyamide-imide having a thickness of 3 ⁇ m and a copper foil having a thickness of 12 ⁇ m were prepared.
  • the insulating layer of the base material and the copper foil were arranged so as to face each other, and a resin sheet was further arranged between the insulating layer and the copper foil.
  • Samples were prepared by heating and pressing these at 200 ° C. and 2 MPa for 1 hour. The 90 ° peel strength of the cured product of the resin sheet with respect to the copper foil of this sample was measured.
  • Solder heat resistance 1 A sample was prepared by the same method as in the case of the above-mentioned "peeling strength 1" test. From the sample, a test piece was prepared based on JIS C6471. The test piece was floated in a solder bath at 260 ° C., 288 ° C. and 300 ° C. for 3 minutes and then pulled up, and then the appearance of the test piece was observed. As a result, when the temperature of the solder bath is 260 ° C or 300 ° C, no abnormality such as swelling or peeling is observed as "A”, and when the temperature of the solder bath is 260 ° C, no abnormality is observed but 300 ° C. The case where an abnormality was observed was evaluated as "B”, and the case where an abnormality was observed at any of the solder bath temperatures of 260 ° C., 288 ° C. and 300 ° C. was evaluated as "C".
  • Solder heat resistance 2 A sample was prepared by the same method as in the case of the above-mentioned "peeling strength 2" test. From the sample, a test piece was prepared based on JIS C6471. The test piece was floated in a solder bath at 260 ° C., 288 ° C. and 300 ° C. for 3 minutes and then pulled up, and then the appearance of the test piece was observed. As a result, when the temperature of the solder bath is 260 ° C or 300 ° C, no abnormality such as swelling or peeling is observed as "A", and when the temperature of the solder bath is 288 ° C, no abnormality is observed but 300 ° C.
  • Impact resistance test A cured product obtained by heating the resin sheet at 200 ° C. for 60 minutes under vacuum was cut to prepare a sample for evaluation of dimensions of 100 mm ⁇ 100 mm in plan view and 100 ⁇ m in thickness. The impact strength of this sample was measured using a film impact tester (“FT-DG” manufactured by Toyo Seiki Kogyo Co., Ltd.) at room temperature under the conditions of a load of 1.5 J and 2.54 cm (1 inch).
  • FT-DG film impact tester

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne une composition de résine thermodurcissable qui permet d'obtenir un produit durci ayant une faible constante diélectrique, un faible facteur de dissipation diélectrique et une résistance élevée à la chaleur. La composition de résine thermodurcissable contient un copolymère éthylène-propylène-diène (A) et un composé organique (B) ayant un groupe fonctionnel polymérisable. Le copolymère éthylène-propylène-diène (A) contient, en pourcentage, 15 à 50 % en masse d'un copolymère éthylène-propylène-diène ramifié (A1) par rapport au copolymère éthylène-propylène-diène (A).
PCT/JP2020/039155 2019-10-31 2020-10-16 Composition de résine thermodurcissable, feuille de résine, feuille métallique équipée de résine, plaque stratifiée et carte de circuit imprimé WO2021085191A1 (fr)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026927A1 (fr) * 2017-08-02 2019-02-07 パナソニックＩｐマネジメント株式会社 Composition thermodurcissable, couche de résine, feuille métallique dotée d'une résine, stratifié à revêtement métallique et carte à circuits imprimés

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026927A1 (fr) * 2017-08-02 2019-02-07 パナソニックＩｐマネジメント株式会社 Composition thermodurcissable, couche de résine, feuille métallique dotée d'une résine, stratifié à revêtement métallique et carte à circuits imprimés

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