WO2021084140A3 - Verfahren zur herstellung eines mit elementarem silber und elementarem ruthenium ausgestatteten partikelförmigen trägermaterials - Google Patents

Verfahren zur herstellung eines mit elementarem silber und elementarem ruthenium ausgestatteten partikelförmigen trägermaterials Download PDF

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Publication number
WO2021084140A3
WO2021084140A3 PCT/EP2021/054376 EP2021054376W WO2021084140A3 WO 2021084140 A3 WO2021084140 A3 WO 2021084140A3 EP 2021054376 W EP2021054376 W EP 2021054376W WO 2021084140 A3 WO2021084140 A3 WO 2021084140A3
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WO
WIPO (PCT)
Prior art keywords
elementary
carrier material
ruthenium
silver
particulate carrier
Prior art date
Application number
PCT/EP2021/054376
Other languages
English (en)
French (fr)
Other versions
WO2021084140A2 (de
Inventor
Michael Gock
Marcel BÄUML
Eva KARTE
Richard Walter
Original Assignee
Heraeus Deutschland GmbH & Co. KG
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Publication date
Application filed by Heraeus Deutschland GmbH & Co. KG filed Critical Heraeus Deutschland GmbH & Co. KG
Priority to JP2023519895A priority Critical patent/JP2023544152A/ja
Priority to US18/250,000 priority patent/US20230392263A1/en
Priority to EP21706295.9A priority patent/EP4237596A2/de
Priority to KR1020237010597A priority patent/KR20230057456A/ko
Priority to CN202180065490.1A priority patent/CN116194619A/zh
Publication of WO2021084140A2 publication Critical patent/WO2021084140A2/de
Publication of WO2021084140A3 publication Critical patent/WO2021084140A3/de

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17Metallic particles coated with metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18Non-metallic particles coated with metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • C23C18/1658Process features with two steps starting with metal deposition followed by addition of reducing agent
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00Metallic composition of the powder or its coating
    • B22F2301/25Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255Silver or gold

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Catalysts (AREA)
  • Glanulating (AREA)

Abstract

Verfahren zur Herstellung eines mit Silber und Ruthenium ausgestatteten partikelförmigen Trägermaterials, umfassend die Schritte: a) Bereitstellen eines wasserunlöslichen partikelförmigen Trägermaterials und jeweils wässrig gelöstem Silber- und Rutheniumvorläufer, b) Inkontaktbringen des wasserunlöslichen partikelförmigen Trägermaterials mit wässriger Lösung der Vorläufer unter Ausbildung eines Intermediats, c) Inkontaktbringen des Intermediats mit einer wässrigen einen pH-Wert von >7 bis 14 aufweisenden Hydrazinlösung unter Bildung einer Silber und Ruthenium umfassenden Masse, d) gegebenenfalls Waschen der erhaltenen Masse, und e) Entfernen von Wasser und anderen eventuellen flüchtigen Bestandteilen aus der Masse.
PCT/EP2021/054376 2020-10-28 2021-02-23 Verfahren zur herstellung eines mit elementarem silber und elementarem ruthenium ausgestatteten partikelförmigen trägermaterials WO2021084140A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2023519895A JP2023544152A (ja) 2020-10-28 2021-02-23 単体銀及び単体ルテニウムを有する粒子状担体材料を製造するための方法
US18/250,000 US20230392263A1 (en) 2020-10-28 2021-02-23 Method for producing a particulate carrier material provided with elementary silver and elementary ruthenium
EP21706295.9A EP4237596A2 (de) 2020-10-28 2021-02-23 Verfahren zur herstellung eines mit elementarem silber und elementarem ruthenium ausgestatteten partikelförmigen trägermaterials
KR1020237010597A KR20230057456A (ko) 2020-10-28 2021-02-23 원소 은 및 원소 루테늄이 제공된 미립자 담체 재료를 제조하는 방법
CN202180065490.1A CN116194619A (zh) 2020-10-28 2021-02-23 用于生产提供有元素银和元素钌的颗粒状载体材料的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20204367.5A EP3825440A1 (de) 2020-10-28 2020-10-28 Verfahren zur herstellung eines mit elementarem silber und elementarem ruthenium ausgestatteten partikelförmigen trägermaterials
EP20204367.5 2020-10-28

Publications (2)

Publication Number Publication Date
WO2021084140A2 WO2021084140A2 (de) 2021-05-06
WO2021084140A3 true WO2021084140A3 (de) 2021-08-19

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PCT/EP2021/054376 WO2021084140A2 (de) 2020-10-28 2021-02-23 Verfahren zur herstellung eines mit elementarem silber und elementarem ruthenium ausgestatteten partikelförmigen trägermaterials

Country Status (6)

Country Link
US (1) US20230392263A1 (de)
EP (2) EP3825440A1 (de)
JP (1) JP2023544152A (de)
KR (1) KR20230057456A (de)
CN (1) CN116194619A (de)
WO (1) WO2021084140A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021005176A1 (de) 2021-10-18 2023-04-20 Sto Se & Co. Kgaa Lagerstabile Beschichtungszusammensetzung
WO2023094038A1 (de) 2021-11-26 2023-06-01 Heraeus Deutschland GmbH & Co. KG Partikuläres material
WO2023160837A1 (de) 2022-02-28 2023-08-31 Heraeus Deutschland GmbH & Co. KG Mit elementarem silber und elementarem ruthenium ausgestattetes partikelförmiges kohlenstoffmaterial
EP4353869A2 (de) 2022-04-06 2024-04-17 Heraeus Precious Metals GmbH & Co. KG Mit elementarem silber und elementarem ruthenium ausgestattetes partikelförmiges anorganisches material
EP4368313A1 (de) * 2022-11-11 2024-05-15 Heraeus Precious Metals GmbH & Co. KG Ungeträgertes bimetallisches partikelförmiges material

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EP2026846A4 (de) 2006-06-05 2010-09-29 Bactiguard Ab Polymatrix, ihre verwendungen und herstellungsverfahren dafür
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Also Published As

Publication number Publication date
CN116194619A (zh) 2023-05-30
JP2023544152A (ja) 2023-10-20
EP3825440A1 (de) 2021-05-26
EP4237596A2 (de) 2023-09-06
US20230392263A1 (en) 2023-12-07
WO2021084140A2 (de) 2021-05-06
KR20230057456A (ko) 2023-04-28

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