WO2021083041A1 - 摄像模组及电子设备 - Google Patents

摄像模组及电子设备 Download PDF

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Publication number
WO2021083041A1
WO2021083041A1 PCT/CN2020/123135 CN2020123135W WO2021083041A1 WO 2021083041 A1 WO2021083041 A1 WO 2021083041A1 CN 2020123135 W CN2020123135 W CN 2020123135W WO 2021083041 A1 WO2021083041 A1 WO 2021083041A1
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WIPO (PCT)
Prior art keywords
camera module
photosensitive chip
circuit board
module according
lens
Prior art date
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PCT/CN2020/123135
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English (en)
French (fr)
Inventor
周锋
Original Assignee
维沃移动通信有限公司
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Publication of WO2021083041A1 publication Critical patent/WO2021083041A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present disclosure relates to the technical field of communication equipment, and in particular to a camera module and electronic equipment.
  • the camera module can realize the shooting function of electronic equipment, and then can meet the needs of users for daily shooting, video calls, identification and unlocking, and payment by scanning codes.
  • the size of the photosensitive chip of the camera module is getting larger and larger.
  • a larger-sized photosensitive chip will increase the heat production of the camera module, and the temperature of the photosensitive chip will be higher, which will not only lead to deterioration of image quality, but also reduce the service life of the camera module.
  • the software requires a higher frame rate output, which in turn leads to an increase in the temperature of the photosensitive chip.
  • the present disclosure discloses a camera module and electronic equipment to solve the problem of poor heat dissipation performance of the current camera module.
  • a camera module includes a base, a photosensitive chip, a lens holder, and a lens.
  • the lens holder is arranged on the base, and the photosensitive chip is arranged on the base and located in the center of the lens holder.
  • the lens is mounted on the lens holder, the photosensitive chip is arranged opposite to the lens, the base includes a refrigerating part and a circuit board arranged on the refrigerating part, and the photosensitive chip is connected to the lens holder.
  • the circuit board is electrically connected, and the refrigeration part is connected to the photosensitive chip.
  • An electronic device includes the above-mentioned camera module.
  • the camera module disclosed in the present disclosure improves the structure of the related camera module, so that the base on which the photosensitive chip is mounted includes a refrigerating part, and the refrigerating part is connected to the photosensitive chip, so that the photosensitive chip can be cooled.
  • the refrigeration unit can actively cool down the photosensitive chip, which can ultimately prevent the temperature of the photosensitive chip from being too high. It can be seen that the camera module disclosed in the embodiment of the present disclosure can solve the problem of poor heat dissipation performance of the current camera module.
  • FIG. 1 is a schematic structural diagram of a camera module disclosed in an embodiment of the disclosure
  • FIG. 2 is a schematic diagram of the working principle of the thermoelectric cooling plate disclosed in the embodiment of the disclosure.
  • embodiments of the present disclosure disclose a camera module, the disclosed camera module can be applied to electronic equipment, the disclosed camera module includes a base 100, a photosensitive chip 200, a lens holder 300 and Lens 400.
  • the base 100 is a basic component of the camera module.
  • the base 100 can provide an installation foundation for other components of the camera module, and the other components of the camera module can be directly or indirectly installed on the base 100.
  • the lens holder 300 is disposed on the base 100 and can be fixedly connected to the base 100. Under normal circumstances, the lens holder 300 and the base 100 can be fixedly connected by bonding.
  • the lens 400 is mounted on the lens holder 300. Specifically, the lens 400 may also be fixed on the lens holder 300 by bonding.
  • the photosensitive chip 200 is the photosensitive part of the camera module, and the photosensitive chip 200 can sense light to realize framing and shooting.
  • the photosensitive chip 200 is disposed on the base 100. Under normal circumstances, the photosensitive chip 200 can be connected to the base 100 by welding. In order to achieve a more stable installation, the photosensitive chip 200 can be attached to the base 100 and fixedly connected to the base 100.
  • the photosensitive chip 200 is located in the area surrounded by the lens holder 300, and the photosensitive chip 200 is disposed opposite to the lens 400, so that light can be sensed through the lens 400.
  • the lens holder 300 not only provides an installation position for the lens 400, but also the lens holder 300 is arranged around the photosensitive chip 200, which can shield the light, and finally can avoid the influence of stray light on the photosensitive chip 200, so that the photosensitive chip 200 can only sense through Light passing through the lens 400.
  • the base 100 includes a refrigerating part 110 and a circuit board 120 disposed on the refrigerating part 110.
  • the photosensitive chip 200 is electrically connected to the circuit board 120, and the circuit board 120 can supply power to the photosensitive chip 200.
  • the refrigeration unit 110 is connected to the photosensitive chip 200 for cooling the photosensitive chip 200.
  • the cooling of the cooling unit 110 can lower the temperature of the photosensitive chip 200.
  • the cooling unit 110 may be directly connected to the photosensitive chip 200 or indirectly connected to the photosensitive chip 200, as long as the temperature of the photosensitive chip 200 can be reduced to prevent the temperature of the photosensitive chip 200 from being too high.
  • the camera module disclosed in the embodiment of the present disclosure improves the structure of the related camera module, so that the base 100 on which the photosensitive chip 200 is installed includes a refrigerating part 110, and the refrigerating part 110 is connected to the photosensitive chip 200, so that the photosensitive chip 200 can be implemented Cool down.
  • the refrigeration unit 110 can actively cool the photosensitive chip 200 to dissipate heat, so as to prevent the temperature of the photosensitive chip 200 from being too high. It can be seen that the camera module disclosed in the embodiments of the present disclosure can solve the problem of poor heat dissipation performance of the current camera module.
  • the refrigeration unit 110 may include a functional device that realizes refrigeration through a refrigerant.
  • the refrigeration part 110 may be a thermoelectric refrigeration sheet, the thermoelectric refrigeration sheet is made of semiconductor material, the thermoelectric refrigeration sheet has a hot end and a cold end, and the cold end of the thermoelectric refrigeration sheet faces the side where the photosensitive chip 200 is located.
  • the hot end of the thermoelectric cooling film is arranged opposite to the photosensitive chip 200.
  • the thermoelectric cooling film utilizes the Peltier effect.
  • thermoelectric cooling chip In a specific working process, the cold end of the thermoelectric cooling chip will be cooled after being energized, thereby cooling the photosensitive chip 200. The heat generated by the hot end of the thermoelectric cooling fin will be dissipated.
  • the cooling principle and process of the thermoelectric cooling fins are well-known technologies, and will not be repeated here.
  • the refrigerating part 110 may be arranged on the side of the circuit board 120 away from the photosensitive chip 200, and the refrigerating part 110 may transfer the cold generated during operation to the photosensitive chip 200 through the circuit board 120, so as to cool down the photosensitive chip 200.
  • the circuit board 120 may be provided with a avoiding hole 121, and the photosensitive chip 200 may be located in the avoiding hole 121 and arranged on a thermoelectric cooling sheet. The cold end of the thermoelectric cooling sheet is connected to the photosensitive chip 200.
  • the circuit board 120 is equivalent to an escape space for accommodating the photosensitive chip 200, so that the photosensitive chip 200 is directly connected to the thermoelectric cooling sheet, which can undoubtedly improve the cooling effect on the photosensitive chip 200.
  • the refrigeration unit 110 is another type of refrigeration structural component, the direct connection with the refrigeration unit 110 can also be achieved by setting the avoidance hole 121 to achieve a better cooling effect.
  • a gap 500 may be formed between the photosensitive chip 200 and the inner wall of the avoiding hole 121. The formation of the gap 500 is conducive to airflow, so as to better take away the photosensitive chip 200 during the working process. The heat.
  • the photosensitive chip 200 can be electrically connected to the circuit board 120, and further connected to the circuit board 120 for power supply or control. In order to facilitate the operation, the photosensitive chip 200 and the circuit board 120 may be electrically connected through a wire 130. Of course, the photosensitive chip 200 can also be electrically connected to the circuit board 120 by means of pad welding or conductive adhesive bonding.
  • thermoelectric refrigeration sheet since the thermoelectric refrigeration sheet needs to be powered during the working process, based on this, in an optional solution, the thermoelectric refrigeration sheet is electrically connected to the circuit board 120, and then to the circuit board 120. Realize power supply connection or control connection between.
  • thermoelectric cooling plate can have multiple structures. Please refer to Figure 2 again.
  • the thermoelectric cooling plate may include at least two semiconductor structural members arranged at intervals, and any two adjacent semiconductor structural members are connected in series. They are respectively an N-type semiconductor structure 111 and a P-type semiconductor structure 112.
  • the two ends of the thermoelectric cooling plate are respectively connected with the positive and negative poles of the DC power supply. After the DC power supply is turned on, the current will transfer the electrons in the semiconductor structure. During the electron transfer process, the semiconductor structure will generate at the joint. The temperature difference and heat transfer make one end of the thermoelectric cooling plate the cold end and the other end the hot end.
  • the above is only a specific structure for forming the thermoelectric cooling plate, and the formation process and principle of the cold end and the hot end are well-known technologies, and will not be repeated here.
  • the semiconductor structure includes a first end facing the circuit board 120 and a second end facing away from the circuit board 120.
  • the semiconductor structure A first conductor 113 is electrically connected between the first end of the semiconductor structure and the first end of the adjacent semiconductor structure, and the second end of the semiconductor structure is electrically connected to the second end of another adjacent semiconductor structure.
  • the first electrical conductor 113 and the second electrical conductor 114 may be metal pieces.
  • the first conductive body 113 and the second conductive body 114 may be electrically connected by adhesive bonding with conductive glue.
  • any two adjacent semiconductor structures can be arranged in parallel or form a certain included angle.
  • the embodiment of the present disclosure does not limit the positional relationship of any adjacent semiconductor structures.
  • the base 100 further includes a circuit board 120, in order to avoid short circuits, in an alternative solution, the thermoelectric refrigeration disclosed in the embodiment of the present disclosure
  • the sheet may further include an insulating sheet 115 covering the at least two semiconductor structural members.
  • the insulating sheet 115 is connected to the circuit board 120 to achieve insulation and isolation from the circuit board 120.
  • the insulating sheet 115 can play a role of insulation and isolation, thereby facilitating the assembly of the thermoelectric cooling sheet.
  • the refrigeration unit 110 in the embodiment of the present disclosure may include an outer edge extending along the edge of the circuit board 120.
  • the outer edge and the edge of the circuit board 120 form a sink 116, and a lens holder
  • the bottom end of 300 can be connected to the sinking platform 116.
  • the lens holder 300 is connected at a lower position, so that the stacking height between the lens holder 300 and the base 100 can be reduced, which is conducive to reducing the height of the camera module, and ultimately conducive to the thinner electronic equipment.
  • the lens holder 300 and the sinking table 116 may be fixedly connected by adhesive bonding.
  • the camera module disclosed in the embodiment of the present disclosure may further include a zoom motor 600, and the zoom motor 600 is fixed on the lens holder 300.
  • the zoom motor 600 may be fixed on the lens holder 300 by bonding, and the lens 400 may be installed on the lens holder 300.
  • the zoom motor 600 moves on the zoom motor 600 to achieve the purpose of focusing.
  • the zoom motor 600 is a well-known device, and its driving process for the lens 400 will not be repeated here.
  • the camera module disclosed in the embodiment of the present disclosure may further include a filter 700.
  • the filter 700 may be disposed between the lens 400 and the photosensitive chip 200, thereby filtering the interference light. except.
  • the filter 700 can be arranged in many ways. For example, as shown in FIG. 1, the filter 700 can be fixed on the lens holder 300. Specifically, the filter 700 can be fixed on the lens holder 300 by overlapping. During the assembling process, the edge of the filter 700 can be overlapped on the lens holder 300, and a fixed connection between the filter 700 and the lens holder 300 can be achieved by bonding at the overlapped position.
  • the filter 700 may be an infrared filter.
  • the embodiment of the present disclosure discloses an electronic device, and the disclosed electronic device includes the camera module described in the above embodiment.
  • the electronic devices disclosed in the embodiments of the present disclosure may be electronic devices such as mobile phones, tablet computers, e-book readers, game consoles, wearable devices (such as smart watches), etc.
  • the embodiments of the present disclosure do not limit the specific types of electronic devices.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Studio Devices (AREA)

Abstract

本公开提供一种摄像模组，包括基座(100)、感光芯片(200)、镜头支架(300)和镜头(400)，所述镜头支架(300)设置在所述基座(100)上，所述感光芯片(200)设置在所述基座(100)上、且位于所述镜头支架(300)围绕的区域中，所述镜头(400)安装在所述镜头支架(300)上，所述感光芯片(200)与所述镜头(400)相对设置，所述基座(100)包括制冷部(110)和设置在所述制冷部(110)上的电路板(120)，所述感光芯片(200)与所述电路板(120)电连接，所述制冷部(110)与所述感光芯片(200)相连。本公开提供一种电子设备。

Description

摄像模组及电子设备
相关申请的交叉引用
本申请主张在2019年10月29日在中国提交的中国专利申请号No.201911036121.0的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信设备技术领域，尤其涉及一种摄像模组及电子设备。
背景技术
随着用户需求的提升，电子设备的功能越来越多，相应地，电子设备的壳体内集成的功能器件越来越多。作为电子设备的基础功能器件，摄像模组能够实现电子设备的拍摄功能，进而能够满足用户的日常拍摄、视频通话、识别解锁、扫码支付等需求。
当然，用户对拍摄质量的要求越来越高，这就需要摄像模组配置更高标准的硬件和软件。其中较为突出的表现为：摄像模组的感光芯片的尺寸越来越大。较大尺寸的感光芯片会导致摄像模组的产热量增加，感光芯片的温度较高，这不仅会导致成像质量变差，而且摄像模组的使用寿命也会降低。另外，软件方面需要更高帧率的输出，这又进一步导致感光芯片的温度升高。
发明内容
本公开公开一种摄像模组及电子设备，以解决目前的摄像模组的散热性能较差的问题。
为了解决上述问题，本公开采用下述技术方案：
一种摄像模组，包括基座、感光芯片、镜头支架和镜头，所述镜头支架设置在所述基座上，所述感光芯片设置在所述基座上、且位于所述镜头支架围绕的区域中，所述镜头安装在所述镜头支架上，所述感光芯片与所述镜头相对设置，所述基座包括制冷部和设置在所述制冷部上的电路板，所述感光芯片与所述电路板电连接，所述制冷部与所述感光芯片相连。
一种电子设备，包括上文所述的摄像模组。
本公开采用的技术方案能够达到以下有益效果：
本公开公开的摄像模组对相关的摄像模组的结构进行改进，使得安装感光芯片的基座包括制冷部，制冷部与感光芯片相连，从而能够为感光芯片实施降温。在此种情况下，在摄像模组工作的过程中，制冷部能够对感光芯片主动实施散热降温，最终能够避免感光芯片的温度过高。可见，本公开实施例公开的摄像模组能够解决目前的摄像模组散热性能较差的问题。
附图说明
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1为本公开实施例公开的摄像模组的结构示意图；
图2为本公开实施例公开的热电制冷片的工作原理示意图。
附图标记说明：
100-基座、110-制冷部、111-N型半导体结构件、112-P型半导体结构件、113-第一导电体、114-第二导电体、115-绝缘片、116-沉台、120-电路板、121-避让孔、130-导线、
200-感光芯片、
300-镜头支架、
400-镜头、
500-间隙、
600-变焦马达、
700-滤光片。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合本公开具体实施例及相应的附图对本公开技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本公开一部分实施例，而不是全部的实施例。基于本公开中 的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
以下结合附图，详细说明本公开各个实施例公开的技术方案。
请参考图1-图2，本公开实施例公开一种摄像模组，所公开的摄像模组可应用于电子设备，所公开的摄像模组包括基座100、感光芯片200、镜头支架300和镜头400。
基座100为摄像模组的基础构件，基座100能够为摄像模组的其它组成部分提供安装基础，摄像模组的其它组成部分可以直接或间接地安装在基座100上。镜头支架300设置在基座100上，并可以与基座100固定相连。在通常情况下，镜头支架300与基座100可以通过粘接的方式固定相连。镜头400安装在镜头支架300上。具体的，镜头400也可以通过粘接的方式固定在镜头支架300上。
感光芯片200为摄像模组的感光部分，感光芯片200能够感应光线进而实现取景拍摄。感光芯片200设置在基座100上。在通常情况下，感光芯片200可与基座100焊接相连。为了实现更稳定地安装，感光芯片200可以贴附在基座100上，并与基座100固定相连。
感光芯片200位于镜头支架300围绕的区域内，感光芯片200与镜头400相对设置，从而能够通过镜头400感应光线。镜头支架300不但为镜头400提供安装位置，而且镜头支架300围绕感光芯片200设置，从而能够起到遮光的作用，最终能够避免杂散光对感光芯片200感光的影响，使得感光芯片200只能感应透过镜头400的光线。
在本公开实施例中，基座100包括制冷部110和设置在制冷部110上的电路板120，感光芯片200与电路板120电连接，电路板120能够为感光芯片200供电。制冷部110与感光芯片200相连，用于对感光芯片200降温。在制冷部110工作的过程中，制冷部110的制冷能够对感光芯片200降温。具体的，制冷部110可以直接与感光芯片200相连，也可以间接地与感光芯片200相连，只要能够达到对感光芯片200降温以避免感光芯片200的温度过高即可。
本公开实施例公开的摄像模组对相关的摄像模组的结构进行改进，使得 安装感光芯片200的基座100包括制冷部110，制冷部110与感光芯片200相连，从而能够为感光芯片200实施降温。在此种情况下，在摄像模组工作的过程中，制冷部110能够对感光芯片200主动实施散热降温，最终能够避免感光芯片200的温度过高。可见，本公开实施例公开的摄像模组能够解决目前的摄像模组散热性能较差的问题。
在本公开实施例中，制冷部110的种类可以有多种，只要能够实施制冷达到散热降温的目的即可，例如，制冷部110可以包含通过制冷剂实现制冷的功能器件。在可选的方案中，制冷部110可以为热电制冷片，热电制冷片由半导体材料制成，热电制冷片具有热端和冷端，热电制冷片的冷端朝向感光芯片200所在的一侧，热电制冷片的热端与感光芯片200相背设置，热电制冷片利用珀尔帖效应，在具体的工作过程中，热电制冷片通电后其冷端会制冷，进而实现对感光芯片200的降温，热电制冷片的热端产生的热量会散走。热电制冷片的制冷原理及过程为公知技术，在此不再赘述。
具体的，制冷部110可以设置在电路板120背离感光芯片200的一侧，制冷部110可以将工作过程中产生的冷量通过电路板120传递给感光芯片200，从而达到对感光芯片200降温的目的。为了进一步提高对感光芯片200的降温效果，电路板120可以开设有避让孔121，感光芯片200可以位于避让孔121中、且设置在热电制冷片上，热电制冷片的冷端与感光芯片200相连。此种情况下，电路板120相当于开设容纳感光芯片200的避让空间，从而使得感光芯片200与热电制冷片直接相连，这无疑能够提高对感光芯片200的降温效果。当然，在制冷部110为其它种类的制冷结构件时，也可以通过设置在避让孔121实现与制冷部110的直接连接，达到较好的降温效果。
在感光芯片200降温的过程中，摄像模组内外的一部分对流也能够起到较好的散热降温的作用。为了提高散热效果，在可选的方案中，感光芯片200与避让孔121的内壁之间可以形成间隙500，间隙500的形成有利于气流通过，从而能够更好地带走感光芯片200工作过程中产生的热量。
由于基座100包括电路板120，感光芯片200可以与电路板120电连接，进而与电路板120之间供电连接或控制连接。为了方便操作，感光芯片200与电路板120之间可以通过导线130电连接。当然，感光芯片200还可以通 过焊盘焊接的方式或导电胶粘接的方式实现与电路板120之间的电连接。
同理，制冷部110为热电制冷片的前提下，由于热电制冷片工作的过程中需要供电，基于此，在可选的方案中，热电制冷片与电路板120电连接，进而与电路板120之间实现供电连接或控制连接。
热电制冷片的结构可以有多种结构，请再次参考图2，一种具体的结构中，热电制冷片可以包括间隔设置的至少两个半导体结构件，任意相邻的两个半导体结构件串联、且分别为N型半导体结构件111和P型半导体结构件112。热电制冷片的两端分别连接有直流电源的正负极，在直流电源接通后，电流会使半导体结构件内的电子发生转移，在电子转移的过程中，半导体结构件在接头处会产生温差和热量转移，从而使得热电制冷片的一端为冷端，另一端为热端。上述仅仅是形成热电制冷片的一种具体结构，冷端及热端的形成过程及原理为公知技术，在此不再赘述。
实现任意相邻的两个半导体结构件串联的方式有多种，一种具体的实施方式中，半导体结构件包括朝向电路板120的第一端和背离电路板120的第二端，半导体结构件的第一端与相邻一个半导体结构件的第一端之间电连接有第一导电体113，半导体结构件的第二端与相邻的另一个半导体结构件的第二端之间电连接有第二导电体114。第一导电体113和第二导电体114可以为金属件。在具体的组装过程中，第一导电体113和第二导电体114可以通过导电胶粘接电连接。
如图2所示，任意相邻的两个半导体结构件可以平行设置，也可以形成一定的夹角，本公开实施例不限制任意相邻的连个半导体结构件的位置关系。
由于半导体结构件、第一导电体113和第二导电体114均为导电件，而且基座100还包括电路板120，为了避免短路，在可选的方案中，本公开实施例公开的热电制冷片还可以包括覆盖所述的至少两个半导体结构件上的绝缘片115，绝缘片115与电路板120相连，从而实现与电路板120之间的绝缘隔离。绝缘片115可以起到绝缘隔离的作用，进而方便热电制冷片的装配。具体的，绝缘片115为两个，两个绝缘片115可以分别覆盖在半导体结构件、第一导电体113和第二导电体114形成的整体相背的两端上，从而起到更好的绝缘防护作用。
如上文所述，在通常情况下，制冷部110与电路板120叠置，镜头支架300可以连接于电路板120上。在可选的方案中，如图1所示，本公开实施例中的制冷部110可以包括沿电路板120的边缘延伸的外沿，外沿与电路板120的边缘形成沉台116，镜头支架300的底端可以连接在沉台116上。在此种情况下，镜头支架300连接在更低的位置，从而能够降低镜头支架300与基座100之间的堆叠高度，有利于降低摄像模组的高度，最终有利于电子设备向着更薄的方向设计。一种具体的实施方式中，镜头支架300与沉台116可以通过胶层粘接固定相连。
本公开实施例公开的摄像模组还可以包括变焦马达600，变焦马达600固定在镜头支架300上，具体的，变焦马达600可以通过粘接的方式固定在镜头支架300上，镜头400可以设置在变焦马达600上，从而在变焦马达600的驱动下移动，达到调焦的目的。变焦马达600为公知器件，其对镜头400的驱动过程在此不再赘述。
为了提高感光效果，在可选的方案中，本公开实施例公开的摄像模组还可以包括滤光片700，滤光片700可以设置在镜头400与感光芯片200之间，从而将干扰光滤除。滤光片700的设置方式可以有多种，例如，如图1所示，滤光片700可以固定在镜头支架300上，具体的，滤光片700可以搭接固定在镜头支架300上，在装配的过程中，滤光片700的边缘可以搭接在镜头支架300上，并在搭接位置通过粘接的方式实现滤光片700与镜头支架300之间的固定连接。具体的，滤光片700可以为红外滤光片。
基于本公开实施例公开的摄像模组，本公开实施例公开一种电子设备，所公开的电子设备包括上文实施例所述的摄像模组。
本公开实施例公开的电子设备可以是手机、平板电脑、电子书阅读器、游戏机、可穿戴设备(例如智能手表)等电子设备，本公开实施例不限制电子设备的具体种类。
本公开上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本公开的实施例而已，并不用于限制本公开。对于本领域 技术人员来说，本公开可以有各种更改和变化。凡在本公开的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本公开的权利要求范围之内。

Claims (13)

  1. 一种摄像模组，包括基座(100)、感光芯片(200)、镜头支架(300)和镜头(400)，所述镜头支架(300)设置在所述基座(100)上，所述感光芯片(200)设置在所述基座(100)上、且位于所述镜头支架(300)围绕的区域中，所述镜头(400)安装在所述镜头支架(300)上，所述感光芯片(200)与所述镜头(400)相对设置，所述基座(100)包括制冷部(110)和设置在所述制冷部(110)上的电路板(120)，所述感光芯片(200)与所述电路板(120)电连接，所述制冷部(110)与所述感光芯片(200)相连。
  2. 根据权利要求1所述的摄像模组，其中，所述制冷部(110)为热电制冷片，所述热电制冷片的冷端朝向所述感光芯片(200)所在的一侧，所述热电制冷片的热端与所述感光芯片(200)相背设置。
  3. 根据权利要求2所述的摄像模组，其中，所述电路板(120)开设有避让孔(121)，所述感光芯片(200)位于所述避让孔(121)中、且设置在所述热电制冷片上，所述热电制冷片的冷端与所述感光芯片(200)相连。
  4. 根据权利要求3所述的摄像模组，其中，所述感光芯片(200)与所述避让孔(121)的内壁之间形成间隙(500)。
  5. 根据权利要求2所述的摄像模组，其中，所述热电制冷片包括间隔设置的至少两个半导体结构件，任意相邻的两个半导体结构件串联、且分别为N型半导体结构件(111)和P型半导体结构件(112)。
  6. 根据权利要求5所述的摄像模组，其中，所述半导体结构件包括朝向所述电路板(120)的第一端和背离所述电路板(120)的第二端，所述半导体结构件的第一端与相邻一个所述半导体结构件的第一端之间电连接有第一导电体(113)，所述半导体结构件的第二端与相邻的另一个所述半导体结构件的第二端之间电连接有第二导电体(114)。
  7. 根据权利要求5所述的摄像模组，其中，所述热电制冷片还包括覆盖在所述至少两个半导体结构件上的绝缘片(115)，所述绝缘片(115)与所述电路板(120)相连。
  8. 根据权利要求1所述的摄像模组，其中，所述感光芯片(200)与所 述电路板(120)通过导线(130)电连接。
  9. 根据权利要求2所述的摄像模组，其中，所述热电制冷片与所述电路板(120)电连接。
  10. 根据权利要求1所述的摄像模组，其中，所述制冷部(110)包括沿所述电路板(120)的边缘延伸的外沿，所述外沿与所述电路板(120)的边缘形成沉台(116)，所述镜头支架(300)的底端连接在所述沉台(116)上。
  11. 根据权利要求1所述的摄像模组，其中，所述摄像模组还包括变焦马达(600)，所述变焦马达(600)设置在所述镜头支架(300)上，所述变焦马达(600)与所述镜头(400)驱动相连。
  12. 根据权利要求1所述的摄像模组，其中，所述摄像模组还包括滤光片(700)，所述滤光片(700)固定在所述镜头支架(300)上，所述滤光片(700)设置在所述镜头(400)与所述感光芯片(200)之间。
  13. 一种电子设备，包括权利要求1-12中任一项所述的摄像模组。
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